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TRIO-CINEMA 1 UCB, 2/08/2010
STEIN Intro Davin Larson
Space Sciences Laboratory
University of California, Berkeley
TRIO-CINEMA 2 UCB, 2/08/2010
STEIN (SupraThermal Electron, Ion,
Neutral) sensor Energy range: ~2-300 keV Resolution: ~ 1keV FWHM Field of view ~15º x70º
TRIO-CINEMA 6 UCB, 2/08/2010
Center Pixel Response (Electrons) Edge Pixel Response (Electrons)
Deflection Voltage
4 kV 4 kV600 6000 1.5 kV1.5 kV
Left Sweep Right Sweep
• Symmetric response for ions
• Neutrals measured in center pixel – cleanly separated for energies below ~15-20 keV
• Logarithmic voltage sweep with ten steps from 600V to 4 kV is optimal for covering phase space. Need positive and negative sweeps to get all angles, so 20 voltage steps desired.
TRIO-CINEMA 14 UCB, 2/08/2010
STEIN Testing
New deflector plates
Built and installed (1 of 2)
Test (planned) on 2010/1/9
Replace parallel plates withSeries of blades
TRIO-CINEMA 16 UCB, 2/08/2010
STEIN Electron Calibration Setup
yaw angle
Pen-rayUV Lamp
-V
Vacuum chamber(grounded)
Quartz window
VD CrLayer
DelrinInsulator
STEINMounted on 3-axis
Manipulator
Electron Beam
D0D3D2D1
TRIO-CINEMA 17 UCB, 2/08/2010
Solid State Detector Basics
+35 V
~200A Al~200A Poly Si
300 micronthick detector
Outside at bias Voltage
n pExample:3.6 keVParticle strikesdetector
guard ring
It takes 3.6 eV to make one electron-hole pair
Total charge produced is:
N = 3600 eV /3.6eV = 1000 electrons = 1.6e-16C
Output PH is proportional to deposited energy!
Cha
rge
Time Time Time
Vol
tage
Vol
tage
CSA Shaper
2ns 2usPH
Avg signal in blackReal signal in red
The shaper circuit averages out the “noise”
Minimize distance-+
TRIO-CINEMA 18 UCB, 2/08/2010
Solid State Detector Basics (Cont)
300 micronthick detector
Time
Vol
tage
Shaper
2usPH
The shaper circuit averages out the “noise”
Shaper
Time
Vol
tage2us
Thresh
ADC
FPGA(logic)
Convert signal occurs
when THRESH is high andPD passes through zero
Memory
Signal
DAC
Thresh
Convert
Read
Convert
PD
PD
Signal
Zero crossing
Comparator
ComparatorDifferentiator
TRIO-CINEMA 20 UCB, 2/08/2010
Response to Electron gun sweep
Time
AD
C c
han
nel
Singles
DoublesTriples
Count rate during electron gun sweep
notsymmetric
Benefits of automation:
It is extremely useful to collect data continuously and plot history of measurements.
Note slight increase in electron beam intensity and hysteresis effect between ramp up and ramp down.
TRIO-CINEMA 23 UCB, 2/08/2010
Yaw angle
D0
D3
D2
D1Scattered e-’s
Detector response vs Yaw angle
D0
D3
D2
D1Total counts
TRIO-CINEMA 24 UCB, 2/08/2010
< System Name > Agenda
AGENDAOverview
Requirements
Design
<Test Results if any>
Development Plan
Issues
TRIO-CINEMA 25 UCB, 2/08/2010
Overview
Clyde Space10 x 1U Solar
Arrays
Clyde Space3U EPS
PumpkinPIC33
Computer
MHX2400Spread-
SpectrumTransceiver
Antenna*2
InstrumentInterface
Emhiser1W S-band
ScienceTransmitter
Antenna*2
MAG Sensors
StacerActuator
Preamp /Shaper / ADC
STEIN
+/-2KV HVPS,Bias
ShutterActuator
Torque Coils(2)
V-Slit SunSensor
MAGICElectronics
ClydeSpace30Wh
Battery
UmbilicalConnect.
Stacer
InstrumentLVPS
Processor Board
Combined LVPS/Logic
EXAMPLEONLY
TRIO-CINEMA 26 UCB, 2/08/2010
Requirements
Level 2 C&DHCDH-01 Processing speed >5 MIPS, >10KFLOPS
CDH-02 RAM>16kbytes (TBR)
CDH-03 Program memory> 32kbytes (TBR), reprogrammable
CDH-04 Telemetry Recorder> 200Mbytes FLASH
CDH-05 Power ~100mW
CDH-06 Cubsesat compatibleCompatible with Cubesat Kit standards for form factor, sep switch interface, USB battery charging/debug interface, etc.
CDH-07 Transciver Interface Interfaces with MicroHard Transciver (data, power switching)
CDH-08 STEIN InterfaceInterfaces to STEIN via TBD interface to Instrument Interface Board (data stream, HVPS, bias, attenuator actuator)
CDH-09 MAGIC Interface Interfaces to MAGIC via SPI or Instrument Interface Board (TBD)
CDH-10 Sun Sensor InterafaceInterfaces to Sun Sensor via Instrument Interface Board
CDH-11 Torque Coil InterfaceInterfaces to Torque Coil power swicthes via Instrument Interface Board (PWM in C&DH or FPGA TBD)
CDH-12 EPS Interface Interfaces to EPS via I2C interfaceEXAMPLEONLY
TRIO-CINEMA 27 UCB, 2/08/2010
PIC – UHF (UART)
PIC – EPS ( I2C )
PIC – SD card (SPI)
PIC – FPGA (SPI & I2C)
Clyde Space10 x 1U Solar
Arrays
Clyde Space3U EPS
PumpkinPIC33
Computer
MHX2400Spread-
SpectrumTransceiver
Antenna*2
InstrumentInterface
Emhiser1W S-band
ScienceTransmitter
Antenna*2
MAG Sensors
StacerActuator
Preamp /Shaper / ADC
STEIN
+/-2KV HVPS,Bias
ShutterActuator
Torque Coils(2)
V-Slit SunSensor
MAGICElectronics
ClydeSpace30Wh
Battery
UmbilicalConnect.
Stacer
InstrumentLVPS
SD
CARD
FPGA – Tx (bitsteam)
FPGA – STEIN (CDI)
FPGA – MAGIC (SPI)
Design
Data Flow Specifications
• Tx : 1 Mbps continuous
• SDCARD : 1.28 Mbps Write, 1 Mbps Read (min)
• STEIN: 16 bits/event, 80KHz events = 1.28Mbps
• MAGIC: 20 bits x 20 Hz x 3 axes = .001 Mbps
• UHF: 0.0096 Mbps
EXAMPLEONLY
TRIO-CINEMA 28 UCB, 2/08/2010
Development Plans
Development• Pumpkin Development Board + Laptop PC
• MPLAB30 “C” Compiler, Simulator, Debuggers
• Subversion (SVN) for storing source code and documents
• GSE Laptop running GSEOS
• FSW Developed in phases:– CPU/Mother Board Only– CPU/Mother Board + [EPS, Batt, UHF, IIB] – CPU/Mother Board + [EPS, Batt, UHF, IIB] + [HVPS,STEIN, MAG]
• Verification Matrix Provides Status of Requirements
• Comprehensive Performance Test on Development Board
• Load into Flight System
• Joins CINEMA Test Flow and Quality reportingEXAMPLEONLY