MSP-EXP430FR5739 FRAM Experimenter Board
User's Guide
Literature Number: SLAU343B
May 2011–Revised February 2012
2 SLAU343B–May 2011–Revised February 2012Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
Contents
1 Getting Started With the MSP-EXP430FR5739 FRAM Experimenter Board ................................. 51.1 Introduction ............................................................................................................... 5
1.2 Kit Contents .............................................................................................................. 6
1.3 MSP-EXP430FR5739 Board Overview ............................................................................... 6
1.4 Connecting the Hardware .............................................................................................. 6
1.5 Starting the PC GUI ..................................................................................................... 6
2 MSP-EXP430FR5739 User Experience Demo .......................................................................... 72.1 Associated Zip Folder Contents ....................................................................................... 7
2.2 The User Experience Demo ........................................................................................... 7
2.3 View, Edit, or Recompile the User Experience Code Using an IDE ............................................ 13
3 MSP-EXP430FR5739 Hardware ............................................................................................ 143.1 MSP430FR5739IRHA Device Pin Designation .................................................................... 14
3.2 Schematics ............................................................................................................. 15
3.3 PCB Layout ............................................................................................................. 18
3.4 Bill of Materials (BOM) ................................................................................................ 21
4 Suggested Reading ........................................................................................................... 225 References ....................................................................................................................... 22
3SLAU343B–May 2011–Revised February 2012 Table of ContentsSubmit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
www.ti.com
List of Figures
1 MSP-EXP430FR5739 Overview .......................................................................................... 5
2 Comparing Write Speeds When Writing to Nonvolatile Memory (MSP430FR5739 FRAM vsMSP430F2274 Flash) ...................................................................................................... 8
3 Comparing Average Power When Writing to Nonvolatile Memory at 13 kBps (MSP430FR5739 FRAM vsMSP430F2274 Flash)..................................................................................................... 10
4 On-Board Accelerometer ................................................................................................. 11
5 On-Board NTC Thermistor ............................................................................................... 12
6 MSP430FR5739 Pin Designation ....................................................................................... 14
7 Schematics (1 of 3)........................................................................................................ 15
8 Schematics (2 of 3)........................................................................................................ 16
9 Schematics (3 of 3)........................................................................................................ 17
10 MSP-EXP430FR5739 Top Layer........................................................................................ 18
11 MSP-EXP430FR5739 Bottom Layer .................................................................................... 19
12 MSP-EXP430FR5739 Silkscreen ....................................................................................... 20
List of Tables
1 User Experience Source Files ........................................................................................... 13
2 Bill of Materials (BOM).................................................................................................... 21
4 List of Figures SLAU343B–May 2011–Revised February 2012Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
USB Connection
Debugging andProgramming Interface
Accelerometer
NTC Thermistor
LED0 to LED8
MSP430FR5739 device
User Input Switches S1,S2
Reset Switch
Connection to EXP-MSP430F5438
Connection to CCxxxxDaughter Cards
SBW and MSP430Application UART
User's GuideSLAU343B–May 2011–Revised February 2012
MSP-EXP430FR5739 FRAM Experimenter Board
1 Getting Started With the MSP-EXP430FR5739 FRAM Experimenter Board
1.1 Introduction
The MSP-EXP430FR5739 Experimenter Board introduces TI's first embedded ferro-electric randomaccess memory (FRAM) based MCU, the MSP430FR5739. The experimenter board is an ideal platformfor evaluating the latest in embedded memory technology while allowing the user to easily develop,debug, and implement prototypes in an efficient manner.
The MSP430FR5739 device is supported by both IAR Embedded Workbench and Code Compose Studio.It is recommended to download the latest version of the IDE from www.msp430.com.
The Quick Start Guide (SLAU341) is recommended for users who cannot wait to get started developingwith the MSP430FR5739. For all others, this MSP-EXP430FR5739 FRAM Experimenter Board User'sGuide provides detailed information on the hardware, the user experience firmware, and theMSP430FR5739 device.
The MSP-EXP430FR5739 Experimenter Board is available for purchase from the TI eStore athttps://estore.ti.com/MSP-EXP430FR5739-MSP-EXP430FR5739-Experimenter-Board-P2430C42.aspx.
Figure 1. MSP-EXP430FR5739 Overview
5SLAU343B–May 2011–Revised February 2012 MSP-EXP430FR5739 FRAM Experimenter BoardSubmit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
Getting Started With the MSP-EXP430FR5739 FRAM Experimenter Board www.ti.com
1.2 Kit Contents
The MSP-EXP430FR5739 FRAM Experimenter Board kit includes the following:
• The MSP-EXP430FR5739 board
• Mini USB-B cable, 0.5 m
• 12-pin PCB connectors (two male and two female)
• 32.768-kHz clock crystal from Microcrystal (www.microcrystal.com)
The 32.768-kHz crystal can be used as the low-frequency XT oscillator. It is not required for the UserExperience code and can be populated as needed.
• Quick start guide
See Section 2.1 for details on the associated software and source code.
