Tunable Antenna for Mobile Devices - ChipDesignchipdesign.be/SDRA.pdf · 2014-08-09 · Overview...

ChipDesign B.V.B.A. Slide 1

Tunable Antenna for Mobile Devices

Koen Van Caekenberghe, Ph.D.ChipDesign B.V.B.A.

E-Mail: [email protected]: +32484836572

Laurena Lau, MBATransceive

E-Mail: [email protected]: +31646441988

August 9, 2014

Overview


Overview


Overview

Tunable Antenna for Mobile DevicesProblemSolutionMeasurementsUnique Selling PropositionBusiness ModelFuture Developments

ChipDesignIntroductionServices and Turn-Key SolutionsProducts

Tunable Antenna for Mobile Devices


Problem


The 700 to 2600 MHz frequency band will be used by ever more mobile devices (up to 50 billion by the end ofthe decade according to forecasts), as it will remain the sweet spot in the frequency spectrum for wide areacoverage macro cells due to the optimal propagation loss in the light of frequency reuse [1,2]. The capacity ofthe cellular networks has to be increased through:

An increase in the number of cells, albeit at the expense of rising infrastructure deployment cost and powerconsumption

An increase in the used spectrum per cell - i.e. the number of frequency bands per base transceiver station(As of 4G, there are 41 and counting frequency bands licensed in the 400 MHz to 3.8 GHz band.). Thistechnique however requires multi-band support at the smartphone side as well.

In addition, solutions are necessary to reduce the ACLR and the efficiency of the transmitter, the EVM of thereceiver, and the overall footprint (=cost!) of the antenna, front-end module and transceiver. Indeed, without areduction in ACLR, the network will become unreliable as more mobile connections will be interrupted ordropped, due to increasing interference. In addition, the inter-band CA and the MIMO technique, which aretouted to improve the data rate, will require more complex front-end modules. The MIMO technique inparticular requires multiple antennas, front-end modules and transceivers per mobile device, and therefore also asmaller footprint per antenna, front-end module and transceiver, as well as improved efficiency, in order tomaintain the current battery autonomy and to prevent sleek mobile device designs from becoming overheated.

State-of-the-art duplexers and power amplifiers, and to a lesser extent antennas, are frequency band-specificcomponents - i.e. they are neither ultra-wideband nor frequency-tunable. Given the ever-increasing number ofcellular communication frequency bands to be supported and hence the higher part count, it should be clear thata tunable approach reduces BOM cost.

Solution


The tunable antenna for mobile devices consists of a low-profileelectronically-tunable electrically-small (18.5 cm long) slot antenna [3–7],which allows for improved receiver selectivitya.

– Band coverage: Matched (|S11| < -10 dB, VSWR < 1.9) frequencybands are the 700 MHz, 866 MHz (ISM), 900 MHz, 1227 MHz (GPSL2), 1800 MHz, 1900 MHz, 2100 MHz, and 2450 MHz (ISM) band. Forthe cellular bands, the full TX band, the duplex gap, and the full RXband are covered, allowing contiguous and non-contiguous intra-bandCA with an instantaneous bandwidth up to 100 MHz, if applicable.

– Directivity: The full-space radiating version is recommended for IoTdevices and tablets, whereas half-space radiating version, currentlyunder development, is recommended for smartphones in order to meetthe SAR specification.

– Efficiency: TBD. The bandwidth and efficiency of electrically-smallantennas with sufficient instantaneous bandwidth are bounded by theChu-Harrington limit.

– Tunable elements: 3 RF varactor diodes integrated in the radiatingaperture for improved antenna match tuning. The tuning time islimited by the RC constant of the low pass filter on the PWM outputs.The RF varactor diodes do generate spurious emission.

aUWB antennas [8], such as the log-periodic and the Archimedean spiral antenna, are electrically-largeand therefore do not allow for MIMO on the handset, and offer no selectivity.

