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The Explosion of Petascale in the Race to Exascale

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Raj Hazra VP of the Architecture Group and GM of Technical Computing at Intel discusses the race to Exascale computing in the world of HPC and Supercomputing and Intel Xeon Phi's role.
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The Explosion of Petascale in the Race to Exascale Rajeeb Hazra VP, Intel Architecture Group, GM, Technical Computing Intel Corporation @IntelITS
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Page 1: The Explosion of Petascale in the Race to Exascale

The Explosion of Petascale in the Race to Exascale

Rajeeb Hazra VP, Intel Architecture Group, GM, Technical Computing Intel Corporation @IntelITS

Page 2: The Explosion of Petascale in the Race to Exascale

Legal Disclaimers Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance is measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.

Intel does not control or audit the design or implementation of third party benchmarks or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmarks are reported and confirm whether the referenced benchmarks are accurate and reflect performance of systems available for purchase.

Relative performance is calculated by assigning a baseline value of 1.0 to one benchmark result, and then dividing the actual benchmark result for the baseline platform into each of the specific benchmark results of each of the other platforms, and assigning them a relative performance number that correlates with the performance improvements reported.

SPEC, SPECint, SPECfp, SPECrate. SPECpower, SPECjAppServer, SPECjbb, SPECjvm, SPECWeb, SPECompM, SPECompL, SPEC MPI, SPECjEnterprise* are trademarks of the Standard Performance Evaluation Corporation. See http://www.spec.org for more information. TPC-C, TPC-H, TPC-E are trademarks of the Transaction Processing Council. See http://www.tpc.org for more information.

Intel® Turbo Boost Technology requires a Platform with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your platform manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see http://www.intel.com/technology/turboboost

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor series, not across different processor sequences. See http://www.intel.com/products/processor_number for details. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice

Copyright © 2011 Intel Corporation. All rights reserved. Intel, the Intel logo, Xeon MIC, TrueScale Infiniband, TXT and Intel Core are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. All dates and products specified are for planning purposes only and are subject to change without notice. Other Names and brands may be claimed as the property of others.

Page 3: The Explosion of Petascale in the Race to Exascale

HPC: Driving Data Center Growth

2X Volume Growth*

HPC Growth

*

>20%

Cloud Growth

*

>25%

Network Growth

*

>30%

Doubling Volume and Revenue Source: Intel

* Forecast , CAGR

Page 4: The Explosion of Petascale in the Race to Exascale

Race for HPC Competency

• Industrial challenges

– Renewable energy

– Genomics/ Biosciences

– Design and Simulation

– Media and Entertainment

• National security challenges

– Threat monitoring and cyber security

– Nuclear safety

To Compete, You Must Compute

Performance of Countries

Source: Top500.org

Page 5: The Explosion of Petascale in the Race to Exascale

The Road to Petascale Everywhere

# of Workgroup

Machines

Typical Workgroup

20kw Rack

Top Machine

1997 Teraflop Ecosystem

*- Compute Capacity - All PC, Embedded and Server Combined

ASCI RED

.5 GF

1 TF

140,000

2012 Petaflop Ecosystem

2018 Exaflop Ecosystem

160,000

5TF

16 PF

0.5-1.0 PF

1 EF

170,000

X X X

70 TFLOPs 800 PFLOPs 170 ExaFLOPs

SEQUOIA

Page 6: The Explosion of Petascale in the Race to Exascale

Helping to Drive the Petascale Explosion

1 →10 Petaflop Systems:

4 Years

10 → 20 Petaflop Systems:

<1 Year

Source: Top500.org

-

5

10

15

20

25

2007 2008 2009 2010 2011 2012

Intel Petaflop Systems Overall Petaflop Systems

Page 7: The Explosion of Petascale in the Race to Exascale

Top500: Rapid Expansion in Total FLOPs

Largest all Intel® Xeon® Processor Cluster Ever

Top500 FLOPs Growth

-

20,000,000

40,000,000

60,000,000

80,000,000

100,000,000

120,000,000

140,000,000

20

03

20

04

20

05

20

06

20

07

20

08

20

09

20

10

20

11

20

12

2.9 PetaFLOPs

Other brands and names are the property of their respective owners. Source: Top500.org

