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RX1 Time to digital TDC7200 WMBUS transceiver AFE 8 MHz Power Management Block* Real time clock LCD driver Pipe Supply SPI TPS62740 TPS61291 LiSOCI2 Battery 3.6 V, 3 mA max Microcontroller Active: 100 μA LPM3: 0.7 μA MSP430FR6989 SPI 32.768 Hz TDC1000 Temp sensor PT1000 TX1 RX2 TX2 169 mHz 29 dBM CC1120 CC1120 RF daughter card Flow rate display SPI TI Designs Ultrasonic Water Flow Measurement Using Time to Digital Conversion TI Designs Design Features TI Designs provide the foundation that you need Ultra-Low-Power Design including methodology, testing and design files to Ultrasonic Time of Flight Measure quickly evaluate and customize the system. TI Designs Small Form Factor help you accelerate your time to market. High Efficiency DC-DC Converter for System Design Resources Power Super-Cap Design for Power Supply of RF Module Design Page TIDM-ULTRASONIC-FLOW-TDC Platform Design With Sockets for RF, Power MSP430FR6989 Product Folder Module, and MCU I/O TDC1000 Product Folder PC GUI TDC7200 Product Folder TPS62740 Product Folder Featured Applications TPS61291 Product Folder Water Meter TPD8E003 Product Folder Gas Meter Heat Meter ASK Our E2E Experts WEBENCH® Calculator Tools An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and other important disclaimers and information. All trademarks are the property of their respective owners. 1 TIDU965A – May 2015 – Revised July 2015 Ultrasonic Water Flow Measurement Using Time to Digital Conversion Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated
Transcript

RX1

Time to digital

TDC7200

WMBUS transceiver

AFE

8 MHz

Power Management Block*

Real time clock

LCD driver

Pipe Supply

SPI

TPS62740 TPS61291

LiSOCI2 Battery3.6 V, 3 mA max

Microcontroller

Active: 100 µALPM3: 0.7 µA

MSP430FR6989 SPI

32.768 Hz

TDC1000

Temp sensor PT1000

TX1RX2TX2

169 mHz29 dBMCC1120

CC1120 RF daughter card

Flow rate display

SPI

TI DesignsUltrasonic Water Flow Measurement Using Time to DigitalConversion

TI Designs Design FeaturesTI Designs provide the foundation that you need • Ultra-Low-Power Designincluding methodology, testing and design files to • Ultrasonic Time of Flight Measurequickly evaluate and customize the system. TI Designs

• Small Form Factorhelp you accelerate your time to market.• High Efficiency DC-DC Converter for System

Design Resources Power• Super-Cap Design for Power Supply of RF Module

Design PageTIDM-ULTRASONIC-FLOW-TDC• Platform Design With Sockets for RF, PowerMSP430FR6989 Product Folder Module, and MCU I/O

TDC1000 Product Folder• PC GUITDC7200 Product Folder

TPS62740 Product Folder Featured ApplicationsTPS61291 Product Folder

• Water MeterTPD8E003 Product Folder• Gas Meter• Heat Meter

ASK Our E2E ExpertsWEBENCH® Calculator Tools

An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and otherimportant disclaimers and information.

All trademarks are the property of their respective owners.

1TIDU965A–May 2015–Revised July 2015 Ultrasonic Water Flow Measurement Using Time to Digital ConversionSubmit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

System Description www.ti.com

1 System DescriptionThis ultrasonic flow meter (water, gas, or heat meter) reference design with LCD is built using theTDC1000, TDC7200, and MSP430FR6989 (1) . The TDC chip sets measure the time of flight of ultrasonicsignals traveling in the media with an accuracy of 52 ps as the LSB of the TDC7200.

The TDC1000 is the analog front end, which transmits and receives signal. The received signal isamplified and passed to a comparator with a tunable internal reference voltage to output a sequence ofpulses called stop pulses. The TDC7200 is a high-resolution timer to measure the time of flight of signal,starting from the time at which it is transmitted from the TDC1000 to the time the stop pulses are output.

This TI design is battery powered with an ultra-low-power design. It mainly consists of the MCU, themeasurement chip set. A socket connecting the power supply circuit is provided for the RF module, whichis connected to the MCU through SPI and I/O.

Ultrasonic transducers can be directly connected to the headers J8 (see the schematic diagram) of theboard. The user can also build an external board with connectors plugged into the headers of J8 and J9.

Two DC-DC convertors are provided. The TPS62740 is used for power supply for the MCU andmeasurement system while the TPS61291 is used for the RF module. Both circuits are connected withconnectors J5 and J6.

Three push buttons are provided for users to implement more functions. This TI design is a platform baseddesign. Users can connect their own external boards to the sockets or connectors to form a highlysophisticated design.

(1) The MSP430FR6989 is used to get to the market quickly. The ESI module in this MCU is not used in this design. Evaluate theMSP430FR697x, a variant without an ESI module.

2 Ultrasonic Water Flow Measurement Using Time to Digital Conversion TIDU965A–May 2015–Revised July 2015Submit Documentation Feedback

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Pipe

TX2/RX1 TX1/RX2

TDC1000

TDC7200

MSP430

SPI

Stop

Start

Trigger

SPI

www.ti.com Design Features

2 Design Features

2.1 Ultra-Low-Power DesignThe whole system consumes average current of 10.5 µA with a sampling rate of one measure per onesecond. The LCD and RF module are in an off state to reduce power consumption. This is the first versionwith a low-power design.

During the low-power mode, the system voltage is set to 2.5 V and consumes 0.5 µA. The only activecomponents during this state are the DC-DC converter TPS62740, the 32.768-KHz crystal, and the timerof the MCU. The default setting of timer is one second. Once the timer reaches the count, the systemwakes up and the system voltage generated by the TPS62740 is set to 3.3 V by the MCU.

During the active mode, power is switched on for the TDC1000 and TDC7200, which are then initializedand reset by the MCU through SPI. These chip sets will perform the measurement.

Once the measurement completed, the power supply to the TDC1000 and TDC7200 is switched off, andthe MCU enters low power mode 3 with the system voltage set to 2.5 V to lower the current consumption.

When switching the power of the devices on board to an active or low power mode state, a specificsequence and settling time is required to minimize the leakage current and the time for stabilization. Fordetails, see the short functions TDC_Chips_On() and TDC_Chips_Off() in Main.c.

2.2 Ultrasonic Measurement for Time of FlightThe basic connection of the measurement analog front end to the MCU is shown in the block diagram ofFigure 1. The TDC1000 has connections to two ultrasonic transducers. The MCU is connected to TDCchips with SPI and other control lines. During the measurement period, the MCU will power up TDC chipsand initialize them through SPI. The time of flight measurement process is done in the TDC1000 andTDC7200 without intervention of MCU. After completing the process, the measurement data is stored inthe TDC7200. The MCU will then fetch the data by SPI and switch off the TDC chip set to save power.The rest of the calculation is done in the MCU and the LCD will display the result. In this reference design,however, the MCU sends the data to the PC GUI, which will process the calculation. The MCU enters intolow power mode and will repeat the whole process after a time interval of one second (default setting).

Figure 1. Measurement Front End

3TIDU965A–May 2015–Revised July 2015 Ultrasonic Water Flow Measurement Using Time to Digital ConversionSubmit Documentation Feedback

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TDC1000

TOF duration

STOP

START

TriggerRX

TX

Transducer A Transducer B

Design Features www.ti.com

Figure 2 shows the overview working principle of the TDC1000. The time of flight is to measure the timetaken from the transmitting transducer to the receiving transducer. In the measurement process, the MCUsends a start message through the SPI to the TDC7200, which then sends a trigger signal to theTDC1000. At the same time, the TDC1000 will send a start pulse to the TDC7200 and transmit the firstultrasonic signal through TX1 and received by RX1. This is in the same direction as the flowing media,called upstream.

In the arrival of the received signal, the TDC1000 amplifies the signal and passes it to a comparator togenerate stop pulses, which are then measured by the TDC7200 to get the time of flight of the signal.Registers of the TDC7200 containing the measurement data are then sent to the MCU through SPI forfurther processing.

To measure differential time of flight, the TDC1000 needs to repeat the same process with oppositedirection, in downstream of the flowing media, transmitting signal from TX2 and received by RX2. Thedifferential result is obtained by time taken for downstream minus that for upstream.

