Track Trigger Meeting 3/23/10

• Chip Schedule:– 2D wafers complete fab~ April 30 – available for single –tier

functional testing– 3D wafers complete fab ~ May 28– Diced parts and full wafers June – Sent to Ziptronix for oxide

bonding of a handle wafer, then back to Tezzaron for exposure of bottom TSVs.

– Sensor wafers available early July• Topography and flatness checked at Ziptronix• Backside protection• Test of topside tungsten deposition and CMP

• Phone conference next week with Ziptronix to discuss plans• Volunteers for chip testing work?

Short Strip TierLong Strip Tier

VICTR Chip

Can be used to estimate areas needed on final chip

Pad Structure

Kapton-based Interposer

• A preliminary project description has been written and sent to one vendor

• The goals include:– Develop a low-mass layup which is

sufficiently planar (<100 microns bow) to allow bump bonding on both sides over the full area.

– Minimum mass, either using low mass materials or by removing unneeded material.

– Contains embedded capacitance.– Provides a flex circuit “tail” for connection

to optical drivers about 5 cm away. – Provides through vias to measure load

capacitance and crosstalk.

Approach Endicott, Compunetics Cyrexx

Interposer Strategy

1. Development of a full-size technology demonstration board which would be used for mounting dummy chips and developing bump-bonding techniques. This board would provide a platform to demonstrate a low-mass interposer with the appropriate interconnectivity.– We probably need to develop a full candidate layout

of either a full or VICTR 2 interposer including bussing for vendors

– Guess at pinout and numbers of bus lines 2. Production of a direct interconnection interposer for

the VIP-1 chip. 3. Production of a direct interconnection interposer for

the VIP-2 chip.4. Final product – full sized fully functional

Proposed On-chip Logic Diagram

Proposal for VICTR II

2nd Submission Plan

Dec 2010 ?

Meetings• Upgrade Week (April 26-30) Presentations

– Simulation– Mass Budget– Module Design– Interposer?– Trigger Architecture– Mechanics and cooling

• US CMS (May 6-8)• Workshop in Elba (May 24-28) – detailed discussions of

CMS upgrade plans in light of revised machine plans.• Address issues and objections:

– Detector mass– Yield and chip size– Functionality

• Increase breadth of the collaboration