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User's Guide SLAU212A – April 2007 – Revised August 2008 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System Contents 1 Introduction ................................................................................................................... 3 2 Functionality .................................................................................................................. 3 3 Hardware Configuration ..................................................................................................... 5 4 Software Installation ....................................................................................................... 12 5 User Interface ............................................................................................................... 16 6 MATLAB™ Interface ....................................................................................................... 22 7 Schematics and Bill of Materials ......................................................................................... 23 8 Circuit Board Layout and Layer Stackup ................................................................................ 30 List of Figures 1 Position of Power Connections ............................................................................................ 5 2 Position of Switches and Jumpers......................................................................................... 7 3 EEPROM Configuration Options........................................................................................... 8 4 Position of LEDs ............................................................................................................. 9 5 Position of Input, Output, and USB Connections ...................................................................... 11 6 Pinout of Header Posts for Parallel Output Data....................................................................... 12 7 TSW1200 User Interface Installation .................................................................................... 13 8 Hardware Device Manager................................................................................................ 14 9 Found New Hardware Windows .......................................................................................... 15 10 User Interface Initial Setup Screen ...................................................................................... 16 11 User Interface Single FFT format ........................................................................................ 20 12 User Interface Time Domain Format..................................................................................... 22 13 Schematic Diagram Page 1 ............................................................................................... 23 14 Schematic Diagram Page 2 ............................................................................................... 24 15 Schematic Diagram Page 3 ............................................................................................... 25 16 Schematic Diagram Page 4 ............................................................................................... 26 17 Schematic Diagram Page 5 ............................................................................................... 27 18 TSW1200C Layout Top Layer ............................................................................................ 30 19 TSW1200C Layout Layer Two ........................................................................................... 31 20 TSW1200C Layout Power Plane ......................................................................................... 32 21 TSW1200C Layout Ground Plane ....................................................................................... 33 22 TSW1200C Layout Layer 5 ............................................................................................... 34 23 TSW1200C Layer 6 ........................................................................................................ 35 24 TSW1200C Bottom Layer ................................................................................................. 36 25 Circuit Board Stackup...................................................................................................... 37 List of Tables 1 Bill of Materials ............................................................................................................. 28 SLAU212A – April 2007 – Revised August 2008 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System 1 Submit Documentation Feedback
Transcript
Page 1: TSW1200EVM: High-Speed LVDS Deserializer and Analysis System · User's Guide SLAU212A–April 2007–Revised August 2008 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System

User's GuideSLAU212A–April 2007–Revised August 2008

TSW1200EVM: High-Speed LVDS Deserializer andAnalysis System

Contents1 Introduction ................................................................................................................... 32 Functionality .................................................................................................................. 33 Hardware Configuration..................................................................................................... 54 Software Installation ....................................................................................................... 125 User Interface............................................................................................................... 166 MATLAB™ Interface ....................................................................................................... 227 Schematics and Bill of Materials ......................................................................................... 238 Circuit Board Layout and Layer Stackup................................................................................ 30

List of Figures

1 Position of Power Connections ............................................................................................ 52 Position of Switches and Jumpers......................................................................................... 73 EEPROM Configuration Options........................................................................................... 84 Position of LEDs ............................................................................................................. 95 Position of Input, Output, and USB Connections ...................................................................... 116 Pinout of Header Posts for Parallel Output Data....................................................................... 127 TSW1200 User Interface Installation .................................................................................... 138 Hardware Device Manager................................................................................................ 149 Found New Hardware Windows.......................................................................................... 1510 User Interface Initial Setup Screen ...................................................................................... 1611 User Interface Single FFT format ........................................................................................ 2012 User Interface Time Domain Format..................................................................................... 2213 Schematic Diagram Page 1............................................................................................... 2314 Schematic Diagram Page 2............................................................................................... 2415 Schematic Diagram Page 3............................................................................................... 2516 Schematic Diagram Page 4............................................................................................... 2617 Schematic Diagram Page 5............................................................................................... 2718 TSW1200C Layout Top Layer ............................................................................................ 3019 TSW1200C Layout Layer Two ........................................................................................... 3120 TSW1200C Layout Power Plane......................................................................................... 3221 TSW1200C Layout Ground Plane ....................................................................................... 3322 TSW1200C Layout Layer 5 ............................................................................................... 3423 TSW1200C Layer 6 ........................................................................................................ 3524 TSW1200C Bottom Layer ................................................................................................. 3625 Circuit Board Stackup...................................................................................................... 37

List of Tables

1 Bill of Materials ............................................................................................................. 28

SLAU212A–April 2007–Revised August 2008 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System 1Submit Documentation Feedback

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www.ti.com

Windows is a trademark of Microsoft Corporation.LabVIEW is a trademark of National Instruments Corporation.MATLAB is a trademark of The MathWorks, Inc..Xilinx is a trademark of Xilinx, Inc..

TSW1200EVM: High-Speed LVDS Deserializer and Analysis System2 SLAU212A–April 2007–Revised August 2008Submit Documentation Feedback

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1 Introduction

2 Functionality

www.ti.com Introduction

The Texas Instruments TSW1200 High-Speed LVDS Deserializer and Analysis System provides acomprehensive set of hardware and user interface software to effectively evaluate the performance of awide range of Texas Instruments (TI) high-speed, analog- to-digital converters (ADC), particularly thosehigh-speed ADCs that employ an low-voltage differential signal (LVDS) format for the data converter’soutput data. With a high-quality, low-jitter clock and a high-quality input frequency provided to theevaluation module, the TSW1200 system can be used to demonstrate data sheet performancespecifications.

The TSW1200 hardware has a high-speed connector that plugs into an evaluation module (EVM) for theADC. Firmware for an FPGA on the TSW1200EVM has an interface to various LVDS data formats andFIFO memory sufficient to capture as much as 64K samples of data. A USB connection transfers thecaptured data to a personal computer for post-processing. The user Interface software controls theTSW1200 hardware and displays the FFT and important statistics related to the performance of the ADC.

Many TI high-speed ADCs have LVDS outputs for the digitized data. These ADCs are generally availableon an EVM that connects directly to the TSW1200EVM. The common connector between the ADC EVMand the TSW1200EVM is a Samtec high-speed connector suitable for differential pairs of pins separatedby ground. A common pinout for the connector across a family of EVMs has been established. At present,the interface between the ADC EVM and the TSW1200EVM has defined connections for 14 pairs of LVDSplus two clock lines. The connector pinout has an additional 14 LVDS pairs for future product support. Inmost cases, if a TI ADC supports LVDS outputs, then the TSW1200 system can be used to capture datafrom the ADC. If the ADC supports a CMOS single-ended format, then the TSW1100 system is intendedto interface to it.

The data format for the LVDS data bus can be in one of many formats, all supported by the TSW1200.For single-channel, high-speed ADCs, the data format is commonly parallel dual-data rate with one clockline. Dual-data rate means that both the rising and falling edges of the clock strobe data into theTSW1200. For multichannel ADCs, the data is commonly presented in a serialized format, whereindividual bits of the output data are presented on an LVDS line one bit at a time, at a higher data ratethan the sample rate of the ADC.

The firmware in the FPGA on the TSW1200 is designed to accommodate both parallel DDR formats andserial LVDS formats, although not at the same time. The EEPROM on the TSW1200EVM is large enoughto hold two distinct program files for the FPGA. One program bit file supports the parallel DDR format andthe other bit file supports serial LVDS formats. The TSW1200 can be set to support the desired dataformat by simply setting two jumpers and pressing the PROGRAM button.

The parallel DDR FPGA program supports several types of data formats. One common format presentsodd-numbered data bits on the bus on one clock edge and even-numbered data bits on the bus on theother clock edge. This format is commonly used for ADCs with sampling rates up to 250 MHz. For thisbit-wise DDR format, the parallel data bus uses half as many LVDS pairs as there are bits in the sample.For example, a 16-bit ADC uses eight LVDS pairs for data plus an LVDS clock pair for bit-wise DDR. Forhigher sample rates up to 500 MHz, a sample-wise DDR format is often used. For sample-wise DDR, thedata bus width has as many LVDS pairs as the bit resolution of the ADC. On one clock edge, a datasample from the ADC is registered; on the next clock edge, the next data sample from the ADC isregistered.

The serial FPGA program also supports several data formats. For one-wire serial formats, the data isserialized onto a single LVDS pair at a rate that is 12 times the sample rate for an ADC with a 12-bitresolution. A one-wire serialization format also is used for 14-bit and 16-bit data at data rates 14 or 16times the sample rate, respectively. For serial data formats, a DDR LVDS bit clock is used to strobe theserial data bits and to deserialize the data. An additional clock pair provided at the sample rate of the ADCidentifies the sample-word boundaries in the serial data. For multichannel ADCs, a single-bit clock and asingle sample-rate clock (frame clock) is used for all of the LVDS data channels. The other common serialdata format is two-wire serialization. Two-wire serialization is similar to one-wire serialization except that adata channel uses two LVDS pairs to carry the serialized data at a rate that is half of what it is for one-wireserialization. Two-wire serialization commonly is used for sample rates up to 125 MHz, whereas one-wireserialization generally is used for sample rates up to 65 MHz.

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Functionality www.ti.com

The FPGA firmware for the TSW1200 generally consists of two major functions: the LVDS ADC interfaceand the FIFO capture. The LVDS ADC interface supports either the various parallel DDR interfaces or thevarious serial interfaces as previously described. The LVDS ADC interface code in the FPGA reformatsthe data into a standard single-ended parallel data word with sample clock. This parallel sample word plusclock is output continuously to header posts on the TSW1200 for capture by a logic analyzer. The paralleldata word with sample clock also is presented to the FIFO capture logic. Note that for parallel DDR dataformats, the header output posts are not enabled by default, as the data rate (up to a 500-MHz samplerate) is often too fast to be feasible for a single-ended CMOS output.

The TSW1200 FPGA has enough FIFO buffer to capture as much as a 65536-sample record length fromthe continuous sample data stream coming from the LVDS ADC interface. The TSW1200 FPGA designincludes a UART function that can transfer data to and from a USB interface device on the TSW1200board. The USB interface device on the TSW1200EVM connects to a personal computer (PC) runningWindows™ over a standard USB cable. The operation of the FIFO capture logic is controlled by writesfrom the PC USB port to a register map defined within the FPGA. The user interface software on the PCselects by register operations such things as record length of data to capture, which channel of an ADC tocapture from, and then the user interface software downloads the captured data from the TSW1200 forprocessing in the form of an FFT or time-domain display.

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3 Hardware Configuration

3.1 Power Connections

TSW1200

Ground

J7J14 J15

Selects 5 VOutput for J15

(Default)

Selects J7 for6 V Input(Default)

Selects J5for 6 V Input

J22

JP8

6 V I/O

+6 VInput

www.ti.com Hardware Configuration

In this section, the various portions of the TSW1200EVM hardware are described.

The TSW1200EVM hardware is designed to operate from a single-supply voltage of greater than 6 Vdc.For convenience, two options can supply power to the TSW1200EVM. A bench power supply can supplypower to banana jack connections on the TSW1200EVM, or a laptop-style power module that is includedwith the TSW1200 hardware can supply power. Figure 1 shows the relative position of the powerconnections on the TSW1200EVM (revision B or C of the hardware).

CAUTIONTI recommends that the black banana jack J14 be connected to a benchground even if the 6-V external power brick is connected to J7. Intermittent lossof the USB connection can sometimes be observed without a good ground fromthe TSW1200EVM to the bench ground reference.

Figure 1. Position of Power Connections

Care must be taken in selection of the input power supply. One jumper selects whether the 6-V inputpower comes from the banana jack, or whether it comes from the external power module. Another jumperselects whether to connect the onboard regulated 5 V to the red banana jack for output. If the red bananajack is used to input 6 V from a bench power supply, the onboard regulated 5 V must not be connected tothe red banana jack for output at the same time. Doing so causes the onboard 5-V regulator to fail overtime.

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3.2 Switches and Jumpers

3.2.1 Pushbuttons

3.2.2 Jumpers

Hardware Configuration www.ti.com

Four pushbutton switches are mounted on the TSW1200EVM. Two pushbutton switches currently havedefined functions; two of the switches are reserved for future use.

The PROGRAM pushbutton (SW3) causes the FPGA to reload its bit file from the FPGA EEPROM on theTSW1200EVM. The EEPROM currently is large enough to hold two FPGA bit files. When the FPGA loadsa bit file, it loads the bit file indicated by the position of the jumpers J11 and J10. When power is firstapplied to the TSW1200EVM, the FPGA also loads its bit file from the EEPROM as determined by thejumpers J11 and J10. Therefore, pressing the PROGRAM pushbutton has the same effect aspower-cycling the FPGA. All register settings in the FPGA and any data held in the FPGA are lost onloading the bit file, and the FPGA then is in its initial default configuration.

