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Topic7-Strengthening Mechanisms

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    Dislocations and their dynamics

    How are strength and dislocation motion related?

    How do we increase strength?

    How can heating change strength and other properties?

    TOPIC 7:DISLOCATIONS AND

    STRENGTHENING

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    EDGE DISLOCATION

    Extra half plane of atoms

    Edge dislocation line: Directed into the page

    Atoms above dislocation line are in compression, and

    those below are in tension

    Symbol

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    SCREW DISLOCATION

    Symbol

    AB is screwdislocation line

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    Incrementally breaking bonds

    If dislocations don't move, deformation doesn't happen!

    (But fracture will, like in a ceramic)

    DISLOCATION MOTION

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    Metals: Disl. motion easier.

    -non-directional bonding

    -close-packed directions

    for slip. electron cloud ion cores

    Covalent Ceramics(Si, diamond): Motion hard.

    -directional (angular) bonding

    Ionic Ceramics (NaCl):

    Motion hard.-need to avoid ++ and --

    neighbors.

    DISLOCATIONS & MATERIALS

    CLASSES

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    DISLOCATION DENSITY

    Dislocation density: total dislocation length per unitvolume of material

    or, the number of dislocations that intersect a unitarea of a random section

    The dislocation density typically determines thestrength of a material

    Metals (carefully solidified): 103 mm-2

    Metals (heavily deformed): 109-1010 mm-2

    Metals (heat treated): 105-106 mm-2 Ceramics: 102-104 mm-2

    Single crystal silicon for ICs: 0.1-1 mm-2

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    LOCAL STRAIN FIELDS

    Edge dislocation: compression (above dislocation

    line) & tension (below dislocation line)

    Screw dislocation: shear

    Stress & strain fields decrease with radial

    distance from dislocation line

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    DISLOCATION INTERACTION

    Strain field from one dislocation can affect aneighboring dislocation

    Two like dislocations can repel each other

    Unlike dislocations attract and annihilate each other

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    SLIP SYSTEMS

    Dislocations do not move with the same degree ofease on all crystallographic planes and directions

    There are preferred planes (slip planes) and

    preferred directions (slip directions)

    Slip planes are planes with high planar density ofatoms, and slip directions are lines with high lineardensity

    Slip system: the combination of slip plane and slipdirection

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    SLIP SYSTEM: EXAMPLES

    FCC (Al, Cu, Ni, Ag, Au) Close packed planes: {111}, e.g., ADF

    Close packed directions: , e.g., AD, DF, AF

    Slip system: {111} (12 independent slip systems)

    BCC (Fe, W, Mo): {110} (12 independent slipsystems)

    HCP (Zn, Cd, Mg, Ti, Be): 3 independent slip systems

    FCC & BCC metals: ductile, HCP metals: brittle

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    SLIP IN SINGLE CRYSTALS Single crystals easy to treat; can generalize to polycrystals later

    Regardless of what type of external stress is applied to amaterial, plastic deformation or dislocation motion occurs due toa shear stress

    Some component of the applied stress has to be a shear stresson a slip plane and along a slip direction

    This component is called the resolved shear stress

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    coscos

    cos/

    cos

    A

    F

    R

    ns

    A

    As

    RESOLVED SHEAR STRESS

    slip plane

    normal, ns

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    Condition for dislocation motion: R CRSS Crystal orientation can make it easy or hard to move disl.

    R cos cos

    CRITICAL RESOLVED SHEAR

    STRESS (CRSS)

    Maximum possible R = /2; thus y = 2CRSS

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    BCC EXAMPLE

    Slip system: {110}

    = 45 degrees = tan-1(a2/a) = 54.7 degrees

    From which or can be calculated if one ofthem is specified

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    Slip planes & directions (, )

    change from one crystal toanother.

    Rwill vary from one crystal toanother.

    The crystal with the largest Ryields first.

    Other (less favorably

    oriented) crystals yield later.

    Polycrystalline materialsgenerally stronger than single

    crystals, due to geometric

    constraints & the requirement of

    larger stresses for yielding

    Adapted from Fig.

    7.10, Callister 6e.

    (Fig. 7.10 is

    courtesy of C.

    Brady, NationalBureau of

    Standards [now the

    National Institute of

    Standards and

    Technology,

    Gaithersburg, MD].)

    300 mm

    DISL. MOTION IN POLYCRYSTALS

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    STRENGTHENING MECHANISMS

    Macroscopic plastic deformation corresponds to themotion of large numbers of dislocations The ability of a metal to plastically deform depends on the

    ability of dislocations to move

    Virtually all strengthening techniques rely onrestricting or hindering dislocation motion

    We will look at 4 such mechanisms Reduce grain size

    Solid-solution strengthening

    Precipitation strengthening

    Strain hardening (or cold working)

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    Grain boundaries arebarriers to slip.

