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3263 © 2012 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim wileyonlinelibrary.com Thin, Flexible Sensors and Actuators as ‘Instrumented’ Surgical Sutures for Targeted Wound Monitoring and Therapy Dae-Hyeong Kim, Shuodao Wang, Hohyun Keum, Roozbeh Ghaffari, Yun-Soung Kim, Hu Tao, Bruce Panilaitis, Ming Li, Zhan Kang, Fiorenzo Omenetto, Yonggang Huang, and John A. Rogers* Sutures are among the simplest and most widely used devices in clinical medicine. All existing synthetic and natural forms use thread-like geometries, as purely passive, mechanical structures that are flexible and resilient to tensile stress. Several recent reports describe strategies to incorporate advanced functionality into this platform through the employ- ment of shape-memory polymers that offer mechanical actua- tion or through the release of bioresorbable compounds that carry growth factors and antibiotics to accelerate healing. [1–3] Such technologies lack, however, programmable actuation or sensory feedback control. Sutures that embed flexible sensors and associated electronic circuits could perform these and other related functions. Demonstrations using thin flexible strips equipped with sensors for pressure and chemical moni- toring have been reported [4,5] but not in designs for use as sutures. Furthermore, the organic and silver-based material components comprising these devices might limit their per- formance capabilities, and also lead to concerns about long- term durability in moist, dynamic conditions in the body. Here, we report strips with significantly smaller form factors, specifically engineered for use as flexible sutures ( 1 mm width and 3 μm thickness) ‘instrumented’ with high quality single crystal inorganic semiconductors of biocompatible materials such as silicon in nanomembrane formats. [6] The resulting class of technology offers routes to high levels of performance and sophisticated function in sensors and actua- tors suitable for in vivo use. This new type of diagnostic/ther- apeutic tools could monitor, sense and actuate in a manner coordinated with natural biological responses in the body for improved health outcomes. The systems described in the following use ultrathin, narrow strips of biocompatible polymers as platforms for integrated single crystal silicon nanomembranes (Si NM) electronics and sensors, configured together in ways that provide requisite mechanical properties. The examples focus on measurement and delivery of heat, using systems composed of Si NMs, multicomponent metallization and dielectric interlayers/encapsulants, all in bifacial designs (i.e. devices and interconnects on both sides of a thin sub- strate). The collective properties, including operational com- patibility with complete immersion in water and biofluids [7] and robustness to large stresses/strains that occur during suturing, are demonstrated through in vivo evaluations using animal models. The envisioned clinical context is for sensing and programmable delivery of local heating and electrical stimulation to promote healing of chronic wounds [8,9] or for heat shock strategies in cancer treatment. [10] Additional pos- sibilities exist in thermally activated drug release from tem- perature sensitive, polymer host matrices as coatings onto these devices. [11] A representative system includes Si NM diode tem- perature sensors and microscale Joule heating elements DOI: 10.1002/smll.201200933 Flexible Electronics Prof. D.-H. Kim School of Chemical and Biological Engineering WCU Program of Chemical Convergence for Energy and Environment Institute of Chemical Processes Inter-University Semiconductor Research Center Seoul National University Seoul 151-741, Republic of Korea Dr. S. Wang, H. Keum, Y.-S. Kim, Prof. J. A. Rogers Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, IL 61801, USA E-mail: [email protected] Dr. R. Ghaffari MC10 Inc., 36 Cameron Avenue Cambridge, MA 02140, USA Dr. H. Tao, Dr. B. Panilaitis, Prof. F. Omenetto Department of Biomedical Engineering Tufts University, Medford, MA 02155, USA M. Li, Prof. Z. Kang State Key Laboratory of Structural Analysis for Industrial Equipment Dalian University of Technology Dalian 116024, China Prof. Y. Huang Department of Mechanical Engineering and Department of Civil and Environmental Engineering Northwestern University Evanston, IL 60208, USA small 2012, 8, No. 21, 3263–3268
Transcript

Flexible Electronics

Thin, Flexible Sensors and Actuators as ‘Instrumented’ Surgical Sutures for Targeted Wound Monitoring and Therapy

Dae-Hyeong Kim , Shuodao Wang , Hohyun Keum , Roozbeh Ghaffari , Yun-Soung Kim , Hu Tao , Bruce Panilaitis , Ming Li , Zhan Kang , Fiorenzo Omenetto , Yonggang Huang , and John A. Rogers *

Sutures are among the simplest and most widely used devices

in clinical medicine. All existing synthetic and natural forms

use thread-like geometries, as purely passive, mechanical

structures that are fl exible and resilient to tensile stress.

