UW-Madison College of Engineering Shared Research

Facilities

Jerry Hunter, Director Wisconsin Center for Applied Microelectronics (WCAM)

Materials Science Center (MSC)Soft Materials Laboratory (SML)

Meeting Organizers

Jerry Hunter, Ph. D.Director

CoE Shared Facilities

Isabelle Girard, Ph. D.Director

Office of Campus Research Cores

Felix Lu, Ph. D.Electrical and Computer Engineering

Co-Director AMIC

Kate SalterAssistant Administrative Director

MRSEC

Julie Last, Ph. D.Instrument Manager

UW-Materials Science Center

Desirée Benefield, Ph. D.Facility Manager

UW Cryo-EM Facility

Agenda for Tutorials

Union South

Level 2 Level 3

Meeting Sponsors

Demonstrations

• Everyone that scheduled Demos should have a personalized schedule 45 minute demonstration, 15 min to get to next demo Please adhere to your schedule

• Demonstration location Materials Science and Engineering

SEM, TEM, AFM, APT, FIB, Nanoindentation, Raman, Mechanical Sample Preparation and XPS

Engineering Research Building RBS and XRD

Engineering Hall Ellipsometry

Engineering Centers Building Electron Beam Lithography

Outline

• Introduction to College of Engineering Shared Research Facilities Wisconsin Center for Applied Microelectronics (WCAM) Materials Science Center Soft Materials Laboratory

• Overview of Analytical Techniques• Summary

CoE Shared Facilities Overview

Wisconsin Center for Applied Microelectronics• Micro and nano-fabrication

facility• 10,000 sq. ft. cleanroom

with 60 instruments

Soft Materials Lab• Polymer characterization

laboratory• 30 major instruments

Materials Science Center• High end microscopy and

microanalysis facility• 30 major instruments

Director: Jerry Hunter

Materials Science Center

Pictures

CoE Shared Research Facilities

Wisconsin Center for Applied Microelectronics

Soft Materials Laboratory

AMIC members receive 20% discount

Overview: FY17 Use

• ~77,000 use hours from 45,000 activities

• 180 Principle Investigators and ~700 users

• 48 different departments covering 8 colleges/schools

• ~30 Companies• ~10 other institutions• 8 courses supported• 320 grants totaling $175M in

research supported

Research in the Physical Sciences • Materials structure/property

relationships• Structures, magnetism and electronics• Advanced materials for energy• Flexible electronics• Quantum devices• Power electronics• Organic/Inorganic interfaces

Research in the Biological Sciences • Hierarchical and active soft materials• Molecular virology• Plant pathology• Membrane trafficking pathways in

plants

Usage statistics (FY17)

WCAM Fabrication Toolset

WCAM Fabrication Toolset• Lithography

ꞏ Nikon NSR-2005i8A Stepperꞏ Canon PLA-501 Contact Alignerꞏ Suss MA6/BA6 double-sided alignerꞏ Suss MJB-3 Contact Alignerꞏ Suss MJB-3 Contact Aligner (with I.R.

backside alignment)ꞏ Headway Photoresist Spinnersꞏ Solitec HMDS chamberꞏ Elionix G100 Electron Beam

Lithographyꞏ (3) Scanning Electron Microscopes with

Nabity electron beam lithography

• Packaging WestBond 747677 Wedge Wire Bonder K+S 4124 Ball Wire Bonder Karl Suss RA-120 Wafer Scribe (2) MicroAutomation 1006 Wafer Saw MEI-720 Die Attacher Indium Evaporator (die bonding) YES vacuum oven Package annealer

• Deposition Ebeam Evaporator (metals) CVC-601 DC Sputterer (metals) Denton Discovery 24 Sputterer (RF &

DC) PlasmaTherm 74 PECVD (dielectrics) Telemark Ebeam Evaporator (dielectrics) Angstrom Ebeam Evaporator (metals)

