SAND2000-1680 Unlimited Release Printed August 2000 Dewarless.Logging Tool – 1stGeneration Joseph Henfling and Randy Normann Geothermal Research Department Sandia National Laboratories P.O. BOX 5800 Albuquerque, NM 87185-1033 RE?6WI!:W) (m 04ZOil 0s1} Abstract This report focuses on Sandia National Laboratories’ effort to create high-temperatnre logging tools for geothermal applications without the need for heat shielding. One of the mechanisms for fiiilure in conventional downhole tools is temperature. They can only survive a limited number of hours in high temperature environments. For the first time since the “evolution of integrated circuits, components are now commercially available that are qualified to 225° C with many continuing to work up to 300° C. These components are primarily based on Silicon-On-Insulator (SOI) technology. Sandia has developed and tested a simple data logger based on this technology that operates up to 300° C with a few limiting components operating to only 250° C without thermal protection. An actual well log to 240° C without shielding is discussed. The first prototype high-temperatnre tool measures pressure and temperature using a wire-line for power and communication. The tool is based around theHT83C51 microcontroller. A brief discussion of Instrumentation program project plans are given. This work was sponsored Technologies. the background and status of the High Temperature at SamliZ objectives, data logger developmen~ and future by the U.S. Department of Energy, Office of Geothermal
Transcript
SAND2000-1680Unlimited Release
Printed August 2000
Dewarless.Logging Tool – 1stGeneration
Joseph Henfling and Randy NormannGeothermal Research Department
Sandia National LaboratoriesP.O. BOX 5800
Albuquerque, NM 87185-1033 RE?6WI!:W)(m 04ZOil
0s1}
Abstract
This report focuses on Sandia National Laboratories’ effort to create high-temperatnrelogging tools for geothermal applications without the need for heat shielding.
One of the mechanisms for fiiilure in conventional downhole tools is temperature. Theycan only survive a limited number of hours in high temperature environments. For thefirst time since the “evolution of integrated circuits, components are now commerciallyavailable that are qualified to 225° C with many continuing to work up to 300° C. Thesecomponents are primarily based on Silicon-On-Insulator (SOI) technology. Sandia hasdeveloped and tested a simple data logger based on this technology that operates up to300° C with a few limiting components operating to only 250° C without thermal
protection. An actual well log to 240° C without shielding is discussed. The firstprototype high-temperatnre tool measures pressure and temperature using a wire-line forpower and communication. The tool is based around theHT83C51 microcontroller.
A brief discussion ofInstrumentation programproject plans are given.
This work was sponsoredTechnologies.
the background and status of the High Temperatureat SamliZ objectives, data logger developmen~ and future
by the U.S. Department of Energy, Office of Geothermal
DISCLAIMERt
This repofi was prepared as an account of work sponsoredbyanagency of the United States Government. Neitherthe United States Government nor any agency thereof, norany of their employees, make any warranty, express or
“implied, or assumes any legal liability or responsibility forthe accuracy, completeness, or usefulness of anyinformation, apparatus, product, or process disclosed, orrepresents that its use would not infringe privately ownedrights. Reference herein to any specific commercialproduct, process, or service by trade name, trademark,manufacturer, or otherwise does not necessarily constituteor imply its endorsement, recommendation, or favoring bythe United States Government or any agency thereof. Theviews and opinions of authors expressed herein do notnecessarily state or reflect those of the United StatesGovernment or any agency thereof.
DISCLAIMER
Portions of this document may be illegiblein electronic image products. Images areproduced from the best availabIe originaldocument.
Unshielded logging tools that operate indefinitely at temperatures up to 300° C arebecoming possible. The benefits of unshielded logging tools are reduced cox increasedreliability, reduced diameters, and increased operating time inside of the well.
The Dewar is the single highest cost item in most geothermal logging tools. In 1996, thecost of a seven-foot Dewar was approximately $10,000.00. Eliminating the Dewarreduces costs while increasing reliabfity. Conventional logging tools are designed withlow-temperature components. These devices are not rated for temperatures above 125° Cand have limited operating time within the wellbore. Tools not returned to the surface intime are destroyed and must be replaced. Increased downhole operating time also allowsthe well operator to place sensors downhole for continuous measurement while alteringproduction strategies. This can lead to a better understanding of the geothermal reservoirdynamics.
