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  • November-December 2010November-December 2010Volume 14, Number 6Volume 14, Number 6

    The International Magazine for the Semiconductor Packaging IndustryThe International Magazine for the Semiconductor Packaging Industry

    Wafer-Level Test Design for Reliability Fine-Pitch Copper Wire Bonding Stress Analysis for 3D Wafer Thinning International Directory of Wire Bonders

    Wafer-Level Test Design for Reliability Fine-Pitch Copper Wire Bonding Stress Analysis for 3D Wafer Thinning International Directory of Wire Bonders

  • http://www.newport.com/bond1

  • Chip Scale Review. Nov/Dec 2010. [ChipScaleReview.com] 1

    CONTENTS

    Nov-Dec 2010 Volume 14, Number 6

    The International Magazine for Device and Wafer-level Test, Assembly, and Packaging

    Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS,

    MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century.

    Cover photo rights reserved Chip Scale Review

    This edition’s cover dramatically depicts sand or silica

    (aka: silicon dioxide) as the raw material for transformation to

    a silicon wafer. This process is achieved through many steps

    including the Czochralski process and eventually results

    as this flip-chip ball grid array. During the manufacturing

    cycle a number of sequential processes occur to achieve

    this final step. In this edition of CSR we have assembled a

    rich set of in-depth articles that unravel a few areas of these

    complex transforming processes that range from TSV silicon

    interposers, wafer test/probing and the increasing adoption

    of copper wire bonding, the criticality of emphasis for

    design and test reliability and the significant challenges

    of ultra-low alpha emitting solder materials.

    FEATURE ARTICLES

    Stress Analysis of Wafer Thinning Processes for 3D-IC James Hermanowski and Sumant Sood, SUSS MicroTec, Inc.

    Scott Sullivan, Disco Corp., Hans-Dieter Geiler and Kristian Schulz, JenaWave GmbH

    3D Glass and Silicon Interposers: A $950M Business by 2015 Jean-Marc Yannou, Yole Développement

    Fine Pitch Copper Wire Bonding Horst Clauberg, Ivy Qin, Paul Reid and Bob Chylak

    Kulicke and Soffa Industries, Inc.

    Probabilistic Design for Reliability (PDfR) Ephraim Suhir, ERS Company

    University of California Santa Cruz, University of Maryland College Park

    Challenges in Supply of Ultra-low Alpha Emitting Solder Materials Andy Mackie, PhD, Indium Corporation, Olivier Lauzeral, iROC Technologies

    14

    18

    20

    24

    29

    http://www.yeu.com

  • Chip Scale Review. Nov/Dec 2010. [ChipScaleReview.com]2

    http://www.ssecusa.com

  • Chip Scale Review. Nov/Dec 2010. [ChipScaleReview.com] 3

    http:\\www.ssecusa.com

  • Chip Scale Review. Nov/Dec 2010. [ChipScaleReview.com]4

    http://www.vitechnology.com

  • Chip Scale Review. Nov/Dec 2010. [ChipScaleReview.com] 5

    From the Publisher World Series Champions . . . The , a Perfect Example of Teamwork! Kim Newman, Chip Scale Review

    Editor's Outlook A Peek Into Next Year Ron Edgar, Technical Editor, Chip Scale Review

    Industry News IWLPC 2010 in Review Chip Scale Review Staff

    Interview Probing Questions for Rudolph Technologies Françoise von Trapp, Contributing Editor

    2010 International Directory of Wire Bond Equipment Manufacturers Ron Molnar, Az Tech Direct, LLC

    What's New!, Product Showcase

    Advertiser Index, Advertising Sales

    CONTENTS

    FEATURE ARTICLES

    DEPARTMENTS

    32

    38

    6

    8

    10, 42

    12

    36

    46

    48

    Wire Bonding . . . It's Not Going Away Any Time Soon Gil Olachea, AZ Tech Direct, LLC

    Contactors for Wafer-level Test Jim Brandes, Multitest

    Copyright © 2010 High Connection Density, Inc. All rights reserved. Information is subject to change without notice. “SuperSpring” and “SuperButton” are trademarks of High Connection Density, Inc.

    820A Kifer Road, Sunnyvale, CA 94086 (408) 743-9700 x331

    www.hcdcorp.com [email protected]

    ISO 9001:2000 Certi�ied

    Our Proprietary Technology Your Competitive Advantage

    SuperButton® SuperSpring®

    Featuring HCD Patented SuperButton® and

    SuperSpring® Contact Elements incorporated into

    socket and interposer solutions for prototyping, validation, space transformer, and test

    applications.