Figure 1: A tunable antennafor mobile devices with metalcase. The 50 Ω coax con-nector is a Hirose U.FL. TheDC blocking capacitors aremuRata X5R ceramic capac-itors. The tuning elementsare Skyworks SMV1247 var-actor diodes.

Measurements


Figure 2: Measurement setup: Rigol 850DSA TGspectrum analyzer with tracking generator, RigolVB1020 VSWR bridge, Minicircuits ZNBT-60-1W+bias tee, N to U.FL adapter, Arduino Due with tun-able antenna shield. The frequency band can be pro-grammed using three PWM outputs of Arduino ormbed micro-controller boards.

Listing 1: Arduino sketch1 // Ardu ino C ske t ch f o r the Ch ipDes ign SDR Antenna ( L a t e s t

v e r s i o n : h t tp : //www. c h i p d e s i g n . be )//// The Ch ipDes ign SDR antenna can be mounted on Ardu ino Uno

micro−c o n t r o l l e r compat i b l e4 // board s and can be powered and i n t e r f a c e d ov e r USB u s i n g

any programming language// suppo r t ed by the Ardu ino p l a t f o rm . The v a r a c t o r s a r e

connected to the low−pas s f i l t e r e d// PWM ouput p i n s 3 , 5 , and 6 o f the Ardu ino p l a t f o rm .

Us ing the ana logWr i t e ( ) f u n c t i o n , the7 // r e v e r s e b i a s v o l t a g e o f the v a r a c t o r s can be s e t between

0 and 5 V.//// I n a d d i t i o n to C, f o l l o w i n g ( g r a p h i c a l ) programming

l anguage s a r e a l s o suppo r t ed :10 // Labview : h t tp : // s i n e . n i . com/ n i p s / cds / v iew /p/ l ang /en/ n i d

/209835// Mathematica : h t tp : // p layg round . a rdu i n o . cc / I n t e r f a c i n g /

Mathematica// MATLAB: h t tp : //www. mathworks . n l / ma t l a b c e n t r a l /

f i l e e x c h a n g e /32374−matlab−support−package−f o r−ardu ino−−aka−a rdu i n o i o−package−

13 // Python : h t tp : // p layg round . a rdu i n o . cc / I n t e r f a c i n g /Python

// RF Varac t o r Diode B i a s i n g16 cons t i n t v a r a c t o r L e f t P i n = 3 ;

cons t i n t varac to rTopPin = 5 ;cons t i n t v a r a c t o rR i g h tP i n = 6 ;

19i n t v a r a c t o r L e f t V a l u e = 255 ;i n t varac to rTopVa lue = 255 ;

22 i n t v a r a c t o rR i g h tVa l u e = 255 ;i n t s e tVa l u e = 1 ;

25 // USB Communication//// echo ”∗IDN?” > /dev /ttyACM0. . .

Measurements


Figure 3: The tunable antenna can be programmed through the Arduino Serial Monitor (select Newline). Thereverse bias voltage of the three varactor diodes can be set by keying in 3 numbers between 0 and 255. In addition,following SCPI commands can be sent: *IDN?, FREQ:700, FREQ:866, FREQ:900, FREQ:1227, FREQ:1800,FREQ:1900, FREQ:2100, FREQ:2450, MAXIMUM REVERSE BIAS, SWEEP. The SWEEP program is run bydefault.

Measurements


-25

-20

-15

-10

-5

0

0.5 1 1.5 2 2.5 3

S11 [dB]

700 MHz

-25

-20

-15

-10

-5

0

0.5 1 1.5 2 2.5 3

866 MHz (ISM)

-25

-20

-15

-10

-5

0

0.5 1 1.5 2 2.5 3

900 MHz

-25

-20

-15

-10

-5

0

0.5 1 1.5 2 2.5 3

S11 [dB]

1227 MHz (GPS L2)

-25

-20

-15

-10

-5

0

0.5 1 1.5 2 2.5 3

1575 MHz (GPS L1)

-25

-20

-15

-10

-5

0

0.5 1 1.5 2 2.5 3

1800 MHz

-25

-20

-15

-10

-5

0

0.5 1 1.5 2 2.5 3

S11 [dB]