This project was initiated in FY97. At that time, a very limited number of SOI deviceswere available for testing. They included an operational amplifier, a digital switch the(HT83c51) microcontroller, and accompanying 32-kbyte of memory. In order to test themicrocontroller with memo~, a number of non-SOI devices had to be identified and oventested. This was accomplished using parts from Sandia’s 200° C technology list. Thisinitial effort required solving a number of testing-related technical challenges. Forexample, conventional electronic board materials and lead attachment methods cannot beutilized above 250° C. For development purposes, machinable ceramic substrates wereutilized with laser spot-welded intercomects.
In FY98 sufficient devices existed to design and test a simple memory-based temperaturetool. This tool consisted of newly available SOI devices and qualified non-SOIcomponents. One of the shortcomings that still existed was the lack of a suitable crystaloscillator for the processor. The initial tests were petiormed with a clock signal for themicrocontroller external to the oven. A microcontroller-based circuit operating at 300° Cwhile measuring the external room temperature was demonstratedTemperature Electronics Cofierence (Hi’I’EC), sponsorti in part byForce.
Also in FY98, a high-temperature electronics workshop was held.well attended by companies including Honeywe~ HalliiurtoL
at the 1998 High-Sandia and the Air
The workshop wasEndevco, Maurer
Engineering and KD Components. The consensus of the workshop was that 225° CMeasurement-While-Drilling (MWD) tools were possible. Problem areas were identifiedand incorporated into Sandia’s 1999 Annual Operating Plan (AOP).
In this fiscal year, many more components were available for testing. They included aclock oscillator, 5-volt re~ator, 10-volt regulator, field-effect transistors @’ET), 5-voltreference, and a strain-gage based pressure transducer. The testing revealed that allcomponents fimctioned well to 250° C but many tiered above this temperature. Utilizing
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these components, a complete pressure/temperature downhole tool that was capable ofsustained operation at 250° C was designed and field-tested in a 240° C, 12,000 foot deepgeothermal well for more than 56 hours and pressures up to 5000 psi. Keeping themaximum operating temperature for the tool below 250° C allowed the use of moreconventional board material and interconnects. This tool was also demonstrated in an ovenoperating at 240° C at the Society of Petroleum Engineers (SPE) conference.
During this fiscal year, Sandia also formed an industry advisory panel to evaluate andguide the direction of the high-temperature electronics technology. The newly formedpanel is called HiTED, High-Temperature Electronics Downhole. HiTED membershippresently consists of five members from industry and two university professors.
This ongoing unshielded logging tool project is evolving with the developing high-temperature industry.
2OBJECTIVES
The objective of the high-temperature instrumentation program is twofold. The objectivesare: 1) identi& and assist the high-temperature-component industry in creating electronicsfor geothermal applications and 2) assist geothermal companies in the development ofNIW%igh-temperature instruments. These new high-temperature instruments will operateat a lower cost and higher reliability without the aid of a heat-shielding Dewar.
These objectives are possible with Silicon-On-Insulator (SOI) technolo~. Thistechnology was developed in part at Sandia National Labs for radiation hardenedelectronics used in weapon applications. SOI is now being commercially produced byHoneywell’s Solid State Electronics Center (SSEC) and Allied Signal for operation at225° C. Many of these devices continue to operate well dove 225° C, several weretested to temperatures as high as 315° C, with reduced peflormance and shortenedoperational life. Tools built utihzing this technology have the capability to stay in hightemperature wells for extended time without temperature-related tool ftiures. Thiscapability has a high potential for greatly altering geothermal ddli.ng and logging.
2.1 Technical Objectives
The technicaI objectives are listed below:
. Test and evaluate SOI devices, as they become available.
. Test and evaluate high-temperature sensors, as they become available.
. Design a pressure/temperature Dewarless downhole tool.
● Develop uphole and downhole software for the P/’Ttool.
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. Field-test a Dewarless P/T tool.
. Form an industry advisory panel to evaluate and guide the direction of the high-temperature electronics technology program.