Several recent reports describe strategies to incorporate

advanced functionality into this platform through the employ-

ment of shape-memory polymers that offer mechanical actua-

tion or through the release of bioresorbable compounds that

carry growth factors and antibiotics to accelerate healing. [ 1–3 ]

Such technologies lack, however, programmable actuation or

sensory feedback control. Sutures that embed fl exible sensors

© 2012 Wiley-VCH Verlag Gmb

DOI: 10.1002/smll.201200933

Prof. D.-H. Kim School of Chemical and Biological Engineering WCU Program of Chemical Convergence for Energy and Environment Institute of Chemical Processes Inter-University Semiconductor Research Center Seoul National University Seoul 151-741, Republic of Korea

Dr. S. Wang, H. Keum, Y.-S. Kim, Prof. J. A. Rogers Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana, IL 61801, USA E-mail: [email protected]

Dr. R. Ghaffari MC10 Inc., 36 Cameron Avenue Cambridge, MA 02140, USA

Dr. H. Tao, Dr. B. Panilaitis, Prof. F. Omenetto Department of Biomedical Engineering Tufts University, Medford, MA 02155, USA

M. Li, Prof. Z. Kang State Key Laboratory of Structural Analysis for Industrial Equipment Dalian University of Technology Dalian 116024, China

Prof. Y. Huang Department of Mechanical Engineering and Department of Civil and Environmental Engineering Northwestern University Evanston, IL 60208, USA

small 2012, 8, No. 21, 3263–3268

and associated electronic circuits could perform these and

other related functions. Demonstrations using thin fl exible

strips equipped with sensors for pressure and chemical moni-

toring have been reported [ 4 , 5 ] but not in designs for use as

sutures. Furthermore, the organic and silver-based material

components comprising these devices might limit their per-

formance capabilities, and also lead to concerns about long-

term durability in moist, dynamic conditions in the body.

Here, we report strips with signifi cantly smaller form factors,

specifi cally engineered for use as fl exible sutures ( ∼ 1 mm

width and ∼ 3 μ m thickness) ‘instrumented’ with high quality

single crystal inorganic semiconductors of biocompatible

materials such as silicon in nanomembrane formats. [ 6 ] The

resulting class of technology offers routes to high levels of

performance and sophisticated function in sensors and actua-

tors suitable for in vivo use. This new type of diagnostic/ther-

apeutic tools could monitor, sense and actuate in a manner

coordinated with natural biological responses in the body for

improved health outcomes.

The systems described in the following use ultrathin,

narrow strips of biocompatible polymers as platforms for

integrated single crystal silicon nanomembranes (Si NM)

electronics and sensors, confi gured together in ways that

provide requisite mechanical properties. The examples

focus on measurement and delivery of heat, using systems

composed of Si NMs, multicomponent metallization and

dielectric interlayers/encapsulants, all in bifacial designs

(i.e. devices and interconnects on both sides of a thin sub-

strate). The collective properties, including operational com-

patibility with complete immersion in water and biofl uids [ 7 ]

and robustness to large stresses/strains that occur during

suturing, are demonstrated through in vivo evaluations using

animal models. The envisioned clinical context is for sensing

and programmable delivery of local heating and electrical

stimulation to promote healing of chronic wounds [ 8 , 9 ] or for

heat shock strategies in cancer treatment. [ 10 ] Additional pos-

sibilities exist in thermally activated drug release from tem-

perature sensitive, polymer host matrices as coatings onto

these devices. [ 11 ]

A representative system includes Si NM diode tem-

perature sensors and microscale Joule heating elements

3263H & Co. KGaA, Weinheim wileyonlinelibrary.com

D.-H. Kim et al.

