Enabling a

Microelectronic

World®

R. Huemoeller

SVP, Adv. Product / Platform Develop

June 2013

The Future of Packaging

~ Advanced System Integration

Jun-13, R.Huemoeller 2 Amkor Info for Controlled Release at Russia Semi

Product Segments

End Market % Share Summary

Jun-13, R.Huemoeller 3 Amkor Info for Controlled Release at Russia Semi

New Product Technology Focus

Jun-13, R.Huemoeller 4 Amkor Info for Controlled Release at Russia Semi

Market Direction & Drivers

Jun-13, R.Huemoeller 5 Amkor Info for Controlled Release at Russia Semi

Foundational Blocks for Advanced Integration

Embedded Die

Advanced

Materials

Cu Pillar

TSV

Advanced

Flip Chip

Jun-13, R.Huemoeller 6 Amkor Info for Controlled Release at Russia Semi

Foundational Blocks for Advanced Integration

Embedded Die

Advanced

Materials

Cu Pillar

TSV

Advanced

Flip Chip

Jun-13, R.Huemoeller 7 Amkor Info for Controlled Release at Russia Semi

Interconnection : Fine Pitch Cu Pillar

Driven by Demand for Handheld, High

Performance, Low Power Devices

Provides Significant Improvement Over

Solder Bump

Launched in 2010, ~ 200 Million

Units Sold WW

Industry-Leading Platform Being Adopted by

Most Customers

Enabling Technology for 2.5D and 3D

Packaging with Through Silicon Vias

Jun-13, R.Huemoeller 8 Amkor Info for Controlled Release at Russia Semi

Digital Baseband

Applications Processor

Networking ASICs

Digital TV ASICs

Power Management

Embedded Processing – DSP, MCU,

Digital Media

Function Integration in All Three

Dimensions

Silicon Node “Shrinks” But Die

Size Remains Unchanged

Increased I/O Density

Finer BGA Pitch

More Demanding Warpage and

Coplanarity Criteria

Technology Trends Devices

Why the Need for Cu Pillar?

Jun-13, R.Huemoeller 9 Amkor Info for Controlled Release at Russia Semi

Amkor FPFC Technology

• From Standard CSP Package Structure

• To Broad Package Application

PSfcCSP fcCSP

TMV™ PoP FCBGA

Fine Pitch Cu Pillar Formats

Jun-13, R.Huemoeller 10 Amkor Info for Controlled Release at Russia Semi

WLFO

Thermal &

Adv. Materials

Cu Pillar

TSV

High-End FC

Foundational Blocks for Advanced Integration

Jun-13, R.Huemoeller 11 Amkor Info for Controlled Release at Russia Semi

Integration : Through Silicon Via (TSV)

• Current Status

World‟s first production fully integrated TSV package platform completed

“Logic dies on Si interposer” product is being produced

Large number of customers engaged in active TSV development

Future Target devices

Logics on Si interposer

Logics + memories on Si interposer

Memory / Memory stack

Memory / Logic combination

Jun-13, R.Huemoeller 12 Amkor Info for Controlled Release at Russia Semi

2.5D Multi-Chip Interposer Breakdown

• High End Products : Networking, Servers

─ Silicon interposers ; < 2um L/S, < 15nsec latency, > 25k µbumps per die

─ Several foundries delivering silicon interposers today

─ Others in consideration of adding capability to make use of unused assets

• Mid Range Products : Gaming, Graphics, HDTV, Adv. Tablets

─ Silicon or Glass interposers ; < 3um L/S, < 25nsec latency, ~10k µbumps/die

─ Glass may provide cost reduction path in future

─ Glass interposers infrastructure still immature, but improving

• Low Cost Products : Lower End Tablets, Smart Phones

─ Organic interposer?? ; < 8um L/S, low resistance, ~2k µbumps

─ Must provide cost reduction path to enable this sector ; thick copper traces

─ Possible elimination of laminate substrate, but organic interposer as substrate!!

Jun-13, R.Huemoeller 13 Amkor Info for Controlled Release at Russia Semi

Memory

• Sources

─ End customer choosing memory supplier

─ Memory supply chain is constrained today

─ 2 different sources – Elpida (Micron) & Hynix

• Logistics

─ Plan is to receive memory as „KGM‟ on tape and reel

─ End customer will manage logistics through consignment models

• Activity

─ Multiple programs in progress with stacked memory in wide I/O format

HBM or Wide-IO2

– Shipping single die, 2 die stacks and 4 die stacks already

– Most development being completed with 4 die stacks now

Jun-13, R.Huemoeller 14 Amkor Info for Controlled Release at Russia Semi

0

1.000

2.000

3.000

4.000

5.000

6.000

7.000

8.000

9.000

2012 2013 2014 2015 2016 2017 2018 2019 2020

2010 2012 2014 2016 2018

3D-ICs, old forecast

3D-ICs, new forecast

TSV Interposers

5000

4000

3000

2000

1000

Package Migration to TSV SiP-MCM Integration

Wafer Shipments (in 1000‟s)

• TSV Product Demand (300mm eq. wafers)

Courtesy of

TechSearch International, Inc.