The transmitting pulses to a transducer are a square wave. Its frequency can be pre-defined by internalregisters of the TDC1000.

Figure 2. Time of Flight Measurement

4 Ultrasonic Water Flow Measurement Using Time to Digital Conversion TIDU965A–May 2015–Revised July 2015Submit Documentation Feedback

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Output on STOP pin

Zero-Crossing Detected after threshold exceeded

Signal exceeds Threshold

Maximum number of requested events (5 in this figure) returned; subsequent events not reported

Threshold

VCOM

www.ti.com Design Features

Figure 3 shows an amplified received signal of the TDC1000 with a DC bias of VCOM. The signal ispassed through a comparator with an internal reference voltage as the threshold. When the voltage of thesignal is lower than the threshold, a stop pulse is then generated when the signal crosses the VCOM. Thenumber of stop pulse can be set with the registers. However, the maximum number of stop pulsesprocessed in the TDC7200 is five. Therefore, when setting the number of pulses in the TDC1000, it has tobe equal to or larger than the number of pulses set in the TDC7200.

Figure 3. Received Signal to Stop Pulses Conversion

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8MHz

Start pulse 1st

Stop pulse5th

Stop pulse

CLK count 1

CLK count 5

Time 1 Time 2 Time 6

Cal. 1 Cal. 2

Time 1 Time 2 Time 6

Cal. 1 Cal. 2

5th

stop pulse1st

stop pulseStart pulse

8 MHz

CLK count 1

CLK count 5

( )Time of flight Time 1 Time 2 normLSB CLOCK count 1 0.125 s= - ´ + ´ m

( )

Cal 1 normLSB offset 0.125 s

Cal 2 normLSB offset 10 0.125 s

10 1 0.125 snormLSB

Cal 2 Cal 1

´ + = m

´ + = ´ m

- ´ m=

-

Design Features www.ti.com

Figure 4 shows how the TDC7200 makes the measurement. There are 13 registers, each of which has24 bits to record the timing information. When the start pulse is generated from the TDC1000, theTDC7200 starts to measure with the external clock of 8 MHz (in this TI design). The register "Time 1" is tomeasure the time taken from the edge (polarity selectable) of the START pulse to the rising edge of the8-MHz clock. This measurement is done using the internal high resolution timer of the TDC7200 with thefine resolution of 52 ps (LSB) in average.

When the ultrasonic signal starts flying through the media in a flow meter, a timer register "CLOCK count1" is counting the number of clock cycle of 8 MHz until the first STOP pulse is received. Register "Time 2"is to measure the time taken from the edge of the first STOP pulse to the edge of the 8-MHz clock (thesame way as "Time 1"). With the information from "Time1", "CLOCK count 1", and "Time 2", the time offlight from the edge of START pulse to the edge of the first STOP pulse can be calculated.

The timer is kept running, and the received signal propagates to generate the second STOP pulse.Similarly, the same process is repeated for the second STOP pulse to obtain "CLOCK count 2" and"Time 3". The process is kept on until the fifth STOP pulse is measured.

Because there might have some deviation of high resolution timer of the TDC7200 in every measurement,the device needs calibration every time. Registers "Calibration 1" and "Calibration 2" ("Cal 1" and "Cal 2"in Figure 4, respectively) are used. In the project's default setting, Cal 1 records timing information fromthe high resolution timer in the period of 1 clock cycle of 8 MHz while Cal 2 does the same for 10 clockcycles of 8 MHz.

Equation 1 calculates the calibration of the high resolution timer as follows:

where• normLSB = normalized least significant bit• 0.125 µs = time for 1 clock cycle of 8 MHz (1)

Similar to calculating for other STOP pulses, Equation 2 calculates the time of flight for the first STOPpulse as follows:

(2)

Figure 4. Timing Registers on Five Stop Pulses

6 Ultrasonic Water Flow Measurement Using Time to Digital Conversion TIDU965A–May 2015–Revised July 2015Submit Documentation Feedback

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www.ti.com Design Features

2.3 Small Form FactorThe PCB board size is 3×3 inches, which can fit into most of the meter casing. Half of the board isoccupied with a big LCD and a socket for the RF module. The user can further reduce the board size witha smaller LCD module. The PCB area for the main chip set of the TDC1000, TDC7200, and MCU ismerely 1.1 × 2.3 inches.

2.4 High Efficiency DC-DC Converter for System Power SupplyThe TPS62740 step-down converter is used to convert 3.6 V of lithium battery into 3.3 V as systemvoltage in active mode with an efficiency up to 90%. It takes a typical quiescent current of 360 nA. Theoutput voltage is selectable. When the system is in standby mode after each measurement, the outputvoltage is set to 2.5 V to reduce overall current consumption to 0.5 µA.

2.5 Super-Cap Design for Power Supply of RF ModuleWhen an RF module is transmitting signal, a large current will be consumed. However, some lithiumbatteries have a limitation of output current. To cope with this situation, a super capacitor is used as abuffer to store the charges from the battery and to supply large current for the use of RF power amplifier.

In the daily operation of a flow meter, the RF module is only switched on for a short time to send out thereading of the meter to the data concentrator, a few times per day or per week. In the standby mode, themodule is switched off to save power. During the standby mode, the super capacitor is charged up to2.5 V. In transmitting mode, a boost converter (TPS61291) connecting to the super cap is enabled to stepup the output voltage to 3.3 V, which will supply the power to RF module. All the current used in the RFmodule will then only be taken from the supper capacitor.

2.6 Platform DesignThe board is designed with a platform-based concept. It has the core function of measurement unit and anMCU with an LCD module. The board also has reserved some sockets for adding on extra functionalitiesor circuit modification.

One important socket is the RF socket, which is connected to the SPI and I/O port of the MCU and has adedicated power supply module. This socket can plug in with the communication module, like Wi-Fi,Bluetooth, or M-bus of a wired or wireless type. It also can be used as an extended connection to otherdevice modules.

The power supply module can be modified with the sockets connecting to it. The user can remove thepower components and replace it with a new module connecting to the sockets.

While programming the MCU, the user can select the JTAG interface or the Spy-Bi-Wire connection. Inthe socket of the Spy-Bi-Wire, it uses a six-pin socket with a UART pin directly connected to MCU. Thissocket is compatible with the eZ-FET tool of the MSP430.

2.7 PC GUIA PC GUI is provided to control the operation of the system. This GUI has the panel for the TDC1000 andTDC7200 set up. It can monitor the time of flight for each STOP pulse. The GUI has reserved some otherfunctions like the flow rate and temperature sensing. However, the first version of the MCU firmware hasnot been implemented with these functions yet.

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RX1

Time to digital

TDC7200

WMBUS transceiver

AFE

8 MHz

Power Management Block*

Real time clock

LCD driver

Pipe Supply

SPI

TPS62740 TPS61291

LiSOCI2 Battery3.6 V, 3 mA max

Microcontroller

Active: 100 µALPM3: 0.7 µA

MSP430FR6989 SPI

32.768 Hz

TDC1000

Temp sensor PT1000

TX1RX2TX2

169 mHz29 dBMCC1120

CC1120 RF daughter card

Flow rate display

SPI

Block Diagram www.ti.com

3 Block Diagram

Figure 5. System Block Diagram

8 Ultrasonic Water Flow Measurement Using Time to Digital Conversion TIDU965A–May 2015–Revised July 2015Submit Documentation Feedback

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1

3

56

4

2

7

910

8

J9

PPPC052LJBN-RC

GPIO2

GPIO3

GPIO1

GPIO4

GPIO5

TDC1000_CHSEL

GPIO6

GPIO7

GND

VS

1

2

3

4 5 6

7

8

9

11

12

14

10

1315

www.ti.com Circuit Design

4 Circuit Design

Figure 6. TI Design of Ultrasonic Flow Meter

This solution of the ultrasonic flow meter is built on the TDC1000, TDC7200, and the MCUMSP430FR6989 with an LCD display soldered on the bottom size of the board. This board is powered bya 3.6-V lithium battery, which is down converted to 3.3 V through a voltage selectable buck converter ofthe TPS62740. For the operation of this board, it can be descripted with 15 parts controlled with the MCU.Details follow for each part:1. An external board can be built and plugged into this socket and the socket of Part 2 to enhance its

features.

