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Ti Nand 74ac11000

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www.ti.com F E A T U R E S     1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 1A 1Y 2Y GND GND 3Y 4Y 4B 1B 2A 2B V CC V CC 3A 3B 4A D OR N PACKAGE (TOP VIEW) D E S R I P T I O N     1 1A 16 1B 1Y 2 15 2A 14 2B 2Y 3 11 3A 10 3B 3Y 6 9 4A 8 4B 4Y 7 & 7 4 A C 1 1 0 0   U A P E 2 - I P U T P O I T I V E - A N D G A T E    C L S 0 5 4 B – A P R I 1 9 8 7 – R E V S E D J N 2 0 0 5       C e n t e r - n V     C C    a n d G N C o n f g u r a t i o n s    i n i i z e H i h - S p e e d S w i t c h i n g N o i s e       C h n c e d - e r f o r m a n c e m p l a n t e d    C M ) -   µ    r o c e s s       5 0 0 - T y p L a t h - p I m u n i t a t 1 2 5    °  C       a c k a g e O p t o n s n c u d e P l a s t c    S a l l - u t i n e ( D ) a c k a g e s a n d S t a n d a r d    a s t i c 3 0 0 - i D P s )   T h i s e v c e c o n t a i n s f o u r d e p e n d e n t 2 - p u t A g a t e s . t p e r f o r m s t e B o o l e a n f u n c t o n Y = A        B o r  Y = A + n p o s i t v e o g i c .  T e 4 A 1 1 0 0 i s c h a r a c t e r i e d f o r p e r a t i o n f r o m – 4 0    °  C t o 8 5    °  C . F U N C T I O N T A B L E     ( E A C H A T E )   I N P U T S O T U T     Y    A B    H H L   L X H    X L H    L O G I C S Y M B O L     ( 1 )  1 ) T h i  s s y m b o l i s i n a c c o r d a n c e w i t h A I / I t d 9 1 - 1 9 8 4 a n d I C P u b l i c a t i o n 6 1 7 - 1 2 .  e a s e b e a w a r e t a t a n m p o r t a n t n o t c e c o n c e r i n g v a i  l b i t y , s t a n a r d w a r r a n t y , a n d u s e n c r t i  c a l a p p l c a t i o n s o f T e x a s    n s t r u m e n t s s e m i  c o n d u c t o r p r o d u c t s a n d d i s c l a i m e r s t e r e t o p p e a r s a t t e e n d o f t h i s d a t a s h e e t .  i s a t r a d e m a r k o f T e x a s n s t r m e n t s .  P R O U C T I O N D A T A i n f o r a t i  o n i s c u r r e n t a s o f p u b l  i c a t i o n d a t e .  o p y r i g h t © 9 8 7 – 2 0 0 5 , e x a s I n s t r u m e n t s I n c o r p o r a t e d    P r o d u c t s c o n f o r m o s p e c f i c a t o n s p e r t h e t e r m s o f t h e T e x a s    I n s t r u m e n t s s t a n d a r d w a r r a n t y . r o d u c t i o n p r o c e s s i  n g d o e s n o t   n e c e s s a r i  l y i n c l u d e t e s t i n g o f a l l p a r a m e t e r s .  
Transcript
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F E A T U R E S

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

1A

1Y

2Y

GND

GND

3Y

4Y

4B

1B

2A

2B

VCC

VCC

3A

3B

4A

D OR N PACKAGE

(TOP VIEW)

D E S C R I P T I O N

11A

161B

1Y

2

152A

142B

2Y3

113A

103B

3Y6

94A

84B

4Y7

&

7 4 A C 1 1 0 0 0 Q U A D R U P L E 2 - I N P U T P O S I T I V E - N A N D G A T E

S C L S 0 5 4 B – A P R I L 1 9 8 7 – R E V I S E D J U N E 2 0 0 5

• C e n t e r - P i n V C C a n d G N D C o n f i g u r a t i o n s M i n i m i z e H i g h - S p e e d S w i t c h i n g N o i s e

• E P I C ™ ( E n h a n c e d - P e r f o r m a n c e I m p l a n t e d

C M O S ) 1 - µ m P r o c e s s

• 5 0 0 - m A T y p L a t c h - U p I m m u n i t y a t 1 2 5 ° C • P a c k a g e O p t i o n s I n c l u d e P l a s t i c

S m a l l - O u t l i n e ( D ) P a c k a g e s a n d S t a n d a r d

P l a s t i c 3 0 0 - m i l D I P s ( N )

T h i s d e v i c e c o n t a i n s f o u r i n d e p e n d e n t 2 - i n p u t N A N D g a t e s . I t p e r f o r m s t h e B o o l e a n f u n c t i o n Y = A • B o r Y = A + B i n p o s i t i v e l o g i c .