1.3 MSP-EXP430FR5739 Board Overview
The experimenter board (see Figure 1) comes equipped with the following features:
• USB debugging and programming interface that uses a driverless installation and provides anapplication UART to communicate back to the PC
• On-board ADXL335 accelerometer
• NTC thermistor for temperature sensing
• Two user input switches and a reset switch
• Eight LEDs for output display
• Connectivity to the MSP-EXP430F5438 Experimenter Board
• Connectivity to CCxxx radio daughter cards
• Easily accessible device pins for debugging purposes or as socket for adding customized extension
• Separate power jumpers to measure power to the MSP430 and the RF daughter card.
1.4 Connecting the Hardware
Connect the MSP-EXP430FR5739 to the PC using the enclosed USB cable. If the PC has an MSP430Integrated Development Environment (IDE) such as Code Composer Studio™ or IAR EmbeddedWorkbench™ already installed, the driver files are automatically located and installed.
If there are no IDEs installed in the PC, unzip the folder associated with this user's guide (see Section 2.1)and point the installation to the [Install Path]\MSP-EXP430FR5739\Drivers folder.
After the drivers are installed, go to My Computer → Properties → Hardware → Device Manager to verifythat the board is enumerated under Ports COM & LPT as MSP430 Application UART.
1.5 Starting the PC GUI
The Graphical User Interface (GUI) for the PC is located in the associated zip file (see Section 2.1) under[Install Path]\MSP-EXP430FR5739\Graphical User Interface.
Double click on FRAM_GUI.exe to load the PC application. More information on how to use thisapplication is provided in Section 2.
6 MSP-EXP430FR5739 FRAM Experimenter Board SLAU343B–May 2011–Revised February 2012Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
www.ti.com MSP-EXP430FR5739 User Experience Demo
2 MSP-EXP430FR5739 User Experience Demo
2.1 Associated Zip Folder Contents
The zip file that contains the software and source code for the MSP-EXP430FR5739 can be downloadedfrom www.ti.com/lit/zip/slac492. The contents of the zip include:
• User Experience source code and project files
• Drivers that support the board installation
• PC GUI
The design files for the experimenter board are can be downloaded from www.ti.com/lit/zip/slac502.
2.2 The User Experience Demo
The User Experience demo is pre-loaded in the MSP-EXP430FR5739 board.
The user input to the demo is given using the switches S1 and S2. These switched allow the user toselect the mode of operation and other options.
The output from the demo is displayed using the LEDs (LED1 to LED8) and is also sent via theback-channel UART that transmits information to the PC.
There are four modes of operation for the User Experience demo:
1. High-speed FRAM writes
2. Emulating the speed of flash writes
3. Sampling accelerometer data and writing to FRAM
4. Sampling thermistor data and writing to FRAM
2.2.1 Entering and Exiting the Demo Modes
Follow these steps to enter and exit the demo modes:
1. Press switch S1 for mode selection. After you press S1, LED8 through LED5 light up to show thecorresponding mode.
2. Press switch S2 to enter the mode.
3. Press switch S2 when inside a mode to turn off the display (LED and UART output). This is usefulwhen measuring power.
4. Press S1 to exit a mode and return to mode selection.
NOTE: Pressing S2 without selecting a mode causes LED8 to toggle rapidly, indicating an invalidsequence. To exit from this mode, press S1 to return to mode selection.
The MSP-EXP430FR5739 board is equipped with a reset switch. On reset, the device displays a shortLED lighting sequence.
7SLAU343B–May 2011–Revised February 2012 MSP-EXP430FR5739 FRAM Experimenter BoardSubmit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
Write
Speed (
kB
/s)
1400
13
1
10
100
1000
10000
FRAM Flash
MSP-EXP430FR5739 User Experience Demo www.ti.com
2.2.2 Using Mode 1 – FRAM High Speed Writes
Mode 1 is entered by pressing S1 once, followed by S2. On entry, LED8 through LED1 light upsequentially to display the speed of FRAM writes.
Every time the LED1 through LED8 sequence is completed, 800KB are written to FRAM. In this mode,FRAM is bring written to at about 1.8MB per second. In comparison, a full-speed write to flash canachieve speeds of approximately 13kB per second.
Figure 2. Comparing Write Speeds When Writing to Nonvolatile Memory(MSP430FR5739 FRAM vs MSP430F2274 Flash)
Note that the code is optimized for power and not speed. FRAM memory blocks can be written at speedsgreater than 8MB per second depending on how the code is optimized. See the application reportAchieving High-Speed FRAM Writes Using the MSP430FR5739 for more details.
On entering Mode 1, the address of the FRAM scratchpad location is calculated. For the User Experiencedemo, the scratchpad location starts at 0xD400 and ends at 0xF000. This location can be modified in theheader file FR_EXP.h. Note that when changing this location, it is important to first check the code spacerequirements in the map file to ensure that the FRAM scratchpad area does not overlap with theapplication code. Different compilers and optimization settings may impact the placement of theapplication code. If any overlap occurs, the application code may be overwritten in Mode 1, which cancause the demo to fail.
