trf1123

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F E A T U R E S

RFO RFI

Power Amp /Attenuator

PreAmp

PowerSupplyVDD PACNT

PAGAIN1PAGAIN0

VPOS VNEG

DETN

DETP

LP

DriverAmplifier

D E S C R I P T I O N

K E Y S P E C I F I C A T I O N S

B L O C K D I A G R A M

T R F 1 1 2 3

S L W S 1 6 7 B A P R I L 2 0 0 5 R E V I S E D S E P T E M B E R 2 0 0 6

2 . 1 - G H z t o 2 . 7 - G H z 1 - W P o w e r A m p l i f i e r

1 . 5 W P - 1 d B m L i n e a r , 3 0 - d B G a i n T r a n s m i t t e r

O p e r a t e s O v e r t h e M M D S , M D S , a n d W C S B a n d s ( 2 . 1 G H z t o 2 . 7 G H z )

T w o T T L C o n t r o l l e d , 1 - b i t , 1 6 - d B G a i n S t e p s

S u p e r i o r L i n e a r i t y O v e r t h e E n t i r e G a i n R a n g e

P A C N T S i g n a l E n a b l e s a n d D i s a b l e s P A

I n t e r n a l l y M a t c h e d 5 0 - I n p u t a n d O u t p u t

T h e T R F 1 1 2 3 i s a h i g h l y i n t e g r a t e d l i n e a r t r a n s m i t t e r p o w e r a m p l i f i e r M M I C . T h e c h i p h a s t w o 1 6 - d B g a i n s t e p s t h a t p r o v i d e a t o t a l o f 3 2 - d B g a i n c o n t r o l v i a 1 - b i t T T L c o n t r o l s i g n a l s . T h e c h i p a l s o i n t e g r a t e s a T T L m u t e f u n c t i o n t h a t t u r n s o f f t h e a m p l i f i e r s f o r p o w e r c r i t i c a l o r T D D a p p l i c a t i o n s . A t e m p e r a t u r e c o m p e n s a t e d d e t e c t o r i s i n c l u d e d f o r o u t p u t p o w e r m o n i t o r o r A L C a p p l i c a t i o n s . T h e c h i p h a s a t y p i c a l P 1 d B o f 3 1 . 5 d B m a n d a t h i r d o r d e r i n t e r c e p t o f 5 2 d B m .

T h e T R F 1 1 2 3 i s d e s i g n e d t o f u n c t i o n a s a p a r t o f T e x a s I n s t r u m e n t s c o m p l e t e 2 . 5 - G H z c h i p s e t . T h e T R F 1 1 2 3 i s u s e d a s t h e o u t p u t p o w e r a m p l i f i e r o r a d r i v e r a m p l i f i e r f o r h i g h e r p o w e r a p p l i c a t i o n s . T h e l i n e a r n a t u r e o f t h e t r a n s m i t t e r m a k e s i t i d e a l f o r c o m p l e x m o d u l a t i o n s s c h e m e s s u c h a s h i g h o r d e r Q A M o r O F D M .

O P 1 d B = 3 1 . 5 d B m , T y p i c a l

O u t p u t I P 3 = 5 2 d B m , T y p i c a l

G a i n = 3 0 d B , T y p i c a l

G a i n F l a t n e s s O v e r T r a n s m i t B a n d 2 . 5 d B

F r e q u e n c y R a n g e : 2 . 1 G H z t o 2 . 7 G H z

0 . 5 - d B D e t e c t e d O u t p u t v o l t a g e v s T e m p e r a t u r e

T h e d e t a i l e d b l o c k d i a g r a m a n d t h e p i n - o u t o f t h e A S I C a r e s h o w n i n F i g u r e 1 .

P l e a s e b e a w a r e t h a t a n i m p o r t a n t n o t i c e c o n c e r n i n g a v a i l a b i l i t y , s t a n d a r d w a r r a n t y , a n d u s e i n c r i t i c a l a p p l i c a t i o n s o f T e x a s I n s t r u m e n t s s e m i c o n d u c t o r p r o d u c t s a n d d i s c l a i m e r s t h e r e t o a p p e a r s a t t h e e n d o f t h i s d a t a s h e e t .