T h e 7 4 A C 1 1 0 0 0 i s c h a r a c t e r i z e d f o r o p e r a t i o n f r o m – 4 0 ° C t o 8 5 ° C .

F U N C T I O N T A B L E ( E A C H G A T E )

I N P U T S O U T P U T Y

A B

H H L

L X H

X L H

L O G I C S Y M B O L ( 1 )

( 1 ) T h i s s y m b o l i s i n a c c o r d a n c e w i t h A N S I / I E E E S t d 9 1 - 1 9 8 4 a n d I E C P u b l i c a t i o n 6 1 7 - 1 2 .

P l e a s e b e a w a r e t h a t a n i m p o r t a n t n o t i c e c o n c e r n i n g a v a i l a b i l i t y , s t a n d a r d w a r r a n t y , a n d u s e i n c r i t i c a l a p p l i c a t i o n s o f T e x a s I n s t r u m e n t s s e m i c o n d u c t o r p r o d u c t s a n d d i s c l a i m e r s t h e r e t o a p p e a r s a t t h e e n d o f t h i s d a t a s h e e t .

E P I C i s a t r a d e m a r k o f T e x a s I n s t r u m e n t s .

P R O D U C T I O N D A T A i n f o r m a t i o n i s c u r r e n t a s o f p u b l i c a t i o n d a t e . C o p y r i g h t © 1 9 8 7 – 2 0 0 5 , T e x a s I n s t r u m e n t s I n c o r p o r a t e d P r o d u c t s c o n f o r m t o s p e c i f i c a t i o n s p e r t h e t e r m s o f t h e T e x a s I n s t r u m e n t s s t a n d a r d w a r r a n t y . P r o d u c t i o n p r o c e s s i n g d o e s n o t

n e c e s s a r i l y i n c l u d e t e s t i n g o f a l l p a r a m e t e r s .

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1Y1A

1B

1

162

2Y

2A

2B

15

14

3

3Y3A

3B

11

106

4Y4A

4B

9

87

A b s o l u t e M a x i m u m R a t i n g s ( 1 )

7 4 A C 1 1 0 0 0 Q U A D R U P L E 2 - I N P U T P O S I T I V E - N A N D G A T E S C L S 0 5 4 B – A P R I L 1 9 8 7 – R E V I S E D J U N E 2 0 0 5

L O G I C D I A G R A M ( P O S I T I V E L O G I C )

o v e r o p e r a t i n g f r e e - a i r t e m p e r a t u r e r a n g e ( u n l e s s o t h e r w i s e n o t e d )

M I N M A X U N I T

V C C S u p p l y v o l t a g e r a n g e – 0 . 5 7 V

V I I n p u t v o l t a g e r a n g e ( 2 ) – 0 . 5 V C C + 0 . 5 V

V O O u t p u t v o l t a g e r a n g e ( 2 ) – 0 . 5 V C C + 0 . 5 V

I I K I n p u t c l a m p c u r r e n t V I < 0 o r V I > V C C ± 2 0 m A

I O K O u t p u t c l a m p c u r r e n t V O < 0 o r V O > V C C ± 5 0 m A

I O C o n t i n u o u s o u t p u t c u r r e n t V O = 0 t o V C C ± 5 0 m A

C o n t i n u o u s c u r r e n t t h r o u g h V C C o r G N D ± 1 0 0 m A

D p a c k a g e 1 . 3 M a x i m u m p o w e r d i s s i p a t i o n a t T A = 5 5 ° C ( i n s t i l l a i r ) ( 3 ) W

N p a c k a g e 1 . 1

T s t g S t o r a g e t e m p e r a t u r e r a n g e – 6 5 1 5 0 ° C

( 1 ) S t r e s s e s b e y o n d t h o s e l i s t e d u n d e r " a b s o l u t e m a x i m u m r a t i n g s " m a y c a u s e p e r m a n e n t d a m a g e t o t h e d e v i c e . T h e s e a r e s t r e s s r a t i n g s

o n l y , a n d f u n c t i o n a l o p e r a t i o n o f t h e d e v i c e a t t h e s e o r a n y o t h e r c o n d i t i o n s b e y o n d t h o s e i n d i c a t e d u n d e r " r e c o m m e n d e d o p e r a t i n g c o n d i t i o n s " i s n o t i m p l i e d . E x p o s u r e t o a b s o l u t e - m a x i m u m - r a t e d c o n d i t i o n s f o r e x t e n d e d p e r i o d s m a y a f f e c t d e v i c e r e l i a b i l i t y . ( 2 ) T h e i n p u t a n d o u t p u t v o l t a g e r a t i n g s m a y b e e x c e e d e d i f t h e i n p u t a n d o u t p u t c u r r e n t r a t i n g s a r e o b s e r v e d . ( 3 ) T h e m a x i m u m p a c k a g e p o w e r d i s s i p a t i o n i s c a l c u l a t e d u s i n g a j u n c t i o n t e m p e r a t u r e o f 1 5 0 ° C a n d a b o a r d t r a c e l e n g t h o f 7 5 0 m i l s ,

e x c e p t f o r t h e N p a c k a g e , w h i c h h a s a t r a c e l e n g t h o f z e r o .