In Mode 1, the system main clock is configured to use the DCO set to 8 MHz. A function that performslong-word writes to FRAM is called continuously inside a while loop. Each time the FRAM_Write() functionin FR_EXP.c is called, 512 bytes are written. This number was chosen arbitrarily to mimic flash segments,and there are no restrictions on the number of FRAM bytes that can be written at once. While in Mode 1,the LED sequence changes every time 100kB are written. For example, after the first 100KB are written,LED8 is turned on; after the next 100kB are written, LED8 and LED7 are turned on; and so on. Thesequence completes when all eight LEDs are turned on, after which the process rolls over and startsagain from LED8.
Also, after every 100kB, a UART data transmission occurs. This data is sent to the PC via a back-channelUART and is used to calculate the FRAM write speed and endurance information that is displayed in thePC GUI. The raw data can also be viewed directly using a PC application such as HyperTerminal.
8 MSP-EXP430FR5739 FRAM Experimenter Board SLAU343B–May 2011–Revised February 2012Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
www.ti.com MSP-EXP430FR5739 User Experience Demo
2.2.2.1 Measuring Current on the MSP-EXP430FR5739
While measuring the active power in a mode, the LEDs should be turned off and the UART transmissionsshould be halted. This is done by pressing switch S2 while inside the mode. Switch S2 toggles the displaysettings, turning them on or off as needed. Turning the display off allows the user to isolate and measurethe current consumption of the MSP430 device when executing instructions at a clock speed of 8 MHzand writing to FRAM. In bench tests, the MSP430 IDVCC was measured at approximately 800 µA.
Note that, because of the nature of the FRAM cache, the number of accesses to FRAM memory cangreatly impact the active power consumption. Unoptimized code that performs a higher number ofaccesses to FRAM can cause an increase in the measured current. It is advisable to review the compilersettings when setting up a project using IDEs such as CCS or IAR to ensure the most efficient code and,hence, the least active power.
The project that accompanies this document (see Section 2.1) uses a level 1 optimization setting in bothIAR and CCS that is one step higher than the default optimization levels.
As mentioned previously, when measuring the ICC on the board, it is important to isolate the currentconsumption by the MSP430FR5739 only. The measurement can be done when the board is powered viaUSB or externally via a battery. When powering via the USB, it is recommended to disconnect theemulation portion from the MSP430FR5739 device. This can be done by removing jumpers TXD, RXD,Reset, and Test on J3. A multimeter can be used to measure the current into the MSP430FR5739 VCC byremoving the VCC jumper and placing the multimeter leads in series.
An alternate approach requires powering the board externally via the VCC and GND connection anddisconnecting the USB cable from the board. In this case, the multimeter can be placed in series to VCC byremoving the MSP_PWR jumper.
These recommendations hold true when measuring IDVCC in all four modes.
2.2.2.2 Displaying Results on the PC GUI
The GUI associated with this document provides details on the time elapsed in the mode, number of byteswritten, speed of FRAM, and the endurance of FRAM emulated over a 512 byte FRAM block.
The endurance is calculated based on the 1014 program/erase cycles for the MSP430FR5739. Becausethe GUI updates every one minute, the scale of reduction of FRAM endurance is very small. A moreobvious decline in endurance can be observed in Mode 2 when the endurance reduction when using flashis emulated.
2.2.3 Using Mode 2 – Emulating the Speed of Flash Writes
Mode 2 is entered by pressing S1 twice, followed by S2. In this mode, the maximum speed at which flashcan be written to (at a 100% active duty cycle) is emulated on FRAM.
Similar to Mode 1, on entry into Mode 2, LED8 through LED1 light up sequentially to display the speed ofemulated flash writes. Every time the LED1 through LED8 sequence is completed, an 800KB write to flashis emulated. In this mode, FRAM is written to at approximately 12 kBps. The entire sequence requiresapproximately 80 seconds, so the demo should be observed for more than one minute to see the LEDsequence roll over.
NOTE: The time to run this sequence varies depending on the frequency source to the interval timer(that is, the VLO).
The test uses the same scratchpad FRAM memory as Mode 1 and the same system setup. In this mode,after every 2KB of memory is written, a UART packet is transmitted to the PC GUI to allow it to calculatespeed and endurance information.
When measuring the average power the methodology described in Section 2.2.2.1 needs to be followed.
9SLAU343B–May 2011–Revised February 2012 MSP-EXP430FR5739 FRAM Experimenter BoardSubmit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
Power Consumption at 13 kB/s (µA)
1
10
100
1000
10000
FRAM Flash
Avera
ge p
ow
er
(µA
)
MSP-EXP430FR5739 User Experience Demo www.ti.com
2.2.3.1 The Math Behind Mode 2
The MSP430F2274 device was used as a benchmark device to calculate the maximum flash write speed.For a 512-byte block of flash, the following parameters were obtained from the MSP430F2274 data sheet:
Segment erase time = 4819 × tFTG = 16 msWhere, tFTG = 1 / fFTG ≈ 1 / 300 kHz
512 bytes write time ≈ 51.2 ms
Total time to write to 512 bytes ≈ 67.2 ms
Time to write to 100KB = 6.72 seconds, which calculates to 14.8 kBps
When measuring the speed of continuous flash writes on the bench, the observed speed is approximately12 kBps, because the code execution overhead is added to the time calculated above.