P R O D U C T I O N D A T A i n f o r m a t i o n i s c u r r e n t a s o f p u b l i c a t i o n d a t e . C o p y r i g h t 2 0 0 5 2 0 0 6 , T e x a s I n s t r u m e n t s I n c o r p o r a t e d P r o d u c t s c o n f o r m t o s p e c i f i c a t i o n s p e r t h e t e r m s o f t h e T e x a s I n s t r u m e n t s s t a n d a r d w a r r a n t y . P r o d u c t i o n p r o c e s s i n g d o e s n o t

n e c e s s a r i l y i n c l u d e t e s t i n g o f a l l p a r a m e t e r s .
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RFO

Driver Amp

RFI

Power Amp /

AttenuatorPreAmp

Power

Supply

PACNT

PAGAIN1

PAGAIN0

VPOS

VNEG

DETN

DETP

LP

Switched Attn Switched Attn

VDD1

VADJ1

VADJ2

VADJ3

VDD3A

VDD3B

VDD2

E L E C T R O S T A T I C D I S C H A R G E N O T E

P I N O U T T A B L E

T R F 1 1 2 3


K E Y S P E C I F I C A T I O N S ( c o n t i n u e d )

F i g u r e 1 . D e t a i l e d B l o c k D i a g r a m o f T R F 1 1 2 3

T h e T R F 1 2 2 3 c o n t a i n C l a s s 1 d e v i c e s . T h e f o l l o w i n g E l e c t r o s t a t i c D i s c h a r g e ( E S D ) p r e c a u t i o n s a r e r e c o m m e n d e d :

P r o t e c t i v e o u t e r g a r m e n t s

H a n d l i n g i n E S D s a f e g u a r d e d w o r k a r e a

T r a n s p o r t i n g i n E S D s h i e l d e d c o n t a i n e r s

F r e q u e n t m o n i t o r i n g a n d t e s t i n g a l l E S D p r o t e c t i o n e q u i p m e n t

T r e a t i n g t h e T R F 1 2 2 3 a s e x t r e m e l y s e n s i t i v e t o E S D

T a b l e 1 . P i n o u t o f T R F 1 1 2 3

P I N # P I N N A M E I / O T Y P E D E S C R I P T I O N

1 G N D - - G r o u n d

2 G N D - - G r o u n d

3 G N D - - G r o u n d

4 R F I I A n a l o g R F i n p u t t o p o w e r a m p l i f i e r , d c b l o c k e d i n t e r n a l l y .

5 G N D - - G r o u n d

6 V G 1 I / O A n a l o g N o c o n n e c t i o n r e q u i r e d f o r n o r m a l o p e r a t i o n . M a y b e u s e d t o a d j u s t F E T 1 b i a s . D O N O T G R O U N D T H I S P I N .

7 G N D - - G r o u n d

2 S u b m i t D o c u m e n t a t i o n F e e d b a c k
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T R F 1 1 2 3


K E Y S P E C I F I C A T I O N S ( c o n t i n u e d )

T a b l e 1 . P i n o u t o f T R F 1 1 2 3 ( c o n t i n u e d )

P I N # P I N N A M E I / O T Y P E D E S C R I P T I O N

8 V N E G I P o w e r N e g a t i v e p o w e r s u p p l y 5 V . U s e d t o s e t g a t e v o l t a g e . T h i s v o l t a g e m u s t b e s e q u e n c e d w i t h V D D . S e e ( 1 ).

9 V P O S I P o w e r P o s i t i v e p o w e r s u p p l y . B i a s i s + V . U s e d t o s e t g a t e b i a s a n d l o g i c i n p u t l e v e l . 1 0 P A G A I N 0 I D i g i t a l F i r s t 1 6 - d B a t t e n u a t o r g a i n c o n t r o l . L o g i c h i g h i s h i g h g a i n ; l o g i c l o w i s l o w g a i n .