2012

Jun-13, R.Huemoeller 15 Amkor Info for Controlled Release at Russia Semi

Embedded Die

Advanced

Materials

Cu Pillar

TSV

Advanced

Flip Chip

Foundational Blocks for Advanced Integration

Jun-13, R.Huemoeller 16 Amkor Info for Controlled Release at Russia Semi

Embedded Die : 3 Levels of Architecture

Wafer Level

Die

Substrate Level

Passive Components

Active Die

Single Die

Multi-Die

3D Package

Single Die

Multi-Die

3D Pkg

– Passive integration

– Internal EMI shielding possibilities

– Multi-die capability – more than one die may be embedded

– Two-sided construction – top side components may be mounted

Jun-13, R.Huemoeller 17 Amkor Info for Controlled Release at Russia Semi

• Embedding Active Die : in small volume production today

– 5x3mm embedded die, 12mm body, 6Layer substrate, 536 Balls

– Passed package reliability : MRT L3 260C ; HAST 96hrs, TCB1000, HTS 1k-hrs

Embedded Die

Top Die

Laser Via

65 mm

Embedded Die in Substrate

PCB: 400 um

PCB to Die:185 um

Inner Die: 185 um

Jun-13, R.Huemoeller 18 Amkor Info for Controlled Release at Russia Semi

Embedded Die in Substrate (cont’d).

Passive Component (MLCC : 100nF, 1.0 x 0.5mm)

– fcPIP, 1x1mm embedded IPD, 15BD, 4Layer, 603 Balls

– passed MRT L3 260‟C ; HAST 96hrs, TCBx1000, HTS 1000hrs

Passive Die (IPD : 100nF, 1.0 x 1.0mm)

– fcPIP, 1x1mm embedded IPD, 15BD, 4Layer, 603 Balls

– passed MRT L2aa 260‟C ; HAST 96hrs, TCBx1000, HTS 1000hrs

• Embedding Passive Die : in high volume production today

Jun-13, R.Huemoeller 19 Amkor Info for Controlled Release at Russia Semi

• Embedded die on Wafer

– Product capability up to 15x15mm, 0.4mm pitch, 1000 I/O+

– 300mm formats

– Fully deployed for several years now

Advanced Platform : Wafer Based Fan Out

Jun-13, R.Huemoeller 20 Amkor Info for Controlled Release at Russia Semi

Large I/O Count Without Die Increase

3D PKG Platform Creation

Core Technology Development

Entry

Expand

Cost Reduce

Die

Die

Die Shrink Continuing

Face to Face

Customer / Product Base Widens

PoP/Sensor Application

No Wire or Substrate

• Customer Interest

– Hybrid Packages, RF Connectivity, Audio modules & Sensor Applications

Advanced Platform : Wafer Based Fan Out (Cont’d)

niche

growing

Jun-13, R.Huemoeller 21 Amkor Info for Controlled Release at Russia Semi

Market Growth for Wafer Fan Out Packages

• Single die solutions remain niche to market ; primarily one customer driving use

Jun-13, R.Huemoeller 22 Amkor Info for Controlled Release at Russia Semi

Evolution of Wafer Based Fan Out

• Wafer Fan Out 3D Products

– Customer interest expanding to two sided structures

– Requiring more functionality

– Ultimate goal is multi chip in smallest form factor

Die

Die

.

3D-WLFO Benefits

H

Die

Die

Die

Die

Die

Die

3D-WLFO Benefits

Die

Die

Thru

Mold Via

Jun-13, R.Huemoeller 23 Amkor Info for Controlled Release at Russia Semi

Market Growth for Wafer Fan Out Packages

• Multi die solutions will drive future market ; triggers growth phase

Jun-13, R.Huemoeller 24 Amkor Info for Controlled Release at Russia Semi

200mm

Phase 1 300mm

Phase 2

Embedded in Panel : Future of Embedded Die

Phase 3

300mm 300mm

3D

Development

Well Underway Phase 4

Panel3D

Jun-13, R.Huemoeller 25 Amkor Info for Controlled Release at Russia Semi

Embedded Die

Advanced

Materials

Cu Pillar

TSV

Advanced

Flip Chip

Foundational Blocks for Advanced Integration

Jun-13, R.Huemoeller 26 Amkor Info for Controlled Release at Russia Semi

Advanced Flip Chip Continuing to Drive Growth

Jun-13, R.Huemoeller 27 Amkor Info for Controlled Release at Russia Semi

• Industry Direction

Increasing body size (>55mm BD)