2.2 Expected Outcomes
The expectedoutcomesaresummmizedbelow
. Cost-saving reliable high temperature tools. Although the geothermal industry viewshigh-temperature instrumentation as critic~ it is ditlicult to show direct cost savings.Specialized tools can provide substantial cost savings during drilling. An example ofsuch a tool is the core-tube data logger (CTDL). This tool enables the driller to obtainvaluable information about bottom hole temperatures, pressures and hole inclinationwithout loss of rig time. The data is virtually free idormation that will help @de thedrilling process. Utilizing this Mormation may lead to better decisions concerning thewell being drilled aud the need for additional wells. It has been estimated that this typeof tool could eliminate the need of one well in ten- The Sandia developed CTDL hasbeen in high-demand and is an extremely reliable tool. Converting the CTDL to aDewarless tool utilizing high temperature electronics is within reach-
. Stimulate the growth of the high-temperature industry by publishing test data on newhigh-temperature components, new high-temperature logging tool circuits, and newhigh-temperature packaging.
. Demonstrate that a usefi,d Dewarless downhole tool can be designed for sustainedoperation at 240° C.
3 APPROACH
The Sandia approach is simple “Adapt and expand high-temperature electronicstechnology to downhole applications”. The aircraft industry has been providing thedriving force for the commercial production of SOI circuits. The aircraft industry needshigh-temperature electronic engine controllers. The components needed for electronicengine controllers are nearly identical to the components needed for a simple logging tool.
Geothermal applications will require features and components not necessary for aircraft.For example, special batteries and narrow tubular packaging must be developed forunshielded geothermal logging tools. Once new high-temperature designs aredemonstrated for geothermal wellbore applications, the geothermal industry will gainnever-before-realized instrumentation capabilities that will lead to new approaches in welllogging and reservoir characterization.
Sandia has tested a number of components to 300° C and built a completepressure/temperature logging tool that was oven tested to 250° C and successfullywellbore tested to 240° C. As the high-temperature electronic industry matures, so willperformance at higher temperatures toward the target temperature for geothermalapplications of 300° C.
4 Data Logger Development
Data Logger Development can be sub-divided into 4 categories. They are 1)Components Tested, 2) First Generation Dewarless Data Logger, 3) High TemperatureSensors, and 4) Power sources.
4.1 Components Tested
Several newly available components were evaluated up to 300° C. They included the SOI‘ 5-volt regulator, SOI 10-volt regsdator, SOI 5-vok reference, SOI PET, clock oscillator,
and a strain-gage pressure transducer. Also, a more detailed analysis was performed onthe SOI operational amplifier.
The volti&e regulators continued to fiction at 300° C. Their petiormance tieredsignificantly above 275° C but it was quite usable to this temperature. This is shown inFigure 1 and Figure 2. The voltage reference’s maximum operating temperature is 250° C.Above this temperature the output rolls off sharply. The results are shown in Figure 3.The PET was tested with satisfactory results to 300° C.
‘&e crystal oscillator results are inconclusive due to the limited number of oscillators thatwere available for testing. To date, Sandia has evaluated four batches of crystalsmanufactured for operation to 300° C with mixed results. The first two batches fded dueto lead attachments separating internal to the oscillator. The list two batches haveworked up to 250° C for several days. Exposures of 300° C appear to significantly limitthe life of the oscillator. Also, the oscillators are load sensitive. A minimum load of 200ohm and 50pf must by maintained to ensure the oscillator will continue to osciUate at theelevated temperatures. The oscillator also exhibits a-sharpfrequency shift of greater than10 % between 30 and 150° C (depending on the oscillator tested). The oscillatormanufacture is aware of the shortcomings and will continue to improve their oscillatordesign based on the feedback Sandia provides to them. They feel the frequency shift couldbe lowered below the anticipated operating range of the oscillator in fbture devices andmay be able to achieve an oscillator with a temperature stability of* 400 PPM or betterover the temperature range of ambient to 300° C. The crystal test resuks are shown inFigure 4 and Figure 5.
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The strain-gage pressure transducer worked well up to 300° C. The offset voltage variesconsiderably over the temperature range. This is an undesirable attribute and will increasethe complications of calibrating the unit, but is quite adequate to demonstrate thepressure/temperature tool concept.
The SOI operational amplifier was fhrther evaluated to determine the bandwidth at variousgains and to determine the offset voltage error at temperatures up to 300° C. It wasdetermined the bandwidth is suitable for most geothermal applications. The offset voltagewas quite large and will need to be kept in mind when designing circuits with thisoperational amplifier. Second generation devices will improve analog petiormance. Theoperation ampliiler test results are shown in Figure 6 and Figure 7.
