Thundercomm Turbox™ T55M SOM

Thermal Test Report

Rev. V1.0 May 20, 2021

Report Number: #001 DN: TC_T55M_131410

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Thundercomm Turbox™ T55M SOM Thermal Test Report

Copyright© 2021 Thundercomm Technology Co., Ltd. All rights reserved.

Revision History

Revision Date Description

1.0 May 20, 2021 Initial release

Thundercomm Turbox™ T55M SOM Thermal Test Report

Copyright© 2021 Thundercomm Technology Co., Ltd. All rights reserved.

Table List

Table 2-1. Test environment

Table 2-2. Date info

Table 2-3. Equipment info

Table 3-1. Basic info of the test

Table 3-2. Testing condition 1

Table 3-3. Result of testing condition 1

Table 3-4. Test condition 2

Table 3-5. Result of testing condition 2

Table 3-6. Test condition 3

Table 3-7. Result of testing condition 3

Table 3-8. Test condition 4

Table 3-9. Result of testing condition 4

Thundercomm Turbox™ T55M SOM Thermal Test Report

Copyright© 2021 Thundercomm Technology Co., Ltd. All rights reserved.

About This Document

Illustrations in this documentation might look different from your product.

Depending on the model, some optional accessories, features, and software programs might not be available on your device.

Depending on the version of operating systems and programs, some user interface instructions might not be applicable to your device.

Documentation content is subject to change without notice. Thundercomm makes constant improvements on the documentation of your computer, including this guidebook.

Button, tool, and key names appear in bold font, for example, click Save or press Enter.

Folders and files are formatted in italic, for example, turbox_flash_flat.sh.

Thundercomm Turbox™ T55M SOM Thermal Test Report

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Table of Contents

Chapter 1. Thermal Design Guidelines................................................................................... - 2 -

Chapter 2. Test Environment Introduction ............................................................................ - 3 -

2.1. Test environment ............................................................................................................................ - 3 -

2.2. Project data ..................................................................................................................................... - 3 -

2.3. Equipment ....................................................................................................................................... - 3 -

2.4. Test points ....................................................................................................................................... - 3 -

Chapter 3. Test Items ............................................................................................................ - 4 -

3.1. Purpose ............................................................................................................................................ - 4 -

3.2. Measurement .................................................................................................................................. - 4 -

3.3. Test procedure................................................................................................................................. - 4 -

3.4. Test results ...................................................................................................................................... - 7 -

Appendix 1. Notices ........................................................................................................... - 11 -

Appendix 2. Trademarks .................................................................................................... - 13 -

Thundercomm Turbox™ T55M SOM Thermal Test Report

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Chapter 1. Thermal Design Guidelines

According to the application environment and scenarios, we need to conduct thermal design analysis to ensure that the equipment runs for a long time with high performance without the risk of failure. Thermal design considerations are as follows.

Keep the module away from heat source, such as CPU, inductors, and power supplies.

In order to ensure good heat dissipation conditions, the IO PCB needs to be copper laid on the bottom of the module position with no device placed on.

Add thermal pads or heat sinks to the laying copper of the IO PCB to contact the bottom of the module (refer to Figure 1-1). If heat sinks are used on the laying copper of the IO PCB, the heat sinks cannot directly contact the copper pads on the module (refer to Figure 1-2).

Figure 1-1. Add Thermal Pad or Heat Sink

Figure 1-2. Attention

Add thermal pads/silicone grease and a heat sink on the shielding cover of the module, refer to Figure 1-3.

Figure 1-3. Add Thermal Pad and Heat Sink

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Chapter 2. Test Environment Introduction

2.1. Test environment

Table 2-1. Test environment

Normal Temperature: 15°C - 35°C

Relative Humidity: 30-60%

2.2. Project data

Table 2-2. Date info

Testing Start Date: 2021-04-15

Testing End Date: 2021-05-06

2.3. Equipment

Table 2-3. Equipment info

Equipment Model Manufacturer Calibration Due date

Environmental Test Chamber PL-150 HongZhan 2021-02-01

Data acquisition instrument GM10-1C0/C8 Yokogawa 2021-02-01

Radio Communication Analyzer MT8821C Anritsu 2021-02-01

Radio Communication Analyzer MT8000A Anritsu 2021-02-01

DC Source UTP3315TFL UNI-T 2021-02-01

2.4. Test points

Figure 2-1. Test Points Diagram

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Chapter 3. Test Items

3.1. Purpose

The test aims to measure if the M.2 form factor device can operate normally at the maximum room temperature.