The RESET (SW4) pushbutton causes the FPGA to clear the FIFO storage, but does not clear any of theregister settings in the FPGA. Any configuration of the FPGA done through register operations such assetting the UART baud rate will persist after pushing the RESET pushbutton. FPGA register settings onlyare cleared by pressing the PROGRAM pushbutton. For this reason, the RESET pushbutton has limitedutility in this revision of the TSW1200EVM; this pushbutton may have more utility defined for it in futurerevisions of the FPGA firmware.

The PROM RESET (SW2) is reserved for future use, as is pushbutton SW5.

Jumpers J10 and J11 select the bit file to be programmed into the FPGA as indicated in Figure 2. TheEEPROM is currently large enough to contain two complete programming files for the FPGA, withprovision to later install a larger EEPROM with the capability to store four complete programming bit filesfor the FPGA.

Bit file CFG1 (jumper J10 set to LO and jumper J11 set to HI) is defined for use with ADC EVMs thatemploy a parallel LVDS DDR (dual-data rate) format. Bit file CFG2 is defined for use with ADC EVMs thatemploy a serialized data format, whether a one-wire serial format or a two-wire serial format. See Figure3.

Simply moving the position of the jumpers J10 and J11 has no immediate effect. The FPGA does not loadits programming bit file except on initial power up or until the PROGRAM pushbutton is pressed. Tochange the operation of the TSW1200EVM for use with a parallel DDR format or with a serial LVDSformat, the jumpers J10 and J11 must be set to the desired position, and then the board must bepower-cycled or have the PROGRAM button pushed.

Jumper JP8 selects whether the power supply to the TSW1200EVM is to be supplied by the external 6-Vpower module through power jack J7 or by an external 6-V bench power supply through the red bananajack J15.

A low drop-out linear power regulator on the TSW1200EVM generates a clean, low-noise 5-V supply fromthe 6-V power that is input to the TSW1200EVM. The jumper J22 can be used to connect this onboardregulated 5 V to the red banana jack J15 as an output. This option is a convenience for use with ADCEVMs that require a single 5-V supply input. In this way, the TSW1200EVM and ADC EVM combinationcan be powered completely from the laptop-style 6-V external power supply.

CAUTIONIt is possible to select the red banana jack J15 as an input to be connected to a6-V bench supply and at the same time install jumper J22 to connect theregulated 5 V to the red banana jack as an output. This, however, over timecauses the 5-V regulator on the TSW1200 to fail.

Jumper J16 is used at the factory to program the small EEPROM for the USB port. The default position forthis jumper is to be installed, and in normal operation, J16 is left installed.

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TSW1200

+6 V

Input

Ground

PROGRAM

RESET

PROM RESET

SW2 SW3

SW5

J1

7

J10

J11

J16

JP8

J22

op

en

USB EEPROM(Default Shorted)

JTAG TDI =>TDO

Selects FPGA bit filefrom EEPROM

(Default CFG1 forParallel DDR format)

(Default Shorted)

6 V I/O

J1

J1

2

SW

4

www.ti.com Hardware Configuration

Jumper J17 can be used to disable the 1.2-V power regulator for the FPGA core logic. The defaultposition for this jumper is to be left uninstalled or open, and in normal operation, this jumper is leftuninstalled.

Jumpers J1 and J12 form part of a JTAG chain through the FPGA and the FPGA EEPROM. A chain ofJTAG devices form a loop, with the TDO from one JTAG device connected to the TDI of the next JTAGdevice. The normal setting of the JTAG jumpers is to connect the TDI of the JTAG connector to the TDIpin of the FPGA EEPROM through jumper J12 pins 2-4. Then, the TDO of the FPGA EEPROM connectsto the TDI of the FPGA through jumper J12 pins 1-3 and jumper J1 pins 2-4. The TDO of the FPGAconnects to the JTAG connector pin TDO through jumper J1 pins 1-2. If it desired to remove either thePFGA or the FPGA EEPROM from the JTAG chain, the jumpers J1 or J12 can be turned 90 degrees toconnect pins 1-2 and 3-4. See the TSW1200EVM schematics and layout sections for illustration of thisoption.

Figure 2. Position of Switches and Jumpers

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PRGM LOAD

CFG3

CFG4

CFG2

CFG1

J10 J11

LO LO

LO

LO

HI

HI

HI

HI

3.3 LEDs

Hardware Configuration www.ti.com

Figure 3. EEPROM Configuration Options

Six LEDs are on the TSW1200EVM to indicate the presence of power and the state of the FPGA. SeeFigure 4. LED D16 illuminates to indicate the presence of a 6-V power supply to the board. On power up,the FPGA loads its programming bit file from the FPGA EEPROM. Once the programming bit file hascompleted loading, the LED D7 illuminates to indicate that the FPGA is operational.

Once the FPGA has loaded its bit file, it internally resets the clock circuitry that locks to a 200-MHz clocksignal from a 200-MHz oscillator on the TSW1200 board. Once the internal reset is complete, LED D1(labeled ADC on the TSW1200 silkscreen) illuminates to indicate that the TSW1200EVM is ready to usewith an ADC EVM.

LED D4 flashes when the onboard 200-MHz oscillator is running. The 200-MHz oscillator clock ismultiplied up to 250 MHz within the FPGA. The pattern of the flashing is of the formflash-flash-pause-pause. That is, the LED illuminates for a time, then turns off for the same time, thenilluminates for the same time, then turns off 5 times. The internal time is derived from a division of the250-MHz reference clock derived from the onboard oscillator.

LED D2 (labeled DCM on the TSW1200 silkscreen, which is an abbreviation for the digital clock managerblock of logic in the FPGA) flashes when an LVDS clock from the ADC is present. The DCM clock flashesin the same flash-flash-pause-pause pattern, using the same clock division parameters as were used forthe 250-MHz reference clock LED. In this manner, the DCM LED can be used to see that the clock fromthe ADC is present and approximately the right frequency by comparing it to the 250-MHz LED. That is, ifthe sample rate clock to the ADC is 250 MHz, then the DCM LED and the 250-MHz LED flash at the samerate. If the sample clock to the ADC is 125 MHz, then the DCM LED flashes at half the rate of LED D4. Ifthe DCM LED is not flashing at all, then no clock is detected from the ADC. Common reasons for an ADCclock not to be detected are that the EVM is not powered on, or that the clock from the ADC is a CMOSclock instead of an LVDS clock due to an improper jumper setting.

LED D3 (labeled USB on the TSW1200EVM silkscreen) illuminates whenever the TSW1200 user interfacesoftware is accessing the FPGA by way of the USB connection. For longer FFT record lengths and lowerUART baud rates, the USB LED illuminates longer than for shorter FFT record lengths or higher UARTbaud rates.

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TSW1200

6 V InputGround

D7

ADC D1

D16

D4

D3

D2DCM

USB

Lit when 6V

present

Lit after FPGA

reset completed

Flashes when clock

from ADC present

Lit during

USB access

Flashes while

200 MHz osc present

Lit

wh

en

FP

GA

fin

ish

es

lo

ad

ing

bit

fil

e

6 V I/O

3.4 Input Connections

3.4.1 Samtec LVDS Connector

www.ti.com Hardware Configuration

Figure 4. Position of LEDs

Figure 5 illustrates the position of the various input and output connections on the TSW1200EVM.

The connection between the TSW1200EVM and the ADC EVM to be tested is through a 120-pin Samtecconnector. Fourteen LVDS data pairs plus two LVDS clock pairs have a defined position in the connectorpinout that is common between the TSW1200EVM and many TI ADC EVMs. For the parallel LVDS DDRdata format, the bit clock runs at the same rate as the sample clock to the ADC. For the serial LVDS dataformat, the bit clock runs at a higher multiple of the ADC sample clock and is used to strobe the serialdata into the TSW1200EVM and then deserialize the data. For the serial LVDS data format, a secondclock is provided, called the frame clock or FCLK, that runs at the sample rate and is used to delineate the

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3.4.2 JTAG Connector

Hardware Configuration www.ti.com

sample boundaries in the serial data stream. The frame clock line is unused in the parallel LVDS DDRformat. In addition, 14 extra LVDS pairs are defined in the connector and routed to the TSW1200EVMFPGA for future expansion for larger parallel bus widths needed for faster data converters. The datadirection for the LVDS data pairs is always defined as the ADC EVM driving the signal through theconnector to the TSW1200EVM FPGA, with integrated 100-Ω termination in the FPGA.

For one-channel parallel DDR bit-wise data formats, eight of the LVDS data pairs are used to support upto 16-bit-resolution ADCs at up to 250-MHz sampling rates. For one-channel parallel DDR sample-wisedata formats, 14 of the LVDS data pairs are used to support up to 14-bit-resolution ADCs at up to500-MHz sampling rates. For two-channel parallel DDR bit-wise data formats, 14 of the LVDS data pairsare used to support two channels of 14-bit resolution at up to 250-MHz sampling rate.

For serial data formats, eight of the LVDS data pairs support up to eight channels of one-wire serial ADCsat up to 65-MHz sampling rate or four channels of two-wire serial ADCs at up to 125-MHz sampling rates.All other LVDS pairs are ignored for this release.

Five extra CMOS single-ended signals are defined in the Samtec connector that are sourced from theFPGA through the connector to the ADC EVM. These signals are optionally defined to allow the FPGA(under control of the TSW1200 user interface software) control the SPI serial programming of the ADC forthose ADC EVMs that support this feature. For those ADC EVMs that support this feature, the SPI signalsSEN (SPI Enable), SCLK (SPI Clk), and SDATA (SPI Data) are sourced by the TSW1200EVM FPGA toallow the TSW1200 user Interface to configure the operational mode of the ADC under evaluation. ThereSPI signals are by default not connected on the ADC EVM until a 0-Ω resistor is installed on the EVM toenable control of the SPI port from the TSW1200 user Interface software. Two additional signals, SPIReset and SPI Power Down, are defined for possible future use.

The Samtec connectors snap together with no screws or other mechanism to hold the TSW1200EVM andthe ADC EVM together. The TSW1200EVM comes with standoff posts for setting the TSW1200EVM flaton a bench or table. The ADC EVM has shorter standoff posts so that the TSW1200EVM and ADC EVMwill lay flat on a bench or table and stay snapped together during use.

The TSW1200EVM includes an industry-standard JTAG connector that loops the JTAG ports of the FPGAand the FPGA EEPROM. Jumpers on the TSW1200EVM allow for either the FPGA or the FPGAEEPROM to be removed from the JTAG chain. The most frequent use for the JTAG connector is toprogram the TSW1200EVM FPGA. An FPGA programming pod can be purchased inexpensively fromXilinx™ to program the FPGA or the FPGA EEPROM.

The FPGA programming pod can be used to load a programming bit file directly into the FPGA for debugand development. However, once the FPGA is power-cycled or programmed by the PROGRAMpushbutton, this loaded FPGA bit file will be lost and the FPGA will revert to the bit file that is stored in theFPGA EEPROM. The FPGA programming pod also can be used to store a new FPGA programming bitfile in the FPGA EEPROM so that the TSW1200 can be upgraded as new revisions of FPGA firmwarebecome available.

The part number of the Xilinx Platform Cable USB programming pod that can be used to program orupgrade the TSW1200EVM is DLC9G. The programming pod operates from a USB port of a PC andconnects directly with the TSW1200 JTAG connector through a ribbon cable supplied with theprogramming pod.

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TSW1200

6V InputGround

HEADER POSTS

HEADER POSTS

HEADER POSTS

HEADER POSTS

CLK

GND

GND

CLK

J6 ch 4

J21 ch 8

JTA

GLV

DS

LV

DS

US

BH

EA

DE

R P

OS

TS

HE

AD

ER

PO

ST

S

HE

AD

ER

PO

ST

S

HE

AD

ER

PO

ST

SC

LK

GN

D

CL

K

GN

D

J18 ch 5

6 V I/O

J3 ch 1

3.5 Output Connections

www.ti.com Hardware Configuration

Figure 5. Position of Input, Output, and USB Connections

Two ways are available to output the parallel clock and sample data from the TSW1200EVM. The ADCsample data can be presented as a continuous stream of CMOS single-ended data on output headerposts, or a set record length of ADC parallel data samples can be captured in the TSW1200EVM FIFOsand output to a PC through the USB serial port. The data capture by the FIFOs and TSW1200 userinterface is the most convenient way to capture data from an ADC, but sometimes the continuous streamof data is desirable. For example, an application may require a larger capture depth for an FFT on amillion continuous data samples or more. For this, the output header posts are available so that a logicanalyzer can be used to capture ADC data in real time.