    Stop by and learn more about our innovative connector

    technology at these upcoming shows:

    IMAPS 2010 November 2-4

    Booth 818

    Silicon Valley Test Conference November 8-9

    SuSuuuupepepppppepppp rBrBBrBBBrBBBBButuuuuuu totototoooooon®nn®n®nnnnnn BeBeeBeeeee tstsstsssstst iiinnnnnnn CClClClCCCC asasasasasasasss s ssss elelllllllececececececceececctrtrtrtttt icicicicicciccalalalaaalaa

    pppepepepppepppepepp rfrfffffffffffffororrororororrorooo maamaamaaaaaaaancnnnnnnn e ee aaananananaanaaa d dd d ccoocococcocoocooooooontntnttttttacacacacacacacacaacaccct tt rereeeeererelllilililillilililiiiababbbbbbbililililiililillilililititii yyyyyy

    http://www.hcdcorp.com

  • Chip Scale Review. Nov/Dec 2010. [ChipScaleReview.com]6

    World Series Champions . . .

    The , a Perfect Example of Teamwork !

    FRFRFRFRFROM OM OM OM OM THE PUBLISHERTHE PUBLISHERTHE PUBLISHERTHE PUBLISHERTHE PUBLISHER

    STAFF

    Kim Newman Publisher [email protected] Lawrence Michaels Managing Director [email protected] Ron Edgar Technical Editor [email protected] Françoise von Trapp Contributing Editor [email protected] Sandra Winkler Contributing Editor [email protected] Dr. Tom Di Stefano Contributing Editor [email protected] Paul M. Sakamoto Contributing Editor Test [email protected] Jason Mirabito Contributing Legal Editor [email protected] Carol Peters Contributing Legal Editor [email protected]

    SUBSCRIPTION--INQUIRIES

    Chip Scale Review T 408-429-8585 F 408-429-8605 [email protected]

    Advertising Production Inquiries: Kim Newman [email protected]

    EDITORIAL ADVISORS

    Dr. Thomas Di Stefano Centipede Systems Ron Molnar Az Tech Direct, LLC. Dr. Andy Mackie Indium Corp. of America Dr. Thorsten Teutsch Pac Tech USA Charles Harper Technology Seminars Dr. Guna Selvaduray San Jose State University Prof. C.P. Wong Georgia Tech Dr. Ephraim Suhir ERS Company Nick Leonardi Premier Semiconductor Services

    Copyright © 2010 by Gene Selven & Associates Inc. Chip Scale Review (ISSN 1526-1344) is a registered trademark of

    Gene Selven & Associates Inc. All rights reserved.

    Subscriptions in the U.S. are available without charge to qualified

    individuals in the electronics industry. Subscriptions outside of the

    U.S. (6 issues) by airmail are $85 per year to Canada or $95 per

    year to other countries. In the U.S. subscriptions by first class mail

    are $75 per year.

    Chip Scale Review, (ISSN 1526-1344), is published six times a

    year with issues in January-February, March-April, May-June, July-

    August, September-October and November-December. Periodical

    postage paid at Los Angeles, Calif., and additional offices.

    POSTMASTER: Send address changes to Chip Scale Review

    magazine, P.O. Box 9522, San Jose, CA 95157-0522

    Printed in the United States

    The International Magazine for Device and Wafer-level Test, Assembly, and Packaging Addressing

    High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/ Wireless, Optoelectronic and Other Wafer-

    fabricated Devices for the 21st Century.

    VOLUME 14, NUMBER 6

    Kim Newman Publisher

    I actually had my publisher’s letter finished ahead of schedule, but then the SanFrancisco Giants did the unexpected, they won the 2010 World Series! Ever since I can recall, as the daughter of now retired CSR publisher, Gene Selven, there was publishing and baseball. My years watching this sport, and specifically cheering on our hometown favorite Giants, gave me little indication that this seemingly wishful thought for “the Team” would become a reality.

    This is historical, at least as far as everyone in this baseball and publishing family is concerned, calling for the immediate and unquestionable need to rethink the publisher’s letter for this issue.

    Many days and discussions later, amateurs and enthusiasts alike seem to agree on one key point. The Giants won the Championship because they simply performed as a team. This seems to come as a surprise in the era of teams with highly-paid superstars, when it is actually the main premise of team sports, with each player expected to contribute equally to win the championship.

    Baseball and publishing . . . I have also relied on the teamwork approach to build momentum and success. With this approach in mind, I would like to share our team line-up for 2011, which will lead to another banner year for Chip Scale Review.

    Articles, editorials and the supplier directories will continue to be the focus, attracting the widening base of subscribers and advertisers alike. The successful International Wafer-Level Packaging Conference (IWLPC), held in October in partnership with the SMTA Organization, will be enhanced in 2011 with the addition of editorial advisors to expand the technical con

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