1 1 V G 2 I / O A n a l o g N o c o n n e c t i o n r e q u i r e d f o r n o r m a l o p e r a t i o n . M a y b e u s e d t o a d j u s t F E T 2 b i a s . D O N O T G R O U N D T H I S P I N .

1 2 P A G A I N 1 I D i g i t a l S e c o n d 1 6 - d B g a i n c o n t r o l . L o g i c h i g h i s h i g h g a i n , L o g i c l o w i s l o w g a i n .

1 3 V G 3 I / O N o c o n n e c t i o n r e q u i r e d f o r n o r m a l o p e r a t i o n . M a y b e u s e d t o a d j u s t F E T 3 b i a s . D O N O T G R O U N D T H I S P I N .

1 4 L P I D i g i t a l L o w P o w e r M o d e : A c t i v e h i g h . L o w p o w e r m o d e i s l o w e r D C a n d P o u t m o d e .

1 5 P A C N T I D i g i t a l P o w e r a m p l i f i e r e n a b l e , h i g h i s P A o n , l o g i c l o w i s P A o f f ( l o w c u r r e n t )

1 6 G N D - - G r o u n d

1 7 V D D 3 B I P o w e r S t a g e 3 d c d r a i n s u p p l y p o w e r . T h i s p i n i s i n t e r n a l l y d c c o n n e c t e d t o p i n 2 4 ( V D D 3 A ) . B i a s m u s t b e p r o v i d e d t o b o t h p i n s f o r o p t i m a l p e r f o r m a n c e . T h e t o t a l d c c u r r e n t t h r o u g h t h e s e t w o p i n s i s t y p i c a l l y 7 0 % o f I D D .

1 8 G N D - - G r o u n d 1 9 G N D - - G r o u n d

2 0 G N D - - G r o u n d

2 1 R F O O A n a l o g R F o u t p u t d c b l o c k i s p r o v i d e d

2 2 G N D - - G r o u n d

2 3 G N D - - G r o u n d

2 4 V D D 3 A I P o w e r S t a g e 3 d c d r a i n s u p p l y p o w e r . T h i s p i n i s i n t e r n a l l y d c c o n n e c t e d t o p i n 1 7 ( V D D 3 B ) . B i a s m u s t b e p r o v i d e d t o b o t h p i n s f o r o p t i m a l p e r f o r m a n c e . T h e t o t a l d c c u r r e n t t h r o u g h t h e s e t w o p i n s i s t y p i c a l l y 7 0 % o f I D D .

2 5 G N D - - G r o u n d

2 6 D E T P O A n a l o g D e t e c t o r o u t p u t , p o s i t i v e . V o l t a g e w i l l b e 0 . 5 V w i t h / w i t h o u t R F o u t p u t

2 7 D E T N O A n a l o g D e t e c t o r o u t p u t , n e g a t i v e . V o l t a g e i s 0 . 5 V w i t h n o R F a n d d e c r e a s e s w i t h i n c r e a s i n g R F o u t p u t p o w e r .

2 8 V D D 2 I P o w e r S t a g e 2 d c d r a i n s u p p l y p o w e r . T h e d c c u r r e n t t h r o u g h t h i s p i n i s t y p i c a l l y 2 5 % o f I D D .

2 9 G N D - - G r o u n d

3 0 G N D - G r o u n d

3 1 V D D 1 - S t a g e 1 d c d r a i n s u p p l y p o w e r . T h e d c c u r r e n t t h r o u g h t h i s p i n i s t y p i c a l l y 5 % o f I D D .

3 2 G N D - - G r o u n d

B a c k - - B a c k o f p a c k a g e h a s m e t a l b a s e t h a t m u s t b e g r o u n d e d f o r t h e r m a l a n d R F p e r f o r m a n c e .