This write speed is emulated with the FRAM device by maintaining a low active duty cycle and performingone 512 byte block write every 40 ms.
Number of writes per second = 1 / 40 ms = 25
Number of bytes written per second = 512 × 25 = 12.800 kBps
The timing of the FRAM write is controlled by the VLO clock.
From these bench tests, it can be seen that writing 12 kBps to flash requires nearly 100% duty cycle,while writing the same speed to FRAM requires less than 1% duty cycle. The rest of the time, the FRAMdevice is in shutdown mode (LPM4), which results in an average current of less than 10 µA. Incomparison, for a similar write speed, flash-based MCUs can require average current up to 2.2 mA.
Figure 3. Comparing Average Power When Writing to Nonvolatile Memory at 13 kBps(MSP430FR5739 FRAM vs MSP430F2274 Flash)
2.2.3.2 Displaying Results on the PC GUI
When in Mode 2, the GUI provides details on the time elapsed in the mode, number of bytes written,speed of emulated flash writes, and the endurance emulated over a 512 byte flash block.
The endurance is calculated based on the 104 program/erase cycles (minimum) for the MSP430F2274. Ifa 512-byte block on a flash device were written to at a speed of 12.5 kBps (that is, 25 times per second),the endurance would exceed the minimum limit in 10000/25 or 6.6 minutes.
Note that the MSP-EXP430FR5739 board only emulates this test to demonstrate a comparison in speedand endurance between FRAM and flash; it does not perform the test on an actual flash device.
10 MSP-EXP430FR5739 FRAM Experimenter Board SLAU343B–May 2011–Revised February 2012Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
3 Axis Accelerometer
www.ti.com MSP-EXP430FR5739 User Experience Demo
2.2.4 Using Mode 3 – Accelerometer Demo
Mode 3 is entered by pressing switch S1 three times, followed by switch S2.
Upon entering this mode, the on-board accelerometer (see Figure 4) is calibrated. To aid this calibrationprocess, it is recommended to place the board on a level surface before entering the mode.
Figure 4. On-Board Accelerometer
After the calibration sequence is completed, LED4 and LED5 are turned on. When tilting the board in anupward or downward direction, the LEDs follow the direction of the tilt. S2 toggles the display on and off,similar to other modes.
Mode 3 also writes the sampled data from the ADC to the FRAM in real time with no wait states or extracycles spent on setting up the FRAM. This can be observed in the ADC interrupt service routine. Thesampling takes place at more than 15k samples per second. At this speed, flash devices require that thedata be buffered in RAM before writing to flash. In FRAM devices, the only bottleneck is the speed atwhich the ADC can sample, not the writes to nonvolatile memory.
2.2.4.1 Displaying Results on the PC GUI
When in the accelerometer mode, the GUI mimics the LEDs that are lit up on the Experimenter Board andare a reflection of the tilt of the board.
11SLAU343B–May 2011–Revised February 2012 MSP-EXP430FR5739 FRAM Experimenter BoardSubmit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
NTC Thermistor
MSP-EXP430FR5739 User Experience Demo www.ti.com
2.2.5 Using Mode 4 – Temperature Sensor Demo
Mode 4 is entered by pressing switch S1 four times, followed by switch S2.
Upon entering this mode, the on-board thermistor (see Figure 5) is calibrated.
Figure 5. On-Board NTC Thermistor
After the calibration sequence is completed, LED4 and LED5 are turned on. When the NTC resistor isheated (for example, by placing a finger on it), LED3 through LED1 are turned on sequentially. When theNTC is cooled (for example, by using a freeze spay or a keyboard dust remover that uses compressed air)LED5 through LED8 are turned on sequentially.
Similar to Mode 3, Mode 4 also writes the sampled data from the ADC to the FRAM in real time with nowait states or extra cycles spent on setting up the FRAM. This can be observed in the ADC interruptservice routine. The sampling takes place at more than 15k samples per second. At this speed, flashdevices require that the data be buffered in RAM before writing to flash. In FRAM devices, the onlybottleneck is the speed at which the ADC can sample, not the writes to nonvolatile memory.
2.2.5.1 Displaying Results on the PC GUI
When in the temperature sense mode, the GUI mimics the LEDs that are lit up on the Experimenter Boardand are a reflection of the thermistor's ambient temperature measurement.