Freq. [GHz]

1900-2100 MHz

-25

-20

-15

-10

-5

0

0.5 1 1.5 2 2.5 3

Freq. [GHz]

2450 MHz (ISM)

-25

-20

-15

-10

-5

0

0.5 1 1.5 2 2.5 3

Freq. [GHz]

2600 MHz

Figure 4: The tunable antenna fully supports 7 bands:700 MHz, 866 MHz (ISM), 900 MHz, 1227 MHz (GPSL2), 1800 MHz, 1900 MHz, 2100 MHz, 2450 MHz(ISM). Unfortunately, it does not support the 1575MHz GPS L1 and the 2600 MHz band.

j200

-j200

j100

-j100

j75

-j75

j50

-j50

j35

-j35

j25

-j25

j12.5

-j12.5

2001007550352512.5

1

1) 0.7 GHz

39.12 Ω

8.59j Ω

Figure 5: FREQ:700: The tunable antenna is matched@ 700 MHz.

Measurements


j200

-j200

j100

-j100

j75

-j75

j50

-j50

j35

-j35

j25

-j25

j12.5

-j12.5

2001007550352512.5

1

1) 0.866 GHz

70.67 Ω

10.76j Ω


j200

-j200

j100

-j100

j75

-j75

j50

-j50

j35

-j35

j25

-j25

j12.5

-j12.5

2001007550352512.5 1

1) 0.9 GHz

74.24 Ω

-4.11j Ω


Measurements


j200

-j200

j100

-j100

j75

-j75

j50

-j50

j35

-j35

j25

-j25

j12.5

-j12.5

2001007550352512.5

1

1) 1.227 GHz

35.92 Ω

-11.09j Ω

Figure 8: FREQ:1227: The tunable antenna ismatched @ 1227 MHz.

j200

-j200

j100

-j100

j75

-j75

j50

-j50

j35

-j35

j25

-j25

j12.5

-j12.5

2001007550352512.5 1

1) 1.8 GHz

63.16 Ω

2.94j Ω


Measurements


j200

-j200

j100

-j100

j75

-j75

j50

-j50

j35

-j35

j25

-j25

j12.5

-j12.5

2001007550352512.5

1

1) 1.9 GHz

37.84 Ω

-6.78j Ω

2

2) 2.1 GHz

61.51 Ω

1.32j Ω

Figure 10: FREQ:1900 or FREQ:2100: The tunableantenna is matched @ 1900 MHz & 2100 MHz.

j200

-j200

j100

-j100

j75

-j75

j50

-j50

j35

-j35

j25

-j25

j12.5

-j12.5

2001007550352512.5

1

1) 2.45 GHz

30.77 Ω

-8.24j Ω


Unique Selling Proposition


This tunable antenna is an on-demand reconfigurable multifunctional antenna, supporting 2G/3G/4G cellularcommunications, 866 MHz RFID tag reading, DVB-H (L-band) broadcast reception, GPS (L2) navigation,and 2.45 GHz WLAN/WPAN (Bluetooth, ZigBee) connectivity.

It will raise the bar in

– Cost:

⊲ Part count reduction to 3 identical tunable antennas per mobile device to allow for concurrent cellularcommunication, GPS navigation, as well as WLAN/WPAN connectivity. The use of identical antennasimplies a single SKU.

⊲ It enables the use of low cost FR4 substrate through the electronic compensation of its dielectricconstant and thickness variations.

⊲ Product development cycle time reduction through the electronic compensation of the battery, caseand screen coupling effects.

– Performance: A single tunable antenna can be made larger than the antennas of a multi-antenna cellularantenna solution and will therefore have a larger bandwidth and/or higher efficiency, as theChu-Harrington limit upper-bounds the bandwidth and the efficiency specifications by the volumespecification. Higher efficiency allows lower EVM and an increase in data rate.