2

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R e c o m m e n d e d O p e r a t i n g C o n d i t i o n s

E l e c t r i c a l C h a r a c t e r i s t i c s

7 4 A C 1 1 0 0 0 Q U A D R U P L E 2 - I N P U T P O S I T I V E - N A N D G A T E

S C L S 0 5 4 B – A P R I L 1 9 8 7 – R E V I S E D J U N E 2 0 0 5

M I N N O M M A X U N I T

V C C S u p p l y v o l t a g e 3 5 5 . 5 V

V C C = 3 V 2 . 1

V I H H i g h - l e v e l i n p u t v o l t a g e V C C = 4 . 5 V 3 . 1 5 V

V C C = 5 . 5 V 3 . 8 5 V C C = 3 V 0 . 9

V I L L o w - l e v e l i n p u t v o l t a g e V C C = 4 . 5 V 1 . 3 5 V

V C C = 5 . 5 V 1 . 6 5

V I I n p u t v o l t a g e 0 V C C V

V O O u t p u t v o l t a g e 0 V C C V

V C C = 3 V – 4

I O H H i g h - l e v e l o u t p u t c u r r e n t V C C = 4 . 5 V – 2 4 m A

V C C = 5 . 5 V – 2 4

V C C = 3 V 1 2

I O L L o w - l e v e l o u t p u t c u r r e n t V C C = 4 . 5 V 2 4 m A

V C C = 5 . 5 V 2 4

∆ t / ∆ v I n p u t t r a n s i t i o n r i s e f a l l r a t e 0 1 0 n s / V

T A O p e r a t i n g f r e e - a i r t e m p e r a t u r e – 4 0 8 5 ° C

o v e r r e c o m m e n d e d o p e r a t i n g f r e e - a i r t e m p e r a t u r e r a n g e ( u n l e s s o t h e r w i s e n o t e d )

T A = 2 5 ° C P A R A M E T E R T E S T C O N D I T I O N S V C C M I N M A X U N I T

M I N T Y P M A X

3 V 2 . 9 2 . 9

I O H = – 5 0 µ A 4 . 5 V 4 . 4 4 . 4

5 . 5 V 5 . 4 5 . 4

V O H I O H = – 4 m A 3 V 2 . 5 8 2 . 4 8 V

4 . 5 V 3 . 9 4 3 . 8 I O H = – 2 4 m A 5 . 5 V 4 . 9 4 4 . 8

I O H = – 7 5 m A ( 1 ) 5 . 5 V 3 . 8 5

3 V 0 . 1 0 . 1

I O L = 5 0 µ A 4 . 5 V 0 . 1 0 . 1

5 . 5 V 0 . 1 0 . 1

V O L I O L = 1 2 m A 3 V 0 . 3 6 0 . 4 4 V

4 . 5 V 0 . 3 6 0 . 4 4 I O L = 2 4 m A

5 . 5 V 0 . 3 6 0 . 4 4

I O L = 7 5 m A ( 1 ) 5 . 5 V 1 . 6 5

I I V I = V C C o r G N D 5 . 5 V ± 0 . 1 ± 1 µ A

I C C V I = V C C o r G N D , I O = 0 5 . 5 V 4 4 0 µ A

C i V I = V C C o r G N D 5 V 3 . 5 p F

( 1 ) N o t m o r e t h a n o n e o u t p u t s h o u l d b e t e s t e d a t a t i m e , a n d t h e d u r a t i o n o f t h e t e s t s h o u l d n o t e x c e e d 1 0 m s .

3

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S w i t c h i n g C h a r a c t e r i s t i c s

S w i t c h i n g C h a r a c t e r i s t i c s

O p e r a t i n g C h a r a c t e r i s t i c s

P A R A M E T E R M E A S U R E M E N T I N F O R M A T I O N

VOLTAGE WAVEFORMSLOAD CIRCUIT

Input

(see Note B)50%

50% VCC 50% VCC

tPHL tPLH

VCC

Output

VOL

VOH

0 V

From Output

Under Test

CL = 50 pF

(see Note A) 500Ω

NOTES: A. CL includes probe and jig capacitance.