32

communications

Figure 1 . Ultrathin suture strip with integrated temperature sensors and thermal actuators. a) Schematic illustration of steps for building the device and integrating them in a bifacial confi guration on a thin, narrow strip of polyester coated with PDMS. b) Optical images of a 1 × 4 array of temperature sensors based on Si nanomembranes (top) and a 1 × 4 array of microheaters based on Au wires in a serpentine layout (bottom), both on a handle wafer. The small total thickness ( < 3 μ m) and the neutral mechanical plane (NMP) design minimize strains induced by deformations. Five metal pads at the end connect either to a data acquisition system (DAQ) or a power supply (PS) through an anisotropic conductive fi lm (ACF). c) Optical image of a temperature sensor array based on Pt resistors, on a handle wafer. The two arrays have four sensors each, which are arranged in a bifacial confi guration, with an offset to provide an effective 1 × 8 array.

( Figure 1 ). The fabrication begins with microfabrication of

interconnected components on a temporary, ‘handle’ sub-

strate (silicon wafer coated with a thin layer of polymethyl-

methacrylate, PMMA), using a combination of conventional

(e.g. photolithography, physical vapor deposition, reactive

ion etching) and unconventional (e.g. transfer printing,

nanomaterials assembly) techniques. The diodes contain

p-n junctions created by selectively doped Si NMs, prior to

release and transfer from a silicon-on-insulator wafer (SOI,

300 nm top silicon, p-type, SOITEC, France) to a thin layer

of polyimide (PI, ∼ 1.2 μ m, Sigma Aldrich, USA) spin-cast on

the handle substrate. Photolithographically defi ned traces

of exposed metal serve as interconnects and contact pads.

A thin spin-cast layer of epoxy ( ∼ 1.5 μ m, Microchem, USA)

encapsulates the entire system. As a fi nal step of fabrication,

we dissolve the PMMA, which allows release of the strips

from the mother wafer. Two additional transfer printing

steps deliver a pair of separate strips formed in this way onto

opposite sides of a thin, narrow polymer (polyester, syn-

thetic fabric) substrate (coated with polydimethylsiloxane

(PDMS, ∼ 50 μ m)), in an aligned confi guration. Figure 1 a

provides a schematic illustration of fabrication processes in

its entirety.

64 www.small-journal.com © 2012 Wiley-VCH Verlag GmbH & Co. KGaA,

The narrow widths ( ∼ 1 mm), ultrathin

profi les ( ∼ 3 μ m) and meandering lengths

( ∼ 30 mm) of these devices allow for

exceptional mechanical fl exibility. Mul-

tiple corkscrew-like twists and knots [ 12 ]

are necessary for effective suturing. These

geometrical features can be further opti-

mized for the intended anatomy and tar-

geted wound. At the proximal end of the

strip, contact pads extend out to establish

connections with metal traces that lead to

anisotropic conductive fi lms (ACF). Ter-

minal connections to the ACF connections

provide interfaces to external power sup-

plies (PSs) and data acquisition consoles

(DAQs). The example in Figure 1 b inte-

grates diagnostic functionality (i.e. tem-

perature sensors; Si NM diodes) on one

side of a strip and therapeutic function-

ality (i.e. resistive Joule heaters; Au ser-

pentine traces) on the other. Alternatively,

Figure 1 c demonstrates a purely diagnostic

system that combines temperature sensors

(Pt NM, serpentine thermistors) on both

sides in a staggered layout that improves

the spatial coverage of the measurement

to ∼ 3 mm.