Figure 7. Socket (J9) Connecting to I/O of MCU

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GND12

34

56

78

910

1112

1314

JTAG1

MHDR2X7

JTAG_TEST JTAG_TCK

JTAG_RST/NMI

JTAG_TMSJTAG_TDIJTAG_TDO/SBWTDIO

UART0_RXDUART0_TXD

FET_PWR

VBatTARGET_3V3

1

2

JP7

1

2

JP6

10.0kR54

10.0kR53

5

4

1

2

3

6

J7

GND

AGND

STOP

START

COMPIN

VCOM

LED1

470RR28

LED2

470RR29

TARGET_3V3

12

JP2

12

JP3

SH-JP2

SH-JP3

TX2/RX1or TX2

TX2/RX1or RX1

TX1/RX2 or TX1

TX1/RX2 or RX21

3

5 6

4

2

7

9 10

8

1211

1413

J8

RTD1

RTD2

AVDD

AGND

Circuit Design www.ti.com

2. Ultrasonic transducers are to be connected through this socket.J8 also provides two pin sockets for external temperature sensors connecting RTD1 and RTD2 signalsin the circuit. These signals are used when temperature of the media in a meter is included for themeasurement, like heat meters.

Figure 8. Socket (J8) Connecting Transmitting and Receiving Pins of TDC1000

3. space

Figure 9. Jumpers JP2 and JP3 Connect Onboard LED

4. A slot of test pins for START and STOP pulses, VCOM, and the internal input of the comparator in theTDC1000.

Figure 10. Test Pins of TDC1000

5. Pins 12 and 14 of this header are connected to the UART pin of the MCU. Use the latest MSP430 FETTool with the UART feature to connect the board to the PC GUI. When using external power, the VCCof the MCU has to be connected to pin 4 of the JTAG; the user can select either the TARGET_3V3 orVBAT.

Figure 11. JTAG Interface for MSP430 FET Tool to Program MCU

10 Ultrasonic Water Flow Measurement Using Time to Digital Conversion TIDU965A–May 2015–Revised July 2015Submit Documentation Feedback

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12KR18

12KR67

100KR17

TARGET_3V3

BUT_AIN

0.1uF

C9

GND

GND

S1

S2

S3

47KR27

2.2nFC13

MC

U_

RS

T

GND

TARGET_3V3

JTAG_RST/NMI

FET_PWR

1 2

JP1

SH-JP1

VBat

123

J4

VS

SH-JP6

FET_PWR

1

2

3

4

5

6

J1UART0_RXD

JTAG_TESTJTAG_RST/NMI

UART0_TXD

GND

FET_PWR

1 2

JP1

SH-JP1

www.ti.com Circuit Design

6. This interface is compatible with the eZ-FET tool of the MSP430. Use the UART feature of the eZ-FETto connect the board to the PC GUI.

Figure 12. Spy-Bi-Wire and UART Interface

7. When using the eZ-FET tool and needing the power supplied from it, short this jumper and pins 1 and2 of jumper J4 located in Part 11.

Figure 13. Jumper JP1

8. space

Figure 14. MCU Reset Button

9. Use these buttons to add on new features. There is no implementation for these buttons in thefirmware. To operate this circuit: when a push button is pressed, it pulls the voltage of the "BUT_AN" tolow to trigger an interrupt routine, which then switches on the ADC to measure the input voltage todetermine which button is pressed.

Figure 15. Three Push Buttons (Reserved for Future Use)

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VIN1

SW2

GND3

CTRL4

VOUT5

LOAD6

PG7

VSEL48

VSEL39

VSEL210

VSEL111

EN12

PAD13

U3

TPS62740DSS

10µFC18

10µFC19

GND

GND

VS

GND

VSEL1

VSEL2

VSEL3

VSEL4

LOAD_ENABLE

V2.5

V2.5L

2.2uHL2

SH-JP4

PG_TEST_PIN

1 2

JP5

0.1µF

C17

10M

R15

10k R36

AGND

VBat VBat

123

J4

VS

SH-JP6

V_PA

12

JP4

SH-JP5

VBat

1

2

J3

Battery

FET_PWR

Circuit Design www.ti.com

10. When battery is used, pins 2 and 3 of J4 are shorted with jumper and JP1 is opened.The jumper JP5 (see Figure 17) near the connector is to short the capacitor C17 to provide an alwayspull-up resistor to pin VSEL2 of the TPS62740, which will then output 2.0 V to start the MCU. Use it asan easy circuit setting of voltage selection during development of new firmware. To use this jumper,the MCU pin connecting to it has to be set as input mode. Once developed, remove the jumper to savecurrent consumption.

Figure 16. Battery Connector Using 3.6-V Lithium Battery

11. When connected to a battery, a low-power circuit consisting of C17 and R15 is used to provide a pulseto VSEL4, a selection pin of the TPS62740, to select an initial voltage of 2.6 V, which is high enough tostart the MCU.In the initialization of the firmware, it has to select the proper operation voltage by using the selectionpins.If all pins are pulled to low, the output voltage of 1.8 V may not be high enough to start the MCU. Inthis situation, short the input and output of the U3 (TPS62740) to supply 3.x V to the MCU and re-program it with proper firmware.There is a header (J6) connecting to each pin of U3.

Figure 17. Buck Converter Using TPS62740 to Provide VCC to the System

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3

1

2

Q4MMBT3904

3

1

2

Q2MMBT3904

3

1

2 Q3MMBT3906

3

1

2 Q1MMBT3906

2.4k

R35

100

R30

3000000µFC15

360kR38

360kR32

10.0M

R37

10.0M

R31

GND GND

V2.5

10.0M

R39

10.0MR41

10.0MR34

10.0M

R33

V2.5

GND

V_SUP_CAP V_SUP_CAP

V_SUP_CAP

SLOW_CHARGEFAST_CHARGE

L1

VOUT2

VIN3

EN/BYP4

VSEL5

GND6

PAD7

U2

TPS61291DRV

10µF

C1622µFC14

L1

LPS3314-332MLB

PAGNDPAGNDPAGND

V_SUP_CAPV_PA

PA_POWER_EN

www.ti.com Circuit Design

12. The firmware does not implement this part, as this is reserved for future use.A dedicated power supply for Part 14. When the communication module connecting to Part 14 isturned on, a large current will be given out by the super capacitor and the voltage will be stepped up to3.3 V. The design will isolate the communication power from the system power. The design will nothave current flowing from the system power to the module during its active state.

Figure 18. Boost Converter With Super Capacitor (in Part 13)

13. The firmware does not implement this part, as this is reserved for future use.Operation is as follows: A super capacitor, which is charged up from the battery through an npn switchand resistor (located in the middle of Part 14) to 2.5 V. This is done when the communication moduleconnecting to Part 14 is in standby mode. When the module is in active mode, the npn switch will beturned off to isolate the battery power.There are two charging circuits. When the super cap is empty or with very little charges,"SLOW_CHARGE" is high and the circuit will charge up the super capacitor with current= (V2.5 – V_SUP_CAP) / 2.4k, which will limit the current to below 1 mA. This limitation is necessary,as the lithium battery has a limited current output.When the super cap is 0.1 V lower than V2.5, a resistor of 100 Ω is used instead of 2.4 K; the circuit isnamed "FAST_CHARGE". Every time a communication module is activated, it only consumes somecharges in the super capacitor to lower its voltage within 0.1 V. Therefore, "FAST_CHARGE" will beused to re-charge the super-cap for the next communication use.

Figure 19. Resistive Charging Circuit for Super Capacitor

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1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

RF2

MHDR2X10

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

RF1

MHDR2X10

0.1uFC2

PAGND

0RR90RR110RR14

0RR12

PAGND

0RR10RR20RR30RR5

PAGND

0RR130RR100RR80RR7

0RR60RR4

RF_SPI1_CSNRF_GPIO_82RF_SPI1_MISO/RF_UART_TXDRF_SPI1_MOSI/RF_UART_RXD

RF_GPIO_17RF_GPIO_13

RF_SPI_CSNRF_SPI_SCLKRF_SPI_MOSIRF_SPI_MISO

RF_RESETRF_GPIO_81RF_GPIO_10

RF_SPI1_SCLK

V_SUP_CAPV_PA

0.1uFC1

Circuit Design www.ti.com

14. The socket has connection of SPI, UART and GPIO to the MCU. The user can also plug in anextension board to enhance the system features.The "V_PA" is the power supply for the power amplifier of the RF module. For testing, jumper JP4(see Figure 16) is provided to direct connection to the DC or battery power supply.

