May 4, 2011
The Convergence of fabless Companies to Application Driven Design
David Dahan Primesense COO
May 4, 2011
May 4, 2011
Presentation Topics
• User Experience / Application driven product
• Solution layers and sales cycle
• Industry supply chain and trends
• Delivering a complete solution and implications
• Success story
• Summary
May 4, 2011
User Experience Driven Product
What I can do with that ?
Application System HW+SW
Silicon Requirement
• End user cares about
• Experience and Value … Nevertheless mostly the doesn’t know that he needs it at all…. – "I think there is a world market for about five computers" — Remark
attributed to Thomas J. Watson (IBM Chairman)
• Product Cost / Performance (retail price) price needs to be factored in at the same time and drive the cost targets
May 4, 2011
Consumer Product Launch Cycle
2011 2012
X-mass Holiday Season
Sale
Oct. Dec
RTM
ProductionTO
FAB
C
ycle
Validation and Qual
EVT/DVT/PVT
Dec. Apr
RTL Freeze
2010
DesignStart
Sample
Note: At the consumer market ~60%—70% of the yearly sales happen at Q4
May 4, 2011
Electronics Equipment Industry Supply Chain
ODM: Original Device ManufacturerEMS: Electronics Manufacturing ServicesOEM: Original Equipment Manufacturer
Retail Distribution Marketing Manufacturing & Procurement
Semiconductor Design System Design
Sale Channel
May 4, 2011
• Traditionally OEM/ODM derived requirement to Fablessand chip makers, nowadays OEM looking for complete and holistic solution and brand the product
Industry Trend
• Performance
• Retail Price
• Time to Revenues
• Pass for Cost down
• Involve at the Application level
• Control the BOM and COGS cost
• Copy Ready reference Design (SW/HW)
• Si consolidate and merges SoC
OEM Fabless
May 4, 2011
Fabless and OEM/ODM Relation
OEM
ODM Reference Design
ATESupport
Silicon
Product Fabless
Retail Chain
May 4, 2011
• Reference Design (RD) is a product (HW+SW) in a production
level form and quality– Fully QA SW that support the relevant OS
• Application eco system
– Qualified Reference Design
• Pass Reliability, Environmental and Certification
• Full BOM (Production files)
• The COGS meet the target price (Retail = 3X BOM)
• AVL Suppliers that meet cost and capacity needs
– Production line set up (at final destination)
What is a Complete Solution ?
May 4, 2011
Development Consideration
Chip Requirement
Cost, Process Technology, IP, Si Speed, Memory Size, IF, Package , Test and Qual
SW
BOM and COGS
NPI process
Qualified design (EV/DV/PV)
DFx
Components and AVL
Tool (Optics / Mechanical etc)
Stable Production line
Yield and SPC (>90% FPY)
ManufacturingSystem/Engineering
Electronic Design
Mechanical Design
Thermo
Optics Design
Audio / Video Design
RF Design
Select vendor and Tech.
Simple production flow
… Control the cost
SW Architecture
Configurable
Structural Development
Release Methodology
QA, RN, Bug Fix, patch etc
…. Room for customization
May 4, 2011
Fabless Manpower Distribution
To support this industry trends Fabless shall invest more and more in System, SW and Manufacturing
• Reference: Primesense
May 4, 2011
MediaTek as an Example • Taiwanese fabless chip vendor that secured design wins in handsets
by enabling the handset OEM to roll out a product rapidly
MediaTek 3G Reference Phone
May 4, 2011
PrimeSensor Reference Design Develop by PrimeSense and ODM partner
PS1080 SoC + FW Develop and sale by PrimeSense
Application
System (RD)
Chip + FW
Middleware OSPrimeSense is piloting the consortium of
OpenNI developers
Content is created by Primesense Partners and Developer
Primesense Solution Layers
May 4, 2011
Key Take Away
• Product is driven by Experience/ Application Vs. Cost
• OEM focus on the product branding and retail chain
• The “D” at the ODM isn't so strong
• Fabless needs to feel the gap and to do “more then Moore”
• This drive Fabless to be more system company and incorporate competence at System / SW and manufacturing domain but still revenue to flow in from Chip sale !