Figure 2 a presents an optical micro-

graph (left) and current-voltage meas-

urements (right) of a Si NM diode as a

function of temperature, externally con-

trolled by a hot plate. The results show the

ability to measure small changes in body

temperature (typically 3-4 ° C) caused by

infl ammation [ 13 ] with temperature sensor

resolution of ∼ 0.2 ° C. A representative

Au micro-heater along with infrared thermal images col-

lected during operation at two levels of heating is shown in

Figure 2 b. The thin substrate has exceptionally low thermal

mass, thereby enabling effi cient, localized delivery of heat to

surrounding tissue. Replacing the Au micro-heater with Pt in a

modifi ed serpentine layout yields simple thermistors, as alter-

natives to the Si NM sensors (Figure 2 c). As with the diodes,

the resistance of the Pt devices changes linearly with temper-

ature (right frame of Figure 2 c). Furthermore, the effects of

parasitic resistances because of the use of long wires can be

ignored because changes in resistance of Pt thermistors are

signifi cantly larger than the resistances measured along the

metal interconnects and bus lines leading to the DAQ. For

the purpose of temperature measurement, Pt sensors offer

advantages in simplicity of fabrication and reduced cost rela-

tive to more active Si-based approaches. Si NM diodes dem-

onstrate the ability to integrate silicon into these platforms

for more sophisticated levels of electronic function beyond

those explicitly demonstrated here. [ 7 ]

The mechanics of these devices are central to their use in

sutures. Designs must offer the required physical durability

and deformability, while avoiding strains that could induce

fracture in the functional materials. Reducing the likelihood

Weinheim small 2012, 8, No. 21, 3263–3268

Thin, Flexible Sensors and Actuators as Surgical Sutures

Figure 2 . Images and characterization data from individual devices, with designs optimized for integration onto thin, narrow suture strips. a) Microscope image of a Si NM diode-based temperature sensor (left) and its characterization results (right). Voltage readings at constant current from current-voltage curves at different temperatures (right frame) show a linear behavior (inset). b, Microscope image of an Au microheater (left) and infrared camera images of heating produced at different currents (right). c, Microscope image of a Pt resistor-based temperature sensor (left) and its calibration results at different temperatures (right). The slope of the resistance versus temperature is ∼ 2.7 Ω / ° C.

of fracture can be challenging, particularly when the devices

incorporate brittle materials such as silicon (fracture strain ∼

1%). To avoid mechanical failure, thin, narrow geometries are

benefi cial because they can accommodate strains induced by

bending. For example, plastic substrates used in typical fl ex-

ible electronic devices (thicknesses ∼ 100 μ m) with standard,

surface-mounted designs have bending stiffness character-

istics that are two orders of magnitude greater than those

associated with the sutures reported here. In addition, the top

layer of epoxy positions the active materials within or near

the neutral mechanical plane (NMP), thus further reducing

strains in the most brittle elements (e.g. silicon).

The essential mechanical properties can all be captured

quantitatively by simple calculations and modeling. A cross-

section of a representative device appears in Figure 3 a (left

frame). The Young’s moduli, thicknesses and widths of the

different layers are denoted as E i , h i and w , respectively.

The device elements (the golden or dark grey bricks shown

in Figure 3 a) are much thinner (50 ∼ 150 nm) and narrower

(40 μ m) than the PI ( h PI = 1.2 μ m, w = 1.0 mm) bottom and

epoxy ( h epoxy = 1.5 μ m, w = 1.0 mm) top layers; their infl uence on

the bending characteristics are negligible ( < 0.2% error). The

© 2012 Wiley-VCH Verlag Gmsmall 2012, 8, No. 21, 3263–3268

bending stiffness of the suture in the width direction is given

by

(E I) =N∑

i= 1

Ei hiw

⎡⎣

⎛⎝y0 −

i∑j = 1

h j

⎞⎠

2

+

⎛⎝y0 −

i∑j = 1

h j

⎞⎠ hi +

1

3h2

i

⎤⎦,

(1)

where N = 3 is the number of layers and y 0 is the position of

NMP (Figure 3 a)

y0 =N∑

i=1

Ei hi

⎛⎝ i∑

j=1

h j − 1

2hi

⎞⎠

/N∑

i=1

Ei hi ,

(2)

and E 1 = E PI = 2.5 GPa [ 14 , 15 ] E 2 = E SiO2 = 73 GPa, [ 16 ] E 3 =

E epoxy = 4.4 GPa, [ 17 ] h 1 = h PI , h 2 = h SiO2 = 50 nm, h 3 = h epoxy .