( 1 ) P r o p e r S e q u e n c i n g : I n o r d e r t o a v o i d p e r m a n e n t d a m a g e t o t h e p o w e r a m p l i f i e r , t h e s u p p l y v o l t a g e s m u s t b e s e q u e n c e d . T h e p r o p e r p o w e r u p s e q u e n c e i s V N E G , t h e n V P O S , a n d t h e n V D D . T h e p r o p e r p o w e r d o w n s e q u e n c e i s r e m o v e V D D , t h e n V P O S , a n d t h e n V N E G .

3S u b m i t D o c u m e n t a t i o n F e e d b a c k

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A B S O L U T E M A X I M U M R A T I N G S

D C C H A R A C T E R I S T I C S

P O W E R A M P L I F I E R C H A R A C T E R I S T I C S

T R F 1 1 2 3


P A R A M E T E R T E S T C O N D I T I O N M I N M A X U N I T

V D D 0 + 8

V P O S D C s u p p l y v o l t a g e 0 5 . 5 V

V N E G - 5 . 5 0

ID D C u r r e n t c o n s u m p t i o n 7 0 0 M a P I N R F i n p u t p o w e r 2 0 d B m

T J J u n c t i o n t e m p e r a t u r e 1 7 5 C

P D P o w e r d i s s i p a t i o n 5 . 5 W

D i g i t a l i n p u t p i n s - 0 . 3 5 . 5

j c T h e r m a l r e s i s t a n c e j u n c t i o n t o 2 0 C / W c a s e ( 1 )

T s t g S t o r a g e t e m p e r a t u r e - 4 0 + 1 0 5 C

T o p O p e r a t i n g t e m p e r a t u r e M a x i m u m c a s e t e m p e r a t u r e d e r a t e f o r - 4 0 + 8 5 C P C B t h e r m a l r e s i s t a n c e

L e a d t e m p e r a t u r e 4 0 s e c m a x i m u m 2 2 0 C

( 1 ) T h e r m a l r e s i s t a n c e i s j u n c t i o n t o c a s e a s s u m i n g t h e r m a l p a d w i t h 2 5 t h e r m a l v i a s u n d e r p a c k a g e m e t a l b a s e . S e e r e c o m m e n d e d l a y o u t F i g u r e 1 1 a n d a p p l i c a t i o n n o t e R A 1 0 0 5 f o r m o r e d e t a i l .

P A R A M E T E R C O N D I T I O N S M I N T Y P M A X U N I T

V D D V D D s u p p l y v o l t a g e 7 7 . 3 5 V

ID D V D D s u p p l y c u r r e n t P A C N T R L = H i g h , V D D = 7 V , 2 5 C 6 0 0 7 0 0 m A

V N E G N e g a t i v e s u p p l y v o l t a g e - 5 . 2 5 - 5 - 4 . 7 5 V

IN E G N e g a t i v e s u p p l y c u r r e n t 1 5 2 5 m A

V P O S P o s i t i v e s u p p l y d i g i t a l v o l t a g e 4 . 7 5 5 5 . 2 5 V

IP O S P o s i t i v e s u p p l y d i g i t a l c u r r e n t 2 5 5 0 m A

V I H I n p u t h i g h v o l t a g e 2 . 5 5 V

V I L I n p u t l o w v o l t a g e 0 . 8 V

II H I n p u t h i g h c u r r e n t 3 0 0 A II L I n p u t l o w c u r r e n t - 5 0 A

VD D = 7 V , I D D = 6 0 0 m A , V P O S = 5 V , V N E G = - 5 V , P A G A I N 0 = 1 , P A G A I N 1 = 1 , P A C N T = 1 , T = 2 5 C , u n l e s s o t h e r w i s e

s t a t e d

P A R A M E T E R T E S T C O N D I T I O N S M I N T Y P M A X U N I T

F F r e q u e n c y 2 1 0 0 2 7 0 0 M H z

G G a i n 2 6 3 0 3 6

G H G G a i n f l a t n e s s f u l l b a n d F = 2 1 0 0 M H z t o 2 7 0 0 M H z 3 5 d B