Figure 20. Socket for Connection of Communication Module (Wired or Wireless Type)

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AGND

0

R55

0R56

RTD2

RTD1

AGND

1.00k

R52

VCOM

ST

AR

T

ST

OP

10.0MegR48

AGND

10.0MegR50

STOP

START

0.01µF

C24

VC

OM

3

RT

D1

8

RT

D2

9

RR

EF

10

ST

AR

T13

ST

OP

14

510

R40

510R57

AGND

AGND

1000pFC26

51pFC23

1.00k

R47

51pFC25

AGND

5.36k

R44 VCOM

CO

MP

IN

LN

AO

UT

4

PG

AIN

5

PG

AO

UT

6

CO

MP

IN7

U5TDC1000PW

0.01µFC28

AGND

0.1µFC29

AGND

AVDD

60 ohm

FB1

0.01µF

C30

GND

0.1µF

C31

GND

V3p3

VDD_TDC1000

VIO

60 ohm

FB2

10µFC27

AGND

VIO

22

VD

D23

VD

D24

www.ti.com Circuit Design

15. The core circuit of measurement on this TI design consists of the TDC1000, TDC7200 and an 8-MHzoscillator. Some important notes as follows have to be followed when implementing this circuit.The ferrite in FB1 and FB2 with capacitors of 0.1 µF and 0.01 µF, respectively, are used to provide alow-noise DC power to the TDC1000. When implementing the low-power design, AVDD and VIO to theTDC1000 are connected together. From the datasheet, AVDD must be set to be equal to or higherthan VIO; otherwise, a large current of a couple of mA will be drained. When in standby mode, both theTDC1000 and TDC7200 will be disabled by pulling low the enable pin.

Figure 21. Low-Pass Filters for Power Supplies of TDC1000

The stability of VCOM is important for accurate measurement. 10 nF in C24 is used; by experiment, itis the most optimal value. The R52 is used as a reference resistor for measurement of temperaturesensor PT500 / PT1000. The accuracy of this 1-KΩ resistor is 0.01%.Resistors R40 and R57 are used to provide damping of ultrasonic transducers. With these resistors,the difference of differential time of flight among STOP1 to STOP5 is reduced.The following circuit from "PGAOUT" to "COMPIN" is to provide a band pass filter with centerfrequency of 1 MHz to reduce noise of the received signal. As a result, the standard deviation ofmeasurement data is reduced.

Figure 22. Critical External Passive Circuits of TDC1000

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Matched TX1 and TX2signal lines

Matched RX1 and RX2signal lines

START and STOP signal linesare matched

Circuit Design www.ti.com

The R43 and R45 of 200 Ω have to be matched with each other within a 1% error; so for the capacitorsC32 and C33. As the measurement on the differential time of flight is in unit of picosecond, to reduceoffset value, the length of signal lines on transmitting end and receiving end have to be matched. Forthe same reason, the START and STOP signal lines need to be matched as well.

Figure 23. PCB Layout of Matched Signal Lines

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Initialization

START

Handle GUI command

Power on TDC1000, TDC7200 and initialization

TDC measurement on differential time of flight

Power off TDC1000 and TDC7200

Send data to PC GUI via UART

MCU enter low power mode

1 second slept?

www.ti.com Software Description

5 Software Description

Figure 24. Software Flowchart

The software is designed to optimize the power consumption of the system. It starts with initializing theMCU peripherals and I/O ports. The flowchart shown in Figure 24 consists of the PC GUI operation. In theinfinite loop of measurement, it checks the command from the GUI and then triggers the measurement. Asthe TDC1000 and TDDC7200 are powered off in standby mode, when they are powered on, the registersetting has to be reloaded. The whole process of power on, measurement, and power off need a period ofaround 35 ms in which a large portion is the delay for stabilization of the system. After that, readings fromthe TDC7200 are sent to the GUI through UART. The MCU will enter into a low-power mode and wait for1 second in default before the next cycle of measurement.

In the software, two modes can be selected. One mode is working with the GUI and another is without theGUI. The mode can be selected with "define GUI" in "global.h". Remark it to select non-GUI operation,which will use the minimum power consumption. For both GUI and NON-GUI operation, the LCD willdisplay the differential time of flight.

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PC GUI Operation www.ti.com

6 PC GUI OperationIn the GUI, only five pages or TABs are used: SETUP, TDC1000, TDC7200, TOF_ONE_SHOT, andGRAPH. Raw data from the TDC7200 will be sent to the GUI and processed. There is no calculated resultin the firmware.

In the SETUP tab, select the com port connecting to the board and click "CONNECT" to link the board andthe PC GUI.

The triggering frequency is defaulted to 1 second in the firmware. The user can select the triggeringfrequency on this page. However, do not select 100 ms because there may not be enough time to synchthe data stream/GUI command to the firmware and the GUI.

Figure 25. SETUP Settings

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www.ti.com PC GUI Operation

After SETUP, open the TAB of the TDC1000. In this page, click "READ ALL" to read the setting of theTDC1000. For the first time to power on the TDC1000, the default setting will be read.

The user can change the individual register setting according to the TDC1000 datasheet and save thewhole configuration to the hard disk with "SAVE CONFIG". Load the configuration back to the TDC1000with "LOAD CONFIG".

The "CONTINUOUS TRIGGER" command enables the signal output. The user can then see the real timeeffect of the setting by oscilloscope.

Figure 26. TDC1000 Settings

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PC GUI Operation www.ti.com

In the TAB of the TDC7200, the user can configure the register setting of the TDC7200. At the first time ofpower up and "READ ALL" is clicked, the default setting of TDC7200 is read.

The user can configure individual register settings according to the TDC7200 datasheet. "SAVE CONFIG"to save the setting into hard disk. "LOAD CONFIG" to load the setting from hard disk into the registers.

Figure 27. TDC7200 Settings

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www.ti.com PC GUI Operation

In the TAB of "TOF_ONE_SHOT", when the button "TOF_ONE_SHOT" is pressed, one set ofmeasurement reading the TDC7200 will be fetched.

The calculated results in the GUI will be displayed on the "DEBUG OUT".

Figure 28. TOF_ONE_SHOT Settings

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PC GUI Operation www.ti.com

In the TAB of "GRAPH", it receives the streaming data from the TI design. After calculation, the result isdisplayed onto the monitor in black.

The GUI has the function of saving the graph data and records the register readings into a file. To enablethis function, the corresponding check box is selected. When the "FLOW MODE" is checked, thedifferential time of flight will be displayed.

When the "FLOW MODE" is unchecked, the time of flight from the START pulse to the STOP pulse isdisplayed.

"TDC_SELECT" to select different STOP pulse, from STOP 1 to STOP 5 in "START GRAPH" is clicked tostart the data logging. "STOP GRAPH" is to stop the data logging.

If the reading is out of scale, move the mouse cursor to the black monitor and right click. Select"Auto Scale Y" to auto scale the curve into the right position.

Figure 29. GRAPH Settings

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www.ti.com Test Data

7 Test Data

7.1 Test Setup to Measure Accuracy

Figure 30. System Setup to Measure Accuracy of Differential Time of Flight

The setup includes an ultrasonic pipe filled with water connected to the board, as shown in Figure 30. Thepipe is sealed at both ends without the flow of water to measure the accuracy of the differential time offlight of the system. The procedure is as follows:1. Remove all jumpers.2. Connect pin 2 and 3 of J4.3. Connect ultrasonic transducers in a pipe filled with water to J8.4. Connect UART in JTAG interface, or using UART connection in J15. Plug in the 3.6-V DC supply to J3.6. Switch on the DC power supply.7. Program it using Code Composer Studio™ (CCS) 6.1, with the firmware which defines PC GUI by

using "#define OPERATION_MODE 2" in "global.h". After that, exit CCS.8. Press the MCU reset button to ensure a restart of the firmware.9. Open the PC GUI.10. Select the proper COM port in SETUP page of the GUI and click "CONNECT".11. Select "1 second" as triggering frequency.12. In TDC1000 TAB, click "READ ALL" to load the default setting from the firmware.13. In TDC7200 TAB, click "READ ALL" to load the default setting from the firmware.14. In the "GRAPH" TAB, check "FLOW MODE" to measure the differential time of flight.15. Check the box of "SAVE RESULT REGR TOFILE".16. Click "START GRAPH".17. A window is displayed. Enter the file name of the file and click "OK".18. Wait for five minutes and click "Stop Graph".19. Process the data of the file using Microsoft® Excel®.