The pinout of the output data headers is shown in Figure 6. In all cases, the output header is a standardtwo-row header of square 0.025-inch posts on 0.1-inch centers. One of the two rows of posts areconnected to ground down the whole row of posts, whereas the other row of posts are signal. Thesample-rate clock is presented on the first post, and after skipping one no-connect post (or three posts forChannel 1) the parallel data bus is presented from the least-significant bit (bit D0) through themost-significant bit. Two of the channels allow for as much as 16-bit data resolution whereas the other sixchannels provide for up to 14-bit data.

By default, the output headers are not enabled for parallel DDR data formats due to the potential highsample rates of up to 500 MHz.

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GND

GND

GND

GND

CL

K

NC

D1

D2

D4

D3

D5

D6

D7

D8

D9

D10

D11

D12

D13

D14

D15

D0

J18 Channel 5

J19 Channel 6

J20 Channel 7

J21 Channel 8

J5 Channel 2

J4 Channel 3

J6 Channel 4

J3 Channel 1

CL

K

NC

D1

D2

D4

D3

D5

D6

D7

D8

D9

D10

D11

D12

D13

D0

NC

NC

CL

K

NC

D1

D2

D4

D3

D5

D6

D7

D8

D9

D10

D11

D12

D13

D0

NC

NC

NC

NC

CL

K

NC

D1

D2

D4

D3

D5

D6

D7

D8

D9

D10

D11

D12

D13

D0

NC

NC

NC

NC

3.6 USB I/O Connection

4 Software Installation

Software Installation www.ti.com

For the current release, four of the header posts are enabled for serial data formats. For up tofour-channel ADCs, the parallel deserialized sample data is presented on the corresponding outputheader. For eight-channel serial data formats, the TSW1200 user interface software selects whether tooutput the lower four channels of data on the output headers for Channels 1 through 4 or whether tooutput the data for Channels 5 through 8 on the output headers for Channels 1 through 4. Output headersfor Channels 5 through 8 are unused for this release.

Figure 6. Pinout of Header Posts for Parallel Output Data

Control of the TSW1200EVM is through a USB connection to a PC running Windows operating system.

For the computer, the drivers needed to access the USB port are included on the TSW1200 InstallationCD and are installed during the installation process. The USB is accessed as a virtual communication port(VCP) and shows up in the Hardware Device Manager as TSW1200 under COM ports and as TSW1200EVM under Multi-Port Serial Adapters. See Figure 8. On the TSW1200EVM, the USB port acts as a bridgeto UART control of the FPGA. Control of the FPGA is managed by reads and writes to a register map ofcontrol registers defined in the design of the FPGA. Normally, register writes from the TSW1200 userinterface software sets up the mode of operation of the FPGA. These register writes define such things asthe depth of FIFO to use for data capture or from which channel of an ADC to capture data. Then, a singleregister access triggers the filling of the capture FIFOs. Immediately after the capture FIFOs havecaptured the desired amount of data, the FIFO data is streamed back up the USB connection to theTSW1200 user interface software. The UART data rate between the FPGA and the USB port can be setto 115K, 230K, or 460K baud. A UART baud rate of 920K is not recommended for reliable data transfer.On first connection of the USB port to a computer, the Microsoft Found New Hardware Wizard appears.Follow the dialog box prompts as covered in the Software Installation section of this User’s Guide.

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4.1 Installation CDwww.ti.com Software Installation

A software installation CD is included with the TSW1200 kit. This Installation CD includes all that isnecessary to install the TSW1200 user interface software on a computer that is running the Microsoft Vistaor Microsoft XP operating system. Included on the installation CD is this user’s guide, a setup program toinstall the user interface software, and a suite of MATLAB™ routines that can be used to interface to theTSW1200EVM hardware. All drivers necessary for the USB connection and the user interface softwareare included.

The user interface software is installed in two parts, which is done automatically once the setup program isrun. The actual user interface software is installed first along with the run-time engine that underlies theuser interface. Then, Virtual Com Port (VCP) is installed for the USB connection to the hardware.

Figure 7. TSW1200 User Interface Installation

If the TSW1200 user interface software is being installed on a machine that has an older version, TIrecommends that you first remove the old TSW1200 installation, using the Microsoft Add/RemovePrograms function in the Control Panel. The TUSB3410 VCP (Virtual Com Port) can be left installed, butduring the installation of the new TSW1200 user interface software, a dialog box appears to warn that theprevious TUSB3410 is about to be uninstalled. Click cancel for this uninstall to leave the old installation ofthe TUSB3410 VCP in place.

If the installation program encounters an older revision of the TSW1200 user interface software that wasnot removed with Add/Remove Programs, it removes the older version, and the Setup.exe must beexecuted again to install the newer version. If an existing TUSB3410 Virtual Com Port is on the machine,the Installation program may remove this also unless the removal is canceled when the dialog boxappears.

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4.2 USB Port and Drivers

Software Installation www.ti.com

To install the TSW1200 user interface software, run the setup.exe file that is contained on the installationCD. Figure 7 shows the more important dialog boxes that appear during the installation process. Foldersare created for the TSW1200 user interface and for the USB Virtual Com Port software. The default foldernames can be accepted in the dialog box as shown in Figure 7, or a folder name and directory path canbe entered into the dialog box. A license agreement is required for the National Instruments LabVIEW™runtime engine that is used by the TSW1200 user interface software. It is unnecessary for the targetcomputer to have LabVIEW installed; the TSW1200 user interface software comes with the runtime engineand is completely self-contained.

When the Virtual Com Port is installed and the USB cable has connected the TSW1200EVM to the PC,the TSW1200 can be located in the Hardware Device Manager as shown in Figure 8. The TSW1200appears as TSW1200 as a COM port. Each time the USB cable is connected, it is possible that a differentcommunication port is assigned. The TSW1200 user interface software locates the TSW1200 com portand opens communications with the TSW1200EVM. If the TSW1200 software is unable to find the port forthe TSW1200EVM, it displays an error message that the TSW1200 is not found. Usually, this is anindication that the user interface software was opened before the USB cable was plugged in or that poweris not supplied to the TSW1200EVM. In this case, ensure that power is applied to the TSW1200EVM andthat the USB cable is plugged in. Then close and re-open the TSW1200 user interface software.

Figure 8. Hardware Device Manager

When the USB cable connects the TSW1200 to the PC for the first time, the Microsoft Found New

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4.3 Device ini Files

www.ti.com Software Installation

Hardware Wizard appears along with a series of pop-up windows. Select the default settings as shown inFigure 9. If the warning dialog box appears and indicates that the software has not passed Microsoft LogoTesting, select Continue Anyway. The Found New Hardware Wizard usually appears twice, once to installthe com port and once to install the TSW1200 under Multi-Port Serial Adapters. The response to thedialog box prompts is the same in both cases.

When the TSW1200EVM USB cable is unplugged and plugged in again to a different USB port on thecomputer, the Found New Hardware Wizard may appear again, depending on whether that USB port iscontrolled by a different USB controller in the computer and depending on the registry configuration for thePC. If the Found New Hardware Wizard does appear again when the USB cable is reconnected, follow thesame responses to the dialog boxes as when the TSW1200 was first installed.

Figure 9. Found New Hardware Windows

Included in the installation for the TSW1200 user interface software is a subdirectory of ini files for eachcategory of ADC that is supported by the TSW1200EVM. TI strongly recommends that these files are notedited except at the factory. These files contain necessary information for the user interface software toproperly configure the TSW1200EVM FPGA registers for proper operation with the desired ADC EVM.Some of the entries within the ini file are obvious, such as defining the bit resolution for a device to be 11,12, 14, or 16 bits. Other entries in the ini file define for the FPGA which LVDS pairs within the Samtec

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5 User Interface

5.1 Toolbar

5.1.1 File Options

User Interface www.ti.com

connector define the data bus, and correct operation may not be possible if these entries are edited. Theuse of ini files allows for new device types to be supported by the TSW1200EVM as they becomeavailable without having to modify, re-release, or re-install the TSW1200 user interface software. Newdevice types may be supported at a later date simply by adding a new ini file to the proper subdirectory,using a script that TI will make available at that time.

When the TSW1200 user interface software is started, the initial setup screen of Figure 10 appears. Thestatus pane in the lower left reports on the firmware selection of the TSW1200EVM, the revision of thefirmware, and the revision of the user interface software. Many of the TSW1200 software controls areavailable from this setup screen, such as ADC device selection. However, a test must be selected beforethe TSW1200 software is ready for data capture from the TSW1200EVM. The tests available for thisrevision of the TSW1200 software are a logic-analyzer-style Time Domain test and a single-tone FFT test.At any time, this setup screen can be chosen from the test pulldown menu.

Figure 10. User Interface Initial Setup Screen

The toolbar contains options and settings that are independent of the device selected for test or the test tobe performed, such as configuration options and save/recall operations. The operations available underthe toolbar are grouped in categories of File, Instrument Options, Data Capture Options, and Test Options

Instrument Options contains all of the options for saving or importing test results and saving or recallingthe setup of the TSW1200 User Interface software.

The Save Capture operation can save the results that are displayed in the test window for export orarchival purposes. If the Single Tone FFT test is active, then the FFT plot is be saved, along with theperformance statistics and setup information. If the Time Domain test is active, then the Time Domain plotis saved along with the time domain statistics. The saved data plot can be saved in jpeg, png, or bmpformat.

The captured data from the ADC under test also can be saved to a file, or previously saved data can beimported back into the TSW1200 software and re-displayed in the Single-tone FFT or Time Domainwindows. Data can be saved in the format of binary, comma separated format, or both.

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5.1.2 Instrument Options

5.1.3 Data Capture Options

5.1.4 Test Options

www.ti.com User Interface

The Instrument Options menu tab contains two options: Reinitialize Instrument and Read ADC EVM SetupProcedure.

The Reinitialize Instrument option causes the TSW1200 software to reset itself to initial conditions and toread the firmware settings from the TSW1200EVM again. The firmware and software revisions then aredisplayed in the status window. This command is useful for cases where the jumper settings on theTSW1200EVM may have changed since the TSW1200 software was opened, or in cases where the USBconnection to the PC has been dropped and the COM port must be reopened.

The Read ADC EVM Setup Procedure command causes the TSW1200 software to read a comment stringfrom the ini file for the ADC that is currently selected and then display that comment string in the statuspane. This comment string generally contains necessary setup information pertaining to the ADC EVM,such as possibly requiring a non-default data format or required jumper setting for the EVM tocommunicate properly with the TSW1200EVM.

The Data Capture menu tab contains two options: Capture Options and UART Baud Rate.

Capture Options allows for continuous capture that can be checked or unchecked. Continuous capturecauses the capture button to continuously capture, process, and display test data. Once the results aredisplayed, the capture process automatically begins again at the desired capture interval The defaultcapture interval is zero, which means that the next capture is started once the current results aredisplayed. The capture interval can be set in seconds to make the continuous capture less frequent.

The UART baud rate can be set to one of four data rates. This controls the data rate of unloading theFIFO capture from the TSW1200EVM FPGA to the USB port. The UART baud rate is the limiting factor forthe time it takes to capture long record lengths of data. The UART data rate is commonly set to 460800,as 921600 is not recommended for reliable data transfer.

The Test Options menu tab allows for setting the parameter options for the Single Tone FFT test and theTime Domain test. Later revisions of the TSW1200 software will allow for setting test parameters for aDual Tone FFT test and the ACPR test.

For a Single Tone FFT test, the RMS line may be enabled or disabled. When enabled, a horizontal markeris displayed over the FFT plot to indicate the RMS average of the noise floor of the FFT plot. The RMSaverage is computed over all of the FFT bins except the bin containing the input frequency. Moreprecisely, the RMS line = SINAD + FFT Record Length Process Gain where FFT Record Process Gain =10log(number of points/2).

SNR, SFDR, and SINAD can be expressed in either dBc or dBFS as selected by the dBFS selectionunder the Single Tone FFT options.

By default, the noise calculations for SNR and SINAD do not include the five FFT bins around theexpected input frequency or the first five FFT bins at DC. The rest of the FFT bins out to the Nyquistfrequency are included in the calculation of the total noise. Vertical marker cursors are present in the FFTdisplay that indicate the beginning and the end of the bandwidth of interest for noise calculations. Becausethese vertical markers are located at the extreme left-most and right-most positions on the FFT display,these vertical markers often are not noticeable. It is possible to compute the total noise power over anarrower range than the default DC through Nyquist band of frequencies. An integration band for the noisecalculations can be set in two ways. First, the mouse can be used to click on one of the vertical cursorsand drag it to a new desired location. Second, the Cursor Band Location window under the Single ToneFFT Test Option in the tool bar can be used to set a new frequency band of integration for the calculationof the total noise power.