G N B G a i n f l a t n e s s / 2 M H z 0 . 2

O P - 1 d B O u t p u t p o w e r a t 1 - d B c o m p r e s s i o n 3 0 3 1 . 5 d B m

O I P 3 O u t p u t t h i r d o r d e r i n t e r c e p t p o i n t 4 0 5 2

G a i n s t e p s i z e 1 s t s t e p P A G A I N 0 = L o w , P A G A I N 1 = H i g h 1 5 1 6 1 7 d B

G a i n s t e p s i z e 2 n d s t e p P A G A I N 0 = L o w , P A G A I N 1 = L o w 3 0 3 2 3 4

V d e t D e t e c t o r v o l t a g e o u t p u t , d i f f e r e n t i a l A t P o u t = 2 7 0 . 7 5 d B m , F = 2 1 0 0 1 5 0 m V ( D E T P - D E T N ) t o 2 7 0 0 M H z a t 2 5 C

D e t e c t o r a c c u r a c y v s t e m p e r a t u r e F = 2 5 0 0 M H z , - 3 0 C t o 7 5 C 0 . 7 5 d B

t S T E P G a i n s t e p r e s p o n s e t i m e 1 5 S


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T Y P I C A L P E R F O R M A N C E

0

5

10

15

20

25

30

35

2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3

VDD= 5 V,

VDD= 7 V

TA= 5C

f Frequency GHz

GaindB

12

16

20

24

28

32

36

2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3

7 V, 32 dB Step

5 V, 32 dB Step

7 V, 16 dB Step

5 V, 16 dB Step

f Frequency GHz

GainStepdB

TA= 5C

T R F 1 1 2 3


P O W E R A M P L I F I E R C H A R A C T E R I S T I C S ( c o n t i n u e d )

V D D = 7 V , I D D = 6 0 0 m A , V P O S = 5 V , V N E G = - 5 V , P A G A I N 0 = 1 , P A G A I N 1 = 1 , P A C N T = 1 , T = 2 5 C , u n l e s s o t h e r w i s e s t a t e d

P A R A M E T E R T E S T C O N D I T I O N S M I N T Y P M A X U N I T

P O N / O F F O n t o o f f p o w e r r a t i o M a x G a i n t o g a i n w i t h P A C N T = 3 5 L o w

N F H G N o i s e f i g u r e , m a x g a i n P A G A I N 0 = H i g h , P A G A I N 1 = H i g h 6 7

N F L G N o i s e f i g u r e m i n g a i n P A G A I N = L o w , P A G A I N 1 = L o w 2 0 d B

S 1 2 R e v e r s e i s o l a t i o n 3 0

S 1 1 I n p u t r e t u r n l o s s Z = 5 0 - 1 0 - 1 2

S 2 2 O u t p u t r e t u r n l o s s Z = 5 0 - 8

F i g u r e 2 . G a i n v s F r e q u e n c y F i g u r e 3 . G a i n C o n t r o l


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20

25

30

35

40

45

50

55

60

2.150 2.250 2.350 2.450 2.550 2.650 2.686

IP3, VDD= 7 V

IP3, VDD= 5 V

P-1dB, VDD= 7 V

P-1dB, VDD= 5 V

f Frequency GHz

OutputP-1dBandIP3dBm

60

50

40

30

2000 2200 2400 2600 2800

Notched

Depth

dBc

22 dBm

21 dBm

20 dBm

19 dBm

f Frequency MHz

PA Notched Test,VDD= 5 V,1000 Carriers @ 2 kHz Spacing

60

50

40

30

2000 2200 2400 2600 2800

22 dBm

21 dBm

20 dBm

19 dBm


Notched

Depth

dBc

f Frequency MHz

60

50

40

30

2000 2200 2400 2600 2800

22 dBm

19 dBm


Notched

Depth

dBc

f Frequency MHz

20 dBm

21 dBm

T R F 1 1 2 3


T Y P I C A L P E R F O R M A N C E ( c o n t i n u e d )