12 MSP-EXP430FR5739 FRAM Experimenter Board SLAU343B–May 2011–Revised February 2012Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
www.ti.com MSP-EXP430FR5739 User Experience Demo
2.3 View, Edit, or Recompile the User Experience Code Using an IDE
There are different development software tools available for the MSP-EXP430FR5739 board. IAREmbedded Workbench™ KickStart™ and Code Composer Studio™ (CCS) IDEs are both available in afree limited version. IAR Embedded Workbench allows 4KB of C-code compilation. CCS is limited to acode size of 16KB. The software is available at www.ti.com/msp430.
To view, modify, or edit the User Experience code provided with the MSP-EXP430FR5739, an IDEinstallation is required. The associated software package (see Section 2.1) supports both IAR and CCSprojects.
The User Experience source files and project folders are provided in the folder [InstallPath]\MSP-EXP430FR5739\MSP-EXP430FR5739 User Experience.
2.3.1 Setting up the IAR Workspace for the User Experience Code
To set up the IAR workspace for the User Experience demo source code:
1. Double-click and open MSP-EXP430FR5739_Workspace.eww in IAR.
2. The Project is automatically included in the workspace.
3. Click Project → Download & Debug to download the code to the MSP-EXP430FR5739 ExperimenterBoard.
4. If multiple emulation tools are connected to your PC, click Project → Options → FET Debugger →Connection to explicitly select the experimenter board.
2.3.2 Importing the CCS Project for the User Experience Code
To import the CCS project for the User Experience demo source code:
1. Create a workspace folder.
2. Open CCS and point to the newly created workspace folder.
3. Click Project → Import Existing CCS/CCE Eclipse Project.
4. Browse to the folder [Install Path]\MSP-EXP430FR5739\MSP-EXP430FR5739 User Experience thatwas extracted from the associated zip file (see Section 2.1).
5. The project MSP-EXP430FR5739_UserExperience is automatically selected.
6. Click Finish to include the project in the current workspace.
7. Click the Debug icon to download the project
2.3.3 Source Files
Table 1 describes the source files for the User Experience demo.
Table 1. User Experience Source Files
Name Description
Main.c This file contains the user experience demo
Main.h This file contains the definitions that are required for main.c
FR_EXP.c This file contains the definitions of all C functions used by main.c
FR_EXP.h This file contains all the function declarations needed by main.c and FR_EXP.c
13SLAU343B–May 2011–Revised February 2012 MSP-EXP430FR5739 FRAM Experimenter BoardSubmit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
21
22
23
24
25
26
27
28
29
P2.2/TB2.2/UCB0CLK/TB1.0
P2.0/TB2.0/UCA0TXD/UCA0SIMO/TB0CLK/ACLK
TEST/SBWTCK
P2.1/TB2.1/UCA0RXD/UCA0SOMI/TB0.0
P3.4/TB1.1/TB2CLK/SMCLK
P3.5/TB1.2/CDOUT
P3.6/TB2.1/TB1CLK
RST/NMI/SBWTDIOPJ.0/TDO/TB0OUTH/SMCLK/CD6
31
32
33
34
35
36
37
38
39
P2.3/TA0.0/UCA1STE/A6*/CD10
P2.4/TA1.0/UCA1CLK/A7*/CD11
AVCC
PJ.5/XOUT
PJ.4/XIN
AVSS
P2.7
P1.0/TA0.1/DMAE0/RTCCLK/A0*/CD0/VeREF-* 1
9
8
7
6
5
4
3
2
P1.3/TA1.2/UCB0STE/A3*/CD3
P3.3/A15*/CD15
P3.2/A14*/CD14
P3.1/A13*/CD13
P3.0/A12*/CD12
P1.2/TA1.1/TA0CLK/CDOUT/A2*/CD2
P1.1/TA0.2/TA1CLK/CDOUT/A1*/CD1/VeREF+*
VCORE11
19
18
17
16
15
14
13
12
P1.7/TB1.2/UCB0SOMI/UCB0SCL/TA1.0
P1.6/TB1.1/UCB0SIMO/UCB0SDA/TA0.0
P2.6/TB1.0/UCA1RXD/UCA1SOMI
P2.5/TB0.0/UCA1TXD/UCA1SIMO
P4.1P4.0/TB2.0
DVCCDVSS
40
30
102
0
RHA PACKAGE(TOP VIEW)
P1.4/TB0.1/UCA0STE/A4*/CD4
P1.5/TB0.2/UCA0CLK/A5*/CD5
MSP430FR5721MSP430FR5723MSP430FR5725MSP430FR5727MSP430FR5729MSP430FR5731MSP430FR5733MSP430FR5735MSP430FR5737MSP430FR5739
PJ.3/TCK/CD9
PJ.1/TDI/TCLK/TB1OUTH/MCLK/CD7PJ.2/TMS/TB2OUTH/ACLK/CD8
P3.7/TB2.2
AVSS
* Not available on MSP430FR5737, MSP430FR5733, MSP430FR5727, MSP430FR5723
Note: Power Pad connection to V recommended.SS
MSP-EXP430FR5739 Hardware www.ti.com
3 MSP-EXP430FR5739 Hardware
3.1 MSP430FR5739IRHA Device Pin Designation
See the MSP430FR5739 data sheet (SLAS639) for the latest information.
