Manufacturing / Advanced Electronics Packaging

In-Circuit ResistanceOpens / Shorts Test on Net ListIn-Circuit CapacitanceIn-Circuit InductanceDiodes and Transistor testDelta ScanFrame Scan

ASIC BGA

FPGA 1156 Ball

CSP (Chip Scale Packages)

Press Fit Connector (custom tooling Rq’d)

QFN Devices

Image Processor Board  ‐Super Hi Density  ‐ Fine Line – Mix TechnologiesCeramic, metal, Plastic components – Populated  both sides.Assembly includes embedded flip chips under Xilinx PLD

Package on Package (POP) devices

• Re‐balling of high cost or long lead time ASIC / FPGA.  • Convert  Pb Free device to Tin/Lead.

TJM works closely with CAM department to assure that paste layer is optimized for proper paste deposition for leadless devices. This is key to successful surface mount assembly of advanced packages.

IPC 7722 / 7721 Certified Repair

Automated DispenseAutomated Dispense