F i g u r e 4 . O u t p u t P - 1 d B a n d I P 3 F i g u r e 5 . P A N o t c h e d T e s t ( V D D = 5 V )

F i g u r e 6 . P A N o t c h e d T e s t ( V D D = 6 V ) F i g u r e 7 . P A N o t c h e d T e s t ( V D D = 7 V )


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T R F 1 1 2 3


T Y P I C A L P E R F O R M A N C E ( c o n t i n u e d )

F i g u r e 8 . P u l s e D r o o p - R F O u t p u t W i t h P A C N T P u l s e d a n d 2 0 % D u t y C y c l e


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A P P L I C A T I O N I N F O R M A T I O N

0.1 F

1

2

5

4

3

6

7

8

9 10 131211 14 15 16

17

18

19

20

GND

GND

GND

RFI

GND

VPOS

PAGAIN0

VG3

RF_OUT

BASE

VDD

21

22

24

2526272829303132

VG1

GND

VNEG

VG2

PAGAIN1

RES

PACNT

GND

VDD3B

GND

GND

GND

RFO

GND

GND

VDD3A

GND

DETP

DETN

VDD2

GND

GND

VDD1

GND

VNEG

RFI

VPOS

PACNT

PAGAIN1

PAGAIN0

Vdet

23

10 F* 1 F 100 pF

0.1 F

100 pF

100 pF

0.1 F

0.1 F

100 pF

0.1 F1 F 0.1 F 100 pF

1 F 0.1 F 100 pF

*10 mF May Need to be 100 mF For High

Speed Pulse Applications

Place 100 pF Capacitors Close to Package

Pins and Minimize Parstic Inductance

T R F 1 1 2 3


F i g u r e 9 . P a c k a g e D r a w i n g

A t y p i c a l a p p l i c a t i o n s c h e m a t i c i s s h o w n i n F i g u r e 1 0 a n d a m e c h a n i c a l d r a w i n g o f t h e p a c k a g e o u t l i n e ( L P C C Q u a d 5 m m x 5 m m , 3 2 - p i n ) i s s h o w n i n F i g u r e 9 .

T h e r e c o m m e n d e d P C B l a y o u t m a s k i s s h o w n i n F i g u r e 1 1 , a l o n g w i t h r e c o m m e n d a t i o n s o n t h e b o a r d m a t e r i a l T a b l e 2 a n d c o n s t r u c t i o n F i g u r e 1 2 .

F i g u r e 1 0 . R e c o m m e n d e d T R F 1 1 2 3 A p p l i c a t i o n S c h e m a t i c

T a b l e 2 . P C B R e c o m m e n d a t i o n s

B o a r d M a t e r i a l F R 4

B o a r d M a t e r i a l C o r e T h i c k n e s s 1 0 m i l

C o p p e r T h i c k n e s s ( s t a r t i n g ) 1 o z


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9/16

www.ti.com

3.80

0.25 TYP

0.50 TYP

SOLDER MASK: NO SOLDERMASK UNDER CHIP, ON LEAD PADS

OR ON GROUND CONNECTIONS.

25 VIA HOLES, EACH 0.38 mm.

DIMENSIONS in mm

DIA 0.38

TYP

0.60 TYP

3.80

3.50

3.50

0.20 TYP

0.75 TYP

0.75 TYP

PIN 1

T R F 1 1 2 3


T a b l e 2 . P C B R e c o m m e n d a t i o n s ( c o n t i n u e d )