Increasing die size (>26mm)

32/28nm in production with 20nm qualification in progress

Cu Pillar to enable density / pitch below 150um bump pitch

Coreless substrates in use for 32/28nm

Multiple die per package …. With die count continuing to increase

High Performance Flip Chip

Jun-13, R.Huemoeller 28 Amkor Info for Controlled Release at Russia Semi

Advanced FC Packages : Chip on Chip

• Next Generation of FC – CoCPOSSUM

– MEMs, Automotive, Networking

Jun-13, R.Huemoeller 29 Amkor Info for Controlled Release at Russia Semi

LOGIC (780um thickness)

ASIC (60um thickness)

40um bump pitch CoC Technology

Heat Spreader

200um bump pitch

LOGIC

Substrate

Cu pillar with LF solder

+ microbump

Advanced FC Packages : Chip on Chip, cont.

• 2014 Targeted production

Networking ASIC + FPGA

Microcontroller ASIC + Memory

Automotive ASIC + Memory

Jun-13, R.Huemoeller 30 Amkor Info for Controlled Release at Russia Semi

Embedded Die

Cu Pillar

TSV

Advanced

Flip Chip

Advanced

Materials

Foundational Blocks for Advanced Integration

Jun-13, R.Huemoeller 31 Amkor Info for Controlled Release at Russia Semi

Substrate

Material & Equipment Technology

Enabling System Integration

Advanced Materials Enabling Package Integration

Die

Attach

Underfill

Thermal

Jun-13, R.Huemoeller 32 Amkor Info for Controlled Release at Russia Semi

Advanced Packaging & Technology Integration

Copper µPillar Bumping

Underfill

Sub-assembly &

Package Warpage

Thermal

Substrate

Interposer

Silicon

Die Joining

Adaptive

Learning

Required

Jun-13, R.Huemoeller 33 Amkor Info for Controlled Release at Russia Semi

Embedded Die

Advanced

Materials

Cu Pillar

TSV

Advanced

Flip Chip

Foundational Blocks for Advanced Integration

Jun-13, R.Huemoeller 34 Amkor Info for Controlled Release at Russia Semi

Advanced Package Integration Becoming Clearer Sm

aller F

orm

Facto

r Larg

er

Interconnect Density & Functionality : Increasing

Wafer Level

Die

Board Level

LOGIC

ASIC

CoCpossum™

Die Level

Jun-13, R.Huemoeller 35 Amkor Info for Controlled Release at Russia Semi

Package Migration to SiP - MCM Integration

Jun-13, R.Huemoeller 36 Amkor Info for Controlled Release at Russia Semi

Advanced Silicon Nodes Driving Higher Costs

Jun-13, R.Huemoeller 37 Amkor Info for Controlled Release at Russia Semi

Logic SoC

Logic 1

Logic 3

Logic 2

Logic 4

• Focus Process Node Development on Specific Application Functionalities

Reduces complexity and mask layer count of process node

Improves wafer yield

Reduces wafer start cost

Improves performance, power, and area of each application

Multi-Die

Interposer

SiP

Monolithic

22nm SOC

Type 1

Multi-Die

Interposer

SiP

Monolithic

22nm SOC

Type 2 SoC

Logic 1

Logic 1

Cache

Logic 2

Logic

1

Logic

2

Cache

Analog

Lo

gic

1

Lo

gic

2

Logic

3

Lo

gic

4

SoC Logic 1

Analog Logic 2

SOC to 2.5D TSV MCM SiP Drivers

Jun-13, R.Huemoeller 38 Amkor Info for Controlled Release at Russia Semi

Commissioned report September 2011 courtesy of

Amkor Technology and Yole Développement

Industry Advanced Package Integration Roadmap

Jun-13, R.Huemoeller 39 Amkor Info for Controlled Release at Russia Semi

Amkor’s View : Future of Advanced Package Sm

aller F

orm

Facto

r Larg

er

Interconnect Density & Functionality : Increasing

Production TransitionDie

Developing

Die

Si Photonics

+ TSV

All About

System

Modularity &

Integration

Enabling a

Microelectronic

World®

Thank You!