It furthermore enables:

– A further increase in data rate through inter-band CA and MIMO (A second tunable antenna can bereconfigured on-demand as either a second cellular antenna for inter-band CA or a cellular/WLANdiversity antenna for MIMO)

Unique Selling Proposition: Multifunctional Antenna


Figure 12: Aerospace & defense example: The USNavy Integrated Topside (InTop) concept is an in-tegrated, multifunctional (communication, electronicwarfare, radar), multibeam topside aperture constructthat has a modular, open RF architecture; software-defined functionality; and synchronization and opti-mization of RF functions for EMI mitigation [9].

Figure 13: Automotive & transportation example:Video surveillance and signal control, as well as pas-senger information, localisation and passenger count-ing systems represent the state-of-the-art in transportvehicles. Services such as satellite localisation, mobilecommunications (GSM, UMTS, LTE), WiFi, FM ra-dio, as well as TETRA and DVB-T are used for thispurpose. HUBER+SUHNER offers a product platformthat has been especially adapted to these applicationsand provides up to four antennas in one [aerodynamicshark fin] housing [10].

Business Model


Up-front license fee: Upon request, ChipDesign transfers the design (CadSoft Eagle files) for an up frontlicense fee and offers design services to tailor the device.

Services & Turn-Key Solutions:

– 2 Weeks of on-site teaching tunable electrically short antenna fundamentals with the customer’s 3Dcomputational EM tool of choice.

– Addition of an AMT [11] and a VSWR meter, and firmware for automatic tuning

– Addition of a diversity antenna for MIMO

– Integration of the antenna in the customer’s mobile device housing (case)

– SAR Reduction to below FCC requirement for mobile phones of 1.6 mW/g

– Upgrade to microwave laminate with low-loss tangent

– Upgrade to higher-Q and more linear tunable elements (RF MEMS, SOI/SOS digitally tunablecapacitors)

– Upgrade of tuning range (GPS (L1), 2600 MHz)

To do:

– Verify coverage of the DVB-H L-band and the SDARS band

– Efficiency and radiation pattern measurements

Future Developments


Rev. 1 for IoT devices & tablets (current version):

– Measurement of efficiency and radiation patterns

– Verification of DVB-H L-band coverage

Rev. 1 for smartphones:

– Development of half-space radiating Rev. 1 version

Rev. 2 for IoT devices & tablets:

– Development of a smaller tunable antenna, which also allows for faster and more linear tuning.

Rev. 2 for smartphones:

– Development of half-space radiating Rev. 2 version

References


[1] A. Bleicher, “4G gets real,” Spectrum, IEEE, vol. 51, no. 1, pp. 38–62, January 2014.

[2] (2013) Spectrum for 5G - a big deal? KTH. [Online]. Available:http://zandercom.com/wordpress/wp-content/uploads/ETSI Summit Zander.pdf

[3] D. F. Sievenpiper, “RF MEMS-tuned slot antenna and a method of making same,” U.S. Patent 6,864,848, September 7, 2002.

[4] R. J. Hill, R. W. Schlub, and R. Caballero, “Multiband handheld electronic device slot antenna,” U.S. Patent 8 665 164, November 19, 2008.

[5] Z. Zhang, R. J. Hill, R. W. Schlub, J. Zavala, and R. Caballero, “Hybrid antennas with directly fed antenna slots for handheld electronicdevices,” U.S. Patent 7 551 142, December 13, 2007.

[6] K. Van Caekenberghe and et al., “A 2-bit Ka-band RF MEMS frequency tunable slot antenna,” IEEE Antennas Wireless Propagat. Lett., vol. 7,pp. 179–182, 2008.

[7] C. Rowell and E. Lam, “Mobile-phone antenna design,” IEEE Antennas Propagat. Mag., vol. 54, no. 4, pp. 14–34, Aug 2012.