Also excluded from calculation of the SNR is the power in the first five harmonics of the input frequency.These first five harmonics are included in calculation of SINAD (signal to noise and distortion) and thusthis is the principal difference between SNR and SINAD. (SINAD is sometimes called SNDR, signal tonoise and distortion ratio.) The number of harmonics to exclude from SNR can be set to a value other thanthe default 5 in the Number of Harmonics window in the Single Tone FFT Test Option in the toolbar.

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5.2 Status Window

5.3 Device Specific Selections

5.4 Single Tone FET

5.4.1 Parameter Controls

User Interface www.ti.com

The lower left portion of the TSW1200 user interface software window under the TI logo is reserved forreporting status, warnings, errors, and informational output. When the TSW1200 software is first run, itqueries the TSW1200EVM and displays the revision of the FPGA firmware and the type of ADC interfacethe TSW1200EVM is expecting to see based on jumper settings J10 and J11. At any time, this initialinformation can be displayed again by selecting the Reinitialize Instrument option in the InstrumentOptions tab of the toolbar.

During operation of the TS1200 software, warnings may appear in the status window if selections madefrom the drop-down menus of the interface are incompatible with the hardware selections or settings. If anADC selection is made that is not supported by the TSW1200EVM jumper settings of J10 and J11, then amessage in the status window prompts the user for a different device selection or to set the jumpers to theproper position on the hardware. If a sample rate is entered that is faster than that supported by aparticular ADC data sheet, then a warning is displayed in the status window.

Drop-down menus that are specific to a particular ADC device selection are located along the top of thedisplay under the toolbar.

The first selection a user makes is to select a type of ADC device from the device selection drop-downmenu. Each ADC that has an ini file installed in the proper directory automatically has an entry in thedevice selection drop-down menu.

Once an ADC device part number is selected, the ADC Channel can be selected in the Channel selectiondrop-down menu. The proper number of channel selections are made available based on the ADC deviceselection.

The format for display of the captured data is chosen in the Test Selection drop-down menu. Single ToneFFT displays the power spectrum of the captured data with calculated AC performance statistics. TimeDomain displays the raw captured data in the format of a logic analyzer display and output level over time.

In the Window Display drop-down menu, the user chooses a windowing function to be applied to thecaptured data. Rectangular Window applies a unity gain to all data points of the captured data. A HanningWindow, Hamming Window, or Blackman-Harris Window function can be applied to the captured data forsituations where the sample rate and the input frequency are not or cannot be set precisely to capture aninteger number of cycles of the input frequency (sometimes called coherent frequency).

The Capture button initiates a data capture once all other selections are made. The data capture can be asingle capture and display, or a continuous repeating capture.

The Single Tone FFT test is shown in Figure 11. The larger central pane displays the FFT powerspectrum, whereas the calculated statistics are grouped into categories on the right of the screen. Settingsand inputs relevant to the test are entered in drop-down menus or text input boxes on the left portion ofthe window.

The sampling rate is entered in the ADC Sampling Rate text box, also called the Sampling Frequency FS.The number is entered in Hertz (Hz), although the letter M may be appended to represent the samplingrate in MHz. For example, 125M = 125 MHz or 125,000,000 Hz.

The expected input frequency is entered in the ADC Input Frequency input box, also known as FC. If theAuto Calculation of Coherent Input Frequency mode is enabled, then this input frequency is adjusted up ordown slightly away from the input frequency automatically. If coherent input frequency is required, thesignal generator used to source the input frequency must be set to this exact calculated coherentfrequency. The coherent frequency calculation takes the sampling frequency, the input frequency asentered by the user, and the FFT record length and adjusts the input frequency so that the captured datastarts and ends on the same place of the sine wave of the input frequency. This avoids an artifact of the

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5.4.2 FFT Power Spectrum

5.4.3 Single FFT Statistics

S

N

PSNR = 10Log 10

P (1)

S

N

PSINAD = 10Log 10

P + PD (2)

www.ti.com User Interface

FFT calculation from presenting a smeared power spectrum due to the fact that the FFT presumes thesample of the input is part of a continuous input signal. If the input and sampling frequency is notcoherent, and the sampled data is appended end to end to form a continuous input signal, then there is anapparent phase discontinuity at the beginning and the end of the sampled data. Making the sampling andinput frequencies coherent avoids this apparent discontinuity. If the input frequency cannot be madecoherent, then the windowing functions other than Rectangular can be used to process out this effect tosome degree.

The FFT record length can be set in the FFT Record Length (NS) input text box. The TSW1200EVMsupports FFT record lengths of as much as 65536 samples, or as little as 4096 samples.

The FFT power spectrum of the captured data is displayed in the major center portion of the window. TheTSW1200 software automatically scales the horizontal axis from DC through the Nyquist frequency,although the scale of the horizontal axis can be changed simply by highlighting the text and typing in anew value. For example, the display in Figure 11 can be used to zoom in on the input frequency byhighlighting the 0MHz and typing 25M, and then highlighting the 62.5M and typing in 35M. This causes theportion of the power spectrum from 25 MHz through 35 MHz to fill the power spectrum display.

The vertical scale of the power spectrum is automatically scaled to display the noise floor of the FFT resultup through 0 dBFS. The vertical scale can also be manually adjusted by highlighting the limits of thevertical scale and typing in new limits.

By default, the first few harmonics of the input frequency are marked in the display, as well as anadditional marker that can be placed by dragging the marker to any place in the power spectrum, such asa noise spur that is not already marked as a harmonic. By default this additional marker initially goes tothe highest spur that is not identified as a harmonic.

Display properties can be edited by using the mouse to right-click in the power spectrum display. Visibleproperties such as the graph palette or plot legend can be edited, and auto-scale of the vertical andhorizontal axises can be enabled or not.

For the Single FFT test, a number of calculated statistics and AC performance measurements aredisplayed to the right of the power spectrum display, grouped into several categories.

ACSignal-to-Noise Ratio – SNR is the ratio of the power of the fundamental (PS) or input frequency to thenoise floor power (PN), excluding the power at DC and the first five harmonics. SNR is either given in unitsof dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dBto full scale) when the power of the fundamental is extrapolated to the converter’s full-scale range.

Signal-to-Noise and Distortion (SINAD) – SINAD is the ratio of the power of the fundamental (PS) to thepower of all the other spectral components including noise (PN) and distortion (PD), but excluding DC.

Spurious-Free Dynamic Range (SFDR) – SFDR is ratio of the power of the fundamental to the highestother spectral component (either spur or harmonic). SFDR is typically given in units of dBc (dB to carrier).

SFDR w/o 2,3 – Spurious-Free Dynamic Range without the second or third harmonic. Commonly thelargest spectral components after the fundamental are the second and third harmonics of the inputfrequency, and commonly the input frequency can contain significant power in the second and thirdharmonics. SFDR w/o 2,3 reports the SFDR with these two harmonics ignored.

Total Harmonic Distortion (THD) – THD is the ratio of the power of the fundamental (PS) to the power inthe first five harmonics (PD). THD is typically given in data sheets in units of dBc (dB to carrier).

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SPTHD = 10Log 10

PD (3)

SINAD 1.76ENOB =

6.02

(4)

5.5 Time Domain

User Interface www.ti.com

Effective Number of Bits (ENOB) – The ENOB is a measure of a converter’s performance as compared tothe theoretical limit based on quantization noise

Time DomainSeveral of the statistics of the Time Domain test are repeated here, particularly the minimum andmaximum sample values in the FFT record length, as well as the mean and standard deviation of thesample values

SignalThe frequency of the expected input signal is reported, as well as the power level of the signal in eitherdBc or dBFS. The amplitude of the input frequency for typical data sheet measurements is commonly setexternally to be about 1 dB below Full Scale, or –1 dBFS.

DistortionThe power values for the second, third, fourth, and fifth harmonics of the input frequency and theuser-selectable marker are displayed in either dBFS or dBc.

Test setupInput parameters relevant to the test are repeated, particularly FFT record length, sample rate, and theend points of the bandwidth of integration for noise calculations. The lower end point for the bandwidth ofintegration is normally not zero because the first few FFT bins are not included to remove any DC biasingcomponent of the signal.

Figure 11. User Interface Single FFT format

The Time Domain test is shown in Figure 12. The larger central pane displays the raw sampled datawhereas the calculated statistics are grouped into categories on the right of the screen. Settings andinputs relevant to the test are entered in drop-down menus or text input boxes on the left portion of thewindow.

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5.5.1 Input Parameters

5.5.2 Results

5.5.3 Time Domain Statistics

www.ti.com User Interface

The sampling rate is entered in the ADC Sampling Rate text box, also called the Sampling Frequency FS.If this number was entered in the Single FFT test then it is carried over to this test.

The expected input frequency is entered in the ADC Input Frequency input box, although theauto-calculation of coherent frequency does not occur in this test. If auto-calculation of coherent frequencyis required, it must be entered in the Single Tone FFT test and then the Time Domain test must beselected. When done in this order, the coherent input frequency is carried over to the Time Domain test.

The FFT record length can be set in the FFT Record Length (NS) input text box. The TSW1200EVMsupports FFT record lengths of as much as 65536 samples, or as little as 4096 samples.

The Overlay Unwrap Waveform check box allows a calculated normalized waveform to be overlaid overthe sample data. If the sample and input frequencies are coherent, the sampled data is normalized into acalculated representation of a single period of a sine wave. Errors in the sampled data for any reasonbecome immediately apparent as spikes on the unwrapped waveform.

The captured sample data is displayed in two formats in the Time Domain results window. In the upperhalf of the window, the arithmetic value of the sample is represented on the vertical scale. In the lower halfof the window the individual bits of the data are displayed as if it were captured by a logic analyzer. IfUnwrap Waveform is enabled, the normalized calculation of one period of a sine wave is overlaid over thetime domain data in the upper half of the display.

The Time Domain display automatically scales the horizontal display to represent the full data capture tothe amount specified by the FFT Record Length. The horizontal scale may be manually adjusted byhighlighting the minimum and maximum sample limits and typing in new scale limits.

The Time Domain display automatically scales the vertical display according the bit resolution of theselected ADC. For example, for a 14-bit ADC such as the ADS62P45, the vertical scale is represented asvalues from 0 through 16000. The logic-analyzer-style display shows 16 bits of data, of which only 14 bitsare shown to toggle for a 14-bit ADC. The vertical scale can also be adjusted manually by highlightinglimits of the scale and typing in new limits.

For the Time Domain test, sample statistics are displayed on the right of the display. The minimum andmaximum sample values are displayed, as is the median sample and the mean, standard deviation, andRMS value of the samples.

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5.6 Future Revisions

6 MATLAB™ Interface

MATLAB™ Interface www.ti.com

Figure 12. User Interface Time Domain Format

Two additional test windows are expected to be supported by a future revision of the TSW1200 userinterface software: two-tone FFT and ACPR. The two-Tone FFT allows for the specification of two inputfrequencies, and the Inter-Modulation Distortion (IMD) components of 2×F1 – F2 and 2×F2 – F1 areidentified and displayed. Adjacent Channel Power Ratio (ACPR) is used for more complex inputfrequencies than for just single or two tones. For ACPR, an input bandwidth for a complex signal isdefined, and then the ACPR takes the place of SNR by presenting the ratio of the power in the definedsignal bandwidth to the total power outside of that bandwidth.

The standard TSW1200 user interface software that is installed with the Installation CD uses a suppliedNational Instruments LabVIEW™ run-time engine. This user interface uses drivers to open a com port to aUSB port to communicate with the TSW1200EVM. This communication takes the form of aregister-mapped series of register writes and reads of the TSW1200 hardware. It is possible tocommunicate with the TSW1200 hardware with other software than the supplied TSW1200 user interfaceas long as this other software can open a com port to the USB channel and can perform the register readsand writes to the TSW1200 hardware. One common request for another user interface is MATLAB, as theuser might then want to use their own MATLAB routines to process the data record captured by theTSW1200EVM FIFOs.

Included on the Installation CD for the TSW1200EVM is a directory of files for an alternative MATLABinterface to the TSW1200EVM. This MATLAB code is a functional starting point for communicating withthe TSW1200 hardware and capturing data from a number of TI ADCs. This MATLAB code can beintegrated into a larger portion of MATLAB code of the customer’s own design, or the supplied MATLABcode can be taken as a starting point for a new development. Currently, the supplied MATLAB codesupports data capture from several families of TI data converters: the ADS5481 through ADS5485, theADS6129 and ADS6149, and the ADS62P41 through ADS62P45 and ADS62P21 through ADS62P25.

