The Electronics Assembly

Handbook

IFS

THE ELECTRONICS ASSEMBLY

HANDBOOK

Edited by Frank Riley

and The Staff of Electronic Packaging and Production

Springer-Verlag Berlin Heidelberg GmbH

Frank Riley The Bodine Corporation PO Box3245 317 Mountain Grove Street Bridgeport, CT06605 USA

British Library Cataloguing in Publicati ou Data

The Electronics Assembly Handbook

1. Electronic apparatus and appliances­Assembly

Electronic Packaging & Production Cahners Publishing Company, A Division of Reed Publishing (USA) lnc. 1350E. Touhy Avenue P0Box5080 Des Plaines, IL 60017-5080 USA

I. Riley, Frank 621.3815'1

II. Electronic Packaging & Production TK7870

ISBN 978-3-662-13163-3 ISBN 978-3-662-13161-9 (eBook) DOI 10.1007/978-3-662-13161-9

© 1988 Springer-Verlag Berlin Heidelberg

Originally published by Springer-Verlag Berlin Heidelberg New York London Paris Tokyo in 1988

This work is protected by copyright. The rights covered by this are reserved, in particular those of translating, reprinting, radio broadcasting, reproduction by photo-mechanical or similar means as

well as the storage and cvaluation in data processing installations even if only extracts are used. Should individual copics for commercial purposes be made with written consent of the publisher then a remittance shall be given to the publisher in accordance with §54, Para 2, of the copyright law. The publisher will provide information on the amount of this remittance.

Phototypeset by Wagstaffs Typcshuttle, Hcnlow, Bedfordshire

Acknowledgements

The maJonty of the articles comprising this work originally appeared in Electronic Packaging and Production, a monthly publication of Cahners Publishing Company, USA. IFS Publications would like to express its thanks to Cahners Publishing for allowing these articles to be used and for its assistance in the preparation of the book. Electronic Packaging and Production is published monthly.

In addition, the following publishers/organisations granted permission for some of the other papers to be reprinted in the book, and IFS Publications would like to express its appreciation of their cooperation.

Assembly Engineering Hitchcock Publishing Company 25W550 Geneva Road Wheaton, IL 60188 USA

Assembly Automation IFS Publications 35/39 High Street Kempston Bedford MK42 7BT UK

AT & T Technologies Inc. Engineering Research Center Princeton, NJ 08540 USA

Machine and Tool Blue Book Hitchcock Publishing Company 25W550 Geneva Road Wheaton, IL60188 USA

Printed Circuit Assembly PMS Industries 1790 Hembree Road Alpharetta, GA 30201 USA

Society of Manufacturing Engineers One SME Drive POBox930 Dearborn, MI 48121 USA

IFS Conferences 35/39 High Street Kempston Bedford MK42 7BT UK

The General Electric Company PLC., I Stanhope Gate London W 1 A l EH UK

Preface

When offered the challenge of collating and editing a series of papers on electronics assembly, I accepted the task with mixed feelings. As one who has spent his life in the field of mechanized assembly I have viewed the developments of mechanized electronics assembly and testing with professional interest and intellectual curiosity. Having spent several years in the Signal Corps at the end of the Second World War this observation of the changing world of electronics manufacturing has spanned the transition from vacuum tube to transistor, from relay to microprocessor and from cable to satellite. This long observation tends to confirm the old cliche that the more things change, the more they remain the same.

This book is intended to assist those given the responsibility of assembly, joining and testing the amazing array of electronic components into functional devices of the highest quality at the lowest cost.

The emphasis on quality cannot be understated. From the most inexpensive consumer item to the most complex military or space unit, quality is imperative to survival in the manufacturing arena of a world economy.

The emphasis on quality is matched with the expectation that electronic goods will be manufactured with ever-increasing capability at even lower costs.

This triology of lower cost, increased quality (or reliability) with ever-increasing functioning capability, is almost unique to the electronics industry. While much of this has been and will be achieved through breakthroughs in product design and new or improved materials, these must be packaged and assembled in usable forms in the most efficient and inexpensive ways.

This collection of articles and papers is specifically aimed at this required efficiency in the assembly of electronic components and the verification of their functioning at each instrumental step in the manufacturing process.

