Valor® NPI Fabrication Analysis User Guide - CADLOG · This document is for information and...

Valor® NPI Fabrication Analysis User Guide

Release NPI9.8

October 2016

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Table of Contents

Chapter 1Fabrication Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Information Provided in Result Category Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20Measurement Principles. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21CAD Net and Layer Net . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Result Attributes Reporting Typical or Minimum Values. . . . . . . . . . . . . . . . . . . . . . . . . . . 22Design Registration Allowance Adjusted for Reliability Margin . . . . . . . . . . . . . . . . . . . . . 22Annular Ring Measurement Topics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23Keepin and Keepout Areas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Configuration Parameters to Indicate Keepin and Keepout Layers . . . . . . . . . . . . . . . . . . 26Job Entity Area Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Keepin and Keepout Area Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29Specifying the Layers to Which a Keepin or Keepout Area Applies. . . . . . . . . . . . . . . . 30

Defining Keepin or Keepout Areas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32Dynamic Categories by DRC Areas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Dynamic Category Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Slivers and Short Slivers Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38Layer Filters for Subtypes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Designation of Top and Bottom for Single-Sided Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Analysis on Multiple Solder Mask Layers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Truncation of Long Strings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Internal Attribute Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43Xpedition Valor-NPI DFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44Categories Implemented in Xpedition Valor NPI DFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46Terminology. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Chapter 2Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Tests Performed in Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55Stubbed Vias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56Thermal Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58Drill Hole Aspect Ratio for the PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59Attributes Used in Drill Checks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60Categories in Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

PTH Summary (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65NPTH Summary (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66Via Summary (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67Plated Slot Summary (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68Non-Plated Slot Summary (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69Non-Standard Symbol (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70Non-Standard Feature (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

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2nd Drilled Holes (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72Tooling Holes (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73Mounting Holes (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74Pressfit Hole Summary (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75Multi-Purpose Holes (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76Covered Tooling Holes (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77Plated Tooling Holes (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78Useful Tooling Hole Count (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79Unique Drill Size (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80Duplicate Holes (Hole Separation) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81Duplicate Holes Same Net (Hole Separation) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82Duplicate Holes Different Net (Hole Separation). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83Touching Holes (Hole Separation) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84Touching Holes Same Net (Hole Separation). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85Touching Holes Different Net (Hole Separation). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86Close Holes (Hole Separation) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87Close Holes Different Net (Hole Separation) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88Close Holes Same Net (Hole Separation). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89Missing Holes (Missing Holes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90Extra Holes (Extra Holes). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91Short_<lyr1>_<lyr2>, Short_3, Short_4, ... Short_10_up* (Power/Ground Shorts) . . . . . 92NPTH to Rout (NPTH to Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93NPTH to Rout (abs) (NPTH to Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94PTH to Rout (NPTH to Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95PTH to Rout (abs) (NPTH to Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96Tooling Hole to Rout (NPTH to Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97Tooling Hole to Rout (abs) (NPTH to Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98Mount Hole to Rout (NPTH to Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99Mount Hole to Rout (abs) (NPTH to Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100Stubbed Via (Stubbed Vias) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101Stubbed Via (Buried) (Stubbed Vias) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102Antenna Stub (Stubbed Vias) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103No Thermal (Thermal Connection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104No Thermal (No Pad) (Thermal Connection). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105Thermal Connection (Small Pin) (Thermal Connection) . . . . . . . . . . . . . . . . . . . . . . . . . . 106Thermal Connection (Large Pin) (Thermal Connection) . . . . . . . . . . . . . . . . . . . . . . . . . . 107TH Aspect Ratio (PCB Aspect Ratio) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108Via Aspect Ratio (PCB Aspect Ratio) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109Blind Via Aspect Ratio (PCB Aspect Ratio) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110Buried Via Aspect Ratio (PCB Aspect Ratio) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

Results Attributes for Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112ERF Parameters for Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114ERF Variables for Drill Checks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

Chapter 3Signal Layer Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

Tests Performed in Signal Layer Checks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124Bottlenecks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

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Compensated Rout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126Signal Layer ERF Variables - Compatibility with Earlier Products . . . . . . . . . . . . . . . . . . . 127Attributes Used in Signal Layer Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127Categories in Signal Layer Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

Toeprint to Toeprint (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136SMD to SMD (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137Via to Via (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138TH to TH* (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139SMD to Via (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140SMD to TH* (Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141Via to TH* (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142Pad to Pad (Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143Pad to Circuit (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144Circuit to Circuit (Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145Text to Text (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147Surface to Surface (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148Pad to Surface (Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149Circuit to Surface (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150Text Touches Copper (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151Spacing Length (Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152Same Net Spacing (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153CAD Short (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155CAD Self Spacing (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156No Net Name Short (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157NPTH to Pad (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158NPTH to Circuit (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159NPTH to Surface (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160PTH to Copper (Drill) - Signal Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161PTH to Copper Same Net (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162PTH Annular Ring (Drill) - Signal Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163PTH Registration (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165NPTH Registration (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166NPTH Annular Ring (Drill) - for Signal Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167PTH (Comp) Annular Ring (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169Pressfit (Comp) Annular Ring (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170Via Annular Ring (Drill) - for Signal Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171Blind Via Annular Ring (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172Buried Via Annular Ring (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173Via to Copper (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174Missing Pad for Via (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175Missing Pad for PTH (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176Missing Pad for PTH Slot (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177Missing Cu for Via (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178Tooling Hole to Exposed Copper (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179NPTH Touches Copper (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180Mounting Pad to Adjacent Copper (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181Rout to Copper (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182V-cut Rout to Copper (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183Break Tab Rout to Copper (Rout). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184


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Rout to Trace (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186V-cut Rout to Trace (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187Break Tab Rout to Trace (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188Pads (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189Lines (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190Shaved Lines (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191Text (Size). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192Text Fields (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193Line Neckdown (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194Arcs (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196Shaved Arcs (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197Conductor Width (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198Wide Trace Narrow Pad (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199Disconnected Surfaces (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200Slivers (Sliver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201Short Slivers (Sliver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202Stubs (Stubs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203Surface Stubs (Stubs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204Undrilled Area (Undrilled Area). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205SMD Pads (SMD). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206SMD Pitch (SMD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207SMD Packages (SMD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208Conductor Width (Bottleneck) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209Same Net Spacing (Legacy) (Bottleneck) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210Copper Bottleneck (Bottleneck) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211Copper Bottleneck Within Lines (Bottleneck) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212Etch Outside Keepin Area (Keepin/Keepout) - Signal Layer. . . . . . . . . . . . . . . . . . . . . . . 214Etch Within Keepout Area (Keepin/Keepout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215Trace Within Keepout Area (Keepin/Keepout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216Via Within Keepout Area (Keepin/Keepout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217Plane Within Keepout Area (Keepin/Keepout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218Pad Within Keepout Area (Keepin/Keepout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219Exposed Via to Exposed Via (Exposure) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220Exposed Via to Exposed Copper (Exposure) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221Exposed to Exposed (Exposure) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222Covered to Covered (Exposure) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223Exposed to Covered (Exposure) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224Net Loop (Nets) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225Large Net . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226Non-Referenced Signal (Adjacent) (Signal Reference) . . . . . . . . . . . . . . . . . . . . . . . . . . . 227Non-Referenced Signal Area (Adjacent) (Signal Reference). . . . . . . . . . . . . . . . . . . . . . . 228Non-Referenced Signal Length (Adjacent) (Signal Reference) . . . . . . . . . . . . . . . . . . . . . 229Non-Referenced Signal Width (%) (Adjacent) (Signal Reference) . . . . . . . . . . . . . . . . . . 230Non-Referenced Signal (Next) (Signal Reference) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231Non-Referenced Signal Area (Next) (Signal Reference) . . . . . . . . . . . . . . . . . . . . . . . . . . 232Non-Referenced Signal Length (Next) (Signal Reference) . . . . . . . . . . . . . . . . . . . . . . . . 233Non-Referenced Signal Width (%) (Next) (Signal Reference) . . . . . . . . . . . . . . . . . . . . . 234

Special Reports for Signal Layer Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235Results Attributes for Signal Layer Checks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236

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ERF Parameters for Signal Layer Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240ERF Variables for Signal Layer Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243

Chapter 4Power and Ground Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255

Tests Performed in Power and Ground Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257P&G ERF Variables - Compatibility with Earlier Products . . . . . . . . . . . . . . . . . . . . . . . . . 258Attributes Used in Power and Ground Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 258Categories in Power and Ground Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260

NPTH to Copper (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263PTH Annular Ring (Drill) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264Via Annular Ring (Drill) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266PTH to Copper (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 268Via to Copper (Drill) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 269PTH Contains Clearance (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270Via Contains Clearance (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271Spot NFP (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272PTH to Plane (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273Via to Plane (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274NPTH to Plane (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275NPTH Contains Copper (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276Missing Cu for Vias (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277PTH Registration (Drill) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278NPTH Registration (Drill) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279Via Registration (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280Sliver (Sliver) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 281Short Sliver (Sliver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282Rout to Copper (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 283V-cut Rout to Copper (Rout) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284Break Tab Rout to Copper (Rout). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 285Rout to Trace (Rout) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 286V-cut Rout to Trace (Rout) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 287Break Tab Rout to Trace (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 288Missing Rout Clearance (Rout) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289Spoke Width (Thermal) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 290Spoke Count (Thermal) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 291Thermal Connect Reduction (Thermal) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 292NFP Spacing (NFP Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 293NFP Spacing (pos) - (NFP Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 294Plane Spacing (Plane Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 295Segmentation Lines (Plane Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 296Etch Outside Keepin Area (Keepin/Keepout). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 297Etch Within Keepout Area (Keepin/Keepout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 298Plane Width (Plane Width) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 299Plane Disconnection (Plane Width) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300Plane Isolated (Plane Width) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301Plane Floating (Plane Connection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 302Layer Floating (Plane Connection). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 303


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Drills Shorted by Plane (Plane Connection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304Drill Isolated from Plane (Plane Connection). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 305

Results Attributes for Power and Ground Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306ERF Parameters for Power and Ground Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 309ERF Variables for Power and Ground Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 311

Chapter 5Solder Mask Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 319

Tests Performed in Solder Mask Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 321SM ERF Variables - Compatibility with Earlier Products . . . . . . . . . . . . . . . . . . . . . . . . . . 323Attributes Used in Solder Mask Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 323Polarity for Solder Mask Layers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 323Example of Rout Spacing of Zero . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324Categories in Solder Mask Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 328

PTH Annular Ring (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 331NPTH Annular Ring (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 332Via Annular Ring (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 334NPTH Touches Mask (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 335PTH Gasket (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 336Via Gasket (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 337SMD Annular Ring (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 338Pad Annular Ring (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 339BGA Pad Annular Ring (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 340PTH Pad Annular Ring (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 341NPTH Pad Annular Ring (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 342Via Pad Annular Ring (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 343Undrilled Pad Annular Ring (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 344SMD Pad Gasket (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 345PTH Pad Gasket (Pads). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 346NPTH Pad Gasket (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 347Via Pad Gasket (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 348Undrilled Pad Gasket (Pads). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 349Coverage (Coverage) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 350Too Large Nets (Coverage) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 351Exposed Plane (Coverage) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 352Rout Spacing (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 353Missing Rout Clearance (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 354No Bridge (Bridge) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 355No Bridge Same Net (Bridge) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 356SM Sliver (Sliver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 357SM Short Sliver (Sliver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 358Missing SMD Clearance (Missing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 359Missing Undrilled Pad Clearance (Missing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 360Missing NPTH Clearance (Missing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 361Missing PTH Clearance (Missing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 362Missing Via Clearance (Missing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 363Missing Testpoint Clearance (Missing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 364Pad to Pad Spacing (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 365

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Pad to Non-Pad Spacing (Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 366Non-Pad to Non-Pad (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 367Toeprint Pad to Fiducial Pad (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 368Toeprint Pad to Non-Fiducial (Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 369Extra SM - Missing Copper (Extra) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 370Extra SM - Missing Pad (Extra) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 371Gang Soldermask Relief . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 371

Results Attributes for Solder Mask Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 373ERF Parameters for Solder Mask Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 376ERF Variables for Solder Mask Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 378

Chapter 6Silk Screen Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 383

Tests Performed in Silk Screen Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 384Grouping of Silk Screen Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 385Attributes Used in Silk Screen Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 385Categories in Silk Screen Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 387

SM Clearance (SM Clearance) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 389SMD Clearance (SMD Clearance) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 390PTH Pads Clearance (Pad Clearance). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 391Via Pads Clearance (Pad Clearance). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 392NPTH Pads Clearance (Pad Clearance) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 393Undrilled Pads Clearance (Pad Clearance) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 394NPTH Clearance (Hole Clearance). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 395PTH Clearance (Hole Clearance) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 396Via Clearance (Hole Clearance) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 397Rout Clearance (Rout Clearance) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 398Line Widths (Line Width). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 399String Overlap (String Overlap) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400String and Line Overlap (String Overlap) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 401String Line Width (String Properties). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 402String Height (String Properties) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 403String Rotation (String Properties) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 404

Results Attributes for Silk Screen Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405ERF Parameters for Silk Screen Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 407ERF Variables for Silk Screen Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 408

Chapter 7Profile Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 411

Tests Performed in Profile Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 412Categories in Profile Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 413

Feature to Profile (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 414Feature to Step and Repeat (Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 415Board Length (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 416Board Thickness (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 417Board Width (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 418Conveyed Edge Gaps (Gap) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 419

Results Attributes for Profile Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 420


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ERF Parameters for Profile Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 421ERF Variables for Profile Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 422

Chapter 8Drill Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 423

Attributes Used in Drill Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 424Categories in Drill Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 425

Maximum Annular Ring (AR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 427*SPACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 428

Special Reports for Drill Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 428Results Attributes for Drill Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 430ERF Parameters for Drill Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 432ERF Variables for Drill Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 433

Chapter 9Board-Drill-Checks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 435

Attributes Used in Board-Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 437Categories in Board-Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 438

Via to Via . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 439Via to PTH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 440Via to NPTH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 441Via to Rout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 442PTH to PTH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 443PTH to NPTH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 444PTH to Rout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 445NPTH to NPTH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 446NPTH to Rout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 447NPTH to Rout_% . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 448

Results Attributes for Board Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 449ERF Parameters for Board Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450ERF Variables for Board Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 452

Chapter 10SMD Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 453

Attributes Used in SMD Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 454Categories in SMD Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 455

SMD_ROW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 457SMD_PACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 458Pad Too Small. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 459Needs Staggering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 460Pitch Is Non-Uniform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 461Picture Frames . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 462PITCHxSIZE_STRIPEx<pitch>x<size> . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 463PITCHxSIZE_ARx<pitch>x<size> . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 464SIZExPITCH_STRIPEx<pitch>x<size> . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 465SIZExPITCH_ARx<size>x<pitch> . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 466

Special Reports for SMD Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 467Results Attributes for SMD Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 469

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ERF Parameters for SMD Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470ERF Variables for SMD Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 471

Chapter 11Pads for Drills . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 473

Attributes Used in Pads for Drills . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 473Sample Report for Pads for Drills . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 474ERF Parameters for Pads for Drills . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 475

Chapter 12Etching Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 477

Categories in Etching Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 479Broken Contact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 480Broken Copper . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 481Disconnection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 482Detached Drill. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 483Unprocessed Net . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 484Drill Mark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 485

Results Attributes for Etching Analysis. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 486ERF Parameters for Etching Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 487ERF Variables for Etching Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 488

Chapter 13Surface Analyzer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 489

Categories in Surface Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 491Self-Intersection in Surface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 492Self-Intersection in Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 493Wrong Nesting for Islands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 494Wrong Nesting for Hole . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 495Small Polygon. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 496Small Polygon in Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 497Fold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 498Fold in Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 499Short Edge. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500Short Edge in Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 501Problematic Surface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 502

Results Attributes for Surface Analysis. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 503ERF Parameters for Surface Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504

Chapter 14Backdrill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 505

Tests Performed in Backdrill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 506Attributes Used in Backdrill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 507Calculations Performed for Backdrill Penetration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 507Categories in Backdrill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 510

No Drill for Backdrill (Backdrill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 511Plated Backdrill (Backdrill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 512Backdrill Annular Ring (Backdrill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513


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Backdrill to Copper (Backdrill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 514Backdrill to Copper Pad (Backdrill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 515Backdrill Smaller Than Plated Drill (Backdrill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 516Backdrill to Drill Annular Ring (Backdrill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 517Backdrill Larger Than Pad (Backdrill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 518Backdrill Ratio (Layer Check) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 519Backdrill Penetrates Stop Layer (Layer Check) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 520

Results Attributes for Backdrill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 521ERF Parameters for Backdrill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 522ERF Variables for Backdrill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 523

Chapter 15Signal Layer Net Type Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525

Tests Performed in Signal Layer Net Type Checks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 530Net to Net Spacing Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 530Parallel Nets Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 531Net Attributes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 534Clearance According to Net Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 535Net to Net Spacing Categories for Cadence Allegro . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 536Attributes Used in Signal Layer Net Type Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 538Line Mode Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 540Relative ERF Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 540Dynamic Categories. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 541Conventions and Terminology. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 541Categories in Signal Layer Net Type Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 544

Line Angle (Angles) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 550Via to Via (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 551Via to Trace (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 552Via to Pin (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 553Via to Pad* (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 554Via to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 555Trace to Trace (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 556Trace to Pin (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 557Trace to Pad* (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 558Trace to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 559Pin to Pin (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 560Pin to Pad* (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 561Pin to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 562Pad to Pad* (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563Pad* to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 564Plane to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 565Via to Via 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 566Via to Trace 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 567Via to Pin 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 568Via to Pad* 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 569Via to Plane 3D (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 570Trace to Trace 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 571Trace to Pin 3D (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 572

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Trace to Pad* 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 573Trace to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 574Pin to Pin 3D (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 575Pin to Pad* 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 576Pin to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 577Pad to Pad* 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 578Pad* to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 579Plane to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 580Diff. Pair With Testpoints (Diff. Pair Properties). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 581Diff. Pair End Points (Diff. Pair Properties) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 582Diff. Pair Gap (%) (Diff. Pair Properties). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 583Diff. Pair Gap (Abs) (Diff. Pair Properties) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 584Diff. Pair Via to Via (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 585Diff. Pair Via to Trace (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 586Diff. Pair Via to Pin (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 587Diff. Pair Via to Pad* (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 588Diff. Pair Via to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 589Diff. Pair Trace to Trace (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 590Diff. Pair Trace to Pin (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 591Diff. Pair Trace to Pad* (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 592Diff. Pair Trace to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 593Diff. Pair Pin to Pin (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 594Diff. Pair Pin to Pad* (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 595Diff. Pair Pin to Plane (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 596Diff. Pair Pad to Pad* (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 597Diff. Pair Pad* to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 598Diff. Pair Plane to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 599Diff. Pair Via to Via 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600Diff. Pair Via to Trace 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601Diff. Pair Via to Pin 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 602Diff. Pair Via to Pad* 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 603Diff. Pair Via to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 604Diff. Pair Trace to Trace 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 605Diff. Pair Trace to Pin 3D (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606Diff. Pair Trace to Pad* 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 607Diff. Pair Trace to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 608Diff. Pair Pin to Pin 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 609Diff. Pair Pin to Pad* 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 610Diff. Pair Pin to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 611Diff. Pair Pad to Pad* 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 612Diff. Pair Pad* to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 613Diff. Pair Plane to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 614Via to Via Cadence (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 615Via to Pin Cadence (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 616Via to Line Cadence (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 617Via to Shape Cadence (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 618Pin to Pin Cadence Prototype (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 619Line to Pin Cadence (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 620Pin to Shape Cadence (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 621


Table of Contents

Line to Line Cadence (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 622Line to Shape Cadence (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 623Shape to Shape Cadence (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 624PTH to Copper (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625Diff. Pair Length (Summary) (Net Length*) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 626Diff. Pair Length Too Short (Net Length*) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 627Diff. Pair Length Too Long (Net Length*) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 628Diff. Pair Length Difference (Net Length*) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 629Diff. Pair Missing Peer (Extraneous Data) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 630Diff. Pair Extra Nets (Extraneous Data) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 631Diff. Pair With T-junction (Extraneous Data) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 632Parallel Nets (Individual) Start (Parallel Nets) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633Parallel Nets (Individual) End (Parallel Nets) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 634Parallel Nets (Adj.) (Individual) Start (Parallel Nets) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 635Parallel Nets (Adj.) (Individual) End (Parallel Nets) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 636Parallel Nets (Accumulative) Start (Parallel Nets) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 637Parallel Nets (Accumulative) End (Parallel Nets) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 639Narrow Trace (Net Path). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 640Narrow Split Trace (Net Path) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 641Too Many Vias (Net Properties). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 642Min Line Width (Net Properties) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 643Above Min Line Width (Net Properties) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 644Net Length by Width (Net Properties) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 645

Results Attributes for Signal Layer Net Type Checks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 645ERF Parameters for Signal Layer Net Type Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 657ERF Variables for Signal Layer Net Type Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 658

End-User License Agreement

14October 2016


List of Tables

Table 1-1. Area Type Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29Table 1-2. Attributes to Indicate Layers on which an Area is Active . . . . . . . . . . . . . . . . . . 29Table 1-3. Fabrication Analysis Internal Attribute Names . . . . . . . . . . . . . . . . . . . . . . . . . . 43Table 1-4. Mentor Graphics Xpedition - Available Drill Checks Categories . . . . . . . . . . . . 46Table 1-5. Mentor Graphics Xpedition - Available Signal Layer Checks Categories . . . . . 47Table 1-6. Mentor Graphics Xpedition - Available Power and Ground Checks Categories 48Table 1-7. Mentor Graphics Xpedition - Available Silk Screen Check Categories . . . . . . . 48Table 1-8. Mentor Graphics Xpedition - Available Solder Mask Checks Categories . . . . . 49Table 1-9. Mentor Graphics Xpedition - Available Etching Analysis Categories . . . . . . . . 50Table 2-1. Drill Checks Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55Table 2-2. Drill Checks Feature Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60Table 2-3. Drill Checks Layer Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61Table 2-4. Drill Checks Board Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61Table 2-5. Drill Checks Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62Table 2-6. Drill Checks Results Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112Table 2-7. Drill Checks ERF Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114Table 2-8. Drill Checks ERF Variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115Table 3-1. Signal Layer Checks Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124Table 3-2. Signal Layer Checks ERF Compatibility Mapping . . . . . . . . . . . . . . . . . . . . . . . 127Table 3-3. Signal Layer Checks Feature Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128Table 3-4. Signal Layer Checks Component Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129Table 3-5. Signal Layer Checks Layer Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129Table 3-6. Signal Layer Checks Keepin/Keepout Attributes . . . . . . . . . . . . . . . . . . . . . . . . 129Table 3-7. Signal Layer Checks Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130Table 3-8. Signal Layer Checks Results Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236Table 3-9. Signal Layer Checks ERF Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240Table 3-10. Signal Layer Checks ERF Variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243Table 4-1. Power and Ground Checks Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257Table 4-2. Power and Ground Checks ERF Compatibility Mapping . . . . . . . . . . . . . . . . . . 258Table 4-3. Power and Ground Checks Feature Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . 258Table 4-4. Power and Ground Checks Layer Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 259Table 4-5. Power and Ground Checks Keepin/Keepout Area Attributes . . . . . . . . . . . . . . . 259Table 4-6. Power and Ground Checks Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260Table 4-7. Power and Ground Checks Results Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . 306Table 4-8. Power and Ground Checks ERF Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . 309Table 4-9. Power and Ground Checks ERF Variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 311Table 5-1. Solder Mask Checks ERF Compatibility Mapping . . . . . . . . . . . . . . . . . . . . . . . 323Table 5-2. Solder Mask Checks Feature Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 323Table 5-3. Solder Mask Checks Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 328Table 5-4. Solder Mask Checks Results Attributes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 373


List of Tables

Table 5-5. Solder Mask Checks ERF Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 376Table 5-6. Solder Mask Checks ERF Variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 378Table 6-1. Silk Screen Checks Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 384Table 6-2. Silk Screen Checks Feature Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 385Table 6-3. Silk Screen Checks Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 387Table 6-4. Silk Screen Checks Results Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405Table 6-5. Silk Screen Checks ERF Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 407Table 6-6. Silk Screen Checks ERF Variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 408Table 7-1. Profile Checks Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 412Table 7-2. Profile Checks Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 413Table 7-3. Profile Checks Feature Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 420Table 7-4. Profile Checks ERF Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 421Table 7-5. Profile Checks ERF Variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 422Table 8-1. Drill Summary Feature Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 424Table 8-2. Drill Summary Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 426Table 8-3. Drill Summary Results Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 430Table 8-4. Drill Summary ERF Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 432Table 8-5. Drill Summary ERF Variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 433Table 9-1. Board-Drill Checks Feature Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 437Table 9-2. Board-Drill Checks Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 438Table 9-3. Board-Drill Checks Results Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 449Table 9-4. Board-Drill Checks ERF Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450Table 9-5. Board-Drill Checks ERF Variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 452Table 10-1. SMD Summary Feature Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 454Table 10-2. SMD Summary Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 455Table 10-3. SMD Summary Results Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 469Table 10-4. SMD Summary ERF Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470Table 10-5. SMD Summary ERF Variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 471Table 11-1. Pads for Drills Feature Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 473Table 11-2. Pads for Drills ERF Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 475Table 12-1. Etching Analysis Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 479Table 12-2. Etching Analysis Results Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 486Table 12-3. Etching Analysis ERF Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 487Table 12-4. Etching Analysis ERF Variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 488Table 13-1. Surface Analysis Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 491Table 14-1. Backdrill Checks Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 506Table 14-2. Backdrill Checks Layer Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 507Table 14-3. Backdrill Checks Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 510Table 14-4. Backdrill Checks Results Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 521Table 14-5. Backdrill Checks ERF Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 522Table 14-6. Backdrill Checks ERF Variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 523Table 15-1. Signal Layer Net Type Checks Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 530Table 15-2. Signal Layer Net Type Checks Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 538Table 15-3. Signal Layer Net Type Checks Line Mode Commands . . . . . . . . . . . . . . . . . . 540Table 15-4. Signal Layer Net Type Check Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 544

16October 2016


List of Tables

Table 15-5. Signal Layer Net Type Checks Results Attributes . . . . . . . . . . . . . . . . . . . . . . 645Table 15-6. Signal Layer Net Type Checks ERF Parameters . . . . . . . . . . . . . . . . . . . . . . . . 657Table 15-7. Signal Layer Net Type Checks ERF Variables . . . . . . . . . . . . . . . . . . . . . . . . . 658


List of Tables

18October 2016



Chapter 1Fabrication Analysis

Fabrication Analysis actions can locate potential manufacturability problems during bare board fabrication. In addition, the Fabrication Analysis actions can collect statistical data on the design which can be used for quoting, planning and resource allocation. Every action described covers a specific aspect of board fabrication. This includes copper layers (signal, power/ground), support layers (solder mask and silk screen) and drill layers.

These are the benefits of performing thorough fabrication analysis:

• Estimation of cost can be derived from the results of the analysis.

• Manufacturing defects can be identified and corrected prior to tool creation.

• Design parameters can be extracted to provide input for planning, down to which machines should be used for production.

Each analysis category is governed by a set of ERF values, usually unique to each Design Center.

Analysis can be performed using the Design Process Wizard (DPW). See “Design Process Wizard (DPW)” in Valor NPI Engineering Toolkit User Guide.

Fabrication Analysis information is relevant for Valor NPI users at all levels. It is assumed that the use is familiar with the general operation of Valor NPI. This includes opening and closing jobs, understanding the job structure (matrix, steps, symbols and others), and operating the Valor NPI Graphic Station. It is also assumed that you have an understanding of the general concepts of checklists.

Additional information on analysis procedures can be found here: “Valor NPI Checklist Operations User Guide”, “Valor NPI ERF Manager User Guide”.

Information Provided in Result Category Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . 20

Measurement Principles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

CAD Net and Layer Net . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Result Attributes Reporting Typical or Minimum Values . . . . . . . . . . . . . . . . . . . . . . . 22

Design Registration Allowance Adjusted for Reliability Margin . . . . . . . . . . . . . . . . . . 22

Annular Ring Measurement Topics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Keepin and Keepout Areas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26Configuration Parameters to Indicate Keepin and Keepout Layers . . . . . . . . . . . . . . . . . . 26Job Entity Area Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28Defining Keepin or Keepout Areas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32


Fabrication AnalysisInformation Provided in Result Category Descriptions

October 2016

Dynamic Categories by DRC Areas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35Dynamic Category Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Slivers and Short Slivers Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Layer Filters for Subtypes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Designation of Top and Bottom for Single-Sided Boards . . . . . . . . . . . . . . . . . . . . . . . . 41

Analysis on Multiple Solder Mask Layers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Truncation of Long Strings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Internal Attribute Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Xpedition Valor-NPI DFF. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Categories Implemented in Xpedition Valor NPI DFF . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Information Provided in Result Category Descriptions

For each analysis, the documentation describes the categories that might contain results when the analysis is run. The full name of the category and its test group serve as the title of the category. Each category is accompanied by a graphic of a typical measurement.

Analysis Category The ERF range name that defines the results for the category; determines the red, green, yellow classifications.

Measurement Shape The measurement can be one of these: point displayed as an X, line skeleton, line displayed in full width such as line summary or sliver, circle, square, arc, bounding box that envelopes contours, such as a box to indicate a covered pinhole.

Measurement Value A number expressing the value of the measurement: distance, percent, area, angle, line width, pitch, 3D distance, ring.

Measurement ID The type of features involved in the measurement. The Results Viewer displays types, sizes and symbols of features involved in the measurement.

Layers Displayed The layers displayed.

Graphic A graphic representing a typical measurement.

Purpose The reason the category is needed.

Function The measurements reported by the category.

ERF Parameters The ERF parameters that affect this category.

ERF Variables The ERF variables that affect this category.

Fabrication AnalysisMeasurement Principles


Measurement PrinciplesMeasurement principles are followed when reporting measurements. They define the endpoints of measurements, the effect of intervening copper on measurements, the effect of units of measurement, and the spacing search radius.

Measurements Between Edges

The assumption is that measurements are made from edge to edge of pads or holes, unless otherwise indicated in the category description.

Intervening Copper

Where a measurement segment touches copper at any point other than its endpoints, the measurement will be to the first copper touched, as described in the following figure.

Measurement from Pad #1 to the Line will not be generated since copper intervenes.

Consistent Units of Measurement

It is best to use the same units of measurement (inches, mm) in the ERF model and in the Valor NPI Graphic Station. When the units differ, orientation and scalar (angles/ratio) measurements of features become unreliable. The reason for this is that control over units in the Valor NPI Graphic Station is separate from that in the ERF model. That is, a change of units in one, does not affect the other. This can cause confusion in the analysis results.

If you frequently switch between metric and imperial units, it is advisable that you keep two ERF models; one in metric and the other in imperial units.

Spacing Search Radius

Spacing measurements are reported when they are within the search radius defined by the ERF parameter pp_spacing.

Limitations Any restrictions of the results of this category.

Related Categories Optional.


Fabrication AnalysisCAD Net and Layer Net

October 2016

CAD Net and Layer NetThe terms CAD net and Layer net are often used in describing nets.

CAD net — Exists only in data read in directly from an EDA system (such as when input from other than Gerber-like data). In such cases, every feature is identified by the electrical net to which it originally belonged in the CAD (EDA) system. A CAD net includes all features in all layers which share the same net name.

Layer net — Net generated automatically by the system and is based on actual geometry. A Layer net includes all the features in one layer which are geometrically connected, either directly or indirectly through other features (in the same layer). Layer nets exist even with data read in from Gerber-like format.

Result Attributes Reporting Typical or Minimum Values

For some checks, the result attributes can have a prefix that indicates whether the value of the attribute represents the typical value or the minimum value.

typ — Typical values appear in Results Attributes of most actions, and reflect the size of the features in the column of the relevant histogram with the largest count. For examples of results attributes with typ (typical) prefixes, see Results Attributes for Signal Layer Checks.

min — Minimum values are the smallest values in the range.

Design Registration Allowance Adjusted for Reliability Margin

The DRA can be adjusted by a reliability margin. This new value of DRA is used as a guideline to determine the difficulty of manufacturing a job, and the tolerances that are forced upon it during the manufacturing process.

DRA (Design Registration Allowance) — Maximum misregistration permitted while still meeting all other requirements.

RM (Reliability Margin) — A value that offsets the attained DRA value based on customer requirements.

This is the formula used to calculate the DRA for annular rings:

DRA = (annular ring) - RM

Fabrication AnalysisAnnular Ring Measurement Topics


This is the standard formula used to calculate the DRA for other tests:

DRA = (minimum test value) - RM

For example, if a 39 mil hole must be within a 51 mil land, the DRA is +/- 6 mils. If a customer requires a 1 mil annular ring on the end product, then the RM = 1. Applying the formula produces DRA = 6 - 1 = 5.

Annular Ring Measurement TopicsFor Annular Ring categories in signal layer checks and power and ground checks, you can classify results by drill size, and you can control how breakouts are handled.

Classification by Drill Size

You can use ERF variable v_ar_drill_size_list to control whether annular ring result categories for signal layer checks and power and ground checks are classified by drill size.

If the value is none (v_ar_drill_size_list = none), results are not classified by drill size. The ERF can contain a range for the category as a whole.

If the value is empty (v_ar_drill_size_list =), a category is generated for each drill size for which there are results to report. The ERF can contain ranges for specific drill sizes.

If the value is a list of drill size classes, results are classified by these classes. The ERF can contain ranges for each class.

Classes are specified by listing the upper limit of each drill size range, in ascending order by drill size, separated by commas.

A class name can be specified, in this format: <class_name>:<upper_limit>. If no class name is specified, the upper limit of the range of drill sizes is used as the name of the class.

This example defines three classes:

v_ar_drill_size_list = A:15,30,B:50.5

Class A (drills less than or equal to 15).

Class 30 (drills greater than 15, and less than or equal to 30).

Class B (drills greater than 30, and less than or equal to 50.5).



October 2016

These ranges could be defined for the classes in the example:

*:via_ar;A = 5 7 9*:via_ar;* = 5 7 11*:pth_ar;30 = 5 8 10*:pth_ar;* = 5 9 10

Allowed Breakouts

There are possible modifications of annular ring measurements in cases where breakouts are allowed by the designer. The normal procedure requires two values:

• RM_AR — ERF variable rm_ar specifies the Reliability Margin for annular rings as received from the customer. A non-zero value for RM_AR does not allow breakouts.

• DRA — Design Registration Allowance is the maximum misregistration permitted by a design while still meeting all other requirements. It is generated.by the analysis.

For example, if the minimum annular ring width = 4 and RM_AR = 1, then DRA = 4-1 = 3.

If you specify that the reliability margin should allow a breakout (RM_AR = 0), the measurement will be extended to the outer perimeter of the drill hole in the position of a theoretical breakout.

The breakout angle is defined in the ERF variable via_breakout_angle or pth_breakout_angle. The range is 0-180, where 0 means no breakout is allowed.

When you do specify a breakout, RM_AR must be zero, and the system will calculate an extended annular ring measurement based on the size of the AR and drill. The AR size that is reported is larger than the actual AR size by an amount that depends on the AR and drill sizes.

The system assumes a drill that is centered within the AR and an AR that is a circle. If the AR is any other shape the system will construct a circle from this shape and plan the breakout on the constructed circular AR.



When a negative feature shaves an AR pad, the system assumes a whole circle and positions the breakout according to this assumption.

When the feature is rectangular, the system also assumes a circular AR and positions the breakout accordingly.

The example describes an annular ring with a 90 degree breakout angle: Outer radius = 20, Inner radius = 10. The annular ring width = 5. In this case, since RM=0, the minimum annular ring = 5.81 and DRA = 5.81 - 0 = 5.81.


Fabrication AnalysisKeepin and Keepout Areas

October 2016

Keepin and Keepout AreasThese areas are typically imported with Gerber or EDA data to define areas of a layer where pads, traces, and other features are either included or excluded. This enables the reporting of features that fall outside or within these areas.

Keepin and Keepout areas are stored on document layers, named according to type of features (starting with .drc_). In this figure, a large Keepin area is defined to encompass all features within the rout, while smaller Keepout areas are defined to keep out certain features. Each area type displays with a different pixmap (texture).

Configuration Parameters to Indicate Keepin and Keepout Layers . . . . . . . . . . . . . . . 26

Job Entity Area Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Defining Keepin or Keepout Areas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Configuration Parameters to Indicate Keepin and Keepout Layers

Configuration parameters indicate the names of the document layers in which the Keepin and Keepout areas are stored after input. Several types of Keepin/Keepout areas can be stored on the same document layer, so several configuration parameters can be assigned to the same layer.

• drc_rout_keepin

• drc_rout_keepout

• drc_via_keepout

• drc_trace_keepout

• drc_plane_keepout

• drc_pad_keepout

During the input of CAD data, the drc_ configuration parameters determine the names of the document layers. The Job Attributes are also updated with the names of the document layers

Fabrication AnalysisConfiguration Parameters to Indicate Keepin and Keepout Layers


and stored with the job. The system checks with the job attributes for the document layer names. This enables the configuration parameters to be changed in preparation for another data input.


Fabrication AnalysisJob Entity Area Attributes

October 2016

Job Entity Area AttributesThe Job Attributes dialog box displays the names of the DRC document layers stored in the product model. The Job Attributes dialog box is accessed from Valor NPI Engineering Toolkit by choosing Edit > Entity Attributes. In the example, the drc_rout has several types of areas defined. If a job attribute is not defined, the name of the DRC document layer is derived from the relevant configuration parameter.

Keepin and Keepout Area Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Specifying the Layers to Which a Keepin or Keepout Area Applies . . . . . . . . . . . . . . . 30



Keepin and Keepout Area AttributesKeepin areas and keepout areas must be assigned an attribute defining the component type or feature type to be included in a keepin area or excluded from a keepout area.

One of these layer activation attributes must be assigned to a keepin or keepout area. If none of these attributes are assigned, the area does not apply to any layers and no checks are performed in that area.

If both DFx Area Selected Layers by Bits and DFx Area Layers by Name are assigned to an area, then the area applies to the layers specified in DFx Area Selected Layers by Bits.

Table 1-1. Area Type Attributes

Area Type Attribute

Description

Rout Keep In The area is to be used as the rout keepin boundary (rout—lines, arcs, vias, pads and surfaces on signal or power and ground or both layers).

Rout Keep Out The area is to be used as the rout keepout boundary (rout—lines, arcs, vias, pads and surfaces on signal or power and ground or both layers).

Via Keep Out The area is to be used as vias keepout boundaries.

Trace Keep Out The area is to be used as trace keepout boundaries (traces—lines and arcs on signal or power and ground or both layers).

Pad Keep Out The area is to be used as pads keepout boundary.

Plane Keep Out The area is to be used as planes keepout boundary.

Table 1-2. Attributes to Indicate Layers on which an Area is Active

Layer Activation Attribute

Description

DFx Area All Layers

Specifies that this area applies to all copper layers.

DFx Area Layers by Name

Layer names separated by semi-colons (;) or a layer filter string. Specifies the layers to which the area applies.



October 2016

Specifying the Layers to Which a Keepin or Keepout Area Applies

You can apply a feature attribute to a keepin area or a keepout area to specify the board layers to which the area applies.

Procedure

1. Select a keepin area or a keepout area in the graphic area and select Edit > Attributes > Change.

2. Assign one of these attributes.

If both DFx Area Selected Layers by Bits and DFx Area Layers by Name are assigned to an area, then the area applies to the layers specified in DFx Area Selected Layers by Bits.

DFx Area Selected Layers by Bits

String of 0 and 1 characters. Specifies the copper layers to which the area applies. The length of the string is equal to the number of board layers.

0 — The area does not apply to this layer.

1 — The area applies to this layer.

For example, in the case of this layer list, if the string is 0 1, the area does not apply to layer sigt (0) and the area does apply to layer sigb

(1).

Attribute Explanation

DFx Area Layers by Name Layer names separated by semi-colons (;) or a layer filter string. Specifies the layers to which the area applies.


String of 0 and 1 characters. Specifies the board layers to which the area applies. The length of the string is equal to the number of board layers.

0 — The area does not apply to this layer.

1 — The area applies to this layer.

DFx Area All Layers Specifies that the area applies to all layers.

Table 1-2. Attributes to Indicate Layers on which an Area is Active (cont.)

Layer Activation Attribute

Description



3. To find all areas that are active in a specific layer, perform these tasks:

• In Valor NPI Graphic Station, click the Feature selection filter tool to open the Features Filter dialog box.

• Click the Attributes button to open the Attributes Filter dialog box.

• In the Attributes Filter dialog box, select the attribute DFx Area Layers by Name.

• In the Text field, type a filter that will resolve to the name of the layer.

• Click Add to display the attribute value in the Filter pane.


Fabrication AnalysisDefining Keepin or Keepout Areas

October 2016

• In the Features Filter dialog box, click Select or Highlight to select or highlight all areas that are active on the specified layer.

Defining Keepin or Keepout AreasYou can define Keepin areas and Keepout areas in addition to such areas imported with the design. The example defines a rout Keepout area.

After defining an area, assign an attribute to specify the layers to which the area applies.

Procedure

1. Click the Add Features icon to open the Add Feature/Component dialog box.



2. Click the Surface icon .

3. Click to activate Attributes, and click Values to display the Attributes dialog box.

4. Select the Rout Keep Out attribute, and click Add.

5. Select the attribute DFx Area Selected Layers by Bits to specify the copper layers to activate for the Keepout area.

Assign a value of 10 to activate the Keepout area on the first layer, sigt.

Click Add.

6. Define the Keepout area in the graphic area by clicking one corner, and then the diagonally opposite corner.



October 2016

In the example, the area becomes active in layer sigt with the attribute Rout Keep Out.

Fabrication AnalysisDynamic Categories by DRC Areas


Dynamic Categories by DRC AreasYou can apply different design rule checks to DRC areas defined within the board profile. The DRC ranges for each area of a category is specified in the ERF and applied to a dynamic category <area> classification. A check can be run on a layer, where a different range applies to each DRC area, as defined in the ERF category range.

A different range can also apply to the area outside the defined DRC areas.

This is an example of an ERF category range set:

The <area> classification is applied dynamically to categories only when the ERF variable v_fab_drc_by_area = 1.

DRC areas are stored on document layers dedicated only to these areas. Each area can have an attribute, .area_name, containing the name of the area. Areas whose .area_name attribute contains standard DRC names (RD, HD or LD for Regular, High or Low density, respectively), have different pixmaps displayed with different hatch-fills.

Range Explanation

HD:npth2p, HD:npth2c=4,6,8 This range is applied to DRC area HD (High Density).

RD:npth2p, RD:npth2c=6,8,10 This range is applied to the RD (Regular Density) area.

LD:npth2p, LD:npth2c=10,12,14 This range is applied to the LD (Low Density) area.

*:npth2p, *:npth2c=10,12,14 This range is applied outside the defined DRC areas.


Fabrication AnalysisDynamic Categories by DRC Areas

October 2016

The name of the document (map) layer is derived from the ERF variable v_fab_drc_map_layer (default value = fab_drc). If there is no specific area defined in the DRC map layer (or no such map layer at all), the DRC map layer name is derived from the step attribute Fab DRC.

If the value of step attribute Fab DRC is also not defined, the name is taken from configuration parameter default_fab_drc.

Ranges can use exact name specification or wildcards. The asterisk (*) indicates measurements in all areas for which ranges have not been explicitly specified in lines of the ERF appearing before this line.

Exact name: HD:npth2c = 8, 10, 12

Wildcard: *:npth2c = 4, 6, 8

The order of the ranges in the ERF affects matching.

• This order yields exact results. Results in area HD use the first range, and results in all other areas use the second range:

.rangesHD:npth2c=8, 10, 12*:npth2c=4, 6, 8

Fabrication AnalysisDynamic Category Examples


• This order results in no results being reported to the second category because the more general category will already have reported those results.

.ranges*:npth2c=4, 6, 8HD:npth2c=8, 10, 12

Sometimes an area name is composed of a number of DRC area names. If the combination is longer than allowed by a specific action—typically 64 characters—the combination is replaced by the system-defined name multiple_areas. If the ERF model does not contain a range for a dynamic category like this, all results are reported in blue severity. To see the results, set configuration parameter chk_ignore_blue_sev = no.

Dynamic Category Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Dynamic Category ExamplesDynamic categories that can limit measurement reporting to DRC areas, are recognized by an area name and their analysis category name. These examples illustrate the lines of an ERF file when area classification is used, and when area classification is not used.

Category name: <area>:npth2p

If v_fab_drc_by_area = 0, no classification is performed, as in this example of a Signal ERF model:

.vars v_fab_drc_by_area = 0

.ranges p2p, p2c, c2c = 4, 6, 8 text2text = 4, 6, 8 npth2p, npth2c = 4, 6, 8 r2c, pth2c, via2c = 4, 6, 8 ar = 6, 8, 10 npth_ar = 6, 8, 10


Fabrication AnalysisSlivers and Short Slivers Categories

October 2016

If v_fab_drc_by_area = 1, classification by DRC area is performed as in this example of a Signal ERF model:

.vars v_fab_drc_by_area = 1 v_fab_drc_map_layer = fab_drc

.ranges HD:p2p, HD:p2c, HD:c2c = 4, 6, 8 RD:p2p, RD:p2c, RD:c2c = 8, 10, 12 *:p2p, *:p2c, *:c2c = 10, 12, 14 HD:text2text = 4, 6, 8 RD:text2text = 8, 10, 12 *:text2text = 10, 12, 14 HD:npth2p, HD:npth2c = 4, 6, 8 RD:npth2p, RD:npth2c = 8, 10, 12 *:npth2p, *:npth2c = 10, 12, 14 HD:r2c, HD:pth2c, HD:via2c = 4, 6, 8 RD:r2c, RD:pth2c, RD:via2c = 8, 10, 12 *:r2c, *:pth2c, *:via2c = 10, 12, 14 *:ar = 6, 8, 10 *:npth_ar = 6, 8, 10

Slivers and Short Slivers CategoriesThe two categories, Slivers and Short Slivers, handle slivers—narrow strips of copper between two features or between non-adjacent sides of the same feature. The two categories are found in Signal, Power and Ground, and Solder Mask Checks, relating to the signal, power and ground, and solder mask layers, respectively.

It is important to detect slivers, which could break off during the manufacturing process and cause shorts. In detecting slivers, the length, width and shortest perimeter length are measured.



These two categories do not detect acute angles. To detect acute angles as slivers, set ERF parameter pp_sliver = 12 mils or more (this might cause additional reports of non-critical violations).



October 2016

Analysis is controlled by the sliver DFx variables v_min_sliver_perim and v_dist2sliver_ratio:

When the two features are not connected (not on the same net), v_dist2sliver_ratio and v_min_sliver_perim become irrelevant.

Slivers found on hatched areas (a plane filled with lines instead of solid copper, where each line in the area has the attribute Hatch Feature) are reported only if ERF variable replace_crosshatch_by_surface = by_attr. (Default value = yes).

