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TM Bias Decoder SPI - farnell.com

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7-Bit 0.25dB Digital Step Attenuator 1MHz to 6GHz F1958 Datasheet © 2018 Integrated Device Technology, Inc. 1 Rev O, March 26, 2018 Description The F1958 is part of IDT’s Glitch-Free TM family of DSAs optimized for the demanding requirements of Base Station (BTS) radio cards and numerous other applications. This device is offered in a compact 4mm x 4mm 24-pin package with 50Ω input and output impedance for ease of integration into the radio or RF system. The F1958 offers very high reliability due to its construction from a monolithic silicon die in a QFN package. The insertion loss is very low with minimal distortion. Additionally, the device is designed to have extremely accurate attenuation levels. These accurate attenuation levels improve system SNR and/or ACLR by ensuring system gain is as close to the targeted level as possible. In addition, the very fast settling time in parallel mode is ideal for fast switching systems. Finally, the device uses our Glitch-Free TM technology in contrast to competing DSAs. Competitive Advantage Lowest insertion loss for best SNR Glitch-Free TM technology to protect power amplifiers or ADC during transitions between attenuation states Extremely accurate attenuation levels Ultra-low distortion MSL1 and 2000 V HBM ESD Typical Applications 3G/4G/4G+ Base Station Systems Distributed Antenna Systems, DAS Remote Radio Heads Active Antenna Systems, AAS Broadband Satellite Equipment NFC Infrastructure Military Communication Equipment Features Serial and 7-bit parallel interface 31.75dB range 0.25dB steps Glitch-Free TM : low transient overshoot 500ns settling time for 0.25dB steps Ultra linear > 63dBm IIP3 Low insertion loss < 1.7dB at 4GHz Attenuation error < ±0.2dB at 4GHz Bi-directional RF use 3.3V or 5V supply -40°C to +105°C operating temperature 4mm x 4mm Thin QFN 24-pin package Block Diagram Figure 1. Block Diagram Decoder RF1 RF2 SPI Bias V MODE CLK DATA LE D[6:0] Glitch-Free TM V DD
Transcript
Page 1: TM Bias Decoder SPI - farnell.com

7-Bit 0.25dB Digital Step Attenuator

1MHz to 6GHz

F1958 Datasheet

© 2018 Integrated Device Technology, Inc. 1 Rev O, March 26, 2018

Description

The F1958 is part of IDT’s Glitch-FreeTM family of DSAs optimized for the demanding requirements of Base Station (BTS) radio cards and numerous other applications. This device is offered in a compact 4mm x 4mm 24-pin package with 50Ω input and output impedance for ease of integration into the radio or RF system.

The F1958 offers very high reliability due to its construction from a monolithic silicon die in a QFN package. The insertion loss is very low with minimal distortion. Additionally, the device is designed to have extremely accurate attenuation levels. These accurate attenuation levels improve system SNR and/or ACLR by ensuring system gain is as close to the targeted level as possible. In addition, the very fast settling time in parallel mode is ideal for fast switching systems. Finally, the device uses our Glitch-FreeTM technology in contrast to competing DSAs.

Competitive Advantage

Lowest insertion loss for best SNR

Glitch-FreeTM technology to protect power amplifiers or ADC during transitions between attenuation states

Extremely accurate attenuation levels

Ultra-low distortion

MSL1 and 2000 V HBM ESD

Typical Applications

3G/4G/4G+ Base Station Systems

Distributed Antenna Systems, DAS

Remote Radio Heads

Active Antenna Systems, AAS Broadband Satellite Equipment

NFC Infrastructure

Military Communication Equipment

Features

Serial and 7-bit parallel interface

31.75dB range

0.25dB steps

Glitch-FreeTM: low transient overshoot

500ns settling time for 0.25dB steps

Ultra linear > 63dBm IIP3

Low insertion loss < 1.7dB at 4GHz

Attenuation error < ±0.2dB at 4GHz

Bi-directional RF use

3.3V or 5V supply

-40°C to +105°C operating temperature

4mm x 4mm Thin QFN 24-pin package

Block Diagram

Figure 1. Block Diagram

Decoder

RF1 RF2

SPIBias

VM

OD

E

CL

K

DA

TA

LE

D[6

:0]

Glitch-FreeTM

VD

D

Page 2: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 2 Rev O, March 26, 2018

F1958 Datasheet

Pin Assignments

Figure 2. Pin Assignments for 4mm x 4mm x 0.75mm TQFN Package – Top View

D0

VMODE

GND

GND

Decoder

EPAD

RF1

VDD

1 DATA

LE

GND

GND

RF2

CLK

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

D1

D3

D4

D6

D5

D2

2

3

4

5

6

7 8 9 10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

SPIB

I

A

S

Pin Descriptions

Table 1. Pin Descriptions

Number Name Description

1 D0 Parallel control pin – 0.25dB. Pull high for attenuation.

2 VDD Power supply input. Bypass to ground with capacitors as close as possible to pin.

3 VMODE Parallel or serial programming mode pin. Leave open or logic LOW for parallel mode. Logic HIGH for serial mode.

4, 6 - 13, 15 GND Internally grounded. These pins must be grounded as close to the device as possible.

