V i t a l i s

ECE 477 - Spring 2013

TEAM 13

Wireless Biometric Sensor

Design Review

Team Members

Paste a photo of team members here, annotated with names of team members.

Shantanu Joshi /Aakash Lamba / Di Mo / Yi Shen

PCB Layout: Overall PCB (3.8 x 3.25)

Power

Board

Main Board

PCB Layout: Top Copper

PCB Layout: Bottom Copper

PCB Layout: Silk Layer

Trace Size for 3.3 V, 5 V and GND is 0.032

PCB Layout: Overall PCB (2.9 x 1.15)(GND Highlighted)

PCB Layout: Overall PCB (2.9 x 1.15)

Power Conne

ct5 V Step

UpFuel

Gauge Charger/Booster

Decoupling Capacitors (C1,C2) for Power Traces

PCB Layout: Main PCB (2.8x 3.25)(GND Highlighted)

Trace Size:3.3 V, 5 V and GND - 0.032Others – 0.012

Hole Size (Diameter):Power - 0.04330709Others – 0.02362205

PCB Layout: Main PCB (2.8x 3.25)

Decoupling Capacitors for Micro:C3,C7,C9 (Size:0805)

9

7

86

10

4

5

3

Decoupling Capacitors for VCC/GND: C10Decoupling Capacitors for Accelerometer : C4Decoupling Capacitors for OLED : C5,C8Decoupling Capacitors for Wi-Fi : C6(Size:1210)

*All passive components are surface-mounted

PCB Layout: Main PCB (2.8x 3.25)(Debugging Connectors Highlighted)

Power

SPI

RESET

JTAG

PCB Layout: Main PCB (2.8x 3.25)(Sensor Connectors and Others Highlighted)

Accelerometer

BUTT

ON

Temperature Sensor

POW

ER

Wi-Fi

SPO2LED

OLED