[8] B. Chiang, G. A. Springer, D. B. Kough, E. Ayala, and M. I. McDonald, “Microslot antennas for electronic devices,” U.S. Patent 8 373 610,December 18, 2007.

[9] (2012) Innovative naval prototype: Integrated topside. Office of Naval Research. [Online]. Available:http://www.onr.navy.mil/Media-Center/Fact-Sheets/Integrated-Topside-INTOP.aspx

[10] (2014) SENCITY Road Multifunction Antenna. Huber+Suhner. [Online]. Available:http://www.hubersuhner.com/en/Products/Radio-Frequency/Antennas

[11] A. van Bezooijen, M. A. de Jongh, C. Chanlo, L. C. H. Ruijs, F. van Straten, R. Mahmoudi, and A. H. M. van Roermund, “AGSM/EDGE/WCDMA adaptive series-LC matching network using RF-MEMS switches,” IEEE J. Solid-State Circuits, vol. 43, no. 10, pp.2259–2268, Oct. 2008.

http://zandercom.com/wordpress/wp-content/uploads/ETSI_Summit_Zander.pdf

http://www.onr.navy.mil/Media-Center/Fact-Sheets/Integrated-Topside-INTOP.aspx

http://www.hubersuhner.com/en/Products/Radio-Frequency/Antennas

ChipDesign


ChipDesign


ChipDesign BVBA is a private LLC according toBelgian law with VAT registration number:BE0501.767.340, founded in 2012. ChipDesignis located at Kapellelaan 302, 1860 Meise,Belgium.ChipDesign offers:

Services & turn-key solutions

– ASIC design services

– Device and process modeling services

– Turn-key RF solutions

Open-source software

– NF2FF

– rfMaxima

– Verilog-A large-signal RF MEMS modellibrary

ChipDesign is owned by Koen Van Caekenberghe

Education:

– 10/97-07/02:Burgerlijk elektrotechnisch ingenieur (cum laude)Katholieke Universiteit Leuven, Belgium

– 05/03-05/07:Ph.D. in electrical engineering (GPA 8.0/9.0)University of Michigan, Ann Arbor, MIMajor: applied electromagnetics and RF circuitsDissertation title: RF MEMS technology formillimeter-wave radar sensors

Experience:

– Consulted for HiSilicon, Infineon, NXP and startups.

Contact details:

– Cell: +32484836572

– E-mail: [email protected]

ChipDesign’s Services and Turn-Key Solutions


ChipDesign offers front-to-back mixed-signal / RFIC design services in triple-well bulk and twin-well PD- andFD-SOI/SOS CMOS processes (interested in FinFET), covering ASIC specification, design, layout, functionalverification, packaging and characterization:

– ASIC specification: performance versus power trade-off and partitioning across building blocks(Mathworks MATLAB & Simulink, Verilog-AMS, wxMaxima)

– ASIC design:

⊲ Analog/RF: passive (antenna matching tuner, attenuator, (TTD) phase shifter, SPNT switch,transformer) and active (image-reject mixer, multiplier, LNA, PA, VCO) design. Analysis of non-linearcircuits (HB, and (Q)PSS solvers) (Agilent GoldenGate, Cadence Spectre/RF, interested in MentorGraphics Eldo and Synopsys HSPICE).

⊲ Digital: design (Verilog, VHDL) and synthesis (Cadence RTL Compiler, interested in Mentor GraphicsModelSim and Synopsys Design Compiler). Interested in integration of CPU (ARM Cortex-A), DSP(CEVA), GPU (Imagination), MCU (ARM Cortex-M), and serial I/O interface IP cores (DigRF, RFFE,SPMI) in ASICs (Cadence SoC Encounter).

⊲ EM: differential equation methods (FDTD, FEM), integral equation methods (TDIE,MoM/MLFMM). Interested in domain decomposition methods.

⊲ Mixed-signal: DAC (charge sharing, current steering), DDS, and PLL (PFD/CP, programmabledivider, sigma/delta modulator) design. Interested in ADC and ADPLL design (BDA AFS, CadenceUltraSim).