• Plasma Etch PlasmaTherm 74 RIE/PECVD (deposition

and etch of oxide, nitride on Si) STS ICP Multiplex (Deep Silicon Etcher) Unaxis 790 RIE (general purpose) PlasmaTherm SLR 770 ECR (compound

semiconductors) PlasmaTherm 770 ICP (metals) PlasmaTherm 790-2 ICP (general

purpose) YES Asher Samco UV Ozone cleaner SPTS Xetch E1 XeF2 vapor etch

WCAM Fabrication Toolset• Assembly

EVG Wafer-Wafer Bonder EVG Wafer-Wafer Bond Aligner Tousimis Critical Point Dryer Obducat NIL-25 Nano-imprinter 400C Oven for polymers Cooke polyimide vacuum oven

• Wet Chemical (2) General Purpose Wet Benches HF Wet Bench Piranha Wet Bench Metal Etch Wet Bench Nitride Strip Wet Bench KOH / TMAH Wet Etch Bench (3) Solvent Wet Benches Spin Rinse-dryers

• Thermal Processing 4 stack MRL Phoenix Oxidation Tubes

wet/dry oxides 4 stack MRL Phoenix Oxidation Tubes

diffusion/anneals 4 Stack Tystar Furnace

LPCVD Nitride LPCVD Polysilicon LTO oxide Thermal oxide

AG 610 RTA (contact anneal – compound semi) Pre-furnace clean wet bench

• Metrology Equipment Tencor Flexus 2320 Film Stress Measurement Rudolph Ellipsometer Filmetrics Optical Film Thickness (2)Tencor Alpha Step 200 Profilometers KLA-Tencor P7 Stylus Profilometer Wild M420 Stereo Microscope Several Inspection Microscopes Wafer mapping four-point probe

Dan Christensen

Hal Gilles

Ed Gonzales

Quinn LeonardHal GillesDan Christensen,

WCAM manager Kurt Kupcho

MSC/SML Imaging and Analysis Toolset

• Microscopy Zeiss Auriga 1540 XB Cross Beam (FIB

+ SEM) with Nabity electron beam lithography

FEI Helios G4 UX Plasma FIB/FESEM (2) Leo 1530 SEMs with EDS (1) with

EBSD and Nabity electron beam lithography

Leo 1550 VP SEM with EDS and Nabityelectron beam lithography

Philips CM200UT TEM FEI Tecnai T-12 TEM FEI Tecnai TF30 cryo-TEM NanoMEGAS ASTAR TEM orientation

imaging system FEI Titan aberration corrected (S)TEM Cameca 3000 X Si Atom Probe

Microscope Bruker MultiMode 8 AFM Bruker Bioscope Catalyst AFM Andor spinning disc Confocal

microscope

• Soft Materials Characterization Q1000 Modulated Differential Scanning

Calorimetry Perkin Elmer DSC 8000 Q500 Thermo Gravimetric Analysis ARES LS2 Rheometer RSA III Dynamic Mechanical Analyzer Viscotek GPCmax Gel Permeation

Chromatograph Waters Gel Permeation Chromatograph Waters e2695 HPLC OCA 15/20 Contact Angle measurement

tool (2) Rudolph Auto EIII Ellipsometers Thermo Scientific DXRxi Raman Imaging

Microscope Zetasizer Nano ZSP with Multi Purpose

Titrator MPT-2 Biolin Scientific Q-Sense E4 Quartz crystal

microbalance Woollam IR-VASE Ellipsometer Woollam VASE+AR Ellipsometer

MSC/SML Imaging and Analysis Toolset• Spectroscopy

Thermo K-Alpha XPS Zygo 6300 White light profilometer Horiba Aramis Confocal MicroRaman Horiba fluorolog spectrofluorometer Nicolet NicPlan IR Microscope with