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Test Data www.ti.com

7.2 Test Setup to Measure Current Consumption

Figure 31. System Setup to Measure of Current Consumption

This setup uses an eZ-FET tool with EnergyTrace™ module to monitor the energy consumption of the TIdesign. This tool uses a Spy-Bi-Wire connection. The UART has to be disconnected to avoid currentleakage. This setup includes an ultrasonic pipe filled with water connected to the board. The setupprocedure is as follows:1. Remove all jumpers, DC power, and JTAG connection.2. Short the jumper JP1 and short pin 1 and 2 of J4.3. Connect the Spy-Bi-Wire from the eZ-FET to J1 on the board, without connecting the UART pins.4. Connect eZ-FET to PC.5. Program the it using CCS 6.1, with the firmware without PC GUI and LCD, by using

"#define OPERATION_MODE 1" in "global.h".6. Compile and enter debug mode of CCS.7. In the "EnergyTrace" setting panel in CCS 6, set 10 second as the measurement duration.8. Select "Run" in menu bar and click "Free Run".9. Click the "Energy" tab in "EnergyTrace" panel.10. The user can see a large surge of energy in the beginning of initialization of the firmware.11. Press "ALT + F8" to suspend the program.12. Select "Run" in menu bar and click "Free Run" again.13. The energy consumption in steady state is shown on the "EnergyTrace" monitor.14. Click the "EnergyTrace Technology" tab to read the energy consumption and supply voltage. With this

data, the average current consumption can be calculated.

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www.ti.com Test Results

8 Test ResultsThe test results for accuracy are shown in Figure 32 and Figure 33. Figure 32 shows the plot of thedifferential time of flight for each STOP pulse over five minutes time, with one measure per second.Figure 33 shows the average of these five curves. Table 1 shows the mean value and the standarddeviation of the results.

From Table 1, the mean value is supposed to be zero for a zero flow rate. However, it comes out as asignificant figure. This difference is due to the imbalance of transducers and unmatched value of the frontend components. As it represents a zero flow, the mean value can be treated as an offset in thecalculation of the flow rate.

The standard deviation for each STOP is ranged from 134 to 241 ps, while that of the averaged data isonly 126 ps. Implement a higher accuracy system by taking a couple of measures per second and performaveraging technique to reduce error (standard deviation).

Table 1. Mean and Standard Deviation of the Test Results

DIFFERENTIAL TOF MEAN VALUE STANDARD DEVIATIONSTOP1 –2.934 ns 241 psSTOP2 –2.928 ns 205 psSTOP3 –2.521ns 153 psSTOP4 –2.200 ns 134 psSTOP5 –1.806 ns 157 ps

Averaged curve –2.478 ns 126 ps

Figure 32. Test Results of Five STOPs

Figure 33. Test Results of the Average of Five STOPs

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Test Results www.ti.com

Figure 34 shows the pattern of energy consumption. A low power mode with a system voltage of 2.5 V isthe normal state. When a one-second time interval is reached, the MCU sets the system voltage to 3.3 Vand wakes up the system for measurement. During the active period of 2.2 ms, a comparatively largecurrent is consumed, which reflects in a step increment in the energy consumption in the graph. Aftermeasurement, the MCU switches off the system to low power mode and set the voltage to 2.5 V from3.3 V. During this state, the charges in the output capacitor of the TPS62740 provide the current intake ofthe system, which almost does not need any extra charges from the supply and so the curve is flat.

The calculation of average current is as follows:

The total energy consumed in 10 seconds = 375 µJThe voltage supply from the eZ-FET is 3.58 VTherefore the average current consumption = 375 / 10 / 3.58 = 10.5 µA

Figure 34. Energy Consumption of TI Design

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300pF

C32

300pF

C33

C18 & 19 must be close to TDC1000

RX pins. Place minimal parasiticcapacitances onto RX1&RX2

Interstage Passive Filters:

Configured for 1 MHz

AGND

TX1

TX2

RX1

RX2

TX2/RX1or TX2

0

R55

TX2/RX1or RX1

0R56

TX1/RX2 or TX1

TX1/RX2 or RX2

200

R43

200

R45

1

3

5 6

4

2

7

9 10

8

1211

1413

J8

RTD1RTD2

1000pFC26

51pFC23

1.00k

R47

51pFC25

AGND

RTD2

RTD1

AGND

1.00k

R52

AGND

VCOM

ST

AR

T

ST

OP

5.36k

R44 VCOM

TDC1000_ENABLE

TDC1000_ ERRB

TDC1000_CHSEL

TDC1000_RESET

MSP430_TRIGGER

TDC7200_TRIGGER

0.01µFC28

AGND

0.1µFC29

AGND

V3p3

GND

OSC_OUT

AVDD

CLK

CPU_CLK_OUT

33R61

60 ohm

FB1

GND

0.01µF

C34

OSC_ENABLE

0.01µF

C30

GND

0.1µF

C31

GND

V3p3

SPI_MISOTRIGGER_IN

33R58

SPI_MOSI

SPI_SCLK

TDC1000_SPI_CSB

10.0kR54

10.0kR53

CO

MP

IN

Place filter capsto VDD pins

Directly connected STOP and START traces fromTDC71000 to TDC7200 must be completelysymmetrical and as short as possible to avoidintroducing timing delay

Pin 1 and pin 14 of the connectormust be marked on the PC board

All the labels appearing on pin 2, 4, 6, 8, 10,12 and 14 must be marked on the PC board

VDD_TDC1000

VIO

10.0MegR48

AGND

10.0MegR50

60 ohm

FB2

STOP

START

0.01µF

C24

VDD4

STANDBY1

GND2

OUT3

8MHz

Y1

ASEMB-8.000MHZ-LY-T

AVDD

0.1µF

C3560 ohm

FB3

CLK

10µFC27

AGND

RX

11

RX

22

VC

OM

3

LN

AO

UT

4

PG

AIN

5

PG

AO

UT

6

CO

MP

IN7

RT

D1

8

RT

D2

9

RR

EF

10

CH

SE

L11

ER

RB

12

ST

AR

T13

ST

OP

14

EN

15

TR

IGG

ER

16

RE

SE

T17

SC

LK

18

CS

B19

SD

I20

SD

O21

VIO

22

VD

D23

VD

D24

CLK

IN25

GN

D26

TX

227

TX

128

U5TDC1000PW

GPIO7

GPIO5

GPIO6

GPIO4

TDC1000_CHSEL

GPIO2

GPIO1

GPIO3

1

3

56

4

2

7

910

8

J9

PPPC052LJBN-RC

GPIO2

GPIO3

GPIO1

GPIO4

GPIO5

TDC1000_CHSEL

GPIO6

GPIO7

GND

GND

Pin 1 and pin 10 of the connectormust be marked on the PC board

IO11

IO22

IO33

IO44

IO5 5

IO6 6

IO77

IO88

EP9

U6

TPD8E003DQDR

VS

5

4

1

2

3

6

J7

GND

AGND

STOPSTARTCOMPIN

VCOM

DNP R60

DNP R63

100KR46

100K

R42

IM_CH2_SEL

3

1

2

Q5

MMBT3904

100KR51

100K

R49

IM_CH1_SEL

3

1

2

Q6MMBT3904

TX1

TX2

510

R40

510R57

AGND

AGND

AGND

AGND

AGND

10MR59

DNPR62

www.ti.com Design Files

9 Design Files

9.1 SchematicsTo download the schematics, see the design files at TIDM-ULTRASONIC-FLOW-TDC.

Figure 35. TDC1000 Schematic

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Component value = DNP means do not populate