However, if the surface is filled with at least fifty lines of the same width, it is accepted as a hatched area even if the lines do not bear the Hatch Feature attribute and ERF variable replace_crosshatch_by_surface = no.

Fabrication AnalysisLayer Filters for Subtypes


Layer Filters for SubtypesThe layer filter, established in the ERF file or when the analysis is run, controls the layers on which the analysis runs. Where sub-layers exist, you can construct the filter to run the analysis on only specific subtypes, or on all subtypes.

The layer filter can be set in these configurations for subtypes:

This filter runs the analysis on all soldermask layers and all subtypes of soldermask layers:

pp_layers=.type=solder_mask&context=board

This filter runs the analysis on soldermask layers of subtype peelable_mask.

pp_layers=.type=solder_mask&content=board&sub_type=peelable_mask

This filter runs the analysis on soldermask layers, but not on subtypes of soldermask layers.

pp_layers=.type=solder_mask&content=board&sub_type=

Designation of Top and Bottom for Single-Sided Boards

Boards with only one copper layer—single-sided boards—are supported. These boards might have two component layers.

To determine whether a layer is top or bottom, the analysis follows this logic:

Non-Copper Layer Side — If a non-copper layer is above a copper layer, the side of the non-copper layer is Top. If a non-copper layer is below the copper layer, the side of the non-copper layer is Bottom.

Copper Layer Side — The analysis checks for the existence of these layers in this order. Once it finds a layer above or below the copper layer it determines that the copper layer is Top or Bottom:

• Solder mask layer

• Solderpaste layer

• Silk screen layer

• Component layers


Fabrication AnalysisAnalysis on Multiple Solder Mask Layers

October 2016

Analysis on Multiple Solder Mask LayersWhen more than one solder mask layer exists at the top or bottom of a PCB, all analyses and DFM Actions use the first solder mask layer. For the top side it is the upper solder mask layer of the solder mask layers above the top copper layer. For the bottom side it is the upper solder mask layer of the solder mask layers below the bottom copper layer.

Example:

In this Job matrix example, the solder mask layers sm1 and sm4 are used.

sm1sm2sm3top copper---------bottom coppersm4sm5sm6

These messages are written to the log:

Number of soldermask layers on top is greater than one! -> sm1 layer is used.

Number of soldermask layers on bottom is greater than one! -> sm4 layer is used.

Truncation of Long StringsThe system automatically truncates strings containing more than 64 characters for the purpose of analysis. A warning message appears in the log:

“Feature <feature_number> in layer <layer_name>: value of attribute <attribute_name> was truncated.”

TroubleshootingIf you encounter these problems when performing fabrication analysis, apply the suggested solutions.

Internal Errors

As a general rule, when encountering errors generated during analysis, you can isolate the error to a particular test by eliminating tests, one by one. After identifying the faulty test, switch it off

Fabrication AnalysisInternal Attribute Names


in the Action screen and carry out all the others. This does not solve the problem, but enables you to carry on until a solution is available from your local service provider.

Insufficient Memory

An analysis can fail due to lack of memory. Because the memory required to complete an analysis is dependent upon the job, there are a number of possibilities.

• It is recommended that large or complex jobs be divided into a number of checklists, each containing a small number of analysis actions.

• Using a script, have a checklist run, the job saved, closed and reopened. This is performed repeatedly until all checklists have been run. In this manner, if one analysis fails, it does not hinder the process in regard to all other checklists. The failed analysis can be run at a computer with more memory or it can be broken into two checklists.

• Divide the design into areas and run your checklist separately on each area.

• Set ERF variable edt_chklist_release_memory = 2 to run in release memory mode. This option must not be used if you are running the checklist from the MRA.

Internal Attribute NamesFabrication Analysis categories in the past have referred to step, job, component, feature, and net attributes by their internal names. Legacy data would contain these names. This table provides the internal name used by legacy data, and its equivalent as it appears in Valor NPI.

The configuration parameter edt_disp_attr_by_prompt controls whether to display attributes by their prompt name (default) or their internal name as in the past.

Table 1-3. Fabrication Analysis Internal Attribute Names

Internal Name Display Name Property Type

.board_thickness Board Thickness Job

.comp_ignore Ignore Graphically/Output

Any component not found in the BOM is automatically ignored.

Component

.copper_weight Copper Weight Layer

.cu_base Vias Need Cu Layer

.drc_etch_lyrs_all DFx Area All Layers Layer

.drc_etch_lyrs_bit DFx Area Selected Layers by Bits Layer

.drc_pad_keepout Pad Keep Out Feature

.drc_plane_keepout Plane Keep Out Feature


Fabrication AnalysisXpedition Valor-NPI DFF

October 2016

Xpedition Valor-NPI DFFYou can perform a predefined list of categories in fabrication analysis directly from Xpedition.

.drc_rout_keepin Rout Keep In Feature

.drc_rout_keepout Rout Keep Out Feature

.drc_trace_keepout Trace Keep Out Feature

.drc_via_keepout Via Keep Out Feature

.drill Drill Type Feature

.feature_ignore Copper Feature Ignore Feature

.hatch Hatch Feature

.hatch_border Hatch Border Feature

.is_capped Capped Via Feature

.layer_class Layer Class Layer

.layer_dielectric Thickness of Material Layer

.mount_hole Mounting Hole Feature

.nomenclature Copper Text Feature

.pattern_fill Copper Balancing Feature

.plated_type=pressfit Pressfit Hole Feature

.smd SMD Pad Feature

.smt_direction_top SMT Direction Top Job

.smt_direction_bottom SMT Direction Bottom Job

.string Copper Text String Feature

.test_point ICT Test Point Feature

.toep_spacing_req Required Toeprint Spacing Component

.tooling_hole Tooling Hole Feature

.vcut V-Score Edge Feature

Table 1-3. Fabrication Analysis Internal Attribute Names (cont.)

Internal Name Display Name Property Type

Fabrication AnalysisXpedition Valor-NPI DFF


To perform a predefined list of categories in fabrication analysis directly from Xpedition, use menu option Analysis > Valor-NPI DFF.

The analysis is performed in the background. The Design Center and checklist to use is according to the definition set in Tools > Valor NPI > Select Design Center in the CES.

The description of each of the categories implemented with Valor-NPI DFF is also applicable to all dynamic categories derived from it.

For a list of links to the individual categories, see “Categories Implemented in Xpedition Valor NPI DFF” on page 46. For details on dynamic categories, see “Dynamic Categories by DRC Areas” on page 35 and “Dynamic Category Examples” on page 37.


Fabrication AnalysisCategories Implemented in Xpedition Valor NPI DFF

October 2016

Categories Implemented in Xpedition Valor NPI DFF

A subset of the Valor NPI fabrication analysis categories are available through the Valor NPI DFF capability of Mentor Graphics Xpedition. Each category description is applicable for all dynamic categories derived from it.

See “Dynamic Categories by DRC Areas” on page 35 and “Dynamic Category Examples” on page 37. For a description of how the analysis is performed, see “Xpedition Valor-NPI DFF” on page 44.

Table 1-4. Mentor Graphics Xpedition - Available Drill Checks Categories

Internal Name Drill Checks Category Name

<area>:pth PTH Summary (Hole Size)

<area>:npth NPTH Summary (Hole Size)

<area>:via Via Summary (Hole Size)

<area>:slot_pt Plated Slot Summary (Hole Size)

<area>:slot_npt Non-Plated Slot Summary (Hole Size)

<area>:non_standard Non-Standard Symbol (Hole Size)

<area>:non_standard_f Non-Standard Feature (Hole Size)

<area>:multi_purpose_holes

Multi-Purpose Holes (Hole Size)

<area>:covered_tooling_h Covered Tooling Holes (Hole Size)

<area>:plated_tooling_h Plated Tooling Holes (Hole Size)

<area>:duph Duplicate Holes (Hole Separation)

<area>:touchh Touching Holes (Hole Separation)

<area>:closeh Close Holes (Hole Separation)

<area>:missh Missing Holes (Missing Holes)

<area>:extrah Extra Holes (Extra Holes)

<area>:stubbed_via Stubbed Via (Stubbed Vias)

<area>:stubbed_buried_via Stubbed Via (Buried) (Stubbed Vias)

<area>:antenna_stub Antenna Stub (Stubbed Vias)

<area>:no_thermal;<pin_type>

No Thermal (Thermal Connection)

<area>:thermal_con_s;<pin_type>

Thermal Connection (Small Pin) (Thermal Connection)



<area>:thermal_con_l;<pin_type>

Thermal Connection (Large Pin) (Thermal Connection)

Table 1-5. Mentor Graphics Xpedition - Available Signal Layer Checks Categories

Internal Name Signal Layer Checks Category Name

smd2smd SMD to SMD (Spacing)

via2via Via to Via (Spacing)

pth2pth TH to TH* (Spacing)

smd2via SMD to Via (Spacing)

smd2th SMD to TH* (Spacing)

via2th Via to TH* (Spacing)

p2p Pad to Pad (Spacing)

p2c Pad to Circuit (Spacing)

c2c Circuit to Circuit (Spacing)

text2text Text to Text (Spacing)

s2s Surface to Surface (Spacing)

p2s Pad to Surface (Spacing)

c2s Circuit to Surface (Spacing)

text_touch_copper Text Touches Copper (Spacing)

cad_self_spacing CAD Self Spacing (Spacing)

no_net_name_short No Net Name Short (Spacing)

npth2p NPTH to Pad (Drill)

npth2c NPTH to Circuit (Drill)

npth2s NPTH to Surface (Drill)

pth2c PTH to Copper (Drill) - Signal Layer

pth2c_same_net PTH to Copper Same Net (Drill)

via2c Via to Copper (Drill)

miss_via “Missing Pad for PTH (Drill)” on page 176

miss_pth Missing Pad for PTH (Drill)

miss_pth_slot Missing Pad for PTH Slot (Drill)

Table 1-4. Mentor Graphics Xpedition - Available Drill Checks Categories

Internal Name Drill Checks Category Name



October 2016

miss_cu Missing Cu for Via (Drill)

npthtc NPTH Touches Copper (Drill)

neckdown Line Neckdown (Size)

wide_trace_narrow_pad Wide Trace Narrow Pad (Size)

sliver Slivers (Sliver)

short_sliver Short Slivers (Sliver)

self_spacing Same Net Spacing (Legacy) (Bottleneck)

net_loop Net Loop (Nets)

large_net Large Net

Table 1-6. Mentor Graphics Xpedition - Available Power and Ground Checks Categories

Internal Name Power and Ground Checks Category Name

npth2c NPTH to Copper (Drill)

pth2c PTH Annular Ring (Drill) - for P&G

via2c Via to Copper (Drill) - for P&G

pth2p PTH to Plane (Drill)

via2p Via to Plane (Drill)

npth2p NPTH to Plane (Drill)

npth_cont_c NPTH Contains Copper (Drill)

sliver Sliver (Sliver) - for P&G

short_sliver Short Sliver (Sliver)

nfp_pos_spacing NFP Spacing (pos) - (NFP Spacing)

plane_spacing Plane Spacing (Plane Spacing)

Table 1-7. Mentor Graphics Xpedition - Available Silk Screen Check Categories

Internal Name Silk Screen Checks Category Name

ss2pad_smd SMD Clearance (SMD Clearance)

ss2pad_pth PTH Pads Clearance (Pad Clearance)

Table 1-5. Mentor Graphics Xpedition - Available Signal Layer Checks Categories (cont.)

Internal Name Signal Layer Checks Category Name



ss2pad_via Via Pads Clearance (Pad Clearance)

ss2pad_npth NPTH Pads Clearance (Pad Clearance)

ss2pad_undrl Undrilled Pads Clearance (Pad Clearance)

ss2npth NPTH Clearance (Hole Clearance)

ss2pth PTH Clearance (Hole Clearance)

ss2via Via Clearance (Hole Clearance)

ss_line Line Widths (Line Width)

str_overlap String Overlap (String Overlap)

str_and_line_overlap String and Line Overlap (String Overlap)

str_line_width String Line Width (String Properties)

Table 1-8. Mentor Graphics Xpedition - Available Solder Mask Checks Categories

Internal Name Solder Mask Checks Category Name

ar_pth PTH Annular Ring (Drill)

ar_npth NPTH Annular Ring (Drill)

ar_via Via Annular Ring (Drill)

npth2m NPTH Touches Mask (Drill)

neg_ar_pth PTH Gasket (Drill)

neg_ar_via Via Gasket (Drill)

ar_smd SMD Annular Ring (Pads)

ar_pad Pad Annular Ring (Pads)

ar_bga BGA Pad Annular Ring (Pads)

ar_pth_pad PTH Pad Annular Ring (Pads)

ar_npth_pad NPTH Pad Annular Ring (Pads)

ar_via_pad Via Pad Annular Ring (Pads)

ar_ndrl_pad Undrilled Pad Annular Ring (Pads)

neg_ar_smd SMD Pad Gasket (Pads)

neg_ar_pth_pad PTH Pad Gasket (Pads)

neg_ar_npth_pad NPTH Pad Gasket (Pads)

Table 1-7. Mentor Graphics Xpedition - Available Silk Screen Check Categories (cont.)

Internal Name Silk Screen Checks Category Name



October 2016

neg_ar_via_pad Via Pad Gasket (Pads)

neg_ar_ndrl_pad Undrilled Pad Gasket (Pads)

coverage Coverage (Coverage)

exposed_plane Exposed Plane (Coverage)

no_bridge No Bridge (Bridge)

no_bridge_same_net No Bridge Same Net (Bridge)

sliver “SM Sliver (Sliver)” on page 357

short_sliver SM Short Sliver (Sliver)

smd_miss Missing SMD Clearance (Missing)

ndrl_miss Missing Undrilled Pad Clearance (Missing)

npth_miss Missing NPTH Clearance (Missing)

pth_miss Missing PTH Clearance (Missing)

via_miss Missing Via Clearance (Missing)

tp_miss Missing Testpoint Clearance (Missing)

pad_to_pad Pad to Pad Spacing (Spacing)

pad_to_non Pad to Non-Pad Spacing (Spacing)

non_to_non Non-Pad to Non-Pad (Spacing)

pad_toep_2_pad_fid Toeprint Pad to Fiducial Pad (Spacing)

pad_toep_2_any Toeprint Pad to Non-Fiducial (Spacing)

ext_sm_copper_miss Extra SM - Missing Copper (Extra)

ext_sm_pad_miss Extra SM - Missing Pad (Extra)

Table 1-9. Mentor Graphics Xpedition - Available Etching Analysis Categories

Internal Name Etching Analysis Category Name

broken_contact Broken Contact

broken_copper Broken Copper

disconnection Disconnection

detached_drill Detached Drill

unprocessed_net Unprocessed Net

Table 1-8. Mentor Graphics Xpedition - Available Solder Mask Checks Categories (cont.)

Internal Name Solder Mask Checks Category Name

Fabrication AnalysisTerminology


TerminologyConventions, abbreviations and acronyms are used in Fabrication Analysis.

NFP

Non-functional pad

NPTH

Non-plated through hole

PTH

Plated through hole (component hole)

Via

Via drill

Text

A feature of type text or a line, arc, or pad tagged with the feature attribute Copper Text.

Circuit

A line, arc or surface used to facilitate the flow of electricity

r0

Null feature ID. In many analysis categories there are two associated features, such as two pads in the pad to pad spacing category. Sometimes, when a drill annular ring is measured, there are two features, namely the pad and the drill. But there may be cases where there is an annular ring measurement between a drill and a drawn surface. In that case there is no pad to refer to; the ID will be an r0 null feature.

RM

Reliability Margin. The RM is defined in the ERF variables list at the end of each Action chapter.

drill_mark Drill Mark

Table 1-9. Mentor Graphics Xpedition - Available Etching Analysis Categories (cont.)

Internal Name Etching Analysis Category Name


Fabrication AnalysisTerminology

October 2016

DRA

Design Registration Allowance. The DRA for a category is the margin between the minimum measurement in the category and the RM. The DRA for a board is the minimum of all DRAs for categories for which a DRA is defined.

Plated Hole

This term is used to refer to PTHs and vias only.

Results Attributes

Result summaries for either specified layers or all layers. The ellipsis (...) before an attribute represents the name of the layer to which the attribute is applied. If no ellipsis is present, the attribute might be a value that is a summary of all the layers, a total value, or a minimum value for all layers.

For example, the attribute ...num_stub produces the number of stubs in L1 (the specified layer in the action check window). The num_stub attribute produces the number of stubs for all layers.


Chapter 2Drill Checks

The Drill Checks action is a read-only action intended to find potential manufacturability defects in drill layers (through, buried and blind via layers) and generate statistics on drill layers. The action is intended to operate only on drill layers. It uses the drill layer, the top and bottom layers of its drilled stack and any Power and Ground layers in the stack. Categories, reports and attributes are generated.

Additional information on analysis procedures can be found in “Valor NPI Checklist Operations User Guide” and “Valor NPI ERF Manager User Guide”.

Access: Analysis > Fabrication > Drill Checks

Drill Checks Action Screen:

Tests Performed in Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Stubbed Vias. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Thermal Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58


Drill Checks

October 2016

Drill Hole Aspect Ratio for the PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Attributes Used in Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

Categories in Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62PTH Summary (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65NPTH Summary (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66Via Summary (Hole Size). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67Plated Slot Summary (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68Non-Plated Slot Summary (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69Non-Standard Symbol (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70Non-Standard Feature (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 712nd Drilled Holes (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72Tooling Holes (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73Mounting Holes (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74Pressfit Hole Summary (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75Multi-Purpose Holes (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76Covered Tooling Holes (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77Plated Tooling Holes (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78Useful Tooling Hole Count (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79Unique Drill Size (Hole Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80Duplicate Holes (Hole Separation) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81Duplicate Holes Same Net (Hole Separation) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82Duplicate Holes Different Net (Hole Separation). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83Touching Holes (Hole Separation) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84Touching Holes Same Net (Hole Separation). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85Touching Holes Different Net (Hole Separation). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86Close Holes (Hole Separation) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87Close Holes Different Net (Hole Separation) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88Close Holes Same Net (Hole Separation). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89Missing Holes (Missing Holes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90Extra Holes (Extra Holes). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91Short_<lyr1>_<lyr2>, Short_3, Short_4, ... Short_10_up* (Power/Ground Shorts) . . . . . 92NPTH to Rout (NPTH to Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93NPTH to Rout (abs) (NPTH to Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94PTH to Rout (NPTH to Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95PTH to Rout (abs) (NPTH to Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96Tooling Hole to Rout (NPTH to Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97Tooling Hole to Rout (abs) (NPTH to Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98Mount Hole to Rout (NPTH to Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99Mount Hole to Rout (abs) (NPTH to Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100Stubbed Via (Stubbed Vias) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101Stubbed Via (Buried) (Stubbed Vias) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102Antenna Stub (Stubbed Vias) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103No Thermal (Thermal Connection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104No Thermal (No Pad) (Thermal Connection). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105Thermal Connection (Small Pin) (Thermal Connection) . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Drill ChecksTests Performed in Drill Checks


Thermal Connection (Large Pin) (Thermal Connection) . . . . . . . . . . . . . . . . . . . . . . . . . . 107TH Aspect Ratio (PCB Aspect Ratio) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108Via Aspect Ratio (PCB Aspect Ratio) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109Blind Via Aspect Ratio (PCB Aspect Ratio) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110Buried Via Aspect Ratio (PCB Aspect Ratio) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

Results Attributes for Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

ERF Parameters for Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

ERF Variables for Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

Tests Performed in Drill ChecksThe tests that are listed in the ERF parameter pp_tests in the ERF model, or are indicated in the Test List when the analysis is run, control to which categories results are reported.

Table 2-1. Drill Checks Tests

Test Explanation

Hole Size Provides a list of all PTHs, NPTHs, and vias, as well as NPTHs that need pilot drills.

Hole Separation Reports duplicate holes, touching holes and close holes.

Missing Holes Reports missing drills for non-SMD pads.

Extra Holes Reports redundant drills that do not belong to any pad.

Power/Ground Shorts

Reports drills touching large copper nets of more than one Power and Ground layer.

NPTH to Rout Reports drills that have the Tooling Hole or Mounting Hole attributes, and NPTHs and PTHs that are close to the rout path.

Stubbed Vias Reports cases of vias not connected to at least two copper layers. See “Stubbed Vias” on page 56.

Thermal Connection Reports the absence of thermals for through-hole pin drills and calculates the total copper area of thermal connections through all negative Power and Ground and mixed layers. See “Thermal Connection” on page 58.

PCB Aspect Ratio Reports the relationship between board thickness and drilled hole diameters for the smallest through hole and vias (standard, blind and buried) in the tested drill layer.


Drill ChecksStubbed Vias

October 2016

Stubbed ViasVia drills are used to connect copper layers by providing conduit for signal or power and ground nets located on different layers. Via drills are connected to copper layers in the following manner:

On outer signal layers — Connected to a net containing traces (lines or arcs) or surfaces; or touches a pad with attribute SMD Pad or Pad Usage = toeprint.

On inner signal layers — Connected to a net containing traces (lines or arcs) or surfaces; and the net is connected to another layer (that is, the net contains at least one pad or surface connected to another drill).

On negative power/ground or mixed layer — Not embedded in any feature (i.e. the via is connected to a plane in the positive representation of the layer).

A via connected to less than two layers, is defined as stubbed and is reported to one of the categories: ‘Stubbed Via’, ‘Stubbed Via (Buried)’ or ‘Antenna Stub’.

These examples of via types use these colors:

Via Type Explanation Graphic

Not Stubbed Vias

Each of the vias is connected to two layers by traces.

#1 is connected to the top and bottom outer copper layers.

#2 is connected to the top outer layer and an inner layer.

#3 is connected to two inner layers.

Drill ChecksStubbed Vias


Stubbed Vias

Vias are not connected to at least two layers.

#4 has no connections.

#5 is connected to only an inner layer

#6 is connected only to an outer layer.

#7 is connected only to an outer layer. The result is reported to the bottom layer because the unconnected bottom layer is an outer layer.

#8 is reported to the drill layer because the outer layer of the via drill stack is an inner layer of the PCB.

Buried Stubbed Vias

Vias do not penetrate an outer layer and are not connected to at least two layers.

#9 has no connections.

#10 has only one connection.

#11 has two connections but one of the connections is not drilled (not itself connected to a net).



Drill ChecksThermal Connection

October 2016

Thermal ConnectionThrough hole pins with too many thermals or too much copper area in the thermal connections associated with them create poor solder joints. The Thermal Connection categories detect drills lacking thermals and, according to their size, report the total copper area associated with them.

The measurement value is calculated using this formula.

<num_spokes> * <width_spokes> * <layer_thickness> * <copper_weight>

• num_spokes — The number of thermal spokes.

• width_spokes — The width of the spokes.

Antenna Stub Vias

Vias are connected to an outer layer and to an inner layer that is not drilled (not connected to a net).

Both Via #12 and #13 have connections on an outer copper layer.

#12 lacks a connection on its opposite outer layer and the inner layer connection is undrilled.

#13 does not penetrate its opposite copper layer and the inner layer connection is undrilled. Results are reported to the top layer.

Special Case Though Via #14 looks like an antenna stubbed via, it is reported to the ‘Stubbed Via’ category because its outer layer connection is the outer layer of the via drill stack and not the outer layer of the board.


Drill ChecksDrill Hole Aspect Ratio for the PCB


• layer_thickness — The layer thickness as found in the layer attribute .copper_weight.

• copper_weight — Copper thickness corresponding to one ounce per square foot. The value used is the value set in configuration parameter copper_weight.

If you work in metric units, multiply the number obtained for layer thickness by the factor 25.4.

The width of a spoke is measured from one side to the opposite side of the spoke gap. Measurements are cumulative.

Identified thermals are symbols of 3, 4, or 5 spokes. Thermals of more than five spokes, unsymmetrical thermals, or drawn thermals are not always recognized and are reported to category ‘No Thermal’. If the thermal spoke gap is covered, they are reported to category “Thermal Connect Reduction (Thermal)” on page 292 in Power and Ground Checks.

Drill Hole Aspect Ratio for the PCBAspect ratio describes the relationship between drill span and drilled hole diameter. It is important because if holes are too small for a given span, they cannot be successfully plated. The ratio is usually given in the form 8:1, that is, drill span is eight times the drilled hole diameter.

Boards stored in ODB++ already contain the required information in various attributes (Thickness, Copper Weight and Thickness of Material) and individual drill tables.

Drill Checks report the aspect ratio for the smallest through hole and vias (standard, blind and buried) on a drill layer. Each category reports the aspect ratio calculated as <drill_span>/(<hole_size>+const).

• <drill_span> — As determined by v_aspect_ratio_calc_drill_span, is the value of board attribute Thickness (recommended where all drills are through hole and standard vias) or the calculation of the drill span obtained from the layer attributes Copper Weight and Thickness of Material (recommended where blind and buried vias are present and these attributes have been accurately defined).

For regular via drills, the span is considered as piercing all copper layers—a drill span of 3 layers pierces layer 1, 2 and 3. For vias of type laser or photo, the span is to the last layer, but does not pierce it.


Drill ChecksAttributes Used in Drill Checks

October 2016

• <hole_size> — The size of the smallest plated through hole or via in the layer (diameter for circular pads or diagonal of the bounding box for non-circular pads). Plated slots are ignored. Whether to use finished or unfinished drill diameter is determined by ERF variable v_aspect_ratio_by_finished_size.

• const — The correction constant determined by ERF variable v_pcb_aspect_ratio_correction.

If v_aspect_ratio_calc_drill_span = 0 and attribute Thickness does not exist, or its value is zero or a negative number, a very large value (10000) is reported to the relevant categories to indicate a critical problem. One of these messages is printed to the log:

• Job attribute <Thickness> does not exist. (Unreliable results in Aspect Ratio categories.)

• Illegal value for job attribute <Thickness> (0.000000). (Unreliable results in Aspect Ratio categories.)

Attributes Used in Drill ChecksAttributes assigned to the features, layers, and the board of the product model control how the analysis tests these entities.

Feature Attributes

Table 2-2. Drill Checks Feature Attributes

Name Description

Drill Type The feature attribute Drill Type is attached to all drill holes on the drill layers. It defines the type of drill and is used extensively in fabrication.

ICT Testpoint This feature attribute is attached to drill features to indicate that they are testpoints.

Pad Usage The feature attribute Pad Usage is attached to pads on outer signal layers. It value can be one of the following:

toeprint

via

g_fiducial

l_fiducial

tooling_hole

SMD Pad This feature attribute should be attached to outer layer pads which are lands for SMD components. It is set by the ‘Set SMD Attribute’ Cleanup Action.

Tooling Hole This feature attribute is attached to drill features to indicate that they are tooling holes.

Drill ChecksAttributes Used in Drill Checks


Layer Attributes

Board Attributes

Table 2-3. Drill Checks Layer Attributes

Name Description

Copper Weight The weight in ounces of one square inch of copper (default=1oz)

Thickness of Material

The thickness of the insulating layer of laminate between copper layers (default=0.0001in.)

Table 2-4. Drill Checks Board Attributes

Name Description

Thickness The thickness of the printed circuit board


Drill ChecksCategories in Drill Checks

October 2016

Categories in Drill ChecksThe full name of the category and its test group serves as the title of the category. Each category is described in detail, accompanied by an example of a typical measurement.

Table 2-5. Drill Checks Categories

Category Description

PTH Summary (Hole Size) Reports the size of all PTH holes in the layer with attribute Drill Type = PTH.

NPTH Summary (Hole Size)

Reports the size of all NPTH holes in the layer with attribute Drill Type = NPTH.

Via Summary (Hole Size) Reports the size of all via holes in the layer with attribute Drill Type = Via.

Plated Slot Summary (Hole Size)

Reports the size of all plated slots in layer with attribute Drill Type = PTH.

Non-Plated Slot Summary (Hole Size)

Reports the size of all non-plated slots in layer with attribute Drill Type = NPTH..

Non-Standard Symbol (Hole Size)

Reports all non-standard symbol sizes in layer.

Non-Standard Feature (Hole Size)

Reports all non-standard feature sizes in layer.

2nd Drilled Holes (Hole Size)

Reports all NPTHs whose diameters are larger than or equal to ERF variable second_drill_width.

Tooling Holes (Hole Size) Reports all drill features with attribute Tooling Hole, and inserts each as a measurement.

Mounting Holes (Hole Size) Reports all drill features with attribute Tooling Hole, and inserts each as a measurement.

Pressfit Hole Summary (Hole Size)

Reports all drill features with attribute .plated_type = pressfit.

Multi-Purpose Holes (Hole Size)

Reports all drill features with the two attributes Tooling Hole and Mounting Hole.

Covered Tooling Holes (Hole Size)

Reports drills with attribute Tooling Hole that are located under a component on the top or bottom layer.

Plated Tooling Holes (Hole Size)

Reports drills with attribute Tooling Hole that lack the additional attribute Drill Type or the value of this attribute is other than Drill Type = NPTH.

Useful Tooling Hole Count (Hole Size)

Reports the total number of tooling holes in a drill layer.



Unique Drill Size (Hole Size)

Reports the number of different aperture sizes found on a layer.

Duplicate Holes (Hole Separation)

Reports holes whose centers are closer than duph_tolerance.

Duplicate Holes Same Net (Hole Separation)

Reports duplicate holes on the same net.

Duplicate Holes Different Net (Hole Separation)

Reports duplicate holes on different nets.

Touching Holes (Hole Separation)

Reports touching holes whose centers are further apart than ERF variable duph_tolerance.

Touching Holes Same Net (Hole Separation)

Reports touching holes on the same net.

Touching Holes Different Net (Hole Separation)

Reports touching holes on the same net.

Close Holes (Hole Separation)

Reports non-touching holes closer than close_hole_dist.

Close Holes Different Net (Hole Separation)

Reports close holes on different nets.

Close Holes Same Net (Hole Separation)

Reports close holes on the same net.

Missing Holes (Missing Holes)

Reports pads in the top and bottom layers of the drilled stack of the inspected drill layer.

Extra Holes (Extra Holes) Reports drills (not slots or NPTHs) that do not touch any features in either the top or bottom layer of the drilled stack for the inspected drill layer.

Short_<lyr1>_<lyr2>, Short_3, Short_4, ... Short_10_up* (Power/Ground Shorts)

Reports drills touching large copper nets of more than two Power and Ground layers.

NPTH to Rout (NPTH to Rout)

Reports all non-plated through holes closer than pp_rout_distance to the rout path.

NPTH to Rout (abs) (NPTH to Rout)

Reports all non-plated through holes closer than pp_rout_distance to the rout path.

PTH to Rout (NPTH to Rout)

Reports all plated through holes closer than pp_rout_distance to the rout path.

PTH to Rout (abs) (NPTH to Rout)

Reports all plated through holes closer than pp_rout_distance to the rout path.

Table 2-5. Drill Checks Categories (cont.)




October 2016

Tooling Hole to Rout (NPTH to Rout)

Reports all non-plated through holes with attribute Tooling Hole closer than pp_rout_distance to the rout path.

Tooling Hole to Rout (abs) (NPTH to Rout)

Reports all non-plated through holes with attribute Tooling Hole closer than pp_rout_distance to the rout path.

Mount Hole to Rout (NPTH to Rout)

Reports all non-plated through holes with attribute Mounting Hole closer than pp_rout_distance to the rout path.

Mount Hole to Rout (abs) (NPTH to Rout)

Reports all non-plated through holes with attribute Mounting Hole closer than pp_rout_distance to the rout path.

Stubbed Via (Stubbed Vias) Reports vias (not buried) not connected to at least two copper layers, excluding the special case of Antenna Stubbed Vias.

Stubbed Via (Buried) (Stubbed Vias)

Reports buried vias that lack at least two connections to outer copper layers.

Antenna Stub (Stubbed Vias)

Reports vias that are connected only to a PCB’s outer layer and at least one inner layer has an antenna connection.

No Thermal (Thermal Connection)

Reports drills connected to a plane without an interceding thermal on negative and positive Power and Ground or mixed layers.

No Thermal (No Pad) (Thermal Connection)

Reports drills connected to a plane on a positive layer without an interceding pad.


Reports the cumulative area of thermals connecting the through pin to layers.



TH Aspect Ratio (PCB Aspect Ratio)

Reports an aspect ratio for the smallest plated through hole in the layer.

Via Aspect Ratio (PCB Aspect Ratio)

Reports an aspect ratio for the smallest via hole in the layer.

Blind Via Aspect Ratio (PCB Aspect Ratio)

Reports an aspect ratio for the smallest blind via hole in the layer

Buried Via Aspect Ratio (PCB Aspect Ratio)

Reports an aspect ratio for the smallest buried via hole in the layer.

Table 2-5. Drill Checks Categories (cont.)


Drill ChecksPTH Summary (Hole Size)


PTH Summary (Hole Size)Reports the size of all PTH holes in the layer with attribute Drill Type = PTH.

Analysis Category <area>:pth

Measurement Shape

Measurement Entity

Square

Pad (representing a PTH)

Layers Displayed Drill layer

Graphic

Purpose The process of reviewing sizes of plated through holes used for components is necessary to determine that the holes are not smaller than accepted fabrication and assembly tolerances.

Function Reports the size of all PTH holes in the layer with attribute Drill Type = PTH. Requires setting of the attribute by direct EDA input or by using the Drill Tools Manager. See “Drill Tools Manager” in Valor NPI Graphic Station User Guide

ERF Parameters pp_drill_layer

ERF Variables v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Drill ChecksNPTH Summary (Hole Size)

October 2016

NPTH Summary (Hole Size)Reports the size of all NPTH holes in the layer with attribute Drill Type = NPTH.

Analysis Category <area>:npth

Measurement Shape

Measurement Entity

Square representing NPTH

Pad (representing an NPTH)


Graphic

Purpose The process of reviewing non-plated through holes is necessary to find which holes are used, their location and their minimum and maximum sizes.

Function Reports the size of all NPTH holes in the layer with attribute Drill Type = NPTH. Requires setting of the attribute by direct EDA input or by using the Drill Tools Manager. See “Drill Tools Manager” in Valor NPI Graphic Station User Guide.



v_fab_drc_by_area

Limitations

Drill ChecksVia Summary (Hole Size)


Via Summary (Hole Size) Reports the size of all via holes in the layer with attribute Drill Type = Via.

Analysis Category <area>:via

Measurement Shape

Measurement Entity

Circle

Pad (representing a via)


Graphic

Purpose Reviewing sizes of via holes is necessary to determine that the holes are not smaller than the accepted fabrication tolerances.

Function Reports the size of all via holes in the layer with attribute Drill Type = Via. Requires setting of the attribute by direct EDA input or by using the Drill Tool Manager. See “Drill Tools Manager” in Valor NPI Graphic Station User Guide.



v_fab_drc_by_area

Limitations


Drill ChecksPlated Slot Summary (Hole Size)

October 2016

Plated Slot Summary (Hole Size)Reports the size of all plated slots in layer with attribute Drill Type = PTH.

Analysis Category <area>:slot_pt

Measurement Shape

Measurement Entity

Shape

Slot


Graphic

Function Reports the size of all plated slots in layer with attribute Drill Type = PTH. Requires setting of the attribute by direct EDA input or by using the Drill Tools Manager. See “Drill Tools Manager” in Valor NPI Graphic Station User Guide.



v_fab_drc_by_area

Limitations

Drill ChecksNon-Plated Slot Summary (Hole Size)


Non-Plated Slot Summary (Hole Size)Reports the size of all non-plated slots in layer with attribute Drill Type = NPTH..

Analysis Category <area>:slot_npt

Measurement Shape

Measurement Entity

Shape

Slot


Graphic

Function Reports the size of all non-plated slots in layer with attribute Drill Type = NPTH. Requires setting of the attribute by direct EDA input or by using the Drill Tools Manager. See “Drill Tools Manager” in Valor NPI Graphic Station User Guide.



v_fab_drc_by_area

Limitations


Drill ChecksNon-Standard Symbol (Hole Size)

October 2016

Non-Standard Symbol (Hole Size)Reports all non-standard symbol sizes in layer.

Analysis Category <area>:non_standard

Measurement Shape

Measurement Entity

Shape

Non-standard symbol


Graphic

Function Reports all non-standard symbol sizes in layer. Non-standard is anything but round (r) or square (s).



v_fab_drc_by_area

Limitations

Drill ChecksNon-Standard Feature (Hole Size)


Non-Standard Feature (Hole Size)Reports all non-standard feature sizes in layer.

Analysis Category <area>:non_standard_f

Measurement Shape

Measurement Entity

Shape

Non-standard symbol


Graphic

Function Reports all non-standard feature sizes in layer.



v_fab_drc_by_area

Limitations


Drill Checks2nd Drilled Holes (Hole Size)

October 2016

2nd Drilled Holes (Hole Size)Reports all NPTHs whose diameters are larger than or equal to ERF variable second_drill_width.

Analysis Category <area>:2drill

Measurement Shape

Measurement Entity

Circle



Graphic

Purpose Non-plated through holes which may be too large to be drilled only once, or larger than a predefined threshold, may require an additional drilling stage and incur a time penalty in fabrication. This category enables the display of large NPTHs that need a pilot drill.

Function Reports all NPTHs whose diameters are larger than or equal to ERF variable second_drill_width.


ERF Variables second_drill_width

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Drill ChecksTooling Holes (Hole Size)


Tooling Holes (Hole Size)Reports all drill features with attribute Tooling Hole, and inserts each as a measurement.

Analysis Category <area>:tooling_holes

Measurement Shape

Measurement Entity

Circle

Pad (representing a tooling hole)


Graphic

Purpose Tooling holes are non-plated through holes on a board, used in the manufacturing process to align it during various processes such as autorout, ATE, and IFX Functional Tests.

Function Reports all drill features with attribute Tooling Hole, and inserts each as a measurement. This category is especially useful in that it provides an ASCII summary of all tooling hole sizes in the layer.



v_fab_drc_by_area

Limitations


Drill ChecksMounting Holes (Hole Size)

October 2016

Mounting Holes (Hole Size)Reports all drill features with attribute Tooling Hole, and inserts each as a measurement.

Analysis Category <area>:mount_holes

Measurement Shape

Measurement Entity

Circle

Pad (representing a mounting hole)


Graphic

Purpose Mounting holes are a pattern of holes on a PCB used to attach the PCB to another object. The object may be another board, chassis, or sheet metal. If tolerances are suitable, mounting holes may also serve as tooling locations for assembly and test operations.

Function Reports all drill features with attribute Mounting Hole, and inserts each as a measurement. It provides an ASCII summary of all mounting hole sizes in the layer.



v_fab_drc_by_area

Limitations

Drill ChecksPressfit Hole Summary (Hole Size)


Pressfit Hole Summary (Hole Size)Reports all drill features with attribute .plated_type = pressfit.

Analysis Category <area>:pressfit_hole

Measurement Shape

Measurement Entity

Circle

Pad (representing a mounting hole)


Graphic

Purpose Knowing the number of pressfit drills there are on a layer can help in executing a design.

Function Reports all drill features with attribute .plated_type = pressfit.



v_fab_drc_by_area

Limitations


Drill ChecksMulti-Purpose Holes (Hole Size)

October 2016

Multi-Purpose Holes (Hole Size)Reports all drill features with the two attributes Tooling Hole and Mounting Hole.

Analysis Category <area>:multi_purpose_holes

Measurement Shape

Measurement Entity

Measurement Value

Drill shape

Drill pad

Drill limits


Graphic

Purpose A hole that is used as a mounting hole may be damaged in the process. If it is later used as a tooling hole, it may not fit the ICT fixture.

Function Reports all drill features with the two attributes Tooling Hole and Mounting Hole.



v_fab_drc_by_area

Limitations

Drill ChecksCovered Tooling Holes (Hole Size)


Covered Tooling Holes (Hole Size)Reports drills with attribute Tooling Hole that are located under a component on the top or bottom layer.

Analysis Category <area>:covered_tooling_h

Measurement Shape

Measurement Entity

Measurement Value

Tooling hole limits

Tooling hole size

Tooling hole size


Component layers

Graphic

Purpose To detect tooling holes located under a component. Such holes cannot be used as tooling holes.

Function Reports drills with attribute Tooling Hole that are located under a component on the top or bottom layer.



v_fab_drc_by_area

Limitations


Drill ChecksPlated Tooling Holes (Hole Size)

October 2016

Plated Tooling Holes (Hole Size)Reports drills with attribute Tooling Hole that lack the additional attribute Drill Type or the value of this attribute is other than Drill Type = NPTH.

Analysis Category <area>:plated_tooling_h

Measurement Shape

Measurement Entity

Measurement Value

Tooling hole limits

Tooling hole size

Tooling hole size


Graphic

Purpose To detect tooling holes that are not non-plated through holes because ICT tooling holes need to be NPTH only.

Function Reports drills with attribute Tooling Hole that lack the additional attribute Drill Type or the value of this attribute is other than Drill Type = NPTH.



v_fab_drc_by_area

Limitations

Drill ChecksUseful Tooling Hole Count (Hole Size)


Useful Tooling Hole Count (Hole Size)Reports the total number of tooling holes in a drill layer.

Analysis Category <area>:tooling_h_count

Measurement Shape

Measurement Entity

Measurement Value

Layer limits

None

Number of useful tooling holes


Graphic

Purpose There should be a minimum number of tooling holes in every board. This category helps detect those boards lacking a minimum number of tooling holes.

Function Reports the total number of tooling holes (drill features with attribute Tooling Hole) in a drill layer. Drills located under components are not reported. Only drill layers with full board span are checked for this category.



v_fab_drc_by_area

Limitations The report is per drill layer, not a total of all drill layers. So where there are multiple drill layers, it could happen that one would be falsely reported as lacking a minimum number of tooling holes. To reduce such false alarms, only drill layers with full board span are checked in this category.


Drill ChecksUnique Drill Size (Hole Size)

October 2016

Unique Drill Size (Hole Size)Reports the number of different aperture sizes found on a layer.

Analysis Category <area>:unique_drill_size

Measurement Shape

Measurement Value

Bounding box of all drills

Drill diameter


Graphic

Purpose Knowing the number of different drill sizes required for the drill holes of a layer is necessary for preparing drilling tools.

Function Reports the number of different aperture sizes found on a layer.



v_fab_drc_by_area

Limitations The report is per drill layer, not a total of all drill layers. So where there are multiple drill layers, it could happen that the same drill size is reported more than once for different layers.

Drill ChecksDuplicate Holes (Hole Separation)


Duplicate Holes (Hole Separation)Reports holes whose centers are closer than duph_tolerance.

Analysis Category <area>:duph

Measurement Shape

Measurement Entity

Shape representing drill

Two pads (representing any drill)


Graphic

Purpose Duplicate holes (holes with the same size and location) serve no purpose. They just lengthen the drilling process and incur wear and tear on the drill bit. Clicking on duplicate holes causes the pile-up menu to open. Select the hole you want from the list. Placing the cursor over the name in the list highlights the feature.

Function Reports holes whose centers are closer than duph_tolerance. Measurements are shapes representing the drill with the smallest index in layer.

If v_calc_by_net = 1, duplicate holes are reported to either Duplicate Holes Same Net or Duplicate Holes Different Net, and not to this category.


ERF Variables duph_tolerance

v_fab_drc_map_layer

v_fab_drc_by_area

v_calc_by_net = 0

Limitations


Drill ChecksDuplicate Holes Same Net (Hole Separation)

October 2016

Duplicate Holes Same Net (Hole Separation)Reports duplicate holes on the same net.

Analysis Category <area>:duphsn

Measurement Shape

Measurement Entity




Graphic

Purpose Duplicate holes (holes with the same size and location) serve no purpose. This category reports holes that are on the same net, whose centers are closer than duph_tolerance.

Function Measurements are shapes representing the drill with the smallest index in the layer.

If v_calc_by_net = 1, duplicate holes are reported to either this category or to Duplicate Holes Different Net.

If v_calc_by_net = 0, all duplicate holes are reported to Duplicate Holes, and not to this category.



v_fab_drc_map_layer

v_fab_drc_by_area

v_calc_by_net = 1

Limitations

Drill ChecksDuplicate Holes Different Net (Hole Separation)


Duplicate Holes Different Net (Hole Separation)Reports duplicate holes on different nets.

Analysis Category <area>:duphdn

Measurement Shape

Measurement Entity




Graphic

Purpose Duplicate holes (holes with the same size and location) serve no purpose. This category reports holes that are on different nets, whose centers are closer than duph_tolerance.

Function Measurements are shapes representing the drill with the smallest index in the layer.

If v_calc_by_net = 1, duplicate holes are reported to either this category or to Duplicate Holes Same Net.

If v_calc_by_net = 0, all duplicate holes are reported to Duplicate Holes, and not to this category.



v_fab_drc_map_layer

v_fab_drc_by_area

v_calc_by_net = 1

Limitations


Drill ChecksTouching Holes (Hole Separation)

October 2016

Touching Holes (Hole Separation)Reports touching holes whose centers are further apart than ERF variable duph_tolerance.

Analysis Category <area>:touchh

Measurement Shape

Measurement Entity

Segment



Graphic

Purpose Holes that touch each other can create irregular shapes with acute corners susceptible to breakage.

Function Reports touching holes whose centers are further apart than ERF variable duph_tolerance. Measurement is a segment representing the inter-center distance of the holes.

If v_calc_by_net = 1, touching holes are reported to either Touching Holes Same Net or Touching Holes Different Net, and not to this category.



v_fab_drc_map_layer

v_fab_drc_by_area

v_calc_by_net = 0

Limitations

Drill ChecksTouching Holes Same Net (Hole Separation)


Touching Holes Same Net (Hole Separation)Reports touching holes on the same net.

Analysis Category <area>:touchhsn

Measurement Shape

Measurement Entity

Segment



Graphic

Purpose Holes that touch each other can create irregular shapes with acute corners susceptible to breakage. This category reports touching holes on the same net whose centers are further apart than ERF variable duph_tolerance.

Function Measurement is a segment representing the inter-center distance of the holes.

If v_calc_by_net = 1, touching holes are reported to either this category or to Touching Holes Different Net.

If v_calc_by_net = 0, all touching holes are reported to category Touching Holes, and not to this category.



v_fab_drc_map_layer

v_fab_drc_by_area

v_calc_by_net = 1

Limitations


Drill ChecksTouching Holes Different Net (Hole Separation)

October 2016

Touching Holes Different Net (Hole Separation)Reports touching holes on the same net.

Analysis Category <area>:touchhdn

Measurement Shape

Measurement Entity

Segment



Graphic

Purpose Holes that touch each other can create irregular shapes with acute corners susceptible to breakage. This category reports touching holes on different nets whose centers are further apart than ERF variable duph_tolerance.

Function Measurement is a segment representing the inter-center distance of the holes.

If v_calc_by_net = 1, touching holes are reported to either this category or to Touching Holes Different Net.