4.2 First Generation Dewarless Data Loggers
Two memory-based data loggers were designed and built. The first design was a datalogger capable of storing and transmitting temperature information. The second designwas a data logger capable of storing and transmitting three temperature channels and apressure channel.
The iirst data logger design used a machinable ceramic substrate as the board material andmechanical lead attachment with laser spot-welded connections to ensure reliablepeflormance. This design incorporated a field-programmable-gate-array (FPGA) with SOIcomponents. The FPGA limited the maximum continuous operating temperature to 200°C with short excursions to 225° C. A photo of this board is shown in Figure 8.
The goal is to ultimately design a geothermal logging tool that will operate continuously at300° C which will require the use of non-conventional board assembles such as theceramic board concept. The FPGA circuit design utilized in the ceramic board data logger,has paved the way for working with Honeywell in FYOO to develop a qualified 300 CApplication Specific Integrated Circuit (ASIC). This needed component will have similarfimctionality to the FPGA and would replace the rnil-spec devices that are currentlyrequired. The developed ASIC will enable a data logger to be designed using onlyqualified high-temperature components.
The ceramic board data logger was tested in a geothemxd well in August 1999. Itperiiormed satisfactorily up to 200° C, but experienced intermittent d.if%ulties above thistemperature. Post-test evaluation revealed the specific crystal oscillator Sandia used forthis test required more of a load than previously tested oscillators to reliably sustainoscillation above 200° C. The temperature data correlated with the previous temperaturewell profile and the ceramic board assembly performed well in the downhole field test.
The second data logger design used more mpventional board material and high-temperature solder for the connections. A photo of this board is shown in Figure 9. Thisdesign incorporated tested mil-spec and SOI components, which would allow continuedoperation up to 250° C. A block diagram of this design is shown in Figure 10. Utilizing
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more conventional board assembly techniques eased the integration of additional datachannels and allowed Sandia to demonstrate a prototype pressure/temperature tool. Thistool successiidly logged a 240° C, 12000 foot geothermal well. It successfully operatedwithin the well for more than 56 hours at temperatures greater than 225° C (up to 240° C)and pressures up to 5000 psi. This type of long-term tool exposure to extremeenvironments is not possible with conventional logging tools. The prototype tool was alsocompared to a conventional Dewared Tool. While the prototype high-temperature PTTool was designed more for fi.mctionality than absolute accuracy, it did provide afavorable well profile. As indicated in Figure 11, the temperature data correlates with theDewared tool. As expected from oven tests, the pressure data contained false pressuregradients. Several factors influenced the results including the limited component choicesfor the pressure transducer interface circuit and temperature gradients that existedbetween the pressure transducer and the temperature compensation circuit. The nextgeneration tool will include a high-temperature analog-to-digital converter that justrecently became available. This device will enable the accuracy of the temperature andpressure measurements to increase significantly.
ARer approximately 56 hours of exposure, the wireline cablehead experienced a smallle~ shorting the cablehead conductors and leaking into the tool. The tool was evaluatedafter the test and it was determined two components had failed due to the leak. After theirreplacement, the tool was again fiuwtional. The development of HT SOI electronics will
~ push the evolution of improved downhole hardware for long-term deployment.
The test results were conveyed to the high-temperature industry through the High-Temperature Electronics Downhole (Hi’IED) panel.
4.3 High-Temperature Sensors
High-temperature sensors can be categorized in three sections: readily available, soon tobe available, may never be available.
4.3.1 Readily Available: Many geothermal sensors are already available for high-temperature applications. These sensors have always been in direct contact withthe wellbore environment in conventional logging tools. Examples of directcontact sensors are the temperature and spinner sensors. Recently, additional newpressure sensors and accelerometers have become available for new high-temperature applications.
4.3.2 Soon to be Available: We are aware of several companies currently working onhigh-accuracy, high-temperature pressure and inclination sensors. There isreasonable evidence that magnetometers and collar counters can be produced toperform at 300° C. Magnetometers and collar counters are examples of sensors .that could be developed by taking the older low temperature design andsubstituting high-temperature materials to enable high temperature operation.