P r e p r e g T h i c k n e s s 8 m i l

R e c o m m e n d e d N u m b e r o f L a y e r s 4

V i a P l a t i n g T h i c k n e s s 0 . 5 o z

F i n a l P l a t e W h i t e i m m e r s i o n t i n

F i n a l B o a r d T h i c k n e s s 3 3 - 3 7 m i l

F i g u r e 1 1 . R e c o m m e n d e d P a d L a y o u t


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www.ti.com

8 MilPrepreg

Dia 15 Mil

10 Mil Core FR4

10 Mil Core FR4

1 oz Copper

1 oz Copper

DuPont CB 100 Conductive Via Plug

1/2 oz Copper Plated

1 oz Copper + 1/2 oz Copper PlatedUpper and Lower Surfaces

35 Mil

T R F 1 1 2 3


F i g u r e 1 2 . P C B V i a C r o s s S e c t i o n

1 0 S u b m i t D o c u m e n t a t i o n F e e d b a c k

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PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (C) Top-Side Markings

(4)

Sampl

TRF1123IRTMR ACTIVE VQFN RTM 32 3000 Green (RoHS

& no Sb/Br)

CU SN Level-3-260C-168 HR -40 to 85 TRF

1123

TRF1123IRTMRG3 ACTIVE VQFN RTM 32 3000 Green (RoHS

& no Sb/Br)


1123

TRF1123IRTMT ACTIVE VQFN RTM 32 250 Green (RoHS

& no Sb/Br)


1123TRF1123IRTMTG3 ACTIVE VQFN RTM 32 250 Green (RoHS

& no Sb/Br)


1123(1)

The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND:Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production. Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)

(3)MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is acontinuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
http://www.ti.com/productcontenthttp://www.ti.com/product/TRF1123?CMP=conv-poasamples#samplebuyhttp://www.ti.com/product/TRF1123?CMP=conv-poasamples#samplebuyhttp://www.ti.com/product/TRF1123?CMP=conv-poasamples#samplebuyhttp://www.ti.com/product/TRF1123?CMP=conv-poasamples#samplebuy

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PACKAGE OPTION ADDENDUM


Addendum-Page 2

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TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0(mm)

B0(mm)

K0(mm)

P1(mm)

W(mm)

Pin1Quadrant

TRF1123IRTMR VQFN RTM 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2

TRF1123IRTMT VQFN RTM 32 250 180.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2

PACKAGE MATERIALS INFORMATION


Pack Materials-Page 1

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*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TRF1123IRTMR VQFN RTM 32 3000 338.1 338.1 20.6

TRF1123IRTMT VQFN RTM 32 250 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION


Pack Materials-Page 2

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IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of salesupplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.

TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provideadequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have notbeen so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

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Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

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Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defenseMicrocontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright 2013, Texas Instruments Incorporated
http://www.ti.com/audiohttp://www.ti.com/automotivehttp://amplifier.ti.com/http://www.ti.com/communicationshttp://dataconverter.ti.com/http://www.ti.com/computershttp://www.dlp.com/http://www.ti.com/consumer-appshttp://dsp.ti.com/http://www.ti.com/energyhttp://www.ti.com/clockshttp://www.ti.com/industrialhttp://interface.ti.com/http://www.ti.com/medicalhttp://logic.ti.com/http://www.ti.com/securityhttp://power.ti.com/http://www.ti.com/space-avionics-defensehttp://microcontroller.ti.com/http://www.ti.com/videohttp://www.ti-rfid.com/http://www.ti.com/omaphttp://e2e.ti.com/http://www.ti.com/wirelessconnectivityhttp://www.ti.com/wirelessconnectivityhttp://e2e.ti.com/http://www.ti.com/omaphttp://www.ti-rfid.com/http://www.ti.com/videohttp://microcontroller.ti.com/http://www.ti.com/space-avionics-defensehttp://power.ti.com/http://www.ti.com/securityhttp://logic.ti.com/http://www.ti.com/medicalhttp://interface.ti.com/http://www.ti.com/industrialhttp://www.ti.com/clockshttp://www.ti.com/energyhttp://dsp.ti.com/http://www.ti.com/consumer-appshttp://www.dlp.com/http://www.ti.com/computershttp://dataconverter.ti.com/http://www.ti.com/communicationshttp://amplifier.ti.com/http://www.ti.com/automotivehttp://www.ti.com/audio

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