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Thermal Analysis of an Icy IC

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Thermal Analysis of an Icy IC. Shiree Burt Cryogenic Electronics Group San Francisco State University Presented October 2, 2006 Revised October 18, 2010. Page 1. Page 2. Two processes for releasing the silicon nitride membrane:. Thin PolySi Removed by XeF 2. Page 3. - PowerPoint PPT Presentation

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Thermal Analysis of an Icy IC Shiree Burt Cryogenic Electronics Group San Francisco State University Presented October 2, 2006 Revised October 18, 2010

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Page 1: Thermal Analysis of an Icy IC

Thermal Analysis of anIcy IC

Shiree BurtCryogenic Electronics Group

San Francisco State UniversityPresented October 2, 2006Revised October 18, 2010

Page 2: Thermal Analysis of an Icy IC

Page 1

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Page 2

Page 4: Thermal Analysis of an Icy IC

Two processes for releasing the silicon nitride membrane:

Thin PolySiRemoved by XeF2

Page 3

Page 5: Thermal Analysis of an Icy IC

Without Etch Stop With Etch Stop

Confinement of XeF2 etch by SiO2 etch stop “tub”

Page 4

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Membrane Undercutting

Test Structure

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