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4.3.3 May Never be Available Sensors such as Sodium Iodide ~aI(TI)] using photonmultipliers are used for gamma spectroscopy. This sensor wi.U require atechnology breakthrough in order to operate above 200° C.
4.4 Power Sources
A downhole tool has two sources for power: wire-lines or batteries. Both are concerns at300° C. High-temperature wire-lines are expensive and have a limited Me. Commerciallyavailablebatteries have limited operation to only 200° C.
Sandia developed thermal batteries are considered the best option. Thermal batteries usemolten salt technology. At room temperature, thermal batteries are inactive. Only whenthe battery salts have been melted will the battery become active. Most thermal batteriesbecome active at temperatures above 300° C.
Our battery development effort is aimed at closing the gap between the startingtemperature of thermal batteries and the upper limitation of conventional batteries. Workis ongoing to develop a thermal battery with useiid power production below 50° C andupper temperature limitation near 300° C. Such batteries give the tool designer the optionof using them in memory took, which can be deployed on slick-line cable or conventionalwire-line.
5 Future Plans
Sandia’s objectives in FYOO will be to evaluate and report on commercial activities toproduce new high-temperature components and to develop Dewarless tool designsdeployable within the geothermal wellbore and transfer this technology to the geothermalindustry. Sandia will also support DOE’s Small Business Innovated Research program tohelp small businesses develop new devices such as high-value capacitors, voltagereferences, pressure and inclination sensors and new high-temperature logging tools suchas a pressure/temperature tool.
The FYOOobjectives include working with Honeywell to develop an Application SpeticIntegrated C~cuit (ASIC) that will be packaged and programmed for geothermalapplications. This component is needed to overcome the shortcomings and lack ofavailability of mil-spec components Sandia is presently using. Whh the addition of thisASIC, a tool can be designed using only qualified high-temperature components. This willresult in a reliable tool capable of sustained temperatures of 250° C with many of thecomponents including the ASIC qualifkd to 300° C. The ASIC also will greatly enhancethe capabilities of the developed tool by providing several new f~tures such as precisioncounters, FM data transmission and increased memo~ capacity beyond 64k bytes. It willalso provide firmware that will serve as a basic data logger. Sandia has consulted various
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geothermal tool companies for specific needs that could be incorporated into the design ofthe ASIC. The resulting ASIC will be essentially an enhanced 8051 based controller,which can be used as the basic building block for a variety of high-temperatureapplications. These enhancements would not be possible without the development of ahigh-temperature ASIC and are needed to design a practical downhole tool. Thedeveloped ASIC will be made available to the high temperature instrumentation industry.
Support for converting existing tool designs to high temperature is also being considered.h&ny tools lend themselves for such a conversion. Examples include 1)pressure/temperature too~ 2) fluidkteam sampling too~ 3) core-tube data logger, and 4)casing inspection tool. Geothermal companies have requested assistance for this type ofsupport. For example, Welaco has requested assistance in modifjhg their casinginspection tool to increase the operating temperature to 300° C. This converted toolcould be used to log more than 1000 aging geothermal wells within the US. Theinilormation gleaned from this type of tool may be critical in developing strategies forincreasing the life of these wells.
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1.
‘ 2.
3.
4.
REFERENCES
McCluskey,P.F., Grzybows&R and PodlesalqT: “High Temperature Electronics”,CRC Press, ISBN O-8493-9623-9
Swenso~ Gregg and Ohme, Bruce. (1996). ‘l+TMOSw: ~ordable H@ITemperature Product Line’:, Third International High Temperature ElectronicsCotierence (HiTEC), Vol 2, pp 89-94.
Norrnaq Randy A and Guidot@ Ronald A (1996). “A Study of the Uuse of High-Temperature Electronics and Batteries to Avoid the Use of Dewars for GeothermalLogging”, Geothermal Resources Coun~ Vol 20, pp 509-513.
FranCo,RJ. and Sleefe, G.E. (1994), “CMOS Devices and Design Methodology for200”C C~cuits”, Sec International High Temperature Electronics, June 5-10, 1994.
----
10 Volt Regulator Oven Test
(Honeywell I-ITPLREG-’I O)
10+
so 9.5@u) 100 ma. Loadm= 93
8.5
0 50 100 150 200 250 300 350
Temperature (C)
Figure 1. The high temperature pefiormance of the Honeywell 10-volt regulatoris shown in this graph.