Figure 6. MSP430FR5739 Pin Designation
14 MSP-EXP430FR5739 FRAM Experimenter Board SLAU343B–May 2011–Revised February 2012Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
GN
D
GN
D
47k
100n
47k
47k
10n
16p
16p
1u/6
.3V
100R
100R
100R
100R
12
MH
z
270
green
GN
D
SL
12
7L
6T
H
MS
P-E
XP
43
0G
2 E
MU
LAT
OR
1/2
1.4
R1
C5
R2
R3
64636261605958575655545352515049
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32313029282726252423222120191817
161 2 3 4 5 6 7 8 9 11 12
13
14
15
10
C1
C3
C2
C4
R5
R4
TP1TP2
TP3TP4
TP5TP6
TP7
R6
R7
Q1
R26
LED0
12
34
56
78
910
J3
J4
21 43 5 6
HT
CK
HT
MS
HT
DI
HT
DO
EZ
_V
CC
EZ
_V
CC
EZ
_V
CC
EZ
_V
CC
EZ
_V
CC
GN
D
GN
D
GN
D
RE
SE
T
RE
SE
T
UR
XD
UT
XD
SC
LS
DA
SB
WT
CK
SB
WT
CK
SB
WT
DIO
SB
WT
DIO
CL
K3
41
0
RS
T3
41
0
BT
XD
BR
XD
IB
TX
DI
BR
XD
EZ
_V
BU
S
TE
ST
/SB
WT
CK
RS
T/S
BW
TD
IO
UR
TS
UD
TR
UD
SR
UC
TS
VC
C
P2
.0
P2
.0
P2
.1
P2
.1
Re
mo
ve
dU
2:
SN
75
24
0P
Wfr
om
SB
Wco
nn
ectio
ns
SB
W&
UA
RT
I/F
to
Arg
on
SB
W&
UA
RT
I/F
toe
xte
rna
lTa
rge
t
www.ti.com MSP-EXP430FR5739 Hardware
3.2 Schematics
The schematics and PCB layouts for the MSP-EXP430FR5739 are shown in the following pages.
Figure 7. Schematics (1 of 3)
15SLAU343B–May 2011–Revised February 2012 MSP-EXP430FR5739 FRAM Experimenter BoardSubmit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
Co
nn
ecto
rM
iniU
SB
GN
D
GN
D
GN
D
TU
SB
34
10
VF
GN
DG
ND
GN
D
CAT
24
FC
32
UI
33k
33R 33R
22p
22p
100n
100n
100k/1
%
100k/1
%
1k5
100n
1k5
1k5
100R
33k
10k
15k
1u/6
.3V
GN
DG
ND
TP
S7
73
01
DG
K
GN
DG
ND
100n
61k5
33k
3k3
1u/6
.3V
1N
41
48
GN
D
3k3
GN
D
47k
47k
US
B_
MIN
I_B
5
GN
D
MS
P-E
XP
43
0G
2 E
MU
LAT
OR
2/2
1.4
DN
P
CL
KO
UT
22
SIN
17
TE
ST
023
SD
A10
TE
ST
124
RT
S20
VC
C1
25
VD
D18
4
PU
R5
DM
7
DT
R21
SC
L11
DS
R14
P3.4
29
X2
26
X1
27
SU
SP
EN
D2
SO
UT
19
DC
D15
CT
S13
DP
6
RI/C
P16
VC
C3
GN
D1
18
GN
D8
VR
EG
EN
1
RE
SE
T9
WA
KE
UP
12
P3.3
30
P3.1
31
P3.0
32
GN
D2
28
U3
E0
1S
DA
5
VS
S4
E1
2
WC
7
SC
L6
VC
C8
E2
3
U5
R21
R15
R14
C10
C9
C12
C11
R20
R18
R13
C13
R25
R24
R23
R12
R10
R11
C8
IN1
5O
UT
18
EN
4
IN2
6
RE
S2
OU
T2
7
FB
1
GN
D3
U2
C7
R8
R9
R19
C6
D1
R22
R17
R16
IO13
VCC1
IO25
GND4
NC2
VB
US
1
ID4
D-
2
U$
2 D+
3
GN
D5
SH
IELD
1S
1
SH
IELD
2S
2
SH
IELD
3S
3
SH
IELD
4S
4
EZ
_V
CC
EZ
_V
CC
EZ
_V
CC
EZ
_V
CC
EZ
_V
CC
EZ
_V
CC SD
AS
CL
UT
XD
UR
XD
RE
SE
T
CL
K3
41
0
RS
T3
41
0
BR
XD
IB
TX
DI
EZ
_D
+
EZ
_D
-
EZ
_V
BU
S
EZ
_V
BU
S
UC
TS
UD
SR
UR
TS
UD
TR
VC
C=
+3
.6V
DN
P
MSP-EXP430FR5739 Hardware www.ti.com
Figure 8. Schematics (2 of 3)
16 MSP-EXP430FR5739 FRAM Experimenter Board SLAU343B–May 2011–Revised February 2012Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
GN
D
10
uF
/10
V
GN
D
GN
D
12
pF
12
pF
100nF QUARZ5
FR
57X
X--
RH
A40R
HA
PA
CK
AG
E
47
0n
GND
eZ
-RF
GN
DG
ND
GN
DG
ND
GN
D
0R
470k 100k
GN
D
.1uRF
_P
WR
GN
D
4.7
u
GN
D
GN
D
GN
D
.1u
.1u
.1
u
GN
DG
ND
4.7
u
AD
XL
32
2/3
30
.1u
GN
D
0.1u
10u
GN
DG
ND
GN
DG
ND
330
330
GN
DG
ND
330