If v_calc_by_net = 0, all touching holes are reported to category Touching Holes, and not to this category.



v_fab_drc_map_layer

v_fab_drc_by_area

v_calc_by_net = 1

Limitations

Drill ChecksClose Holes (Hole Separation)


Close Holes (Hole Separation)Reports non-touching holes closer than close_hole_dist.

Analysis Category <area>:closeh

Measurement Shape

Measurement Entity

Segment

Two pads (representing drill diameters)


Graphic

Purpose Holes that are too close might create a tiny inter-hole strip which is liable to break during processing.

Function Reports non-touching holes closer than close_hole_dist. Measurements are shapes representing distance segments.

If v_calc_by_net = 1, close holes are reported to either Close Holes Same Net or Close Holes Different Net, and not to this category.


ERF Variables close_hole_dist

v_fab_drc_map_layer

v_fab_drc_by_area

v_calc_by_net = 0

Limitations


Drill ChecksClose Holes Different Net (Hole Separation)

October 2016

Close Holes Different Net (Hole Separation)Reports close holes on different nets.

Analysis Category <area>:closehdn

Measurement Shape

Measurement Entity

Segment



Graphic

Purpose Holes that are too close might create a tiny inter-hole strip which is liable to break during processing. This category reports non-touching holes, on different nets, that are closer than close_hole_dist.

Function Measurements are shapes representing distance segments.

If v_calc_by_net = 1, close holes are reported to either this category or to Close Holes Same Net.

If v_calc_net = 0, all close holes are reported to category Close Holes and not to this category.



v_fab_drc_map_layer

v_fab_drc_by_area

v_calc_by_net = 1

Limitations

Drill ChecksClose Holes Same Net (Hole Separation)


Close Holes Same Net (Hole Separation)Reports close holes on the same net.

Analysis Category <area>:closehsn

Measurement Shape

Measurement Entity

Segment



Graphic

Purpose Holes that are too close might create a tiny inter-hole strip which is liable to break during processing. This category reports non-touching holes on the same net, that are closer than close_hole_dist.

Function Measurements are shapes representing distance segments.

If v_calc_by_net = 1, close holes are reported to either this category or to Close Holes Different Net.

If v_calc_net = 0, all close holes are reported to category Close Holes and not to this category.



v_fab_drc_map_layer

v_fab_drc_by_area

v_calc_by_net = 1

Limitations


Drill ChecksMissing Holes (Missing Holes)

October 2016

Missing Holes (Missing Holes)Reports pads in the top and bottom layers of the drilled stack of the inspected drill layer.

Analysis Category <area>:missh

Measurement Shape

Measurement Entity

Point

Pad

Layers Displayed Top and bottom outer layers

Graphic

Purpose This category serves as a warning. Sometimes a hole is omitted by a mistake, then two pads will be located on both sides of a stack without a connecting hole.

Function Reports pads in the top and bottom layers of the drilled stack of the inspected drill layer where all of these apply:

• No drill touches the top pad.• Both pads are non SMD.• The distance between the pad centers is no more than

duph_tolerance.Measurement is a point at the center of the top pad.

If a fiducial is found in one of the outer layers, a missing hole violation is not reported.



v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Drill ChecksExtra Holes (Extra Holes)


Extra Holes (Extra Holes)Reports drills (not slots or NPTHs) that do not touch any features in either the top or bottom layer of the drilled stack for the inspected drill layer.

Analysis Category <area>:extrah

Measurement Shape

Measurement Entity

Circle representing such a drill

Layers Displayed Drill layer and the top and bottom layer of its layer stack

Graphic

Purpose A plated through or via hole always requires copper pads on both sides to ensure correct plating.

Function Reports drills (not slots or NPTHs) that do not touch any features in either the top or bottom layer of the drilled stack for the inspected drill layer. Measurement is a circle representing such a drill.

Measurements will be reported only for the selected hole types.


pp_extra_hole_type


v_fab_drc_by_area

Limitations


Drill ChecksShort_<lyr1>_<lyr2>, Short_3, Short_4, ... Short_10_up* (Power/Ground Shorts)

October 2016

Short_<lyr1>_<lyr2>, Short_3, Short_4, ... Short_10_up* (Power/Ground Shorts)

Reports drills touching large copper nets of more than two Power and Ground layers.

Analysis Category <area>:pgshort*

Measurement Shape

Measurement Entity

Point representing the drill center

Pad (representing a drill)

Layers Displayed Drill layer and two Power and Ground layers pierced by it

Graphic

Purpose A clearance which is replaced by a thermal pad or omitted altogether causes a direct short between a power plane and a ground plane with the usual disastrous results. Detecting shorts between two different Power and Ground layers is crucial, even though false alarms are sometimes reported.

Function Reports drills touching large copper nets (not NFP) of more than two Power and Ground layers. The logic is that if a drill is drilled through thermal pads of two different Power and Ground layers, it shorts the planes.

When two layers are shorted, the category name is ‘Short_<1st layer name>_<2nd layer name>’. When more than two layers are shorted, the category name is ‘Short_3’, ‘Short_4’, and so on.


ERF Variables min_hole_dist

v_fab_drc_map_layer

v_fab_drc_by_area

v_shorts_by_net_name

Limitations

Drill ChecksNPTH to Rout (NPTH to Rout)


NPTH to Rout (NPTH to Rout)Reports all non-plated through holes closer than pp_rout_distance to the rout path.

Analysis Category <area>:npth2rout

Measurement Shape

Measurement Entity

Segment

Pad

Layers Displayed Drill layer, rout layer

Graphic

Purpose Holes too close to the rout edge could be damaged during routing.

Function Reports all non-plated through holes closer than pp_rout_distance to the rout path. The measurement itself is the segment between the hole’s edge and the rout skeleton, but the measurement value is the distance as a percentage of the hole’s radius. That is, a distance of 60 mils for a hole with radius 300 mils will have a measurement value of 20 [60*100/300].


pp_rout_distance

ERF Variables npth2rout_only_tool_mnt

npth2rout_by_type

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Drill ChecksNPTH to Rout (abs) (NPTH to Rout)

October 2016

NPTH to Rout (abs) (NPTH to Rout)Reports all non-plated through holes closer than pp_rout_distance to the rout path.

Analysis Category <area>:npth2rout_abs

Measurement Shape

Measurement Entity

Segment

Pad


Graphic


Function Reports all non-plated through holes closer than pp_rout_distance to the rout path. The measurement value is the distance between the hole’s edge and the rout skeleton.


pp_rout_distance


npth2rout_by_type

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Drill ChecksPTH to Rout (NPTH to Rout)


PTH to Rout (NPTH to Rout)Reports all plated through holes closer than pp_rout_distance to the rout path.

Analysis Category <area>:pth2rout

Measurement Shape

Measurement Entity

Segment

Pad


Graphic


Function Reports all plated through holes closer than pp_rout_distance to the rout path. The measurement itself is the segment between the hole’s edge and the rout skeleton, but the measurement value is the distance as a percentage of the hole’s radius. That is, a distance of 60 mils for a hole with radius 300 mils will have a measurement value of 20 [60*100/300].


pp_rout_distance


v_fab_drc_by_area

Limitations


Drill ChecksPTH to Rout (abs) (NPTH to Rout)

October 2016

PTH to Rout (abs) (NPTH to Rout)Reports all plated through holes closer than pp_rout_distance to the rout path.

Analysis Category <area>:pth2rout_abs

Measurement Shape

Measurement Entity

Segment

Pad


Graphic


Function Reports all plated through holes closer than pp_rout_distance to the rout path. The measurement value is the distance between the hole’s edge and the rout skeleton.


pp_rout_distance


v_fab_drc_by_area

Limitations

Drill ChecksTooling Hole to Rout (NPTH to Rout)


Tooling Hole to Rout (NPTH to Rout)Reports all non-plated through holes with attribute Tooling Hole closer than pp_rout_distance to the rout path.

Analysis Category <area>:tooling2rout

Measurement Shape

Measurement Entity

Segment

Pad


Graphic


Function Reports all non-plated through holes with attribute Tooling Hole closer than pp_rout_distance to the rout path. The measurement itself is the segment between the hole’s edge and the rout skeleton, but the measurement value is the distance as a percentage of the hole’s radius. That is, a distance of 60 mils for a hole with radius 300 mils will have a measurement value of 20 [60*100/300].


pp_rout_distance


npth2rout_by_type

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Drill ChecksTooling Hole to Rout (abs) (NPTH to Rout)

October 2016

Tooling Hole to Rout (abs) (NPTH to Rout)Reports all non-plated through holes with attribute Tooling Hole closer than pp_rout_distance to the rout path.

Analysis Category <area>:tooling2rout_abs

Measurement Shape

Measurement Entity

Segment

Pad


Graphic


Function Reports all non-plated through holes with attribute Tooling Hole closer than pp_rout_distance to the rout path. The measurement value is the distance between the hole’s edge and the rout skeleton.


pp_rout_distance


npth2rout_by_type

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Drill ChecksMount Hole to Rout (NPTH to Rout)


Mount Hole to Rout (NPTH to Rout)Reports all non-plated through holes with attribute Mounting Hole closer than pp_rout_distance to the rout path.

Analysis Category <area>:mount2rout

Measurement Shape

Measurement Entity

Segment

Pad


Graphic


Function Reports all non-plated through holes with attribute Mounting Hole closer than pp_rout_distance to the rout path. The measurement itself is the segment between the hole’s edge and the rout skeleton, but the measurement value is the distance as a percentage of the hole’s radius. That is, a distance of 60 mils for a hole with radius 300 mils will have a measurement value of 20 [60*100/300].


pp_rout_distance


npth2rout_by_type

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Drill ChecksMount Hole to Rout (abs) (NPTH to Rout)

October 2016

Mount Hole to Rout (abs) (NPTH to Rout)Reports all non-plated through holes with attribute Mounting Hole closer than pp_rout_distance to the rout path.

Analysis Category <area>:mount2rout_abs

Measurement Shape

Measurement Entity

Segment

Pad


Graphic


Function Reports all non-plated through holes with attribute Mounting Hole closer than pp_rout_distance to the rout path. The measurement value is the distance between the hole’s edge and the rout skeleton.


pp_rout_distance


npth2rout_by_type

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Drill ChecksStubbed Via (Stubbed Vias)


Stubbed Via (Stubbed Vias)Reports vias (not buried) not connected to at least two copper layers, excluding the special case of Antenna Stubbed Vias.

Analysis Category <area>:stubbed_via

Measurement Shape

Measurement Entity

Via drill

None


Top and bottom layer of the via drill stack

Graphic

Purpose Vias not connected to at least two copper layers indicate a design problem since an electrical connection is impossible.

Function Reports vias (not buried) not connected to at least two copper layers, excluding the special case of Antenna Stubbed Vias. See Stubbed Vias.



v_fab_drc_by_area

v_report_testpoint_stub

Limitations


Drill ChecksStubbed Via (Buried) (Stubbed Vias)

October 2016

Stubbed Via (Buried) (Stubbed Vias)Reports buried vias that lack at least two connections to outer copper layers.

Analysis Category <area>:stubbed_buried_via

Measurement Shape

Measurement Entity

Via drill


Top and bottom layer of the via drill stack

Graphic

Purpose Vias not connected to at least two points on the outer copper layers indicate a design problem since a valid electrical connection is impossible.

Function Reports buried vias that lack at least two connections to outer copper layers.



v_fab_drc_by_area

Limitations

Drill ChecksAntenna Stub (Stubbed Vias)


Antenna Stub (Stubbed Vias)Reports vias that are connected only to a PCB’s outer layer and at least one inner layer has an antenna connection.

Analysis Category <area>:antenna_stub

Measurement Shape

Measurement Entity

Via drill


Top and bottom layer of the vial drill stack

Graphic

Purpose Vias not connected to at least two copper layers indicate a design problem since an electrical connection is impossible.

Function Reports vias that are connected only to a PCB’s outer layer and at least one inner layer has an antenna connection. (A via connected to a net containing traces or surfaces but the net is not connected to another layer. Results are reported to the connected outer layer.



v_fab_drc_by_area


Limitations


Drill ChecksNo Thermal (Thermal Connection)

October 2016

No Thermal (Thermal Connection)Reports drills connected to a plane without an interceding thermal on negative and positive Power and Ground or mixed layers.

Analysis Category <area>:no_thermal;<pin_type>

Measurement Shape

Measurement Entity

Drill shape

Drill shape


Copper layer

Graphic

Purpose Through-hole pins connected directly to a plane without a thermal may cause an incorrect solder joint due to heat dissipation.

Function Reports drills connected to a plane without an interceding thermal on negative and positive Power and Ground or mixed layers.

See the discussion in “Thermal Connection” on page 58.



v_fab_drc_by_area

min_pad_to_report_thermal

min_trace_to_report_thermal

max_thermal_dist

v_polarity_for_thermal_check

v_calc_outer_layers

Limitations

Drill ChecksNo Thermal (No Pad) (Thermal Connection)


No Thermal (No Pad) (Thermal Connection)Reports drills connected to a plane on a positive layer without an interceding pad.

Analysis Category <area>:no_thermal_no_pad;<pin_type>

Measurement Shape

Measurement Entity

Drill shape

Drill shape


Copper layer

Graphic

Purpose Through-hole pins connected directly to a plane without a thermal may cause an incorrect solder joint due to heat dissipation.

Function Reports drills connected to a plane on a positive layer without an interceding pad. Where pads do not exist, thermal checks cannot be run.

See the discussion in “Thermal Connection” on page 58.



v_fab_drc_by_area

max_thermal_dist


v_calc_outer_layers

Limitations If ‘All’ is selected, this category reports instances of missing thermal pads on positive layers only.


Drill ChecksThermal Connection (Small Pin) (Thermal Connection)

October 2016



Analysis Category <area>:thermal_con_s;<pin_type>

Measurement Shape

Measurement Entity

Measurement Value

Drill shape

Drill shape

Sum of copper area connection in all layers.


Copper layer

Graphic

Purpose Through-hole pins connected to a plane by too much copper (large thermal spokes; large number of layers) might cause an incorrect solder joint due to heat dissipation.

Function Reports the cumulative area of thermals connecting the through pin to layers.

The measurement is calculated as described in “Thermal Connection” on page 58.



v_fab_drc_by_area



max_thermal_dist

max_small_pin

v_max_thermal_size


v_calc_outer_layers

v_thermal_connection_layers

Limitations

Drill ChecksThermal Connection (Large Pin) (Thermal Connection)




Analysis Category <area>:thermal_con_l;<pin_type>

Measurement Shape

Measurement Entity

Measurement Value

Drill shape

Drill shape

Sum of copper area connection in all layers.


Copper layer

Graphic

Purpose Through-hole pins connected to a plane by too much copper (large thermal spokes; large number of layers) might cause an incorrect solder joint due to heat dissipation.

Function Reports the cumulative area of thermals connecting the through pin to layers.

The measurement is calculated as described in “Thermal Connection” on page 58.



v_fab_drc_by_area



max_thermal_dist

max_small_pin

v_max_thermal_size


v_calc_outer_layers


Limitations


Drill ChecksTH Aspect Ratio (PCB Aspect Ratio)

October 2016

TH Aspect Ratio (PCB Aspect Ratio)Reports an aspect ratio for the smallest plated through hole in the layer.

Analysis Category th_aspect_ratio

Measurement Shape

Measurement Entity

Measurement Value

Smallest TH drill in the layer

Pad (representing a drill), drill size, drill span

Ratio (floating point number)


Graphic

Purpose Aspect ratio is a fabrication term used to describe the relationship between drill span and the drilled hole diameter. Holes that are too small cannot be successfully plated.

Function Reports an aspect ratio for the smallest plated through hole in the layer: <drill_span>/(<hole_size>+const)

<drill_span> — determined by ERF variable v_pcb_aspect_ratio_correction.

<hole_size> — the size of the smallest plated through hole in the layer (diameter for circular pads or diagonal of the bounding box for non-circular pads). Plated slots are ignored.

const — the correction constant determined by ERF variable v_pcb_aspect_ratio_correction.

If v_aspect_ratio_calc_drill_span = 0 and attribute Thickness does not exist, or its value is zero or a negative number, a very large value (10000) is reported to the relevant categories to indicate a critical problem. A message is printed to the log. See “Drill Hole Aspect Ratio for the PCB” on page 59


ERF Variables v_pcb_aspect_ratio_correction

v_aspect_ratio_by_finished_size

v_aspect_ratio_calc_drill_span

Limitations

Drill ChecksVia Aspect Ratio (PCB Aspect Ratio)


Via Aspect Ratio (PCB Aspect Ratio)Reports an aspect ratio for the smallest via hole in the layer.

Analysis Category via_aspect_ratio;<via_type>

Measurement Shape

Measurement Entity

Measurement Value

Smallest via drill in the layer

Pad (representing a drill), drill size, drill span



Graphic


Function Reports an aspect ratio for the smallest via hole in the layer: <drill_span>/(<hole_size>+const) where,


<hole_size> — the size of the smallest via in the layer (diameter for circular pads or diagonal of the bounding box for non-circular pads). Plated slots are ignored.

‘const’ — the correction constant determined by ERF variable v_pcb_aspect_ratio_correction.


If v_aspect_ratio_calc_drill_span = 0 and attribute Thickness does not exist, or its value is zero or a negative number, a very large value (10000) is reported to the relevant categories to indicate a critical problem. A message is printed to the log. See “Drill Hole Aspect Ratio for the PCB” on page 59.





Limitations


Drill ChecksBlind Via Aspect Ratio (PCB Aspect Ratio)

October 2016

Blind Via Aspect Ratio (PCB Aspect Ratio)Reports an aspect ratio for the smallest blind via hole in the layer

Analysis Category blind_via_aspect_ratio;<via_type>

Measurement Shape

Measurement Entity

Measurement Value

Smallest blind via drill in the layer

A pad (representing a drill), drill size, drill span



Graphic


Function Reports an aspect ratio for the smallest blind via hole in the layer: <drill_span>/(<hole_size>+const) where,


<hole_size> — the size of the smallest blind via hole in the layer (diameter for circular pads or diagonal of the bounding box for non-circular pads). Plated slots are ignored.



If v_aspect_ratio_calc_drill_span=0 and attribute Thickness does not exist, or its value is zero or a negative number, a very large value (10000) is reported to the relevant categories to indicate a critical problem. A message is printed to the log. See “Drill Hole Aspect Ratio for the PCB” on page 59.





Limitations

Drill ChecksBuried Via Aspect Ratio (PCB Aspect Ratio)


Buried Via Aspect Ratio (PCB Aspect Ratio)Reports an aspect ratio for the smallest buried via hole in the layer.

Analysis Category buried_via_aspect_ratio;<via_type>

Measurement Shape

Measurement Entity

Measurement Value

Smallest buried via drill in the layer

A pad (representing the drill), drill size, drill span



Graphic


Function Reports an aspect ratio for the smallest buried via hole in the layer: <drill_span>/(<hole_size>+const)

<drill_span> —determined by ERF variable v_pcb_aspect_ratio_correction.

<hole_size> — the size of the smallest buried via hole in the layer (diameter for circular pads or diagonal of the bounding box for non-circular pads). Plated slots are ignored.



If v_aspect_ratio_calc_drill_span=0 and attribute Thickness does not exist, or its value is zero or a negative number, a very large value (10000) is reported to the relevant categories to indicate a critical problem. A message is printed to the log. See “Drill Hole Aspect Ratio for the PCB” on page 59.





Limitations


Drill ChecksResults Attributes for Drill Checks

October 2016

Results Attributes for Drill ChecksResult attributes are assigned when the analysis is run. The values of the attributes can be retrieved afterwards.

Table 2-6. Drill Checks Results Attributes

Attribute Description

...num_pth PTHs found by the action

...min_pth Smallest PTH found by the action

...num_npth NPTHs found by the action

...min_npth Smallest NPTH found by the action

...num_via Vias found by the action

...min_via Smallest via found by the action

...num_2drill NPTHs in need of a pilot drill

...num_duph Duplicate holes found by the action

...num_touchh Touching holes found by the action

...num_closeh Close holes found by the action

...min_closeh Smallest distance between close holes found by the action

...num_missh Missing holes found by the action

...num_extrah Extra holes found by the action

...min_npth2rout Smallest NPTH to rout measurement (%)

...num_npth2rout Number of NPTH to rout measurements

...min_npth2rout_abs Smallest NPTH to rout measurement

...num_npth2rout_abs Number of NPTH to rout measurements

...typ_npth2rout Typical NPTH to rout measurement

...num_pth2rout Number of PTH to rout measurements

...min_pth2rout Smallest PTH to rout measurements

...typ_pth2rout Typical PTH to rout measurements

...num_pth2rout_abs Number of PTH to rout measurements

...min_pth2rout_abs Smallest PTH to rout measurements

...typ_pth2rout_abs Typical PTH to rout measurements

...num_tooling_holes Number of tooling holes

...num_mount_holes Number of mount holes

Drill ChecksResults Attributes for Drill Checks


...num_pressfit_hole Number of pressfit holes

...num_unique_drill_size Number of different drill sizes in a layer

...num_slot_pt Plated slots found by the action

...num_slot_npt Non-plated slots found by the action

...num_non_standard Non-standard symbols found by the action

...num_non_standard_f Non-standard features found by the action

...num_pgshort Total of all kinds of Power and Ground shorts found by the action. Summary of the number of measurements in the ‘PGSHORT_3 - PGSHORT_10_UP’ and all the ‘PGSHORT_<layer name 1>_<layer name 2>’ categories

Table 2-6. Drill Checks Results Attributes (cont.)



Drill ChecksERF Parameters for Drill Checks

October 2016

ERF Parameters for Drill ChecksERF parameters, set in the ERF model or when the analysis is run, control the analysis..

Table 2-7. Drill Checks ERF Parameters

Screen Name Parameter Description Categories Affected

Drill Layer pp_drill_layer Defines the layer to be affected by the action, according to the rules defined as described in “Valor NPI Checklist Operations User Guide”.

All categories

Rout Distance pp_rout_distance Minimum distance allowed between NPTHs and rout skeleton

All NPTH to Rout categories

Test List pp_tests Defines the tests to be run. See “Tests Performed in Drill Checks” on page 55.

All categories

Hole types to check for extras

pp_extra_hole_type The type of holes to be reported as extra holes (holes that do not touch features in one of the external layers of the stack). More than one can be checked.

PTH or NPTH or Via

Extra Holes

Drill ChecksERF Variables for Drill Checks


ERF Variables for Drill ChecksERF variables set in the ERF model control the analysis.ERF variable values are limited to 255 characters.

Table 2-8. Drill Checks ERF Variables

ERF Variable Description Categories Affected

close_hole_dist Maximum search radius for ‘Hole Separation’ tests. (default = 24 mils)

Close Holes — When non-touching holes are closer than this.

Close Holes

duph_tolerance Defines the relationship between holes and pads. (default = 0.5)

Duplicate Holes — Two holes whose centers are closer than this value.

Touching Holes — Two holes whose centers are further apart than this value, but touch.

Missing Holes — Two pads in top and bottom layers where all of these apply:

• The distance between pad centers is no more than this value.

• No drill touches the top pad.• Both pads are non SMD.

Duplicate Holes

Touching Holes

Missing Holes

max_small_pin Controls whether results are reported to ‘Thermal Connection (Small Pin)’ or ‘Thermal Connection (Large Pin)’.

Values equal to or less than this variable are reported to ‘Thermal Connection (Small Pin)’.

Values greater than this variable are reported to ‘Thermal Connection (Large Pin)’.

Thermal Connection (Small Pin)

Thermal Connection (Large Pin)

max_thermal_dist Determines the distance within which to check for a thermal. If no thermal is found, results are reported to ‘No Thermal’.

All Thermal Connection categories

min_hole_dist For internal testing by the Power and Ground short test. Its value should not be changed from default = 10 mil.

Short_<layer1>_<layer2>, Short_3, and so on.



October 2016


Determines the minimum diameter of thermal pads to report on inner layers if the thermal has only one or two spoke gaps. Relates only to positive layers. (default=200mil)

No Thermal




Determines the minimum trace width (cumulative) to report thermals of either one or two spoke gaps on inner layers. Relates only to positive layers. (default=200mil)

No Thermal



npth2rout_by_type Determines how NPTH drills are reported.

0 — Reports all NPTHs to the ‘NPTH to Rout’ categories.

1 — Reports NPTHs with attribute Tooling Hole to ‘Tooling Hole to Rout’ and ‘Tooling Hole to Rout (abs)’; reports all NPTHs with attribute Mounting Hole to ‘Mount Hole to Rout’ and ‘Mount Hole to Rout (abs)’; and reports all other NPTHs to ‘NPTH to Rout’ and ‘NPTH to Rout (abs)’.


npth2rout_only_tool_mnt

Determines which NPTHs, too close to rout skeleton, are reported.

0 — All NPTHs within maximal distance. (default)

1 — Only NPTHs with attribute Tooling Hole or Mounting Hole within maximal distance.


second_drill_width Determines which NPTHs are too large to be drilled only once. NPTHs with diameters larger than this value are reported as ‘2nd Drilled Holes’. (default = 250 mil.)

2nd Drilled Holes

Table 2-8. Drill Checks ERF Variables (cont.)





Determines whether drill span is taken from the job attribute Thickness or calculated using the layer attributes .copper_weight and Thickness of Material.

0 — Drill span taken from attribute Thickness. (default) Recommended where all drills are through hole and standard vias.

1 — Drill span calculated using attributes .copper_weight and Thickness of Material. Recommended where blind and buried vias are present and these attributes have been accurately defined.

TH Aspect Ratio

Via Aspect Ratio

Blind Via Aspect Ratio

Buried Via Aspect Ratio


Determines the size taken from the drill tool manager for drill diameter, finished or unfinished.

0 — Use drill size (drill diameter before plating).

1 — Use finished drill size (drill diameter after plating). (default)

TH Aspect Ratio

Via Aspect Ratio







October 2016

v_calc_by_net Controls whether results of the Hole Separation test are reported to categories that indicate whether the holes are on the same net.

no — Results are reported to categories Close Holes, Duplicate Holes and Touching Holes. (default)

yes — Results are reported to categories that indicate whether the holes are on different nets or on the same net.

Close Holes

Close Holes Different Net

Close Holes Same Net

Duplicate Holes

Duplicate Holes Different Net

Duplicate Holes Same Net

Touching Holes

Touching Holes Different Net

Touching Holes Same Net

v_calc_outer_layers Determines whether or not to include the outer layers in Thermal Connection Checks.

0 — do not include outer layers. (default)

1 — include outer layers.


v_fab_drc_all_layers

Controls the layers for which classification by area is performed.

yes — Classification by area is performed on all layers, even if layers are specified in attributes .drc_etch_lyrs or .drc_etch_lyrs_bit.

no — If layers are specified in attributes .drc_etch_lyrs or .drc_etch_lyrs_bit, classification by area is performed only on those layers. (default)

All except:

PCB Aspect Ratio





v_fab_drc_by_area Determines whether checks are applied according to dynamic area classification.

0 — <area> classification is not applied. (default)

1 — <area> classification is applied.

All except:

PCB Aspect Ratio

v_fab_drc_map_layer

Specifies the default DRC map layer name. All except:

PCB Aspect Ratio

v_max_thermal_size

Maximum size of the outer diameter of a thermal, calculated as the average distance between the drill center and the connections to the plane. New thermal recognition method is used if the value is positive.



v_pcb_aspect_ratio_correction

The constant used in calculating the aspect ratio. (default=0)

TH Aspect Ratio

Via Aspect Ratio







October 2016


Defines the layers to be affected by the Thermal Connection checks.

All - all layers. (default)

Negative - negative layers only.

Positive - positive layers only.



Determines whether to report testpoint drills as stubbed vias.

1 - reports all stubbed vias. (default)

0 - does not report via drills with attribute ICT Test Point.

Stubbed Via

Antenna Stub

v_shorts_by_net_name

Determines whether to report the shorts of drills in two or more planes when their net names are the same.

0 - report all drills that short two or more power and ground layers. (default)

1 - report drills that short two or more power and ground planes only if belonging to different nets.

Note: This variable set to 1 is effective only when running the Power/Ground Shorts test globally and when net data exists.

Short_<layer1>_<layer2>, Short_3, and so on.


Determines the layers checked. You enter values for type, side and context as text. For example: type=mixed|signal|power_ground & side=top|inner & context=board.






Chapter 3Signal Layer Checks

The Signal Layer action is a read-only action intended to find potential manufacturability defects in signal and mixed layers, and generate statistics. The action can operate on any layer, but is mainly intended for signal layers. It uses the layer itself and any NC (drill or rout) layer which pierces it. Categories, reports and attributes are generated.

Access: Analysis > Fabrication > Signal Layer Checks.

Signal Layer Checks Action Screen.

Tests Performed in Signal Layer Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124


Signal Layer Checks

October 2016

Bottlenecks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

Compensated Rout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

Signal Layer ERF Variables - Compatibility with Earlier Products . . . . . . . . . . . . . . . 127

Attributes Used in Signal Layer Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

Categories in Signal Layer Checks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130Toeprint to Toeprint (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136SMD to SMD (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137Via to Via (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138TH to TH* (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139SMD to Via (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140SMD to TH* (Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141Via to TH* (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142Pad to Pad (Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143Pad to Circuit (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144Circuit to Circuit (Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145Text to Text (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147Surface to Surface (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148Pad to Surface (Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149Circuit to Surface (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150Text Touches Copper (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151Spacing Length (Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152Same Net Spacing (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153CAD Short (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155CAD Self Spacing (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156No Net Name Short (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157NPTH to Pad (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158NPTH to Circuit (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159NPTH to Surface (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160PTH to Copper (Drill) - Signal Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161PTH to Copper Same Net (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162PTH Annular Ring (Drill) - Signal Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163PTH Registration (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165NPTH Registration (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166NPTH Annular Ring (Drill) - for Signal Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167PTH (Comp) Annular Ring (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169Pressfit (Comp) Annular Ring (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170Via Annular Ring (Drill) - for Signal Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171Blind Via Annular Ring (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172Buried Via Annular Ring (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173Via to Copper (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174Missing Pad for Via (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175Missing Pad for PTH (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176Missing Pad for PTH Slot (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177Missing Cu for Via (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178

Signal Layer Checks


Tooling Hole to Exposed Copper (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179NPTH Touches Copper (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180Mounting Pad to Adjacent Copper (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181Rout to Copper (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182V-cut Rout to Copper (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183Break Tab Rout to Copper (Rout). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184Rout to Trace (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186V-cut Rout to Trace (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187Break Tab Rout to Trace (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188Pads (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189Lines (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190Shaved Lines (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191Text (Size). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192Text Fields (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193Line Neckdown (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194Arcs (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196Shaved Arcs (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197Conductor Width (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198Wide Trace Narrow Pad (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199Disconnected Surfaces (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200Slivers (Sliver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201Short Slivers (Sliver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202Stubs (Stubs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203Surface Stubs (Stubs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204Undrilled Area (Undrilled Area). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205SMD Pads (SMD). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206SMD Pitch (SMD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207SMD Packages (SMD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208Conductor Width (Bottleneck) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209Same Net Spacing (Legacy) (Bottleneck) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210Copper Bottleneck (Bottleneck) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211Copper Bottleneck Within Lines (Bottleneck) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212Etch Outside Keepin Area (Keepin/Keepout) - Signal Layer. . . . . . . . . . . . . . . . . . . . . . . 214Etch Within Keepout Area (Keepin/Keepout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215Trace Within Keepout Area (Keepin/Keepout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216Via Within Keepout Area (Keepin/Keepout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217Plane Within Keepout Area (Keepin/Keepout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218Pad Within Keepout Area (Keepin/Keepout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219Exposed Via to Exposed Via (Exposure) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220Exposed Via to Exposed Copper (Exposure) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221Exposed to Exposed (Exposure) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222Covered to Covered (Exposure) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223Exposed to Covered (Exposure) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224Net Loop (Nets) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225Large Net . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226


Signal Layer ChecksTests Performed in Signal Layer Checks

October 2016

Non-Referenced Signal (Adjacent) (Signal Reference) . . . . . . . . . . . . . . . . . . . . . . . . . . . 227Non-Referenced Signal Area (Adjacent) (Signal Reference). . . . . . . . . . . . . . . . . . . . . . . 228Non-Referenced Signal Length (Adjacent) (Signal Reference) . . . . . . . . . . . . . . . . . . . . . 229Non-Referenced Signal Width (%) (Adjacent) (Signal Reference) . . . . . . . . . . . . . . . . . . 230Non-Referenced Signal (Next) (Signal Reference) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231Non-Referenced Signal Area (Next) (Signal Reference) . . . . . . . . . . . . . . . . . . . . . . . . . . 232Non-Referenced Signal Length (Next) (Signal Reference) . . . . . . . . . . . . . . . . . . . . . . . . 233Non-Referenced Signal Width (%) (Next) (Signal Reference) . . . . . . . . . . . . . . . . . . . . . 234

Special Reports for Signal Layer Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235

Results Attributes for Signal Layer Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236

ERF Parameters for Signal Layer Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240

ERF Variables for Signal Layer Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243

Tests Performed in Signal Layer ChecksThe tests that are listed in the ERF parameter pp_tests in the ERF model, or are indicated in the Test List when the analysis is run, control to which categories results are reported.

Table 3-1. Signal Layer Checks Tests

Test Explanation

Spacing Reports spacing violations between pads, circuits and nets, and between text to text. Also reports shorts and spacing between different CAD nets and close distances between non-touching features on the same CAD or Layer nets.

Drill Reports distance violations between NPTHs/PTHs/Vias, and pads, circuits, annular rings and copper. Also reports missing pads.

Rout Reports distance violations between edge of rout features and pads, circuits, and other features.

Size Reports sizes of pads, shaved lines, text, line neckdowns, arcs and shaved arcs.

Sliver Reports on slivers between lines and pads or between pads and pads. Slivers between two features with the Copper Text attribute are ignored. However, a sliver between a text feature and a functional pad are reported.

Stubs Reports unconnected line endpoints.

Undrilled Area Reports circular areas exceeding a specified diameter where no drill holes are found.

SMD Lists SMD pads, reports on pitch of SMD pads, and identifies SMD packages.

Signal Layer ChecksBottlenecks


BottlenecksBottleneck categories handle bottlenecks (conductor neckdown), which produce narrow strips of copper. It is important to detect bottlenecks because they could break off during the manufacturing process and cause shorts. In detecting bottlenecks, width and shortest perimeter length are measured.

All incidences of bottlenecks less than or equal to max_bottleneck_width are reported.

There are these types of bottlenecks:

Classic Bottleneck

. Conductor neckdown occurs between two features in a surface or between a feature and the outer edge of a surface.

Bottleneck Reports thin copper surfaces which could break during assembly.

See “Bottlenecks” on page 125.

Keepin/Keepout Areas

Reports on features inside/outside Keepin/Keepout areas (for a description of Keepin/Keepout areas see “Keepin and Keepout Areas” on page 26).

Exposure Reports distances between exposed vias to exposed vias/toeprints/copper on outer layers.

Nets Reports layer nets containing loops.

Signal Reference Reports on signal traces belonging to critical nets which meet an opening in the plane of an adjacent/next power and ground layer.

This check is no longer part of the Valor NPI standard offering.

Table 3-1. Signal Layer Checks Tests (cont.)

Test Explanation


Signal Layer ChecksCompensated Rout

October 2016

Bottleneck due to Tail Narrowing

This is conductor narrowing close to the end of a copper surface or feature (a tail).

Tail narrowing is considered to be a bottleneck based on one or both of the values T and B.

T — Shortest perimeter length from one endpoint of the segment to the other, along the conductor edge.

B — Width of the bottleneck.

For category “Copper Bottleneck (Bottleneck)” on page 211 the tail narrowing is defined as a bottleneck if this relationship exists: (T / B) > v_tail2bottleneck_ratio.

For the other bottleneck categories, the tail narrowing is defined as a bottleneck if this relationship exists: T >= v_min_bottleneck_tail.

Compensated RoutMeasurements from features to rout features can be run in one of two ways—feature to rout skeleton, or feature to compensated rout. If the actual routing parameters are not known, the feature to rout skeleton option can be used and ranges set to take into consideration width of the possible rout path. However, if routing tool details are available, measurements should be performed using the feature to compensated rout option.

Signal Layer ChecksSignal Layer ERF Variables - Compatibility with Earlier Products


Whether or not to use the compensated rout option is determined by the ERF parameter pp_use_compensated_rout.

If pp_use_compensated_rout = yes, and compensation does not exist, the measurement will be to the rout edge.

Signal Layer ERF Variables - Compatibility with Earlier Products

To maintain compatibility between legacy products and current versions of Valor NPI, some ERF variables must be mapped.

Attributes Used in Signal Layer ChecksAttributes assigned to the features, components, layers, and keepin/keepout areas of the product model control how the analysis tests these entities.

Table 3-2. Signal Layer Checks ERF Compatibility Mapping

Earlier Products Valor NPI

ignore_isolated_pad = yes miss_pad_for_isolated_hole = 0

ignore_isolated_pad = no miss_pad_for_isolated_hole = 1

diff_net_local_spacing v_slivers_check_diff_nets

dist2sliver_ratio v_dist2sliver_ratio

min_sliver_len v_min_sliver_len


Signal Layer ChecksAttributes Used in Signal Layer Checks

October 2016

Feature Attributes

Table 3-3. Signal Layer Checks Feature Attributes

Name Description

Copper Balancing This attribute is attached to features which are added during a pattern fill operation, either manually or through the Copper Balance DFM action.

If a line / arc has this attribute attached, then it will not be reported in the line histogram display.

Copper Feature Ignore

Copper features bearing this attribute are ignored in analysis actions. (Presently implemented only for Rout Test.)

Copper Text This attribute defines a feature as a nomenclature legend feature. The attribute affects the fabrication analysis by directing spacing checks between such features into a new category (Text to text).

Drill Type This attribute is attached to hole features in drill layers. It defines the type of drill and is used extensively during fabrication analysis.

Pad Usage The feature attribute Pad Usage is attached to pads on outer signal layers. It value can be one of the following:

toeprint

via

g_fiducial

l_fiducial

tooling_hole

Rout Break Point Applied to features in the rout layer to indicate a break tab.

Note: the system automatically recognizes a minimum of three round or square hole features of equal pitch as a break tab. To recognize only two features as a break tab, both must have this attribute.

SMD Pad This feature attribute should be attached to outer layer pads which are lands for SMD components. It is set by the ‘Set SMD Attribute’ Cleanup Action.

V-Score Edge This attribute is assigned to rout features that are cut in a V-shape (such as in the figure). Another machine performs the V-shape

cutting.

Signal Layer ChecksAttributes Used in Signal Layer Checks


Component Attributes

Layer Attribute

Keepin/Keepout Area Attributes

Table 3-4. Signal Layer Checks Component Attributes

Name Description

Ignore Graphically/Output

This attribute is attached to a component to be ignored during DFM actions.

Required Toeprint Spacing

This attribute is specifically attached to components for reporting in the Toeprint to Toeprint category. It defines the maximum spacing within which to report pad to pad spacing measurements.

Range: 1-500

Units: inch/mm

Table 3-5. Signal Layer Checks Layer Attributes

Name Description

Layer Class This attribute is used to differentiate between layers. It enables you to set different ERF ranges for inner layers than for outer layers.

Table 3-6. Signal Layer Checks Keepin/Keepout Attributes

Name Description

Rout Keep In Reports rout features outside this area.

Rout Keep Out Reports rout features inside this area.

Via Keep Out Reports via features inside this area.

Trace Keep Out Reports traces inside this area.

Pad Keep Out Reports pads inside this area.

Plane Keep Out Reports planes inside this area.

DFx Area All Layers

Applies the area to all board layers.


Applies the area to all specified copper layers according to the values specified. (For further details see Keepin and Keepout Area Attributes.)


Signal Layer ChecksCategories in Signal Layer Checks

October 2016

Categories in Signal Layer ChecksThe full name of the category and its test group serves as the title of the category. Each category is described in detail, accompanied by an example of a typical measurement.

Spacing measurements are reported when they are within the search radius set in pp_spacing.

The ERF parameter pp_layer applies to all categories, and is not mentioned on the category fact sheet. See “ERF Parameters for Signal Layer Checks” on page 240.


Table 3-7. Signal Layer Checks Categories


Toeprint to Toeprint (Spacing)

Reports measurements between two pads on an outer layer belonging to the same component with attribute Required Toeprint Spacing.

SMD to SMD (Spacing) Reports SMD pad to SMD pad measurements less than pp_spacing.

Via to Via (Spacing) Reports via pad to via pad measurements less than pp_spacing.

TH to TH* (Spacing) Reports TH pad to TH pad measurements less than pp_spacing.

SMD to Via (Spacing) Reports SMD pad to via pad measurements less than the pp_spacing.

SMD to TH* (Spacing) Reports SMD pad to TH pad measurements less than pp_spacing.

Via to TH* (Spacing) Reports via pad to TH pad measurements less than pp_spacing.

Pad to Pad (Spacing) Reports electrically unconnected pads (in the same layer) closer than pp_spacing.

Pad to Circuit (Spacing) Reports unconnected pads and circuit elements closer than pp_spacing in the same layer.

Circuit to Circuit (Spacing) Reports unconnected circuit elements closer than pp_spacing in the same layer.

Text to Text (Spacing) Reports text features closer than pp_spacing.

Surface to Surface (Spacing)

Reports two surfaces closer than ERF parameter pp_spacing in the same layer.

Pad to Surface (Spacing) Reports pads and surfaces closer than ERF parameter pp_spacing in the same layer.

Circuit to Surface (Spacing) Reports circuits and surfaces closer than ERF parameter pp_spacing in the same layer.



Text Touches Copper (Spacing)

Reports text features (text, or lines/arc/pads tagged with attribute Copper Text) touching copper features.

Spacing Length (Spacing) Reports parallel lines closer than pp_spacing belonging to different layer nets.

Same Net Spacing (Spacing)

Reports non-touching, non-text features closer than pp_spacing belonging to the same layer net.

CAD Short (Spacing) Reports touching features that belong to different CAD nets.

CAD Self Spacing (Spacing)

Reports non-touching features closer than pp_spacing belonging to the same CAD net.

No Net Name Short (Spacing)

Reports touching features: one with a CAD net name, the other with no net name.

NPTH to Pad (Drill) Reports other net NPTHs and pads closer than pp_d2c in accordance with group_drill_to_copper.

NPTH to Circuit (Drill) Reports other net NPTHs and circuits closer than pp_d2c in accordance with group_drill_to_copper.

NPTH to Surface (Drill) Reports other net NPTHs and surfaces closer that ERF parameter pp_d2c in accordance with ERF variable group_drill_to_copper.

PTH to Copper (Drill) - Signal Layer

Reports plated holes of different nets in the same layer closer than pp_d2c to any copper in accordance with ERF variable group_drill_to_copper.

PTH to Copper Same Net (Drill)

Reports plated holes of the same net in the same layer closer than pp_d2c to any copper in accordance with group_drill_to_copper.

PTH Annular Ring (Drill) - Signal Layer

Reports the shortest distance between drill and laminate for PTHs (or vias) embedded in copper, for a specific drill size.

PTH Registration (Drill) Reports the smallest center-to-center distance between drills and touching pads, if larger than reg_allowance and smaller than max_reg.

NPTH Registration (Drill) Reports the smallest center-to-center distance between drills and touching pads, if larger than reg_allowance and smaller than max_reg.

NPTH Annular Ring (Drill) - for Signal Layer

Reports the shortest distance between drill and laminate for NPTHs embedded in copper, for a specific drill size.

PTH (Comp) Annular Ring (Drill)

Reports the shortest distance between drill and laminate for PTHs embedded in copper, for a specific drill size.

Table 3-7. Signal Layer Checks Categories (cont.)




October 2016

Pressfit (Comp) Annular Ring (Drill)

Reports the shortest distance between drill and laminate for pressfit drills embedded in copper, for a specified drill size.

Via Annular Ring (Drill) - for Signal Layer

Reports the shortest distance between drill and laminate for vias embedded in copper, for a specific drill size.

Blind Via Annular Ring (Drill)

Reports the shortest distance between drill and laminate for blind vias embedded in copper, for a specific drill size.

Buried Via Annular Ring (Drill)

Reports the shortest distance between drill and laminate for buried vias embedded in copper for a specific drill size.

Via to Copper (Drill) Reports other net, via holes closer than pp_d2c to any copper in accordance with group_drill_to_copper.

Missing Pad for Via (Drill) Reports via drills not fully covered by copper.

Missing Pad for PTH (Drill) Reports PTH drills not fully covered by copper.

Missing Pad for PTH Slot (Drill)

Reports PTH drills not fully covered by copper.

Missing Cu for Via (Drill) Reports via holes with attribute Vias Need CU not completely surrounded by copper in a drill layer.

Tooling Hole to Exposed Copper (Drill)

Reports all tooling holes closer than pp_d2c to exposed copper on an outer layer.

NPTH Touches Copper (Drill)

Reports NPTH holes that touch non-pad features; or pads, if pad limits do not include hole center.

Mounting Pad to Adjacent Copper (Drill)

Reports pads around a mounting hole on an outer signal layer that are too close to copper in the next (adjacent) layer.

Rout to Copper (Rout) Reports distances closer than pp_r2c between copper and rout features.

V-cut Rout to Copper (Rout)

Reports distances closer than pp_r2c between copper and rout features bearing attribute Vcut Feature.

Break Tab Rout to Copper (Rout)

Reports copper features too close to a break tab. Distance is measured from feature edge to break tab edge.

Rout to Trace (Rout) Reports distances closer than pp_r2c between an arc or line and rout features.

V-cut Rout to Trace (Rout) Reports distances closer than pp_r2c between arcs and lines and rout features bearing attribute Vcut Feature.

Break Tab Rout to Trace (Rout)

Reports arcs and lines too close to a break tab.

Pads (Size) Reports a summary of all pads in a signal layer.





Lines (Size) Reports width of lines representing conductor traces in signal layers.

Shaved Lines (Size) Reports lines touched by negative shaves, NPTHs, or non-plated rout features.

Text (Size) Reports all lines tagged by the Copper Text system attribute.

Text Fields (Size) Reports features of type text.

Line Neckdown (Size) Reports lines that are joined so that the width at the narrowest point is less than nominal line width.

Arcs (Size) Reports arc features thinner than max_line_width with neither Copper Text nor Copper Balancing attributes.

Shaved Arcs (Size) Reports arc features shaved by negative features, NPTHs or non-plated rout features.

Conductor Width (Size) Reports lines with neckdowns.

Wide Trace Narrow Pad (Size)

Reports cases where a trace is connected at one of its end points to a pad narrower than the trace at their point of connection.

Disconnected Surfaces (Size)

Reports small, isolated surfaces to warn about the presence of thin copper.

Slivers (Sliver) Reports narrow slivers.

Short Slivers (Sliver) Reports narrow slivers.

Stubs (Stubs) Reports line endpoints that do not touch any other feature.