B. Input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50Ω, tr = 3 ns, tf = 3 ns.

C. The outputs are measured one at a time with one input transition per measurement.

50%

7 4 A C 1 1 0 0 0 Q U A D R U P L E 2 - I N P U T P O S I T I V E - N A N D G A T E S C L S 0 5 4 B – A P R I L 1 9 8 7 – R E V I S E D J U N E 2 0 0 5

o v e r r e c o m m e n d e d o p e r a t i n g f r e e - a i r t e m p e r a t u r e r a n g e , V C C = 3 . 3 V ± 0 . 3 V ( u n l e s s o t h e r w i s e n o t e d ) ( s e e F i g u r e 1 )

T A = 2 5 ° C F R O M T O P A R A M E T E R M I N M A X U N I T

( I N P U T ) ( O U T P U T ) M I N T Y P M A X

t P L H 1 . 5 7 . 2 9 . 8 1 . 5 1 1 . 1 A o r B Y n s

t P H L 1 . 5 5 . 8 8 . 6 1 . 5 9 . 6

o v e r r e c o m m e n d e d o p e r a t i n g f r e e - a i r t e m p e r a t u r e r a n g e , V C C = 5 V ± 0 . 5 V ( u n l e s s o t h e r w i s e n o t e d ) ( s e e F i g u r e 1 )

T A = 2 5 ° C F R O M T O P A R A M E T E R M I N M A X U N I T

( I N P U T ) ( O U T P U T ) M I N T Y P M A X

t P L H 1 . 5 5 6 . 5 1 . 5 7 . 4 A o r B Y n s

t P H L 1 . 5 4 . 4 6 . 1 1 . 5 6 . 8

V C C = 5 V , T A = 2 5 ° C

P A R A M E T E R T E S T C O N D I T I O N S T Y P U N I T

C p d P o w e r d i s s i p a t i o n c a p a c i t a n c e p e r g a t e C L = 5 0 p F , f = 1 M H z 3 3 p F

F i g u r e 1 . L o a d C i r c u i t a n d V o l t a g e W a v e f o r m s

4

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PACKAGING INFORMATION

Orderable Device Status (1) PackageType

PackageDrawing

Pins PackageQty

Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)

74AC11000D ACTIVE SOIC D 16 40 Green (RoHS &

no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74AC11000DE4 ACTIVE SOIC D 16 40 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74AC11000DG4 ACTIVE SOIC D 16 40 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74AC11000DR ACTIVE SOIC D 16 2500 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74AC11000DRE4 ACTIVE SOIC D 16 2500 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74AC11000DRG4 ACTIVE SOIC D 16 2500 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74AC11000N ACTIVE PDIP N 16 25 Pb-Free(RoHS)

CU NIPDAU N / A for Pkg Type

74AC11000NE4 ACTIVE PDIP N 16 25 Pb-Free(RoHS)

CU NIPDAU N / A for Pkg Type

74AC11000NSR ACTIVE SO NS 16 2000 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74AC11000NSRE4 ACTIVE SO NS 16 2000 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

74AC11000NSRG4 ACTIVE SO NS 16 2000 Green (RoHS &no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part ina new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please checkhttp://www.ti.com/productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirementsfor all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be solderedat high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die andpackage, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHScompatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flameretardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak soldertemperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to theaccuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis onincoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limitedinformation may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

PACKAGE OPTION ADDENDUM

www.ti.com 4-Jun-2007

Addendum-Page 1

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to Customer on an annual basis.

PACKAGE OPTION ADDENDUM

www.ti.com 4-Jun-2007

Addendum-Page 2

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TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1(mm)

W(mm) Q

74AC11000DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0

74AC11000NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0

PACKAGE MATERIALS INFORMATION

www.ti.com 19-Mar-2008

Pack Materials-Page 1

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*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

74AC11000DR SOIC D 16 2500 333.2 345.9 28.6

74AC11000NSR SO NS 16 2000 346.0 346.0 33.0

PACKAGE MATERIALS INFORMATION

www.ti.com 19-Mar-2008

Pack Materials-Page 2

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IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where

mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not

responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Communications and Telecom www.ti.com/communications

Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers

Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps

DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy

DSP dsp.ti.com Industrial www.ti.com/industrial

Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical

Interface interface.ti.com Security www.ti.com/security

Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Power Mgmt power.ti.com Transportation and www.ti.com/automotiveAutomotive

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com Wireless www.ti.com/wireless-apps

RF/IF and ZigBee® Solutions www.ti.com/lprf

TI E2E Community Home Page e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2011, Texas Instruments Incorporated


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