330
330
330
330
330
47k GN
D2.2
n
FR
57
xx
Fra
un
ch
pa
d
Ext_
PW
R
DN
P DN
P
DN
P
1.0
C2
3
1
2
3
J6
12
S1
12
S2
C2
2
C2
1
C20
Q2
37_PJ.437
24
_P
3.4
24
25
_P
3.5
25
33_P2.733
5_
P3
.15
38_PJ.538
1_
P1
.01
22
_P
2.1
22
26
_P
3.6
26
13_PJ.2_TMS13
14_PJ.3_TCK14
9_
P1
.49
10
_P
1.5
10
11_PJ.0_TDO11
12_PJ.1_TDI_TCLK12
15_P4.015
16_P4.116
17_P2.517
23
_P
2.2
23
40_AVCC40
28
_P
1.6
28
27
_P
3.7
27
8_
P1
.38
7_
P3
.37
6_
P3
.26
34_P2.334
35_P2.435
36_AVSS36
2_
P1
.12
3_
P1
.23
21
_P
2.0
21
20__RST_SBWTDIO20
19_TEST_SBWTCK19
18_P2.618
29
_P
1.7
29
30
_V
CO
RE
30
31_DVSS31
32_DVCC32
FR
57
XX
39_AVSS39
4_
P3
.04
41_TPTP
C1
4
1 3 5
2 4 6
7 9
8
10
11 13
15
12
14
16
17
RF
3
18
1 3 5
2 4 6
7 9
8 10
11 13
15
12
14
16
17
19
RF
1
18
20
1 3 5
2 4 6
7 9
8 10
11 13
15
12
14
16
17
19
RF
2
18
20
1MSP_PWR
2
TP
8T
P9
TP
10
TP
11
TP
12
TP
13
TP
15
TP
14
R34
R35 NTC
C3
1
1
2
RF
_P
WR
C3
2
1 2 3 4 5 6 7 8 9 10
11 12
SV
1
1 2 3 4 5 6 7 8 9
10
11 12
SV
2
C1
5
C1
6C
17
C5
3
NC
1
ST
2
CO
M3
NC
4
CO
M5
CO
M6
CO
M7
ZO
UT
8N
C9
YO
UT
10
NC
11X
OU
T1
2N
C1
3V
S1
4V
S1
5N
C1
6
AC
C
C5
8
C18
C19
LED2
LED1
R28
R29
LED4
LED3
R36
R37
R27
R30
R31
R32
LED5
LED6
LED7
LED8
TP
16
TP
17
LDR
12
RST
R33
C2
4
GNDG
ND
GN
D
GND
GND
GND
GND
GN
D
VC
C
VC
C
VC
C
VC
C
XINRX
INR
XOUTR
XO
UT
R
VC
OR
E
P2
.6
P2
.6
P1
.7
P1
.7P
1.7
P1
.6
P1
.6
P1
.6
P3
.7
P3
.7
P3
.7
P3
.6
P3
.6
P3
.5
P3
.5
P3
.4
P3
.4
P2
.2
P2
.2
P2
.2
P2
.1
P2
.0
P2
.0
P2
.0
P2
.5
P2
.5
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
TE
ST
/SB
WT
CK
P4
.1
P4
.1
P4
.1
P4.1
P1
.0P
1
P1
.0
P1
.0
P1
.0
P1
.1
P1
.1
P1
.1
P1
.1
P1
.2
P1
.2
P1
.2
P1
.2
P3
.0
P3
.0
P3
.1P
3.1
P3
.2P
3.2
P3
.3
P3
.3
P1
.3
P1
.3
P1
.3
P1
.4
P1
.4
P1
.5
P4
.0
P4
.0
P4
.0
P4
.0
VCC_MSP
VCC_MSP
VC
C_
MS
P
VC
C_
MS
P
P2.4
P2
.4
P2
.4
P2.3
P2
.3
P2
.3
P2.7
P2
.7
P2
.7
P2
.7
P2
.7
RF
PW
R
RF
PW
R
RF
PW
R
PJ.0
PJ.0
PJ.1
PJ.1
PJ.2
PJ.2
PJ.3
PJ.3
XT1_GND
2o
r3
-Axis
Acce
lero
me
ter
www.ti.com MSP-EXP430FR5739 Hardware
Figure 9. Schematics (3 of 3)
17SLAU343B–May 2011–Revised February 2012 MSP-EXP430FR5739 FRAM Experimenter BoardSubmit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
MSP-EXP430FR5739 Hardware www.ti.com
3.3 PCB Layout
Figure 10. MSP-EXP430FR5739 Top Layer
18 MSP-EXP430FR5739 FRAM Experimenter Board SLAU343B–May 2011–Revised February 2012Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
www.ti.com MSP-EXP430FR5739 Hardware
Figure 11. MSP-EXP430FR5739 Bottom Layer
19SLAU343B–May 2011–Revised February 2012 MSP-EXP430FR5739 FRAM Experimenter BoardSubmit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
MSP-EXP430FR5739 Hardware www.ti.com
Figure 12. MSP-EXP430FR5739 Silkscreen
20 MSP-EXP430FR5739 FRAM Experimenter Board SLAU343B–May 2011–Revised February 2012Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
www.ti.com MSP-EXP430FR5739 Hardware
3.4 Bill of Materials (BOM)
Table 2 shows the bill of materials for the MSP-EXP430FR5739 board.