To use the MATLAB interface, TI recommends that users install the TSW1200 user interface softwareusing the setup.exe command on the Installation CD. This installs the USB drivers that are needed for theVCP (Virtual Com Port) so that the PC recognizes the TSW1200 hardware when the USB cable isplugged in. The MATLAB interface then is able to open the com port to the TSW1200EVM.

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7 Schematics and Bill of Materials

7.1 Schematics+

6V

_IN

6V

_IN

INH

IBIT

+3

.3V

+2

.5V

+1

.2V

+3

.3V

+2.5

V

+1.2

V

VC

C_

BA

NK

5_

AD

J

+1

.8V

VC

C_

BA

NK

5_

AD

J

+6

V

+3

.3V

_U

SB

+6

V

+6

V

+5

VA

DC

+6

V

GN

D

GN

D

GN

DG

ND

GN

DG

ND

GN

DG

ND

GN

DG

ND

GN

DG

ND

GN

DG

ND

GN

D

GN

D

GN

DG

ND

GN

D

GN

DG

ND

GN

D

GN

D

GN

DG

ND

GN

D

+6

V+

3.3

V

GN

D

+3

.3V

_U

SB

+1

.2V

GN

D

GN

D

+3

.3V

_U

SB

GN

D

+3

.3V

_U

SB

+5

VA

DC

VC

C_

BA

NK

5_

AD

J

+6

V+

2.5

V

JP8 default: Short 1-2

J22 default: Shorted

J17 default: OPEN

C8

2

2.2

uF

C8

2

2.2

uF

1 2

C6

4

.01

uF

C6

4

.01

uF

1 2

C2

0

.01u

F

C2

0

.01u

F

1 2

R4

93

3.2

KR

49

33

.2K

C3

31

0u

F1

0%

16

V

C3

31

0u

F1

0%

16

V

1 2

C3

7

.1u

F

C3

7

.1u

F

1 2

J1

4

BA

NA

NA

_JA

CK

_B

LK

J1

4

BA

NA

NA

_JA

CK

_B

LK

C6

7.1

uF

10

%1

6V

C6

7.1

uF

10

%1

6V

1 2

U9

TP

S7

67

50

QP

WP

U9

TP

S7

67

50

QP

WP

GN

D/H

TS

NK

22

NC

317

GN

D3

NC

14

EN

5

IN1

6

NC

28

GN

D/H

TS

NK

511

GN

D/H

TS

NK

11

GN

D/H

TS

NK

39

OU

T1

13

GN

D/H

TS

NK

410

IN2

7R

ES

ET

16

GN

D/H

TS

NK

612

OU

T2

14

FB

/NC

15

NC

418

GN

D/H

TS

NK

719

GN

D/H

TS

NK

820

PW

RP

AD

21

C8

91

0u

F1

0%

16

V

C8

91

0u

F1

0%

16

V

1 2

C3

2.1

uF

10

%1

6V

C3

2.1

uF

10

%1

6V

1 2

C12

.01

uF

C12

.01

uF

1 2

C6

3

.1u

F

C6

3

.1u

F

1 2

C1

9

.1u

F

C1

9

.1u

F

1 2

+

C1

01

47

uF

10

V2

0%

+

C1

01

47

uF

10

V2

0%

C8

4

2.2

uF

C8

4

2.2

uF

1 2

C36

.01u

F

C36

.01u

F

1 2

C7

.1u

F

C7

.1u

F

1 2

+

C1

02

10

uF

16

V1

0%

LO

W E

SR

+

C1

02

10

uF

16

V1

0%

LO

W E

SR

C3

5

.1u

F

C3

5

.1u

F

1 2

R5

9

10

K

R5

9

10

K

U11

TP

S7

67

33

QP

WP

U11

TP

S7

67

33

QP

WP

GN

D/H

TS

NK

22

NC

317

GN

D3

NC

14

EN

5

IN1

6

NC

28

GN

D/H

TS

NK

511

GN

D/H

TS

NK

11

GN

D/H

TS

NK

39

OU

T1

13

GN

D/H

TS

NK

410

IN2

7R

ES

ET

16

GN

D/H

TS

NK

612

OU

T2

14

FB

/NC

15

NC

418

GN

D/H

TS

NK

719

GN

D/H

TS

NK

820

PW

RP

AD

21

C8

.01u

F

C8

.01u

F

1 2

C6

2

.01

uF

C6

2

.01

uF

1 2

+

C5

14

7u

F

10

V2

0%

+

C5

14

7u

F

10

V2

0%

R5

03

0.1

KR

50

30

.1K

U1

2

TP

S7

67

01

QP

WP

U1

2

TP

S7

67

01

QP

WP

GN

D/H

TS

NK

22

NC

317

GN

D3

NC

14

EN

5

IN1

6

NC

28

GN

D/H

TS

NK

511

GN

D/H

TS

NK

11

GN

D/H

TS

NK

39

OU

T1

13

GN

D/H

TS

NK

410

IN2

7R

ES

ET

16

GN

D/H

TS

NK

612

OU

T2

14

FB

/NC

15

NC

418

GN

D/H

TS

NK

719

GN

D/H

TS

NK

820

PW

RP

AD

21

C1

5

.1u

F

C1

5

.1u

F

1 2

C6

1

.1u

F

C6

1

.1u

F

1 2

+

C9

64

7u

F

10

V2

0%

+

C9

64

7u

F

10

V2

0%

R4

51

00

KR

45

10

0K

+C

10

31

0u

F

16

V1

0%

LO

W E

SR

+C

10

31

0u

F

16

V1

0%

LO

W E

SR

R5

11

00

KR

51

10

0K

C60

.01

uF

C60

.01

uF

1 2

C5

9

.1uF

C5

9

.1uF

1 2

C1

8

.01

uF

C1

8

.01

uF

1 2

+

C1

08

10

0u

F1

6V

20

%

+

C1

08

10

0u

F1

6V

20

%

C5

5

.1u

F

C5

5

.1u

F

1 2

+

C9

74

7u

F

10

V2

0%

+

C9

74

7u

F

10

V2

0%

C5

8

.01

uF

C5

8

.01

uF

1 2

C11

.1u

F

C11

.1u

F

1 2

68

OH

M @

10

0M

Hz

FB

11

68

OH

M @

10

0M

Hz

FB

11

68

OH

M @

10

0M

Hz

FB

13

68

OH

M @

10

0M

Hz

FB

13

C5

7

.1u

F

C5

7

.1u

F

1 2

C8

5

.1u

F

C8

5

.1u

F

1 2

C3

0

.01

uF

C3

0

.01

uF

1 2

C8

1

.1u

F

C8

1

.1u

F

1 2

C5

41

0u

F1

0%

16

V

C5

41

0u

F1

0%

16

V

1 2

C4

1

.1u

F

C4

1

.1u

F

1 2

C56

.01u

F

C56

.01u

F

1 2

C1

4

.01

uF

C1

4

.01

uF

1 2

J1

7J1

7

1 2

C2

9

.1u

F

C2

9

.1u

F

1 2

C2

8

.01

uF

C2

8

.01

uF

1 2

C5

0

.01

uF

C5

0

.01

uF

1 2

D1

6

LE

D g

ree

n

+6

VD

16

LE

D g

ree

n

+6

V

C4

5

.1u

F

C4

5

.1u

F

1 2

68

OH

M @

10

0M

Hz

FB

12

68

OH

M @

10

0M

Hz

FB

12

C4

0

.01

uF

C4

0

.01

uF

1 2

C3

9

.1u

F

C3

9

.1u

F

1 2

C2

7

.1u

F

C2

7

.1u

F

1 2

J7

CO

NN

JA

CK

PW

R

J7

CO

NN

JA

CK

PW

R23 1

C1

04

.1u

F

10

%1

6V

C1

04

.1u

F

10

%1

6V

1 2

C1

7

.1u

F

C1

7

.1u

F

1 2

R1

09

30

0

R1

09

30

0

C4

4

.01

uF

C4

4

.01

uF

1 2

C4

3

.1u

F

C4

3

.1u

F

1 2

R5

82

4.3

KR

58

24

.3K

C3

49

10

uF

10

%1

6V

C3

49

10

uF

10

%1

6V

1 2

+

C5

31

0u

F

16

V1

0%

LO

W E

SR

+

C5

31

0u

F

16

V1

0%

LO

W E

SR

C4

9

.1uF

C4

9

.1uF

1 2

C2

6

.01

uF

C2

6

.01

uF

1 2

C1

0

.01

uF

C1

0

.01

uF

1 2

C1

06

10

uF

10

%1

6V

C1

06

10

uF

10

%1

6V

1 2

C42

.01u

F

C42

.01u

F

1 2

+

C1

09

10

0u

F1

6V

20

%

+

C1

09

10

0u

F1

6V

20

%

U1

-5X

C4

VL

X2

5-S

F3

63

-BG

AU

1-5

XC

4V

LX

25-S

F3

63

-BG

A

VC

CO

_0

D10

VC

CO

_0

U11

VC

CO

_1

D7

VC

CO

_1

D14

VC

CO

_2

U7

VC

CO

_3

A9

VC

CO

_2

U14

VC

CO

_3

A12

VC

CO

_4

Y8

VC

CO

_4

Y13

VC

CO

_5

K15

VC

CO

_5

L15

VC

CO

_5

A17

VC

CO

_5

E17

VC

CO

_5

L18

VC

CO

_5

D20

VC

CO

_5

J20

VC

CO

_5

N20

VC

CO

_6

D1

VC

CO

_6

J1

VC

CO

_6

N1

VC

CO

_6

L3

VC

CO

_6

A4

VC

CO

_6

E4

VC

CO

_6

K6

VC

CO

_6

L6

VC

CO

_7

T16

VC

CO

_7

Y18

VC

CO

_7

U20

VC

CO

_8

U1

VC

CO

_8

Y3

VC

CO

_8

T5

GNDB1

GNDW1

GNDY1

GNDY2

GNDG3

GNDP3

GNDC7

GNDH7

GNDJ7

GNDK7

GNDL7

GNDM7

GNDN7

GNDV7

GNDG8

GNDP8

GNDG9

GNDP9

GNDG10

GNDP10

GNDU10

GNDA2

GNDD11

GNDG11

GNDP11

GNDG12

GNDP12

GNDG13

GNDP13

GNDC14

GNDH14

GNDJ14

GNDK14

GNDL14

GNDM14

GNDN14

GNDV14

GNDG18

GNDP18

GNDA19

GNDY19

GNDA20

GNDB20

GNDW20

GNDY20

VR

EF

P_S

MW

14

VR

EF

N_S

MW

15

AV

DD

_S

MW

16

VP

_S

MY

14

VN

_S

MY

15

AV

SS

_S

MY

16

VC

CA

UX

1H

6

VC

CA

UX

2N

6

VC

CA

UX

3F

8

VC

CA

UX

4R

8

VC

CA

UX

5F

13

VC

CA

UX

6R

13

VC

CA

UX

7H

15

VC

CA

UX

8N

15

VC

CIN

T1

G6

VC

CIN

T2

P6

VC

CIN

T3

F7

VC

CIN

T4

G7

VC

CIN

T5

P7

VC

CIN

T6

R7

VC

CIN

T7

F14

VC

CIN

T8

G14

VC

CIN

T9

P14

VC

CIN

T10

R14

VC

CIN

T11

G15

VC

CIN

T12

P15

J2

2J2

2

1 2

R4

81

00

KR

48

10

0K

+

C8

84

7u

F

10

V2

0%

+

C8

84

7u

F

10

V2

0%

C5

21

0u

F1

0%

16

V

C5

21

0u

F1

0%

16

V

1 2

C4

8

.01

uF

C4

8

.01

uF

1 2

C2

5

.1u

F

C2

5

.1u

F

1 2

U1

3

TP

S7

67

33

QP

WP

U1

3

TP

S7

67

33

QP

WP

GN

D/H

TS

NK

22

NC

317

GN

D3

NC

14

EN

5

IN1

6

NC

28

GN

D/H

TS

NK

511

GN

D/H

TS

NK

11

GN

D/H

TS

NK

39

OU

T1

13

GN

D/H

TS

NK

410

IN2

7R

ES

ET

16

GN

D/H

TS

NK

612

OU

T2

14

FB

/NC

15

NC

418

GN

D/H

TS

NK

719

GN

D/H

TS

NK

820

PW

RP

AD

21

U1

5

TP

S7

32

25

-SO

T2

3

U1

5

TP

S7

32

25

-SO

T2

3

EN

3

IN1

GN

D2

OU

T5

NC

/FB

4

U7

TP

S7

30

18

-SO

T2

3

U7

TP

S7

30

18

-SO

T2

3

EN

3

IN1

GN

D2

OU

T5

NC