5 Volt Regulator Oven Test(Honeywell HTPLREG-05)
5
+
s 4.750 100 ma. Load% 4.59 L
z 4.25
4 , ,
0 50 100 150 200 250 300 350
Temperature (C)
Figure 2. The high temperature performance of the Honeywell 5-volt regulatoris shown in this graph.
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5 Volt Reference Oven Test
(Honeywell HTVREF-05)
6
5
24
&3~02
>1
00 50 100 150 200 250 300 350
Temperature (C)
Figure 3. The high temperature performance of the Honeywell 5-volt reference isshown in this graph.
Crystal Oscillator Oven Test
(High-Temp Research Lab)
= 8.2- &~ 8-
+ v7
50 7.8
$ 7.6a)g 7.4 ●
: 7.2 I I , I ,
0 50 100 150 200 250 300 350
Temperature (C)
Figure 4. This graph depicts an example of the frequency shift the tested oscillatorsexhibited. The manufacture has indicted the frequency shift could be lowered belowthe anticipated operating range in fbture devices.
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Crystal Oscillator Oven Ted
(High-Temp Research Lab)
7.4I?g 7.39 --
~ 7.38 -0 }g 7.37 !‘
A A A +:v v T
@; 7.36 --
L 7.35-1- ,
150 200 250 300
Temperature (C)
Figure 5. This graph indicates the stability of the tested oscillators after thefrequency shift. The manufacture has indicted an achievable temperature stability ofbetter than * 400 PPM from ambient to 300° C.
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Figure 6. The frequency response of the Honeywell HT1 104 operation amplifier at315° C is shown in this graph. The results are encouraging and are quite adequate fora wide variety of applications.
HTII04 Frequency Response at 3_15Celsius
50
40 ?~+ UnityGain-!-Gain = 10; 3dB= 170 ki+z
30
~20+ a+Gain = 100 ; 3dB= 25 kliz
; lo-.-; 0’ ‘
-lo
-20
-30 , I ! T
0.01 0.1 1 10 100 1000 10000
Frequency (kHz)
HTI 104 Offset Voltage Tests Results
~ -300~ -250- - +- Unity Gain
A
-m-Gain= 10
& -200 --$ + Gain= 100~ -150
; -1oo
$ -500 Ao I 1 T T T
o 50 100 150 200 250 300 350
Te~erature (C)
Figure 7. The offset voltages exhibited by the Honeywell HT1 104 operationamplifier over the expected operating temperature range are indicated in this graph.(The graph is not corrected for gain and gain error.) The next generation operationamdifiers will have enhanced analog performance.
, 1 1
Figure 8. This photograph depicts the Prototype Data Logger utilizing a ceramicsubstrate as the board material.
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Figure 9. The prototype polyimide Pressure/Temperature Data Logger board isshown in this picture. This board was used to successfully log a 240° C, 12000 footgeothermal well. It successfiliy operated within the well for more than 56 hours.
Temperature MultiplexerPressure Sensor
Sensor Ch-cuits ‘ Circuits
(IIT 11040p hp)(I-IT 1204)
I(HTl 104 Op AIIlp)
I
“Glue Logic” HT83C51
El
Transmit.. . . . . . . . . . . .
54ACXX’ MicroprocessorCircuit
(HTANFET)
w
10 volt
crystalRegulator
32 Kb SRAM High-Temp.Oscillator Batteries
5 volt*&fiLSpec components, lot fesfed fo
-300c (No longer m production)Regulator
Figure 10. Block diagram of the prototype pressure/temperature data logger.
250
200
150
100
50
0
—— -— 6000
5000
4000 s%
3000 $
—High Temperature 2000 j1000
—Dewared TPS Toolo
0 3000 6000 9000 12000
Depth (Feet)
Figure 11. Temperature/Pressure plot comparing a conventional Dewared loggingtool with the prototype Dewarless logging tool.
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Appendix A
The schematic for the Dewarless data logger utilizing the polyimide as the board materialfollows.
1l%E=-
E
1~ {111111-1E? I l-+
!----’:, I 1
#11-11-rs3
Ill 11111111 : [
Appendix B
The following page is the parts list for the Dewarless Data Logger utilizing polyimide asthe board material.
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BillOfMaterials Sept.22,1999 17:25:03 PagelItem QuantityReference Part