Surface Stubs (Stubs) Reports long thin surface protrusions that are not connected to copper or a drill.

Undrilled Area (Undrilled Area)

Reports circular areas exceeding a specified diameter where no drill holes are found on the layer.

SMD Pads (SMD) Reports pads tagged with feature attribute SMD Pad.

SMD Pitch (SMD) Reports first measurement of parallel, evenly spaced SMD pads for each row in the layer.

SMD Packages (SMD) Reports matching rows of SMD pads (as described in ‘SMD Pitch’) and tries to group them into packages.

Conductor Width (Bottleneck)

Reports distances between copper surfaces narrower than max_bottleneck_width.

Same Net Spacing (Legacy) (Bottleneck)

Reports violations within the same net between each of a contour’s edges and another feature closer than pp_spacing.

Copper Bottleneck (Bottleneck)

Reports bottlenecks where the conductor is narrower than max_bottleneck_width.





October 2016

Copper Bottleneck Within Lines (Bottleneck)

Reports bottlenecks where the conductor is narrower than max_bottleneck_width.

Etch Outside Keepin Area (Keepin/Keepout) - Signal Layer

Reports etches placed outside the rout keepin area boundaries.

Etch Within Keepout Area (Keepin/Keepout)

Reports etches within keepout area boundaries.

Trace Within Keepout Area (Keepin/Keepout)

Reports lines and arcs within Keepout area boundaries.

Via Within Keepout Area (Keepin/Keepout)

Reports vias within Keepout area boundaries.

Plane Within Keepout Area (Keepin/Keepout)

Reports surfaces within Keepout area boundaries.

Pad Within Keepout Area (Keepin/Keepout)

Reports pads within Keepout area boundaries.

Exposed Via to Exposed Via (Exposure)

Reports the distances less than pp_e_spacing between the edges of the exposed copper of two uncapped vias. Classified by process.

Exposed Via to Exposed Copper (Exposure)

Reports the distance between the edge of the exposed copper of an uncapped via and the exposed copper on the outer signal layers only, when closer than pp_e_spacing.

Exposed to Exposed (Exposure)

Reports close circuit elements in the same layer.

Covered to Covered (Exposure)

Reports circuit elements closer than pp_e_spacing in the same layer.

Exposed to Covered (Exposure)

Reports circuit elements closer than pp_e_spacing in the same layer, one exposed and one covered in the matching solder mask layer.

Net Loop (Nets) Reports net loops on each layer.

Large Net Reports nets with more than the number of features specified by large_net_min.

Non-Referenced Signal (Adjacent) (Signal Reference)

Reports signal traces belonging to critical nets at the point where they meet an opening in the plane of an adjacent P&G layer.

Non-Referenced Signal Area (Adjacent) (Signal Reference)

Calculates the area of a critical net with net attribute SQA Critical Net over an opening in the adjacent P&G plane.





Non-Referenced Signal Length (Adjacent) (Signal Reference)

Reports the length of a non-referenced portion under the signal trace belonging to a net with net attribute SQA Critical Net.

Non-Referenced Signal Width (%) (Adjacent) (Signal Reference)

Reports the width of a non-referenced signal area in an adjacent layer under a net with attribute SQA Critical Net.

Non-Referenced Signal (Next) (Signal Reference)

Reports signal traces which belong to nets with attribute SQA Critical Net, at the point where they meet an opening in the plane of the next P&G layer.

Non-Referenced Signal Area (Next) (Signal Reference)

Calculates the area of a critical net with net attribute critical_net over an opening in the next P&G plane.

Non-Referenced Signal Length (Next) (Signal Reference)

Reports the length of a non-referenced portion under the signal trace belonging to a net with attribute SQA Critical Net.

Non-Referenced Signal Width (%) (Next) (Signal Reference)

Reports the width of a non-referenced signal area in the next layer under a net with attribute SQA Critical Net.




Signal Layer ChecksToeprint to Toeprint (Spacing)

October 2016

Toeprint to Toeprint (Spacing)Reports measurements between two pads on an outer layer belonging to the same component with attribute Required Toeprint Spacing.

Analysis Category <area>:toe2toe

Measurement Shape

Measurement ID

Spacing segment

Two pads

Layers Displayed Signal layer

Graphic

Purpose To enable the specification of different pad2pad spacing requirements for each component type.

Function Reports measurements between two pads on an outer layer belonging to the same component with attribute Required Toeprint Spacing. The pads must be closer than the value of Required Toeprint Spacing (within the tolerance specified by toe2toe_tol). Does not report measurements involving features with attribute Copper Feature Ignore.

If attribute Required Toeprint Spacing not present, toeprints are classified according to pad type.

If attribute Required Toeprint Spacing = 7.5 mil, and variable toe2toe_tol = 0.1 mil, then measurements of 7.4 mil or less are reported, and measurements larger than 7.4 mil are ignored.

If the job was created directly from a CAD database, extra functionality is provided. A measurement between pads of the same CAD net, even if unconnected in the same layer, is placed in the ‘CAD Self Spacing’ category rather than the ‘Toeprint to Toeprint’ category.

ERF Parameters

ERF Variables classify_pad2pad = yes

toe2toe_tol

v_classify_spacing_by_imp

v_ignore_comps_with_ignore_attr

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksSMD to SMD (Spacing)


SMD to SMD (Spacing)Reports SMD pad to SMD pad measurements less than pp_spacing.

Analysis Category <area>:smd2smd

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing

Pad1; Pad2


Graphic

Purpose To apply spacing restrictions to SMD pads.

Function Reports SMD pad to SMD pad measurements less than pp_spacing. Does not report measurements involving features with attribute Copper Feature Ignore.

If the job was created directly from a CAD database, extra functionality is provided. A measurement between pads of the same CAD net, even if unconnected in the same layer, is placed in the ‘CAD Self Spacing’ category rather than the ‘SMD to SMD’ category.

ERF Parameters pp_spacing



v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Signal Layer ChecksVia to Via (Spacing)

October 2016

Via to Via (Spacing)Reports via pad to via pad measurements less than pp_spacing.

Analysis Category <area>:via2via

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing

Pad1; Pad2


Graphic

Purpose To apply spacing restrictions to via pads.

Function Reports via pad to via pad measurements less than pp_spacing. Does not report measurements involving features with attribute Copper Feature Ignore.

Via, in this instance, refers to a via hole with attribute Drill Type = Via.

If the job was created directly from a CAD database, extra functionality is provided. A measurement between pads of the same CAD net, even if unconnected in the same layer, are placed in the ‘CAD Self Spacing’ category rather than the ‘Via to Via’ category.




v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksTH to TH* (Spacing)


TH to TH* (Spacing)Reports TH pad to TH pad measurements less than pp_spacing.

Analysis Category <area>:pth2pth

(name is retained for backward compatibility)

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing

Pad1; Pad2


Graphic

Purpose To apply spacing restrictions to through-holes.

Function Reports TH pad to TH pad measurements less than pp_spacing. Does not report measurements involving features with attribute Copper Feature Ignore.

TH, in this instance, refers to a through-hole which can be either plated (PTH) or non-plated (NPTH).

If the job was created directly from a CAD database, extra functionality is provided. A measurement between pads of the same CAD net, even if unconnected in the same layer, are placed in the ‘CAD Self Spacing’ category rather than the ‘TH to TH’ category.




v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Signal Layer ChecksSMD to Via (Spacing)

October 2016

SMD to Via (Spacing)Reports SMD pad to via pad measurements less than the pp_spacing.

Analysis Category <area>:smd2via

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing

Two pads


Graphic

Purpose To apply spacing restrictions to SMD/via pads.

Function Reports SMD pad to via pad measurements less than the pp_spacing. Does not report measurements involving features with attribute Copper Feature Ignore.

If the job was created directly from a CAD database, extra functionality is provided. A measurement between pads of the same CAD net, even if unconnected in the same layer, are placed in the ‘CAD Self Spacing’ category rather than the ‘SMD to Via’ category.




v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksSMD to TH* (Spacing)


SMD to TH* (Spacing)Reports SMD pad to TH pad measurements less than pp_spacing.

Analysis Category <area>:smd2th

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing

Pad1; Pad2


Graphic

Purpose To apply spacing restrictions to SMD pads /through-holes.

Function Reports SMD pad to TH pad measurements less than pp_spacing. Does not report measurements involving features with attribute Copper Feature Ignore.

TH, in this instance, refers to a through-hole which can be either plated or non-plated.

If the job was created directly from a CAD database, extra functionality is provided. A measurement between pads of the same CAD net, even if unconnected in the same layer, are placed in the ‘CAD Self Spacing’ category rather than the ‘SMD to TH’ category.




v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Signal Layer ChecksVia to TH* (Spacing)

October 2016

Via to TH* (Spacing)Reports via pad to TH pad measurements less than pp_spacing.

Analysis Category <area>:via2th

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing

Pad1; Pad2


Graphic

Purpose To apply spacing restrictions to vias or through-holes.

Function Reports via pad to TH pad measurements less than pp_spacing. Does not report measurements involving features with attribute Copper Feature Ignore.

TH, in this instance, refers to a through-hole which can be either plated or non-plated.

If the job was created directly from a CAD database, extra functionality is provided. A measurement between pads of the same CAD net, even if unconnected in the same layer, are placed in the ‘CAD Self Spacing’ category rather than the ‘Via to TH’ category.




v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksPad to Pad (Spacing)


Pad to Pad (Spacing)Reports electrically unconnected pads (in the same layer) closer than pp_spacing.

Analysis Category <area>:p2p;teardrop

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing

Pad1; Pad2


Graphic

Purpose Close pads may bridge during imaging, etching, plating or soldering, and result in a direct short.

Function Reports electrically unconnected pads (in the same layer) closer than pp_spacing. Measurements are segments, provided they only touch copper at its end points.

If classify_pad2pad=yes, the measurements reported are only between pads that are both non-drilled and non-SMD. If no, all measurements are reported here.

Does not report measurements involving features with attribute Copper Feature Ignore.

If the job was created directly from a CAD database, extra functionality is provided. A measurement between pads of the same CAD net, even if unconnected in the same layer, are placed in the ‘CAD Self Spacing’ category rather than the ‘Pad to Pad’ category.




v_classify_by_teardrop

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Signal Layer ChecksPad to Circuit (Spacing)

October 2016

Pad to Circuit (Spacing)Reports unconnected pads and circuit elements closer than pp_spacing in the same layer.

Analysis Category <area>:p2c;teardrop

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing

Pad; Circuit


Graphic

Purpose A pad and a circuit too close may bridge during imaging, etching, plating or soldering, and result in a direct short.

Function Reports unconnected pads and circuit elements closer than pp_spacing in the same layer. Measurements are segments, provided they only touch copper at its end points. Does not report measurements involving features with attribute Copper Feature Ignore.

If the job was created directly from a CAD database, extra functionality is provided. A measurement between pads, even if unconnected, and circuits of the same CAD net in the same layer are placed in the ‘CAD Self Spacing’ category rather than in the ‘Pad to Circuit’ category.


ERF Variables v_surface_spacing_separately



v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksCircuit to Circuit (Spacing)


Circuit to Circuit (Spacing)Reports unconnected circuit elements closer than pp_spacing in the same layer.

Analysis Category <area>:c2c;teardrop

Measurement Shape

Measurement Value

Measurement ID

Segment

Spacing

Circuit1; Circuit2


Graphic

Purpose Close circuits may bridge during imaging, etching, plating or soldering, and result in a direct short.

Function Reports unconnected circuit elements closer than pp_spacing in the same layer. Measurements are segments, provided they only touch copper at its end points.


Jobs created directly from a CAD database, contain extra functionality. A measurement between two circuits of the same CAD net, even if unconnected in the same layer, are reported to ‘CAD Self Spacing’ rather than ‘Circuit to Circuit’.

Violations occurring when rout features or non-plated holes cross copper features are also reported to this category. Make sure the respective layers (rout and npth drill) are displayed. Otherwise, measurements seem to be embedded within a copper feature. Activating the relevant layer reveals that the copper feature has been cut into two

very close surfaces.



Signal Layer ChecksCircuit to Circuit (Spacing)

October 2016

ERF Variables v_surface_spacing_separately



v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksText to Text (Spacing)


Text to Text (Spacing)Reports text features closer than pp_spacing.

Analysis Category <area>:text2text

Measurement Shape

Measurement Value

Measurement ID

Segment

Spacing

Text1; Text2


Graphic

Purpose Copper marked as text on a layer may create spacing violations. Since these are typically non-critical, they are channeled to a special category.

Function Text features are either features of type text, or lines/arc/pads tagged with attribute Copper Text. Reports text features closer than pp_spacing. Does not report measurements involving features with attribute Copper Feature Ignore.



v_fab_drc_by_area

Limitations


Signal Layer ChecksSurface to Surface (Spacing)

October 2016

Surface to Surface (Spacing)Reports two surfaces closer than ERF parameter pp_spacing in the same layer.

Analysis Category <area>:s2s;teardrop

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing distance

Surface1; Surface2


Graphic

Purpose Surfaces too close to each other may bridge during imaging, etching, plating or soldering, and result in a direct short.

Function Reports two surfaces closer than ERF parameter pp_spacing in the same layer. Measurement is the distance segment provided it only touches copper at its end points. Measurements involving features with attribute Copper Feature Ignore are not reported.


ERF Variables v_surface_spacing_separately = yes



v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksPad to Surface (Spacing)


Pad to Surface (Spacing)Reports pads and surfaces closer than ERF parameter pp_spacing in the same layer.

Analysis Category <area>:p2s;teardrop

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing distance

Pad; Surface


Graphic

Purpose A pad too close to a surface may bridge during imaging, etching, plating or soldering, and result in a direct short.

Function Reports pads and surfaces closer than ERF parameter pp_spacing in the same layer. Measurement is the distance segment provided it only touches copper at its end points. Measurements involving features with attribute Copper Feature Ignore are not reported.





v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Signal Layer ChecksCircuit to Surface (Spacing)

October 2016

Circuit to Surface (Spacing)Reports circuits and surfaces closer than ERF parameter pp_spacing in the same layer.

Analysis Category <area>:c2s;teardrop

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing distance

Circuit; Surface


Graphic

Purpose A circuit too close to a surface may bridge during imaging, etching, plating or soldering, and result in a direct short.

Function Reports circuits and surfaces closer than ERF parameter pp_spacing in the same layer. Measurement is the distance segment provided it only touches copper at its end points. Measurements involving features with attribute Copper Feature Ignore are not reported.





v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksText Touches Copper (Spacing)


Text Touches Copper (Spacing)Reports text features (text, or lines/arc/pads tagged with attribute Copper Text) touching copper features.

Analysis Category <area>:text_touch_copper

Measurement Shape

Measurement Value

Measurement ID

Shape

Size

Text feature


Graphic

Purpose Copper marked as text on a layer should be isolated from conducting features to avoid shorts.

Function Reports text features (text, or lines/arc/pads tagged with attribute Copper Text) touching copper features. Does not report measurements involving features with attribute Copper Feature Ignore.

ERF Parameters


v_fab_drc_by_area

Limitations


Signal Layer ChecksSpacing Length (Spacing)

October 2016

Spacing Length (Spacing)Reports parallel lines closer than pp_spacing belonging to different layer nets.

Analysis Category <area>:spacing_length

Measurement Shape

Measurement Value

Measurement ID

Line

Distance

Circuit1; Circuit2


Graphic

Purpose This category provides a report on cumulative lengths of parallel spacing in a layer. The results can be used for forecasting yields and planning.

Function Reports parallel lines closer than pp_spacing belonging to different layer nets. Also measures the overlap of lines (line to line) greater than min_line_len (see figure below).

Measurements are lines representing the parallel spacing and overlap. Measurements are reported when both of the following conditions are

met:



ERF Variables spacing_length_measure = yes

spacing_resolution

min_line_len

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations In rare cases where one of the lines touches another feature in the layer, the action does not report the cumulative lengths of parallel spacing.

Signal Layer ChecksSame Net Spacing (Spacing)


Same Net Spacing (Spacing)Reports non-touching, non-text features closer than pp_spacing belonging to the same layer net.

Analysis Category <area>:self_spacing

Measurement Shape

Measurement Value

Measurement ID

Segment

Distance

None


Graphic

Purpose Spacing (p2p, p2c, c2c) is measured only between features of different layer nets. There is a need to find spacing violations between features of the same net when this spacing is small and can potentially cause slivers.

Function Reports non-touching, non-text features closer than pp_spacing belonging to the same layer net. Measurements are segments representing the distance. Does not report measurements involving features with attribute Copper Feature Ignore.

To retain compatibility with prior software versions, both this category and Same Net Spacing (Legacy) (Bottleneck) are reported together in the Results Viewer under ‘Same Net Spacing’.

‘Same Net Spacing’ (Spacing) reports violations between two features. There is only one violation reported for each pair.

Same Net Spacing (Bottleneck) reports violations between edges of a contour and a feature. It relates to every edge of a contourized surface. There can be many violations for a surface.


ERF Variables large_net_min

self_spacing = yes


v_fab_drc_map_layer

v_fab_drc_by_area


Signal Layer ChecksSame Net Spacing (Spacing)

October 2016

Limitations Due to performance considerations, nets considered drawn surfaces (that contain more features than specified in large_net_min) are not tested for ‘Same Net Spacing’ violations. Measurements are located arbitrarily between the contours of two parallel features. If the location happens to be over copper, that violation is not reported.

Signal Layer ChecksCAD Short (Spacing)


CAD Short (Spacing)Reports touching features that belong to different CAD nets.

Analysis Category <area>:cad_short

Measurement Shape

Measurement Value

Measurement ID

Point

Short

Feature1; Feature2


Graphic

Purpose To utilize the added intelligence of CAD nets to quickly locate shorts in the CAD data.

Function Reports touching features that belong to different CAD nets. Measurements are points representing a contact point. Select ‘Spacing’ in the Test list and check that layer data were input directly from a CAD database. Does not report measurements involving features with attribute Copper Feature Ignore.

ERF Parameters


v_fab_drc_by_area

Limitations


Signal Layer ChecksCAD Self Spacing (Spacing)

October 2016

CAD Self Spacing (Spacing)Reports non-touching features closer than pp_spacing belonging to the same CAD net.

Analysis Category <area>:cad_self_spacing

Measurement Shape

Measurement Value

Measurement ID

Segment

Distance

Feature1; Feature2


Graphic

Purpose There can be instances where close features are located in different layer nets but still belong to the same CAD net (e.g. two ground pads/planes connected through other layers). When the system ‘knows’ the CAD nets, it channels these spacing violations to this category instead of the p2p, p2c or c2c categories. This avoids creating false alarms since CAD Self Spacing violations are not normally an issue.

Function Reports non-touching features closer than pp_spacing belonging to the same CAD net. Measurements are segments representing the distance, if they only touch copper at their end-points. Does not report measurements involving features with attribute Copper Feature Ignore.




v_fab_drc_by_area

Limitations Layer data must be input directly from a CAD database.

Signal Layer ChecksNo Net Name Short (Spacing)


No Net Name Short (Spacing)Reports touching features: one with a CAD net name, the other with no net name.

Analysis Category <area>:no_net_name_short

Measurement Shape

Measurement ID

Connection point

Feature1; Feature2


Graphic

Purpose Features not connected to a CAD net and touching CAD nets can indicate a problem in design.

Function Reports touching features: one with a CAD net name, the other with no net name. Does not report measurements involving features with attribute Copper Feature Ignore.

ERF Parameters


v_fab_drc_by_area

Limitations


Signal Layer ChecksNPTH to Pad (Drill)

October 2016

NPTH to Pad (Drill)Reports other net NPTHs and pads closer than pp_d2c in accordance with group_drill_to_copper.

Analysis Category <area>:npth2p

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing

NPTH; Pad


Drill layer which pierces it

Graphic

Purpose When an NPTH is too close to a pad, drill machine inaccuracy may cause the NPTH to ‘bite’ the pad and damage it.

Function Reports other net NPTHs and pads closer than pp_d2c in accordance with group_drill_to_copper.

ERF Parameters pp_d2c

ERF Variables group_drill_to_copper

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksNPTH to Circuit (Drill)


NPTH to Circuit (Drill)Reports other net NPTHs and circuits closer than pp_d2c in accordance with group_drill_to_copper.

Analysis Category <area>:npth2c;teardrop

Measurement Shape

Measurement Value

Measurement ID

Segment

Spacing

NPTH; Circuit



Graphic

Purpose When an NPTH is too close to a circuit, drill machine inaccuracy may cause it to ‘bite’ the circuit and damage it.

Function Reports other net NPTHs and circuits closer than pp_d2c in accordance with group_drill_to_copper.



v_surface_spacing_separately


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations Copper text is considered as a circuit.


Signal Layer ChecksNPTH to Surface (Drill)

October 2016

NPTH to Surface (Drill)Reports other net NPTHs and surfaces closer that ERF parameter pp_d2c in accordance with ERF variable group_drill_to_copper.

Analysis Category <area>:npth2s

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing distance

NPTH; Surface


Drill layer that pierces the signal layer

Graphic

Purpose When an NPTH is too close to a surface, the inaccuracy of drill machinery might cause damage by biting into the surface.

Function Reports other net NPTHs and surfaces closer that ERF parameter pp_d2c in accordance with ERF variable group_drill_to_copper.



v_surface_spacing_separately = yes

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksPTH to Copper (Drill) - Signal Layer


PTH to Copper (Drill) - Signal LayerReports plated holes of different nets in the same layer closer than pp_d2c to any copper in accordance with ERF variable group_drill_to_copper.

Analysis Category <area>:pth2c;teardrop

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing

PTH; Feature



Graphic

Purpose To detect holes too close to other net copper.

Function Reports plated holes of different nets in the same layer closer than pp_d2c to any copper (circuit, pad or text) in accordance with group_drill_to_copper.



classify_via2c

v_split_pth2c_report


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Signal Layer ChecksPTH to Copper Same Net (Drill)

October 2016

PTH to Copper Same Net (Drill)Reports plated holes of the same net in the same layer closer than pp_d2c to any copper in accordance with group_drill_to_copper.

Analysis Category <area>:pth2c_same_net;teardrop

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing

PTH; Feature



Graphic

Purpose To detect holes too close to copper where there is no pad around the hole (on internal layers).

Function Reports plated holes of the same net in the same layer closer than pp_d2c to any copper (circuit, pad or text) in accordance with group_drill_to_copper.



classify_via2c

v_split_pth2c_report = yes


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksPTH Annular Ring (Drill) - Signal Layer


PTH Annular Ring (Drill) - Signal LayerReports the shortest distance between drill and laminate for PTHs (or vias) embedded in copper, for a specific drill size.

Analysis Category <area>:ar;<drill_size>

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Ring

PTH (or via); Feature (or r0)*



Graphic

Purpose When an annular ring around a plated through hole is too small, the hole may shift during drilling and cause insufficient plating later.


Signal Layer ChecksPTH Annular Ring (Drill) - Signal Layer

October 2016

Function Reports the shortest distance between drill and laminate for PTHs (or vias) embedded in copper, for a specific drill size, if closer than pp_d2c. The measurement takes into account both negative and positive data. Measurements are segments representing the shortest distance from drill to laminate. Breakouts are enabled by specifying a breakout angle.

Where PTH AR is composed of more than one feature (as in drawn surfaces), the measurement entity will be r0.

The classification of results by drill size is controlled by ERF variable v_ar_drill_size_list:

If v_ar_drill_size_list contains a list of drill size range classes, results are classified by these classes.

If v_ar_drill_size_list is empty, a category is generated for each drill size.

If v_ar_drill_size_list = none, results are not classified by drill size.

See “Annular Ring Measurement Topics” on page 23


ERF Variables pth_breakout_angle

via_breakout_angle

classify_pad_ar = no

v_ar_drill_size_list

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksPTH Registration (Drill)


PTH Registration (Drill)Reports the smallest center-to-center distance between drills and touching pads, if larger than reg_allowance and smaller than max_reg.

Analysis Category <area>:reg

Measurement Shape

Measurement Value

Measurement ID

Segment

Distance

Hole; Feature



Graphic

Purpose Typically, a hole should be in the middle of a pad. Any deviation may indicate inaccuracy in the input files or a CAD system error.

Function Reports the smallest center-to-center distance between drills and touching pads, if larger than reg_allowance and smaller than max_reg. Measurements are segments representing distance.

ERF Parameters

ERF Variables reg_allowance

max_reg

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations If the distance between the centers is larger than max_reg, then the features are considered offset on purpose and large registration errors may be missed. Vias drilled in SMD lands may be intentionally offset.


Signal Layer ChecksNPTH Registration (Drill)

October 2016

NPTH Registration (Drill)Reports the smallest center-to-center distance between drills and touching pads, if larger than reg_allowance and smaller than max_reg.

Analysis Category <area>:npth_reg

Measurement Shape

Measurement Value

Measurement ID

Segment

Distance

Hole; Feature



Graphic


Function Reports the smallest center-to-center distance between drills and touching pads, if larger than reg_allowance and smaller than max_reg. Measurements are segments representing distance.

ERF Parameters


max_reg

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations If the distance between the centers is larger than max_reg, then the features are considered offset on purpose and large registration errors may be missed. Vias drilled in SMD lands may be intentionally offset.

Signal Layer ChecksNPTH Annular Ring (Drill) - for Signal Layer


NPTH Annular Ring (Drill) - for Signal LayerReports the shortest distance between drill and laminate for NPTHs embedded in copper, for a specific drill size.

Analysis Category <area>:npth_ar;<drill_size>

Measurement Shape

Measurement Value

Measurement ID

Segment

Ring

NPTH; Feature (or r0)


Drill layer that pierces it

Graphic

Purpose

Function Reports the shortest distance between drill and laminate for NPTHs embedded in copper, for a specific drill size, if closer than pp_d2c. Measurements are segments representing distance between the NPTH and the nearest laminate.





See “Annular Ring Measurement Topics” on page 23.


ERF Variables limited_npth_check


v_fab_drc_map_layer

v_fab_drc_by_area


Signal Layer ChecksNPTH Annular Ring (Drill) - for Signal Layer

October 2016

Limitations If there is any copper in the NPTH, then a zero annular ring measurement is reported. This may be considered by some to be a false alarm.

Where NPTH AR is composed of more than one feature (such as in drawn surfaces), the measurement entity will be r0.

Signal Layer ChecksPTH (Comp) Annular Ring (Drill)


PTH (Comp) Annular Ring (Drill)Reports the shortest distance between drill and laminate for PTHs embedded in copper, for a specific drill size.

Analysis Category <area>:pth_ar;<drill_size>

Measurement Shape

Measurement Value

Measurement ID

Segment

Ring

PTH; Feature (or r0)


Graphic

Function Reports the shortest distance between drill and laminate for PTHs embedded in copper, for a specific drill size, if closer than pp_d2c. Takes into account both negative and positive data. Measurements are segments representing the shortest distance from drill to laminate.







ERF Variables pth_breakout_angle

classify_pad_ar = yes


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations Where PTH AR is composed of more than one feature (such as in drawn surfaces), the measurement entity will be r0.


Signal Layer ChecksPressfit (Comp) Annular Ring (Drill)

October 2016

Pressfit (Comp) Annular Ring (Drill)Reports the shortest distance between drill and laminate for pressfit drills embedded in copper, for a specified drill size.

Analysis Category <area>:pressfit_ar;<drill_size>

Measurement Shape

Measurement Value

Measurement ID

Segment

Ring

Pressfit hole


Graphic

Function Reports the shortest distance between drill and laminate for pressfit drills embedded in copper, for a specified drill size, if closer than pp_d2c. Takes into account both negative and positive data. Measurements are segments representing the shortest distance from drill to laminate.







ERF Variables v_ar_drill_size_list

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksVia Annular Ring (Drill) - for Signal Layer


Via Annular Ring (Drill) - for Signal LayerReports the shortest distance between drill and laminate for vias embedded in copper, for a specific drill size.

Analysis Category <area>:via_ar;<drill_size>

Measurement Shape

Measurement Value

Measurement ID

Segment

Ring

Via; Feature (or r0)


Graphic

Function Reports the shortest distance between drill and laminate for vias embedded in copper, for a specific drill size, if closer than pp_d2c. Takes into account both negative and positive data. Measurements are segments representing the shortest distance from drill to laminate.







ERF Variables via_breakout_angle



v_report_via_by_type

v_fab_drc_map_layer

v_fab_drc_by_area



Signal Layer ChecksBlind Via Annular Ring (Drill)

October 2016

Blind Via Annular Ring (Drill)Reports the shortest distance between drill and laminate for blind vias embedded in copper, for a specific drill size.

Analysis Category <area>:blind_via_ar;<drill_size>

Measurement Shape

Measurement Value

Measurement ID

Segment

Ring



Graphic

Function Reports the shortest distance between drill and laminate for blind vias embedded in copper, for a specific drill size, if closer than pp_d2c. Takes into account both negative and positive data. Measurements are segments representing the shortest distance from drill to laminate.










v_report_via_by_type = yes

v_fab_drc_map_layer

v_fab_drc_by_area


Signal Layer ChecksBuried Via Annular Ring (Drill)


Buried Via Annular Ring (Drill)Reports the shortest distance between drill and laminate for buried vias embedded in copper for a specific drill size.

Analysis Category <area>:buried_via_ar;<drill_size>

Measurement Shape

Measurement Value

Measurement ID

Segment

Ring



Graphic

Function Reports the shortest distance between drill and laminate for buried vias embedded in copper, for a specific drill size, if closer than pp_d2c. Takes into account both negative and positive data. Measurements are segments representing the shortest distance from drill to laminate.










v_report_via_by_type = yes

v_fab_drc_map_layer

v_fab_drc_by_area



Signal Layer ChecksVia to Copper (Drill)

October 2016

Via to Copper (Drill)Reports other net, via holes closer than pp_d2c to any copper in accordance with group_drill_to_copper.

Analysis Category <area>:via2c

Measurement Shape

Measurement Value

Measurement ID

Segment


Via; Feature



Graphic

Function Reports other net, via holes closer than pp_d2c to any copper (circuit, pad or text) in accordance with group_drill_to_copper.



classify_via2c = 1

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksMissing Pad for Via (Drill)


Missing Pad for Via (Drill)Reports via drills not fully covered by copper.

Analysis Category <area>:miss_via

Measurement Shape

Measurement Value

Measurement ID

Circle representing via

Symbol representing the via

None



Graphic

Function Reports via drills not fully covered by copper.

If ERF models from legacy products include the variable ignore_isolated_pad, it is mapped as described in “Signal Layer ERF Variables - Compatibility with Earlier Products” on page 127.

ERF Parameters

ERF Variables via_cover_by_pad

miss_pad_for_isolated_hole

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Signal Layer ChecksMissing Pad for PTH (Drill)

October 2016

Missing Pad for PTH (Drill)Reports PTH drills not fully covered by copper.

Analysis Category <area>:miss_pth

Measurement Shape

Measurement Value

Measurement ID

Circle

None

None



Graphic

Function Reports PTH drills not fully covered by copper.

Measurements are circles representing the PTH.


ERF Parameters

ERF Variables pth_cover_by_pad


v_fab_drc_by_area

v_fab_drc_map_layer

Signal Layer ChecksMissing Pad for PTH Slot (Drill)


Missing Pad for PTH Slot (Drill)Reports PTH drills not fully covered by copper.

Analysis Category <area>:miss_pth_slot

Measurement Shape

Measurement Value

Measurement ID

PTH slot (line)

PTH slot size

None



Graphic

Function Reports PTH drills not fully covered by copper.

Measurements are circles representing the PTH.


ERF Parameters

ERF Variables pth_cover_by_pad


v_fab_drc_by_area

v_fab_drc_map_layer


Signal Layer ChecksMissing Cu for Via (Drill)

October 2016

Missing Cu for Via (Drill)Reports via holes with attribute Vias Need CU not completely surrounded by copper in a drill layer.

Analysis Category <area>:miss_cu

Measurement Shape

Measurement Value

Measurement ID

Circle

Symbol representing the via

None



Graphic

Purpose To determine if a via drill hole is completely surrounded by copper in signal layers.

Function Reports via holes with attribute Vias Need CU not completely surrounded by copper in a drill layer. Measurements are circles representing the via.

ERF Parameters


v_fab_drc_by_area

Limitations

Signal Layer ChecksTooling Hole to Exposed Copper (Drill)


Tooling Hole to Exposed Copper (Drill)Reports all tooling holes closer than pp_d2c to exposed copper on an outer layer.

Analysis Category <area>:thole2exp_copper

Measurement Shape

Measurement Value

Measurement ID

Distance segment

Spacing

Hole; Feature


Drill layer

Correspondent solder mask layer (if exists)

Graphic

Function Reports all tooling holes closer than pp_d2c to exposed copper on an outer layer.

All copper shapes in the signal layer are considered “exposed” if a correspondent solder mask layer does not exist.



v_fab_drc_by_area

Limitations


Signal Layer ChecksNPTH Touches Copper (Drill)

October 2016

NPTH Touches Copper (Drill)Reports NPTH holes that touch non-pad features; or pads, if pad limits do not include hole center.

Analysis Category <area>:npthtc

Measurement Shape

Measurement Value

Measurement ID

Segment

Distance

NPTH; Copper Feature


Drill layer

Graphic

Function Reports NPTH holes that touch non-pad features; or pads, if pad limits do not include hole center. No reports are made if the NPTH is completely covered by a pad.

ERF Parameters


v_fab_drc_by_area

Limitations

Signal Layer ChecksMounting Pad to Adjacent Copper (Drill)


Mounting Pad to Adjacent Copper (Drill)Reports pads around a mounting hole on an outer signal layer that are too close to copper in the next (adjacent) layer.

Analysis Category mounting2adj

Measurement Shape

Measurement Value

Measurement ID

Distance segment

Spacing

Layers Displayed Outer signal layer

Adjacent layer (signal, mixed or Power and Ground)

Drill layer

Graphic

Purpose Mounting hole pad can be shorted by copper on an adjacent layer by the mounting screw tightened on the pad.

Function Reports pads around a mounting hole on an outer signal layer that are too close to copper in the next (adjacent) layer. The distance measurement does not take into consideration the layer dielectric thickness. If copper on an adjacent layer is under the mounting pad, it is reported as zero distance.


ERF Variables

Limitations


Signal Layer ChecksRout to Copper (Rout)

October 2016

Rout to Copper (Rout)Reports distances closer than pp_r2c between copper and rout features.

Analysis Category <area>:r2c;<layer_class>

Measurement Shape

Measurement Value

Measurement ID

Segment

Spacing

Rout; Feature


Rout layer

Graphic

Function Reports distances closer than pp_r2c between copper and rout features. When compensated rout measurement is required, specify pp_use_compensated_rout = yes. Does not report copper features with attribute Copper Feature Ignore.

Results are classified by layer attribute Layer Class. This enables you to define different ERF ranges for inner layers than for outer layers.

ERF Parameters pp_use_compensated_rout

pp_r2c

ERF Variables r2cpr_by_rtype = 0

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksV-cut Rout to Copper (Rout)


V-cut Rout to Copper (Rout)Reports distances closer than pp_r2c between copper and rout features bearing attribute Vcut Feature.

Analysis Category <area>:vcut2c;<layer_class>

Measurement Shape

Measurement Value

Measurement ID

Segment

Spacing

Rout; Feature


Rout layer

Graphic

Purpose The rout, which represents the edge of the board, must be isolated from copper features to avoid shorting.

Function Reports distances closer than pp_r2c between copper and rout features bearing attribute Vcut Feature. When compensated rout measurement is required, specify pp_use_compensated_rout = yes. Does not report copper features with attribute Copper Feature Ignore.



pp_r2c

ERF Variables r2cpr_by_rtype=1

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Signal Layer ChecksBreak Tab Rout to Copper (Rout)

October 2016

Break Tab Rout to Copper (Rout)Reports copper features too close to a break tab. Distance is measured from feature edge to break tab edge.

Analysis Category <area>:btab2c;<layer_class>

Measurement Shape

Measurement Value

Measurement ID

Segment

Spacing

Break tab; Feature


Rout layer

Graphic

Purpose To identify copper too close to break tabs.

Function Reports copper features closer than pp_r2c to a break tab. Distance is measured from feature edge to break tab edge. Does not report copper features with attribute Copper Feature Ignore.


A Break Tab is a row of at least three round or square holes of the same size with constant pitch located in the rout layer. These holes are used to make it easier to break off sections of the board after production. Break tab borders are determined by the neighboring rout feature and the break tab margin, as in the illustration.

The Break Tab must be parallel to the X or Y axis.

As of v9.1, two round or square holes in the rout layer, each bearing feature attribute Rout Break Point, are considered to be a break tab.

ERF Parameters pp_r2c

ERF Variables v_break_tab_margin

v_fab_drc_map_layer

v_fab_drc_by_area

Signal Layer ChecksBreak Tab Rout to Copper (Rout)


Limitations


Signal Layer ChecksRout to Trace (Rout)

October 2016

Rout to Trace (Rout)Reports distances closer than pp_r2c between an arc or line and rout features.

Analysis Category <area>:r2t;<layer_class>

Measurement Shape

Measurement Value

Measurement ID

Segment

Spacing

Rout; Feature


Rout layer

Graphic

Function Reports distances closer than pp_r2c between an arc or line and rout features. When compensated rout measurement is required, specify pp_use_compensated_rout = yes. Does not report lines and arcs with attribute Copper Feature Ignore.



pp_r2c


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksV-cut Rout to Trace (Rout)


V-cut Rout to Trace (Rout)Reports distances closer than pp_r2c between arcs and lines and rout features bearing attribute Vcut Feature.

Analysis Category <area>:vcut2t;<layer_class>

Measurement Shape

Measurement Value

Measurement ID

Segment

Spacing

Rout; Feature


Rout layer

Graphic

Purpose The rout, which represents the edge of the board, must be isolated from arcs and lines to avoid shorting.

Function Reports distances closer than pp_r2c between arcs and lines and rout features bearing attribute Vcut Feature. When compensated rout measurement is required, specify pp_use_compensated_rout = yes. Does not report arcs and lines with attribute Copper Feature Ignore.



pp_r2c


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Signal Layer ChecksBreak Tab Rout to Trace (Rout)

October 2016

Break Tab Rout to Trace (Rout)Reports arcs and lines too close to a break tab.

Analysis Category <area>:btab2t;<layer_class>

Measurement Shape

Measurement Value

Measurement ID

Segment

Spacing

Break tab; Feature


Rout layer

Graphic

Purpose To identify arcs and lines too close to break tabs.*

Function Reports arcs and lines closer than pp_r2c to a break tab. Distance is measured from feature edge to break tab edge. Does not report arcs and lines with attribute Copper Feature Ignore.


A Break Tab is a row of at least three round or square holes of the same size with constant pitch located in the rout layer. These holes are used to make it easier to break off sections of the board after production. Break tab borders are determined by the neighboring rout feature and the break tab margin, as in the illustration.

The Break Tab must be parallel to the X or Y axis.

As of v9.1, two round or square holes in the rout layer, each bearing feature attribute Rout Break Point, are considered to be a break tab.



v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksPads (Size)


Pads (Size)Reports a summary of all pads in a signal layer.

Analysis Category <area>:pad

Measurement Shape

Measurement Value

Measurement ID

Shape

Size

Feature


Graphic

Function Reports a summary of all pads in a signal layer. Measurements are pad shapes. (circle, square or contour)

A histogram depicts a range of pads sizes.

ERF Parameters


v_fab_drc_by_area

Limitations


Signal Layer ChecksLines (Size)

October 2016

Lines (Size)Reports width of lines representing conductor traces in signal layers.

Analysis Category <area>:line

Measurement Shape

Measurement Value

Measurement ID

Line

Size

Feature


Graphic

Function Reports width of lines representing conductor traces in signal layers. Lines with attribute Copper Balancing or Copper Text are not reported. If a line is drawn (represented by two touching lines running beside each other), the compound width of the drawn line is reported.

Lines are reported if both of these conditions apply:

• The line is narrower than max_line_width.• One of these conditions is met:

• The line is longer than min_line_len.• The length to width ratio is greater than len2width_ratio.

If a line is partially covered by another feature, only the uncovered part is measured.

ERF Parameters

ERF Variables min_line_len

max_line_width

len2width_ratio

report_lines_with_arcs = yes

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksShaved Lines (Size)


Shaved Lines (Size)Reports lines touched by negative shaves, NPTHs, or non-plated rout features.

Analysis Category <area>:shaved_line

Measurement Shape

Measurement Value

Measurement ID

Line

Symbol representing the line

None


Graphic

Function Reports lines touched by negative shaves, NPTHs, or non-plated rout features. Such lines may be potential conductor width violations. Measurements are the original lines.

ERF Parameters

ERF Variables report_lines_with_arcs = yes

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations These lines are displayed but not measured.


Signal Layer ChecksText (Size)

October 2016

Text (Size)Reports all lines tagged by the Copper Text system attribute.

Analysis Category <area>:text

Measurement Shape

Measurement Value

Measurement ID

Line

Width

Feature


Graphic

Function Reports all lines tagged by the Copper Text system attribute.

You can gauge the widths of lines used to draw text.

ERF Parameters


v_fab_drc_by_area

Limitations

Signal Layer ChecksText Fields (Size)


Text Fields (Size)Reports features of type text.

Analysis Category <area>:text_fld

Measurement Shape

Measurement Value

Measurement ID

Rectangle

Size

Feature


Graphic

Function Draws a rectangular measurement around each feature of type text to help define it. It does not inspect areas for AOI (for example, Mania).

ERF Parameters

ERF Variables text_fields = yes

v_fab_drc_map_layer - specifies the default DRC map layer name.

v_fab_drc_by_area

Limitations


Signal Layer ChecksLine Neckdown (Size)

October 2016

Line Neckdown (Size)Reports lines that are joined so that the width at the narrowest point is less than nominal line width.

Analysis Category <area>:neckdown

Measurement Shape

Measurement Value

Measurement ID

Segment

Size

Line


Graphic

Purpose A line neckdown can be a dangerous defect. The indentation of copper at the connection point may become an acid trap and cause over etching of the copper. This forms a nick and a potential cut.

Function Reports lines that are joined so that the width at the narrowest point is less than nominal line width. Measurements are segments representing the minimal line width.

ERF Parameters

ERF Variables max_line_width

v_fab_drc_map_layer

v_fab_drc_by_area

Signal Layer ChecksLine Neckdown (Size)


Known Limitations Neckdowns are not reported if the difference between the wider section and the narrower section is less than 0.5 mil.

Neckdowns are always reported, except when max_line_width is less than 1000my (default value is 12mil = 304.8my), if the difference is greater than 0.6mil. See Fig. A.

Differences between 0.5mil and 0.6mil are sometimes reported (0.1mil accuracy).

If the wider section is greater than max_line_width, the line is replaced by a virtual line of the same coordinates with width equal to max_line_width. The narrower part is reported if less than [max_line_width - 0.6mil]. See Fig.

B.


Signal Layer ChecksArcs (Size)

October 2016

Arcs (Size)Reports arc features thinner than max_line_width with neither Copper Text nor Copper Balancing attributes.

Analysis Category <area>:arc

Measurement Shape

Measurement Value

Measurement ID

Arcs

Size

None


Graphic

Function Reports arc features thinner than max_line_width with neither Copper Text nor Copper Balancing attributes. Measurements are arcs whose center sections do not touch other features.

ERF Parameters

ERF Variables max_line_width

report_lines_with_arcs = no

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksShaved Arcs (Size)


Shaved Arcs (Size)Reports arc features shaved by negative features, NPTHs or non-plated rout features.

Analysis Category <area>:shaved_arc

Measurement Shape

Measurement Value

Measurement ID

Bounding box

Symbol representing the arc

None


Graphic

Function Reports arc features shaved by negative features, NPTHs or non-plated rout features.

ERF Parameters

ERF Variables report_lines_with_arcs = no

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Signal Layer ChecksConductor Width (Size)

October 2016

Conductor Width (Size)Reports lines with neckdowns.

Analysis Category <area>:conductor_width

Measurement Shape

Measurement Value

Measurement ID

Segment representing width at thinnest point

Width

None


Graphic

Function Reports lines with neckdowns.

To retain compatibility with prior software versions, both this category and “Bottlenecks” on page 125 report their results to the same item in the Results Viewer: ‘Conductor Width’.

ERF Parameters

ERF Variables v_conductor_width_full_check

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksWide Trace Narrow Pad (Size)


Wide Trace Narrow Pad (Size)Reports cases where a trace is connected at one of its end points to a pad narrower than the trace at their point of connection.

Analysis Category <area>:wide_trace_narrow_pad

Measurement Shape

Measurement Value

Measurement ID

Segment at connection of trace and pad

Length of segment

Pad, trace


Graphic

Purpose A wide trace connected to a narrow pad might cause solder starvation on the pad or the lack of a correct fillet.

Function Reports cases where a trace is connected at one of its end points to a pad narrower than the trace at their point of connection.

ERF Parameters


v_fab_drc_by_area

Limitations If the end of the trace (including the amount by which the width of the trace extends beyond the end of the skeleton) extends beyond the pad, this is not considered an intersection, so it is not reported.


Signal Layer ChecksDisconnected Surfaces (Size)

October 2016

Disconnected Surfaces (Size)Reports small, isolated surfaces to warn about the presence of thin copper.

Analysis Category <area>:disconn_surf

Measurement Shape

Measurement Value

Measurement ID

Surface limits

Surface width (the smaller dimension)

Feature


Graphic

Purpose Small, isolated surfaces are usually areas of thin copper, and indicate a defect in the design.

Function Reports small, isolated surfaces to warn about the presence of thin copper.

ERF Parameters


v_fab_drc_by_area

Limitations

Signal Layer ChecksSlivers (Sliver)


Slivers (Sliver)Reports narrow slivers.

Analysis Category <area>:sliver

Measurement Shape

Measurement Value

Measurement ID

Segment

Size

Feature representing the sliver line


Graphic

Purpose A laminate sliver can cause material to detach during photo-imaging processes in fabrication. Floating pieces can cause defects and shorts which reduce yield.

Function Categories Silvers and Short Slivers report slivers, either between two copper areas (positive layer) or two clearance areas (negative layers). A violation is reported if silver width is less than pp_sliver, and non-zero. A sliver is defined by v_dist2sliver_ratio and v_min_sliver_perim. See Slivers and Short Slivers Categories.

ERF Parameters pp_sliver

ERF Variables v_sliver_algorithm_mode = 1

v_dist2sliver_ratio

v_min_sliver_perim

large_net_min

v_slivers_check_diff_net = yes

replace_crosshatch_by_surface

v_min_sliver_len

v_fab_drc_map_layer

v_fab_drc_by_area

Related Category Short Slivers (Sliver)


Signal Layer ChecksShort Slivers (Sliver)

October 2016

Short Slivers (Sliver)Reports narrow slivers.