GND

0.01µFC36

Place caps closeto the pin

V3p3

GND

Place cap closeto the pin

1µFC38

SPI_MOSI

TDC7200_SPI_CSB

SPI_SCLK

SPI_MISO33

R64

MSP_TDC_INT

MSP_TDC7200_ EN

CLK

STOP

START

GND

33

R66TDC7200_TRIGGER

VD

D_T

DC

72

00

60 ohm

FB4

0.1µFC37

GND

ENABLE1

TRIGG2

START3

STOP4

CLOCK5

FLAG6

GND7

INT8

DOUT9

DIN10

CS11

SCLK12

VREG13

VDD14

U7

TDC7200PW

Design Files www.ti.com

Figure 36. TDC7200 Schematic

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VIN1 SW 2

GND3CTRL 4

VOUT5

LOAD6

PG7

VSEL48VSEL3

9VSEL2

10VSEL1

11

EN12

PAD13

U3

TPS62740DSS

3

1

2

Q4MMBT3904

3

1

2

Q2MMBT3904

3

1

2 Q3MMBT3906

3

1

2 Q1MMBT3906

10µFC18

10µFC19

GND

AGND

GND

VBat

VS

GND

VSEL1

VSEL2

VSEL3

VSEL4

LOAD_ENABLE

2.4k

R35

100

R30

3000000µFC15

360kR38

360kR32

V2.5

10.0M

R37

10.0M

R31

GND

GND

V2.5

10.0M

R39

10.0MR41

10.0MR34

10.0M

R33

V2.5

GND

V_SUP_CAP

V_SUP_CAPV_SUP_CAP

SLOW_CHARGE

FAST_CHARGE

V2.5L

GNDAGND

AVDDVBat

123

J4

VSV3p3

SH-JP6

V_PA

12

JP4

SH-JP5

VBat

PAGND

2.2uHL2

1

2

J3

Battery

SH-JP4

FET_PWR

L1

VOUT2

VIN3

EN/BYP4

VSEL 5GND6

PAD7

U2

TPS61291DRV

10µF

C1622µFC14

L1

LPS3314-332MLB

PAGNDPAGNDPAGND

V_SUP_CAPV_PA

PA_POWER_EN

5

4

1

2

3

6

7

8

J5

V2.5VS V2.5L

LOAD_ENABLE

GND

VSEL1

VSEL2

VSEL3

VSEL4

5

4

1

2

3

6

7

8

9

10

J6

V_PA

PAGND

V_SUP_CAP

PA_POWER_EN

PA_VSEL

SCL

SDA

PG_TEST_PIN

PG_TEST_PIN

1 2

JP5

0.1µF

C17

10M

R15

10k R36

V2.5MCU_V

www.ti.com Design Files

Figure 37. Power Circuit Schematic

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DNPR21

DNPR22

DNPR23

4u7C10

GND

GND

0.1uF

C7

TARGET_3V3

GND

22pFC3

22pFC4

DNPC5

DNPC6

0.1uF

C8

0.1uF

C11

0.1uFC12

TARGET_3V3GND

AVCC

P2.0/UCA0SIMO/UCA0TXD/TB0.6/TB0CLK 51P7.0/TA0CL K/S17

52P7.1/TA0.0/S16

53P7.2/TA0.1/S15

54P7.3/TA0.2/S14

55P7.4/SMCLK/S13

56DVSS2

57DVCC2

58P8.4/A7/C7

59P8.5/A6/C6 60P8.6/A5/C5

61P8.7/A4/C4

62P1.3/ESITEST4/TA1.2/A3/C3

63P1.2/TA1.1/TA0CL K/COUT/A2/C2

64P1.1/TA0.2/TA1CL K/COUT/A1/C1/VREF+/VeREF+

65P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VeREF

66P9.0/ESICH0/ESITEST0/A8/C8

67P9.1/ESICH1/ESITEST1/A9/C9

68P9.2/ESICH2/ESITEST2/A10/C10 69P9.3/ESICH3/ESITEST3/A11/C11

70P9.4/ESICI0/A12/C12

71P9.5/ESICI1/A13/C13

72P9.6/ESICI2/A14/C14

73P9.7/ESICI3/A15/C15

74ESIVCC

75

ES

IVS

S7

6E

SIC

I7

7E

SIC

OM

78

AV

CC

17

9A

VS

S3

80

PJ.7

/HF

XO

UT

81

PJ.6

/HF

XIN

82

AV

SS

18

3P

J.4

/LF

XIN

84

PJ.5

/LF

XO

UT

85

AV

SS

28

6P

5.4

/UC

A1

SIM

O/U

CA

1T

XD

/S1

28

7P

5.5

/UC

A1S

OM

I/U

CA

1R

XD

/S1

18

8P

5.6

/UC

A1

CL

K/S

10

89

P5

.7/U

CA

1S

TE

/TB

0C

LK

/S9

90

P4

.4/U

CB

1S

TE

/TA

1C

LK

/S8

91

P4.5

/UC

B1C

LK

/TA

1.0

/S7

92

P4.6

/UC

B1S

IMO

/UC

B1

SD

A/T

A1.1

/S6

93

P4

.7/U

CB

1S

OM

I/U

CB

1S

CL/T

A1.2

/S5

94

P1

0.0

/SM

CLK

/S4

95

P4

.0/U

CB

1S

IMO

/UC

B1

SD

A/M

CLK

/S3

96

P4.1

/UC

B1S

OM

I/U

CB

1S

CL

/AC

LK

/S2

97

DV

SS

39

8D

VC

C3

99

P4

.2/U

CA

0S

IMO

/UC

A0T

XD

/UC

B1C

LK

100

DV

SS

12

6

DV

CC

12

7

TE

ST

/SB

WT

CK

28

RE

SE

T/N

MI/S

BW

TD

IO2

9

PJ.0

/TD

O/T

B0

OU

TH

/SM

CL

K/S

RS

CG

13

0

PJ.1

/TD

I/T

CLK

/MC

LK

/SR

SC

G0

31

PJ.2

/TM

S/A

CL

K/S

RO

SC

OF

F3

2

PJ.3

/TC

K/C

OU

T/S

RC

PU

OF

F3

3

P6

.7/T

A0

CL

K/S

31

34

P7

.5/T

A0

.2/S

30

35

P7

.6/T

A0

.1/S

29

36

P1

0.1

/TA

0.0

/S28

37

P7

.7/T

A1

.2/T

B0

OU

TH

/S27

38

P3

.3/T

A1

.1/T

B0

CL

K/S

26

39

P3

.4/U

CA

1S

IMO

/UC

A1T

XD

/TB

0.0

/S2

54

0

P3

.5/U

CA

1S

OM

I/U

CA

1R

XD

/TB

0.1

/S24

41

P3

.6/U

CA

1C

LK

/TB

0.2

/S2

34

2

P3

.7/U

CA

1S

TE

/TB

0.3

/S2

24

3

P8

.0/R

TC

CL

K/S

21

44

P8

.1/D

MA

E0

/S2

04

5

P8

.2/S

19

46

P8

.3/M

CLK

/S1

84

7

P2

.3/U

CA

0S

TE

/TB

0O

UT

H4

8

P2

.2/U

CA

0C

LK

/TB

0.4

/RT

CC

LK

49

P2

.1/U

CA

0S

OM

I/U

CA

0R

XD

/TB

0.5

/DM

AE

05

0

P4.3/UCA0SOMI/UCA0RXD#/UCB1STE1

P1.4/UCB0CLK/UCA0STE/TA1.0/S12

P1.5/UCB0STE/UC A0CLK/TA0.0/S03

P1.6/UCB0SIMO/UC B0SDA/TA0.14

P1.7/UCB0SOMI/UC B0SCL/TA0.25

R33/LCDCAP6

P6.0/R237

P6.1/R13/LCDR EF8

P6.2/COUT/R039

P6.3/COM010

P6.4/TB0.0/COM111

P6.5/TB0.1/COM212

P6.6/TB0.2/COM313

P2.4/TB0.3/COM4/S4314

P2.5/TB0.4/CO M5/S4215

P2.6/TB0.5/CO M6/S4116

P2.7/TB0.6/CO M7/S4017

P10.2/TA1.0/SMCLK/S3918

P5.0/TA1.1/MCLK/S3819

P5.1/TA1.2/S3720

P5.2/TA1.0/TA1CL K/ACLK/S3621

P5.3/UCB1STE/S3522

P3.0/UCB1CL K/S3423

P3.1/UCB1SIMO/UC B1SDA/S3324

P3.2/UCB1SOMI/UC B1SCL/S3225

U1MSP430FR6989

X232.768

47KR27

2.2nFC13

MC

U_

RS

T

GND

TARGET_3V3