5 RF1 RF Port 1. Can be used as either the input or output RF (bi-directional). Port must be at 0V DC. An external AC coupling capacitor must be used if there is a DC voltage present.

14 RF2 RF Port 2. Can be used as either the input or output RF (bi-directional). Port must be at 0V DC. An external AC coupling capacitor must be used if there is a DC voltage present.

16 LE Serial latch enable.

17 CLK Serial clock input.

18 DATA Serial data input.

19 D6 Parallel control pin – 16dB. Pull HIGH for attenuation. [a]

20 D5 Parallel control pin – 8dB. Pull HIGH for attenuation. [a]

21 D4 Parallel control pin – 4dB. Pull HIGH for attenuation. [a]

22 D3 Parallel control pin – 2dB. Pull HIGH for attenuation. [a]

23 D2 Parallel control pin – 1dB. Pull HIGH for attenuation. [a]

24 D1 Parallel control pin – 0.5dB. Pull HIGH for attenuation. [a]

– EPAD Exposed paddle. Internally connected to ground. Solder this exposed paddle to a printed circuit board (PCB) pad that uses multiple ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground vias are also required to achieve the specified RF performance.

[a] There is a 500kΩ pull-down resistor to ground.

Page 3: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 3 Rev O, March 26, 2018

F1958 Datasheet

Absolute Maximum Ratings

The absolute maximum ratings are stress ratings only. Stresses greater than those listed below can cause permanent damage to the device. Functional operation of the F1958 at absolute maximum ratings is not implied. Exposure to absolute maximum rating conditions may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Units

Power Supply Voltage VDD -0.3 5.8 V

VMODE, DATA, CLK, LE, D[6:0] VCTRL -0.3 Lower of

(VDD+0.25, 5.8) V

RF1, RF2 VRF -0.3 0.3 V

Maximum RF Input Power to RF1 or RF2 (> 100 MHz) PMAX +34 dBm

Junction Temperature TJMAX +150 °C

Storage Temperature Range TSTOR -65 +150 °C

Lead Temperature (soldering, 10s) TLEAD +260 °C

Electrostatic Discharge – HBM (JEDEC/ESDA JS-001-2012)

VESDHMB 2000

(Class 2) V

Electrostatic Discharge – CDM (JEDEC 22-C101F)

VESDCDM 1000

(Class C3) V

Page 4: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 4 Rev O, March 26, 2018

F1958 Datasheet

Recommended Operating Conditions

Table 3. Recommended Operating Conditions

Parameter Symbol Condition Minimum Typical Maximum Units

Power Supply Voltage VDD 3.0 5.5 V

Operating Temperature Range TEP Exposed paddle -40 +105 °C

RF Frequency Range fRF 0.001 6 GHz

Maximum Input Power PMAX RF1 or RF2 See Figure 3 dBm

RF Peak Input Power PPEAK

RF1 Port, VDD = 3.3V, TEP= 85°C, fRF > 500MHz, WCDMA, 3GPP, Downlink, 64 DPCH, Chip rate =3.84MSPS, Avg. PIN = +22dBm

1 % 28.9

dBm 0.1 % 30.7

0.01 % 32.3

0.001 % 33.2

RF1 Port Impedance Z1 50

RF2 Port Impedance Z2 50

Figure 3. Maximum Operating CW Input Power vs. Input Frequency

Page 5: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 5 Rev O, March 26, 2018

F1958 Datasheet

Electrical Characteristics

Table 4. Electrical Characteristics

Specifications apply at VDD = 3.3V, TEP = 25°C, fRF = 2GHz, LSB = 0.25dB steps and Evaluation Board (EVKit) trace and connector losses are de-embedded, unless otherwise noted. Minimum attenuation D[6:0] = [0000000], Maximum attenuation D[6:0] = [1111111].

Parameter Symbol Condition Minimum Typical Maximum Units

Logic Input HIGH VIH All logic pins 2.6 [a] 5.5 V

Logic Input LOW VIL All logic pins 0 1 V

Logic Current IIH, IIL -15 +15 µA

DC Current IDD VDD = 3.3V 250 400

µA VDD = 5.5V 310

Attenuation Range No missing codes 31.75 dB

Minimum Gain Step for Monotonicity

LSB

fRF < 4.0GHz 0.25

dB fRF < 6.0GHz 0.50

fRF < 8.0GHz 1.00

DSA Settling Time [b] tSET

Max to min attenuation to settle to within 0.5dB of final value

1.2

µs Min to max attenuation to settle to within 0.5dB of final value

2.0

Maximum Video Feed-Through VIDFT Measured with 10ns rise time, 0V to 3.3V control pulse

10 mVpp

Maximum Spurious Level on any RF Port [c]

SPURMAX Unused RF ports terminated into 50Ω

-118 dBm

Serial Clock Speed fCLK 10 MHz

Parallel to Serial Setup tPS 100 ns

Serial Data Hold Time tH 10 ns

LE Delay Time from final serial clock rising edge

10 ns

Maximum Switch Rate SWRATE 25 kHz

[a] Specifications in the minimum/maximum columns that are shown in bold italics are guaranteed by test. Specifications in these columns that are not shown in bold italics are guaranteed by design characterization.

