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TRILLION SCIENCE INC.
Breakthrough Fixed Array Technologies for
Ultra-Fine Resolution Wearable Devices
Rong-Chang (RC) Liang
Founding Chairman
Prepared for Lux Executive Summit Asia 2016, Tokyo
2016/10/18-19 1 Lux Executive Summit Asia 2016, Tokyo
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Fixed Array Technologies For Ultra-Fine Resolution Wearable Devices
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Roll to Roll Anisotropic Conductive Adhesive (ACF) Film Microfluidic
Assembling
2-4 µm conductive particles
Fine-Pitch Chip Bonding & Integration
Huge Potential of Wearables
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Millions of Devices Connected (52% CAGR)
200 100
AMR & Berg: A estimated total of about $100B market by 2020 in: - Consumer wearable devices ($50B) - Home automation ($35B) - Mobile medical devices ($20B)
Huge Technical Hurdles of Multi-SoC for Wearables
- Serial processing of each chip - Long conductor traces, signal degradation - Solder (source of 95% of
failure) - CTE Mismatches - …
Fine-Pitch Flip Chip (e.g. µLED) Applications
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Fixed Array Technologies enable high quality connections for high resolution/ density integrations w/o current leakage or short.
ACP
Traditional ACF 2-layer ACF Trillion Fixed Array ACF
Mono-dispersed conductive particles
Unwanted particles in the space area
Connected particles
Trillion Fixed Array ACF Processes
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e.g. US 9,352,539; 9,102,851; 8,802,214 and more than 30 other pending applications
R2R Production of the World’s Finest Resolution ACF w Superior Performances Since 2012
Min. Bonding Area < 300 µm2 ; Min Bonding Space < 4 µm Breakdown Voltage 360-420V; Leakage Current < 10-20 nAmp @ 110V
Microcavities allow just 1 particle/ device to fill in and release easily.
Microcavity array 2000X Video Inspection System
Coating
Microfluidic Self-Assembling
Fixed Array ACF
1000X (Pattern 1) (Pattern 2)
Differentiation & Value Proposition Trillion’s Fixed Array Technologies
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1. High connection conductivity in the bonded area with a low standard deviation and reduced risk of leakage current and short circuit.
2. Flexible multi-SoC systems of ultra-fine resolution and high degree of integration qualified at 1st tier companies.
3. Highly efficient roll-to-roll production of fine pitch fixed array ACF demonstrated since 2012.
4. A thorough patent portfolio of more than 30 US patents covering all aspects in morphology/structure, composition, manufacturing process, devices and applications.
5. The technologies may be extended, with some modifications, to many hot areas including chip arrays and medical applications.
Strategy for Business Growth and Sustainability • R&D and Feasibility completed in the Silicon Valley (2005-2015) and
Relocation to Taiwan for Manufacturing (fully ramped up in 2016). • Joint-Development Partnerships with World Class Companies in USA, Taiwan,
China and S. Korea for Ultra-fine Resolution Wearable Devices and 3D IC Packaging (on-going since 2013).
• Open for ODM and Toll-manufacturing Possibilities for Major Display/
Semiconductor Companies for Fine-Pitch Driver IC (COG/COF) and 3D Packaging Applications (on-going since 2016).
• Extension of the Fine Chemistry and Microfluidic Assembling Process to Other
Major Applications Including Chip Arrays and Medical.
• Partnership for Commercialization of Selected Devices Enabled by Trillion’s Fixed Array for a fast revenue growth.
• To raise > $15M for the expansion and upgrade of the production lines and R&D facility in Taiwan.
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Thank You
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Rong-Chang (RC) Liang
Lux Executive Summit Asia 2016, Tokyo
Enable Trillion Opportunities with Science & Technologies