The bending stiffness calculated from Equations (1-2) is

5.9 × 10 − 12 N · m 2 , which is consistent with values (6.2 × 10 − 12

N · m 2 ) obtained with fi nite element analysis (FEA). For many

applications, the suture mainly undergoes various forms of

bending (Figure 3 b, c). The bending strain in the suture is

expressed as

ε = |y|

R,

(3)

where y is the distance from the NMP (Figure 3 a) and R is

the bending radius. NMP is given by Equation (2) as y 0 =

1.47 μ m, which is just 0.02 μ m above the Au layer. As a result,

the strain remains small even when the suture is in a bending

state (e.g. | ε | = 0.5% in Pt when R = 0.44 mm).

A representative example of a smart suture strip con-

taining temperature sensors and Au electrodes is shown in

Figure 3 b. The ultrathin design, the NMP confi guration and

the use of PDMS as a strain isolation layer on a polyester

strip (Figure 3 a, right frame) enable large deformations, such

as those involved during suturing (second and third frame of

Figure 3 b) as well as knotting (last frame of Figure 3 b). Since

the PDMS layers are much softer and thicker ( ∼ 250 kPa,

50 μ m) than the device strips ( > 2 GPa, 2.7 μ m), the PDMS

(Figure 3 a, right frame) absorbs most of the strain deforma-

tions that result from bending. The PDMS layer provides

this strain isolation without signifi cantly shifting the loca-

tion of the NMP. For suturing (Figure 3 b, middle frames),

the bending radius at the most severely deformed region is

estimated to be R ∼ 2 mm, giving rise to a maximum bending

strain in the gold layer of 0.0085% ( Equation 3 ), consistent

with 0.0081% given by FEA (Figure 3 d).

These fabrication sequences and device designs can

accommodate a wide range of substrate materials. To achieve

minimal thickness in a fi nal, deployed state, bioresorbable

materials, such as silk, can be used (middle frame of Figure 3 c).

The location of the NMP for a suture strip with Pt tem-

perature sensors is schematically shown in the left frame of

Figure 3 c. Because of enhanced fl exibility after dissolving the

underlying silk substrate, folding around a thin glass slide

(middle frame of Figure 3 c) and wrapping around a fi ngertip

(right frame of Figure 3 c) are both possible. In the case of

folding the suture around a sharp glass edge (thickness

1.3 mm) the bending radius of the suture at the sharp edge is

estimated to be R ∼ 1.3 mm and the corresponding maximum

strain given by Eq. (3) is 0.012% for the gold, consistent

with 0.013% given by FEA (Figure 3 e). The zigzag shape of

3265www.small-journal.combH & Co. KGaA, Weinheim

D.-H. Kim et al.

3266

communications

Figure 3 . Mechanics of thin, instrumented suture strips. a) Schematic illustrations of the cross section of a bifacial suture. b) Optical image of a suture strip in its curled form (fi rst frame) and after suturing (second and third frame) and knotting (last frame). c) Optimized mechanical structure shown in a schematic illustration (left frame) and examples of a device under various deformations, such as folding (center frame) and wrapping (right frame). d) Strain distribution for the deformation of Figure 3 b (middle frame). e) Strain distribution for the deformation of Figure 3 c (middle frame).

the Pt sensor (Figure 2 c) further reduces the strain in this

material to only 0.0098% (obtained by FEA). In addition

to minimizing the thickness of the residual, active devices,

bioresorbable substrates can facilitate intimate coupling to

biological tissue surfaces with complex surface texture, such

as the brain ( Figure 4 a).

In vivo animal experiments provide evidence for the prac-

tical use of this new class of devices. Specifi cally, sutures that

use silk substrates were evaluated in anaesthetized mouse

models. After anesthesia delivery, the dorsal side was wiped

with alcohol at the incision site with 70% ethanol and the

incision was sutured with a customized 16-gauge needle and

the smart suture to seal the wound.

Incisions made through the dorsal epidermal layer

allowed partial implantation of the Pt temperature sensor

strip, as shown in the left frame of Figure 4 b. No leakage cur-

rents were observed and temperature measurements showed

stable values around ∼ 26.5 ° C. The right frame of Figure 4 b

shows an image of sensors after removal of the partially

implanted strip from the animal body. The implanted part

shows entanglement that results from the high fl exibility that

follows dissolution of the silk. Some amount of un-implanted

silk, however, remains and maintains the original shape of

the strip, which facilitates handling. The same experiment is

performed with Pt temperature sensors (Figure 4 c). The left

www.small-journal.com © 2012 Wiley-VCH Verlag GmbH & Co. KGaA

frame of Figure 4 c shows a tapered strip

knotted to a suture needle, following three

stitch patterns. The four temperature sen-

sors embedded in the strip measure local

temperatures 25.1, 26.8, 26.1 and 25.9 ° C

from left to right.