[b] Speeds are measured after SPI programming is completed (data latched with LE = LOW to HIGH transition). [c] Spurious due to on-chip negative voltage generator. Typical generator fundamental frequency is 2.2MHz.

Page 6: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 6 Rev O, March 26, 2018

F1958 Datasheet

Electrical Characteristics

Table 5. Electrical Characteristics

Specifications apply at VDD = 3.3V, TEP = 25°C, fRF = 2GHz, LSB = 0.25dB steps and Evaluation Board (EVKit) trace and connector losses are de-embedded, unless otherwise noted. Minimum attenuation D[6:0] = [0000000], Maximum attenuation D[6:0] = [1111111].

Parameter Symbol Condition Minimum Typical Maximum Units

Insertion Loss IL

1MHz ≤ fRF ≤ 1GHz 1.1

dB

1GHz < fRF ≤ 2GHz 1.3 1.8 [a]

2GHz < fRF ≤ 3GHz 1.5

3GHz < fRF ≤ 4GHz 1.6

4GHz < fRF ≤ 5GHz 1.9

5GHz < fRF ≤ 6GHz 2.6

Relative Phase Between the Minimum and Maximum Attenuation

Φ∆

fRF = 1GHz 12

deg fRF = 2GHz 25

fRF = 4GHz 50

fRF = 6GHz 70

Step Error DNL Maximum error between any two adjacent attenuation levels

0.15 0.28 dB

Absolute Attenuation Error INL

Max. error for state 19.75dB, fRF = 2000MHz

-0.4 +0.5

dB Max. error, over all states fRF = 2000MHz

-0.8 -0.25 +0.08

+0.5

RF1 Port Return Loss RL1

1MHz ≤ fRF ≤ 2GHz 20

dB 2GHz < fRF ≤ 4GHz 17

4GHz < fRF ≤ 6GHz 13

RF2 Port Return Loss RL2

1MHz ≤ fRF ≤ 2GHz 20

dB 2GHz < fRF ≤ 4GHz 16

4GHz < fRF ≤ 6GHz 12

[a] Specifications in the minimum/maximum columns that are shown in bold italics are guaranteed by test. Specifications in these columns that are not shown in bold italics are guaranteed by design characterization.

Page 7: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 7 Rev O, March 26, 2018

F1958 Datasheet

Electrical Characteristics

Table 6. Electrical Characteristics

Specifications apply at VDD = 3.3V, TEP = 25°C, fRF = 2GHz, LSB = 0.25dB steps and Evaluation Board (EVKit) trace and connector losses are de-embedded, unless otherwise noted. Minimum attenuation D[6:0] = [0000000], Maximum attenuation D[6:0] = [1111111].

Parameter Symbol Condition Minimum Typical Maximum Units

Input IP3 IIP3

PIN = +19dBm per tone 50MHz tone separation

Attn = 0.00dB 64

dBm Attn = 15.75dB 64

Attn = 31.75dB 64

PIN = +16dBm per tone 1MHz tone separation

fRF = 0.7GHz 60 [a] 63.3

dBm fRF = 1.8GHz 60 63.7

fRF = 2.2GHz 60 63.4

fRF = 2.6GHz 60 63.7

Input 0.1dB Compression [b] IP0.1dB 35 dBm

[a] Specifications in the minimum/maximum columns that are shown in bold italics are guaranteed by test. Specifications in these columns that are not shown in bold italics are guaranteed by design characterization.

[b] The input 0.1dB compression point is a linearity figure of merit. Refer to the Recommended Operating Conditions section and Figure 3 for the maximum operating power levels.

Page 8: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 8 Rev O, March 26, 2018

F1958 Datasheet

Thermal Characteristics

Table 7. Package Thermal Characteristics

Parameter Symbol Value Units

Junction to Ambient Thermal Resistance θJA 42 °C/W

Junction to Case Thermal Resistance (case is defined as the exposed paddle)

θJC-BOT 8 °C/W

Moisture Sensitivity Rating (Per J-STD-020) MSL 1

Typical Operating Conditions (TOC)

VDD = 3.3V

ZL = ZS = 50Ω

TEP = 25°C

fRF = 2.0GHz

Attenuation setting = 0 dB = D[6:0] =[0000000]

Pin = +16dBm / tone

50MHz tone spacing

All temperatures are referenced to the exposed paddle

Evaluation Kit traces and connector losses are de-embedded

Page 9: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 9 Rev O, March 26, 2018

F1958 Datasheet

Typical Performance Characteristics

Figure 4. Insertion Loss vs Frequency Figure 5. Insertion Loss vs Attenuator Setting

Figure 6. Input Return Loss vs Frequency

[All States]

Figure 7. Input Return Loss vs Attenuator

Setting

Figure 8. Output Return Loss vs Frequency

[All States]