Page 8: The Explosion of Petascale in the Race to Exascale

What’s Intel Doing in 2012 in HPC…

Intel® Xeon® Processor: E5-2600/4600 Product Families

Intel® Many Integrated Core Architecture

Fabric Technology: Cray’s Aries Interconnect

Qlogic’s TrueScale Product Family

Page 9: The Explosion of Petascale in the Race to Exascale

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

Jun

'06

Nov

'06

Jun

'07

Nov

'07

Jun

'08

Nov

'08

Jun

'09

Nov

'09

Jun

'10

Nov

'10

Jun

'11

Nov

'11

Jun

'12

Intel IBM Power AMD Other

Intel® Xeon® Processor E5 Family: Foundation of HPC

• Intel® Xeon® processor remains #1 architecture

– 78% of new Top500 systems

• Rapid Adoption of Intel® Xeon® Processor E5 Family

– 45 systems just 3 months post-launch

Architecture Presence in Top 500

Source: Top500.org Other brands and names are the property of their respective owners.

Genci LRZ LLNL LANL University of

Frankfurt

Page 10: The Explosion of Petascale in the Race to Exascale

Intel® Xeon® Processor E5 Family: Architecture for Discovery

Example: Cellular Imaging

• Drug discovery is one of the most CPU intensive workloads

• Processing of image data to support discovery of new drugs

• Real-time cell segmentation and classification at 2X speed

467 447

239

Xeon 5660 Xeon 5680 Xeon E5-

2680

Cellular Imaging Execution Time (Lower is Better)

“The new Intel® Xeon®

processor E5 family-based

platform(s) doubles the speed

of cellular image analysis.”

See the Live Demo at Booth #540 Other brands and names are the property of their respective owners.

Page 11: The Explosion of Petascale in the Race to Exascale

HPC Expertise

Intellectual Property

World-class Interconnects

HPC Expertise

Fabric Management & Software

Highest Performance, Scalable IB Products

Low-latency Ethernet Switching

Data Center Ethernet Expertise

High Radix & Low Radix Switch Products

Market Leading Compute & Ethernet Products

Platform Expertise

Intel’s Comprehensive Connectivity and

Fabric

Portfolio

Unprecedented Rate of Innovation in HPC Fabric

Next Front of System Innovation: Fabrics

Other brands and names are the property of their respective owners.

Page 12: The Explosion of Petascale in the Race to Exascale

Driving from Petascale to Exascale

Workhorse for Petascale Systems:

Flexible, Powerful for a Broad Range of Workloads

Path to Exascale:

Efficient for Highly Parallel Applications

+

Page 13: The Explosion of Petascale in the Race to Exascale

• RADIOSS*: complete finite element solver

• Programming continuity a major advantage

• SGI UV2 system will support Intel® MIC Architecture

“… we were able to take advantage of

the many core architecture to

drastically reduce time to solution.”

Transformational Performance From Workstations to Supercomputers

Example: Next Generation Manufacturing

See the Live Demo at Booth #540 Other brands and names are the property of their respective owners.

Page 14: The Explosion of Petascale in the Race to Exascale

Announcing Brand for Intel® MIC Architecture Based Products

Intel® Xeon® Phi™ Product Family

Page 15: The Explosion of Petascale in the Race to Exascale

Why Did We Create the Intel® Xeon® Phi™ Brand?

• Intel® Xeon® Brand

– Industrial strength processing

– Enterprise, cloud, mission critical, & technical compute

• Intel® Xeon® Phi™ Brand

– Part of the Intel® Xeon® brand family

– Parallel performance to power breakthrough innovation

– Evokes many concepts in science & nature

Page 16: The Explosion of Petascale in the Race to Exascale

Game Changer for HPC Performance & Programmability

Single Source

Compilers and Runtimes

“Unparalleled productivity… most of this software does not run on a GPU”

Dr. Robert Harrison, NICS, ORNL

“R. Harrison, “Opportunities and Challenges Posed by Exascale Computing - ORNL's Plans and Perspectives”, National Institute of Computational Sciences, Nov 2011”

15

Other brands and names are the property of their respective owners.