12KR18

12KR67

100KR17

TARGET_3V3

11

22

33

44

55

66

77

88

99

10

10

11

11

12

12

13

13

14

14

15

15

16

16

17

17

18

18

19

19

20

20

21

21

22

22

23

23

24

24

CO

M3

25

CO

M2

26

CO

M1

27

CO

M0

28

29

29

30

30

31

31

32

32

33

33

34

34

35

35

36

36

37

37

38

38

39

39

40

40

41

41

42

42

43

43

44

44

LCD LCD

LCD1FH-1152P

LED1

470RR28

LED2

470RR29

TARGET_3V3

JTAG_RST/NMI

LC

D8

LC

D9

LC

D1

2LC

D1

3

LC

D1

6LC

D1

7

LC

D2

0LC

D2

1

CO

M0

CO

M1

CO

M2

CO

M3

COM0COM1COM2COM3

LC

D8

LC

D9

LC

D12

LCD13

LCD16LCD17

LC

D20

LC

D21

JTA

G_T

ES

TJT

AG

_R

ST

/NM

IJT

AG

_T

DO

/SB

WT

DIO

JTA

G_T

MS

JTA

G_T

CK

BUT_AIN

BUT_AIN

UART0_RXD

UART0_TXD

RF_RESETRF_GPIO_81RF_GPIO_10RF_GPIO_82

RF_GPIO_17RF_GPIO_13

RF_SPI1_MOSI/RF_UART_RXD

RF

_S

PI1

_M

ISO

/RF

_U

AR

T_T

XD

RF

_S

PI1

_S

CLK

RF

_S

PI1

_C

SN

RF

_S

PI_

CS

N

RF

_S

PI_

SC

LK

RF

_S

PI_

MIS

OR

F_S

PI_

MO

SI

TARGET_3V3

10RR16

AVCC

1 2

3 45 6

7 8

9 10

11 1213 14

15 16

17 18

19 20

RF2

MHDR2X10

1 2

3 45 6

7 8

9 10

11 1213 14

15 16

17 18

19 20

RF1

MHDR2X10

0.1uFC2

PAGND

0RR90RR110RR14

0RR12

PAGND

0RR10RR20RR30RR5

PAGND

0RR130RR100RR80RR7

0RR60RR4

RF_SPI1_CSNRF_GPIO_82RF_SPI1_MISO/RF_UART_TXDRF_SPI1_MOSI/RF_UART_RXD

RF_GPIO_17RF_GPIO_13

RF_SPI_CSNRF_SPI_SCLKRF_SPI_MOSIRF_SPI_MISO

RF_RESETRF_GPIO_81RF_GPIO_10

RF_SPI1_SCLK

JTA

G_T

DI

0.1uF

C9

GND

GND

R20DNP

R19DNP

TARGET_3V3

GND12

34

56

78910

1112

1314

JTAG1

MHDR2X7

JTAG_TEST JTAG_TCK

JTAG_RST/NMI

JTAG_TMSJTAG_TDIJTAG_TDO/SBWTDIO

SDASCL

TARGET_3V3

TDC1000_SPI_CSBSPI_SCLK

SPI_MOSI

SPI_MISO

TDC7200_SPI_CSB

MSP_TDC_INT

MSP430_TRIGGERCPU_CLK_OUT

OSC_ENABLE

TDC1000_ENABLETDC1000_CHSEL

TDC1000_ERRB

TDC1000_R ESET

MSP_TDC7200_EN

VDD_ENABLE

GNDGND

GND

VSEL1

VSEL2

VSEL3

PA_POWER_EN

VSEL4

LOAD_ENABLE

FAST_CHARGE

SLOW_CHARGE

IM_CH1_SEL

IM_CH2_SELPA_VSEL

GPIO5

GPIO2

GPIO1

GPIO4

GPIO3

GPIO7

GPIO6

V_SUP_CAPV_PA

0.1uFC1

GND

TARGET_3V3

1 2

DNP

X1

12

JP2

12

JP3

SH-JP2

SH-JP3

DNPR26

S1

S2

S3

UART0_RXDUART0_TXD

FET_PWR

VBat

1

23

4

5

6

J1UART0_RXD

JTAG_TESTJTAG_RST/NMI

UART0_TXD

pin 1 of the header is pointingto the left hand side of a PCBedge.

GND

FET_PWR

1 2

JP1

SH-JP1

DNPR24DNPR25

LCD14LCD15

LC

D2

LC

D3

LC

D2

LC

D3

LC

D1

4LC

D1

5

MCU_V

GND

10µFC20

60 ohm

FB5

TARGET_3V3

1

2

JP7

1

2

JP6

Design Files www.ti.com

Figure 38. MCU Circuit Schematic

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9.2 Bill of MaterialsTo download the bill of materials (BOM), see the design files at TIDM-ULTRASONIC-FLOW-TDC.

Table 2. BOM

DESIGNATOR VALUE QTY DESCRIPTION FOOTPRINT MANUFACTURER LIBREFC1, C2, C3, C4, C5, 0.1uF, 0.1uF, 22pF,C6, C7, C8, C9, 22pF, DNP, DNP,C11, C12, C13, R1, 0.1uF, 0.1uF, 0.1uF,R2, R3, R4, R5, R6, 0.1uF, 0.1uF, 2.2nF,R7, R8, R9, R10, 0R, 0R, 0R, 0R, 0R, Capacitors andR11, R12, R13, 39 402 Cap, Res20R, 0R, 0R, 0R, 0R, ResistorsR14, R16, R17, 0R, 0R, 0R, 0R, 10R,R18, R21, R22, 100K, 12K, DNP, DNP,R23, R24, R25, DNP, DNP, DNP, DNP,R26, R27, R28, 47K, 470R, 470R, 12KR29, R67C10 4u7 1 Capacitor 805 Cap

CAP, CERM, 22 GRM21BR60J226C14 22uF 1 µF, 6.3 V, +/- 0805_HV MuRata ME39L20%, X5R, 0805CAP, ElectricDouble Layer, ESHSR_800x2 ESHSR-0003C0-C15 3000000uF 1 3000000 µF, 2.7 NESSCAP000 002R7V, +20/-10%,0.061 ohm, THCAP, CERM, 10 GRM219R61A10C16 10uF 1 µF, 10 V, +/- 0805_HV MuRata 6KE44D10%, X5R, 0805CAP, CERM,0.1 µF, 6.3 V, C1005X5R0J104C17 0.1uF 1 402 TDK+/- 10%, X5R, K0402CAP, CERM, 10 GRM21BR71A10C18, C19, C20, C27 10uF 4 µF, 10 V, +/- 0805_HV MuRata 6KE51L10%, X7R, 0805CAP, CERM, GRM188R71E10C34, C36 0.01uF 2 0.01uF, 25V, +/- 603 MuRata 3KA01D10%, X7R, 0603CAP, CERM,51pF, 100V, +/- GRM1885C2A51C23, C25 51pF 2 603 MuRata5%, C0G/NP0, 0JA01D0603CAP, CERM,0.01uF, 25V, +/- C1608C0G1E103C24 0.01uF 1 603 TDK5%, C0G/NP0, J0603CAP, CERM,1000 pF, 50 V, C1608C0G1H102C26 1000pF 1 603 TDK+/- 5%, JC0G/NP0, 0603CAP, CERM, GRM155R61A10C28, C30 0.01uF 2 0.01uF, 10V, +/- 402 MuRata 3KA01D10%, X5R, 0402CAP, CERM, C1005X5R1A104C29, C31, C35, C37 0.1uF 4 0.1uF, 10V, +/- 402 TDK K10%, X5R, 0402CAP, CERM,300pF, 50V, +/- GRM1885C1H30C32, C33 300pF 2 805 MuRata5%, C0G/NP0, 1JA01D0603CAP, CERM, GRM188R71E10C38 1uF 1 1uF, 25V, +/- 603 MuRata 5KA12D10%, X7R, 0603

31TIDU965A–May 2015–Revised July 2015 Ultrasonic Water Flow Measurement Using Time to Digital ConversionSubmit Documentation Feedback

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Table 2. BOM (continued)DESIGNATOR VALUE QTY DESCRIPTION FOOTPRINT MANUFACTURER LIBREF

0.8A FerriteFB1, FB2, FB3, Bead, 60 ohm60 ohm 4 603 Taiyo Yuden BK1608HS600-TFB4, FB5 @ 100MHz,