Analysis Category <area>:short_sliver

Measurement Shape

Measurement Value

Measurement ID

Segment

Size

None


Graphic

Purpose A laminate sliver might cause material to detach during photo-imaging processes in fabrication. The floating piece can cause defects and shorts.

Function Categories Silvers and Short Slivers report slivers, either between two copper areas (positive layer) or two clearance areas (negative layers). A violation is reported if silver width is less than pp_sliver, and non-zero. See Slivers and Short Slivers Categories.



v_dist2sliver_ratio

v_min_sliver_perim

large_net_min

v_slivers_check_diff_net


v_min_sliver_len

v_fab_drc_map_layer

v_fab_drc_by_area

Related Category Slivers (Sliver)

Signal Layer ChecksStubs (Stubs)


Stubs (Stubs)Reports line endpoints that do not touch any other feature.

Analysis Category <area>:stub

Measurement Shape

Measurement Value

Measurement ID

Endpoint

Shape

Feature representing the open dimensions (r8)


Graphic

Purpose In some cases, stubs indicate an error in the design. Normally, lines end with pads, or are drilled by component holes or vias (wide ground conductors).

Function Reports line endpoints that do not touch any other feature. Measurements are shapes representing the endpoints (e.g. a circle for a round, capped line).

When two identical lines lie on top of each other, the endpoints touch each other. This is reported if the end points do not touch other features. Drilled line endpoints are not inserted as measurements.

ERF Parameters

ERF Variables v_stubs_check_both_ends

v_terminated_stub

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations • Features tagged with attribute Copper Balancing are not tested for ‘Stubs’ so as to improve performance.

• The endpoints of lines that are shaved (touching successive negative features) are not inserted as measurements.

• When two circuit lines coincide, a false alarm may be reported at the end of the wider line.


Signal Layer ChecksSurface Stubs (Stubs)

October 2016

Surface Stubs (Stubs)Reports long thin surface protrusions that are not connected to copper or a drill.

Analysis Category <area>:surface_stub

Measurement Shape

Measurement Value

Measurement ID

Bounding box of surface stub

Size of bounding box of surface stub

None


Graphic

Purpose A surface with protruding sections not connected to anything else might indicate a design mistake. During production there is the danger of their lowering product quality through electro-magnetic interference.

Function Reports surface protrusions that have a length greater than v_surface_stub_length and a width less than v_surface_stub_width, that are not connected to copper or a drill.

ERF Parameters

ERF Variables v_surface_stub_width

v_surface_stub_length

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations • This category works on positive layers and only on surface features. If the surface is drawn (filled), it is not tested.

• The test might take some time on complicated surfaces that are large or that have many edges, or both.

• Due to the complexity of calculating the stub length for a complex configuration of surface stubs, an estimated length of half of the perimeter of the stub is used in these cases.

Signal Layer ChecksUndrilled Area (Undrilled Area)


Undrilled Area (Undrilled Area)Reports circular areas exceeding a specified diameter where no drill holes are found on the layer.

Analysis Category undrilled_area

Measurement Shape

Measurement Value

Measurement ID

Circle describing the area

Diameter

Layers Displayed Drill layers

Graphic

Purpose In large areas lacking plated drills the foil can become detached from its underlying laminate.

Function Reports circular areas exceeding a specified diameter (determined by the ERF range for the category) where no drill holes are found on the layer. Circular areas touching or covering drill holes, but of smaller diameters are not considered violations.

ERF Parameters

ERF Variables

Limitations The Undrilled Area analysis employs a resolution minimum for performance reasons. Areas below 1mm (~0.039 inch) in diameter are ignored. This includes curved edges or small holes less than 1mm in width or diameter. A small, round area where there is no copper is ignored and the analysis reports the larger area around it as being undrilled.

As is the case with most false alarms, the area reported is slightly larger than the actual one, making it easily noticeable. You should visually inspect such reports to determine whether further actions are required.

The graphic illustrates this phenomenon.


Signal Layer ChecksSMD Pads (SMD)

October 2016

SMD Pads (SMD)Reports pads tagged with feature attribute SMD Pad.

Analysis Category <area>:smd_pad

Measurement Shape

Measurement Value

Measurement ID

Pad

Shape representing the pad

None


Graphic

Purpose Provides a review of all identified SMD pads used in the design. It can be used as a measure of the difficulty in producing the job.

Function Reports pads tagged with feature attribute SMD Pad. Measurements are shapes of SMD pads (circle, square or bounding box).

ERF Parameters


v_fab_drc_by_area

Limitations

Signal Layer ChecksSMD Pitch (SMD)


SMD Pitch (SMD)Reports first measurement of parallel, evenly spaced SMD pads for each row in the layer.

Analysis Category <area>:smd_pitch

Measurement Shape

Measurement Value

Measurement ID

For each such row, a segment representing its pitch - the typical center to center distance of adjacent pads.

Pitch

None


Graphic

Purpose Provides a review of pitch sizes used in rows of SMD pads. It can be used as a measure of the difficulty in producing the job.

Function Reports first measurement of parallel, evenly spaced SMD pads for each row in the layer.

ERF Parameters

ERF Variables max_smd

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations • Pads whose dimensions (width and height) differ by more than 5 mil are not considered as belonging to the same row. If the narrow dimension (width for horizontal rows) of two adjacent pads differs by more than 1 mil, they are not considered as belonging to the same row.

• Evenly spaced pads belonging to different discrete SMD components may be considered as belonging to the same row of one package.


Signal Layer ChecksSMD Packages (SMD)

October 2016

SMD Packages (SMD)Reports matching rows of SMD pads (as described in ‘SMD Pitch’) and tries to group them into packages.

Analysis Category <area>:smd_package

Measurement Shape

Measurement Value

Measurement ID

Bounding box

Package

None


Graphic

Purpose

Function Reports matching rows of SMD pads (as described in ‘SMD Pitch’) and tries to group them into packages. The packages can be composed of two or four rows representing a square (QFP). A bounding box, representing the package, is inserted as a measurement.

ERF Parameters


v_fab_drc_by_area

Limitations The packages found may not correspond to actual packages because pads of discrete components may be grouped together in a larger package. To ensure you have full component information, read in CAD data.

Signal Layer ChecksConductor Width (Bottleneck)


Conductor Width (Bottleneck)Reports distances between copper surfaces narrower than max_bottleneck_width.

Analysis Category <area>:conductor_width

Measurement Shape

Measurement Value

Measurement ID

Segment representing width at its thinnest point

Width

None


Graphic

Purpose To detect incorrect surface definition. Any feature touching the surface is also checked to avoid false alarms when the touching feature corrects the surface bottleneck.

Function Reports distances between copper surfaces narrower than max_bottleneck_width.

Both this category and “Conductor Width (Size)” on page 198 report their results to the same item in the Results Viewer: ‘Conductor Width’.

When v_bottleneck_algorithm_mode=1, only “Conductor Width (Size)” on page 198 is reported to ‘Conductor Width’ in the Results Viewer.


ERF Parameters

ERF Variables max_bottleneck_width

v_bottleneck_algorithm_mode = 0

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations Time consuming.


Signal Layer ChecksSame Net Spacing (Legacy) (Bottleneck)

October 2016

Same Net Spacing (Legacy) (Bottleneck)Reports violations within the same net between each of a contour’s edges and another feature closer than pp_spacing.

Analysis Category <area>:self_spacing_legacy

Measurement Shape

Measurement Value

Measurement ID

Distance segment

Distance

None


Graphic

Purpose Spacing (p2p, p2c, c2c) is measured only between features of different layer nets. There is a need to find spacing violations between features of the same net when small enough to cause slivers.

Function Reports violations within the same net between each of a contour’s edges and another feature closer than pp_spacing. Measurements are segments representing the distance.

To retain compatibility with prior software versions, both this category and “Same Net Spacing (Spacing)” on page 153 report their results to the same item in the Results Viewer: ‘Same Net Spacing’.

• Same Net Spacing (Spacing) — Reports violations between two features. One violation reported for a pair.

• Same Net Spacing (Legacy) (Bottleneck) — Reports violations between the edges of a contour (each and every edge) and another feature. The name of this category was changed in v.9.5 to further differentiate it from ‘Same Net Spacing’.



ERF Variables v_bottleneck_algorithm_mode = 0

self_spacing = yes

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksCopper Bottleneck (Bottleneck)


Copper Bottleneck (Bottleneck)Reports bottlenecks where the conductor is narrower than max_bottleneck_width.

Analysis Category <area>:copper_bottleneck

Measurement Shape

Measurement Value

Measurement ID

Segment

Width

Feature representing conductor width


Graphic

Purpose Bottlenecks can cause copper to break off during photo-imaging processes.

Function Reports bottlenecks where the conductor is narrower than max_bottleneck_width.

If v_bottleneck_trace_filter=1, a bottleneck equal to trace width, is only

reported if connected to a wider trace.


ERF Parameters


max_bottleneck_width

v_tail2bottleneck_ratio

v_min_bottleneck_tail

v_bottleneck_trace_filter

v_ignore_looping_back_bottleneck

v_fab_drc_map_layer

v_fab_drc_by_area

Related Category “Copper Bottleneck Within Lines (Bottleneck)” on page 212

Limitations Does not report for features of a bottleneck looping back through different layers.


Signal Layer ChecksCopper Bottleneck Within Lines (Bottleneck)

October 2016

Copper Bottleneck Within Lines (Bottleneck)Reports bottlenecks where the conductor is narrower than max_bottleneck_width.

Analysis Category <area>:bottleneck_within_lines

Measurement Shape

Measurement Value

Measurement ID

Segment

Width

Feature representing conductor width


Graphic

Purpose Bottlenecks can cause copper to break off during photo-imaging.

Function Reports bottlenecks where the conductor is narrower than max_bottleneck_width. If v_bottleneck_trace_filter = 1, a bottleneck equal to trace width is reported only if connected to a wider

trace.

This category is a companion category to Copper Bottleneck (Bottleneck). The results reported here depend upon these criteria:

• All report involve only traces, or traces and other features (results involving features other than lines are reported to “Copper Bottleneck (Bottleneck)” on page 211).

• The ERF model must have a realistic range (not empty).See “Bottlenecks” on page 125.

ERF Parameters







v_fab_drc_map_layer

v_fab_drc_by_area

Signal Layer ChecksCopper Bottleneck Within Lines (Bottleneck)


Limitations Does not report for features of a bottleneck looping back through different layers.


Signal Layer ChecksEtch Outside Keepin Area (Keepin/Keepout) - Signal Layer

October 2016

Etch Outside Keepin Area (Keepin/Keepout) - Signal Layer

Reports etches placed outside the rout keepin area boundaries.

Analysis Category <area>:etch_out_keepin_area

Measurement Shape

Measurement Value

Measurement ID

Bounding box

Shape

Feature


Associated document layer

Graphic

Function Reports etches (lines, arcs, vias, pads, and surfaces) placed outside the rout keepin area boundaries.

These areas are placed on the document layers whose names are defined in job attribute Rout Keepin Layer.

The areas have attribute Rout Keep In and either attribute DFx Area All Layers or attribute DFx Area Selected Layers by Bits (with a value that includes the layer being checked).


ERF Parameters


v_fab_drc_by_area

Limitations

See Also “Keepin and Keepout Areas” on page 26

For a description of how to use attribute DFx Area Selected Layers by Bits, and other attributes, see Valor NPI System Management User Guide.

Signal Layer ChecksEtch Within Keepout Area (Keepin/Keepout)


Etch Within Keepout Area (Keepin/Keepout)Reports etches within keepout area boundaries.

Analysis Category <area>:etch_in_keepout_area

Measurement Shape

Measurement Value

Measurement ID

Bounding box

Shape

Feature



Graphic

Function Reports etches (lines, arcs, vias, pads, and surfaces) within keepout area boundaries.

These areas are placed on the document layers whose names are defined in job attribute Rout Keepout Layer.

The areas have attribute Rout Keep Out and either attribute DFx Area All Layers or attribute DFx Area Selected Layers by Bits (with a value that includes the layer being checked).


ERF Parameters

ERF Variables classify_etch_keepout = 0

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


For a description of how to use attribute DFx Area Selected Layers by Bits, and other attributes, see Valor NPI System Management User Guide.


Signal Layer ChecksTrace Within Keepout Area (Keepin/Keepout)

October 2016

Trace Within Keepout Area (Keepin/Keepout)Reports lines and arcs within Keepout area boundaries.

Analysis Category <area>:trace_in_keepout_area

Measurement Shape

Measurement Value

Measurement ID

Bounding box

Shape

Feature



Graphic

Function Reports lines and arcs within ‘Keepout’ area boundaries.

These areas are placed on document layers whose names are defined in job attribute “Trace Keepout Layer”. The areas have attribute Trace Keep Out and either attribute ERF Area All Layers or attribute ERF Area Selected Layers by Bits (with the value appropriate to the layer being checked).


ERF Parameters

ERF Variables classify_etch_keepout = 1

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

See Also “Keepin and Keepout Areas” on page 26.

Signal Layer ChecksVia Within Keepout Area (Keepin/Keepout)


Via Within Keepout Area (Keepin/Keepout)Reports vias within Keepout area boundaries.

Analysis Category <area>:via_in_keepout_area

Measurement Shape

Measurement Value

Measurement ID

Bounding box

Shape

Feature



Graphic

Function Reports vias within ‘Keepout’ area boundaries.

These areas are placed on the document layers whose names are defined in job attribute “Via Keepout Layer”. The areas have attribute Via Keep Out and either attribute ERF Area All Layers or attribute ERF Area Selected Layers by Bits (with the value appropriate to the layer being checked).


ERF Parameters

ERF Variables classify_etch_keepout=1

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations



Signal Layer ChecksPlane Within Keepout Area (Keepin/Keepout)

October 2016

Plane Within Keepout Area (Keepin/Keepout)Reports surfaces within Keepout area boundaries.

Analysis Category <area>:plane_in_keepout_area

Measurement Shape

Measurement Value

Measurement ID

Bounding box

Shape

Feature



Graphic

Function Reports surfaces within ‘Keepout’ area boundaries.

These areas are placed on the document layers whose names are defined in job attribute “Plane Keepout Layer”. The areas have attribute Plane Keep Out and either attribute ERF Area All Layers or attribute ERF Area Selected Layers by Bits (with the value appropriate to the layer being checked).


ERF Parameters


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Signal Layer ChecksPad Within Keepout Area (Keepin/Keepout)


Pad Within Keepout Area (Keepin/Keepout)Reports pads within Keepout area boundaries.

Analysis Category <area>:pad_in_keepout_area

Measurement Shape

Measurement Value

Measurement ID

Bounding box

Shape

Feature



Graphic

Function Reports pads within ‘Keepout’ area boundaries.

These areas are placed on the document layers whose names are defined in job attribute “Pad Keepout Layer”. The areas have attribute Pad Keep Out and either attribute ERF Area All Layers or attribute ERF Area Selected Layers by Bits (with the value appropriate to the layer being checked).


ERF Parameters


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations



Signal Layer ChecksExposed Via to Exposed Via (Exposure)

October 2016

Exposed Via to Exposed Via (Exposure)Reports the distances less than pp_e_spacing between the edges of the exposed copper of two uncapped vias. Classified by process.

Analysis Category <area>:exvia2exvia

Measurement Shape

Measurement ID

Segment

Vias

Layers Displayed Top/Bottom signal

Solder mask layers

Graphic

Purpose Vias (pads) should be kept distant from each other to prevent solder bridging during the assembly process.

Function Reports the distances less than pp_e_spacing between the edges of the exposed copper of two uncapped vias. Classified by process.

ERF Parameters pp_e_spacing

ERF Variables v_tp_exvia_as_via

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksExposed Via to Exposed Copper (Exposure)


Exposed Via to Exposed Copper (Exposure)Reports the distance between the edge of the exposed copper of an uncapped via and the exposed copper on the outer signal layers only, when closer than pp_e_spacing.

Analysis Category <area>:exvia2exc

Measurement Shape

Measurement ID

Segment

Via and copper surface

Layers Displayed Top/Bottom signal

Solder mask layers

Graphic

Function Reports the distance between the edge of the exposed copper of an uncapped via and the exposed copper on the outer signal layers only, when closer than pp_e_spacing. The reported exposed via and exposed copper surface do not touch. Classified by process.



v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Signal Layer ChecksExposed to Exposed (Exposure)

October 2016

Exposed to Exposed (Exposure)Reports close circuit elements in the same layer.

Analysis Category <area>:ex2ex

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing

Pad1; Pad2


Solder mask layer

Graphic

Purpose Circuit elements which are too close may bridge during imaging, etching, plating or soldering, and result in a direct short.

Function Reports circuit elements closer than pp_e_spacing in the same layer. Both are exposed (not covered by solder mask) in the matching solder mask layer. Measurements are spacing segments, provided the segment only touches copper at its end points. The check is run on outer layers only.

For partially covered features, two measurements are generated; one for the exposed part, one for the covered part.

Exact match of feature with SM clearance is considered exposed.



exposure_group_area

v_exposure_by_is_capped

v_exposure_report_same_net

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksCovered to Covered (Exposure)


Covered to Covered (Exposure)Reports circuit elements closer than pp_e_spacing in the same layer.

Analysis Category <area>:cov2cov

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing

Pad1; Pad2


Solder mask layer

Graphic


Function Reports circuit elements closer than pp_e_spacing in the same layer. Both elements are covered in the matching solder mask layer. Measurements are spacing segments, provided the segment only touches copper at its end points. The check is run on outer layers only.


A covered via is considered covered copper and reported in this category.

Exact match of feature with SM clearance is considered exposed.



exposure_group_area



v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Signal Layer ChecksExposed to Covered (Exposure)

October 2016

Exposed to Covered (Exposure)Reports circuit elements closer than pp_e_spacing in the same layer, one exposed and one covered in the matching solder mask layer.

Analysis Category <area>:ex2cov

Measurement Shape

Measurement Value

Measurement ID

Spacing segment

Spacing

Pad1; Pad2


Graphic


Function Reports circuit elements closer than pp_e_spacing in the same layer, one exposed and one covered in the matching solder mask layer. Measurements are spacing segments, provided the segment only touches copper at its end points. The check is run on outer layers only.


A covered via is considered covered copper and reported in this category.

Measurement from exposed vias to covered copper are reported in this category.



exposure_group_area



v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Signal Layer ChecksNet Loop (Nets)


Net Loop (Nets)Reports net loops on each layer.

Analysis Category net_loop

Measurement Shape

Measurement Value

Measurement ID

Bounding box of the loop

Size of the bounding box

Net name (taken from one feature of the net loop)


Graphic

Purpose Loops in a signal net could indicate a mistake in design.

Function Checks each layer net for loops. This category is meant to check simple nets with pads connected by traces. It does not work on nets containing a large or drawn surface.

ERF Parameters


Limitations


Signal Layer ChecksLarge Net

October 2016

Large NetReports nets with more than the number of features specified by large_net_min.

Analysis Category large_net

Measurement Shape

Measurement Value

Measurement ID

One feature on the net

Number of features on the net

Net name


Graphic

Purpose Nets with more than the number of features specified by large_net_min are ignored by the Sliver/Short Sliver test and Spacing test to avoid long running time on drawn surfaces. This category gives an indication of the nets that were not checked.

Function Reports nets with more than the number of features specified by large_net_min.

ERF Parameters


self_spacing = yes

Related Category

Signal Layer ChecksNon-Referenced Signal (Adjacent) (Signal Reference)


Non-Referenced Signal (Adjacent) (Signal Reference)

Reports signal traces belonging to critical nets at the point where they meet an opening in the plane of an adjacent P&G layer.

Analysis Category nonref_sig_adj;<net_type>

Measurement Shape

Value

IDs

Point from which the non-referenced signal trace begins

Distance (always 0)

Net name

Layers Displayed Signal/mixed layer

Adjacent P&G layer

Graphic

Purpose An opening in the P&G layer influences the current return path and causes EMI effects.

Function Reports signal traces belonging to nets with net attribute SQA Critical Net at the point where they meet an opening in the plane of an adjacent P&G layer. See “Adjacent/Next Layer” on page 542.

ERF Parameters

ERF Variables

Limitations


Signal Layer ChecksNon-Referenced Signal Area (Adjacent) (Signal Reference)

October 2016

Non-Referenced Signal Area (Adjacent) (Signal Reference)

Calculates the area of a critical net with net attribute SQA Critical Net over an opening in the adjacent P&G plane.

Analysis Category nonref_sig_area_adj;<net_type>

Measurement Shape

Value

IDs

Limits of the non-referenced signal area

Area

Net name


Adjacent P&G layer

Graphic


Function Calculates the area of a critical net with net attribute SQA Critical Net over an opening in the adjacent P&G plane. See “Adjacent/Next Layer” on page 542.

ERF Parameters

ERF Variables

Limitations

Signal Layer ChecksNon-Referenced Signal Length (Adjacent) (Signal Reference)


Non-Referenced Signal Length (Adjacent) (Signal Reference)

Reports the length of a non-referenced portion under the signal trace belonging to a net with net attribute SQA Critical Net.

Analysis Category nonref_sig_len_adj;<net_type>

Measurement Shape

Value

IDs

Limits of the non-referenced signal portion

Length

Net name


Adjacent P&G layer

Graphic


Function Reports the length of a non-referenced portion under the signal trace belonging to a net with net attribute SQA Critical Net. See “Adjacent/Next Layer” on page 542.

ERF Parameters

ERF Variables

Limitations


Signal Layer ChecksNon-Referenced Signal Width (%) (Adjacent) (Signal Reference)

October 2016

Non-Referenced Signal Width (%) (Adjacent) (Signal Reference)

Reports the width of a non-referenced signal area in an adjacent layer under a net with attribute SQA Critical Net.

Analysis Category nonref_sig_width_p_adj;<net_type>

Measurement Shape

Value

IDs


Percentage

Net name


Adjacent P&G layer

Graphic

Purpose To identify partially non-referenced signals as distinguished from totally non-referenced signals. An opening in the P&G layer influences the current return path and causes EMI effects.

Function Reports the width of a non-referenced signal area in an adjacent layer under a net with net attribute SQA Critical Net. Expressed in percentage of signal trace width. See “Adjacent/Next Layer” on

page 542.

ERF Parameters

ERF Variables

Limitations

Signal Layer ChecksNon-Referenced Signal (Next) (Signal Reference)


Non-Referenced Signal (Next) (Signal Reference)Reports signal traces which belong to nets with attribute SQA Critical Net, at the point where they meet an opening in the plane of the next P&G layer.

Analysis Category nonref_sig_next;<net_type>

Measurement Shape

Value

IDs

Point from which the non-referenced signal trace begins

Distance (always 0)

Net name


Next P&G layer

Graphic


Function Reports signal traces which belong to nets with net attribute SQA Critical Net at the point where they meet an opening in the plane of the next P&G layer. See “Adjacent/Next Layer” on page 542.

ERF Parameters

ERF Variables

Limitations


Signal Layer ChecksNon-Referenced Signal Area (Next) (Signal Reference)

October 2016

Non-Referenced Signal Area (Next) (Signal Reference)

Calculates the area of a critical net with net attribute critical_net over an opening in the next P&G plane.

Analysis Category nonref_sig_area_next;<net_type>

Measurement Shape

Value

IDs


Area

Net name


Next P&G layer

Graphic


Function Calculates the area of a critical net with net attribute critical_net over an opening in the next P&G plane. See “Adjacent/Next Layer” on page 542.

ERF Parameters

ERF Variables

Limitations

Signal Layer ChecksNon-Referenced Signal Length (Next) (Signal Reference)


Non-Referenced Signal Length (Next) (Signal Reference)

Reports the length of a non-referenced portion under the signal trace belonging to a net with attribute SQA Critical Net.

Analysis Category nonref_sig_len_next;<net_type>

Measurement Shape

Value

IDs

Limits of the non-referenced signal portion

Length

Net name


Next P&G layer

Graphic


Function This is activated on nets with a SQA Critical Net net attribute.

Reports the length of a non-referenced portion under the signal trace belonging to a net with net attribute SQA Critical Net. See “Adjacent/Next Layer” on page 542.

ERF Parameters

ERF Variables

Limitations


Signal Layer ChecksNon-Referenced Signal Width (%) (Next) (Signal Reference)

October 2016

Non-Referenced Signal Width (%) (Next) (Signal Reference)

Reports the width of a non-referenced signal area in the next layer under a net with attribute SQA Critical Net.

Analysis Category nonref_sig_width_p_next;<net_type>

Measurement Shape

Value

IDs


Percentage

Net name


Next P&G layer

Graphic

Purpose To identify partially non-referenced signals as distinguished from totally non-referenced signals. An opening in the P&G layer influences the current return path and causes EMI effects.

Function Reports the width of a non-referenced signal area in the next layer under a net with net attribute SQA Critical Net. Expressed in percentage of signal trace

width.

See “Adjacent/Next Layer” on page 542.

ERF Parameters

ERF Variables

Limitations

Signal Layer ChecksSpecial Reports for Signal Layer Checks


Special Reports for Signal Layer ChecksIn addition to a textual listing of all the categories, and histograms for all layers, this analysis creates a parallel spacing summary and a line length summary.

Parallel Spacing Summary

This report lists the total length of spacing between parallel lines, for every spacing width in the design (in user-definable width increments). This report is useful in planning and forecasting yields.

Line Length Summary

This report lists the total length of all lines of the same width for every line width in the design (in user-definable width increments).

# Spacing (ml) Total Length (“)

1 6.0 - 6.2 16.732

2 8.4 - 8.6 55.740

3 10.0 - 10.2 10.622

4 13.4 - 13.6 12.194

# Line width (ml) Total Length (“)

1 8.0 - 8.2 27.367

2 8.8 - 9.0 7.067

3 9.8 - 10.0 0.068

4 10.0 - 10.2 6.456

5 11.8 - 12.0 0.058

6 12.0 - 12.2 8.174


Signal Layer ChecksResults Attributes for Signal Layer Checks

October 2016

Results Attributes for Signal Layer ChecksResult attributes are assigned when the analysis is run. The values of the attributes can be retrieved afterwards.

Table 3-8. Signal Layer Checks Results Attributes


...typ_par_space Typical parallel spacing value over all parallel spacing measurements

...min_p2p Minimum spacing between any two pads that belong to different nets

...typ_p2p Typical pad to pad spacing

...min_p2c Minimum spacing between any different net pad and conductor

...typ_p2c Typical spacing between any different net pad and conductor

...min_c2c Minimum spacing between any different net conductors

...typ_c2c Typical spacing between any different net conductors

...min_self_spacing Minimal spacing between two non-touching same net features (minimum sliver width)

...typ_self_spacing Typical spacing between two non-touching same net features

...min_text2text Minimum spacing between any two text features

...typ_text2text Typical spacing between any two text features

...dra_npth2p The DRA of the NPTH to Pad category

...min_npth2p Minimum distance from an NPTH to a pad that does not touch it

...typ_npth2p Typical distance from an NPTH to a pad that does not touch it

...dra_npth2c The DRA for the NPTH to Pad category

...min_npth2c Minimum distance from an NPTH to a non pad that does not touch it

...typ_npth2c Typical distance from an NPTH to a non pad that does not touch it

...dra_pth2c The DRA for the PTH to Copper category

...min_pth2c Minimal measurement in the PTH to Copper category

...typ_pth2c Typical measurement in the PTH to Copper category

...dra_via2c The DRA for the Via to Copper category

...min_via2c Minimal measurement in the Via to Copper category

...typ_via2c Typical measurement in the Via to Copper category



...dra_ar DRA for annular ring

...min_ar Minimal annular ring measurement

...typ_ar Typical annular ring measurement

...dra_pth_ar The DRA for PTH annular ring

...min_pth_ar Minimal PTH annular ring measurement value

...typ_pth_ar Typical PTH annular ring measurement value

...dra_pressfit_ar The DRA for pressfit annular ring

...min_pressfit_ar Minimal pressfit annular ring measurement value

...typ_pressfit_ar Typical pressfit annular ring measurement value

...dra_via_ar DRA for via annular ring

...min_via_ar Minimal via annular ring measurement value

...typ_via_ar Typical via annular ring measurement value

...min_reg Minimal PTH Registration measurement value

...typ_reg Typical PTH Registration measurement value

...dra_npth_ar DRA for NPTH annular ring

...min_npth_ar Minimal NPTH annular ring measurement value

...typ_npth_ar Typical NPTH annular ring measurement value

...min_npth_reg Minimal NPTH Registration measurement value

...typ_npth_reg Typical NPTH Registration measurement value

...min_r2c Minimal Rout to Copper distance

...typ_r2c Typical Rout to Copper distance

...min_pad Minimal pad diameter

...typ_pad Typical pad diameter

...min_line Minimal line width

...typ_line Typical line width

...min_shaved_line Minimal (original) width of a shaved line

...typ_shaved_line Typical (original) width of a shaved line

...min_sliver Minimal sliver width

...typ_sliver Typical sliver width

...num_stub Number of stubs alarms

Table 3-8. Signal Layer Checks Results Attributes (cont.)




October 2016

...typ_stub Typical stub width

...min_smd_pad Minimal SMD pad size

...num_smd_pad Number of SMD pads

...typ_smd_pad Typical SMD pad size

...min_smd_pitch Minimal SMD pitch (distance between adjacent pad centers)

...typ_smd_pitch Typical SMD pitch

...min_smd_package Small dimension of the smallest SMD package

...typ_smd_package Typical small dimension of the SMD packages

...min_conductor_width Minimal value of conductor width measurements

...typ_conductor_width Typical value of conductor width measurements

...min_arc Minimal width of arcs

...typ_arc Typical width of arcs

...min_shaved_arc Minimal (original) width of shaved arcs

...typ_shaved_arc Typical (original) width of shaved arcs

...num_miss_via Number of Missing Pad for PTH alarms

...num_miss_pth Number of Missing Pad for Via alarms

...dra Overall DRA of a board is the minimum of all DRAs for categories for which a DRA is defined: dra_npth2p, dra_npth2c, dra_pth2c, dra_via2c, dra_ar, dra_pth_ar, dra_via_ar

...num_etch_out_keepin_area

Number of features outside Keepin areas.

...num_etch_in_keepout_area

Number of features within Keepout areas

...num_trace_in_keepout_area

Number of traces within Keepout areas

...num_pad_in_keepout_area

Number of pads within Keepout areas

...num_via_in_keepout_area

Number of vias within Keepout areas

...num_plane_in_keepout_area

Number of planes within Keepout areas

...num_exvia2exvia Number of exposed-via-to-exposed-via spacing alarms





...min_exvia2exvia Minimal exposed-via-to-exposed-via spacing

...typ_exvia2exvia Typical exposed-via-to-exposed-via spacing alarms

...num_exvia2exc Number of exposed-via-to-exposed-copper spacing alarms

...min_exvia2exc Minimal exposed-via-to-exposed-copper spacing

...typ_exvia2exc Typical exposed-via-to-exposed-copper spacing

...num_ex2ex Number of exposed-copper-to-exposed-copper spacing alarms

...min_ex2ex Minimal exposed-copper-to-exposed-copper spacing

...typ_ex2ex Typical exposed-copper-to-exposed-copper spacing

...num_ex2cov Number of exposed-copper-to-covered-copper spacing alarms

...min_ex2cov Minimal exposed-copper-to-covered-copper spacing

...typ_ex2cov Typical exposed-copper-to-covered-copper spacing

...num_cov2cov Number of covered-copper-to-covered-copper spacing alarms

...min_cov2cov Minimal covered-copper-to-covered-copper spacing

...typ_cov2cov Typical covered-copper-to-covered-copper spacing




Signal Layer ChecksERF Parameters for Signal Layer Checks

October 2016

ERF Parameters for Signal Layer ChecksERF parameters, set in the ERF model or when the analysis is run, control the analysis.

Table 3-9. Signal Layer Checks ERF Parameters


Layer pp_layer The layer to be affected by the action according to the rules defined as described in “Valor NPI Checklist Operations User Guide”.

All categories

Spacing pp_spacing Search radius to use when looking for closely spaced features.

SMD to SMD

Via to Via

TH to TH

SMD to Via

SMD to TH

Via to TH

Pad to Pad

Pad to Circuit

Circuit to Circuit

Text to Text

Spacing Length

CAD Self Spacing

Same Net Spacing



Drill to Cu pp_d2c The search radius for copper features too close to drills, and also determines the maximum annular ring value to be reported.

NPTH to Pad

NPTH to Circuit

PTH to Copper

PTH Annular Ring

NPTH Annular ring

PTH (Comp) Annular Ring

Via Annular Ring

Via to Copper

Tooling Hole to Exposed Copper

Rout to Cu pp_r2c The search radius for copper features too close to rout skeleton.

Rout to Copper

Sliver Min pp_sliver Minimum allowed sliver width. Measurements smaller than this are reported in the sliver category.

Sliver, Short Sliver

Exposure Spacing pp_e_spacing Minimum allowed spacing between exposed copper features.

Exposed Via to Exposed Via

Exposed Via to Exposed Copper

Exposed to Exposed

Covered to Covered

Exposed to Covered

Tests List pp_tests Tests to be run. See “Tests Performed in Signal Layer Checks” on page 124.

All categories

Table 3-9. Signal Layer Checks ERF Parameters (cont.)




October 2016

Check Missing Pads for Drills

pp_check_missing_pads_for_drills

yes - reports missing via and PTH pads to their respective categories. (default)

no - does not report any measurements to ‘Missing Pad for Via’ or ‘Missing Pad for PTH’.

Missing Pad for Via

Missing Pad for PTH

Compensated Rout

pp_use_compensated_rout

no - measures to rout skeleton. (default)

yes - enables measurement to internal cutout of compensated rout feature. If compensation does not exist, measure to edge of rout. See “Compensated Rout” on page 126.

Rout to Copper

Table 3-9. Signal Layer Checks ERF Parameters (cont.)


Signal Layer ChecksERF Variables for Signal Layer Checks


ERF Variables for Signal Layer ChecksERF variables set in the ERF model control the analysis. ERF variable values are limited to 255 characters.

Table 3-10. Signal Layer Checks ERF Variables


classify_etch_keepout

0 — Etchings found inside the area with attribute Rout Keep Out are placed in the “Etch Within Keepout Area” category. (default)

1 — Etchings are inserted into a category according to their type (Trace/Pad/Via/Plane Within Keepout Area category)

Etch Within Keepout Area

Trace Within Keepout Area

Via Within Keepout Area

Plane Within Keepout Area

Pad Within Keepout Area

classify_pad_ar Controls how via and PTH measurements are reported.

yes — Classify AR measurement according to via/PTH in ‘Via Annular Ring’ or ‘PTH (Comp) Annular Ring’. (default)

no — Report all via/PTH measurements in ‘PTH Annular Ring’.

PTH Annular Ring


Via Annular Ring

Blind Via Annular Ring

Buried Via Annular Ring

classify_pad2pad no — All measurements reported to ‘Pad to Pad’ category. (default)

yes — Distributes measurements to these categories, depending on pad type:

• Toeprint to Toeprint - when both pads belong to the same component with attribute Required Toeprint Spacing.

• SMD to SMD — When both pads are SMD pads.

• Via to Via — When both pads are pierced by a via drill.

• PTH to PTH — When both pads are pierced by a non-via drill.

• Pad to Pad — All other pads.

Toeprint to Toeprint

SMD to SMD

Via to Via

TH to TH

SMD to Via

SMD to TH

Via to TH

Pad to Pad



October 2016

classify_via2c 0 — Do not distinguish between via and PTH measurements to copper. Report both in ‘PTH to Copper’. (default)

1 — Distinguish between via and PTH holes. Report measurements in ‘Via to Copper’ or ‘PTH to Copper’.

PTH to Copper

PTH to Copper Same Net

Via to Copper

exposure_group_area

Controls whether to limit the reporting of spacing violations between exposed copper features to one report for each set of nets within a defined area or to report all violations on the board. If exposure_group_area=100 mil, the board is divided into squares of 100x100 mil. Only one violation for a set of nets is reported for each square.

0 — report all violations. (default)

<positive value> - report only one violation between the same two nets in a square area defined by this value.

Exposed to Exposed

Covered to Covered

Exposed to Covered

group_drill_to_copper

Controls whether to report only the closest violation or all violations.

1 — For each drill (NPTH, PTH, or via) only the closest spacing violation is reported to its respective category. If there are both pad and circuit spacing violates with NPTHs, only the closest is reported in its respective category (either ‘NPTH to Pad’ or ‘NPTH to Circuit’). The category of the other violation does not appear. (default)

0 — All spacing violations are reported, each to its respective category.

NPTH to Pad

NPTH to Circuit

PTH to Copper


Via to Copper

NPTH to Surface

large_net_min Nets with more than large_net_min features are ignored in ‘Same Net Spacing’, ‘Sliver’ and ‘Short Sliver’ categories.

Same Net Spacing

Slivers

Short Slivers

Large Net

Net Loop

len2width_ratio Minimum ratio of length to width of a line to be inserted in the ‘Lines’ category.

Lines

Table 3-10. Signal Layer Checks ERF Variables (cont.)




limited_npth_check Controls whether NPTH annular ring values larger than pp_d2c are reported.

yes — Only distances less than pp_d2c are reported. (default)

no — All values reported.

NPTH Annular Ring


Maximum bottleneck width for ‘Conductor Width’ and ‘Copper Bottleneck’.

Conductor Width

Copper Bottleneck

Copper Bottleneck Within Lines

max_line_width Maximum line width in ‘Lines’ category. Lines

Line Neckdown

Arcs

max_reg Maximum offset to be considered a registration error. A center to center distance of a drill and pad larger than this value, is not reported.

PTH Registration

NPTH Registration

max_smd Maximum pitch in SMD rows. SMD Pitch

min_line_len Minimum line length in ‘Lines’ category. Also the minimum overlap between lines to report in parallel spacing.

Spacing Length

Lines


Controls which missing pads are reported.

1 — Reports all missing pads for via and PTH drills. (default)

0 — Reports missing pads on inner layers only where the drill connects to a line.

To maintain compatibility with earlier products, this variable must be mapped. See “Signal Layer ERF Variables - Compatibility with Earlier Products” on page 127.

Missing Pad for Via

Missing Pad for PTH

Missing Pad for PTH Slot

pth_breakout_angle Maximum angle for breakout of drill from PTH pad.


PTH Annular Ring






October 2016

pth_cover_by_pad Controls what is considered a pad for a PTH drill.

yes — Report PTHs not fully covered by a pad (default).

no — Report PTHs not fully covered by copper.

Missing Pad for PTH Drill

Missing Pad for PTH Slot

r2cpr_by_rtype Controls how to report distances between copper and rout features.

0 — Results only reported to ‘Rout to Copper’ or ‘Rout to Trace’ category. (default)

1 — Results reported to ‘V-cut Rout to Copper’ or ‘V-cut Rout to Trace’ category if rout is assigned attribute .vcut.

Rout to Copper

V-cut Rout to Copper

Rout to Trace

V-cut Rout to Trace

reg_allowance A distance between pad center and drill center greater than this value is considered misregistered.

PTH Registration

NPTH Registration


Controls how slivers are reported.

yes — Do not report slivers found on hatched area. (default) (Gerber)

no — Report slivers found on hatched area.

by attr — Do not report slivers found on features with a hatch attribute. (EDA)

Slivers

Short Slivers

report_lines_with_arcs

Controls how lines with arcs are reported.

yes — Arc sizes are reported to ‘Lines’ or ‘Shaved Lines’. (default)

no — Arc sizes are reported in ‘Arcs’ or ‘Shaved Arcs’.

Lines

Shaved Lines

Arcs

Shaved Arcs

rm_ar Reliability margin for annular ring measurements. Determines the calculation of the DRA attributes.


Annular ring categories

rm_d2c Reliability margin for all drill to copper measurements other than annular ring. Used in the calculation of the DRA attributes.

Affects the reporting of result attributes for drill categories





self_spacing Controls whether self-spacing measurements are taken.

yes — Self-spacing measurements are taken. (default)

no — Self-spacing measurements are not taken.

Large Net

Same Net Spacing (Spacing)

Same Net Spacing (Bottleneck)

spacing_length_measure

Controls whether parallel spacing measurements are taken.

yes — Parallel spacing measurements are taken. (default)

no — Measurements are not taken.

Spacing Length

spacing_resolution Resolution for parallel spacing report. (1mil = default)

Spacing Length

text_fields yes — Text defined as text is reported in ‘Text Fields’ (default)

no — Text is not reported.

Text Fields

toe2toe_tol Spacing check tolerance for the ‘Toe to Toe’ category.


v_ar_drill_size_list Controls the annular ring categories that are reported.

• If the value is none (v_ar_drill_size_list = none), results are not classified by drill size. The ERF can contain a range for the category as a whole.

• If the value is empty (v_ar_drill_size_list =), a category is generated for each drill size for which there are results to report. The ERF can contain ranges for specific drill sizes.

• If the value is a list of drill size range classes, results are classified by these classes. The ERF can contain ranges for each defined class.


PTH Annular Ring

NPTH Annular Ring


Via Annular Ring



Pressfit (Comp) Annular Ring





October 2016

v_bottleneck_algorithm_mode

Defines which of two algorithms is used to determine bottleneck violations.

0 — Use original algorithm where results are reported to ‘Conductor Width’ (Bottleneck) and ‘Same Net Spacing’ (Bottleneck). (slow)

1 — Use improved algorithm where results are reported to ‘Copper Bottleneck’ (Bottleneck). (default) (fast)

2 — Results are the same as with 1, but the process is slower. (Remains in the system to insure backward compatibility.)

Conductor Width (Bottleneck)

Same Net Spacing (Bottleneck)

Copper Bottleneck



Defines trace narrowings reported as bottlenecks.

1 — Reports bottlenecks with widths equal to trace width only if connected to a wider trace. (default)

0 — Reports all bottlenecks found on traces.

Copper Bottleneck


v_break_tab_margin Break tab margins. (default 1mm) Break Tab Rout to Copper

Break Tab Rout to Trace


Controls how results for teardrop features are reported.

no — All results are reported to this category regardless of the presence of attribute Teardrop Feature. (default)

yes — All results are reported to this category; however, those where at least one feature bears the attribute Teardrop Feature, they are reported separately. (c2c;teardrop)

Pad to Pad

Pad to Circuit

Circuit to Circuit

Surface to Surface

Pad to Surface

Circuit to Surface

NPTH to Circuit

PTH to Copper







Controls whether spacing violations that involve an impedance line (a feature with attribute .imp_line) are reported to a specific dynamic category.

no — (default) Spacing violations involving impedance lines are reported to the regular category.

yes — Spacing violations that involve an impedance line are reported to a dynamic category with suffix ;impedance. For example, p2p;impedance.


SMD to SMD

Via to Via

TH to TH

SMD to Via

SMD to TH

Via to TH

Pad to Pad

Pad to Circuit

Circuit to Circuit

Surface to Surface

Pad to Surface

Circuit to Surface

Same Net Spacing

CAD Self Spacing

v_conductor_width_full_check

Controls how conductor width is checked.

no — Conductor width is not checked if a line or arc is touched by more than a certain, threshold, number of negative shapes (neckdowns). The result is better performance. (default)

yes — Conductor width is checked, no matter the number of negative shapes. Therefore, there is a degradation in performance.

Conductor Width

v_dist2sliver_ratio Minimal ratio for the distance between measurement segment endpoints along the net and the width of the sliver.


Slivers

Short Slivers





October 2016


Controls how a via is considered exposed.

no — A via is considered exposed if not covered in the solder mask layer. (default)

yes — A via is considered covered if assigned attribute Capped Via, even if exposed in the solder mask layer.

Exposed to Exposed

Covered to Covered

Exposed to Covered


Controls whether to report features of the same copper net.

0 — Do not report features of the same net. (default)

1 — Report features even if they are of the same net.

Exposed to Exposed

Covered to Covered

Exposed to Covered





All except:

Mounting Pad to Adjacent Copper

Large Net

Net Loop

v_fab_drc_by_area Controls whether checks are applied according to dynamic area classification.

0 — The <area> classification is not applied. (default)

1 — The <area> classification is applied.

All except:


Large Net

Net Loop

v_fab_drc_map_layer

Default DRC map layer name. All except:


Large Net

Net Loop





v_ignore_comps_with_ignore_attr

Controls whether components with attribute Ignore Graphically/Output are checked.

0 — Does not exclude components with attribute Ignore Graphically/Output. (default)

1 — Does not analyze components with attribute Ignore Graphically/Output.

(Assigned to components not placed on the board when printed.)


v_ignore_dummy_nets

0 — Do not ignore nets having a ‘CAD Short’ violation. (default)

1 — Do not report touching features if one or both of them belong to certain CAD nets. The list of nets to ignore is given by v_ignore_nets_list. (See below)

CAD Short


Controls which copper bottlenecks to report.

no — Report all bottlenecks (default)

yes — Ignore the bottleneck if it loops back in the same layer.

Copper Bottleneck

v_ignore_nets_list A list of nets not to be reported as having ‘CAD Short’ violations. The list is case sensitive and names must be separated by at least one space or tab.

CAD Short


Minimal distance between measurement segment endpoints along the conductor’s edge.

Copper Bottleneck


v_min_sliver_len Slivers shorter than this value are reported as ‘Short Sliver’. All others are reported in ‘Sliver’. Maximum possible value is 100 mils.


Slivers

Short Slivers

v_min_sliver_perim Minimal distance between the measurement segment endpoints along the net.

Slivers

Short Slivers





October 2016

v_report_via_by_type

Controls whether via annular ring violations are reported to ‘Via Annular Ring’ or to individual categories according to via type.

no — Report all via annular ring violations to ‘Via Annular Ring’. (default)

yes — Report via annular ring violations according to type: regular, blind or buried.

Via Annular Ring



v_sliver_algorithm_mode

Controls which algorithm is used to determine sliver violations.

0 — Use original algorithm where results are reported to the ‘Sliver’ category. (slow)

1 — Use improved algorithm where results are reported to either the ‘Sliver’ or ‘Short Sliver’ category. (fast) (default)


Slivers

Short Slivers

v_slivers_check_diff_nets

no — Do not report slivers detected between unconnected features (on different nets). (default)

yes — Report slivers detected between unconnected features, and distances between close nets.


Short Slivers

v_split_pth2c_report Determines whether to report results from the same CAD net in this category along with those of different CAD nets or to ‘PTH to Copper Same Net’.

no — Report all results to this category. (default)

yes — Report same CAD net results to ‘PTH to Copper Same Net’.

PTH to Copper


v_stubs_check_both_ends

yes — Lines or arcs with both ends touching the same surface or feature are reported as stubs. (default)

no — Ignore stubs touching the same surface or feature.