Figure 9. Output Return Loss vs Attenuator

Setting

-40

-35

-30

-25

-20

-15

-10

-5

0

0 1 2 3 4 5 6 7 8

Inse

rtio

n L

oss (

dB

)

Frequency (GHz)

-40

-35

-30

-25

-20

-15

-10

-5

0

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32

Inse

rtio

n L

oss (

dB

)

Attenuation Setting (dB)

0.02 GHz 0.50 GHz 1.00 GHz 1.50 GHz 2.00 GHz2.50 GHz 3.00 GHz 3.50 GHz 4.00 GHz 4.50 GHz5.00 GHz 5.50 GHz 6.00 GHz

-40

-35

-30

-25

-20

-15

-10

-5

0

0 1 2 3 4 5 6 7 8

Re

turn

Lo

ss (

dB

)

Frequency (GHz)

-40

-35

-30

-25

-20

-15

-10

-5

0

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32

Re

turn

Lo

ss (

dB

)

Attenuation Setting (dB)

0.02 GHz 0.50 GHz 1.00 GHz 1.50 GHz 2.00 GHz2.50 GHz 3.00 GHz 3.50 GHz 4.00 GHz 4.50 GHz5.00 GHz 5.50 GHz 6.00 GHz

-40

-35

-30

-25

-20

-15

-10

-5

0

0 1 2 3 4 5 6 7 8

Re

turn

Lo

ss (

dB

)

Frequency (GHz)

-40

-35

-30

-25

-20

-15

-10

-5

0

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32

Re

turn

Lo

ss (

dB

)

Attenuation Setting (dB)

0.02 GHz 0.50 GHz 1.00 GHz 1.50 GHz 2.00 GHz2.50 GHz 3.00 GHz 3.50 GHz 4.00 GHz 4.50 GHz5.00 GHz 5.50 GHz 6.00 GHz

Page 10: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 10 Rev O, March 26, 2018

F1958 Datasheet

Typical Performance Characteristics

Figure 10. Worst Case Absolute Accuracy vs

Frequency [LSB = 0.25dB]

Figure 11. Absolute Accuracy vs Attenuator

Setting [LSB = 0.25dB]

Figure 12. Worst Case Absolute Accuracy vs

Frequency [LSB = 0.50dB]

Figure 13. Absolute Accuracy vs Attenuator

Setting [LSB = 0.50dB]

Figure 14. Worst Case Absolute Accuracy vs

Frequency [LSB = 1.00dB]

Figure 15. Absolute Accuracy vs Attenuator

Setting [LSB = 1.00dB]

-1.8

-1.6

-1.4

-1.2

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0 1 2 3 4 5 6 7 8

Err

or

(dB

)

Frequency (GHz)

-40 C / Min -40 C / Max

+25 C / Min +25 C / Max

+105 C / Min +105 C / Max

-1.8

-1.6

-1.4

-1.2

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32

Err

or

(dB

)

Attenuation Setting (dB)

0.02 GHz 0.50 GHz 1.00 GHz 1.50 GHz 2.00 GHz

2.50 GHz 3.00 GHz 3.50 GHz 4.00 GHz

-1.8

-1.6

-1.4

-1.2

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0 1 2 3 4 5 6 7 8

Err

or

(dB

)

Frequency (GHz)

-40 C / Min -40 C / Max

+25 C / Min +25 C / Max

+105 C / Min +105 C / Max

-1.8

-1.6

-1.4

-1.2

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32

Err

or

(dB

)

Attenuation Setting (dB)

0.02 GHz 0.50 GHz 1.00 GHz 1.50 GHz 2.00 GHz2.50 GHz 3.00 GHz 3.50 GHz 4.00 GHz 4.50 GHz5.00 GHz 5.50 GHz 6.00 GHz

-1.8

-1.6

-1.4

-1.2

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0 1 2 3 4 5 6 7 8

Err

or

(dB

)

Frequency (GHz)

-40 C / Min -40 C / Max

+25 C / Min +25 C / Max

+105 C / Min +105 C / Max

-1.8

-1.6

-1.4

-1.2

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32

Err

or

(dB

)

Attenuation Setting (dB)

0.02 GHz 0.50 GHz 1.00 GHz 1.50 GHz 2.00 GHz2.50 GHz 3.00 GHz 3.50 GHz 4.00 GHz 4.50 GHz5.00 GHz 5.50 GHz 6.00 GHz

Page 11: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 11 Rev O, March 26, 2018

F1958 Datasheet

Typical Performance Characteristics

Figure 16. Worst Case Step Accuracy vs

Frequency [LSB = 0.25dB]

Figure 17. Step Accuracy vs Attenuator Setting

[LSB = 0.25dB]

Figure 18. Worst Case Step Accuracy vs

Frequency [LSB = 0.50dB]

Figure 19. Step Accuracy vs Attenuator Setting

[LSB = 0.50dB]

Figure 20. Worst Case Step Accuracy vs

Frequency [LSB = 1.00dB]

Figure 21. Step Accuracy vs Attenuator Setting

[LSB = 1.00dB]

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

0 1 2 3 4 5 6 7 8

Err

or

(dB

)

Frequency (GHz)

