America’s Flexible Hybrid Electronics Manufacturing Institute
Flexible Hybrid Electronics…The
Tipping Point To Drive Printed
Electronics Market Growth
November 7, 2016
Jason Marsh
Director of Technology
AUGUS T 2 8 , 2 0 1 5
What is NextFlex?Established 28 August 2015
Lead FlexTech Alliance
Hub Location San Jose, California
Proposal Contributors 145+ in 27 states
Federal Funding $75 million
Committed Matching $96 million
Government Agencies Engaged 17 DOD & OGAs
Flex. Hybrid Elec.San Jose, CA
Additive Mfg.Youngstown,
OH
ElectronicsRaleigh, NC
Light/Modern Metals
Detroit, MI
Adv. Composites
Knoxville, TN
Albany & Rochester,
NYDigital Mfg &
Design.Chicago, IL
Smart Mfg.for Energy EfficiencyProj. Award TBD
• Nearly $500M Federal funding
catalyzed over $1.2B cost
share from consortia
• Institutes have attracted
hundreds of companies and
universities as active partners
from across the country
National Network of InstitutesNetwork Status
ESTABLISHED INSTITUTES
Revolutionary Fibers & Textiles
Boston, MA
Next Up
MEMBERS (*Founding)
Corporate
Tier 1*
Tier 2* *
Tier 3
Academic / Non-Profit
Tier 1
Tier 2
Tier 3 * *
* *
Honorary
NextFlex FHE Vision
Why FHE?
• Flexible• Stretchable• Conformable• Transparent• Biocompatible• Lightweight• Cost Effective
Photo Source: Phillips
Photo Source: Phillips
Flexible Hybrid Electronics
Integrated System
Integrated System
Application/ Attribute Defined
Semiconductor
Component
Process/Material Defined
DisplayComponent
Function Defined
FHE as a Market
The Challenge with Pure PE• Unimpressive Mobility at Operating Temp• VT Shift• It works in Display?
• 2x10-9
Duty Cycle
• Amorphous Silicon/Metal Oxides• Polymer• Carbon Nanotubes/Graphene
Photo Source: imec HRG
EMS Industry
$-
$0.50
$1.00
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$3.50
2012 2013 2014 2015 2016
Fixed Assets in USD $BN
Flex Jabil
PC-Laptop-Tablet-Smartphone
39%
8%
4%8% 10%
29%32%
42%
-9%
4%
-8%
19%
37%
-32%
1%
18%
28%
7%
9%3%
-3%-9%
32%
0%-3%
5%10%
0%-2%
2%
-40%
-30%
-20%
-10%
0%
10%
20%
30%
40%
50%
$0
$50
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F2
01
7F
An
nu
al G
row
th(%
)
Sem
ico
nd
uct
or
Rev
enu
e($
US
Bill
ion
)
Semiconductor Revenue• Semiconductor is estimated to contract
in 2016
• Display is moving to flex or seeing margin
erosion
• Thin Film PV market was impacted by
China and falling Silicon prices in 2009
Source: IHS
Why Is The Market Ready for FHE?
FHE has been hiding in plain sight…
FHE Building Blocks
Printed Antenna
Integrated Si Die
Printed BatteryStrain Gage
Skin Contact
Stretch ConductorCMOS Radio
Die on Stretch Die Thinning
Antenna Print
Trace PrintDie Placement
Integration & Lamination
Sensor
Processor
Memory
Power
Transceiver
Application Specific “Package”
Intelligent Devices
• Perishable Decision Window
Why? Our Time Domain World• When we have gone from manual operation in many process to
automation we have relied too heavily on the time domain…
Time Domain vs Need Domain• We rely far too heavily on the time
domain for automation
• Significant waste can be eliminated by operating in a “need” domain
IOT is about Efficiency• Significant waste can be eliminated by operating in a “need” domain
Photo Source: Intratab
FHE Device Requirements
• Robust ROI (the money is already being spent)
• Product Lifecycle Considerations
• Unobtrusive Form Factor
Test Die #1
Bump Tin-Lead
Bump height 130 μm
Bump diameter 120 μm
Pitch 254 μm (10 mils)
Die size 5 x 5 mm
No. of bumps 64
Wafer size 5”
Test Die #2
Bump Nickel-Gold
Bump height 20 +/-3 μm
Bump dia. 90 μm
Pitch 400 μm (16 mils)
Die size 10 x 10 mm
Wafer size 6”
No of dies ~ 132
Die Bonding to Textile Systems
Accelerate Wound Healing
Source: Purdue Universi ty
Additive Applications
Source: PARC
The resonance frequency is tuned 1) by changing BST loading or
2) by applying bias voltage
7 8 9 10 11 12 13-25
-20
-15
-10
-5
0
Frequency (GHz)|S
11| (d
B)
Measured:er=1
Measured:er=6
Simulated:er=1
Simulated:er=6
Printed two sided Frequency selective surface
on BST-COC-LDPE substrate; Front side (a)
and Back side (b).
Measured Tunability using CRC method
Frequency Tunable Materials
Integrated LinesPrint, Die Placement, Ablation, Etch, Bonding, Plasma, Encapsulation
Mass Customization
Soft Robotics Applications
Resistor Diode Transistor Capacitor
Source: PolyIC
Source: Stratasys Source: WileySource: HeraeusPrinted and organic electronics
Printed Circuit Elements for Basic Structures
Design Rule Check for Printed Active and Passive Circuits
Layout and Schematic Capture
DRC for Printed Components
DRC for CNT Transistor
Strategic Road-mapping FrameworkTPD1 Human Monitoring
TPD2 Asset Monitoring
TPD3 Integrate array antenna systems
TPD4 Soft robotics
Demos 1
Key Features
1.
2.
Demos 1
Key Features
1.
2.
“What” we do• Led by Tech council
• Strong end-user participation
• Demos describe “What” the institute
is doing in manufacturing
• Revised annually
MT1. Device Integration and Packaging
MT2. Materials
MT3. Printed Flexible Components& Microfluidics
MT4. Modeling & Design
MT5. Standards, Test & Reliability
“How” we do it• Industry Led at WG level
• Clear boundaries, detailed
roadmaps and deliverables feeding
into TPDs
• Develop “How” – gap analysis
• Drive Project Calls
• Revised semi-annually
TIME
In March we had 660 attendees at FLEX2016 from Industry, academia, government (FTA run)
Technical Working Groups: 140 participants focused on the Roadmapping
NextFlex HQ
Die Integration
and Assembly
Area(c lass 10,000 C lean Room)
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Seminar, Training and
Workforce Development
Materials
Wearables
Lab
Product
Display
Design
Lab
Materials
Registry
Library
Cubicles
Conf
Co
nf
Conf
Board
Room
Break Room
Lunch
Room
Screen
Exp
Printing and Additive
Processing Area(class 10,000 Clean Room)
Lo
bb
y
Co
nf
Co
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Conclusions• Market conditions are driving interest in alternative approaches
like FHE
• FHE is well positioned to combine advanced packaging and printed electronics approaches for IoT, wearables and other key growth markets
• You need not sit on the side lines…get involved and help make this market what we want it to be...
More Information
www.NextFlex.us
Contact: Jason Marsh, Director of Technology
Email: [email protected]