SMDStandoff, Hex, Keystone_1902H5, H6, H7, H8 4 0.5"L #4-40 Keystone 1902CCNylonReceptacle, Mill-Max_851- 851-43-006-10-J1 1 50mil, 6x1, XX-006-10- Mill-Max 001000Gold, TH 001000Header (friction MOLEX_22-27-J3 1 lock), 100mil, Molex 22-27-202120212x1, Tin, THHeader, 100mil, TSW-103-07-J4 1 Samtec TSW-103-07-G-S3x1, Gold, TH G-SReceptacle, 50 Mill-Max_851- 851-43-008-20-J5 1 mil, 8x1, Gold, 43-008-20- Mill-Max 001000R/A, TH 001000Receptacle, CONN_851-43- 851-43-010-20-J6 1 50mil, 10x1, Mill-Max010-20-001000 001000Gold, R/A, TH

Mill-Max_800-Header, 100mil, 800-10-006-10-J7 1 10-006-10- Mill-Max6x1, TH 001000001000Receptacle, 7x2, SSW-107-02- SSW-107-02-G-J8 1 2.54mm, R/A, SamtecG-D-RA D-RATHConnector,Receptacle, CONN_PPPC0 Sullins Connector PPPC052LJBN-J9 1 100mil, 5x2, 52LJBN-RC Solutions RCGold plated,R/A, THHeader, TH,100mil, 2x1,JP1, JP2, JP3, JP4, TSW-102-07-5 Gold plated, 230 Samtec TSW-102-07-G-SJP5, JP6, JP7 G-Smil aboveinsulatorHeader, 7-Pin, 2X7BOXHEADJTAG1 1 MHDR2X7Dual row ERInductor,Shielded Drum LPS3314-L1 3.3uH 1 Core, Ferrite, LPS3314 Coilcraft 332MLB3.3uH, 1.3A,0.14 ohm, SMDInductor,Shielded, IND_VLF25201 VLF252015MT-L2 2.2uH 1 Ferrite, 2.2uH, TDK5 2R2M0.97A, 0.056ohm, SMD

LCD1 1 FH-1152P FH-1152PTypical RED,GREEN, LED_LTST-LED1, LED2 2 YELLOW, LED2C190AMBER GaAsLED

MCU_RST, S1, S2, 4 Switch B3U-1000P SW-PBS3Transistor, PNP, MMBT3906,FairchildQ1, Q3 0.25V 2 40V, 0.2A, SOT- SOT-23 FairchildSemiconductor23 Semiconductor

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Table 2. BOM (continued)DESIGNATOR VALUE QTY DESCRIPTION FOOTPRINT MANUFACTURER LIBREF

Transistor, NPN, MMBT3904,FairchildQ2, Q4, Q5, Q6 0.2V 4 40V, 0.2A, SOT- SOT-23 FairchildSemiconductor23 SemiconductorRES, 10 M, 5%, CRCW040210M0R15, R59 10Meg 1 402 Vishay-Dale0.063 W, 0402 JNED

R19, R20 2 Resistor 402 Res2RES, 100, 5%, CRCW0603100RR30 100 1 603 Vishay-Dale0.1 W, 0603 JNEA

R31, R33, R34, RES, 10.0 M, CRCW060310M0R37, R39, R41, 10.0Meg 8 603 Vishay-Dale1%, 0.1 W FKEAR48, R50RES, 100K, 5%, CRCW0603100KR42, R46,R49, R51 100k 4 603 Vishay-Dale0.1 W JNEARES, 360 k, 5%, CRCW0603360KR32, R38 360k 2 603 Vishay-Dale0.1 W, 0603 JNEARES, 2.4 k, 5%, CRCW06032K40R35 2.4k 1 603 Vishay-Dale0.1 W, 0603 JNEARES, 10 k, 5%, CRCW040210K0R36 10k 1 402 Vishay-Dale0.063 W, 0402 JNEDRES, 510, 0.1%, RG1608P-511-B-R40, R57 510 2 603 Susumu Co Ltd0.1 W, 0603 T5RES, 200 ohm, RG1608P-201-B-R43, R45 200 2 0.1%, 0.1W, 603 Susumu Co Ltd T50603RES, 5.36k CRCW06035K36R44 5.36k 1 ohm, 1%, 0.1W, 603 Vishay-Dale FKEA0603RES, 1.00k RNCF0603TKY1R52 1.00K 1 ohm, 0.01%, 603 DigiKey PN K00CT-ND0.1W, 0603RES, 1.00k CRCW06031K00R47 1.00k 1 ohm, 1%, 0.1W, 603 Vishay-Dale FKEA0603RES, 10.0k RC0603FR-R53, R54 10.0k 2 ohm, 1%, 0.1W, 603 Yageo America 0710KL0603

R55, R56, R62, RES, 0 ohm, CRCW060300000, 0, 0, DNP, DNP 5 603 Vishay-DaleR60, R63 5%, 0.1W, 0603 Z0EARES, 33 ohm, CRCW040233R0R58, R61, R64, R66 33 4 5%, 0.063W, 402 Vishay-Dale JNED0402Header, 10-Pin, TFM-110-02-RF1, RF2 2 MHDR2X10Dual row SM-D-A-K

SH-JP1, SH-JP2, Shunt, 100mil,SH-JP3, SH-JP4, 1x2 6 Gold plated, SNT-100-BK-G 3M 969102-0000-DASH-JP5, SH-JP6 Black

MSP430FR698 MSP430FR698XU1 1 MCU 9 PZLOW Iq BOOSTCONVERTER

U2 1 WITH BYPASS DRV0006A Texas Instruments TPS61291DRVOPERATION,DRV0006A360nA IQ StepDown Converter

U3 1 for Low Power DSS0012A Texas Instruments TPS62740DSSApplications,DSS0012A

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Table 2. BOM (continued)DESIGNATOR VALUE QTY DESCRIPTION FOOTPRINT MANUFACTURER LIBREF

TDC1000Precision AFEU5 1 PW0028A_N Texas Instruments TDC1000PWfor Time ofFlight, PW0028AESD Array ForPortable Space-SavingApplications, 8

U6 1 Channels, -40 to DQD0008A Texas Instruments TPD8E003DQDR+85 degC, 8-pinWSON (DQD),Green (RoHS &no Sb/Br)STOPWATCHIC FOR TIMEMEASUREMENU7 1 PW0014A_N Texas Instruments TDC7200PWT BETWEENTWO EVENTS,PW0014ACrystal, 32.768, CMR200T-X2 1 Cylindrical12.5pF, SMD 32.768KDZFTOSC, 8 MHz, 3.2 x 2.5 x Epson PG-310Y1 1 RS Alt: 667-63531.8 - 3.3V, SMD 1.05mm 8MHzMachine Screw,Round, #4-40 x NY PMS 440 B&F Fastener NY PMS 440H1, H2, H3, H4 4 1/4, Nylon, 0025 PH Supply 0025 PHPhilips panhead

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9.3 PCB LayoutTo download the layer plots, see the design files at TIDM-ULTRASONIC-FLOW-TDC.

Figure 39. Top Overlay Figure 40. Top Layer

Figure 41. Internal Plane 1 Figure 42. Internal Plane 2

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Figure 43. Bottom Layer Figure 44. Bottom Overlay

9.4 Altium Project FilesTo download the Altium project files, see the design files at TIDM-ULTRASONIC-FLOW-TDC.

9.5 Gerber FilesTo download the Gerber files, see the design files at TIDM-ULTRASONIC-FLOW-TDC.

9.6 Software FilesTo download the software files, see the design files at TIDM-ULTRASONIC-FLOW-TDC.

9.7 RF ModulesFor more information on RF modules, contact Milen Stefanov at [email protected].

10 About the AuthorTHOMAS KOT is a system and solutions architect in the Smart Grid and Energy group at TexasInstruments, where he primarily works on the flow meter reference design development and customersupport. Thomas received his bachelor of engineering in electronic engineering from Hong KongPolytechnic University in 1995 and received his master of science in electronic and informationengineering from the same university in 2005. He received the master of business administration from CityUniversity of Hong Kong in 2007. Contact Thomas at [email protected].

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Revision History

Changes from Original (May 2015) to A Revision ........................................................................................................... Page

• Changed title from Ultrasonic TDC Flowmeter Reference Design.................................................................. 1

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

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