    - dislocation has to change

    directions

    - grain boundary regiondisordered, so discontinuity inslip planes

    Barrier "strength

    increases with

    misorientation.

    Smaller grain size: morebarriers to slip.

    Hall-Petch Equation:

    grain

    bounda

    ry

    slip plane

    grain AgrainB

    yield o kyd1/ 2

    Adapted from Fig. 7.12, Callister 6e.

    (Fig. 7.12 is fromA Textbook of Materials

    Technology, by Van Vlack, Pearson Education,

    Inc., Upper Saddle River, NJ.)

    STRENGTHENING STRATEGY 1:

    REDUCE GRAIN SIZE

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    70wt%Cu-30wt%Zn brass alloy

    yield

    o

    kyd1/ 2

    Adapted from Fig. 7.13,

    Callister 6e.

    (Fig. 7.13 is adapted from

    H. Suzuki, "The Relation

    Between the Structure

    and Mechanical Properties

    of Metals", Vol. II, National

    Physical Laboratory

    Symposium No. 15, 1963,

    p. 524.)

    GRAIN SIZE STRENGTHENING:

    AN EXAMPLE

    Grain size controlled by heat treatment (e.g., cooling rateduring solidification, annealing)

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    Can be induced by rolling a polycrystalline metal

    -before rolling -after rolling

    235 mm

    -isotropicsince grains areapprox. spherical

    & randomly

    oriented.

    -anisotropicsince rolling affects grainorientation and shape.

    rolling direction

    Adapted from Fig. 7.11,

    Callister 6e. (Fig. 7.11 is from

    W.G. Moffatt, G.W. Pearsall,

    and J. Wulff, The Structure

    and Properties of Materials,

    Vol. I, Structure, p. 140, John

    Wiley and Sons, New York,1964.)

    ANISOTROPY IN yield

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    Impurity atoms distort the lattice & generate stress.

    Stress can produce a barrier to dislocation motion.

    Smaller substitutional

    impurity

    Larger substitutional

    impurity

    Impurity generates local shear atA

    and B that opposes disl motion to the

    right.

    Impurity generates local shear at C

    and D that opposes disl motion to the

    right.

    STRENGTHENING STRATEGY 2:SOLID SOLUTION STRENGTHENING

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    SOLID SOLUTION STRENGTHENING

    Impurity atoms attracted to dislocations so as to

    reduce the overall strain energy, i.e., to partiallycancel the strain in the lattice surrounding thedislocation

    If a dislocation wants to move, it has to tear itselffrom the impurity atoms which will cost energy

    Smaller impurity atom

    above dislocation line

    Larger impurity atom

    below dislocation line

    EXAMPLE SOLID SOLUTION

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    EXAMPLE: SOLID SOLUTION

    STRENGTHENING IN COPPER

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    Hard precipitates are difficult to shear.Ex: Ceramics in metals (SiC in Iron or Aluminum).

    Result: y ~1

    S

    STRENGTHENING STRATEGY 3:PRECIPITATION STRENGTHENING

    SIMULATION

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    View onto slip plane of Nimonic PE16 Precipitate volume fraction: 10%

    Simulation courtesy of Volker

    Mohles, Institut fr Materialphysik

    der Universitt, Mnster, Germany

    (http://www.uni-munster.de/physik

    /MP/mohles/). Used with

    permission.

    SIMULATION:

    PRECIPITATION STRENGTHENING

    APPLICATION

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    Internal wing structure on Boeing 767

    Aluminum is strengthened with precipitates formed

    by alloying.

    Adapted from Fig.

    11.24, Callister 6e.

    (Fig. 11.24 is courtesyof G.H. Narayanan

    and A.G. Miller,

    Boeing Commercial

    Airplane Company.)

    Adapted from Fig.

    11.0, Callister 5e.

    (Fig. 11.0 is courtesy

    of G.H. Narayanan

    and A.G. Miller,

    Boeing Commercial

    Airplane Company.)

    1.5mm

    APPLICATION:

    PRECIPITATION STRENGTHENING

    STRENGTHENING STRATEGY 4

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    Room temperature deformation. Common forming operations change the cross sectional

    area:

    %CW Ao Ad

    Ao

    x100

    Ao Ad

    force

    dieblank

    force

    -Forging -Rolling

    -Extrusion-Drawing

    Adapted from Fig.

    11.7, Callister 6e.

    tensile

    forceAo

    Addie

    die

    STRENGTHENING STRATEGY 4:

    COLD WORK (%CW)

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    Ti alloy after cold working:

    Dislocations entangle

    with one anotherduring cold work.

    Dislocation motion

    becomes more difficult.

    Adapted from Fig.

    4.6, Callister 6e.(Fig. 4.6 is courtesy

    of M.R. Plichta,

    Michigan

    Technological

    University.)