Nicolet Magna 550 Fourier Transform Infrared spectrometer

PE spectrum 19 – UV/VIS/NIR spectrometer

• Mechanical Test Hysitron TI 950 TriboIndenter

Nanoindenter Hysitron PI 95 in-situ TEM Picoindenter

• X-ray Analysis Rigaku Small Angle X-ray scattering Panalytical Empryrean XRD Bruker D8 Discover – XRD Panalytical X’Pert Pro MRD -- XRD

• Sample Preparation Leica EM UC7 Cryo Ultramicrotome FEI Vitrobot cryo vitrifier Fischione 1040 NanoMill Fischione 1050 TEM Mill Fischione 1010 Low Angle Ion Mill

Rick Noll, SEM & FIB Manager

Julie Last, SPM & light microscopy

Manager

John Jacobs, Surface Science

Manager

Don Savage, X-Ray systems manager

Alex Kvit, TEM Manager Anna Kiyanova

SML managerMike Efremov

SML

MSC/SML Imaging and Analysis Toolset

Hysitron TriboIndenter

Cameca Atom Probe

Zeiss Auriga SEM/FIB

Bruker D8 Discover XRD

Aramis Confocal Raman

Leo 1530 FESEM

FEI Titan aberration corrected (S)TEM

Thermo k-alpha XPS

Advanced RheometricExpansion System

Summary

• Centers support research campus wide and outside users• Over $3M in new instrumentation added since Jan 2016

Nanoscale Fabrication Center (currently WCAM) Elionix G100 Electron beam Lithography

Nanoscale Imaging and Analysis Center (currently MSC) NanoMEGAS ASTAR TEM orientation imaging FEI Helios G4 Plasma FIB/FESEM Panalytical Empyrean XRD Glow Discharge Optical Emission Spectrometer (GDOES) Phase contrast microscope with temperature stage

Soft Materials Characterization Lab (currently SML) Perkin Elmer DSC 8000 Differential Scanning Calorimeter Waters e2695 High Performance Liquid Chromatography

• Over 100 instruments available for nanoscale fabrication and characterization of polymers, biological and “hard” materials

• Centers are available for use by both internal and external users

Analytical Methods Introduction

Analytical Methods

Theoretical detection limits• How many silicon atoms in a cm3?

((2.33 g/cm3)/ (28.09 g/mol)) * 6.023x1023 atoms/mol= 4.98 x 1022 atoms/cm3

• How many silicon atoms in a nm3?4.98 x 1022 atoms/cm3 * (1e-7nm/cm)3

= 4.98x1022 atoms/cm3 * 1e-21nm3/cm3

= 50 silicon atoms in nm3

• What is the minimum detectable concentration in 1 nm3 (best case)?– Must be one atom in the volume– 1/50 = 0.02 = 2%– In practice no technique can detect 100% of atoms in a

volume, so actual detection limits will always be worse than the theoretical

Excitation followed by detection

• Nearly all these methods are a result of excitation/bombardment of a specimen with Photons (x-rays, visible light, etc.) Electrons Ions

• Followed by detection of Photons Electrons Ions

• Which measure some physical/chemical characteristic Topography, elemental and chemical identification, surface

morphology, density, thickness, phase, etc.

Analytical Methods compared

Courtesy of EAG

Microanalysis Techniques Tutorials

• Measurement of crystallographic orientation and strain

• Measurement of mechanical properties of nanoscale materials

XRD

Nanoindentation

• Quantitative analysis of near surface (5nm) and bondinginformation

XPS

• Standardless quantitative depth profiling for stoichiometry

RBS

• Fast and high Depth resolution depth profiling with ppm detection limits

GDOES E-beam Litho

• nm scale patterning of materials

Imaging Techniques Tutorials

• High (sub nm) resolution measurement of topography

SPM

• Sub-nm lateral resolution, orientation and elemental identification

TEM

• nm lateral resolution with elemental identification, orientation, simple sample preparation

SEM

• High resolution imaging with material addition and subtraction

FIB

Atomic identification with atomic lateral resolution

Atom Probe

• ~1um resolution imaging with chemical bonding

Raman

Analytical Methods