Stubs





v_surface_spacing_separately

Controls whether measurements to surfaces are reported as circuits or into their own categories.

no — Report surfaces as circuits to categories ‘Circuit to Circuit’, ‘Pad to Circuit’ and ‘NPTH to Circuit’. (default)

yes — Report measurements to surfaces to ‘Surface to Surface’, ‘Pad to Surface’, ‘Circuit to Surface’ and ‘NPTH to Surface.’

Circuit to Circuit

Pad to Circuit

NPTH to Circuit

Surface to Surface

Pad to Surface

Circuit to Surface

NPTH to Surface

v_surface_stub_width

Maximum width of a surface stub to report. If wider, it is not reported.

Surface Stubs

v_surface_stub_length

Minimum length of a surface stub to report. If shorter, it is not reported.

Surface Stubs


Minimal ratio for distance between measurement segment endpoints along conductor edge and width of bottleneck.

Copper Bottleneck


v_terminated_stub Controls whether lines with small pads at their endpoints are reported as stubs.

0 — Do not report such lines as a stub.

1 — Report lines with a pad smaller than the line endpoint (and having the same x/y coordinate) as a stub. (default)

2 — Report lines with a pad smaller than or equal to the line endpoint as a stub.

Stubs

v_tp_exvia_as_via Controls whether an exposed via with attribute ICT Test Point is considered a via (reported in ‘Exposed Via to Exposed Via’) or a copper pad (reported in ‘Exposed to Exposed’).

no — Consider via pad with attribute ICT Test Point a copper pad. (default)

yes — Consider via pad with attribute ICT Test Point a via.

Exposed Via to Exposed Via

Exposed Via to Exposed Copper

Exposed to Exposed

Covered to Covered

Exposed to Covered





October 2016

via_breakout_angle Maximum angle for breakout of drill from via pad.


PTH Annular Ring

Via Annular Ring



via_cover_by_pad yes — Report vias not fully covered by a pad. (default)

no — Report vias not fully covered by copper.

Missing Pad for Via




Chapter 4Power and Ground Checks

The Power and Ground Checks action is a read-only action intended to find potential manufacturability defects in power and ground and mixed layers. It uses different algorithms to diagnose negative and positive power and ground layers.

Access: Analysis > Fabrication > Power/Ground Checks.

Power/Ground Checks Action Screen

Tests Performed in Power and Ground Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257


Power and Ground Checks

October 2016

P&G ERF Variables - Compatibility with Earlier Products . . . . . . . . . . . . . . . . . . . . . . 258

Attributes Used in Power and Ground Checks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 258

Categories in Power and Ground Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260NPTH to Copper (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263PTH Annular Ring (Drill) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264Via Annular Ring (Drill) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266PTH to Copper (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 268Via to Copper (Drill) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 269PTH Contains Clearance (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270Via Contains Clearance (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271Spot NFP (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272PTH to Plane (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273Via to Plane (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274NPTH to Plane (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275NPTH Contains Copper (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276Missing Cu for Vias (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277PTH Registration (Drill) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278NPTH Registration (Drill) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279Via Registration (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280Sliver (Sliver) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 281Short Sliver (Sliver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282Rout to Copper (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 283V-cut Rout to Copper (Rout) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284Break Tab Rout to Copper (Rout). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 285Rout to Trace (Rout) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 286V-cut Rout to Trace (Rout) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 287Break Tab Rout to Trace (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 288Missing Rout Clearance (Rout) - for P&G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289Spoke Width (Thermal) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 290Spoke Count (Thermal) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 291Thermal Connect Reduction (Thermal) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 292NFP Spacing (NFP Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 293NFP Spacing (pos) - (NFP Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 294Plane Spacing (Plane Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 295Segmentation Lines (Plane Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 296Etch Outside Keepin Area (Keepin/Keepout). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 297Etch Within Keepout Area (Keepin/Keepout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 298Plane Width (Plane Width) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 299Plane Disconnection (Plane Width) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300Plane Isolated (Plane Width) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301Plane Floating (Plane Connection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 302Layer Floating (Plane Connection). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 303Drills Shorted by Plane (Plane Connection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304Drill Isolated from Plane (Plane Connection). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 305

Power and Ground ChecksTests Performed in Power and Ground Checks


Results Attributes for Power and Ground Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306

ERF Parameters for Power and Ground Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 309

ERF Variables for Power and Ground Checks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 311

Tests Performed in Power and Ground ChecksThe tests that are listed in the ERF parameter pp_tests in the ERF model, or are indicated in the Test List when the analysis is run, control to which categories results are reported.

Table 4-1. Power and Ground Checks Tests

Test Explanation

Drill Reports distance violations between NPTHs/PTHs/Vias to plane, copper, clearances and annular rings.

Sliver Reports slivers in negative and positive layers.

Rout Reports close spacing between copper/clearances and rout features.

Thermal Reports spoke (tie) widths and reduction of connectivity of thermal pads.

The categories, “Spoke Width (Thermal)” and “Thermal Connect Reduction (Thermal)” apply only to negative layers and to correct thermal pads (pads with “th...” names). These categories detect thermal ties either completely broken or chipped by adjacent clearances and thermals.

The categories report the spoke (tie) width and the percentage of overall reduction in thermal pad electrical connectivity. If a thermal has four 10-mil ties, of which two are completely broken, there is a 50% reduction in thermal connectivity.

NFP Spacing Reports spacing between NFPs to NFPs, and NFPs to planes.

Plane Spacing Reports spacing between features of different planes.

Keepin/Keepout Areas

Reports features inside/outside Keepin/Keepout areas (for a description of Keepin/Keepout areas see “Keepin and Keepout Areas” on page 26).

Plane Width Reports insufficient width of copper between two drills connected to a copper plane.

Plane Connection Reports disconnected areas of copper often used as reference planes that is left in a design could cause an unreferenced critical net, or a missing electrical connection.


Power and Ground ChecksP&G ERF Variables - Compatibility with Earlier Products

October 2016

P&G ERF Variables - Compatibility with Earlier Products

To maintain compatibility between legacy products and current versions of Valor NPI, some ERF variables must be mapped.

Attributes Used in Power and Ground ChecksAttributes assigned to the features, layers, keepin areas and keepout areas of the product model control how the analysis tests these entities.

Feature Attributes

Table 4-2. Power and Ground Checks ERF Compatibility Mapping


max_net_size v_max_net_size



Table 4-3. Power and Ground Checks Feature Attributes

Name Description

Copper Text This attribute defines a feature as a nomenclature legend feature. This attribute affects the fabrication analysis by directing spacing checks between such features into a new category (Text to Text).


V-Score Edge This attribute is assigned to rout features that are cut in a V-shape (such as in the figure). Another machine performs the V-shape

cutting.

Power and Ground ChecksAttributes Used in Power and Ground Checks


Layer Attributes

Keepin/Keepout Area Attributes

Table 4-4. Power and Ground Checks Layer Attributes

Name Description

Layer Class This attribute is used to differentiate between layers. It enables you to set different ERF ranges for power layers than for ground layers.

Table 4-5. Power and Ground Checks Keepin/Keepout Area Attributes

Name Description

Rout Keep In Reports rout features outside this area.

Rout Keep Out Reports rout features inside this area.

DFx Area All Layers Applies the area to all board layers.


Applies the area to all specified copper layers according to the values specified. (For further details see Keepin and Keepout Area Attributes.)


Power and Ground ChecksCategories in Power and Ground Checks

October 2016

Categories in Power and Ground ChecksThe full name of the category and its test group serves as the title of the category. Each category is described in detail, accompanied by an example of a typical measurement.

All measurements are from edge to edge of copper, drill or clearance unless stated otherwise.


The ERF parameter pp_layer affects all categories, and is not repeated in the category fact sheets.

Table 4-6. Power and Ground Checks Categories


NPTH to Copper (Drill) Reports NPTHs closer than pp_d2c or touching copper.

PTH Annular Ring (Drill) - for P&G

Reports the shortest distance between drill and laminate for PTHs embedded in copper, for a specific drill size.

Via Annular Ring (Drill) - for P&G

Reports the shortest distance between drill and laminate for PTHs (or vias or both) embedded in copper, for a specified drill size.

PTH to Copper (Drill) Reports other net drills embedded in laminate if the distance from the edge of the drill to the nearest copper is less than pp_d2c.

Via to Copper (Drill) - for P&G

Reports other net drills embedded in laminate if the distance from the edge of the drill to the nearest copper is less than pp_d2c.

PTH Contains Clearance (Drill)

Reports drills containing clearances on negative layers only. If clearance size is close to drill size, drill connectivity is degraded.

Via Contains Clearance (Drill)

Reports drills containing clearances on negative layers only. If clearance size is close to drill size, drill connectivity is degraded.

Spot NFP (Drill) Reports pads in positive layers smaller than their drill by less than pp_d2c.

PTH to Plane (Drill) Reports drills (embedded in copper) closer than pp_d2c to other net copper.

Via to Plane (Drill) Reports drills (embedded in copper) closer than pp_d2c to other net copper.

NPTH to Plane (Drill) Reports NPTHs closer than pp_d2c to other net copper.



NPTH Contains Copper (Drill)

Reports NPTHs containing copper on positive layers only.

Missing Cu for Vias (Drill) Reports via holes not completely surrounded by copper in the drill layer with layer attribute Vias Need CU. Measurements are circles representing the via.

PTH Registration (Drill) - for P&G

Reports the center-to-center distance between drills and touching pads, if larger reg_allowance and smaller than max_reg. Measurements are segments representing distance.

NPTH Registration (Drill) - for P&G

Reports the center-to-center distance between drills and touching pads, if larger reg_allowance and smaller than max_reg.

Via Registration (Drill) Reports the center-to-center distance between drills and touching pads, if larger reg_allowance and smaller than max_reg. Measurements are segments representing distance.

Sliver (Sliver) - for P&G Reports slivers, either between two copper areas or two clearance areas.

Short Sliver (Sliver) Reports slivers, either between two copper areas or two clearance areas.

Rout to Copper (Rout) Reports distances less than pp_r2c between rout skeletons and copper.

V-cut Rout to Copper (Rout) - for P&G

Reports distances less than pp_r2c between routs with attribute Vcut Feature and copper.

Break Tab Rout to Copper (Rout)

Reports copper features too close to a break tab.

Rout to Trace (Rout) - for P&G

Reports distances less than pp_r2c between rout skeletons and arcs and lines.

V-cut Rout to Trace (Rout) - for P&G

Reports distances less than pp_r2c between routs with attribute Vcut Feature and copper arcs and lines.

Break Tab Rout to Trace (Rout)

Reports copper arcs and lines too close to a break tab.

Missing Rout Clearance (Rout) - for P&G

Reports rout features whose compensated routs do not have corresponding clearances.

Spoke Width (Thermal) Reports thermal spoke (tie) widths in negative layers with flashed pads that are less than their defined widths.

Spoke Count (Thermal) Reports thermal connections of a drill to a plane on positive layers.

Table 4-6. Power and Ground Checks Categories (cont.)




October 2016

Thermal Connect Reduction (Thermal)

Reports all incidents of thermal connectivity reduction in negative layers where thermal pads are flashed. Measurement is expressed as a percentage.

NFP Spacing (NFP Spacing)

Reports PTHs and via drills embedded in copper surrounded by clearance, when the copper island (the NFP) is closer to another copper shape than pp_nfp_spacing.

NFP Spacing (pos) - (NFP Spacing)

Reports copper features closer than pp_nfp_spacing belonging to different NFP nets in positive layers only, and if the measurement segment touches copper only at its end points.

Plane Spacing (Plane Spacing)

Reports features in a positive or negative layer closer than pp_pln_spacing belonging to different plane nets if the measurement segment touches copper only at its endpoints.

Segmentation Lines (Plane Spacing)

Reports widths of actual laminate (spacing width) occupied by lines in negative layers only (lines in negative plane layers represent spacing), less than pp_pln_spacing.

Etch Outside Keepin Area (Keepin/Keepout)

Reports etches placed outside the rout Keepin area boundaries.

Etch Within Keepout Area (Keepin/Keepout)

Reports etches within the Keepout area boundaries.

Plane Width (Plane Width) Reports planes connecting at least two drills.between them, having width less than pp_plane_width.

Plane Disconnection (Plane Width)

Reports pairs of surfaces that are disconnected, and contain drills that are connected to the same net.

Plane Isolated (Plane Width)

Reports surface shapes that have no connected drills.

Plane Floating (Plane Connection)

Reports plane layers with anti-pads being used for all holes, or lacking connectivity.

Layer Floating (Plane Connection)

Reports layers where all planes are disconnected due to anti-pads being used for all holes, or lack connectivity.

Drills Shorted by Plane (Plane Connection)

Reports the closest two drills of different nets connected to the same copper plane.

Drill Isolated from Plane (Plane Connection)

Reports drills of the same net, within the plane, that are not electrically connected to the net.

Table 4-6. Power and Ground Checks Categories (cont.)


Power and Ground ChecksNPTH to Copper (Drill)


NPTH to Copper (Drill)Reports NPTHs closer than pp_d2c or touching copper.

Analysis Category <area>:npth2c

Measurement Shape

Measurement ID

Segment

Drill and clearance (in neg. layer) or none (in pos. layer)

Layers Displayed Power and Ground layer

Drill layer piercing it

Graphic

Purpose A non-plated through hole should be kept away from copper surfaces since it is used for mounting and tooling by metal objects.

Function Reports NPTHs closer than pp_d2c or touching copper. If the NPTH also contains copper, it is reported to NPTH Contains Copper (Drill) as well.

In negative Power and Ground layers, a violation is an NPTH whose clearance is not large enough. In positive Power and Ground layers, a violation is an NPTH too close to copper features.


ERF Variables take_npth_range

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Power and Ground ChecksPTH Annular Ring (Drill) - for P&G

October 2016

PTH Annular Ring (Drill) - for P&GReports the shortest distance between drill and laminate for PTHs embedded in copper, for a specific drill size.

Analysis Category <area>:pth2t;<drill_size>

Measurement Shape

Measurement ID

Segment

In negative P&G layer, Entity = thermal pad, or Entity = clearance if clearance encroaches on drill. In positive P&G layer, there is no Entity.



Graphic

Purpose A hole connected to copper must have a sufficiently large annular ring of copper. If not, shifts of the drill and the imaging process cause the drill to lack sufficient contact.

Power and Ground ChecksPTH Annular Ring (Drill) - for P&G


Function Reports the shortest distance between drill and laminate for a specific drill size range, for PTHs embedded in copper, if less than pp_d2c. Breakouts are allowed by specifying a breakout angle between 0 - 180 where 0 = no breakout.

These drills are typically drilled through thermal pads; the annular ring indicates the quality of the connection. With negative P&G layers, the associated entity from the P&G layer is a thermal pad.







ERF Variables classify_via2t

pth_breakout_angle


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations In positive P&G layers, no associated copper features are reported.


Power and Ground ChecksVia Annular Ring (Drill) - for P&G

October 2016

Via Annular Ring (Drill) - for P&GReports the shortest distance between drill and laminate for PTHs (or vias or both) embedded in copper, for a specified drill size.

Analysis Category <area>:via2t;<drill_size> (via to thermal)

Measurement Shape

Measurement ID

Segment

In negative Power and Ground layer, Entity = thermal pad, or Entity = clearance, if clearance encroaches on drill. In positive Power and Ground there is no Entity.



Graphic

Purpose A hole connected to copper must have a sufficiently large annular ring of copper. If not, shifts of the drill and the imaging process cause the drill to lack sufficient contact.

Function Reports the shortest distance between drill and laminate, for a specific drill size, for PTHs (or vias or both) embedded in copper if less than pp_d2c. Breakouts are allowed by specifying a breakout angle between 0 - 180 where 0 = no breakout.






Power and Ground ChecksVia Annular Ring (Drill) - for P&G



ERF Variables classify_via2t = 1

via_breakout_angle


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations In positive P&G layers, no associated copper features are reported.


Power and Ground ChecksPTH to Copper (Drill)

October 2016

PTH to Copper (Drill)Reports other net drills embedded in laminate if the distance from the edge of the drill to the nearest copper is less than pp_d2c.

Analysis Category <area>:pth2c

Measurement Shape

Measurement ID

Segment

Drill

Thermal or close clearance (negative layer);

nothing (positive layer)



Graphic

Purpose A hole to be isolated from power or ground planes must be kept apart from copper. The required distance is typically larger than regular spacing due to the higher than usual current.

Function Reports other net drills embedded in laminate if the distance from the edge of the drill to the nearest copper is less than pp_d2c.

This category also indicates the spacing of the hole from the copper or its laminate annular ring. Normally, it shows how well holes are embedded in laminate.


ERF Variables classify_via2c

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations In positive Power and Ground layers, no associated copper feature is reported.

Power and Ground ChecksVia to Copper (Drill) - for P&G


Via to Copper (Drill) - for P&GReports other net drills embedded in laminate if the distance from the edge of the drill to the nearest copper is less than pp_d2c.

Analysis Category <area>:via2c

Measurement Shape

Measurement ID

Segment

Drill and thermal or close clearance (negative layer);

none (positive layer)



Graphic

Purpose A hole to be isolated from power or ground planes must be kept apart from copper. The required distance is typically larger than regular spacing due to the higher than usual current.

Function Reports other net drills embedded in laminate if the distance from the edge of the drill to the nearest copper is less than pp_d2c.


ERF Variables classify_via2c = 1

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations In positive Power and Ground layers, no associated copper feature is reported.


Power and Ground ChecksPTH Contains Clearance (Drill)

October 2016

PTH Contains Clearance (Drill)Reports drills containing clearances on negative layers only. If clearance size is close to drill size, drill connectivity is degraded.

Analysis Category <area>:pth_cont_clr

Measurement Shape

Measurement ID

Segment

Drill

Layers Displayed Power and Ground (or mixed) layer

Layer piercing it

Graphic

Function Reports drills containing clearances on negative layers only. If clearance size is close to drill size, drill connectivity is degraded. Measurements are segments representing the smallest distance between drill and clearance outlines.

ERF Parameters

ERF Variables classify_via_cont_clr

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Power and Ground ChecksVia Contains Clearance (Drill)


Via Contains Clearance (Drill)Reports drills containing clearances on negative layers only. If clearance size is close to drill size, drill connectivity is degraded.

Analysis Category <area>:via_cont_clr

Measurement Shape

Measurement ID

Segment

Drill


Layer piercing it

Graphic

Function Reports drills containing clearances on negative layers only. If clearance size is close to drill size, drill connectivity is degraded. Measurements are segments representing the smallest distance between drill and clearance outlines.

ERF Parameters

ERF Variables classify_via_cont_clr = 1

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Power and Ground ChecksSpot NFP (Drill)

October 2016

Spot NFP (Drill)Reports pads in positive layers smaller than their drill by less than pp_d2c.

Analysis Category <area>:spot_nfp

Measurement Shape

Measurement ID

Segment

Drill


Layer piercing it

Graphic

Function Reports pads in positive layers smaller than their drill by less than pp_d2c. If larger than pp_d2c, it is assumed the spot NFP is intentional. Measurements are segments representing the distance between the pad and the drill dimensions.



v_fab_drc_by_area

Limitations This category applies only to positive Power and Ground layers.

Power and Ground ChecksPTH to Plane (Drill)


PTH to Plane (Drill)Reports drills (embedded in copper) closer than pp_d2c to other net copper.

Analysis Category <area>:pth2p

Measurement Shape

Measurement ID

Segment

Drill



Graphic

Function Reports drills (embedded in copper) closer than pp_d2c to other net copper. Measurements are segments representing the distance between plane and hole edge.


ERF Variables classify_via2p

v_fab_drc_map_layer

v_fv_fab_drc_by_area



Power and Ground ChecksVia to Plane (Drill)

October 2016

Via to Plane (Drill)Reports drills (embedded in copper) closer than pp_d2c to other net copper.

Analysis Category <area>:via2p

Measurement Shape

Measurement ID

Segment

Drill



Graphic

Function Reports drills (embedded in copper) closer than pp_d2c to other net copper. Measurements are segments representing the distance between plane and hole edge.


ERF Variables classify_via2p = 1

v_fab_drc_map_layer

v_fab_drc_by_area


Power and Ground ChecksNPTH to Plane (Drill)


NPTH to Plane (Drill)Reports NPTHs closer than pp_d2c to other net copper.

Analysis Category <area>:npth2p

Measurement Shape

Measurement ID

Segment

NPTH



Graphic

Function Reports NPTHs closer than pp_d2c to other net copper. Measurements are segments representing the distance between plane and hole edge.


ERF Variables take_npth_range

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Power and Ground ChecksNPTH Contains Copper (Drill)

October 2016

NPTH Contains Copper (Drill)Reports NPTHs containing copper on positive layers only.

Analysis Category <area>:npth_cont_c

Measurement Shape

Measurement ID

Segment

Drill


Layer piercing it

Graphic

Purpose Having copper inside non-plated through holes serves no purpose and inflicts unnecessary wear and tear on the drill bit.

Function Reports NPTHs containing copper on positive layers only. If the NPTH is also in violation of pp_d2c spacing requirements, it is reported to NPTH to Copper (Drill) as well.

ERF Parameters


v_fab_drc_by_area

Limitations

Power and Ground ChecksMissing Cu for Vias (Drill)


Missing Cu for Vias (Drill)Reports via holes not completely surrounded by copper in the drill layer with layer attribute Vias Need CU. Measurements are circles representing the via.

Analysis Category <area>:miss_cu

Measurement Shape

Measurement ID

Circle

Vias



Graphic

Purpose To determine if a via drill is completely surrounded by copper in Power and Ground layers.

Function Reports via holes not completely surrounded by copper in the drill layer with layer attribute Vias Need CU. Measurements are circles representing the via.

ERF Parameters


v_fab_drc_by_area

Limitations


Power and Ground ChecksPTH Registration (Drill) - for P&G

October 2016

PTH Registration (Drill) - for P&GReports the center-to-center distance between drills and touching pads, if larger reg_allowance and smaller than max_reg. Measurements are segments representing distance.

Analysis Category <area>:pth_reg

Measurement Shape

Measurement ID

Segment

Drill; Pad



Graphic


Function Reports the center-to-center distance between drills and touching pads, if larger reg_allowance and smaller than max_reg. Measurements are segments representing distance.

ERF Parameters


max_reg

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations If the distance between the centers is larger than max_reg, then the features are considered offset on purpose and large registration errors may be missed.

Power and Ground ChecksNPTH Registration (Drill) - for P&G


NPTH Registration (Drill) - for P&GReports the center-to-center distance between drills and touching pads, if larger reg_allowance and smaller than max_reg.

Analysis Category <area>:npth_reg

Measurement Shape

Measurement ID

Segment

Drill; Pad



Graphic



ERF Parameters


max_reg

v_fab_drc_map_layer

v_fab_drc_by_area



Power and Ground ChecksVia Registration (Drill)

October 2016

Via Registration (Drill)Reports the center-to-center distance between drills and touching pads, if larger reg_allowance and smaller than max_reg. Measurements are segments representing distance.

Analysis Category <area>:via_reg

Measurement Shape

Measurement ID

Segment

Drill; Pad



Graphic



ERF Parameters


max_reg

v_fab_drc_map_layer

v_fab_drc_by_area


Power and Ground ChecksSliver (Sliver) - for P&G


Sliver (Sliver) - for P&GReports slivers, either between two copper areas or two clearance areas.


Measurement Shape

Measurement ID

Segment

None


Graphic

Purpose A copper sliver can cause material to detach during the photo imaging processes in fabrication. Floating pieces can cause defects and shorts which reduce yield.

Function Both ‘Sliver’ and ‘Short Sliver’ report slivers, either between two copper areas (positive layer) or two clearance areas (negative layers) (usual case). A violation is reported if silver width is less than pp_sliver, and non-zero. A sliver is defined by v_dist2sliver_ratio and v_min_sliver_perim. See Slivers and Short Slivers Categories for a detailed explanation.

v_slivers_check_diff_net used in ‘Sliver’ (Signal Layers Checks), is irrelevant here.


ERF Variables v_sliver_algorithm_mode

v_dist2sliver_ratio

v_min_sliver_perim

v_max_net_size


v_min_sliver_len

v_fab_drc_map_layer

v_fab_drc_by_area

Related Category Short Sliver (Sliver)


Power and Ground ChecksShort Sliver (Sliver)

October 2016

Short Sliver (Sliver)Reports slivers, either between two copper areas or two clearance areas.


Measurement Shape

Measurement ID

Segment

None


Graphic

Purpose A copper sliver can cause material to detach during photo-imaging processes in fabrication. Floating pieces cause defects and shorts which reduce yield.

Function Both ‘Silvers’ and ‘Short Sliver’ report slivers, either between two copper areas (positive layer) or two clearance areas (negative layers) (usual case). See Slivers and Short Slivers Categories for a detailed explanation.




v_dist2sliver_ratio

v_min_sliver_perim

v_max_net_size


v_min_sliver_len

v_fab_drc_map_layer

v_fab_drc_by_area

Related Category Sliver (Sliver)

Power and Ground ChecksRout to Copper (Rout)


Rout to Copper (Rout) Reports distances less than pp_r2c between rout skeletons and copper.

Analysis Category <area>:r2c;<layer_class>

Measurement Shape

Measurement ID

Segment

None (r0)


Layer piercing it

Graphic

Purpose The rout, which represents the edge of the board, must be isolated from copper planes to avoid shorting the signal to the card cage.

Function Results are classified by layer attribute Layer Class. This enables you to define different ERF ranges for power layers than for ground layers.

Reports distances less than pp_r2c between rout skeletons and copper.These are the two most common types of this violation:

• An NPTH drills out a spot pad.• An NPTH is drilled through copper that neither includes it nor is

included in it. The NPTH “bites” copper.


pp_r2c


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Power and Ground ChecksV-cut Rout to Copper (Rout) - for P&G

October 2016

V-cut Rout to Copper (Rout) - for P&GReports distances less than pp_r2c between routs with attribute Vcut Feature and copper.

Analysis Category <area>:vcut2c;<layer_class>

Measurement Shape

Measurement Entity

Segment

None (r0)


Layer piercing it

Graphic

Purpose The rout, which represents the edge of the board, must be isolated from copper planes to avoid shorting the signal to the card cage.

Function Results are classified by layer attribute Layer Class. This enables you to define different ERF rule ranges for power layers than for ground layers. Reports distances less than pp_r2c between routs with attribute Vcut Feature and copper.


pp_r2c


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Power and Ground ChecksBreak Tab Rout to Copper (Rout)


Break Tab Rout to Copper (Rout)Reports copper features too close to a break tab.

Analysis Category <area>:btab2c;<layer_class>

Measurement Shape

Measurement Value

Measurement ID

Segment

Spacing

Break tab; Feature


Rout layer

Graphic


A Break Tab is a row of at least three round or square holes of the same size, with constant pitch, located in the rout layer. These holes make it easier to break off sections of the board after production. Break tab borders are determined by the neighboring rout feature and the break tab margin, as in the illustration. The Break Tab must be parallel to the X or Y axis.

Function Reports copper features closer than pp_r2c to a break tab. Distance is measured from feature edge to break tab edge. Does not report copper features with attribute Copper Feature Ignore.

Results are classified by layer attribute Layer Class. This enables you to define different ERF rule ranges for inner layers than for outer layers.



v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Power and Ground ChecksRout to Trace (Rout) - for P&G

October 2016

Rout to Trace (Rout) - for P&GReports distances less than pp_r2c between rout skeletons and arcs and lines.

Analysis Category <area>:r2t;<layer_class>

Measurement Shape

Measurement ID

Segment

None (r0)


Layer piercing it

Graphic

Purpose The rout, which represents the edge of the board, must be isolated from copper arcs and lines to avoid shorting the signal to the card cage.

Function Reports distances less than pp_r2c between rout skeletons and arcs and lines. Results are classified by layer attribute Layer Class. This enables you to define different ERF rule ranges for power layers than for ground layers.

These are the two most common types of this violation:

• An NPTH drills out a spot pad.• An NPTH is drilled through copper that neither includes it nor is

included in it. The NPTH “bites” copper.


pp_r2c


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Power and Ground ChecksV-cut Rout to Trace (Rout) - for P&G


V-cut Rout to Trace (Rout) - for P&GReports distances less than pp_r2c between routs with attribute Vcut Feature and copper arcs and lines.

Analysis Category <area>:vcut2t;<layer_class>

Measurement Shape

Measurement ID

Segment

None (r0)


Layer piercing it

Graphic

Purpose The rout, which represents the edge of the board, must be isolated from copper arcs and lines to avoid shorting the signal to the card cage.

Function Reports distances less than pp_r2c between routs with attribute Vcut Feature and copper arcs and lines. Results are classified by layer attribute Layer Class. This enables you to define different ERF rule ranges for power layers than for ground layers.


pp_r2c


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Power and Ground ChecksBreak Tab Rout to Trace (Rout)

October 2016

Break Tab Rout to Trace (Rout)Reports copper arcs and lines too close to a break tab.

Analysis Category <area>:btab2t;<layer_class>

Measurement Shape

Measurement Value

Measurement ID

Segment

Spacing

Break tab; Feature


Rout layer

Graphic


A Break Tab is a row of at least three round or square holes of the same size with constant pitch located in the rout layer. These holes make it easier to break off sections of the board after production. Break tab borders are determined by the neighboring rout feature and the break tab margin (as in the illustration). The Break Tab must be parallel to the X or Y axis.

Function Reports copper arcs and lines closer than pp_r2c to a break tab. Distance is measured from feature edge to break tab edge. Does not report copper arcs and lines with attribute Copper Feature Ignore.

Results are classified by layer attribute Layer Class. This enables you to define different ERF rule ranges for inner layers than for outer layers.



v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Power and Ground ChecksMissing Rout Clearance (Rout) - for P&G


Missing Rout Clearance (Rout) - for P&GReports rout features whose compensated routs do not have corresponding clearances.

Analysis Category <area>:rout_clearance

Measurement Shape

Measurement ID

Segment

Rout feature


Rout layer

Graphic

Function Reports rout features whose compensated routs do not have corresponding clearances. For every clearance violation, a Rout Spacing violation with a distance of 0 is also reported.



v_fab_drc_by_area

Limitations


Power and Ground ChecksSpoke Width (Thermal)

October 2016

Spoke Width (Thermal)Reports thermal spoke (tie) widths in negative layers with flashed pads that are less than their defined widths.

Analysis Category <area>:spoke_width

Measurement Shape

Measurement ID

Segment

None


Graphic

Function Reports thermal spoke (tie) widths in negative layers with flashed pads that are less than their defined widths. Measurements are segments describing the spoke width at its narrowest point.

The definition of a thermal pad includes the ‘tie width’. (‘Spoke gap’ in Valor NPI.)

ERF Parameters

ERF Variables thermal_shrink_outer

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Power and Ground ChecksSpoke Count (Thermal)


Spoke Count (Thermal)Reports thermal connections of a drill to a plane on positive layers.

Analysis Category <area>:spoke_num

Measurement Shape

Measurement ID

Circle or square representing the outer shape of the thermal (points of connection to the plane)

Number of spokes


Graphic

Purpose To recognize a drill connected to plane as a thermal with an insufficient number of connections.

Function Reports thermal connections of a drill to a plane on positive layers.

ERF Parameters

ERF Variables v_max_thermal_size

Limitations


Power and Ground ChecksThermal Connect Reduction (Thermal)

October 2016

Thermal Connect Reduction (Thermal)Reports all incidents of thermal connectivity reduction in negative layers where thermal pads are flashed. Measurement is expressed as a percentage.

Analysis Category <area>:thermal_percent_red

Measurement Shape

Measurement ID

Bounding box around thermal

None


Graphic

Purpose If the drill located inside the thermal has insufficient electrical connectivity to the surrounding plane, it may not provide the required functionality, especially in high speed designs.

Function Reports all incidents of thermal connectivity reduction in negative layers where thermal pads are flashed. Measurement is expressed as a percentage.

The overall electrical connectivity of a thermal pad is the sum of its defined spoke widths. The actual connectivity is the sum of actual spoke widths.

The percentage reduction is defined as:

(Defined Connectivity - Actual Connectivity) / (Actual Connectivity).

ERF Parameters

ERF Variables thermal_shrink_outer

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Power and Ground ChecksNFP Spacing (NFP Spacing)


NFP Spacing (NFP Spacing) Reports PTHs and via drills embedded in copper surrounded by clearance, when the copper island (the NFP) is closer to another copper shape than pp_nfp_spacing.

Analysis Category <area>:nfp_spacing

Measurement Shape

Measurement ID

Segment

None


Graphic

Purpose To ensure that non-functional copper pads are far enough away from other copper features so as not to cause interference.

Function Reports PTHs and via drills embedded in copper surrounded by clearance, when the copper island (the NFP) is closer to another copper shape than pp_nfp_spacing.

Stage 1 — The system first verifies that the copper around the drill is an NFP. If it is surrounded by a clearance so that the copper island is contained within a circle of radius: drill radius + pp_d2c + pp_nfp_spacing + nfp_clr_extend., it is an NFP.

pp_d2c and pp_nfp_spacing are parameters used for a number of measurements. However, in this stage they are used only as representative elements of size.

Stage 2 — If the copper island is a true NFP, distances between it and the next copper feature less than pp_nfp_spacing are reported.

The check is performed on negative layers only.

This logic applies regardless of how NFPs are defined: as donuts, a combination of positive and negative pads, or drawn.

ERF Parameters pp_nfp_spacing

ERF Variables nfp_clr_extend

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Power and Ground ChecksNFP Spacing (pos) - (NFP Spacing)

October 2016

NFP Spacing (pos) - (NFP Spacing) Reports copper features closer than pp_nfp_spacing belonging to different NFP nets in positive layers only, and if the measurement segment touches copper only at its end points.

Analysis Category <area>:nfp_pos_spacing

Measurement Shape

Measurement ID

Spacing segment

Any two features


Graphic

Function Reports copper features closer than pp_nfp_spacing belonging to different NFP nets in positive layers only, and if the measurement segment touches copper only at its end points.

ERF Parameters pp_nfp_spacing

ERF Variables max_nfp_net_size

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations The classification of NFP and plane nets is based on size of nets. See the note below.

Power and Ground ChecksPlane Spacing (Plane Spacing)


Plane Spacing (Plane Spacing)Reports features in a positive or negative layer closer than pp_pln_spacing belonging to different plane nets if the measurement segment touches copper only at its endpoints.

Analysis Category <area>:plane_spacing

Measurement Shape

Measurement ID

Segment

Any two features


Graphic

Purpose When spacing between planes is compromised, shorts can occur between different voltage levels or between power and ground, resulting in non-functional boards.

Function Reports features in a positive or negative layer closer than pp_pln_spacing belonging to different plane nets if the measurement segment touches copper only at its endpoints.

ERF Parameters pp_pln_spacing

ERF Variables max_nfp_net_size

v_divide_complicated_surfaces

v_fab_drc_by_area

Limitations Drawn planes close to each other can produce a large number of measurements. Measurements are not filtered by their proximity to each other.


Power and Ground ChecksSegmentation Lines (Plane Spacing)

October 2016

Segmentation Lines (Plane Spacing)Reports widths of actual laminate (spacing width) occupied by lines in negative layers only (lines in negative plane layers represent spacing), less than pp_pln_spacing.

Analysis Category <area>:segmentation_lines

Measurement Shape

Measurement ID

Line

Line


Graphic

Function Reports widths of actual laminate (spacing width) occupied by lines in negative layers only (lines in negative plane layers represent spacing), less than pp_pln_spacing. This width may be larger than line width if spacing is drawn using partially overlapping parallel lines.

Measurements are line shapes representing spacing width.

If measurement segment touches copper at any point other than its endpoints, it is not reported.

ERF Parameters pp_pln_spacing


len2width_ratio


v_fab_drc_by_area

Limitations The measured lines may not always represent split planes but also cutouts or text.

Power and Ground ChecksEtch Outside Keepin Area (Keepin/Keepout)


Etch Outside Keepin Area (Keepin/Keepout)Reports etches placed outside the rout Keepin area boundaries.

Analysis Category <area>:etch_out_keepin_area

Measurement Shape

Measurement Value

Measurement ID

Bounding box

Shape

Feature



Graphic

Function Reports etches (lines, arcs, vias, pads and surfaces) placed outside the rout ‘Keepin’ area boundaries.

These areas are placed on the document layers whose names are defined in the job attribute, ‘Rout Keepin Layer’. The areas have attribute Rout Keepin and either attribute DFX Area All Layers or attribute DFX Area Selected Layers by Bits (with the value appropriate to the layer being checked).

ERF Parameters


v_fab_drc_by_area

Limitations



Power and Ground ChecksEtch Within Keepout Area (Keepin/Keepout)

October 2016

Etch Within Keepout Area (Keepin/Keepout)Reports etches within the Keepout area boundaries.

Analysis Category <area>:etch_in_keepout_area

Measurement Shape

Measurement Value

Measurement ID

Bounding box

Shape

Feature


Associated document layer.

Graphic

Function Reports etches (lines, arcs, vias, pads and surfaces) within ‘Keepout’ area boundaries.

These areas are placed on the document layers whose names are defined in job attribute “Rout Keepout Layer”. The areas have attribute Rout Keepout and either attribute DFX Area All Layers or attribute DFX Area Selected Layers by Bits (with the value appropriate to the layer being checked).

ERF Parameters


v_fab_drc_by_area

Limitations


Power and Ground ChecksPlane Width (Plane Width)


Plane Width (Plane Width)Reports planes connecting at least two drills.between them, having width less than pp_plane_width.

Analysis Category plane_width

Measurement Shape

Measurement Value

Measurement ID

Segment across plane width, or the shortest path of copper.

Width of the plane for the current path.

Index of the current segment of the path.

Layers Displayed Power and Ground layer.

Graphic

Purpose Copper planes should be wide enough for electrical current to flow between connected drills.

Function Checks planes connected to at least two drills, and reports if the width of the plane between them is less than pp_plane_width.

A plane width measurement can transverse a path comprised of a number of features and the edges surrounding the drill (the source of electrical current). The measurement is the total of all segments; its entity is the path’s index. All individual segments of the measurement have the same path index.

ERF Parameters pp_plane_width

ERF Variables v_thermal_as_clearance

v_pos_layer_contourize


Limitations


Power and Ground ChecksPlane Disconnection (Plane Width)

October 2016

Plane Disconnection (Plane Width)Reports pairs of surfaces that are disconnected, and contain drills that are connected to the same net.

Analysis Category plane_disconnection

Measurement Shape

Measurement Value

Measurement ID

Segment connecting the shapes.

Area

None


Graphic

Purpose

Function Reports pairs of surfaces that are disconnected, and contain drills that are connected to the same net.

A surface without connected drills is reported to category Plane Isolated.

For negative layers, when v_thermal_as_clearance = yes, thermals are considered as clearances when surfaces are tested for being reported as disconnected.

ERF Parameters




Limitations

Power and Ground ChecksPlane Isolated (Plane Width)


Plane Isolated (Plane Width)Reports surface shapes that have no connected drills.

Analysis Category plane_isolated

Measurement Shape

Measurement Value

Measurement ID

Area of the isolated plane.

Area

None


Graphic

Purpose

Function Reports surface shapes that have no connected drills.

For negative layers, when v_thermal_as_clearance = yes, thermals are considered as clearances when surfaces are tested for being reported as isolated.

ERF Parameters




Limitations


Power and Ground ChecksPlane Floating (Plane Connection)

October 2016

Plane Floating (Plane Connection)Reports plane layers with anti-pads being used for all holes, or lacking connectivity.

Analysis Category <area>:plane_float

Measurement Shape

Measurement Value

Measurement ID

Plane bounding box


Graphic

Purpose Floating planes are disconnected areas of copper often used as reference planes. They can result in isolated areas of copper where correct power and ground connection was intended. Locating these areas minimizes the likelihood of an unreferenced critical net, or a missing electrical connection.

Copper planes not connected to any net are usually an error in design. To visually locate them is time-consuming.

Function Reports plane layers with anti-pads being used for all holes, or lacking connectivity.

If all planes in the layer float, then this category remains empty and the layer is reported to Layer Floating (Plane Connection).

ERF Parameters


v_fab_drc_by_area

Limitations

Power and Ground ChecksLayer Floating (Plane Connection)


Layer Floating (Plane Connection)Reports layers where all planes are disconnected due to anti-pads being used for all holes, or lack connectivity.

Analysis Category layer_float

Measurement Shape

Measurement Value

Measurement ID

Layer bounding box


Graphic

Purpose Floating planes are disconnected layers of copper used for reference, or not removed by mistake. Their presence in a design is an error. To visually examine a design to remove floating planes is time-consuming.

Function Reports layers where all planes are disconnected due to anti-pads being used for all holes, or lack connectivity.

When a layer is reported to this category, none of its planes is reported to Plane Floating (Plane Connection).

ERF Parameters


Limitations


Power and Ground ChecksDrills Shorted by Plane (Plane Connection)

October 2016

Drills Shorted by Plane (Plane Connection)Reports the closest two drills of different nets connected to the same copper plane.

Analysis Category <area>:drills_shorted_by_plane

Measurement Shape

Measurement Value

Measurement ID

Segment between shorted drills

Distance between shorted drills

Net names of the shorted drills

Layers Displayed Power and Ground layer, drill layers

Graphic

Purpose To detect shorts caused by two drills connected to the same copper plane.

Function Reports the closest two drills of different nets connected to the same copper plane.

All drills connected to the plane are checked to determine their CAD net. The largest group is considered the plane net. The distance to one drill of each of the other groups is reported.

ERF Parameters

ERF Variables

Limitations

Power and Ground ChecksDrill Isolated from Plane (Plane Connection)


Drill Isolated from Plane (Plane Connection)Reports drills of the same net, within the plane, that are not electrically connected to the net.

Analysis Category <area>:drill_isolated_from_plane

Measurement Shape

Measurement Value

Measurement ID

Isolated drill

Size of isolated drill

Net names of the isolated drill

Layers Displayed Power and Ground layer, drill layers

Graphic

Purpose To detect a drill isolated from its surrounding plane but of the same CAD net as the plane. In many cases, this indicates a mistake in the design, an unnecessary clearance, or a missing thermal.

Function Reports drills of the same net, within the plane, that are not electrically connected to the net.

Determines the net for each plane, and checks all drills of the same net within the plane area. Those not electrically connected to it are reported.

ERF Parameters

ERF Variables

Limitations


Power and Ground ChecksResults Attributes for Power and Ground Checks

October 2016

Results Attributes for Power and Ground Checks

Result attributes are assigned when the analysis is run. The values of the attributes can be retrieved afterwards.

Table 4-7. Power and Ground Checks Results Attributes


...dra_pth2t The DRA of the PTH to Annular Ring category

...min_pth2t Minimum distance between a PTH and laminate

...typ_pth2t Typical distance between a PTH and laminate

...min_pth_reg Minimum PTH registration measurement value

...typ_pth_reg Typical PTH registration measurement value

...min_via_reg Minimal via registration measurement value

...typ_via_reg Typical via registration measurement value

...dra_via2t The DRA of the Via to Annual Ring category

...min_via2t Minimum distance between a via and laminate

...typ_via2t Typical distance between a via and laminate

...dra_via2c The DRA of the Via to Copper category

...min_via2c Minimum distance between a via and copper

...typ_via2c Typical distance between a via and copper

...dra_via2p The DRA of the Via to Plane category

...min_via2p Minimum distance between a via and a plane

...typ_via2p Typical distance between a via and a plane

...dra_pth2c The DRA of the PTH to Copper category

...min_pth2c Minimum distance between a PTH and copper

...typ_pth2c Typical distance between a PTH and copper

...dra_pth2p The DRA of the PTH to Plane category

...min_pth2p Minimum distance between a PTH and a plane

...typ_pth2p Typical distance between a PTH and a plane

...dra_pth_cont_clr The DRA of the PTH Contains Clearance category

...min_pth_cont_clr Minimum distance between drill and clearance outline.

...typ_pth_cont_clr Typical distance between drill and clearance outline



...dra_via_cont_clr The DRA of the Via Contains Clearance category

...min_via_cont_clr Minimum distance between a via and the clearance outline

...typ_via_cont_clr Typical distance between a via and the clearance outline

...dra_spot_nfp The DRA of the Spot NFP category

...min_spot_nfp Minimum distance between an NFP pad and a drill

...typ_spot_nfp Typical distance between an NFP pad and a drill

...dra_npth2c The DRA of the NPTH to Copper category

...min_npth2c Minimum distance between an NPTH and copper

...typ_npth2c Typical distance between an NPTH and copper

...num_npth_cont_c Number of NPTHs containing copper

...dra_npth2p The DRA of the NPTH to Plane category

...min_npth2p Minimum distance between an NPTH and a plane

...typ_npth2p Typical distance between an NPTH and a plane

...min_npth_reg Minimum NPTH Registration measurement value

...typ_npth_reg Typical NPTH Registration measurement value

...num_sliver Number of slivers

...num_short_sliver Number of short slivers

...min_r2c Minimal distance between rout and copper

...typ_r2c Typical distance between rout and copper

...num_rout_clearance

Number of rout to clearance alarms

...min_spoke_width Minimum spoke width report

...typ_spoke_width Typical spoke width report

...typ_thermal_percent_red

Typical percentage of thermal connectivity reduction

...max_thermal_percent_red

Maximum percentage of thermal connectivity reduction

...min_nfp_spacing Minimum distance between an NFP and a copper feature

...typ_nfp_spacing Typical distance between an NFP and a copper feature

...min_nfp_pos_spacing

Minimum distance between two NFPs on different nets

Table 4-7. Power and Ground Checks Results Attributes (cont.)




October 2016

...typ_nfp_pos_spacing

Typical distance between two NFPs on different nets

...min_plane_spacing

Minimum distance between two features belonging to different plane nets

...typ_plane_spacing Typical distance between two features belonging to different plane nets

...min_segmentation_lines

Minimum line width representing spacing in negative layers

...typ_segmentation_lines

Typical line width representing spacing in negative layers

...dra_miss_cu The DRA for the Missing Cu for Vias category

...min_miss_cu Minimum size of via

...typ_miss_cu Typical size of via

...num_etch_out_keepin_area

Number of features outside Keepin areas.

...num_etch_in_keepout_area

Number of features within Keepout areas

...dra Overall DRA of a board is the minimum of all DRAs for all categories for which a DRA is defined:

pth2t, via2t, via2c, via2p, pth2c, pth2p, pth_cont_clr, via_cont_clr, spot_nfp, npth2c, npth2p, miss_cu

Table 4-7. Power and Ground Checks Results Attributes (cont.)


Power and Ground ChecksERF Parameters for Power and Ground Checks


ERF Parameters for Power and Ground Checks

ERF parameters, set in the ERF model or when the analysis is run, control the analysis.

Table 4-8. Power and Ground Checks ERF Parameters


Layer pp_layer Layers to be affected by the action.

All categories

Drill to Copper pp_d2c The maximum search radius for all drill related measurements to copper.