Failure was avoided by limiting the

fracture strains within the brittle materials

(gold ∼ 1%, [ 18 ] Pt ∼ 4%, [ 19 ] epoxy ∼ 6%, [ 20 ] PI

∼ 6%). [ 21 ] Appropriate function is achieved

only when the tensile strain is smaller than

the smallest fracture strains listed above,

i.e. ε f ≈ 1%. Therefore the maximum ten-

sion the suture could provide is

Tmax = εf (E A) = εf ·∑

i

Ei Ai

(4)

where E i and A i are the Young’s moduli

and cross-section areas of different mate-

rial layers (Epoxy–4.4 GPa, [ 17 ] 3.0 × 10 3

μ m 2 , SiO 2 –73 GPa, [ 16 ] 100 μ m 2 , PI–2.5

GPa, [ 14 , 15 ] 2.4 × 10 3 μ m 2 , PDMS–250

kPa, 0.20 mm 2 , polyester–580 MPa, [ 22 ]

1.0 mm 2 ), respectively. Using the experi-

mental data, Equation (4) gives T max = 6.1

N which is more than two times the tension

needed ( ∼ 2.5 N) [ 23 ] for suturing a 60 mm

long incision. Therefore, the smart sutures

shown in Figure 3 a had suffi cient ten-

sile strength to be pulled through animal

tissue with a suture needle. Other pos-

sible choices of substrate material could

improve further the strength.

The materials and mechanics strat-

egies developed in this study enable a new class of sutures

with electronic ‘instrumentation’ for advanced functionality

in monitoring the state of wound sites and, potentially, pro-

viding therapeutic operation. Sensing and therapy functions

in sutures can exploit device-quality Si based elements, giving

rise to a wide range of clinical applications, including delivery

of light, chemical and electrical stimuli locally to wound sites.

Experimental Section

Fabrication of Silicon NM Temperature Sensors : The fab-rication began with spin coating a thin polyimide fi lm (PI, ∼ 1.2 μ m, Sigma Aldrich, USA) on top of a sacrifi cial layer of poly(methylmethacrylate) (PMMA, 100 nm, MicroChem, USA) on a handle wafer. Doped single crystalline Si NMs (300 nm) were then transfer printed from a source wafer (n-type SOI wafer, SOITEC, France) to the PI fi lm. The transferred Si NMs were etched to defi ne active regions of pn diodes by using patterns defi ned by photoli-thography and reactive ion etching (RIE). Evaporating metal fi lms (Cr/Au, 5 nm/150 nm) followed by photolithography and wet etching formed metal interconnections between the pn diodes and an external DAQ system. A top insulation layer was formed by spin coating of a thin overcoat of epoxy ( ∼ 1.5 μ m). Oxygen reactive ion etching (RIE) defi ned the overall dimensions of the strip, as shown

, Weinheim small 2012, 8, No. 21, 3263–3268

Thin, Flexible Sensors and Actuators as Surgical Sutures

Figure 4 . Applications of thin, instrumented suture strips. a) Representative device on a plastic model of the human brain before (left frame) and after (right frame) dissolving a temporary silk substrate. b) Temperature monitoring experiment on an animal model using an instrumented suture strip based on a Pt thermistor on silk substrate. No leakage current is measured before (left frame) and after (center frame) dissolving the silk substrate. c) Temperature monitoring using an instrumented suture strip at the location of an incision on an animal model. Schematic illustration of a suture strip and needle (left frame) and corresponding image after suturing (right frame). Temperature differences inside and outside of the epidermis can be monitored by suturing the incision.

in the top frame of Figure 1 b. Transfer printing to a polyester sub-strate coated with PDMS or a silk substrate, and connecting an ACF cable for external wiring to a DAQ completed the process. For enhanced adhesion, a thin bilayer of Ti/SiO 2 (3 nm/30 nm) can be deposited onto the polyester or silk.