-40 C / Min -40 C / Max

+25 C / Min +25 C / Max

+105 C / Min +105 C / Max

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32

Err

or

(dB

)

Attenuation Setting (dB)

0.02 GHz 0.50 GHz 1.00 GHz 1.50 GHz 2.00 GHz

2.50 GHz 3.00 GHz 3.50 GHz 4.00 GHz

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

0 1 2 3 4 5 6 7 8

Err

or

(dB

)

Frequency (GHz)

-40 C / Min -40 C / Max

+25 C / Min +25 C / Max

+105 C / Min +105 C / Max

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32

Err

or

(dB

)

Attenuation Setting (dB)

0.02 GHz 0.50 GHz 1.00 GHz 1.50 GHz 2.00 GHz2.50 GHz 3.00 GHz 3.50 GHz 4.00 GHz 4.50 GHz5.00 GHz 5.50 GHz 6.00 GHz

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

0 1 2 3 4 5 6 7 8

Err

or

(dB

)

Frequency (GHz)

-40 C / Min -40 C / Max

+25 C / Min +25 C / Max

+105 C / Min +105 C / Max

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

0.5

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32

Err

or

(dB

)

Attenuation Setting (dB)

0.02 GHz 0.50 GHz 1.00 GHz 1.50 GHz 2.00 GHz2.50 GHz 3.00 GHz 3.50 GHz 4.00 GHz 4.50 GHz5.00 GHz 5.50 GHz 6.00 GHz

Page 12: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 12 Rev O, March 26, 2018

F1958 Datasheet

Typical Performance Characteristics

Figure 22. Relative Insertion Phase vs

Frequency [All States]

Figure 23. Relative Insertion Phase vs

Attenuator Setting

Figure 24. Attenuation vs Frequency

[All States]

Figure 25. Attenuation vs Attenuator Setting

Figure 26. Insertion Loss vs Frequency [0dB] Figure 27. Evaluation Board Insertion Loss

-10

0

10

20

30

40

50

60

70

80

90

0 1 2 3 4 5 6 7 8

Ph

ase

(d

eg

ree

s)

Frequency (GHz)

Positive phase means the device is electrically shorter.

-10

0

10

20

30

40

50

60

70

80

90

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32

Ph

ase

(d

eg

ree

s)

Attenuation Setting (dB)

0.02 GHz 0.50 GHz 1.00 GHz 1.50 GHz 2.00 GHz2.50 GHz 3.00 GHz 3.50 GHz 4.00 GHz 4.50 GHz5.00 GHz 5.50 GHz 6.00 GHz

Positive phase means the device is electrically shorter.

-32

-30

-28

-26

-24

-22

-20

-18

-16

-14

-12

-10

-8

-6

-4

-2

0

0 1 2 3 4 5 6 7 8

Att

en

ua

tio

n (

dB

)

Frequency (GHz)

-32

-30

-28

-26

-24

-22

-20

-18

-16

-14

-12

-10

-8

-6

-4

-2

0

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32

Att

en

ua

tio

n (

dB

)

Attenuation Setting (dB)

0.02 GHz 0.50 GHz 1.00 GHz 1.50 GHz 2.00 GHz2.50 GHz 3.00 GHz 3.50 GHz 4.00 GHz 4.50 GHz5.00 GHz 5.50 GHz 6.00 GHz

-3.5

-3.0

-2.5

-2.0

-1.5

-1.0

-0.5

0.0

0 1 2 3 4 5 6 7 8

Inse

rtio

n L

oss (

dB

)

Frequency (GHz)

3.00 V / -40 C 3.30 V / -40 C 5.00 V / -40 C 5.25 V / -40 C3.00 V / +25 C 3.30 V / +25 C 5.00 V / +25 C 5.25 V / +25 C3.00 V / +105 C 3.30 V / +105 C 5.00 V / +105 C 5.25 V / +105 C

-2.0

-1.8

-1.6

-1.4

-1.2

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0 1 2 3 4 5 6 7 8

Inse

rtio

n L

oss

(dB

)

Frequency (GHz)

-40 C

+25 C

+105 C

Page 13: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 13 Rev O, March 26, 2018

F1958 Datasheet

Typical Performance Characteristics

Figure 28. Input IP3 vs Frequency [0dB] Figure 29. Input IP3 vs Attenuation [2GHz]

Figure 30. Compression vs Input Power [2GHz]

Figure 31. Typical Switching Time for a 0.25dB

Attenuation Transition

Figure 32. Switching Time between Maximum

and Minimum Attenuation

50

55

60

65

70

75

0 1 2 3 4 5 6 7 8

Inp

ut

IP3

(d

Bm

)

Frequency (GHz)

50

55

60

65

70

75

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32

Inp

ut

IP3

(d

Bm

)

Attenuation (dB)

-40 C / RF1 -40 C / RF2 +25 C / RF1 +25 C / RF2+105 C / RF1 +105 C / RF2

-0.8

-0.7

-0.6

-0.5

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

16 18 20 22 24 26 28 30 32 34 36

Co

mp

ressio

n (

dB

)

Input Power (dBm)