/FB

4

+

C9

81

0u

F

16

V1

0%

LO

W E

SR

+

C9

81

0u

F

16

V1

0%

LO

W E

SR

68

OH

M @

10

0M

Hz

FB

16

68

OH

M @

10

0M

Hz

FB

16

C9

91

uF

20

%2

5V

C9

91

uF

20

%2

5V

+

C1

05

47

uF

10

V2

0%

+

C1

05

47

uF

10

V2

0%

J1

5B

AN

AN

A_

JA

CK

_R

ED

J1

5B

AN

AN

A_

JA

CK

_R

ED

U1

4

PT

H0

30

00

W

U1

4

PT

H0

30

00

W

GN

D1

Vin

2

INH

IBIT

3V

o_A

DJ

4

Vout

5

C47

.1u

F

C47

.1u

F

1 2

C24

.01

uF

C24

.01

uF

1 2

C1

3

.1u

F

C1

3

.1u

F

1 2

R1

31

00

KR

13

10

0K

C3

4.1

uF

10

%1

6V

C3

4.1

uF

10

%1

6V

1 2

JP

8JP

8

1 32

C4

6

.01

uF

C4

6

.01

uF

1 2C2

3

.1u

F

C2

3

.1u

F

1 2

68

OH

M @

10

0M

Hz

FB

10

68

OH

M @

10

0M

Hz

FB

10

C2

2

.01

uF

C2

2

.01

uF

1 2

C1

6

.01

uF

C1

6

.01

uF

1 2

C1

00

.1u

F

10

%1

6V

C1

00

.1u

F

10

%1

6V

1 2

C6

6

.01

uF

C6

6

.01

uF

1 2

C6

5

.1u

F

C6

5

.1u

F

1 2

C21

.1u

F

C21

.1u

F

1 2C9

.1u

F

C9

.1u

F

1 2

C3

48

10

uF

10

%1

6V

C3

48

10

uF

10

%1

6V

1 2

C3

8

.01

uF

C3

8

.01

uF

1 2

+C

10

71

0u

F

16

V1

0%

LO

W E

SR

+C

10

71

0u

F

16

V1

0%

LO

W E

SR

C3

1.0

1u

FC

31

.01

uF

www.ti.com Schematics and Bill of Materials

Figure 13. Schematic Diagram Page 1

SLAU212A–April 2007–Revised August 2008 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System 23Submit Documentation Feedback

Page 24: TSW1200EVM: High-Speed LVDS Deserializer and Analysis System · User's Guide SLAU212A–April 2007–Revised August 2008 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System

+5

V_

US

B

DM

PU

R

WK

UP

RS

T

VR

EG

EN

SU

SP

CL

KO

UT

/CT

S/D

SR

SIN

/DC

D

RI

GP

IO1

GP

IO2

GP

IO3

GP

IO4

SD

A

SO

UT

DT

RR

TS

/DC

DS

IN/D

SR

GP

IO1

GP

IO2

GP

IO3

GP

IO4

RI

RT

SD

TR

SO

UT/C

TS

DP

X1

X2

+3

.3V

_U

SB

+3

.3V

_U

SB

+3

.3V

_U

SB

+3

.3V

_U

SB

+3

.3V

_U

SB

+3

.3V

_U

SB

+3

.3V

+3

.3V

+3

.3V

RT

SD

TR

SO

UT

GP

IO1

GP

IO3

GP

IO4

GP

IO2

/CT

S/D

SR

SIN

/DC

D

RI

/CT

S/D

SR

SIN /D

CD

GP

IO1

GP

IO2

GP

IO3

GP

IO4

RI

RT

SD

TR

SO

UT

FP

GA

_P

DN

SH

4F

PG

A_

SE

NS

H4

FP

GA

_S

CL

KS

H4

FP

GA

_R

ST

SH

4

FP

GA

_S

DA

TA

SH

4

CH

8-D

13

SH

5

CH

8-D

12

SH

5

CH

8-D

11

SH

5

CH

8-D

8S

H5

CH

8-D

10

SH

5

CH

8-D

9S

H5

CH

8-D

0S

H5

CH

8-D

1S

H5

CH

8-C

LK

OU

TS

H5

CH

8-D

5S

H5

CH

8-D

2S

H5

CH

8-D

3S

H5

CH

8-D

4S

H5

CH

8-D

6S

H5

CH

8-D

7S

H5

24LC32A

Do not installed

Do not installed

Do not installed

R2

31

.5K

R2

31

.5K

SW

4

RE

SE

T

SW

4

RE

SE

T

12

R4

6

1K

R4

6

1K

TP

7T

P7

J1

6J1

61

2

U8

EE

PR

OM

32

K (

4K

x 8

)U

8E

EP

RO

M 3

2K

(4

K x

8)

A1

1

A2

2

A3

3

SD

A5

GN

D4

SC

L6

WP

7V

CC

8

R1

81

00

KR

18

10

0K

L3

1K

@

10

0M

HZ

L3

1K

@

10

0M

HZ

12

R2

53

3 o

hm

R2

53

3 o

hm

C7

72

2p

FC

77

22

pF

C7

82

2p

FC

78

22

pF

R2

4

15

K

R2

4

15

K

Y1

12

MH

z w

/ 1

8p

F

Y1

12

MH

z w

/ 1

8p

F

1 3

2 4

R2

14

.99

KR

21

4.9

9K

R2

23

3K

R2

23

3K

C7

33

3p

FC

73

33

pF

U5

TP

S7

69

33

DB

VT

U5

TP

S7

69

33

DB

VT

EN

3

IN1

GN

D2

OU

T5

NC

/FB

4

R4

3

10

K

R4

3

10

K

C7

41

00

0p

FC

74

10

00

pF

U6

TU

SB

34

10

IVF

U6

TU

SB

34

10

IVF

SO

UT

/IR

_S

OU

T1

9

X1

/CL

KI

27

SC

L11

DT

R*

21

WA

KE

UP

*1

2

RE

SE

T*

9

VDD184

CT

S*

13

SU

SP

EN

D2

DP

6

PU

R5

CL

KO

UT

22

VR

EG

EN

*1

DM

7

GND1818

RT

S*

20

TE

ST

124

DS

R*

14

TE

ST

023

VCC33 S

IN/I

R_

SIN

17

P3

.42

9

SD

A1

0

GND88

P3

.33

0P

3.1

31

P3

.03

2

GND2828

X2

26

RI*

/CP

16

DC

D*

15

VCC2525

U1

-4

XC

4V

LX

25

-SF

36

3-B

GA

U1

-4

XC

4V

LX

25

-SF

36

3-B

GA

IO_

L2

0P

_7

R1

9

IO_

L2

0N

_V

RE

F_

7R

20

IO_

L2

1P

_7

R1

5

IO_

L2

1N

_7

R1

6

IO_

L2

3P

_V

RN

_7

T1

9

IO_

L2

3N

_V

RP

_7

T2

0

IO_

L2

4P

_C

C_

LC

_7

R1

7

IO_

L2

4N

_C

C_

LC

_7

R1

8

IO_

L2

5P

_C

C_

SM

7_L

C_

7T

17

IO_

L2

5N

_C

C_

SM

7_L

C_7

T1

8

IO_

L2

6P

_S

M6

_7

U1

8

IO_

L2

6N

_S

M6

_7

U1

9

IO_

L2

7P

_S

M5

_7

T1

5

IO_

L2

7N

_S

M5

_7

U1

5

IO_

L2

8P

_7

V19

IO_

L2

8N

_V

RE

F_

7V

20

IO_

L2

9P

_S

M4

_7

U1

6

IO_

L2

9N

_S

M4

_7

U1

7

IO_

L3

0P

_S

M3

_7

W18

IO_

L3

0N

_S

M3

_7

W19

IO_

L3

1P

_S

M2

_7

Y17

IO_

L3

1N

_S

M2

_7

W17

IO_

L3

2P

_S

M1

_7

V17

IO_

L3

2N

_S

M1

_N

_7

V18

IO_L

25

P_C

C_

LC

_8

U3

IO_

L2

5N

_C

C_

LC

_8

U2

IO_L

26

P_8

T4

IO_

L2

6N

_8

T3

IO_L

27

P_8

T6

IO_

L2

7N

_8

U6

IO_L

28

P_8

V2

IO_

L2

8N

_V

RE

F_

8V

1

IO_L

29

P_8

U5

IO_

L2

9N

_8

U4

IO_L

30

P_8

W3

IO_

L3

0N

_8

W2

IO_L

31

P_8

Y4

IO_

L3

1N

_8

W4

IO_L

32

P_8

V4

IO_

L3

2N

_8

V3

IO_L

20

P_8

R2

IO_

L2

0N

_V

RE

F_

8R

1

IO_L

21

P_8

R6

IO_

L2

1N

_8

R5

IO_

L2

3P

_V

RN

_8

T2

IO_

L2

3N

_V

RP

_8

T1

IO_L

24

P_C

C_

LC

_8

R4

IO_

L2

4N

_C

C_

LC

_8

R3

R3

8

1K

R3

8

1K

C7

53

3p

FC

75

33

pF

R4

2

33

0

R4

2

33

0

C7

14

.7u

FC

71

4.7

uF

R4

4

10

K

R4

4

10

K

R4

0

33

0

R4

0

33

0

R4

7

1K

R4

7

1K

C7

21

0u

FC

72

10

uF

R2

0

10

K

R2

0

10

K

R1

99

0.9

KR

19

90

.9K

D1

GR

EE

N

D1

GR

EE

N

R4

1

33

0

R4

1

33

0

D2

GR

EE

N

D2

GR

EE

N

D4

GR

EE

N

D4

GR

EE

N

R3

9

33

0

R3

9

33

0

R3

7

1K

R3

7

1K

J8

CO

NN

US

BT

YP

B F

EM J8

CO

NN

US

BT

YP

B F

EM

1 234

R2

63

3 o

hm

R2

63

3 o

hm

SW

5

RE

SE

T

SW

5

RE

SE

T

12

D5

DIO

DE

D5

DIO

DE

D3

GR

EE

N

D3

GR

EE

N

C7

61

uF

C7

61

uF

Schematics and Bill of Materials www.ti.com

Figure 14. Schematic Diagram Page 2

24 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System SLAU212A–April 2007–Revised August 2008Submit Documentation Feedback

Page 25: TSW1200EVM: High-Speed LVDS Deserializer and Analysis System · User's Guide SLAU212A–April 2007–Revised August 2008 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System

PR

OG

_B

TD

I_0

M0

M2

M1

DONE

CE

TD

O_

0

TD

OT

CK

TM

S

TD

I

HS

WA

P_

EN CCLK

BU

SY

PR

OM

RE

SE

T

+3

.3V

+3

.3V

+3

.3V

+3

.3V

+3

.3V

+3

.3V

+1

.8V

+3

.3V

+1

.8V

+3

.3V

+3

.3V

+3

.3V

+3

.3V

+3

.3V

D6

D7

D5

D2

D4

D3

D0D1

D0

D1

D2

D3

D4

D5

D6

D7

CH

7-C

LK

OU

TS

H5

CH

7-D

0S

H5

CH

6-D

1S

H5

CH

6-D

2S

H5

CH

6-D

3S

H5

CH

6-D

4S

H5

CH

6-D

5S

H5

CH

6-D

0S

H5

CH

5-D

3S

H5

CH

5-D

4S

H5

CH

5-D

5S

H5

CH

5-D

6S

H5

CH

5-D

7S

H5

CH

5-D

9S

H5

CH

5-D

10

SH

5C

H5

-D11

SH

5

CH

5-D

12

SH

5C

H5

-D1

3S

H5

CH

5-D

8S

H5

CH

6-C

LK

OU

TS

H5

CH

6-D

7S

H5

CH

6-D

9S

H5

CH

6-D

10

SH

5

CH

6-D

11

SH

5

CH

6-D

6S

H5

CH

6-D

8S

H5

CH

6-D

12

SH

5

CH

6-D

13

SH

5C

H5

-CL

KO

UT

SH

5

CH

5-D

0S

H5

CH

5-D

2S

H5

CH

5-D

1S

H5

CH

7-D

3S

H5

CH

7-D

1S

H5

CH

7-D

2S

H5

CH

7-D

4S

H5

CH

7-D

12

SH

5C

H7

-D1

3S

H5

CH

7-D

5S

H5

CH

7-D

6S

H5

CH

7-D

7S

H5

CH

7-D

8S

H5

CH

7-D

9S

H5

CH

7-D

11

SH

5

CH

7-D

10

SH

5

JTA

G

1.

DEFA

ULT

SET

UP F

OR

J1

AN

D J1

2

SH

ORT 1

AN

D 3

; SH

ORT 2

AN

D 4

2.