Fabrication of Pt Temperature Sensors : The overall shapes and fabrication procedures were similar to those used for the silicon devices. For temperature sensing, however, Pt resistors, instead of Si NM p-n diodes, were located in the island region. Thin layers of Ti/Pt (5 nm/50 nm) deposited with an electron beam (e-beam) evaporator on patterns of photoresist, followed by lift-off formed the Pt resistors. Deposition of Cr/Au (5/150 nm) established interconnection bus lines to each temperature sensor. Surface treatment of the PI with UV/Ozone or deposition of a thin silicon dioxide (SiO 2 ) layer ( ∼ 50 nm) on top of the PI improved the adhe-sion of the Pt. Additional encapsulation with thin fi lms of epoxy formed insulation layers to prevent electrical leakage currents. The fi nal device is shown in Figure 1 c. The steps for transfer printing and connecting to ACF were the same as those for the silicon NM devices.

© 2012 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheismall 2012, 8, No. 21, 3263–3268

Fabrication of Au Heaters : The overall shapes and fabrication procedures were sim-ilar to those for the Pt devices. After deposi-tion of Cr/Au (5/150 nm) by electron beam evaporation, wet chemical etching defi ned patterns of Au for resistive heaters. Final pas-sivation with fi lms of epoxy and etching to defi ne the strip geometries completed the fabrication. The resulting device is shown in the bottom frame of Figure 1 b. The steps for transfer printing and connecting to ACF were the same as those for the silicon NM devices.

Silk Preparation : The purifi cation of silk fi broin from Bombyx mori cocoons initially involved removal of sericin, a water-soluble glycoprotein that binds fi broin fi laments, by boiling the cocoons in a 0.02 M aqueous solution of sodium carbonate for 30 min. The resulting fi broin bundle was dried and then dis-solved in a 9.3 M aqueous solution of lithium bromide at 60 ° C for 4 h. The lithium bromide salt was then extracted through a water-based dialysis process over several days. The resulting solution was centrifuged and fi ltered via syringe based micro-fi ltration (5 μ m pore size, Millipore Inc., Bedford, MA) to remove any remaining particulates. This process enables the produc-tion of ∼ 6.5% w/v silk fi broin solution with minimal contaminants and reduced scattering for optical applications. After production of the silk fi broin solution, 10 mL of the solution was cast on 4-inch Si wafers and allowed to crystal-lize in air ( ∼ 12 h). The resulting fi lms were then removed from the substrate and were approxi-mately 50 μ m thick.

Animal Experiments : All procedures were carried out under approved animal protocols. A female Balb/c mouse was anaesthetized with an intraperitoneal injection of a mix of

ketamine–xylazine. The depth of anaesthesia was monitored by palpebral and withdrawal refl exes to confi rm that the animal had reached ‘stage 3’ of anaesthesia. Once the animal was lightly anaesthetized, the dorsal area was shaved and scrubbed with alcohol (70% ethanol) at the incision site, followed with a beta-dine surgical scrub. To validate the performance of sutures in real conditions, the incision opened during surgery was closed with a customized 16-gauge needle and three passes with the tempera-ture sensing suture were carried out to seal the wound. We then verifi ed the operation of the temperature sensors in the animal. In all instances, the incisions were carried out on the dorsal side of the mouse and the suturing was carried out across the dermal layers above the musculature.

Acknowledgements

This material is based upon work supported by the National Science Foundation under grant #0749028 (CMMI) and the US Department

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of Energy, Division of Materials Sciences under Award No. DE-FG02-07ER46471, through the Materials Research Laboratory and Center for Microanalysis of Materials (DE-FG02-07ER46453) at the Uni-versity of Illinois at Urbana-Champaign. J.A.R. acknowledges a National Security Science and Engineering Faculty Fellowship. This work was supported by a grant (2011-0031635) from the Center for Advanced Soft Electronics under the Global Frontier Research Program of the Ministry of Education, Science and Technology Korea and Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Edu-cation, Science and Technology (2012R1A1A1004925).

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Received: April 30, 2012 Published online: August 14, 2012

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