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Thermaltronics
Why Thermaltronics?
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Overview Introduction
Company Introduction Our customers & Industries we service Certifications
Our Products Product Comparison Conclusion
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Mission Statement To research, develop and manufacture
products related to power and thermal demand requirements.
Our goals: Quality Increased Productivity Cost Reduction
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Company Introduction Production and manufacturing of
soldering devices and related products Extensive knowledge in Curie Heat
Technology Manufacturing Facility in Beijing, China
Capacity: 2000 systems 80,000 cartridges per month
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Industries We Supply Avionics Disk Drive Manufacturing Contract Electronic Manufacturing (CEM’S) Medical Electronics Power Supply Manufacturers Solar Cell Production Telecommunications
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Customers
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NRTL - Safety TUV / GS - Safety CE - Safety
Certifications
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ISO9000 - Quality ISO14000 - Environment SGS – Lead-Free
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TMT-2000S Soldering Station (450KHz)
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K Series
P Series
S Series
Part Number Description WarrantyTMT-2000PS Power Supply 1 YearsSHP-K Handpiece 30 DaysSHH-3 Workstand 30 Days
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TMT-5000S Soldering Station (13.56MHz)
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T Series
Part Number Description WarrantyTMT-5000PS-1 Power Supply 1 YearsTMT-5000PS-2 Power Supply 1 YearsSHP-T Handpiece 30 DaysSHH-2 Workstand 30 Days
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TMT-9000S Soldering Station (13.56MHz)
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Part Number Description WarrantyTMT-9000PS-1 Power Supply 4 YearsTMT-9000PS-2 Power Supply 4 YearsSHP-1 Handpiece 90 DaysSHH-1 Workstand 90 Days
M Series
Power Plus
Micro Fine
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Why Thermaltronics?
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No Calibration Required Thermaltronics soldering irons do not need
calibration. (EOS)
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ESD Safe Verified by third parties in hard drive industry to be
completely ESD Safe.
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Point 1Point 2
Point 3
Point 4
Point 5 Point 6
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Electrical Overstress Thermaltronics soldering irons conform
to international standards of Electrical Overstress (EOS)
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Data Point Tip to Ground AC Leakage (<20mv)
Tip to Ground Resistance <2ohms
Hot Cold
1 0.3 0.2 0.32 0.2 0.1 0.23 0.2 0.2 0.44 0.2 0.2 0.35 0.3 0.2 0.36 0.2 0.2 0.2
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Grounding Scheme Comparison Thermaltronics offers an improved
grounding scheme.
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MX500 – Grounding Scheme No secured grounding connection exists. Grounding is highly dependent on the connectivity
between the front and back enclosure. (a potential grounding problem exists if oxidation occurs or there is an uneven fit between the front and back enclosure).
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TMT-9000S – Secured Grounding Scheme Secured grounding path to insure AC Filter, PCBA,
RF connectors, Front and Back enclosure are all physically securely grounded together.
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Faster Start-Up
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Sustained Power Output
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TMT-9000S – Secured Grounding Scheme Secured grounding path to insure AC Filter, PCBA,
RF connectors, Front and Back enclosure are all physically securely grounded together.
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Plating Improvements Additional plating at tip front Denser plating means longer tip life
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Gold Plated Connectors Gold Plated Connectors improve connectivity
and optimizes power transition.
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Easy Color Identification Color coded bands for easy
identification of tip temperatures
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Patented colour band for easy temperature identificationBlue = 600 series, Yellow = 700 series, Red = 800 series
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Unique Tip Profiles Unique tip profiles such as Mini Wave
tips for SMT applications
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MXWV020 MXWV031 MXWV300
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M Series - Power Plus Tips Faster Soldering Increased Performance without no increase
in temperature Thicker Plating to extend tip life
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Large Copper MassIncreases Stored Heat
Increased PlatingLong Tip Life
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Quality Control & Traceability Tracking systems allows finished products to
be traced back to the original work order, QC report and supplier batch
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Product S/N#
Work Order
AssemblyWork Order Component Component
SupplierBatch#
SupplierBatch#Component
SupplierBatch#
Unique S/N#allowsTraceability
Unique S/N# 83910108
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Why Thermaltronics? Secured Grounding Faster Start-up Sustained Power Output Increased Plating Gold Plated Connectors Easy Color Identification Unique New Tip Profiles Quality Control & Traceability
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Thermaltronics
Quality – Increase Productivity – Cost Reduction
End Presentation
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