In assembling these papers, several assumptions have been made. First and most importantly, this book is intended to serve those producing or manufacturing engineers who are involved in the assembly and testing of electronic components rather than in the design or fabrication of these components. To do this the emphasis has been given to those papers reflecting the latest commercially available equipment rather than that of academic research. Great emphasis is placed on the implementation and integration of available tools for efficient assembly in a manner consistent with the human resources, volume of production and good product design that will ensure profitable manufacturing.

The book contains the opinions of many practitioners of electronics assembly. Much of this may be subjective or biased toward specific solutions. It is hoped, however, that exposure to a broad spectrum of such opinions is beneficial to the reader.

It is impossible to utilize a collection of such articles without commercial references. These are given without endorsement but as indicative of the range of commercially available tools for successful electronics assembly.

We have drawn on a wide number of papers and sources. It would be unfair, however, not to note the special importance of those articles which originally were prepared for Electronic Packaging & Production magazine. They form the foundation for the book.

In attempting to cover all areas of concern to those involved with electronics assembly, it soon became apparent that the book would become unwieldy. It was possible to devote only a short space to the questions of 'rework' (which has been mentioned briefly in the chapter on Soldering) and to 'burn in' which is included in the chapter on Testing. Each of these topics could stand a full treatment not possible here.

Finally, no attempt has been made to cover thick-film production on laser trimming. There is an underlying assumption that the technology of inserting axial lead devices or DIP units in bandoliers or magazine tubes is a mature technology requiring little coverage in this text. Our emphasis is on the emerging world of practical technology.

Frank Riley

CONTENTS

CHAPTER 1-THE CHANGING WORLD OF ELECTRONICS ASSEMBLY

Systems, vision and components in electronics assembly

Manging automated electronics assembly C-H.Mangin

CHAPTER 2- CIRCUIT BOARDS

PCB production equipment H. W. Markstein

Modern platers and etchers H. W. Markstein

Chemicals in PCB manufacturing S. L. Spitz

Cleaning PCBs for higher quality S. L. Spitz

Producing quality multilayer PCBs M. Friedman and W. Berry

Plasma desmearing T.Dixon

Chip-on-Board

Chip-on, board technology R. Keeler

Chip-and-wire technology G.L. Ginsberg

TAB and flip-chip technology G. L. Ginsberg

3

6

13

15

20

25

32

33

41

45

52

CHAPTER 3- COMPONENT INSERTION

Component insertion equipment T. Thompson

Workstations R. Keeler

Automatic component insertion/placement systems H. W. Markstein

Automated pin insertion B. Corner

Automated placement techniques N.Andreiev

Robotic Assembly

Assembly challenges C-H. Mangin

Robots in the electrical and electronics industry G.Bornecke

Consistency and quality using robots R.Pound

Robot hand exchangers T. Petronis

Vision-guided assembly R.Pound

Robotic Application

59

64

70

76

79

85

86

93

99

103

Vibratory insertion process: A new approach to non-standard component insertion 115 B. D. Hoffman, S. H. Pollack and B. Weissman

CHAPTER 4-SURF .ACE-MOUNT TECHNOLOGY SMTgrowth D. Brown,J. Bracken, A. MannaandJ. Brasch