PR

OM

CO

NFIG

UR

AT

ION

M0

=M

1=

1SET

UP F

OR

MA

ST

ER

SELEC

T M

AP O

PER

AT

ION

M2

=0

NO

TES:

D7

GR

EE

N

D7

GR

EE

N

R4

10

KR

41

0K

R3

51

00

R3

51

00

R1

0 o

hm

R1

0 o

hm

U2

XC

F3

2P

FS

G4

8U

2X

CF

32

PF

SG

48

D3D5

NC

1A

4

D7

A6

VC

CO

B2

CE

B4

CLKOUTC2

D4C5

CEOD2

GN

DA

1

GN

DA

2

OE

/RE

SE

TA

3

D6

A5

VC

CIN

TB

1

CL

KB

3

D5

B5

GN

DB

6

BUSYC1

NC2C3

NC3C4

VCCOC6

CFD1

NC4D3

NC5D4

VCCOD6

TM

SE

2

VC

CIN

TE

1

NC

7E

4

NC

6E

3

D2

E5

TD

OE

6G

ND

F1

NC

8F

2

NC

10

F4

NC

9F

3

GN

DF

5G

ND

F6

TDIG1

NC11G2

REV_SEL0G3

REV_SEL1G4

VCCOG5

VCCINTG6

GNDH1

VCCJH2

TCKH3

EN_EXT_SELH4

D1H5

D0H6

C4

.1u

F

C4

.1u

F

1 2

R5

5 ZE

RO

R5

5 ZE

RO

R3

20

oh

mR

32

0 o

hm

C1

10

uF

C1

10

uF

C6

.1u

F

C6

.1u

F

1 2

RN

1

4.7

K

RN

1

4.7

K

18273645

C5

.01

uF

C5

.01

uF

1 2

R7

33

0

R7

33

0

C3

.01

uF

C3

.01

uF

1 2

R5

44

9.9

R5

44

9.9

R6

4.7

K

R6

4.7

K

J1

J1

124 3

C2

.1u

F

C2

.1u

F

1 2

SW

2

RE

SE

T

SW

2

RE

SE

T

12

SW

3

PR

OG

RA

M

SW

3

PR

OG

RA

M

12

C8

0

.1u

F

C8

0

.1u

F

1 2

R3

10

oh

mR

31

0 o

hm

R5

34

9.9

R5

34

9.9

U1

0

LV

77

45

DE

V-2

00

MH

z

U1

0

LV

77

45

DE

V-2

00

MH

z

OE

1

NC

2

GN

D3

OU

T4

OU

T5

VC

C6

J1

2J1

2

1 243

R3

6

10

0

R3

6

10

0

C8

7

.1u

F

C8

7

.1u

F

1 2

C7

9

10

uF

C7

9

10

uF

J1

0H

EA

DE

R 3

J1

0H

EA

DE

R 3

123

J2

J2

2 4 6 81

01

21

4

1 3 5 7 9 11

13

C8

6

.1u

F

C8

6

.1u

F

1 2

R3

0 o

hm

R3

0 o

hm

+

C8

3

3.3

uF

+

C8

3

3.3

uF

R5

24

.7K

R5

24

.7K

R2

0 o

hm

R2

0 o

hm

R3

3

1K

R3

3

1K

Q3

DT

C11

4E

ET

1Q

3D

TC

11

4E

ET

1

J11

HE

AD

ER

3J11

HE

AD

ER

3

123

R3

4

1K

R3

4

1K

U1

-1

XC

4V

LX

25

-SF

36

3-B

GA

U1

-1

XC

4V

LX

25

-SF

36

3-B

GA

HS

WA

PE

N_

0E

13

CC

LK

_0

E11

D_IN

_0

E9

CS

_B

_0

E8

INIT

_B

_0

E12

TD

N_

0E

10

RD

WR

_B

_0

F9

TD

P_0

F1

0

DO

NE

_0

F11

PR

OG

_B

_0

F1

2

TD

I_0

R9

TD

O_

0R

10

M2

_0

R11

M0

_0

R1

2

TM

S_

0T

8

TC

K_

0T

9

PW

RD

WN

_B

_0

T1

0

DO

UT

_B

US

Y_

0T

11

M1

_0

T1

2

VB

AT

T_

0T

13

IO_L

1P

_D

31

_L

C_

1F

15

IO_L

1N

_D

30_

LC

_1

E15

IO_L

2P

_D

29

_L

C_

1E

6

IO_L

2N

_D

28_

LC

_1

F6

IO_L

3P

_D

27

_L

C_

1D

15

IO_L

3N

_D

26_

LC

_1

E14

IO_L

4P

_D

25

_L

C_

1E

7

IO_L

4N

_D

24_

VR

EF

_L

C_

1D

6

IO_L

5P

_D

23

_L

C_

1D

13

IO_L

5N

_D

22_

LC

_1

C1

3

IO_L

6P

_D

21

_L

C_

1C

8

IO_L

6N

_D

20_

LC

_1

D8

IO_L

7P

_D

19

_L

C_

1D

12

IO_L

7N

_D

18_

LC

_1

C1

2

IO_L

8P

_D

17

_C

C_

LC

_1

C9

IO_L

8N

_D

16_

CC

_L

C_

1D

9

IO_L

1P

_G

C_C

C_

LC

_3

B12

IO_L

1N

_G

C_

CC

_LC

_3

A11

IO_L

2P

_G

C_V

RN

_L

C_

3A

10

IO_L

2N

_G

C_

VR

P_

LC

_3

B9

IO_L

3P

_G

C_L

C_

3C

11

IO_L

3N

_G

C_

LC

_3

B11

IO_L

4P

_G

C_L

C_

3B

10

IO_L

4N

_G

C_

VR

EF

_L

C_

3C

10

IO_L

5P

_G

C_L

C_

3B

13

IO_L

5N

_G

C_

LC

_3

A13

IO_L

6P

_G

C_L

C_

3A

8

IO_L

6N

_G

C_

LC

_3

B8

IO_L

7P

_G

C_L

C_

3B

14

IO_L

7N

_G

C_

LC

_A

14

IO_L

8P

_G

C_L

C_

3A

7

IO_L

8N

_G

C_

LC

_3

B7

IO_

L1

P_

D1

5_

CC

_L

C_

2V

16

IO_L

1N

_D

14_

CC

_L

C_

2V

15

IO_

L2

P_

D1

3_

LC

_2

V6

IO_

L2

N_

D1

2_

LC

_2

V5

IO_

L3

P_

D11_

LC

_2

T1

4

IO_

L3

N_

D1

0_

LC

_2

U1

3

IO_

L4

P_

D9

_L

C_

2U

8

IO_

L4

N_

D8

_V

RE

F_

LC

_2

T7

IO_

L5

P_

D7

_L

C_

2V

13

IO_

L5

N_

D6

_L

C_

11

V1

2

IO_

L6

P_

D5

_L

C_

2V

9

IO_L

6N

_D

4_

LC

_2

V8

IO_

L7

P_

D3

_L

C_

2U

12

IO_L

7N

_D

2_

LC

_2

V11

IO_

L8

P_

D1

_L

C_

2V

10

IO_L

8N

_D

0_

LC

_2

U9

IO_

L1P

_G

C_L

C_

4W

13

IO_

L1

N_

GC

_L

C_

4W

12

IO_

L2P

_G

C_L

C_

4Y

5

IO_

L2

N_

GC

_L

C_

4W

5

IO_

L3P

_G

C_L

C_

4Y

12

IO_

L3

N_

GC

_L

C_

4Y

11

IO_

L4P

_G

C_L

C_

4Y

6

IO_

L4

N_

GC

_V

RE

F_

LC

_4

W6

IO_

L5P

_G

C_L

C_

4W

11

IO_

L5

N_

GC

_L

C_

4W

10

IO_

L6P

_G

C_L

C_

4Y

7

IO_

L6

N_

GC

_L

C_

4W

7

IO_L

7P

_G

C_

VR

N_

LC

_4

Y1

0

IO_L

7N

_G

C_

VR

P_

LC

_4

Y9

IO_

L8P

_G

C_

CC

_L

C_4

W9

IO_

L8

N_

GC

_C

C_

LC

_4

W8

www.ti.com Schematics and Bill of Materials

Figure 15. Schematic Diagram Page 3

SLAU212A–April 2007–Revised August 2008 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System 25Submit Documentation Feedback

Page 26: TSW1200EVM: High-Speed LVDS Deserializer and Analysis System · User's Guide SLAU212A–April 2007–Revised August 2008 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System

DC

LK

_M

DC

LK

_P

FC

LK

_M

FC

LK

_P

FP

GA

_S

DA

TA

SH

2F

PG

A_

SE

NS

H2

FP

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22

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34

36

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42

43

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45

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50

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55

56

57

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59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

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95

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102

103

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105

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0111

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8119

120

Schematics and Bill of Materials www.ti.com

Figure 16. Schematic Diagram Page 4

26 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System SLAU212A–April 2007–Revised August 2008Submit Documentation Feedback

Page 27: TSW1200EVM: High-Speed LVDS Deserializer and Analysis System · User's Guide SLAU212A–April 2007–Revised August 2008 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System

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13

15

17

19

21

23

25

27

29

31

33

34

35

36

37

38

39

40

RN

12

22 o

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RN

12

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116

215

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512

611

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89

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24

26

28

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13

15

17

19

21

23

25

27

29

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R28 22

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116

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512

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U1-3

XC

4V

LX

25-S

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GA

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XC

4V

LX

25-S

F363-B

GA

IO_L1P

_6

B6

IO_L1N

_6

A6

IO_L2P

_6

A5

IO_L2N

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B5

IO_L3P

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C6

IO_L3N

_6

C5

IO_L4P

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B4

IO_L4N

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F_6

C4

IO_L5P

_6

D5

IO_L5N

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E5

IO_L6P

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IO_L6N

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B3

IO_L7P

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D4

IO_L7N

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IO_L8P

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C_LC

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B2

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C_LC

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C1

IO_L9P

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IO_L9N

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C_LC

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E3

IO_L10P

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C3

IO_L10N

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C2

IO_L11P

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F5

IO_L11N

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F4

IO_L12P

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IO_L12N

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F_6

E2

IO_L13P

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G5

IO_L13N

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G4

IO_L14P

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E1

IO_L14N

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F1

IO_L15P

_6

H5

IO_L15N

_6

H4

IO_L16P

_6

F2

IO_L16N

_6

G2

IO_L17P

_6

J4

IO_L17N

_6

J3

IO_L18P

_6

H1

IO_L18N

_6

G1

IO_L19P

_6

J6

IO_L19N

_6

J5

IO_L20P

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H3

IO_L20N

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F_6

H2

IO_L21P

_6

K5

IO_L21N

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K4

IO_L22P

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K1

IO_L22N

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J2

IO_L23P

_V

RN

_6

L5

IO_L23N

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RP

_6

L4

IO_L24P

_C

C_LC

_6

K3

IO_L24N

_C

C_LC

_6

K2

IO_L25P

_C

C_LC

_6

M4

IO_L25N

_C

C_LC

_6

M3

IO_L26P

_6

M1

IO_L26N

_6

L1

IO_L27P

_6

M6

IO_L27N

_6

M5

IO_L28P

_6

M2

IO_L28N

_V

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F_6

L2

IO_L29P

_6

N5

IO_L29N

_6

N4

IO_L30P

_6

N3

IO_L30N

_6

N2

IO_L31P

_6

P5

IO_L31N

_6

P4

IO_L32P

_6

P2

IO_L32N

_6

P1

R27 22

R27 22

J3

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AD

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MA

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20x2 P

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DA

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J3

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ER

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TA

_O

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12 4 6 8 10

12

14

16

18

20

22

24

26

28

30

32

3 5 7 911

13

15

17

19

21

23

25

27

29

31

33

34

35

36

37

38

39

40

RN

17

22 o

hm

RN

17

22 o

hm

116

215

314

413

512

611

710

89

RN

722 o

hm

RN

722 o

hm

116

215

314

413

512

611

710

89

www.ti.com Schematics and Bill of Materials

Figure 17. Schematic Diagram Page 5

SLAU212A–April 2007–Revised August 2008 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System 27Submit Documentation Feedback

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7.2 Bill of MaterialsSchematics and Bill of Materials www.ti.com

Table 1. Bill of MaterialsQTY Reference Not Part Foot Print Part Number Manufacturer Tol Volt Wat

Installed

3 C1,C72,C79 10 µF 603 ECJ-1VB0J106M Panasonic 20% 6.3V

4 C2,C4,C6,C80 0.1 µF 603 GRM188R71H104KA93D Murata 5% 50V

2 C3,C5 0.01 µF 603 C0603C103K5RACTU Kemet 10% 50V

26 C7,C9,C11,C13, 0.1 µF 201 ECJ-ZEBFJ104K Panasonic 5% 50VC15,C17,C19,C21,C23,C25,C27,C29,C35,C37,C39,C41,C43,C45,C47,C49,C55,C57,C59,C61,C63,C65

