w w w . t h i n f i l m . c o m

Thermal ConductivityMETALS (Watts cm °C)Silver (Ag) 4.08Copper (Cu) 3.94Gold (Au) 2.96Aluminum (Al) 2.18Beryllium (Be) 2.00Tungsten (W) 1.74Rhodium (Rh) 1.50Molybdenum (Mo) 1.46Brass (66%Cu, 34% Zn) 1.110Chromium (Cr) 0.937Nickel (Ni) 0.920Platinum (Pt) 0.716Tin (Sn) 0.666Tantalum (Ta) 0.575Lead (Pb) 0.353Titanium (Ti) 0.219Manganese (Mn) 0.078

INSULATORS (Watts cm °C)Diamond (CVD) 10.0–16.0Beryllium Oxide 99.5% (BeO) 2.61Aluminum Nitride (AIN) 1.70Boron Nitride (HBN 500°) 0.59Sapphire 0.46Alumina Oxide 99.6% (AI2O3) 0.36Alumina Oxide 96% (AI2O3) 0.26Alumina Oxide 91% (AI2O3) 0.13Glass 0.015Mica 0.0043–0.0062Air 0.00026

BONDING (Watts cm °C)Gold Germanium 88/12 0.8834Gold Tin 80/20 0.6824Tin Lead Solder (Sn62) 0.4921Indium 100% 0.2386Silver Filled Epoxy 0.0156Epoxy 0.0099

Temperature ConversionDegrees F = 9/5 (Degrees C) + 32Degrees C = 5/9 (Degrees F) – 32

Gold ConversionEQUIVALENTS1 Kilogram = 32.15 Troy Ounces1 Troy Ounce = 31.103 Grams1 Pound = 453.59 Grams1 Pound = 14.583 Troy Ounces24 Karats = 100% Gold18 Karats = 75% Gold14 Karats = 58.33% Gold10 Karats = 41.66% Gold

SoldersCOMPOSITION MELTING RANGE SOLIDUS LIQUIDUS

Sn96 221°C 221°CSn70 182°C 193°CSn63 182°C 182°CSn62 176°C 189°CSn60 182°C 190°CSn50 182°C 215°CSn40 182°C 238°CSn35 182°C 246°CSn30 182°C 254°CSn20 182°C 276°CSn10 267°C 299°CSn5 308°C 312°CSb5 232°C 240°CPb80 182°C 276°CPb70 182°C 254°CPb65 182°C 246°CAg1.5 309°C 309°CAg2.5 304°C 304°CAg5.5 304°C 365°CGold Germanium (88/12) 356°C 356°CGold Tin (80/20) 280°C 280°CIndium (100%) 157°C 157°C

Material PropertiesMATERIAL ELECTRICAL CONDUCTIVITY (Siemens/m)Aluminum 3.538×107

Beryllium 2.256×107

Brass (66%Cu, 34%Zn) 2.564×107 (converted from resistivity)Carbon (graphite) 1.276×105

Chrome 5.104×106

Copper 5.800×107

Gold 4.257×107

Indium 1.392×107

Lead 4.872×106

Nickel 1.462×107

Palladium 9.280×106

Platinum 9.442×106

Rhodium 2.227×107

Silver 6.090×107

Tin 8.700×106

Tin Lead Solder (63/37) 7.284×106 (estimated)Titanium 1.276×106

Titanium Tungsten (TiW) 1.652×107 (estimated)Tungsten 1.821×107

Copper ThicknessConversionCOPPER OUNCES THICKNESS½ Ounce 0.7 Mils 17.78 Microns1 Ounce 1.4 Mils 35.56 Microns2 Ounces 2.8 Mils 71.12 Microns3 Ounces 4.2 Mils 106.68 Microns

Other ConversionsEQUIVALENTS1 Micron = 39.37 Microinches1 Micron = 10,000 Angstroms1 Micron = 1,000 Nanometers25.4 Microns = 1 Mil1 Angstrom = 0.003937 Microinches1 Angstrom = 0.0001 Microns10 Angstroms = 0.03937 Microinches = 1 Nanometer50 Angstroms = 0.1968 Microinches = 60/40 Optical254 Angstroms = 1 Microinch100 Nanometers = 3.937 Microinches100 Nanometers = 1,000 Angstroms1 Nanometer = 10 Angstroms1 Microinch = 254 Angstroms1 Microinch = 25.4 Nanometers39.37 Microinches = 1 Micron1 Mil = 25.4 Microns

TO GET MULTIPLY BYAngstroms = Microns x 10,000Angstroms = Microinches x 254Angstroms = Mils x 25,400Angstroms = Nanometers x 10Microns = Nanometers x 0.001Microns = Angstroms x 0.0001Microns = Microinches x 0.0254Microns = Mils x 25.4Microns = Millimeters x 0.01Nanometers = Microns x 1000Nanometers = Mils x 0.03937Nanometers = Microinches x 25.4Nanometers = Angstroms x 0.10Millimeters = Microns x 0.001Millimeters = Mils x 0.0254Millimeters = Microinches x 0.0000254Millimeters = Inches x 25.4Centimeters = Inches x 2.54Centimeters = Millimeters x 10Microinches = Microns x 39.37Microinches = Mils x 1000Microinches = Angstroms x 0.003937Microinches = Nanometers x 0.03937Microinches = Millimeters x 39.373Mils = Microns x 0.03937Mils = Microinches x 0.001Mils = Angstroms x 254,000Mils = Millimeters x 39.37Inches = Millimeters x 0.03937Inches = Centimeters x 0.3937Sq. Inches = Sq. Centimeters x 0.15499Sq. Centimeters = Sq. Inches x 6.45Cu. Inches = Cu. Centimeters x 0.06102Cu. Centimeters = Cu. Inches x 16.39Ounces = Grams x 0.03527Pounds = Kilograms x 2.2046Grams = Ounces x 28.349Kilograms = Pounds x 0.4536