    DISLOCATIONS DURING COLD WORK

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    Dislocation density (rd) goes up:

    Carefully prepared sample: rd ~ 103 mm/mm3Heavily deformed sample: rd ~ 1010 mm/mm3

    Ways of measuring dislocation density:

    OR

    dN

    A

    Area , A

    N dislocation

    pits (revealed

    by etching)

    dislocation

    pit

    r

    Yield stress increasesas rd increases:

    Micrograph

    adapted from Fig.

    7.0, Callister 6e.

    (Fig. 7.0 is

    courtesy of W.G.

    Johnson, General

    Electric Co.)

    40mm

    RESULT OF COLD WORK

    SIMULATION DISLOCATION

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    Tensile loading (horizontal dir.) of a FCC metal with

    notches in the top and bottom surface.

    Over 1 billion atoms modeled in 3D block.

    Note the large increase in disl. density.

    SIMULATION: DISLOCATION

    MOTION/GENERATION

    Simulation courtesy

    of Farid Abraham. Used withpermission from International

    Business Machines Corporation.

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    Dislocations generate stress.

    This traps other dislocations.

    DISLOCATION-DISLOCATION TRAPPING

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    Yield strength increases.

    Tensile strength (TS) increases. Ductility (%EL or %AR) decreases (dramatically).

    Adapted from Fig. 7.18,

    Callister 6e. (Fig. 7.18 is

    from Metals Handbook:

    Properties and Selection:

    Iron and Steels, Vol. 1, 9th

    ed., B. Bardes (Ed.),

    American Society for Metals,

    1978, p. 221.)

    IMPACT OF COLD WORK

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    What is the tensile strength &

    ductility after cold working?

    Adapted from Fig. 7.17, Callister 6e. (Fig. 7.17 is adapted from Metals Handbook: Properties and Selection:

    Iron and Steels, Vol. 1, 9th ed., B. Bardes (Ed.), American Society for Metals, 1978, p. 226; and Metals

    Handbook: Properties and Selection: Nonferrous Alloys and Pure Metals, Vol. 2, 9th ed., H. Baker

    (Managing Ed.), American Society for Metals, 1979, p. 276 and 327.)

    %CW ro2 rd2

    ro2x100 35.6%

    COLD WORK ANALYSIS

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    Results for

    polycrystalline iron:

    y and TS decrease with increasing test temperature. %EL increases with increasing test temperature.

    Why?

    Adapted from Fig. 6.14,

    Callister 6e.

    -e BEHAVIOR VS TEMPERTURE

    Vacancies helpdislocations past

    obstacles.

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    1 hour treatment at Tanneal...

    decreases TS and increases %EL. Effects of cold work are reversed!

    3 Annealingstages to

    discuss...

    Adapted from Fig. 7.20, Callister 6e. (Fig.

    7.20 is adapted from G. Sachs and K.R. van

    Horn, Practical Metallurgy, Applied Metallurgy,

    and the Industrial Processing of Ferrous and

    Nonferrous Metals and Alloys, American

    Society for Metals, 1940, p. 139.)

    EFFECT OF HEATING AFTER %CW

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    Annihilation reduces dislocation density.

    Scenario 1

    Scenario 2

    RECOVERY

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    New crystals are formed that:

    --have a small disl. density--are small

    --consume cold-worked crystals.

    33% cold

    worked

    brass

    New crystals

    nucleate after

    3 sec. at 580C.

    Adapted from

    Fig. 7.19 (a),(b),

    Callister 6e.

    (Fig. 7.19 (a),(b)

    are courtesy of

    J.E. Burke,

    General Electric

    Company.)

    0.6 mm 0.6 mm

    RECRYSTALLIZATION

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    All cold-worked crystals are consumed.

    After 4

    seconds

    After 8

    seconds

    Adapted fromFig. 7.19 (c),(d),

    Callister 6e.

    (Fig. 7.19 (c),(d)

    are courtesy of

    J.E. Burke,

    General Electric

    Company.)

    0.6 mm0.6 mm

    FURTHER RECRYSTALLIZATION

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    At longer times, larger grains consume smaller ones. Why? Grain boundary area (and therefore energy) is reduced.

    Empirical Relation:

    After 8 s,

    580C

    After 15 min,

    580C

    dn don

    Ktelapsed time

    coefficient dependent

    on material and T.

    grain diam.

    at time t.

    exponent typ. ~ 2

    0.6 mm 0.6 mm

    Adapted from

    Fig. 7.19 (d),(e),

    Callister 6e.

    (Fig. 7.19 (d),(e)are courtesy of

    J.E. Burke,

    General Electric

    Company.)

    GRAIN GROWTH

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    Dislocations motion correlates to plastic deformation.

    Strength is increased by making dislocation motion difficult.

    Particular ways to increase strength are to:--decrease grain size

    --solid solution strengthening

    --precipitate strengthening

    --cold work

    Heating (annealing) can reduce dislocation densityand increase grain size.

    SUMMARY


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