3.2. Measurement

Table 3-1. Basic info of the test

Power supply IO Board: 12V

SOM: 3.8V

Tester WenHao Wang

Test points U5400/U4000/U4800/U5500/U6500/U6300/U8902/U8600/U8300/U8200/Shield

Conclusion With MAX power Max Throughput test case, the T55M module can work stably at 57°C for at least 1 hour.

3.3. Test procedure

Step 1. Refer to Figure 3-1 to add thermal gel and copper laying to T55 M.2 module.

Figure 3-1. Add Thermal Gel and Copper Laying

Step 2. Connect the surface of the M.2 chip with thermocouple wires, then connect the module to the T55 DK board. Refer to Figure 3-2.

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Figure 3-2. Connect Thermocouple Wires

Step 3. Add thermal gel to connected points, refer to Figure 3-3.

Figure 3-3. Add Thermal Gel

Step 4. Connect a heat sink to the board. Refer to Figure 3-4.

Figure 3-4. Connect a Heat Sink

Step 5. Put the device assembly to the test chamber, refer to Figure 3-5.

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Figure 3-5. Test Scenario

Step 6. Connect the DC power supply to the board.

Step 7. Connect the device to the the Radio Communication Analyzer (5G NSA mode, LTE DL 3CA(B1/7C), NR DL 4*4 MIMO N78, Max Throughput).

Step 8. Connect the board to a computer.

Step 9. Setup the temperature of test chamber (refer to Figure 2-6) to 25°C, 40°C, 60°C, 57°C, and 58°C respectively with the app of MT8000A Software. Refer to Figure 3-6.

Figure 3-6. MT8000A Software Main Page

Step 10. Run the device for 1 hour unless the connection is broken.

Step 11. Record the temperature data of each chip with data acquisition app, refer to Figure 3-7.

Figure 3-7. Data Acquisition Interface

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3.4. Test results

3.4.1. Test condition 1

Table 3-2. Testing condition 1

Chamber Temperature 25°C

Test Case 5G NSA mode: LTE 3CA(B1/7C), NR 4*4 MIMO N78, Max Power, Max Throughput

TX Power 23dBm

Method Thermal Conductive Adhesive, aluminum sheet

Table 3-3. Result of testing condition 1

Test Location (Chip Model) Temperature (Max °C) Phenomenal Description

Environment Temperature 25

Run continuously for 1h

U5400 41.2

U4000 48.8

U4800 45.2

U5500 42.7

U6500 43.4

U6300 40.4

U8902 42.9

U8600 41.2

U8300 43.6

U8200 43.5

Surface 36.6

Attach temperature picture (As Follows)

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3.4.2. Test condition 2

Table 3-4. Test condition 2

Chamber Temperature 40°C

Test Case 5G NSA mode: LTE 3CA(B1/7C), NR 4*4 MIMO N78,Max Power,Max Throughput

TX Power 23dBm

Method Thermal Conductive Adhesive, aluminum sheet

Table 3-5. Result of testing condition 2

Test Location (Chip Model) Temperature (Max °C) Phenomenal Description

Environment Temperature 40

Run continuously for 1h

U5400 56.3

U4000 64.4

U4800 60.4

U5500 57.8

U6500 58.6

U6300 55.7

U8902 58.0

U8600 56.3

U8300 58.8

U8200 58.6

Surface 51.5

Attach temperature picture (As Follows)

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3.4.3. Test condition 3

Table 3-6. Test condition 3

Chamber Temperature 60°C

Test Case 5G NSA mode: LTE 3CA(B1/7C),NR 4*4 MIMO N78,Max Power,Max Throughput

TX Power 23dBm

Method Thermal Conductive Adhesive, aluminum sheet

Table 3-7. Result of testing condition 3

Test Location (Chip Model) Temperature (Max °C) Phenomenal Description

Environment Temperature 60

After 8 min operation, the NR was disconnected and the LTE was well connected.

U5400 74.6

U4000 83.8

U4800 79.2

U5500 76.3

U6500 77.4

U6300 74.0

U8902 76.4

U8600 74.6

U8300 77.1

U8200 77.0

Surface 69.6

Attach temperature picture (As Follows)

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3.4.4. Test condition 4

Table 3-8. Test condition 4

Chamber Temperature 57°C

Test Case 5G NSA mode: LTE 3CA(B1/7C), NR 4*4 MIMO N78,Max Power,Max Throughput

TX Power 23dBm

Method Thermal Conductive Adhesive, aluminum sheet

Table 3-9. Result of testing condition 4

Test Location (Chip Model) Temperature (Max °C) Phenomenal Description

Environment Temperature 57

Run continuously for 1h.