0.00 dB 0.25 dB 0.50 dB 1.00 dB

2.00 dB 4.00 dB 6.00 dB 10.00 dB

12.00 dB 18.00 dB 24.00 dB 30.00 dB

31.75 dB

-6.50

-6.25

-6.00

-5.75

-5.50

-5.25

-5.00

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8

Att

en

ua

tio

n (

dB

)

Time (µs)

5.50 dB to 5.75 dB

5.75 dB to 5.50 dB

-32

-30

-28

-26

-24

-22

-20

-18

-16

-14

-12

-10

-8

-6

-4

-2

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

Att

en

ua

tio

n (

dB

)

Time (µs)

0.00 to 31.75 dB

31.75 to 0.00 dB

Page 14: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 14 Rev O, March 26, 2018

F1958 Datasheet

Programming

The F1958 can be programmed using either the parallel or the serial mode, which is selectable via VMODE (pin 3). The serial mode is selected by pulling VMODE to a logic HIGH, and the parallel mode is selected by floating VMODE or setting it to logic LOW.

Serial Mode

F1958 Serial Mode is selected by pulling VMODE to a logic HIGH. The serial interface uses a 8-bit word with only 7 bits used. The serial word is shifted in LSB (D0) first. When serial programming is used, all the parallel control input pins (1, 19 - 24) must be grounded.

Table 8. 7-Bit SPI Word Sequence

Data Bit Symbol

D7 Not Used

D6 Attenuation 16 dB Control Bit

D5 Attenuation 8 dB Control Bit

D4 Attenuation 4 dB Control Bit

D3 Attenuation 2 dB Control Bit

D2 Attenuation 1 dB Control Bit

D1 Attenuation 0.5 dB Control Bit

D0 Attenuation 0.25 dB Control Bit

Table 9. Truth Table for Serial Control Word

D7 (MSB) D6 D5 D4 D3 D2 D1 D0 (LSB) Attenuation (dB)

X 0 0 0 0 0 0 0 0

X 0 0 0 0 0 0 1 0.25

X 0 0 0 0 0 1 0 0.5

X 0 0 0 0 1 0 0 1

X 0 0 0 1 0 0 0 2

X 0 0 1 0 0 0 0 4

X 0 1 0 0 0 0 0 8

X 1 0 0 0 0 0 0 16

X 1 1 1 1 1 1 1 31.75

In the Serial Mode, the F1958 is programmed via the serial port on the rising edge of Latch Enable (LE). It is required that LE be kept logic LOW until all data bits are clocked into the shift register. The F1958 will change attenuation state after the data word is latched into the active register. Refer to Figure 33.

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© 2018 Integrated Device Technology, Inc. 15 Rev O, March 26, 2018

F1958 Datasheet

Figure 33. Serial Register Timing Diagram

Table 10. SPI Timing Diagram Values for the Serial Mode

Parameter Symbol Test Condition Min Typical Max Units

CLK Frequency fC 25 MHz

CLK HIGH Duration Time tCH 20 ns

CLK LOW Duration Time tCL 20 ns

DATA to CLK Setup Time tS 10 ns

CLK Period [a] tP 40 ns

CLK to Data Hold Time tH 10 ns

Final CLK Rising Edge to LE Rising Edge tCLS 10 ns

LE to CLK Setup Time tLS 10 ns

LE Trigger Pulse Width tL 10 ns

LE Trigger to CLK Setup Time [b] tLC 10 ns

[a] (tCH + tCL) ≥ 1/fC. [b] Once all desired data has been clocked in, LE must transition from LOW to HIGH after the minimum setup time tLC and before

any further CLK signals.

Serial Mode Default Startup Condition

When the device is first powered up, it will default to the maximum attenuation of 31.75dB independent of the VMODE and parallel pin [D6:D0] conditions.

Table 11. Default Setting Truth Table for Serial Control Word

D7 (MSB) D6 D5 D4 D3 D2 D1 D0 (LSB) Attenuation (dB)

X 1 1 1 1 1 1 1 31.75

Page 16: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 16 Rev O, March 26, 2018

F1958 Datasheet

Parallel Control Mode

For the F1958, the user has the option of running in one of two parallel modes. Direct Parallel Mode or Latched Parallel Mode.

Direct Parallel Mode

Direct Parallel Mode is selected when VMODE is floating or a logic LOW and LE is a logic HIGH. In this mode, the device will immediately react to any voltage changes on the parallel control pins (1, 19 - 24). Use Direct Parallel Mode for the fastest settling time. The serial pins, CLK and DATA, can be either grounded or left opened in the Parallel Mode.

Latched Parallel Mode

Latched Parallel Mode is selected when VMODE is floating or a logic LOW and LE is toggled from logic LOW to HIGH. To utilize Latched Parallel Mode:

Set VMODE to logic LOW or leave floating.

Set LE to logic LOW.

Adjust pins (1, 19 - 24) to the desired attenuation setting. (Note the device will not react to these pins while LE is a logic LOW).

Set LE to a logic HIGH. The device will then transition to the attenuation settings reflected by pins D6 - D0.