⊲ Power management: AC-DC (voltage multiplier) and DC-DC (buck, boost, Dickson charge pump)converters, linear regulators (LDO, series), and voltage references (band gap).



Front-to-back mixed-signal / RF IC design services (continued):

– ASIC layout verification using DRC/LVS, parasitic extraction (Cadence Assura, Mentor Graphics Calibre),and EM simulation (Agilent Momentum, Ansys HFSS, CST Microwave Studio, Integrand EMX, Sonnet).IC yield optimization using foundry-supplied PCM data-based Monte Carlo and process corners simulationof extracted views.

– RF IC floor planning (ESD protection, micro-bumps / pad ring, RF grounding) and RF IC packaging(DVN/QFN, WLCSP) and signal integrity analysis of PCB designs.

– Mixed-signal ASIC functional verification using Verilog-AMS and digital ASIC/FPGA functionalverification using SystemVerilog and UVM (Cadence Incisive).

– On-wafer ASIC characterization, incl. large-signal S-parameter, noise (NF, phase noise), and non-linearmeasurements (ACPR, CSO, CTB, IP3, P1dB, XMOD). ASIC debugging (FIB).

– Electronic design automation using Agilent AEL, Ansys VBScript, Cadence OCEAN, Python, ROD andSKILL, and Tcl.

ChipDesign provides device and process modeling (Silvaco TCAD, Verilog-A) and characterization (AgilentIC-CAP) services:

– III-V compound semiconductor (D/E-mode GaAs pHEMT, interested in GaN HEMT and InSb DHBT)and silicon-based (SiGe:C HBT) semiconductor devices

– Capacitive MEMS and piezoelectric devices (accelerometers, gyroscopes, inertial measurement units,microphones, resonators (incl. quartz crystal, SAW and BAW resonators), switches)



ChipDesign also offers turn-key RF solutions tocustomers. Examples include:

– Antennas and antenna arrays

– ASIC packages (BGA/LGA, DVN/QFN, SOT,WLCSP)

– FPGA design

– Class A through S PAs based on GaN orLDMOS transistors, incl. tunable matchingnetworks for optimal load-pulling, as well asDoherty, EER (Kahn), ET and outphasingSSPA transmitters.

– PCB design

– PDK development

Figure 14: A differential RF MEMS reflectarray brickwith 3:1 bandwidth (slotline RF MEMS TTD phaseshifter DETSA) for a wideband brick assembled re-flectarray for mobile backhaul applications.

ChipDesign’s Products


ChipDesign aims at transforming itself from a service provider to a scalable product-oriented fabless and lablesssemiconductor company, by developing proprietary IP, in order to supply following licensable IP andmanufactured goods:

Multi-mode multi-band (MMMB) antennas, front-end integrated circuits and modules, for 2G/3G/4G mobiledevices:

– On-chip integrated and tunable BAW resonators, filters and duplexers. At the same frequency, thewavelength of an acoustic wave is much smaller than the wavelength of an electromagnetic one and theQ factor of an acoustic resonator is much higher than the Q factor of an electromagnetic one.

– Envelope tracking CMOS power amplifiers [1] with on-chip integrated filtering and power combining inthe acoustic energy domain using BAW transducers, in order to lower the ACLR, footprint (=cost!) andtemperature, while improving the efficiency.

– Frequency-tunable antennas with integrated VSWR meters in order to allow for mismatch detection andcorrection due to suboptimal environment conditions, such as head proximity and death grip.

– Long term goal: On-chip integration of AESA technology for emerging 5G short-range high capacityfemto- or pico-cells operating in the 28 GHz or 60 GHz frequency bands.

– Long term goal: Integration of the transceiver and front-end into a single SoC, using a deep-submicronFD-SOI process [2].