NPTH to Copper

PTH Annular Ring

Via Annular Ring

PTH to Copper

Via to Copper

Spot NFP

PTH to Plane

Via to Plane

NPTH to Plane

NFP Spacing

Minimal Sliver pp_sliver The minimum sliver width. A sliver that is narrower than this value is reported.

Sliver

Short Sliver

Rout to Copper pp_r2c The search distance for copper to rout measurements.

Rout to Copper

NFP Spacing pp_nfp_spacing The maximum distance for NFP spacing measurements.

NFP Spacing

NFP Spacing (pos)

Plane Spacing pp_pln_spacing The maximum distance for split plane spacing measurements.

Plane Spacing

Segmentation Lines

Plane Width pp_plane_width The maximum plane width to be reported.

Plane Width

Test List pp_tests Defines the tests to be run. All categories


Power and Ground ChecksERF Parameters for Power and Ground Checks

October 2016

Compensated Rout pp_use_compensated_rout

no - measures to skeleton. (default)

yes - enables measurement to internal cutout of compensated rout feature. If compensation does not exist, measure to edge of rout.

Rout to Copper

Missing Rout Clearance

Table 4-8. Power and Ground Checks ERF Parameters (cont.)


Power and Ground ChecksERF Variables for Power and Ground Checks


ERF Variables for Power and Ground ChecksERF variables set in the ERF model control the analysis. ERF variable values are limited to 255 characters.

Table 4-9. Power and Ground Checks ERF Variables


classify_via_cont_clr

Controls how PTHs/vias containing clearances are reported.

0 — Report both PTHs/vias in ‘PTH Contains Clearance’. (default)

1 — Report PTHs in ‘PTH Contains Clearance’ and vias in ‘Via Contains Clearance’.

PTH Contains Clearance

Via Contains Clearance

classify_via2c Controls how PTH/via to copper measurements are reported.

0 — Report both PTHs/vias in ‘PTH to Copper’. (default)

1 — Report PTHs in ‘PTH to Copper’ and vias in ‘Via to Copper’.

PTH to Copper

Via to Copper

classify_via2p Controls how PTH/via to plane measurements are reported.

0 — Report both PTHs/vias in ‘PTH to Plane’. (default)

1 — Report PTHs in ‘PTH to Plane’ and vias in ‘Via to Plane’.

PTH to Plane

Via to Plane

classify_via2t Controls how PTH/via to annular ring measurements are reported.

0 — Report both PTHs/vias in ‘PTH to Annular Ring’. (default)

1 — Report PTHs in ‘PTH Annular Ring’ and vias in ‘Via Annular Ring’.

PTH Annular Ring

Via Annular Ring

len2width_ratio Minimum ratio of length to width for the ‘Segmentation Lines’ category.

Segmentation Lines

max_nfp_net_size Limits (length and width of a bounding box) of a copper net in positive Power and Ground layers. Nets with limits less than this value are considered NFP nets, except for one pad nets which are always considered NFP, regardless of size. Spacing measurements between two NFP nets or an NFP net and a plane net are reported to ‘NFP Spacing (pos)’. Spacing measurements between two plane nets are reported to ‘Plane Spacing’.

NFP Spacing (pos)

Plane Spacing



October 2016

max_reg Maximum offset considered a registration error. If the center-to-center distance of drill and pad is larger than this value, a registration error is not reported.

PTH Registration

NPTH Registration

Via Registration

min_line_len Minimum line length in ‘Segmentation Lines’ category. Also the minimum overlap between lines to report in parallel spacing.

Segmentation Lines

nfp_clr_extend Value by which to extend the search radius for NFP pads. In negative Power and Ground layers, when a drill is totally surrounded by copper, and that copper island is totally surrounded by clearances, the system only reports spacing violations if the copper island containing the drill is fully within a circle of radius:

drill radius + Drill to Copper parameter (pp_d2c) + NFP Spacing parameter (pp_nfp_spacing) + nfp_clr_extend.

Since drill radius is a fixed value, and pp_d2c and pp_nfp_spacing are only define size and not actual measurements here, nfp_clr_extend (which can be a large number) enables the system to check NFPs with large annular rings for spacing and report violations to ‘NFP Spacing’.

NFP Spacing

pth_breakout_angle 0 - 180 degrees

Maximum angle for breakout of drill from PTH pad. To block breakout of PTH to thermal pad set pth_breakout_angle=0.

PTH Annular Ring

r2cpr_by_rtype Controls how to report distances between copper and rout features.

0 — Results only reported to ‘Rout to Copper’ or ‘Rout to Trace’ category. (default)

1 — Results reported to ‘V-cut Rout to Copper’ or ‘V-cut Rout to Trace’ category if rout assigned attribute Vcut Feature.

Rout to Copper

V-cut Rout to Copper

Rout to Trace

V-cut Rout to Trace

Table 4-9. Power and Ground Checks ERF Variables (cont.)




reg_allowance A distance between pad center and drill center greater than this value is considered misregistered.

PTH Registration

NPTH Registration

Via Registration


Controls how slivers are reported on hatched area.



by attr — Only report slivers bearing a hatch attribute. (EDA)

Sliver

Short Sliver

rm_npth2c Reliability Margin (RM). See “Design Registration Allowance Adjusted for Reliability Margin” on page 22.

NPTH to Copper

rm_pth2c Reliability Margin (RM). See “Design Registration Allowance Adjusted for Reliability Margin” on page 22.

PTH to Copper

Via to Copper

rm_pth2t Reliability Margin (RM). See “Design Registration Allowance Adjusted for Reliability Margin” on page 22.

PTH Annular Ring

Via Annular Ring

take_npth_range Controls whether the maximal distance for NPTHs to copper is taken from pp_d2c or from the npth2c. parameter

0 — Use value of pp_d2c. (default)

1 — Use value of npth2c range.

NPTH to Copper

NPTH to Plane

thermal_shrink_outer

The amount by which to shrink the diameter of the outer thermal shape without causing a spoke reduction violation, when clearance barely intrudes upon the outer perimeter of a thermal. This is accomplished by taking a shape equal to the outer shape of the thermal, shrinking it by the value of thermal_shrink_outer and checking the spoke widths and thermal reduction along the outline of this shape.

Spoke Width

Thermal Connect Reduction





October 2016

via_breakout_angle 0 - 180 degrees

Maximum angle for breakout of drill from via pad.

Via Annular Ring

v_ar_drill_size_list Controls the annular ring categories that are reported.

• If the value is none (v_ar_drill_size_list = none), results are not classified by drill size. The ERF can contain a range for the category as a whole.

• If the value is empty (v_ar_drill_size_list =), a category is generated for each drill size for which there are results to report. The ERF can contain ranges for specific drill sizes.

• If the value is a list of drill size range classes, results are classified by these classes. The ERF can contain ranges for each defined class.


PTH Annular Ring

Via Annular Ring

v_break_tab_margin Break tab margins. (default 1mm) Break Tab Rout to Copper

Break Tab Rout to Trace


To maintain compatibility with earlier products, this variable must be mapped. See “P&G ERF Variables - Compatibility with Earlier Products” on page 258.

Sliver

Short Sliver


Controls whether complicated surfaces with a large number of edges are divided into a few overlapping surfaces to improve analysis performance.

Yes — Always Divide complicated surfaces. (default)

No — Do not divide complicated surfaces.

All categories in Plane Spacing and Plane Width tests.

All other checks will run longer, if set to No.









All except:

Plane Width

Plane Disconnection




All except:

Plane Width

Plane Disconnection

v_fab_drc_map_layer

Specifies the default DRC map layer name. All except:

Plane Width

Plane Disconnection

v_max_net_size Nets with more than v_max_net_size features are ignored.


Sliver

Short Sliver





October 2016

v_max_thermal_size

Maximum size of the outer diameter of a thermal, calculated as the average distance between the drill center and the connections to the plane. No thermal connections are reported on positive layers if the value is negative or zero.

Spoke Count



Sliver

Short Sliver

v_min_sliver_perim Minimal distance between the measurement segment endpoints along the net. (For a description of perimeter, see Slivers and Short Slivers Categories).

Sliver

Short Sliver


Controls whether to contourize in positive layers.

yes — a connected group of copper features are contourized and considered a plane. (default)

no — each copper feature of type surface is considered a plane.

Plane Width

Plane Disconnection






Controls which of three algorithms is used to determine sliver violations.




Sliver

Short Sliver

v_thermal_as_clearance

Controls whether to relate to thermals on the plane as clearances.

yes — Considers the area of a thermal as a clearance feature. (default)

no — Considers thermals as a group of holes in copper,

each spoke separately.

Plane Width

Plane Disconnection





October 2016


Chapter 5Solder Mask Checks

Solder Mask Checks is a read-only check of solder mask layers for potential manufacturability defects. This action relates to a solder mask layer, and the drill and external copper layers associated with it. It operates on a single solder mask layer per side (single top, single bottom) at a time. If more than one are selected, the action will not analyze any. This action also checks solder paste layers to detect SMDs without paste and compare the negative annular ring (gasket) of the SMD pad with the paste pad.

Solder mask layers are always assumed to be negative; that is, all positive features describe clearances or the absence of solder masks.

This action also checks if solder paste has been deposited on all SMD pads. (See Missing SMD Clearance (Missing).)

Access: Analysis > Fabrication > Solder Mask Checks.


Solder Mask Checks

October 2016

Solder Mask Checks Action Screen:

Tests Performed in Solder Mask Checks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 321

SM ERF Variables - Compatibility with Earlier Products . . . . . . . . . . . . . . . . . . . . . . . 323

Attributes Used in Solder Mask Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 323

Polarity for Solder Mask Layers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 323

Example of Rout Spacing of Zero . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324

Categories in Solder Mask Checks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 328PTH Annular Ring (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 331NPTH Annular Ring (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 332Via Annular Ring (Drill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 334NPTH Touches Mask (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 335PTH Gasket (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 336Via Gasket (Drill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 337SMD Annular Ring (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 338Pad Annular Ring (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 339BGA Pad Annular Ring (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 340PTH Pad Annular Ring (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 341NPTH Pad Annular Ring (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 342Via Pad Annular Ring (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 343Undrilled Pad Annular Ring (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 344

Solder Mask ChecksTests Performed in Solder Mask Checks


SMD Pad Gasket (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 345PTH Pad Gasket (Pads). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 346NPTH Pad Gasket (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 347Via Pad Gasket (Pads) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 348Undrilled Pad Gasket (Pads). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 349Coverage (Coverage) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 350Too Large Nets (Coverage) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 351Exposed Plane (Coverage) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 352Rout Spacing (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 353Missing Rout Clearance (Rout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 354No Bridge (Bridge) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 355No Bridge Same Net (Bridge) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 356SM Sliver (Sliver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 357SM Short Sliver (Sliver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 358Missing SMD Clearance (Missing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 359Missing Undrilled Pad Clearance (Missing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 360Missing NPTH Clearance (Missing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 361Missing PTH Clearance (Missing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 362Missing Via Clearance (Missing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 363Missing Testpoint Clearance (Missing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 364Pad to Pad Spacing (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 365Pad to Non-Pad Spacing (Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 366Non-Pad to Non-Pad (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 367Toeprint Pad to Fiducial Pad (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 368Toeprint Pad to Non-Fiducial (Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 369Extra SM - Missing Copper (Extra) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 370Extra SM - Missing Pad (Extra) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 371Gang Soldermask Relief . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 371

Results Attributes for Solder Mask Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 373

ERF Parameters for Solder Mask Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 376

ERF Variables for Solder Mask Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 378

Tests Performed in Solder Mask ChecksThe tests that are listed in the ERF parameter pp_tests in the ERF model, or are indicated in the Test List when the analysis is run, control to which categories results are reported.

Test Explanation

Drill Reports close distances to solder mask openings of PTH/NPTH annular rings, and where NPTH touches mask.


Solder Mask ChecksTests Performed in Solder Mask Checks

October 2016

Pads Reports close distances to solder mask openings of all pads, including undrilled pads. It also reports on gaskets.

• Annular Ring categories — These categories report pad annular ring results. If ERF variable classify_pad_ar = 1, annular ring results are reported in categories specific to pad types: PTH Pads, NPTH Pads, Via Pads and Non-Drilled Pads.

Annular ring categories do not report a pad (or drill) completely covered by solder mask. Zero annular ring might be reported if a solder mask clearance and a pad drill overlap, but neither includes the other.

• Gasket categories — These categories report on measurements of gasket annular rings. Gaskets are overlapping sections of solder mask onto board features, such as pads. This makes the solder mask opening smaller than the pad.

The system measures this by assuming a negative annular ring—an annular ring that dips into the pad rather than extends beyond it. To activate the gasket categories (to consider negative annular rings) set ERF variable categorize_negative_ar = 1. When categorize_negative_ar = 0, the system globally assigns a zero value to all negative annular rings and they are reported to Pad Annular Ring (Pads).

This figure illustrates a gasket:

Coverage Reports lines too close to clearances (that is, not adequately covered).

Rout Reports close distances between solder mask and rout features.

Bridge Reports different net pads without solder mask bridges.

Sliver Reports slivers between solder mask clearances.

Missing Reports missing clearances.

Spacing Reports close spaces between clearances (wider than sliver).

Test Explanation

Solder Mask ChecksSM ERF Variables - Compatibility with Earlier Products


SM ERF Variables - Compatibility with Earlier Products

To maintain compatibility between earlier products and Valor NPI, these ERF variables are mapped:

Attributes Used in Solder Mask ChecksAttributes assigned to the features of the product model control how the analysis tests these entities.

Feature Attributes

Polarity for Solder Mask LayersFeatures on a positive layer are considered copper. Features on a negative layer are considered clearances. This is true for every layer except the solder mask layer.

Extra Reports solder mask features which lack copper pads, or do not intersect with copper.

Table 5-1. Solder Mask Checks ERF Compatibility Mapping


cover_check_same_net = 0

cover_check_same_net = 1

cover_ignore_same_net = 1

cover_ignore_same_net = 0



classify_pad_ar = 2 classify_pad_ar = 1

Table 5-2. Solder Mask Checks Feature Attributes


Drill Type This attribute is attached to hole features in drill layers. It defines the type of the drill and is used extensively during fabrication analysis.

SMD Pad This attribute is attached to outer layer pads which are lands for SMD components. It is set by the ‘Set SMD Attribute’ Cleanup Action.

Test Explanation


Solder Mask ChecksExample of Rout Spacing of Zero

October 2016

Though solder mask is defined as positive, the system considers it negative and its features are considered clearances. Therefore, the solder mask layer should be set to positive in the job matrix. If defined as negative, it may result in incorrect results and long analysis.

Example of Rout Spacing of ZeroWhen a rout segment is missing rout clearance, but the start point and end point of the segment do have acceptable clearance, the segment is not considered to be missing rout clearance. rather, the segment is considered to have rout spacing of zero..

This example illustrates situations that are reported to each of these categories:

• “Rout Spacing (Rout)” on page 353

• “Missing Rout Clearance (Rout)” on page 354

Consider the missing rout clearance for the rout segment circled in yellow in the graphic. It might be expected that this issue would be reported to category Missing Rout Clearance. But



because the start and end point of the rout does have acceptable clearance, the Rout Spacing for the segment is actually zero.

Zooming in to the graphic reveals two marks.

The marks report a Rout Spacing to solder mask of 0.



October 2016

This is similar to the results at the bottom of the same section of rout. Here the rout spacing to solder mask is also 0.

When you remove the soldermask openings from both sides of the rout segment, the entire segment is missing rout clearance and therefore the segment is reported to category Missing

Rout Clearance.

But the rout arcs are still not reported to Missing Rout Clearance.



The rout arcs are now being reported with a rout spacing of 0. Previously, they were not reported.

This is because one of the ends of the arc is still exposed, but leads to a Rout Spacing of 0.


Solder Mask ChecksCategories in Solder Mask Checks

October 2016

Categories in Solder Mask ChecksThe full name of the category and its test group serves as the title of the category. Each category is described in detail, accompanied by an example of a typical measurement.

The ERF parameter pp_layer affects all categories, and is not repeated in the category fact sheets.


Table 5-3. Solder Mask Checks Categories


PTH Annular Ring (Drill) Reports distances less than pp_ar between PTHs and solder mask in negative layers.

NPTH Annular Ring (Drill) Reports distances less than pp_ar between NPTHs and solder mask in negative layers.

Via Annular Ring (Drill) Reports distances less than pp_ar between vias and solder mask in negative layers.

NPTH Touches Mask (Drill) Reports cases in which the NPTH touches the solder mask, if the NPTH is not contained in a solder mask clearance, or if there is no clearance at all.

PTH Gasket (Drill) Reports SM to PTH gaskets narrower than pp_ar.

Via Gasket (Drill) Reports all SM to via gaskets (negative AR) narrower than pp_ar.

SMD Annular Ring (Pads) Reports distances less than pp_ar between SMD pads with attribute SMD Pad and solder mask.

Pad Annular Ring (Pads) Reports non-SMD pad to solder mask distances less than pp_ar.

BGA Pad Annular Ring (Pads)

Reports distances from BGA pads to solder mask less than pp_ar.

PTH Pad Annular Ring (Pads)

Reports PTH pad to solder mask distances less than pp_ar.

NPTH Pad Annular Ring (Pads)

Reports NPTH pad to solder mask distances less than pp_ar.

Via Pad Annular Ring (Pads)

Reports via pad to solder mask distances less than pp_ar.

Undrilled Pad Annular Ring (Pads)

Reports undrilled pad to solder mask distances less than pp_ar.

SMD Pad Gasket (Pads) Reports SMD pad gaskets narrower than pp_ar.



PTH Pad Gasket (Pads) Reports PTH pad gaskets narrower than pp_ar.

NPTH Pad Gasket (Pads) Reports NPTH pad gaskets narrower than pp_ar.

Via Pad Gasket (Pads) Reports via pad gaskets narrower than pp_ar.

Undrilled Pad Gasket (Pads) Reports pad gaskets of undrilled pads, not bearing attribute SMD Pads, narrower than pp_ar.

Coverage (Coverage) Reports traces or other circuit features closer than pp_coverage or touching a solder mask clearance that exposes a pad belonging to another net.

Too Large Nets (Coverage) Reports both solder mask and signal layer nets where the number of elements in the solder mask layer net being tested exceeds v_max_net_size.

Exposed Plane (Coverage) Reports exposed areas at the edge of the plane if such areas are not connected to pads or traces.

Rout Spacing (Rout) Reports distances smaller than pp_sm2r between rout features and solder mask.

Missing Rout Clearance (Rout)

Reports rout features whose compensated routs do not have corresponding clearances.

No Bridge (Bridge) Reports distances less than the pp_bridge between pads (at least one of which is a non-SMD pad) whose solder mask clearances touch.

No Bridge Same Net (Bridge)

Reports distances less than the pp_bridge between pads of the same net (at least one of which is a non-SMD pad) whose solder mask clearances touch.

SM Sliver (Sliver) Reports slivers between two solder mask clearances.

SM Short Sliver (Sliver) Reports slivers between two solder mask clearances.

Missing SMD Clearance (Missing)

Reports SMD pads that neither include, nor are included, in any solder mask clearances.

Missing Undrilled Pad Clearance (Missing)

Reports undrilled pads that neither include, nor are included in, any solder mask clearances.

Missing NPTH Clearance (Missing)

Reports NPTHs that do not touch any solder mask clearances.

Missing PTH Clearance (Missing)

Reports PTHs that do not touch any solder mask clearances.

Missing Via Clearance (Missing)

Reports vias that do not touch any solder mask clearances. At such locations, the via is covered by solder mask.

Table 5-3. Solder Mask Checks Categories (cont.)




October 2016

Missing Testpoint Clearance (Missing)

Reports testpoint pads that neither include, nor are included, in any solder mask clearance.

Pad to Pad Spacing (Spacing)

Reports distances between pads in solder mask layers closer than pp_spacing.

Pad to Non-Pad Spacing (Spacing)

Reports distances between pads and non-pads in solder mask layers closer than pp_spacing.

Non-Pad to Non-Pad (Spacing)

Reports distances between non-pad features in solder mask layers closer than pp_spacing.

Toeprint Pad to Fiducial Pad (Spacing)

Reports distances between unconnected toeprint pads and fiducial pads in solder mask layers closer than pp_spacing.

Toeprint Pad to Non-Fiducial (Spacing)

Reports distances between unconnected toeprint pads and any other feature in the solder mask layers, closer than pp_spacing.

Extra SM - Missing Copper (Extra)

Reports solder mask features which do not intersect with copper.

Extra SM - Missing Pad (Extra)

Reports solder mask features that do not have copper pads.

Gang Soldermask Relief Reports solder mask features fully exposing v_gang_relief_min or more pads.

Table 5-3. Solder Mask Checks Categories (cont.)


Solder Mask ChecksPTH Annular Ring (Drill)


PTH Annular Ring (Drill)Reports distances less than pp_ar between PTHs and solder mask in negative layers.

Analysis Category <area>:ar_pth

Measurement Shape

Measurement ID

Segment

Pad (representing the PTH)

Layers Displayed Solder mask layer

Drill layer

Graphic

Purpose The area in and around a plated through hole should be clear of mask, enabling the solder wave to completely fill the hole around the component pin.

Function Reports distances less than pp_ar between PTHs and solder mask in negative layers. Measurements are segments corresponding to the minimal distance between drill and clearance outline.

ERF Parameters pp_ar


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Limitations


Solder Mask ChecksNPTH Annular Ring (Drill)

October 2016

NPTH Annular Ring (Drill)Reports distances less than pp_ar between NPTHs and solder mask in negative layers.

Analysis Category <area>:ar_npth

Measurement Shape

Measurement ID

Segment

Pad (representing the NPTH)


Drill layer

Graphic

Function Reports distances less than pp_ar between NPTHs and solder mask in negative layers, in these situations:

• The drill is completely within the clearance (first graphic). Measurements are segments corresponding to the minimal distance between the drill and the clearance outline.

• The drill is partly within the clearance (second graphic). The drill is reported with a zero value.

• The drill extends into the annular ring (third graphic).NPTH drills are assumed to be drilled through a solder mask opening and require a large clearance.

See also “NPTH Touches Mask (Drill)” on page 335



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Solder Mask ChecksNPTH Annular Ring (Drill)


Limitations


Solder Mask ChecksVia Annular Ring (Drill)

October 2016

Via Annular Ring (Drill) Reports distances less than pp_ar between vias and solder mask in negative layers.

Analysis Category <area>:ar_via

Measurement Shape

Measurement ID

Segment

Pad (representing the via)


Drill layer

Graphic

Purpose The area in and around a via should be clear of mask, enabling the solder wave to completely fill the hole around the component pin.

Function Reports distances less than pp_ar between vias and solder mask in negative layers. Measurements are segments corresponding to the minimal distance between drill and clearance outline.



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Limitations

Solder Mask ChecksNPTH Touches Mask (Drill)


NPTH Touches Mask (Drill)Reports cases in which the NPTH touches the solder mask, if the NPTH is not contained in a solder mask clearance, or if there is no clearance at all.

Analysis Category <area>:npth2m

Measurement Shape

Measurement ID

Zero length segment at drill center



Drill layer

Graphic

Function Reports these cases in which the NPTH touches the solder mask:

• The NPTH is not contained in a solder mask clearance (has non-negative annular ring of clearance). In the first graphic, the drill is larger than the clearance.

• There is no clearance at all. In the second graphic, the drill touches the clearance.

If the drill is partly inside the clearance, the violation is reported to category NPTH Annular Ring (Drill). See “NPTH Annular Ring (Drill)” on page 332.

ERF Parameters


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Limitations


Solder Mask ChecksPTH Gasket (Drill)

October 2016

PTH Gasket (Drill)Reports SM to PTH gaskets narrower than pp_ar.

Analysis Category <area>:neg_ar_pth

Measurement Shape

Measurement ID

Segment

Solder mask clearance; Drill


Drill layer

Graphic

Purpose To identify PTH drills whose SM gaskets are too narrow.

Function Reports all SM to PTH gaskets (negative AR) narrower than pp_ar.



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Limitations

Solder Mask ChecksVia Gasket (Drill)


Via Gasket (Drill)Reports all SM to via gaskets (negative AR) narrower than pp_ar.

Analysis Category <area>:neg_ar_via

Measurement Shape

Measurement ID

Segment

Solder mask clearance; Drill


Drill layer

Graphic

Purpose To identify via drills whose SM gaskets are too narrow.

Function Reports all SM to via gaskets (negative AR) narrower than pp_ar.



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Limitations


Solder Mask ChecksSMD Annular Ring (Pads)

October 2016

SMD Annular Ring (Pads)Reports distances less than pp_ar between SMD pads with attribute SMD Pad and solder mask.

Analysis Category <area>:ar_smd

Measurement Shape

Measurement ID

Segment

Pad (representing the SMD); Pad (for clearance)


External copper layer

Graphic

Purpose SMD pads must be free of mask but typically with a smaller annular ring than plated through hole pads. This is why they have their own category.

Function Reports distances less than pp_ar between SMD pads with attribute SMD Pad and solder mask. Measurements are segments corresponding to the minimal distance between SMD pad and clearance outline.


ERF Variables categorize_negative_ar = 0

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Limitations If the clearance is drawn, the clearance entity will be r0 because no single feature corresponds to the clearance.

Solder mask gaskets (clearance smaller than the pad) are reported as zero annular ring. For actual “negative” annular ring values for gaskets, categorize_negative_ar must be set to 1. Then gaskets are reported in this category.

Solder Mask ChecksPad Annular Ring (Pads)


Pad Annular Ring (Pads)Reports non-SMD pad to solder mask distances less than pp_ar.

Analysis Category <area>:ar_pad

Measurement Shape

Measurement ID

Segment

Pad (representing the SMD); Pad (for clearance)



Graphic

Function Reports non-SMD pad to solder mask distances less than pp_ar. Measurements are segments corresponding to the minimal distance between pad and clearance outline.


ERF Variables classify_pad_ar = 0

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Limitations


Solder Mask ChecksBGA Pad Annular Ring (Pads)

October 2016

BGA Pad Annular Ring (Pads)Reports distances from BGA pads to solder mask less than pp_ar.

Analysis Category <area>:ar_bga

Measurement Shape

Measurement ID

Segment

Pad (representing the BGA); Pad (for clearance)



Graphic

Function Reports distances from BGA pads—copper pad with attribute .bga—to solder mask less than pp_ar. Measurements are segments corresponding to the minimal distance between pad and clearance outline.



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Limitations

Solder Mask ChecksPTH Pad Annular Ring (Pads)


PTH Pad Annular Ring (Pads)Reports PTH pad to solder mask distances less than pp_ar.

Analysis Category <area>:ar_pth_pad

Measurement Shape

Measurement ID

Segment

Two pads (one representing the pad; the other, the clearance)



Graphic

Function Reports PTH pad to solder mask distances less than pp_ar. Measurements are segments corresponding to the minimal distance between pad and clearance outline.



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Limitations


Solder Mask ChecksNPTH Pad Annular Ring (Pads)

October 2016

NPTH Pad Annular Ring (Pads)Reports NPTH pad to solder mask distances less than pp_ar.

Analysis Category <area>:ar_npth_pad

Measurement Shape

Measurement ID

Segment




Graphic

Function Reports NPTH pad to solder mask distances less than pp_ar. Measurements are segments corresponding to the minimal distance between pad and clearance outline.



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Limitations

Solder Mask ChecksVia Pad Annular Ring (Pads)


Via Pad Annular Ring (Pads)Reports via pad to solder mask distances less than pp_ar.

Analysis Category <area>:ar_via_pad

Measurement Shape

Measurement ID

Segment




Graphic

Function Reports via pad to solder mask distances less than pp_ar. Measurements are segments corresponding to the minimal distance between pad and clearance outline.



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Limitations


Solder Mask ChecksUndrilled Pad Annular Ring (Pads)

October 2016

Undrilled Pad Annular Ring (Pads)Reports undrilled pad to solder mask distances less than pp_ar.

Analysis Category <area>:ar_ndrl_pad

Measurement Shape

Measurement ID

Segment




Graphic

Function Reports undrilled pad to solder mask distances less than pp_ar. Such a feature could be a testpoint pad, fiducial, non-SMD or non-drill pad.Measurements are segments corresponding to the minimal distance between pad and clearance outline.



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Limitations

Solder Mask ChecksSMD Pad Gasket (Pads)


SMD Pad Gasket (Pads)Reports SMD pad gaskets narrower than pp_ar.

Analysis Category <area>:neg_ar_smd

Measurement Shape

Measurement ID

Segment

Two pads

Layers Displayed External copper layer

Solder mask layers

Graphic

Function Reports SMD pad gaskets narrower than pp_ar.



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Limitations


Solder Mask ChecksPTH Pad Gasket (Pads)

October 2016

PTH Pad Gasket (Pads)Reports PTH pad gaskets narrower than pp_ar.

Analysis Category <area>:neg_ar_pth_pad

Measurement Shape

Measurement ID

Segment

Two pads

Layers Displayed External copper

Solder mask layers

Graphic

Function Reports PTH pad gaskets narrower than pp_ar.



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Limitations

Solder Mask ChecksNPTH Pad Gasket (Pads)


NPTH Pad Gasket (Pads)Reports NPTH pad gaskets narrower than pp_ar.

Analysis Category <area>:neg_ar_npth_pad

Measurement Shape

Measurement ID

Segment

Two pads


Solder mask layers

Graphic

Function Reports NPTH pad gaskets narrower than pp_ar.



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Limitations


Solder Mask ChecksVia Pad Gasket (Pads)

October 2016

Via Pad Gasket (Pads)Reports via pad gaskets narrower than pp_ar.

Analysis Category <area>:neg_ar_via_pad

Measurement Shape

Measurement ID

Segment

Two pads


Solder mask layers

Graphic

Function Reports via pad gaskets narrower than pp_ar.



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Limitations

Solder Mask ChecksUndrilled Pad Gasket (Pads)


Undrilled Pad Gasket (Pads)Reports pad gaskets of undrilled pads, not bearing attribute SMD Pads, narrower than pp_ar.

Analysis Category <area>:neg_ar_ndrl_pad

Measurement Shape

Measurement ID

Segment

Two pads


Solder mask layers

Graphic

Function Reports pad gaskets of undrilled pads, not bearing attribute SMD Pads, narrower than pp_ar.



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Limitations


Solder Mask ChecksCoverage (Coverage)

October 2016

Coverage (Coverage)Reports traces or other circuit features closer than pp_coverage or touching a solder mask clearance that exposes a pad belonging to another net.

Analysis Category <area>:coverage

Measurement Shape

Measurement ID

Segment

Spacing; Clearance

Layers Displayed Solder mask


Graphic

Purpose Lines which pass close to a pad must be fully covered by mask to avoid solder bridging between line and pad during the assembly process.

Function Reports traces (or any other circuit features) closer than pp_coverage or touching a solder mask clearance that exposes a pad belonging to another net.

Typically, each clearance has a signal intersecting it, a trace that touches exposed copper. If it does not connect to an inner pad, it is considered a violation.

Unexposed copper, too close to a SM clearance with no exposed copper within, is always reported in this category.

ERF Parameters pp_coverage

ERF Variables cover_dist_to_cu

cover_ignore_same_net

cover_ignore_intersection

cover_special_check

v_report_proximity

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations To avoid false alarms near SMD picture frame openings and drawn areas, a filter is applied. If the distance to the other net exposed copper is greater than 1.5 times pp_coverage, the measurement is filtered. This causes coverage violations in oversized clearances to go unreported.

Solder Mask ChecksToo Large Nets (Coverage)


Too Large Nets (Coverage)Reports both solder mask and signal layer nets where the number of elements in the solder mask layer net being tested exceeds v_max_net_size.

Analysis Category <area>:too_large_nets

Measurement Shape

Measurement ID

Shape


Graphic

Function Reports both solder mask and signal layer nets where the number of elements in the solder mask layer net being tested exceeds v_max_net_size. In this case, the solder mask net is not tested (large nets are usually not a problem). You may check the net manually.

ERF Parameters

ERF Variables v_max_net_size

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Solder Mask ChecksExposed Plane (Coverage)

October 2016

Exposed Plane (Coverage)Reports exposed areas at the edge of the plane if such areas are not connected to pads or traces.

Analysis Category <area>:exposed_plane

Measurement Shape

Measurement ID

Exposed part of the plane

Clearance; Plane



Graphic

Purpose Area of plane disconnected from pads/traces must be fully covered by mask to avoid solder bridging between the plane and neighboring copper.

Function Reports exposed areas at the edge of the plane if such areas are not connected to pads or traces. If more than one area of the plane is exposed by the same SM clearance, reports such areas regardless of connection to pads/traces.

ERF Parameters

ERF Variables

Limitations

Solder Mask ChecksRout Spacing (Rout)


Rout Spacing (Rout)Reports distances smaller than pp_sm2r between rout features and solder mask.

Analysis Category <area>:rout

Measurement Shape

Measurement ID

Segment

Rout feature


Rout layer

Graphic

Purpose The rout path should be free of solder mask to avoid the generation of residual pieces during the routing process.

Function Reports distances smaller than pp_sm2r between rout features and solder mask.

This category reports rout features that are too close to solder mask or are partly covered by solder mask.

If a rout feature is completely covered by solder mask, the result is reported to this category with a distance of zero, and the result is also reported to category Missing Rout Clearance.

For an example of a situation where a line segment is missing rout clearance but the start and end points of the rout have acceptable clearance, see “Example of Rout Spacing of Zero” on page 324.

ERF Parameters pp_sm2r



v_fab_drc_by_area

Limitations Compensated and non-compensated rout shapes are considered equal.


Solder Mask ChecksMissing Rout Clearance (Rout)

October 2016

Missing Rout Clearance (Rout)Reports rout features whose compensated routs do not have corresponding clearances.

Analysis Category <area>:rout_clearance

Measurement Shape

Measurement ID

Segment

Rout feature

Layers Displayed Solder mask

Rout layers

Graphic

Purpose The rout path should be free of solder mask to avoid the generation of residual pieces during the routing process.

Function Reports rout features whose compensated routs do not have corresponding clearances.

If a rout feature is completely covered by solder mask, the result is reported to this category.

Rout features that are too close to solder mask or are partly covered by solder mask are reported to category Rout Spacing.

For every missing clearance violation reported, a Rout Spacing (Rout) violation of distance 0 is also reported.

For an example of a situation where a line segment is missing rout clearance but the start and end points of the rout have acceptable clearance, see “Example of Rout Spacing of Zero” on page 324.

ERF Parameters pp_sm2r



v_fab_drc_by_area

Limitations A rout feature for which the start point and end point of the skeleton are both within the solder mask is reported to this category. In some cases, the entire skeleton might not actually be covered with solder mask.

Solder Mask ChecksNo Bridge (Bridge)


No Bridge (Bridge)Reports distances less than the pp_bridge between pads (at least one of which is a non-SMD pad) whose solder mask clearances touch.

Analysis Category <area>:no_bridge

Measurement Shape

Measurement ID

Segment

Two pads


Corresponding external layer

Graphic

Purpose Pads which are too close should be separated with a small dam of mask to protect against solder bridging.

Function Reports distances less than the pp_bridge between pads (at least one of which is a non-SMD pad) whose solder mask clearances touch. That is, two different net pads without a solder mask bridge between them. Measurements are segments between pads.

If pp_bridge = 0, the value set in pp_ar is used.

ERF Parameters pp_bridge

pp_ar


v_fab_drc_by_area

Limitations The value of pp_ar must be increased to at least twice the nominal annular ring value for this check to report any violations. This may slowdown the annular ring check.


Solder Mask ChecksNo Bridge Same Net (Bridge)

October 2016

No Bridge Same Net (Bridge)Reports distances less than the pp_bridge between pads of the same net (at least one of which is a non-SMD pad) whose solder mask clearances touch.

Analysis Category <area>:no_bridge_same_net

Measurement Shape

Measurement ID

Segment

Two pads


Corresponding external layer

Graphic

Purpose Pads which are too close should be separated with a small dam of mask to protect against solder bridging.

Function Reports distances less than the pp_bridge between pads of the same net (at least one of which is a non-SMD pad) whose solder mask clearances touch. (Each pad must have its own SM pad.) That is, two pads of the same net without a solder mask bridge between them. Measurements are segments between pads.

If pp_bridge = 0, the value set in pp_ar is used.

ERF Parameters pp_bridge

pp_ar


v_fab_drc_by_area

Limitations The value of pp_ar must be increased to at least twice the nominal annular ring value for this check to report any violations. This may slowdown the annular ring check.

Solder Mask ChecksSM Sliver (Sliver)


SM Sliver (Sliver)Reports slivers between two solder mask clearances.


Measurement Shape

Measurement ID

Segment

None


Graphic

Purpose Tiny solder mask slivers can detach during processing and cause a short or damage.

Function Both the ‘Sliver’ and ‘Short Sliver’ categories report slivers between two solder mask clearances. A violation is reported if silver width is less than pp_sliver, and non-zero. v_dist2sliver_ratio and v_min_sliver_perim define slivers. See “Slivers and Short Slivers Categories” on page 38.


ERF Parameters pp_sliver - maximum sliver width.

ERF Variables v_sliver_algorithm_mode

v_dist2sliver_ratio

v_min_sliver_perim

v_max_net_size


v_min_sliver_len

v_fab_drc_map_layer

v_fab_drc_by_area

Related Category SM Short Sliver (Sliver)


Solder Mask ChecksSM Short Sliver (Sliver)

October 2016

SM Short Sliver (Sliver)Reports slivers between two solder mask clearances.


Measurement Shape

Measurement ID

Segment

None


Graphic

Purpose Tiny solder mask slivers can detach during processing and cause a short or damage.

Function Both the ‘Sliver’ and ‘Short Sliver’ categories report slivers between two solder mask clearances. A violation is reported if silver width is less than pp_sliver, and non-zero. v_dist2sliver_ratio and v_min_sliver_perim define slivers. See “Slivers and Short Slivers Categories” on page 38.

v_slivers_check_diff_net used in ‘sliver’ (Signal Layers Checks), is irrelevant here.



v_dist2sliver_ratio

v_min_sliver_perim

v_max_net_size


v_min_sliver_len

v_fab_drc_map_layer

v_fab_drc_by_area

Related Category SM Sliver (Sliver)

Solder Mask ChecksMissing SMD Clearance (Missing)


Missing SMD Clearance (Missing)Reports SMD pads that neither include, nor are included, in any solder mask clearances.

Analysis Category <area>:smd_miss

Measurement Shape

Measurement ID

Square

Pad


Matching external copper layer

Graphic

Function Reports SMD pads that neither include, nor are included, in any solder mask clearances. At such locations the SMD pad is covered by solder mask. Measurements are squares or bounding boxes (representing SMD pads). For every missing clearance violation reported, a Rout Spacing (Rout) violation of distance 0 is also reported.

This category is also useful for checking the existence of solder paste for each SMD pad in the solder paste layer.

ERF Parameters


v_fab_drc_by_area

Limitations


Solder Mask ChecksMissing Undrilled Pad Clearance (Missing)

October 2016

Missing Undrilled Pad Clearance (Missing)Reports undrilled pads that neither include, nor are included in, any solder mask clearances.

Analysis Category <area>:ndrl_miss

Measurement Shape

Measurement ID

Square

Pad



Graphic

Function Reports undrilled pads that neither include, nor are included in, any solder mask clearances. At such locations, the undrilled pad is covered by solder mask. Measurements are squares or bounding boxes (representing undrilled pads). For every missing clearance violation reported, a rout spacing violation of distance 0 is also reported.

ERF Parameters


v_fab_drc_by_area

Limitations

Solder Mask ChecksMissing NPTH Clearance (Missing)


Missing NPTH Clearance (Missing)Reports NPTHs that do not touch any solder mask clearances.

Analysis Category <area>:npth_miss

Measurement Shape

Measurement ID

Circle

Pad



Graphic

Function Reports NPTHs that do not touch any solder mask clearances. At such locations, the NPTH is covered by solder mask. Measurements are circles representing NPTHs. For every missing clearance violation reported, a Rout Spacing (Rout) violation of distance 0 is also reported.

ERF Parameters

ERF Variables v_report_only_one_side_sm

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations If an NPTH touches a solder mask clearance even at a single point, it is reported as zero annular ring rather than as a missing NPTH clearance.


Solder Mask ChecksMissing PTH Clearance (Missing)

October 2016

Missing PTH Clearance (Missing)Reports PTHs that do not touch any solder mask clearances.

Analysis Category <area>:pth_miss

Measurement Shape

Measurement ID

Circle

Pad


Matching drill layer

Graphic

Function Reports PTHs that do not touch any solder mask clearances. At such locations, the PTH is covered by solder mask. Measurements are forms representing PTHs. For every missing clearance violation reported, a Rout Spacing (Rout) violation of distance 0 is also reported.

ERF Parameters


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations If a PTH touches a solder mask clearance even at a single point, it is reported as zero annular ring rather than as a missing PTH clearance.

Solder Mask ChecksMissing Via Clearance (Missing)


Missing Via Clearance (Missing)Reports vias that do not touch any solder mask clearances. At such locations, the via is covered by solder mask.

Analysis Category <area>:via_miss

Measurement Shape

Measurement ID

Circle

Pad



Graphic

Function Reports vias that do not touch any solder mask clearances. At such locations, the via is covered by solder mask. For every missing clearance violation reported, a Rout Spacing (Rout) violation of distance 0 is also reported.

This category is normally disabled through the default setting of ignore_miss_via = 1. The reasoning is that vias are supposed to be covered by solder mask. For cases where vias are supposed to be exposed, the check can be activated by setting ignore_miss_via = 0.

ERF Parameters


ignore_miss_via = 0

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations If a via touches a solder mask clearance even at a single point, it is reported as zero annular ring rather than as a missing via clearance.


Solder Mask ChecksMissing Testpoint Clearance (Missing)

October 2016

Missing Testpoint Clearance (Missing)Reports testpoint pads that neither include, nor are included, in any solder mask clearance.

Analysis Category <area>:tp_miss

Measurement Shape

Measurement Value

Measurement ID

Pad (or its bounding box)

Pad size



Graphic

Purpose Testpoint pads require solder mask clearances so that the testing probe comes in contact with the copper pad.

Function Reports testpoint pads that neither include, nor are included, in any solder mask clearance. For every missing clearance violation reported, a Rout Spacing (Rout) violation of distance 0 is also reported.

ERF Parameters

ERF Variables full_tp_exposure

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Solder Mask ChecksPad to Pad Spacing (Spacing)


Pad to Pad Spacing (Spacing)Reports distances between pads in solder mask layers closer than pp_spacing.

Analysis Category <area>:pad_to_pad

Measurement Shape

Measurement ID

Segment

Two pads


Graphic

Function Reports distances between pads in solder mask layers closer than pp_spacing.



v_fab_drc_by_area

Limitations


Solder Mask ChecksPad to Non-Pad Spacing (Spacing)

October 2016

Pad to Non-Pad Spacing (Spacing)Reports distances between pads and non-pads in solder mask layers closer than pp_spacing.

Analysis Category <area>:pad_to_non

Measurement Shape

Measurement ID

Segment

Two pads


Graphic

Function Reports distances between pads and non-pads in solder mask layers closer than pp_spacing.

In the figure, the distance is between a pad opening over a signal layer pad and a line clearance over a rout.



v_fab_drc_by_area

Limitations

Solder Mask ChecksNon-Pad to Non-Pad (Spacing)


Non-Pad to Non-Pad (Spacing)Reports distances between non-pad features in solder mask layers closer than pp_spacing.

Analysis Category <area>:non_to_non

Measurement Shape

Measurement ID

Segment

Two pads


Graphic

Function Reports distances between non-pad features in solder mask layers closer than pp_spacing.



v_fab_drc_by_area

Limitations


Solder Mask ChecksToeprint Pad to Fiducial Pad (Spacing)

October 2016

Toeprint Pad to Fiducial Pad (Spacing)Reports distances between unconnected toeprint pads and fiducial pads in solder mask layers closer than pp_spacing.

Analysis Category <area>:pad_toep_2_pad_fid

Measurement Shape

Measurement ID

Segment

Two pads

Layers Displayed • Solder mask layer• Relevant copper layer

Graphic

Function Reports distances between unconnected toeprint pads with attribute Pad Usage = toeprint and fiducial pads with attribute Pad Usage=l_fiducial or g_figucial in solder mask layers closer than pp_spacing. If the solder mask pad is not assigned attribute Pad Usage, the attribute of the touching copper pad is used.



v_fab_drc_by_area

Limitations

Solder Mask ChecksToeprint Pad to Non-Fiducial (Spacing)


Toeprint Pad to Non-Fiducial (Spacing)Reports distances between unconnected toeprint pads and any other feature in the solder mask layers, closer than pp_spacing.

Analysis Category <area>:pad_toep_2_any

Measurement Shape

Measurement ID

Segment

Two pads


Graphic

Function Reports distances between unconnected toeprint pads with attribute Pad Usage = toeprint and any other feature in the solder mask layers closer than pp_spacing. If the solder mask pad is not assigned attribute Pad Usage, the attribute of the touching copper pad is used.



v_fab_drc_by_area

Limitations Does not report measurements between two toeprint pads. These are reported in Pad to Pad Spacing (Spacing).


Solder Mask ChecksExtra SM - Missing Copper (Extra)

October 2016

Extra SM - Missing Copper (Extra)Reports solder mask features which do not intersect with copper.

Analysis Category <area>:ext_sm_copper_miss

Measurement Shape

Measurement Value

Measurement ID

Solder mask pad

Solder mask pad size


Signal layer

Purpose Solder mask pads which do not intersect with copper may indicate faulty design.

Function Reports solder mask features which do not intersect with copper.

ERF Parameters


v_fab_drc_by_area

Limitations

Solder Mask ChecksExtra SM - Missing Pad (Extra)


Extra SM - Missing Pad (Extra)Reports solder mask features that do not have copper pads.

Gang Soldermask ReliefReports solder mask features fully exposing v_gang_relief_min or more pads.

Analysis Category <area>:ext_sm_pad_miss

Measurement Shape

Measurement Value

Measurement ID

Solder mask pad

Solder mask pad size


Signal layer

Graphic

Purpose Solder mask pads without copper pads may indicate faulty design.

Function Reports solder mask features that do not have copper pads.

A soldermask feature with more fully exposed copper pads than the number set in v_gang_relief_min, or exactly that number, is considered to be a gang soldermask relief and is reported to category Gang Soldermask Relief, and not to this category.

ERF Parameters

ERF Variables v_sm2pad_tolerance

v_fab_drc_map_layer

v_fab_drc_by_area

v_gang_relief_min

Limitations

Analysis Category <area>:gang_relief


Solder Mask ChecksGang Soldermask Relief

October 2016

Measurement Shape

Measurement Value

Measurement ID

Solder mask pad

Number of fully exposed copper pads

Solder mask clearance


Signal layer

Graphic

Purpose Gang solder reliefs are created by designers intentionally, to expose multiple pads by a single clearance. Unlike single clearances, gang solder reliefs are not close in size to the exposed pads.

