Prof. Dr.-Ing. Jörg FrankeChairman of theResearch AssociationMolded Interconnect Devices
Transition of Molded Interconnect to Mechatronic Integrated Devices
Molded Interconnect Devices
Franke J., Härter S.
Prof. Dr.-Ing. J. Franke | Molded Interconnect Devices – 9th International Congress
The presentation focuses on the transition of molded interconnectt h t i i t t d d ito mechatronic integrated devices.
1. Research association Molded Interconnect Devicesconnects various competencies
2 Successful realization of new MID-applications2. Successful realization of new MID-applications
3. Future challenges of MID-technology
Prof. Dr.-Ing. J. Franke | Molded Interconnect Devices – 9th International Congress 9/17/2010 2
The objective of the research association is to support and d l MID t h l
Internal
develop MID-technology.
External InternalExternal
Exhibitions/Congress Exhibitions and
international
Working groups
Each project isHybridica, international congress for public relations of MID Technology
Each project is supported by an industry committee
Munich9.-12.11.2010
Publications
Publications as an opportunity to
Workshops
Workshops to discuss future h ll i MID
Website
present recent developments
challenges in MID
Research projects
The website provides a platform for information and discussion
p j Benefits of recent
results by govern-mental funded research
Prof. Dr.-Ing. J. Franke | Molded Interconnect Devices – 9th International Congress 39/17/2010
discussion
Research activities involve the ti d t lif lentire product life cycle.
Design and Quality andAssembly &ProductionSubstrate
Test criteria for Chip mounting High-
Design and Engineering
Quality and Reliability
Assembly & Connection
Production Process
Substrate Materials
Simulation Housing by 3D MID
Standardization of tests
Failure
p gtechnologies
Embedded components
Optimization of
gtemperature thermoplastics
Biocompatible and colored/
models
Heat dissipation concepts
Recycling
g yovermolding
Rapid prototyping
Definition of Failure mechanisms for 3D MID
Optimization of interconnection technologies
transparent materials
Recycling Definition of design-rules
Layout and routing
Thermally conductive
Printing technologies
Workpiececarrier for
Life time predictions forrouting conductive
plasticstechnologies carrier for
standard SMT process chain
predictions for 3D MID
Source:
Prof. Dr.-Ing. J. Franke | Molded Interconnect Devices – 9th International Congress 49/17/2010
Source:Neotech Source: HSG-IMAT
Development of MID-technology leads to a secure footholdith hi h t ti l f f thwith high potential for further success.
In 5 yearsToday10 years ago
Few series applications Optimization of processes
In 5 yearsToday10 years ago
ppfor MID-technology
p pand materials strengthen fields of application and establish new possibilities
e
Sources: HARTING, Kromberg&Schubert/BASF, Continental
Laser technology not available and niche technology respectively
Improved manufacturing equipment and additional processes, e.g. printing
LDS
Mar
ket v
olum
e
Projects and the research
gy p y
Missing interdisciplinary
p , g p gtechnologies
New customers profit by
M
quantity
jassociation 3-D MID e.V. connect the MID-community
g p ycooperation as a barrier for developing MID-products
p yMID-development and expand the market
Source:
Prof. Dr.-Ing. J. Franke | Molded Interconnect Devices – 9th International Congress 59/17/2010
FC on MIDHT-MIDSource: HSG-IMAT
Number of patents and their content represent innovation inMID d t h l i tMID and technology improvement.
Number of MID-related patents*
422008Efficiency by
cost reduction and 422008cost reduction and increase in producivity
342007Process reliability
and process accuracy help to improve product quality
MID T h l t i i t i ti 232006MID-Technology supports miniaturization and functional integration
Prof. Dr.-Ing. J. Franke | Molded Interconnect Devices – 9th International Congress 69/17/2010
*Data 2009/2010 not yet full published and available
Wide range of MID in various sectors shows thel fi ld f li ti f thi t h llarge field of application for this technology.
Industrial Automation Automotive Industry Medical Industrycamera module steering wheel control switches tool for dentistry
ctor
Source:
Sec
Antenna Structures Magnetic Field Sensor Security Housing
Source:HARTING
Source:TRW Automotive
Safety Systems GmbHSource:
KaVo. Dental
catio
n
g y g
App
lic
Prof. Dr.-Ing. J. Franke | Molded Interconnect Devices – 9th International Congress 79/17/2010
Source:HARTING
Source:HARTING
Source:LPKF
Transition from molded interconnect to mechatronic integrated devicesi ti l t i l t ll d t i tis essential to implement all product requirements.
Technology Application
Design M h i l
Plastics Metals Ceramics
gyPush
ppPull
evic
es
Designfreedom
Dev
ices
Mechanical
Electric/El t i
MID
conn
ect
De
Reduction ofparts nt
egra
ted
DElectronics
Thermal
ame
ded
Inte
rc parts
hatr
onic
In
OpticalLead
fras
Mol
Environmentalfriendliness
Mec
Fluidic
FR 4
Foils
Prof. Dr.-Ing. J. Franke | Molded Interconnect Devices – 9th International Congress 89/17/2010
F
Conclusion and f th h llfurther challenges.
MID-Technology made a breakthrough…
Numerous series applications are manufactured in high volumes
Various industry sectors have been reached, even safety-related y yfeatures in automotive industry
Further breakthrough is not self-directing…
Intensely research activities have to be forced especially in the fields ofIntensely research activities have to be forced, especially in the fields of
Materials (e.g. HT-thermoplastics)
Efficient production processes for MID
Adapted assembly and interconnection technology (3D-mounting)
Integrated process and product development
Standards and norms of MID
Prof. Dr.-Ing. J. Franke | Molded Interconnect Devices – 9th International Congress 99/17/2010
Great success, inspiring conversations and new impulses by participating in the conference!
Nordostpark 91 Tel : +49 911 5805817
Prof. Dr.-Ing. J. Franke | Molded Interconnect Devices – 9th International Congress
Nordostpark 91 Tel.: +49.911.5805817D-90411 Nürnberg Fax: +49.911.5805830
www.faps.uni-erlangen.de