Realizing the benefits of SMT T.Dixon

Designing reliability into surface-mount assemblies C. Capillo

Design solutions M. Kastner and V. Solberg

Choosing SMT and setting up a facility H. W. Markstein

SMT advantages H. W. Markstein

Pick-and-place machines R.Pound

Surface-mount assembly using machine vision S. L. Spitz

SMD placement using machine vision C. Cullen, J. Field and J. Payne

The Demands ofSMT

Hot-air leveling D. A. Elliott

Testability circuit and board access problems J. Turino

Conductive epoxy for SMT solder replacement R. Pound

The removal and replacement ofSMCs L. Walgren

123

129

137

143

150

156

163

169

175

183

190

195

201

CHAPTER 5-HYBRID CIRCUITS

New applications D. BrownandM. Freedman

New materials and equipment J. E. Sergent

Integral substrate package technology A. W. Koszykowski

CHAPTER 6- SOLDERING AND CLEANING

Solder/cleaning, test and rework

Solder Quality Definition

Solder joint acceptability J. Keller

Wave solder defects J.G.Davy

Wave Soldering

Soldering system trends R.Pound

Wave soldering: A study in process control L.Cox

Optimizing the wave soldering process K. M. Lin and R. N. Kacker

Computerized soldering systems S. L. Spitz

Re-examination of soldering techniques T.Dixon

207

211

216

221

227

230

239

245

252

259

263

.Adhesives Adhesives for SMD wave soldering R. Keeler

Adhesive evaluation E. St. Peter, F. C. Martin and W. A. Reyes

The Role of Solder Paste Solder coating and leveling R. Keeler

Screen printing R. Keeler

Cleaning Soldered Assemblies Solvent flushing R.Pound

Rosin solder flux residues E. Westerlaken

Aqueous cleaning R. Keeler

Cleaning surface-mounted assemblies C. A. Capillo

Repairing Soldered Assemblies

Desoldering components H. W. Markstein

CHAPTER 7- TEST .AND INSPECTION

Verification of Incoming Components and Circuit Boards

Bare-board testing N.Andreiev

275

280

285

293

303

309

317

324

333

343

Automatic optical inspection systems H. Gilutz

Machine vision R. Keeler

Verifying Component Quality

Component testers and handlers R. Keeler

Handlers S. L. Spitz

Lead Inspection

Lead scanning E.J. Penn

Special Problems of Hybrid and SMT Inspection

Probe design and test fixturing C.M. Tygard

Inspecting Soldered Joints

Inspection equipment R. Pound

Image processing and non-destructive testing R. Pound

Special Problems of Surface-Mounted and Hybrid Circuit Construction

Design of SMA for testability J. L. Turino

Test and inspection of hybrid microcircuits J. E. Sergent, H. H. Chiles and R. Power

346

352

363

371

379

385

393

395

405

411

Testing Completed .Assemblies

In-circuit and functional ATE R. Keeler

Functional test R. Keeler

.Automating the Test Function

Test program development and processing power R. Pound

Robotic automated-test workcells R. Woodcock

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424

433

440

CHAPTER 8- ENVIRONMENTAL CONCERNS IN ELECTRONICS .ASSEMBLY

Clean Rooms

Clean room technology S.Crum

Modular clean rooms G. J. Horky, B. 0. Williams and J. R. Block

Personal Discipline

Clean room air monitoring S.Crum

Protection .Against Electrostatic Damage

ESDcontrol J. Harris

Static shielding techniques R.Berson

453

458

463

469

474

CHAPTER 9- THE ROLE OF CAE/CAD/CAM IN ELECTRONICS MANUFACTURING

Computer control of modern factory operations H. W. Markstein

Electronics CAE/CAD/CAM

CAD/CAM for PCB manufacturing R. L. Myers

Designing PCBs for surface-mount assemblies M.Marsh

CAD in hybrid production J. E. Sergent, H. H. Chiles and P. P. Molkenthin

Discrete wired circuit board production A. Filippone

CHAPTER 10- AUTOMATING ELECTRONICS MANUFACTURING

Automating the assembly of electronic products

Test, rework and inspection management costs C-H. Mangin

Flexible manufacturing S. L. Spitz

Computer simulation R.Pound

Local area networks T. Dixon

Physical Integration

Materials handling accessories H. W. Markstein

481

491

500

504

510

515

525

530

533

537

543

551

Automated PCB handling R. Osterhout

Automated guided vehicle systems G.A.Koff

Case Histories in Electronic .Assembly .Automation

Batch-of-one assembly W. H. Schwartz

FMS for PCB assembly A.M. Freer

PCB assembly and test R. D. McCleary

Factory control and robotic systems R. N. Hosier and J. A. Henderson

Authors' organizations and addresses

557

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571

576

581

589

601

ERRATUM The Electronics Assembly Handbook- Edited by

Frank Riley and the staff of Electronics Packaging and Production

In the Contents list (Chapter 3-'Robotics in the electl'ical and electronics industry') the author's

name should read G. Bornecke

Please note that page 87 should precede page 86.

The publishers apologise for the these errors.

© 1988 IFS Ltd., UK Springer-Verlag