26 C8,C10,C12,C1 0.01 µF 201 ECJ-ZEB1A103K Panasonic 5% 50V4,C16,C18,C20,C22,C24,C26,C28,C30,C36,C38,C40,C42,C44,C46,C48,C50,C56,C58,C60,C62,C64,C66

1 C31 0.01 µF 402 ECJ-0EB1E103K Panasonic 10% 25V

1 C32 0.1 µF 402 ECJ-0EB1C104K Panasonic 10% 16V

11 C33,C52,C53,C 10uF 1206 Panasonic 10% 16V89,C98,C102,C ECJ-3YB1C106K103,C106,C107,C348,C349

4 C34,C67,C100, 0.1 µF 402 Panasonic 10% 16VC104 ECJ-0EB1C104K

5 C51,C88,C96,C 47 µF tant_b Kemet T494B476M010AS 20% 10V101,C105

1 C54 10 µF 1206 ECJ-3YB1C106K Panasonic 10% 16V

1 C71 4.7 µF 603 GRM188F51A475ZE20D Murata 0.6 10V

0 C73,C75 Not 33 pF 603 GRM1885C2A330JA01D Murata 5% 100VInstalled

1 C74 1000 pF 603 ECJ-1VB1H102K Panasonic 10% 50V

1 C76 1 µF 603 ECJ-1VB1A105K Panasonic 10% 10V

2 C77,C78 22 pF 603 GRM1885C2A220JA01D Murata 5% 100V

2 C81,C85 0.1 µF 603 ECJ-1VB1H104K Panasonic 10% 50V

2 C82,C84 2.2 µF 603 ECJ-1VB1A225K Panasonic 10% 10V

1 C83 3.3 µF TANT_B TAJB335K016R AVX 10% 16V

2 C86,C87 0.1 µF 603 GRM188R71H104KA93D Murata 10% 50V

1 C97 47 µF tant_b T494B476M010AS Kemet 20% 10V

1 C99 1 µF 603 ECJ-1V41E105M Panasonic 20% 25V

2 C108,C109 100 µF smd_cap_elec_TCE EEE-TG1C101P Panasonic 20% 16V

5 D1–D4, D7 Green diode_0805 DC1112H-TR Stanley

1 D5 Diode SOT23_DIODE BAS21TA Zetec Inc.

1 D16 LED green LED_0805 LNJ306G5UUX Panasonic

5 FB10–FB13, 68 Ω at 100 MHz 1206 EXC-ML32A680U PanasonicFB16

1 JP8 Header 3 POS 0.1 CTR JUMPER3 HTSW-103-07-F-S Samtec Short pins 1-2 with shuntconnector DigiKey #S9000-ND

2 J1,J12 Header 2X2 hdr2X2_100ctr_alt 90131-0122 Molex Short pins with shuntconnector DigiKey #S9000-ND (as shown onsilkscreen)

1 J2 CONN 7x2 CON_2X7_2mm_M 87831-1420 Molex

4 J3–6 Header male 20x2 POS CON20X2_100ctr_M_tsw1100_ HTSW-120-07-L-D Samtec0.100 VERT mate

1 J7 CONN JACK PWR PWRJACK RAPC722 Switchcraft

1 J8 CONN USB TYP B FEM conn_usb_typb_fem 897-43-004-90-000 Milmax

1 J9 CONN_QSH_30X2-D-A conn_QSH_30X2-D-A QSH-060-01-F-D-A Samtec

2 J10, J11 Header 3 jumper3 22-28-4030 Molex Short pins 1-2 with shuntconnector DigiKey #S9000-ND

28 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System SLAU212A–April 2007–Revised August 2008Submit Documentation Feedback

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www.ti.com Schematics and Bill of Materials

Table 1. Bill of Materials (continued)QTY Reference Not Part Foot Print Part Number Manufacturer Tol Volt Wat

Installed

1 J14 BANANA_JACK_BLK banana_jack ST-351B BLK AlectronConnectors

1 J15 BANANA_JACK_RED banana_jack ST-351B RED AlectronConnectors

2 J16,J22 Header 2 JUMPER2 22-28-4020 Molex Short pins with shuntconnector DigiKey #S9000-ND

1 J17 Header 2 JUMPER2 22-28-4020 Molex

4 J18–J21 HDR 16X2 MALE CON16X2_100ctr_M_alt TSW-116-07-L-D SAMTEC0.100CTR

0 L3 Not 1K at 100 MHz smd_0805 BLM21AG102SN1D MurataInstalled

1 Q3 DTC114EET1 sc75 DTC114EET1 On Semi

1 RN1 4.7K RNET4_8_0603 EXB-V8V472JV Panasonic 5%

16 RN2–RN17 22 Ω rnet8_16_0603 742C163220JTR CTS 5% 0.063W

5 R1–R3,R31,R32 0 Ω 603 ERJ-3GEY0R00V Panasonic 5% 1/10W

5 R4,R20,R43,R4 10K 603 ERJ-3EKF1002V Panasonic 1% 1/10W4,R59

1 R6 4.7K 603 ERJ-3GEYJ472V Panasonic 5% 1/10W

5 R7,R39, 330 603 RC0603FR-07330RL YageoR40–R42

3 R13,R48,R51 100K 603 ERJ-3EKF1003V Panasonic 1% 1/10W

1 R18 100K 603 ERJ-3EKF1003V Panasonic 1% 1/10W

1 R19 90.9K 603 ERJ-3EKF9092V Panasonic 1% 1/10W

1 R21 4.99K 603 ERJ-3EKF4991V Panasonic 1% 1/10W

1 R22 33K 603 RC0603FR-0733KL Yageo 1% 1/10W

1 R23 1.5K 603 ERJ-3EKF1501V Panasonic 1% 1/10W

1 R24 15K 603 ERJ-3EKF1502V Panasonic 1% 1/10W

2 R25,R26 33 Ω 603 RC0603FR-0733RL Yageo 1% 1/10W

8 R27–R30, 22 603 RC0603FR-0722RL Yageo 1% 1/10WR60–R63

6 R33,R34,R37,R 1K 603 ERJ-3EKF1001V Panasonic 1% 1/10W38,R46,R47

2 R35,R36 100 603 ERJ-3EKF1000V Panasonic 1% 1/10W

1 R45 100K 603 ERJ-3EKF1003V Panasonic 1% 1/10W

1 R49 33.2K 603 ERJ-3EKF3322V Panasonic 1% 1/10W

1 R50 30.1K 603 ERJ-3EKF3012V Panasonic 1% 1/10W

1 R52 4.7K 603 ERA-V15J472V Panasonic 5% 1/16W

2 R53,R54 49.9 603 ERJ-3EKF49R9V Panasonic 1% 1/10W

0 R55 Not Zero 603 ERJ-3GEY0R00V Panasonic 5% 1/10WInstalled

1 R58 24.3K 603 ERJ-3EKF2432V Panasonic 1% 1/10W

1 R109 300 603 ERJ-3EKF3000V Panasonic

1 SW2 Reset SW_RESET_PTS635 PTS635SL43 ITT Industries/C&KDiv

3 SW3,SW4,SW5 Program SW_RESET_PTS635 PTS635SL43 ITT Industries/C&KDiv

1 TP7 T POINT R testpoint 5002 Keystone

1 U1 XC4VLX25-SF363-BGA MBGA_PT8MM_363 XC4VLX25-SF363-BGA Xilinx TI Provide-11C

1 U2 XCF32P/FSG48 MBGA_FS48_PT8MM XCF32PFSG48 Xilinx TI Provide

1 U5 TPS76933DBVT dbv5 TPS76933DBVT TI TI Provide

1 U6A TUSB3410IVF pqfp32 TUSB3410IVF TI TI Provide

1 U7 TPS73018-SOT23 DBV5 TPS73018DBVT TI TI Provide

1 U8 EEPROM 32K (4K x 8) DIP8_3 24LC32A-I/P Microchip

1 XU8 Socket, dip 8 DIP8_3 ED58083-ND DigiKey

1 U9 TPS76750QPWP HTSSOP_20_260x177_26_pwr TPS76750QPWP TI TI Providepad

1 U10 LV7745DEV-200MHz SMD_XTAL_7X5MM_6PIN LV7745DEV-200MHz Pletronics

2 U11,U13 TPS76733QPWP HTSSOP_20_260x177_26_pwr TPS76733QPWP TI TI Providepad

SLAU212A–April 2007–Revised August 2008 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System 29Submit Documentation Feedback

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8 Circuit Board Layout and Layer Stackup

Circuit Board Layout and Layer Stackup www.ti.com

Table 1. Bill of Materials (continued)QTY Reference Not Part Foot Print Part Number Manufacturer Tol Volt Wat

Installed

1 U12 TPS76701QPWP HTSSOP_20_260x177_26_pwr TPS76701QPWP TI TI Providepad

1 U14 PTH03000W SMD_PWRMOD_EUT5 PTH03000WAS TI TI Provide

1 U15 TPS73225-SOT23 DBV5 TPS73225DBVT TI TI Provide

1 Y1 12MHz w/ 18pF smd_xtal_AMB3B ABM3B-12.000MHZ-10-1- AbraconU-T

4 Screw 4-40 X 3/8" PMS 440 0038 PH Building Fasteners PCBlegs

4 Standoff RD 4-40 THR 1846 Keystone0.875" ALUM

Figure 18. TSW1200C Layout Top Layer

30 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System SLAU212A–April 2007–Revised August 2008Submit Documentation Feedback

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www.ti.com Circuit Board Layout and Layer Stackup

Figure 19. TSW1200C Layout Layer Two

SLAU212A–April 2007–Revised August 2008 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System 31Submit Documentation Feedback

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Circuit Board Layout and Layer Stackup www.ti.com

Figure 20. TSW1200C Layout Power Plane

32 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System SLAU212A–April 2007–Revised August 2008Submit Documentation Feedback

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www.ti.com Circuit Board Layout and Layer Stackup

Figure 21. TSW1200C Layout Ground Plane

SLAU212A–April 2007–Revised August 2008 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System 33Submit Documentation Feedback

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Circuit Board Layout and Layer Stackup www.ti.com

Figure 22. TSW1200C Layout Layer 5

34 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System SLAU212A–April 2007–Revised August 2008Submit Documentation Feedback

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www.ti.com Circuit Board Layout and Layer Stackup

Figure 23. TSW1200C Layer 6

SLAU212A–April 2007–Revised August 2008 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System 35Submit Documentation Feedback

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Circuit Board Layout and Layer Stackup www.ti.com

Figure 24. TSW1200C Bottom Layer

36 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System SLAU212A–April 2007–Revised August 2008Submit Documentation Feedback

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www.ti.com Circuit Board Layout and Layer Stackup

Figure 25. Circuit Board Stackup

SLAU212A–April 2007–Revised August 2008 TSW1200EVM: High-Speed LVDS Deserializer and Analysis System 37Submit Documentation Feedback

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EVALUATION BOARD/KIT IMPORTANT NOTICETexas Instruments (TI) provides the enclosed product(s) under the following conditions:This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSESONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must haveelectronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be completein terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmentalmeasures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit doesnot fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling(WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives.Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days fromthe date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYERAND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OFMERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claimsarising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and allappropriate precautions with regard to electrostatic discharge.EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANYINDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents orservices described herein.Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. Thisnotice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/orsafety programs, please contact the TI application engineer or visit www.ti.com/esh.No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, orcombination in which such TI products or services might be or are used.

FCC WarningThis evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSESONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radiofrequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which aredesigned to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments maycause interference with radio communications, in which case the user at his own expense will be required to take whatever measures maybe required to correct this interference.

EVM WARNINGS AND RESTRICTIONSIt is important to operate this EVM within the input voltage range of -0.3 V to 7 V and the output voltage range of -0.3 V to 3.8 V.Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questionsconcerning the input range, please contact a TI field representative prior to connecting the input power.Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification,please contact a TI field representative.During normal operation, some circuit components may have case temperatures greater than 25°C. The EVM is designed to operateproperly with certain components above 50°C as long as the input and output ranges are maintained. These components include but arenot limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identifiedusing the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation,please be aware that these devices may be very warm to the touch.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2008, Texas Instruments Incorporated

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IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDSP dsp.ti.com Broadband www.ti.com/broadbandClocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrolInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Military www.ti.com/militaryPower Mgmt power.ti.com Optical Networking www.ti.com/opticalnetworkMicrocontrollers microcontroller.ti.com Security www.ti.com/securityRFID www.ti-rfid.com Telephony www.ti.com/telephonyRF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/video

Wireless www.ti.com/wireless

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2008, Texas Instruments Incorporated


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