Table 2. Bill of Materials (BOM)
NumbePos. Ref Des r per Description
Board
1 C1 1 10n
2 C2,C3 2 16p
3 C4, C6, C8 3 1u/6.3V
C5, C7, C11,4 5 100nC12,C13
C15, C16, C17,5 C18, C20, C31, 7 100n
C58
6 C9, C10 2 22p
7 C14 1 470n
8 C19 1 10u
9 C21, C22 0 12pF
10 C23 1 10uF/10V
11 C24 1 2.2nF
12 C32, C53 2 4.7u
13 D1 1 1N4148
14 FR5739 1 FR5739-RHA40
15 J3 1 2x05 Pin Header Male
16 J4 [1] SL127L6TH
17 J6 1 3-pin header, male, TH
18 LDR 0 Do not populate
19 LED0 1 LED GREEN 0603
20 LED1 - LED8 8 LED BLUE 470NM 0603 SMD
21 MSP_PWR 1 2-pin header, male, TH
22 NTC 1 100k
23 Q1 1 12MHz
24 Q2 1 Crystal
R1, R2, R3, R16,25 4 47kR17, R33
R4, R5, R6, R7,26 4 100RR23
27 R8 1 61k5
28 R12 1 33k
29 R9 1 30K
30 R10 1 10k
31 R11 1 15k
32 R13, R24, R25 3 1k5
33 R14, R15 2 33R
34
35 R18, R20 2 100k/1%
36 R19, R22 2 3k3
37 R21 1 33k
39 R26 1 270
21SLAU343B–May 2011–Revised February 2012 MSP-EXP430FR5739 FRAM Experimenter BoardSubmit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
Suggested Reading www.ti.com
Table 2. Bill of Materials (BOM) (continued)
NumbePos. Ref Des r per Description
Board
R27, R28, R29,40 R30, R31, R32, 8 330
R36, R37
41 R34 0 0R
42 R35 1 470k
43 RF1, RF2 2
44 RF3 0 eZ-RF connector for EXP-F5438 board
45 RF_PWR 1 RF_PWR
46 S1, S2 2
47 RST 1
48 SV1, SV2 2+[2] 12-pin header, TH
49 U$2 1 USB_MINI_B5
50 U1 1 F1612-PM64
51 U2 1 TPS77301DGK
52 U3 1 TUSB3410VF
53 U4 1 TPD2E001
54 U5 1 CAT24FC32UI
55 U6 1 ADXL335 accelerometer
4 Suggested Reading
The primary sources of MSP430 information are the device-specific data sheets and user's guides. Themost up-to-date versions of those documents can be found at the Texas Instruments MSP430 pagewww.ti.com/msp430.
Visit www.ti.com/fram to find the latest information on TI's FRAM family.
To get an inside view of the CCS and IAR IDEs, download the latest version from the MSP430 page andread the included user's guides and documentation in the installation folder.
Documents describing the IAR tools (Workbench/C-SPY, the assembler, the C compiler, the linker, andthe library) are located in common\doc and 430\doc. All necessary CCS documents can be found inmsp430\doc inside the CCS installation path. The Code Composer Studio v4.2 for MSP430™ User’sGuide (SLAU157) and IAR Embedded Workbench Version 3+ for MSP430™ User's Guide (SLAU138)include detailed information on how to set up a project for the MSP430 using CCS or IAR. They areincluded in most of the IDE releases and on the MSP430 page.
5 References
1. MSP430FR5739 data sheet (SLAS639)
2. MSP430F2274 data sheet (SLAS504)
3. MSP430FR57xx Family User's Guide (SLAU272)
22 MSP-EXP430FR5739 FRAM Experimenter Board SLAU343B–May 2011–Revised February 2012Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2012, Texas Instruments Incorporated