U5400 74.5

U4000 83.6

U4800 79.3

U5500 76.3

U6500 77.7

U6300 74.3

U8902 76.6

U8600 75.0

U8300 77.4

U8200 77.2

Surface 68.8

Attach temperature picture (As Follows)

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Appendix 1. Notices

Thundercomm may have patents or pending patent programs covering subject matter described in this document. The furnishing of this document does not give you any license to these patents. You can send license inquiries to service@thundercomm.com.

THUNDERCOMM PROVIDES THIS PUBLICATION "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some jurisdictions do not allow disclaimer of express or implied warranties in certain transactions; therefore, this statement may not apply to you.

Changes are made periodically to the information herein; these changes will be incorporated in new editions of the publication. To provide better service, Thundercomm reserves the right to improve and/or modify the products and software programs described in the manuals, and the content of the manual, at any time without additional notice.

The software interface and function and hardware configuration described in the manuals included with your development board or system on module might not match exactly the actual configuration of that you have purchased. For the configuration of the product, refer to the related contract (if any) or product packing list, or consult the distributor for the product sales. Thundercomm may use or distribute any of the information you supply in any way it believes appropriate without incurring any obligation to you.

The products described in this document are not intended for use in implantation or other life support applications where malfunction may result in injury or death to persons. The information contained in this document does not affect or change Thundercomm product specifications or warranties. Nothing in this document shall operate as an express or implied license or indemnity under the intellectual property rights of Thundercomm or third parties. All information contained in this document was obtained in specific environments and is presented as an illustration. The result obtained in other operating environments may vary.

The information of this document should not be as any invitation for offer or any advice to the visitors. Please consult the professional comments from the sales consultant prior to do any actions of investment or purchase.

Thundercomm may use or distribute any of the information you supply in any way it believes appropriate without incurring any obligation to you.

Any references in this publication to non-Thundercomm Web sites are provided for convenience only and do not in any manner serve as an endorsement of those Web sites. The materials at those Web sites are not part of the materials for this Thundercomm product, and use of those Web sites is at your own risk. Thundercomm shall not be responsible for the content of the third party.

Any performance data contained herein was determined in a controlled environment. Therefore, the result obtained in other operating environments may vary significantly. Some measurements may have been made on development-level systems and there is no guarantee that these measurements will be the same on generally available systems. Furthermore, some measurements may have been estimated through extrapolation. Actual results may vary. Users of this document should verify the applicable data for their specific environment.

This document is copyrighted by Thundercomm and the property right of the date mentioned in this document, including but not limited trademarks, patents, copyrights, trade name etc. are not covered by any open-source license. Thundercomm may update this document at any time without notice.

Anyone doesn’t have the right to amend, reprint, republication, reproduce, transmit, distribute or any other way to use this document in business or public purpose without the prior written consent by Thundercomm.

E-mail messages sent to Thundercomm via the Internet are not guaranteed to be completely secure.Thundercomm shall not be liable for any loss incurred by the surfer when transmitting any information over the Internet or for any loss incurred by Thundercomm when sending any information over the Internet at your request.

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Thundercomm has all rights under other relevant exemptions provided by laws and regulations, and Thundercomm's failure to claim or delay in claiming such rights shall not be deemed to be a waiver of such rights by Thundercomm.

Thundercomm reserves the right of final interpretation of this document.

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Appendix 2. Trademarks

Thundercomm, Thundercomm Turbox, TURBOX, Thundersoft turbox are trademarks of Thundercomm Corporation or its associate companies in China and/or other countries. Intel, Intel SpeedStep, Optane, and Thunderbolt are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Microsoft, Windows, Direct3D, BitLocker, and Cortana are trademarks of the Microsoft group of companies. Mini DisplayPort (mDP), DisplayPort, and VESA are trademarks of the Video Electronics Standards Association. The terms HDMI and HDMI High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC in the United States and other countries. Wi-Fi, Wi-Fi Alliance, WiGig, and Miracast are registered trademarks of Wi-Fi Alliance. USB-C is a registered trademark of USB Implementers Forum. All other trademarks are the property of their respective owners.