If LE is set to a logic LOW then the attenuator will not change state.

The truth table for the Parallel Mode is identical for bits D6 to D0 as shown in the Serial Mode truth table; see Table 9.

Figure 34. Latch Parallel Timing Diagram

Table 12. Latched Parallel Timing Diagram Values

Parameter Symbol Min Max Units

Serial to Parallel Mode Setup Time tSPS 100 ns

Parallel Data Hold Time tPDH 10 ns

LE Minimum Pulse Width tLE 10 ns

Parallel Data Setup Time tPDS 10 ns

Page 17: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 17 Rev O, March 26, 2018

F1958 Datasheet

Evaluation Kit Picture

Figure 35. Top View

RF1 RF2

VDD

VLOGIC

SW1 Switch for parallel control

VMODE

VDD

J10 Serial Control Pins

J6 Parallel

Control Pins

Figure 36. Bottom View

Page 18: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 18 Rev O, March 26, 2018

F1958 Datasheet

Evaluation Kit / Applications Circuit

Figure 37. Electrical Schematic

C7

R7

J2

C1 C3

J11

U1

D01

VDD2

VMODE3

GND4

RF15

GND6

GN

D7

GN

D8

GN

D9

GN

D10

GN

D11

GN

D12

DATA18

CLK17

LE16

GND15

RF214

GND13

D1

24

D2

23

D3

22

D4

21

D5

20

D6

19

PAD25

C2

VDD

C14

VDD

J10

HEADER 4

1234

R2

R11

C12

J6

10 Pin Header

12345678910

RF1

C11

J3

R13

J8

HEADER 1x2

1 2

R4

VDD

RF2

J7

HEADER 1x2

12

J9

C10

J4

R12

R9

C9

Logic LOW switch to '-' position Logic HIGH switch to '+' position

Thru Cal

D0 D1

D2 D3

D4 D5 D6VMODE VDD

GND

C15

J5

HEADER 1x2

12

R1

VDD

C13

J1

C8

R5

8 pin DIP Sw itch

8 7 6 5 4 3 2 1916

R3

C5

R14

C6

VLOGIC

R8

R10

C4

SW1

VDD

R6

Page 19: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 19 Rev O, March 26, 2018

F1958 Datasheet

Table 13. Bill of Material (BOM)

Part Reference QTY Description Manufacturer Part # Manufacturer

C1 - C8, C11 - C13 11 100pF ±5%, 50V, C0G Ceramic Capacitor (0402) GRM1555C1H101J MURATA

C9, C15 2 1000pF ±5%, 50V, C0G Ceramic Capacitor (0402) GRM1555C1H102J MURATA

C10, C14 2 10nF ±5%, 50V, X7R Ceramic Capacitor (0603) GRM188R71H103J MURATA

R14 1 0Ω Resistors (0402) ERJ-2GE0R00X PANASONIC

R1 - R8, R11 - R13 11 100Ω ±1%, 1/10W, Resistor (0402) ERJ-2RKF1000X PANASONIC

R9 1 10kΩ ±1%, 1/10W, Resistor (0402) ERJ-2RKF1002X PANASONIC

J5, J7, J8 3 CONN HEADER VERT SGL 2 X 1 POS GOLD 961102-6404-AR 3M

J10 1 CONN HEADER VERT SGL 4 X 2 POS GOLD 67997-108HLF Amphenol FCI

J6 1 CONN HEADER VERT SGL 10 X 1 POS GOLD 961110-6404-AR 3M

J1 - J4, J11 5 Edge Launch SMA (0.375 inch pitch ground, tab) 142-0701-851 Emerson Johnson

SW1 1 SWITCH 8 POSITION DIP SWITCH KAT1108E E-Switch

U1 1 DSA F1958NBGK IDT

1 Printed Circuit Board F1958 EVKit Rev 01 IDT

J9, R10 Do Not Populate (DNP)

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© 2018 Integrated Device Technology, Inc. 20 Rev O, March 26, 2018

F1958 Datasheet

Evaluation Kit Operation

Power Supply Setup

Set up a power supply in the voltage range of 3.0V to 5.5V with the power supply output disabled. The voltage can be applied via one of the following connections (see Figure 38):

J11 connector

J5 header connection (note the polarity of the GND pin on this connector)

Pin 9 (VDD) and pin 10 (GND) on the J6 header connection

Figure 38. Power Supply Connections

VDD

VDD

Parallel Logic Control Setup

The Evaluation Board has the ability to control the F1958 in the Parallel Mode. For external control, apply logic voltages to the J6 header pins 1 through 7 (see Figure 39). For manual control, switches 1 through 7 on SW1 can be set. The switch is a three-position switch. The bottom position, "-" will ground the pin. The center position "O" will leave the pin open circuited. Setting the switch to the top position "+" will apply a voltage that is supplied to the switch.

The logic voltage can be applied in one of three ways:

Apply a voltage through a SMA connector (J9). This connector is not supplied.

Apply a voltage on pin 2 of the J7 header connector.

Short out the two header connectors, J7 and J8, so a resistor divider will generate the correct logic voltage from the power supply on the Evaluation Board. The logic voltage will be VDD.