Page 17: The Explosion of Petascale in the Race to Exascale

Announcing Breakthrough Performance on Intel® Xeon® Phi™ Coprocessor

(Codenamed Knights Corner)

>1 TFLOP Linpack (HPL) in a node

Source: Intel Discovery Cluster Linpack benchmark run, June 2012

118 TFLOPs #150 on the Top500

In Production In 2012, Enabled by 22nm 3-D TriGate Transistors

Page 18: The Explosion of Petascale in the Race to Exascale

Broad Ecosystem Support

Other brands and names are the property of their respective owners.

Page 19: The Explosion of Petascale in the Race to Exascale

Barry Bolding Vice President,

Corporate Marketing

Cray Inc.

Other brands and names are the property of their respective owners.

Page 20: The Explosion of Petascale in the Race to Exascale

Interconnect

Technology

Intel in High Performance Computing

Dedicated,

Renowned

Expertise

Terascale

Research

Leading

Performance,

Performance/

Watt

Large Scale

Clusters

for Test and

Optimization

Broad SW

Tools

Portfolio

Defined

HPC

Application

Platform

Platform

Building

Blocks

Manufacturing

Process

Strategic Commitment to High Performance Computing

Other brands and names are the property of their respective owners.

Page 21: The Explosion of Petascale in the Race to Exascale

Summary

• HPC market: Growing and seen as a national + industrial imperative

• Intel® Xeon® Processor E5 Family: Rapid adoption, Leading the Industry

• New Intel® Xeon® Phi™ Product Family: Brand covers all Intel® MIC Architecture based products Provides additional boost for highly parallel applications Ecosystem aligned and supportive

• Intel in HPC: Building block alignment provides customers leading HPC technology

Page 22: The Explosion of Petascale in the Race to Exascale
Page 23: The Explosion of Petascale in the Race to Exascale

Risk Factors

The above statements and any others in this document that refer to plans and expectations for the second quarter, the year and the future are forward-looking statements that involve a number of risks and uncertainties. Words such as “anticipates,” “expects,” “intends,” “plans,” “believes,” “seeks,” “estimates,” “may,” “will,” “should,” and their variations identify forward-looking statements. Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements. Many factors could affect Intel’s actual results, and variances from Intel’s current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could cause actual results to differ materially from the company’s expectations. Demand could be different from Intel's expectations due to factors including changes in business and economic conditions, including supply constraints and other disruptions affecting customers; customer acceptance of Intel’s and competitors’ products; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Potential disruptions in the high technology supply chain resulting from the recent disaster in Japan could cause customer demand to be different from Intel’s expectations. Intel operates in intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast. Revenue and the gross margin percentage are affected by the timing of Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel’s response to such actions; and Intel’s ability to respond quickly to technological developments and to incorporate new features into its products. The gross margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; changes in revenue levels; product mix and pricing; the timing and execution of the manufacturing ramp and associated costs; start-up costs; excess or obsolete inventory; changes in unit costs; defects or disruptions in the supply of materials or resources; product manufacturing quality/yields; and impairments of long-lived assets, including manufacturing, assembly/test and intangible assets. Expenses, particularly certain marketing and compensation expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel's products and the level of revenue and profits. The tax rate expectation is based on current tax law and current expected income. The tax rate may be affected by the jurisdictions in which profits are determined to be earned and taxed; changes in the estimates of credits, benefits and deductions; the resolution of issues arising from tax audits with various tax authorities, including payment of interest and penalties; and the ability to realize deferred tax assets. Gains or losses from equity securities and interest and other could vary from expectations depending on gains or losses on the sale, exchange, change in the fair value or impairments of debt and equity investments; interest rates; cash balances; and changes in fair value of derivative instruments. The majority of Intel’s non-marketable equity investment portfolio balance is concentrated in companies in the flash memory market segment, and declines in this market segment or changes in management’s plans with respect to Intel’s investments in this market segment could result in significant impairment charges, impacting restructuring charges as well as gains/losses on equity investments and interest and other. Intel's results could be affected by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates. Intel’s results could be affected by the timing of closing of acquisitions and divestitures. Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust and other issues, such as the litigation and regulatory matters described in Intel's SEC reports. An unfavorable ruling could include monetary damages or an injunction prohibiting us from manufacturing or selling one or more products, precluding particular business practices, impacting Intel’s ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property. A detailed discussion of these and other factors that could affect Intel’s results is included in Intel’s SEC filings, including the report on Form 10-Q for the quarter ended April 2, 2011.

Rev. 5/9/11


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