Turnkey solutions for the wireless infrastructure market:

– Focal plane array PESA technology for 28 GHz or 60 GHz backhaul

ChipDesign’s Open-Source Software: NF2FF


Figure 15: nf2ff.sourceforge.net

ChipDesign’s Open-Source Software: Verilog-A RF MEMS Model Library


Figure 16: rfmems.sourceforge.net

ChipDesign’s Open-Source Software: Verilog-A RF MEMS Model Library


How to install the 1-DOF Verilog-A compact models: Agilent ADS:

– Copy the files with ael extension intothe networks subdirectory of the ADSproject.

– If necessary, make a verilogasubdirectory in the ADS project.

– Copy the files with va extension into theveriloga subdirectory of the ADSproject.

– Close and reopen the ADS project.

– Create a new design.

– Insert a random component and swap itwithFIXED FIXED BEAM RF MEMS RESONATORorFREE FREE BEAM RF MEMS RESONATOR.

Cadence Virtuoso Schematic Editor:

– CIW : File → New → Cellview...

– Create New File: Cell Name:FIXED FIXED BEAM RF MEMS RESONATOR orFREE FREE BEAM RF MEMS RESONATOR,View Name: veriloga, Tool: VerilogA-Editor. Click”OK”.

– The editor will appear. Copy/paste the Verilog-Acode into the editor. Save it and exit the editor.

– A dialog box will appear and ask you if you want tocreate a new symbol. Click ”Yes”.

– The Symbol Generation Options window willappear. Make appropriate changes and click ”OK”.

– Create a new schematic and insert an instance oftheFIXED FIXED BEAM RF MEMS RESONATORcomponent or theFREE FREE BEAM RF MEMS RESONATORcomponent.

References


[1] CMOS PA acquisition binge, 2013.

[2] FD-SOI, 2013.

Acronyms


2G/3G/4G second generation/third generation/fourth generationACLR adjacent channel leakage ratioADC analog to digital converterAESA active electronically scanned arrayAMS analog-mixed signalAMT antenna matching tunerASM antenna switch moduleBAW bulk acoustic waveBEOL back end of lineBT bluetoothBTO barium titanateCA carrier aggregationCMOS complementary metal oxide semiconductorCPU central processing unitCRF coupled resonator filterCSD chemical solution depositionDDS direct digital synthesizerDMS dual mode SAWDPX duplexerDSP digital signal processorEMI electromagnetic interferenceEVM error vector magnitudeET envelope trackingFBAR film bulk acoustic resonatorFDD frequency division duplexFD-SOI fully-depleted silicon-on-insulatorFEA finite element analysisFEM front-end moduleGPU graphical processing unitGSM global system for mobile communicationsHB harmonic balanceHBT heterojunction bipolar transistorHDL hardware description languageHETNET heterogeneous networkIC integrated circuitIEEE institute for electrical and electronics engineersIL insertion lossIP intellectual propertyMBE molecular beam epitaxyMEMS micro electromechanical system

MIMO multiple-in multiple-outMOCVD metallo-organic chemical vapor depositionMMMB multi mode multi bandLNA low noise amplifierLTE long term evolutionLTE-A long term evolution - advancedPA power amplifiersPAE power added efficiencyPCM process control monitorPDK process development kitPD-SOI partially-depleted silicon-on-insulatorPESA passive electronically scanned arrayPMIC power management integrated circuitPLD pulsed laser depositionPSS periodic steady statePVT process voltage temperaturePZT lead zirconate titanateQ quality factorQFN quad-flat no-leadsQPSS quasi-periodic steady-stateQS quasi-staticRF radio frequencyRF IC radio frequency integrated circuitRSSI received signal strength indicatorRX receiverSAR specific absorption rateSAW surface acoustic waveSKU stock keeping unitSMR solidly mounted resonatorSMT surface mount technologySNR signal to noise ratioSoC system-on-chipSPNT single pole N throwTDD time division duplexTX transmitterUMTS universal mobile telecommunication systemVSWR voltage standing wave ratioWLAN wireless local area networkWLCSP wafer level chip scale packageWPAN wireless personal area network

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