Page 21: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 21 Rev O, March 26, 2018

F1958 Datasheet

Figure 39. Parallel Logic Voltage Connections

RF1 RF2

VDD

VLOGIC

SW1 Switch for parallel control

VMODE

VDD

J11 Serial Control Pins

J6 Parallel

Control Pins

Serial Logic Control Setup

The Evaluation Board has the ability to control the F1958 in the Serial Mode. Connect the serial controller to the J10 header connection as shown in Figure 40. To use the Serial Mode, set SW1 switch 8 to the "+" or "O" position.

The attenuation setting can be programmed according to Table 9.

Figure 40. Serial Logic Connections

RF1 RF2

VDD

VLOGIC

SW1 Switch for parallel control

VMODE

VDD

J10 Serial Control Pins

J6 Parallel

Control Pins

Power-On Procedure

Set up the voltage supplies and Evaluation Board as described in the "Power Supply Setup" section and either the "Parallel Logic Control Setup" or "Serial Logic Control Setup" sections above.

Enable the power supply.

Enable the proper attenuation setting according to Table 9.

Power-Off Procedure

Set the logic control pins to a logic LOW.

Disable the power supply.

Page 22: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 22 Rev O, March 26, 2018

F1958 Datasheet

Application Information

Digital Pin Voltage and Resistance Values

Table 14 provides the open-circuit DC voltage referenced to ground and resistance values for each of the control pins listed.

Table 14. Digital Pin Voltages and Resistance

Pin Name Open Circuit DC Voltage

Internal Connection

3, 16, 17, 18 VMODE, LE, CLK, DATA 0V 500kΩ pull-down resistor to GND

1, 19 - 24 D0, D6 – D1 0V 500kΩ pull-down resistor to GND

Power Supplies

A common power supply should be used for all pins requiring DC power. All supply pins should be bypassed with external capacitors to minimize noise and fast transients. Supply noise can degrade the noise figure and fast transients can trigger ESD clamps and cause them to fail. Supply voltage changes or transients should have a slew rate smaller than 1V/20µs. In addition, all control pins should remain at 0V (+/-0.3V) while the supply voltage ramps or while it returns to zero.

If control signal integrity is a concern and clean signals cannot be guaranteed due to overshoot, undershoot, ringing, etc., the following circuit at the input of each control pin is recommended. This applies to pins for the SPI (16, 17, 18), parallel (1, 19-24) and VMODE pin (3) as shown below. Note the recommended resistor and capacitor values do not necessarily match the EVKit BOM for the case of poor control signal integrity. For multiple devices driven by a single control line, the component values will need to be adjusted accordingly so as not to load down the control line.

Figure 41. Control Pin Interface for Signal Integrity

DATA

Decoder

EPAD

1

2

3

4

5

6

7 8 9 10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

SPIB

I

A

S

2 pF

5 kohm

2 pF

5 kohm

2 pF

5 kohm

CLK

LE

2 pF

5 kohm

2 pF

5 kohm

2 pF

5 kohm

2 pF

5 kohm

2 pF

5 kohm

2 pF

5 kohm

2 pF

5 kohm

D6

D5

D4D3

D2

D1

VMODE

D0

2 pF

5 kohm

Page 23: TM Bias Decoder SPI - farnell.com

© 2018 Integrated Device Technology, Inc. 23 Rev O, March 26, 2018

F1958 Datasheet

Package Drawings

The package outline drawings are appended at the end of this document and are accessible from the link below. The package information is the most current data available.

www.idt.com/document/psc/nbnbg24-package-outline-40-x-40-mm-bodyepad-270mm-sq-050-mm-pitch-qfn

Ordering Information

Orderable Part Number Package MSL Rating Shipping Packaging Temperature

F1958NBGK 4mm x 4mm x 0.75mm 24 pin QFN 1 Tray -40°C to +105°C

F1958NBGK8 4mm x 4mm x 0.75mm 24 pin QFN 1 Reel -40°C to +105°C

F1958EVB Evaluation Board

F1958EVS Evaluation Solution including the Evaluation Board, Controller Board, and cable. The Evaluation Software is available for download on the product page on the IDT website: http://www.idt.com/F1958

Marking Diagram

F1958

NBGK

Z1716AAG

1. Line 1 and 2 are the part number. 2. Line 3 “Z” is for die version. 3. Line 3 “yyww” = 1716 has two digits for the year and week that the part was assembled. 4. Line 3 “NG” denotes Assembly Lot number.

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© 2018 Integrated Device Technology, Inc. 24 Rev O, March 26, 2018

F1958 Datasheet

Revision History

Revision Revision Date Description of Change

O March 26, 2018 Initial Release

Corporate Headquarters

6024 Silver Creek Valley Road San Jose, CA 95138 www.IDT.com

Sales

1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.IDT.com/go/sales

Tech Support

www.IDT.com/go/support

DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an implied warranty of merchantability, or non -infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the Uni ted States and other countries. Other trademarks used herein are the property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. All contents of this document are copyright of Integrated Device Technology, Inc. All rights reserved.


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