LETI WEEKLY STATUS REPORT

Tom McMullen

Week 3

25/2/2013 – 1/3/2013

LETI wafer thinning project flowPhase 1

ID Project Name Owner Days Start End 3-Feb 10-Feb 17-Feb 24-Feb 3-Mar 10-Mar 17-Mar 24-Mar 31-Mar 5-Apr 12-Apr 19-Apr 26-Apr

1.0 Thin Wafer Assemblies T. McMullen 0 1-Feb 30-Sep

Week 1 Week 2 Week 3 Week 4 Week 5 Week 6 Week 7 Week 8 Week 9        

                                     

1.1

PHASE 1 - Layout and mask production, first 2 wafers with microbumps delivered to Advacam LETI - 3D 10 1-Feb 29-Mar

LETI accpets CERN proposal

                       

1.1.1 Send gds to LETI T. McMullen 5 1-Feb 8-Feb                          

1.1.2Send 2 FEI4b wafers to LETI R. Bates 5 1-Feb 6-Feb

                         

1.1.3

Confirm step size on wafer and centre ofset variation on wafer LETI 5 1-Feb 6-Feb

                         

1.1.4Layout and mask production LETI 10 1-Feb 11-Feb

 

Deliverable 1: Microbumb

gds files

                     

1.1.4

First 2 wafers with micro bumps delivered to Advacam LETI 49 12-Feb 2-Apr

               

Deliverable 2: First 2 wafers

with micro bumps

delivered to Advacam

       

Current

Deliverable

Target not met

Action ListPhase 1 and 2

Action What Who When Comment4 Top metal align key information TMcM 22/5/2003 Alignment key config taken from FEI4 CAD – now with LETI

5 CERN purcahsing info for STFC TMcM 14/2/2013 Confirmed to be ok by Richard

6 Further funding for flip-chip process Rbates\Cbuttar 31/3/2013Richard awaiting information back from Hienze regarding

this

7 Bow measurement set-up TMcM 31/2/2013 visit SMC and set up program for bow measurement

8 Sensors for flip chipping All 31/3/2013 Sensor availablilty for flip-chip process - Meeting rqd

9 Assembly probe test solution TMcM 19/3/2013 Pobe test solution for flip-chipped assemblies - yield maps

10 FEI4B probe card and probe set-up Rbates/TMcM 19/3/2013 FEI4B test solution for assembly testing yeild maps

Highlights and issues 1 Cash for flip-chip bonding

We have the funding for the thinning work with LETI but will need further funding for the flip-chip process at Advacam

Richard has contacted Heinz regarding this and awaiting feedback. Didier and Peppe have declined to contribute at this time as they have already submitted their proposals for the next 2 years

We will need this further funding by the end of phase 1 (week 9 from Gant on previous slide) to test the LETI micro-bumps

Receipt of purchase CERN feedback on receipt of purchase prior to the end of March was not possible with a DAI.

An invoice can be created using EDH and needs to be confirmed if this will suffice. Richard has confirmed with STFC that their will be no issues with a receipt of purchase prior to

the end-of-March deadline

Top Metal layer gds information is required for the alignment scheme. Richard is trying to source this information but its painfully slow and holding up progress. Deliverable 1 has been missed due to this. LETI are still confident on meeting deliverable 2 provided we get this information ASAP. Alignment key configuration taken from FEI4 and ‘instanced’ into FEI4B. 120nm offset in y-axis,

this is a little above 1% of the smallest CD of the alignment marks and should be well within alignment tolerance. Gds sent to LETI and awaiting information if it’s ok and final layout configuration.

Micro-bumps are designed and wafer mapping completed

Highlights and Issues 2 Meeting required to discuss sensor availability

for the flip-chip processAmount of sensors for flip-chipping – good statistical

analysis required for micro-bump yield. LETI input required

We will need to resolve funding for the flip-chip process prior so we know how many we can process for the whole project

FEI4b Assembly testingFEI4b probe card requiredTest equipment/apparatus requiredSemi-auto testing solution required for assemblies

Alignment key proposal

- Rectangle entourant le motif alignement grossier

- Alignement fin Croix / carré

Photos wafers

LETI wafer thinning project flowPhase 2

To be published in next report