Function Reports solder mask features fully exposing v_gang_relief_min or more pads.

If the Extra test is run, a soldermask feature with fewer fully exposed copper pads than the number set in v_gang_relief_min is not considered to be a gang soldermask relief, and is reported to category Extra SM - Missing Pad, and not to this category.

This category is not related to a specific test.

ERF Parameters


v_fab_drc_by_area

v_gang_relief_min

Limitations

Solder Mask ChecksResults Attributes for Solder Mask Checks


Results Attributes for Solder Mask ChecksResult attributes are assigned when the analysis is run. The values of the attributes can be retrieved afterwards.

Table 5-4. Solder Mask Checks Results Attributes.


...dra_ar_pth DRA for annular ring PTH

...min_ar_pth Minimal annular ring PTH measurement value

...typ_ar_pth Typical annular ring PTH value

...dra_ar_npth DRA for annular ring NPTH

...min_ar_npth Minimal annular ring NPTH measurement value

...typ_ar_npth Typical annular ring NPTH value

...dra_ar_via DRA for annular ring via

...min_ar_via Minimal annular ring via measurement value

...typ_ar_via Typical annular ring via value

...dra_ar_smd DRA for annular ring SMD

...min_ar_smd Minimal annular ring SMD measurement value

...typ_ar_smd Typical annular ring SMD value

...dra_ar_bga DRA for annular ring BGA

...min_ar_bga Minimal annular ring BGA measurement value

...typ_ar_bga Typical annular ring BGA measurement value

...dra_ar_pad DRA for annular ring pad

...min_ar_pad Minimal annular ring pad measurement value

...typ_ar_pad Typical annular ring pad value

...dra_ar_pth_pad DRA for annular ring PTH pad

...min_ar_pth_pad Minimal annular ring PTH pad measurement value

...typ_ar_pth_pad Typical annular ring PTH pad value

...dra_ar_npth_pad DRA for annular ring NPTH pad

...min_ar_npth_pad Minimal annular ring NPTH pad measurement value

...typ_ar_npth_pad Typical annular ring NPTH pad value

...dra_ar_via_pad DRA for annular ring via pad

...min_ar_via_pad Minimal annular ring via pad measurement value



October 2016

...typ_ar_via_pad Typical annular ring via pad value

...dra_ar_ndrl_pad DRA for annular ring non-drilled pad

...min_ar_ndrl_pad Minimal annular ring non-drilled pad measurement value

...typ_ar_ndrl_pad Typical annular ring undrilled pad value

...dra_neg_ar_smd DRA for negative annular ring SMD

...min_neg_ar_smd Minimal negative annular ring SMD measurement value

...max_neg_ar_smd Maximum negative annular ring SMD measurement value

...typ_neg_ar_smd Typical negative annular ring SMD value

...dra_neg_ar_ndrl_pad DRA for negative annular ring non-drilled pad

...min_neg_ar_ndrl_pad Minimal negative annular ring non-drilled pad measurement value

...max_neg_ar_ndrl_pad Maximum negative annular ring non-drilled pad measurement value

...typ_neg_ar_ndrl_pad Typical negative annular ring undrilled pad value

...dra_neg_ar_pth_pad DRA for negative annular ring PTH pad

...min_neg_ar_pth_pad Minimal negative annular ring PTH pad measurement value

...max_neg_ar_pth_pad Maximum negative annular ring PTH pad measurement value

...typ_neg_ar_pth_pad Typical negative annular ring PTH pad value

...dra_neg_ar_npth_pad DRA for negative annular ring NPTH pad

...min_neg_ar_npth_pad Minimal negative annular ring NPTH pad measurement value

...max_neg_ar_npth_pad Maximum negative annular ring NPTH pad measurement value

...typ_neg_ar_npth_pad Typical negative annular ring NPTH pad value

...dra_neg_ar_via_pad DRA for negative annular ring via pad

...min_neg_ar_via_pad Minimal negative annular ring via pad measurement value

...max_neg_ar_via_pad Maximum negative annular ring via pad measurement value

...typ_neg_ar_via_pad Typical negative annular ring via pad value

...dra_coverage DRA coverage

...min_coverage Minimal coverage

...typ_coverage Typical coverage

...dra_npth2m DRA for NPTH to mask

Table 5-4. Solder Mask Checks Results Attributes. (cont.)




...min_npth2m Minimal NPTH to mask value

...typ_npth2m Typical NPTH to mask value

...dra_sm2r DRA for solder mask to rout

...min_sm2r Minimal solder mask to rout value

...typ_sm2r Typical solder mask to rout value

...num_no_bridge Number of no bridge distance between pads

...min_sliver Minimum sliver width

...num_sliver Number of slivers

...num_smd_miss Number of missing SMD clearances

...num_pth_miss Number of missing PTH clearances

...num_via_miss Number of missing via clearances

...min_pad_to_pad Minimum pad to pad distance

...num_pad_to_pad Number of pad to pad measurements

...min_pad_to_non Minimal pad to non-pad measurements

...num_pad_to_non Number of pad to non-pad measurements

...min_non_to_non Minimal non-pad to non-pad measurements

...num_non_to_non Number of non-pad to non-pad measurements

...dra Overall DRA of a board is the minimum of all DRAs for all categories for which a DRA is defined:

dra_sm2r, dra_npth2m, dra_coverage, dra_neg_ar_via_pad, dra_neg_ar_npth_pad, dra_neg_ar_pth_pad, dra_neg_ar_ndrl_pad, dra_neg_ar_smd, dra_ar_ndrl_pad, dra_ar_via_pad, dra_ar_npth_pad, dra_ar_pth_pad, dra_ar_pad, dra_ar_smd, dra_ar_via, dra_ar_pth, dra_ar_npth

Table 5-4. Solder Mask Checks Results Attributes. (cont.)



Solder Mask ChecksERF Parameters for Solder Mask Checks

October 2016

ERF Parameters for Solder Mask ChecksERF parameters, set in the ERF model or when the analysis is run, control the analysis.

Table 5-5. Solder Mask Checks ERF Parameters


Layer pp_layer The layer to be affected by the action.

All categories

SM A.R. pp_ar Maximum distance from annular rings to solder mask.

PTH Annular Ring

NPTH Annular Ring

Via Annular Ring

PTH Gasket

Via Gasket

SMD Annular Ring

Pad Annular Ring

PTH Pad Annular Ring

NPTH Pad Annular Ring

Via Pad Annular Ring

Undrilled Pad Annular Ring

SMD Pad Gasket

PTH Pad Gasket

NPTH Pad Gasket

Via Pad Gasket

No Bridge

Undrilled Pad Gasket

SM to Rout pp_sm2r Maximum distance between rout features and solder mask clearances.

Rout Spacing


Spacing Min pp_spacing Search radius to use when looking for closely spaced features.

Pad to Pad Spacing

Pad to Non-Pad Spacing

Non-Pad to Non-Pad Spacing

Solder Mask ChecksERF Parameters for Solder Mask Checks


SM Coverage pp_coverage Maximum distance between circuit features and solder mask.

Coverage

Sliver Min pp_sliver The minimum sliver width. A sliver that is narrower than this value is reported.

SM Sliver

SM Short Sliver

Bridge Min pp_bridge Minimum distance between two pads (at least one of which is non-SMD) whose solder mask touch. Less than this distance is reported.

No Bridge

Tests List pp_tests Tests to be run. All categories

Compensated Rout


Controls measurements to compensated rout features.

no — Measures to skeleton. (default)

yes — Enables measurement to internal cutout of compensated rout feature.

Rout Spacing


Table 5-5. Solder Mask Checks ERF Parameters (cont.)



Solder Mask ChecksERF Variables for Solder Mask Checks

October 2016

ERF Variables for Solder Mask ChecksERF variables set in the ERF model control the analysis. ERF variable values are limited to 255 characters.

Table 5-6. Solder Mask Checks ERF Variables


categorize_negative_ar

Controls whether SM negative annular rings are reported.

0 — Report SM negative annular rings (gaskets) as r0. (default)

1 — Report measurement of SM negative annular rings.

SMD Annular Ring

SMD Pad Gasket

PTH Pad Gasket

NPTH Pad Gasket

Via Pad Gasket

Undrilled Pad Gasket

classify_pad_ar Controls whether SM pad annular ring measurements are classified according to type.

0 — Report all SM pad annular ring measurements in ‘Pad Annular Ring’. (default)

1 — Report SM pad annular ring according to type. (PTH, NPTH, via, undrilled)

2 — Maintains compatibility between earlier products and Valor NPI by mapping to 1.

To maintain compatibility with earlier products, this variable must be mapped. See “SM ERF Variables - Compatibility with Earlier Products” on page 323.

Pad Annular Ring

PTH Pad Annular Ring

NPTH Pad Annular Ring

Via Pad Annular Ring

Undrilled Pad Annular Ring



cover_dist_to_cu Controls whether a measurement from non-exposed copper is the closest distance to the solder mask clearance or the closest distance to the SM clearance in the direction of the exposed copper within it:

1 — Report distance from non-exposed copper to SM clearance in the direction of the exposed copper. (default)

0 — Report closest distance from non-exposed copper to solder mask clearance.

Coverage

cover_ignore_intersection

Controls whether features intersecting SM clearances are reported.

0 — Report features intersecting SM clearances. (default)

1 — Do not report features intersecting SM clearances.

If a copper feature is not entirely within an SM clearance, the system checks for a pad partly within and with its center inside. If found, it and its intersecting traces are ignored.

Coverage

cover_ignore_same_net

Controls whether copper features of the same net within the SM clearance are ignored.

0 — Report copper features of the same net. (default)

1 — Ignore copper features of the same net.


Coverage

Table 5-6. Solder Mask Checks ERF Variables (cont.)




October 2016

cover_special_check Controls whether a special check of nets intersecting with a SM clearance twice are checked in the ‘Coverage’ category.

0 — If a signal net has a pad covered completely by SM clearance, ignore intersections between its features and the clearance. (default)

1 — Check for more than one intersection in solder mask clearance where the first is legal (a signal trace connected directly to the covered pad) and report all others as a violation.

Note: A check requires considerable processing time.

Coverage

full_tp_exposure Determines which types of testpoints should be considered exposed by solder mask clearance.

0 — Does not report testpoint pads that are included or include a solder mask clearance. (default)

1 — Does not report testpoint pads that are fully included in a solder mask clearance.

Missing Testpoint Clearance

ignore_miss_via Determines whether missing vias are reported.

1 — Do not report missing vias. (default)

0 — Report missing vias.

Missing Via Clearance




by attr — Do not report slivers found on features with a hatch attribute. (EDA)

SM Sliver

SM Short Sliver

rm_coverage

rm_npth

rm_pad

rm_pth

rm_smd

Reliability Margin (RM). See Design Registration Allowance Adjusted for Reliability Margin.

Used in determining the reliability margin for the SMD Annular Ring category.

All







SM Sliver

SM Short Sliver

v_fab_drc_all_layers Controls the layers for which classification by area is performed.

1 — Classification by area is performed on all layers, even if layers are specified in attributes .drc_etch_lyrs or .drc_etch_lyrs_bit.

0 — If layers are specified in attributes .drc_etch_lyrs or .drc_etch_lyrs_bit, classification by area is performed only on those layers. (default)

All




All

v_fab_drc_map_layer

Default DRC map layer name. All

v_gang_relief_min The minimum number of fully exposed copper pads for a soldermask feature to be identified as a gang soldermask relief.

A soldermask feature with this number or more fully exposed copper pads is considered to be a gang soldermask relief and is reported to category Gang Soldermask Relief.

A soldermask feature with fewer than this number of fully exposed copper pads is reported to category Extra SM - Missing Pad, if the Extra test is run.

Extra SM - Missing Pad

Gang Soldermask Relief

v_max_net_size Nets with more than v_max_net_size features are ignored.


SM Sliver

SM Short Sliver

Too Large Nets





October 2016



SM Sliver

SM Short Sliver

v_min_sliver_perim Minimal distance between the measurement segment endpoints along the net. For a description of perimeter, see SM Short Sliver (Sliver).

SM Sliver

SM Short Sliver

v_report_only_one_ side_sm

Controls how drills that do not touch a solder mask clearance are reported.

no — Report all locations that do not touch any solder mask clearances. (default)

yes — Report only those locations that do not touch solder mask clearances on one side only.

Missing NPTH Clearance

Missing PTH Clearance

Missing Via Clearance

v_report_proximity Defines the size of area for reporting solder mask coverage violations. Only one violation between a clearance and signal layer net is reported. (Default=20 mil; minimum value=5mil. If a value less than the minimum is entered, 5 mil is used.)

Example: If v_report_proximity = 10, from all the ‘same net’ violations within a square of 10x10, only one is reported.

Coverage


Defines which of two algorithms is used to determine sliver violations.




SM Sliver

SM Short Sliver

v_sm2pad_tolerance Specifies the maximum difference in size between a solder mask pad and a copper pad for the copper pad to be considered as belonging to the solder mask pad.

Extra SM - Missing Pad




Chapter 6Silk Screen Checks

The Silk Screen Checks action is a read-only action intended to find potential manufacturing defects in silk screen layers, and generate statistics. The check operates only on silk screen layers because it relies on the job matrix to find the related external copper, solder mask and drill layers against which to check. It uses the associated solder mask, external copper and drill layers to test against.

NoteSilk Screen Analysis, run on a single-sided board, with silk screening on the bottom bare laminate, will exit without checking.

Access: Analysis > Fabrication > Silk Screen Checks.

Silk Screen Checks Action Screen:

Tests Performed in Silk Screen Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 384

Grouping of Silk Screen Results. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 385

Attributes Used in Silk Screen Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 385


Silk Screen ChecksTests Performed in Silk Screen Checks

October 2016

Categories in Silk Screen Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 387SM Clearance (SM Clearance) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 389SMD Clearance (SMD Clearance) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 390PTH Pads Clearance (Pad Clearance). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 391Via Pads Clearance (Pad Clearance). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 392NPTH Pads Clearance (Pad Clearance) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 393Undrilled Pads Clearance (Pad Clearance) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 394NPTH Clearance (Hole Clearance). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 395PTH Clearance (Hole Clearance) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 396Via Clearance (Hole Clearance) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 397Rout Clearance (Rout Clearance) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 398Line Widths (Line Width). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 399String Overlap (String Overlap) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400String and Line Overlap (String Overlap) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 401String Line Width (String Properties). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 402String Height (String Properties) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 403String Rotation (String Properties) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 404

Results Attributes for Silk Screen Checks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405

ERF Parameters for Silk Screen Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 407

ERF Variables for Silk Screen Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 408

Tests Performed in Silk Screen ChecksThe tests that are listed in the ERF parameter pp_tests in the ERF model, or are indicated in the Test List when the analysis is run, control to which categories results are reported.

Table 6-1. Silk Screen Checks Tests

Test Explanation

SM Clearance Reports close distances between silk screen features and solder mask clearances.

SMD Clearance Reports close distances between silk screen features and SMD pads.

Pad Clearance Reports close distances between silk screen features and pads.

Hole Clearance Reports close distances between silk screen features and drills.

Rout Clearance Reports close distances between silk screen features and rout features.

Line Width Reports line width violations and length to width ratio violations.

String Overlap Reports the touching or intersection of silk screen features of different string value.

String Properties Reports the height, width and rotation of text on the silk screen.

Silk Screen ChecksGrouping of Silk Screen Results


Grouping of Silk Screen ResultsSilk screen features are composed of a number of other features (lines and arcs). Measurements, by default, are reported for each and every one of the features within the distance specified by ERF parameter pp_spacing. This can result in many unnecessary measurements, depending upon what an operator is checking. The ERF variable v_results_grouping enables grouping silk screen features. Only one measurement from each close string (dependent upon attribute String Value) or from the closest string only can be reported. The differences are illustrated:

Attributes Used in Silk Screen ChecksAttributes assigned to the features of the product model control how the analysis tests these entities.

Feature Attributes

Table 6-2. Silk Screen Checks Feature Attributes

Name Description

Copper Feature Ignore

Copper features bearing this attribute are ignored in analysis actions. (Presently implemented only for Rout Test.)


SMD Pad This attribute should be attached to outer layer pads which are lands for SMD components. It is set by the ‘Set SMD Attribute’ Cleanup Action.

Copper Balancing This attribute is attached to features which are added during a pattern fill operation, either manually or through the Copper Balance DFM action.

String Angle For text features, the value of this attribute is the original (in the input file) rotation angle of the text string of which this feature is a part. This attribute is assigned to translated jobs of formats: Cadence Allegro BRD/APD, Mentor Graphics Board Station, Mentor Graphics PADS.


Silk Screen ChecksAttributes Used in Silk Screen Checks

October 2016

Copper Text This attribute defines a feature as a nomenclature legend. It affects the fabrication analysis by directing spacing checks between such features into a new category (Text to Text).

Table 6-2. Silk Screen Checks Feature Attributes (cont.)

Name Description

Silk Screen ChecksCategories in Silk Screen Checks


Categories in Silk Screen ChecksThe full name of the category and its test group serves as the title of the category. Each category is described in detail, accompanied by an example of a typical measurement.

The ERF parameter pp_layer applies to all categories and is not repeated on the individual fact sheet of a category.

The <area> classification is applied dynamically to categories only when ERF variable v_fab_drc_by_area = 1.

Table 6-3. Silk Screen Checks Categories


SM Clearance (SM Clearance)

Reports distances less than pp_spacing between silk screen features and solder mask clearances.

SMD Clearance (SMD Clearance)

Reports distances less than pp_spacing between silk screen features and SMD pads.

PTH Pads Clearance (Pad Clearance)

Reports distances less than pp_spacing between silk screen features and PTH pads.

Via Pads Clearance (Pad Clearance)

Reports distances less than pp_spacing between silk screen features and via pads.

NPTH Pads Clearance (Pad Clearance)

Reports distances less than pp_spacing between silk screen features and NPTH pads.

Undrilled Pads Clearance (Pad Clearance)

Reports distances less than pp_spacing between silk screen features and undrilled pads (possibly fiducials or testpoints).

NPTH Clearance (Hole Clearance)

Reports distances less than pp_spacing between NPTHs and silk screen features.

PTH Clearance (Hole Clearance)

Reports distances less than pp_spacing between PTHs and silk screen features.

Via Clearance (Hole Clearance)

Reports distances less than pp_spacing between vias and silk screen features.

Rout Clearance (Rout Clearance)

Reports distances less than pp_spacing between silk screen features and rout features.

Line Widths (Line Width) Reports width of lines in silk screen layers.

String Overlap (String Overlap)

Reports silk screen text with attributes Copper Text and String Value that overlaps other text.

String and Line Overlap (String Overlap)

Reports silk screen text with attributes Copper Text and String Value that overlaps a line.

String Line Width (String Properties)

Reports the width and length of string lines in the silk screen layers.


Silk Screen ChecksCategories in Silk Screen Checks

October 2016

String Height (String Properties)

Reports the height of the bounding box containing the full string.

String Rotation (String Properties)

Reports the rotation of text containing all features of the same string according to attribute String Angle.

Table 6-3. Silk Screen Checks Categories (cont.)


Silk Screen ChecksSM Clearance (SM Clearance)


SM Clearance (SM Clearance)Reports distances less than pp_spacing between silk screen features and solder mask clearances.

Analysis Category <area>:ss2sm

Measurement Shape

Measurement ID

Segment

Any SM feature

Layers Displayed Silk screen layer

Solder mask layer of the same side (top or bottom)

Graphic

Purpose Silk screen should only be printed on masked areas and not inside clearance areas. Due to the inaccuracy of the silk screen process, a certain safety distance should be retained.

Function Reports distances less than pp_spacing between silk screen features and solder mask clearances.


ERF Variables v_report_include_sm_as_zero

v_results_grouping

v_report_only_string_feature

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Silk Screen ChecksSMD Clearance (SMD Clearance)

October 2016

SMD Clearance (SMD Clearance)Reports distances less than pp_spacing between silk screen features and SMD pads.

Analysis Category <area>:ss2pad_smd

Measurement Shape

Measurement ID

Segment

Silk screen feature; SMD pad of the matching external layer



Graphic

Purpose Silk screen should never be applied on pads because this adversely affects the soldering process.

Function Reports distances less than pp_spacing between silk screen features and SMD pads.

If an SMD pad is reported here, it is not reported in ‘Undrilled Pads Clearance’.


ERF Variables v_results_grouping


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Silk Screen ChecksPTH Pads Clearance (Pad Clearance)


PTH Pads Clearance (Pad Clearance)Reports distances less than pp_spacing between silk screen features and PTH pads.

Analysis Category <area>:ss2pad_pth

Measurement Shape

Measurement ID

Segment

Silk screen feature; Pad



Graphic

Purpose Silk screen should never be applied on pads since this adversely affects the soldering process.

Function Reports distances less than pp_spacing between silk screen features and PTH pads.


ERF Variables v_hole_clearance_consider_sm

v_results_grouping


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Silk Screen ChecksVia Pads Clearance (Pad Clearance)

October 2016

Via Pads Clearance (Pad Clearance)Reports distances less than pp_spacing between silk screen features and via pads.

Analysis Category <area>:ss2pad_via

Measurement Shape

Measurement ID

Segment




Graphic


Function Reports distances less than pp_spacing between silk screen features and via pads.



v_results_grouping


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Silk Screen ChecksNPTH Pads Clearance (Pad Clearance)


NPTH Pads Clearance (Pad Clearance)Reports distances less than pp_spacing between silk screen features and NPTH pads.

Analysis Category <area>:ss2pad_npth

Measurement Shape

Measurement ID

Segment




Graphic


Function Reports distances less than pp_spacing between silk screen features and NPTH pads.



v_results_grouping


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Silk Screen ChecksUndrilled Pads Clearance (Pad Clearance)

October 2016

Undrilled Pads Clearance (Pad Clearance)Reports distances less than pp_spacing between silk screen features and undrilled pads (possibly fiducials or testpoints).

Analysis Category <area>:ss2pad_undrl

Measurement Shape

Measurement ID

Segment




Graphic

Function Reports distances less than pp_spacing between silk screen features and undrilled pads (possibly fiducials or testpoints).

If an SMD pad is reported in ‘SMD Clearance’, it is not reported here.



v_results_grouping


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Silk Screen ChecksNPTH Clearance (Hole Clearance)


NPTH Clearance (Hole Clearance)Reports distances less than pp_spacing between NPTHs and silk screen features.

Analysis Category <area>:ss2npth

Measurement Shape

Measurement ID

Segment




Solder Mask layer

Graphic

Purpose Silk screen should never be applied on holes since it will be unreadable and adversely affects the assembly process.

Function Reports distances less than pp_spacing between NPTHs and silk screen features.



v_results_grouping


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Silk Screen ChecksPTH Clearance (Hole Clearance)

October 2016

PTH Clearance (Hole Clearance)Reports distances less than pp_spacing between PTHs and silk screen features.

Analysis Category <area>:ss2pth

Measurement Shape

Measurement ID

Segment

Silk screen feature; Drill



Solder Mask layer

Graphic


Function Reports distances less than pp_spacing between PTHs and silk screen features.



v_results_grouping


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Silk Screen ChecksVia Clearance (Hole Clearance)


Via Clearance (Hole Clearance)Reports distances less than pp_spacing between vias and silk screen features.

Analysis Category <area>:ss2via

Measurement Shape

Measurement ID

Segment

Silk screen feature; Drill



Solder mask layer

Graphic


Function Reports distances less than pp_spacing between vias and silk screen features.



v_results_grouping


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Silk Screen ChecksRout Clearance (Rout Clearance)

October 2016

Rout Clearance (Rout Clearance)Reports distances less than pp_spacing between silk screen features and rout features.

Analysis Category <area>:ss2rout

Measurement Shape

Measurement ID

Segment

Silk screen feature; Rout feature


Rout layer

Graphic

Function Reports distances less than pp_spacing between silk screen features and rout features. When measurement is to the compensated rout, specify pp_use_compensated_rout=yes. Does not report copper features with attribute Copper Feature Ignore.



ERF Variables v_results_grouping


v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Silk Screen ChecksLine Widths (Line Width)


Line Widths (Line Width)Reports width of lines in silk screen layers.

Analysis Category <area>:ss_line

Measurement Shape

Measurement ID

Line

Silk screen feature


Graphic

Purpose To report line widths matching specifications.

Function Reports width of lines in silk screen layers. If a line is drawn (represented by two touching lines running along each other), the compound width of the drawn line is reported. Lines with the attributes Copper Balancing and Copper Text are not reported.



max_line_width

len2width_ratio

v_one_width_report_per_letter

v_fab_drc_map_layer

Limitations


Silk Screen ChecksString Overlap (String Overlap)

October 2016

String Overlap (String Overlap)Reports silk screen text with attributes Copper Text and String Value that overlaps other text.

Analysis Category <area>:str_overlap

Measurement Shape

Measurement Value

Measurement ID

Bounding box

Percentage of overlap

String value of 1st shape; String value of 2nd shape


Graphic

Purpose The information given by the silk screen text is used for assembling the board. If this information is not clear, it could cause mistakes.

Function Reports silk screen text with attributes Copper Text and String Value that overlaps other text. If the two touching shapes have different String Value designations, they are reported to this category. The only area reported is that of the greatest overlap. The percentage of overlap is area common to both features divided by the area of the larger affected feature. In the graphic, this is the are within the box divided by the area of the character 4.

ERF Parameters


v_fab_drc_by_area

Limitations

Silk Screen ChecksString and Line Overlap (String Overlap)


String and Line Overlap (String Overlap)Reports silk screen text with attributes Copper Text and String Value that overlaps a line.

Analysis Category <area>:str_and_line_overlap

Measurement Shape

Measurement Value

Measurement ID

Segment

Percentage of overlap

String value


Graphic


Function Reports silk screen text with attributes Copper Text and String Value that overlaps a line. To reduce the number of reports, only one point of overlap is reported along with the percentage of overlap (the area of the line’s bounding box, from first intersection to last intersection, divided by the area of the string’s bounding box). If a number of lines of different nets intersect the string, there will be a report for each.

ERF Parameters


v_fab_drc_by_area

Limitations


Silk Screen ChecksString Line Width (String Properties)

October 2016

String Line Width (String Properties)Reports the width and length of string lines in the silk screen layers.

Analysis Category <area>:str_line_width

Measurement Shape

Measurement Value

Measurement ID

Line

Line width; Line length

Silk screen feature; String value


Graphic


Function Reports the width and length of string lines in the silk screen layers. Lines with attribute Copper Balancing or lacking attribute String Value or Copper Text are not reported.

ERF Parameters


v_fab_drc_by_area

Limitations

Silk Screen ChecksString Height (String Properties)


String Height (String Properties)Reports the height of the bounding box containing the full string.

Analysis Category <area>:str_height

Measurement Shape

Measurement Value

Measurement ID

Rectangle (bounding box of silk screen text)

Height; Width



Graphic


Function Reports the height of the bounding box containing the full string. Lines with attribute Copper Balancing or lacking attribute String Value or Copper Text are not reported.

ERF Parameters


v_fab_drc_by_area

Limitations


Silk Screen ChecksString Rotation (String Properties)

October 2016

String Rotation (String Properties)Reports the rotation of text containing all features of the same string according to attribute String Angle.

Analysis Category <area>:str_rotate

Measurement Shape

Measurement Value

Measurement ID

Rectangle (bounding box of silk screen text)

Rotation



Graphic


Function Reports the rotation of text containing all features of the same string according to attribute String Angle. Lines with attribute Copper Balancing or lacking attribute String Value or Copper Text are not reported.

ERF Parameters

ERF Variables v_ignore_string_rotation

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations

Silk Screen ChecksResults Attributes for Silk Screen Checks


Results Attributes for Silk Screen ChecksResult attributes are assigned when the analysis is run. The values of the attributes can be retrieved afterwards.

Table 6-4. Silk Screen Checks Results Attributes

Result Attribute Description

dra_sm DRA for SM clearance category

min_sm Min value for SM clearance category

typ_sm Typical value for SM clearance category

dra_smd DRA for SMD pad clearance category

min_smd Min value for SMD pad clearance category

typ_smd Typical value for SMD pad clearance category

dra_thp DRA for PTH pad clearance category

min_thp Min value for PTH pad clearance category

typ_thp Typical value for PTH pad clearance category

dra_vp DRA for Via pad clearance category

min_vp Min value for Via pad clearance category

typ_vp Typical value for Via pad clearance category

dra_npthp DRA for NPTH pad clearance category

min_npthp Min value for NPTH pad clearance category

typ_npthp Typical value for NPTH pad clearance category

dra_undrlp DRA for undrilled pad clearance category

min_undrlp Min value for undrilled pad clearance category

typ_undrlp Typical value for undrilled pad clearance category

dra_npth DRA for NPTH clearance category

min_npth Min value for NPTH clearance category

typ_npth Typical value for NPTH clearance category

dra_pth DRA for PTH clearance category

min_pth Min value for PTH clearance category

typ_pth Typical value for PTH clearance category

dra_via DRA for via clearance category

min_via Min value for via clearance category


Silk Screen ChecksResults Attributes for Silk Screen Checks

October 2016

typ_via Typical value for via clearance category

dra Minimum of the following: dra_sm, dra_smd, dra_thp, dra_vp,dra_npth, dra_pth, and dra_via

min_line Minimal width of lines

num_line Number of lines in layer

typ_line Typical line width

Table 6-4. Silk Screen Checks Results Attributes (cont.)


Silk Screen ChecksERF Parameters for Silk Screen Checks


ERF Parameters for Silk Screen ChecksERF parameters, set in the ERF model or when the analysis is run, control the analysis.

Table 6-5. Silk Screen Checks ERF Parameters


Layer pp_layer Layers to be affected by the action, according to the rules defined as described in “Valor NPI Checklist Operations User Guide”

All categories

Spacing pp_spacing Search radius to use when looking for closely spaced features.

All categories

Test List pp_tests Tests to be run. See “Tests Performed in Silk Screen Checks” on page 384.

All categories

Compensated Rout pp_use_compensated_rout

no — Measures to skeleton. (default)

yes — Enables measurement to internal cutout of compensated rout feature. See “Compensated Rout” on page 126.

Rout Clearance


Silk Screen ChecksERF Variables for Silk Screen Checks

October 2016

ERF Variables for Silk Screen ChecksERF variables set in the ERF model control the analysis. ERF variable values are limited to 255 characters.

Table 6-6. Silk Screen Checks ERF Variables


len2width_ratio Minimum ratio of length to width for the ‘Line Widths’ category.

Line Widths

max_line_width Maximum line width of lines in the ‘Line Widths’ category

Line Widths

min_line_len Minimum line length of lines in the ‘Line Widths’ category, also minimum overlap between lines to report in parallel spacing

Line Widths

rm_pad_pth Reliability margins used in DRA calculations. See “Design Registration Allowance Adjusted for Reliability Margin” on page 22.

PTH Pad Clearance

rm_pad_via Reliability margins used in DRA calculations. See “Design Registration Allowance Adjusted for Reliability Margin” on page 22.

Via Pad Clearance

rn_pad_smd Reliability margins used in DRA calculations. See “Design Registration Allowance Adjusted for Reliability Margin” on page 22.

SMD Clearance

rm_pth Reliability margins used in DRA calculations. See “Design Registration Allowance Adjusted for Reliability Margin” on page 22.

PTH Clearance

rm_npth Reliability margins used in DRA calculations. See “Design Registration Allowance Adjusted for Reliability Margin” on page 22.

NPTH Clearance

rm_rout Reliability margins used in DRA calculations. See “Design Registration Allowance Adjusted for Reliability Margin” on page 22.

Rout Clearance

rm_sm Reliability margins used in DRA calculations. See “Design Registration Allowance Adjusted for Reliability Margin” on page 22.

SM Clearance

rm_via Reliability margins used in DRA calculations. See “Design Registration Allowance Adjusted for Reliability Margin” on page 22.

Via Clearance







All

v_fab_drc_by_area Controls whether checks are reported according to dynamic area classification.



All

v_fab_drc_map_layer

Default DRC map layer name. All

v_hole_clearance_consider_sm

Controls whether to report only drills within SM clearances too close to silk screen features or all drills, even those without SM clearances.

yes — Report spacing violations only if SM clearance is present. (default)

no — Report all spacing violations.

PTH Pad Clearance

Via Pad Clearance

NPTH Pad Clearance

Undrilled Pad Clearance

NPTH Clearance

PTH Clearance

Via Clearance

v_ignore_string_rotation

A list of angles not to be reported. String Rotation

v_one_width_report_per_letter

Controls how line width of silk screen features is reported.

no — Report line width for each individual feature

yes — Report the line width of one feature of a group of connected features (as in a letter or number)

Line Widths

Table 6-6. Silk Screen Checks ERF Variables (cont.)




October 2016

v_report_include_sm_as_zero

Controls whether to report silk screen features that are completely covered or included in solder mask features.

0 — (default) Do not report silk screen features that are completely covered or included in solder mask features.

1 — Report such features as a segment of zero length.

SM Clearance


Controls which silk screen features are reported.

no — Reports all silk screen features. (default)

yes — Reports only silk screen features with the attribute String Value.

SM Clearance

SMD Clearance

All Pad Clearance categories

All Hole Clearance categories

Rout Clearance

v_results_grouping Controls how silk screen results are grouped.

0 — (default) No grouping of silk screen results is performed and each measurement between a silk screen feature and another feature is reported individually.

1 — Silk screen results are grouped according to the same String Value attribute, and only one measurement is reported between the grouped features and other features.

2 — Silk screen results are grouped and the measurement between the group and another feature is the shortest measurement possible.

If the non-silk screen feature (smd, sm, drill, or other feature) is larger than 200 mil, mode 1 is used.

See “Grouping of Silk Screen Results” on page 385.

SM Clearance

SMD Clearance

All Pad Clearance categories

All Hole Clearance categories

Rout Clearance

Table 6-6. Silk Screen Checks ERF Variables (cont.)



Chapter 7Profile Checks

The Profile Checks action is a read-only action intended to measure distances between features and inner profiles (step and repeat PCAs), and outer profiles (PCA and panel), and generate statistics.

The check can operate on any layer.

Access: Analysis > Fabrication > Profile Checks.

Profile Checks Action Screen:

Tests Performed in Profile Checks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 412

Categories in Profile Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 413Feature to Profile (Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 414Feature to Step and Repeat (Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 415Board Length (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 416Board Thickness (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 417Board Width (Size) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 418Conveyed Edge Gaps (Gap) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 419

Results Attributes for Profile Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 420

ERF Parameters for Profile Checks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 421

ERF Variables for Profile Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 422


Profile ChecksTests Performed in Profile Checks

October 2016

Tests Performed in Profile ChecksThe tests that are listed in the ERF parameter pp_tests in the ERF model, or are indicated in the Test List when the analysis is run, control to which categories results are reported.

Table 7-1. Profile Checks Tests

Test Explanation

Spacing Reports distances from features to the board profile or the step profile.

Size Reports the board length, width, and thickness.

Gaps Reports the distances from features to the conveyed edge gap.

Profile ChecksCategories in Profile Checks


Categories in Profile ChecksThe full name of the category and its test group serves as the title of the category. Each category is described in detail, accompanied by an example of a typical measurement.


The ERF parameter pp_layer is used by all categories. It is not repeated in the fact sheets of the categories.

Table 7-2. Profile Checks Categories


Feature to Profile (Spacing) Reports features too close to the profile of the PCB.

Feature to Step and Repeat (Spacing)

Reports distances less than pp_p2f between panel features and the profile of the encompassed PCA.

Board Length (Size) Reports the step profile length.

Board Thickness (Size) Reports the step profile thickness.

Board Width (Size) Reports the step profile width.

Conveyed Edge Gaps (Gap) Reports the gaps in the step profile, taken along the direction of the SMT process flow.


Profile ChecksFeature to Profile (Spacing)

October 2016

Feature to Profile (Spacing)Reports features too close to the profile of the PCB.

Analysis Category <area>:f2outer

Measurement Shape

Measurement ID

Segment

Any layer feature

Layers Displayed Analyzed layer

Graphic

Function Reports distances less than pp_p2f between features (within the profile) and the profile of the PCB. Also reports measurements for all features outside the profile.

ERF Parameters pp_p2f


v_fab_drc_by_area

Remarks ‘Feature to Profile’ and ‘Feature to Step & Repeat’ check the distance between the profile and features of the same polarity as the layer. Positive features in negative Power and Ground layers are not checked (since they do not represent copper).

Profile ChecksFeature to Step and Repeat (Spacing)


Feature to Step and Repeat (Spacing)Reports distances less than pp_p2f between panel features and the profile of the encompassed PCA.

Analysis Category <area>:f2inner

Measurement Shape

Measurement ID

Segment

Any layer feature

Layers Displayed Analyzed layer

Graphic

Function Reports distances less than pp_p2f between panel features and the profile of the encompassed PCA.

ERF Parameters pp_p2f


v_fab_drc_by_area

Remarks ‘Feature to Profile’ and ‘Feature to Step & Repeat’ check the distance between the profile and features of the same polarity as the layer. Positive features in negative Power and Ground layers are not checked (since they do not represent copper).


Profile ChecksBoard Length (Size)

October 2016

Board Length (Size)Reports the step profile length.

Analysis Category brd_length

Measurement Shape

Measurement ID

Profile limits

None

Layers Displayed Arbitrary

Graphic

Purpose Some processes and equipment types cannot handle a board that is too large.

Function Reports the step profile length. This is defined as the larger of the two dimensions of the smallest rectangle containing the step profile.

ERF Parameters

ERF Variables

Limitations

Profile ChecksBoard Thickness (Size)


Board Thickness (Size)Reports the step profile thickness.

Analysis Category brd_thickness

Measurement Shape

Measurement ID

Profile limits

None


Graphic


Function Reports the step profile thickness. This is defined as the value of the board attribute Thickness. If this attribute is 0, a very large value is given as the result instead.

ERF Parameters

ERF Variables

Limitations


Profile ChecksBoard Width (Size)

October 2016

Board Width (Size)Reports the step profile width.

Analysis Category brd_width

Measurement Shape

Measurement ID

Profile limits

None


Graphic


Function Reports the step profile width. This is defined as the smaller of the two dimensions of the smallest rectangle containing the step profile.

ERF Parameters

ERF Variables

Limitations

Profile ChecksConveyed Edge Gaps (Gap)


Conveyed Edge Gaps (Gap)Reports the gaps in the step profile, taken along the direction of the SMT process flow.

Analysis Category <area>:conv_gaps

Measurement Shape

Measurement ID

Segment

None


Graphic

Purpose When the board is conveyed through the SMT process, there are sensors set at a certain “depth” beside the conveyors, used to sense when the board has finished passing through the process. A gap in the profile will mislead these sensors.

Function Reports the gaps in the step profile, taken along the direction of the SMT process flow [represented by step attribute SMT Direction (top)]. It considers the straight line parallel to the SMT process flow direction, close to the profile’s edge and lists all gaps along this line. A gap is defined as any segment of the line, within the rectangle of the profile’s limits, outside the step profile itself.

ERF Parameters

ERF Variables conveyor_sensor_depth

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


Profile ChecksResults Attributes for Profile Checks

October 2016

Results Attributes for Profile ChecksResult attributes are assigned when the analysis is run. The values of the attributes can be retrieved afterwards.

Table 7-3. Profile Checks Feature Attributes


...min_f2outer Minimum distance between PCB features and PCB profile.

...min_f2inner Minimum distance between panel features and profile of encompassed PCB.

Profile ChecksERF Parameters for Profile Checks


ERF Parameters for Profile ChecksERF parameters, set in the ERF model or when the analysis is run, control the analysis.

Table 7-4. Profile Checks ERF Parameters


Layer pp_layer Layers to be affected by the action.

All categories

Feature to Profile pp_p2f Maximal distance between feature and profile.

Feature to Profile

Feature to Step&Repeat

Test List pp_tests Defines the tests to be run. All categories


Profile ChecksERF Variables for Profile Checks

October 2016

ERF Variables for Profile ChecksERF variables set in the ERF model control the analysis. ERF variable values are limited to 255 characters.

Table 7-5. Profile Checks ERF Variables


conveyor_sensor_depth

Specifies the ‘depth’, in mils, for sensors positioned along the conveyor to check board presence. The ‘Conveyed Edge Gaps’ category looks for gaps at this distance from the board edge.

Conveyed Edge Gaps





Feature to Profile

Feature to Step & Repeat

Conveyed Edge Gaps




Feature to Profile


Conveyed Edge Gaps

v_fab_drc_map_layer

Specifies the default DRC map layer name. Feature to Profile


Conveyed Edge Gaps


Chapter 8Drill Summary

Drill Summary is a read-only action intended to generate statistics on holes in padstacks. It finds the minimum annular ring in a padstack and generates a table listing all the annular rings in the padstack for a specific hole. Measurements are from edge of hole to other net copper encompassing copper or solder mask clearance.

The Drill Summary action uses dynamic category names to report annular rings and hole dimensions.

Measurements are from edge of hole to other net copper encompassing copper or solder mask clearance.

Access: Analysis > Fabrication > Drill Summary

Drill Summary Action Screen:

Attributes Used in Drill Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 424

Categories in Drill Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 425Maximum Annular Ring (AR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 427*SPACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 428

Special Reports for Drill Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 428

Results Attributes for Drill Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 430

ERF Parameters for Drill Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 432


Drill SummaryAttributes Used in Drill Summary

October 2016

ERF Variables for Drill Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 433

Attributes Used in Drill SummaryAttributes assigned to the features of the product model control how the analysis tests these entities.

Feature Attributes

Table 8-1. Drill Summary Feature Attributes

Name Description


Drill SummaryCategories in Drill Summary


Categories in Drill SummaryThe Drill Summary action uses dynamic category names to report annular rings and hole dimensions.

This is the general structure of a category name:

<layer_name>_<layer_type>_<drill_type>_<drill_diameter>_<category>

• <layer_name> — Layer name.

• <layer_type> — outer, inner, smask

• <drill_type> — PTH, VIA, NPTH

• <drill_diameter> — Drill diameter.

• <category> — AR, SPACE

These are example Drill Summary results:


The full name of the category and its test group serves as the title of the category. Each category is described in detail, accompanied by an example of a typical measurement.


Drill SummaryCategories in Drill Summary

October 2016

Table 8-2. Drill Summary Categories


Maximum Annular Ring (AR)

Reports small distances from the edge of a hole to the outline of a copper shape surrounding the hole.

*SPACE Reports small distances from the edge of a hole to non-touching (other net) copper.

Drill SummaryMaximum Annular Ring (AR)


Maximum Annular Ring (AR)Reports small distances from the edge of a hole to the outline of a copper shape surrounding the hole.

Analysis Category <area>:*_outer__PTH_*_AR

<area>:*_outer_NPTH_*_AR

<area>:*_outer__VIA_*_AR

<area>:*_inner__PTH_*_AR

<area>:*_inner_NPTH_*_AR

<area>:*_inner__VIA_*_AR

<area>:*_smask__PTH_*_AR

<area>:*_smask_NPTH_*_AR

<area>:*_smask__VIA_*_AR

Measurement Shape

Measurement ID

Segment

Pad (representing a hole)

Layers Displayed The drill layer

Analyzed layers

Graphic

Function Reports distances less than pp_max_annular_ring from the edge of a hole to the outline of a copper shape surrounding the hole.

ERF Parameters pp_max_annular_ring


v_fab_drc_by_area

Limitations


Drill Summary*SPACE

October 2016

*SPACEReports small distances from the edge of a hole to non-touching (other net) copper.

Special Reports for Drill SummaryThe drill summary check creates a special report.

Analysis Category <area>:*_outer__PTH_*_SPACE

<area>:*_outer_NPTH_*_SPACE

<area>:*_outer__VIA_*_SPACE

<area>:*_inner__PTH_*_SPACE

<area>:*_inner_NPTH_*_SPACE

<area>:*_inner__VIA_*_SPACE

<area>:*_smask__PTH_*_SPACE

<area>:*_smask_NPTH_*_SPACE

<area>:*_smask__VIA_*_SPACE

Measurement Shape

Measurement ID

Segment

Pad (representing a hole)

Layers Displayed The drill layer

Analyzed layers

Graphic

Function Reports distances less than pp_max_clearance from edge of hole to non-touching (other net) copper.

ERF Parameters pp_max_clearance


v_fab_drc_by_area

Limitations

Drill SummarySpecial Reports for Drill Summary



Drill SummaryResults Attributes for Drill Summary

October 2016

Results Attributes for Drill SummaryAn attribute is assigned to each layer and each dynamic category. Each attribute represents a minimum value for the dynamic category.

Table 8-3. Drill Summary Results Attributes


drill_outer__PTH_<drill>_AR Minimum value of category AR for PTH drill <drill>, on the outer layer.

drill_outer__PTH_<drill>_SPACE Minimum value of category SPACE for PTH drill <drill>, on the outer layer.

drill_inner__PTH_<drill>_AR Minimum value of category AR for PTH drill <drill>, on the inner layer.

drill_inner__PTH_<drill>_SPACE Minimum value of category SPACE for PTH drill <drill>, on the inner layer.

drill_smask__PTH_<drill>_AR Minimum value of category AR for PTH drill <drill>, on the smask layer.

drill_smask__PTH_<drill>_SPACE Minimum value of category SPACE for PTH drill <drill>, on the smask layer.

drill_outer_NPTH_<drill>_AR Minimum value of category AR for NPTH drill <drill>, on the outer layer.

drill_outer_NPTH_<drill>_SPACE Minimum value of category SPACE for NPTH drill <drill>, on the outer layer.

drill_inner_NPTH_<drill>_AR Minimum value of category AR for NPTH drill <drill>, on the inner layer.

drill_inner_NPTH_<drill>_SPACE Minimum value of category SPACE for NPTH drill <drill>, on the inner layer.

drill_smask_NPTH_<drill>_AR Minimum value of category AR for NPTH drill <drill>, on the smask layer.

drill_smask_NPTH_<drill>_SPACE Minimum value of category SPACE for NPTH drill <drill>, on the smask layer.

drill_outer__VIA_<drill>_AR Minimum value of category AR for VIA drill <drill>, on the outer layer.

drill_outer__VIA_<drill>_SPACE Minimum value of category SPACE for VIA drill <drill>, on the outer layer.

drill_inner__VIA_<drill>_AR Minimum value of category AR for VIA drill <drill>, on the inner layer.

drill_inner__VIA_<drill>_SPACE Minimum value of category SPACE for VIA drill <drill>, on the inner layer.

Drill SummaryResults Attributes for Drill Summary


drill_smask__VIA_<drill>_AR Minimum value of category AR for VIA drill <drill>, on the smask layer.

drill_smask__VIA_<drill>_SPACE Minimum value of category SPACE for VIA drill <drill>, on the smask layer.

Table 8-3. Drill Summary Results Attributes (cont.)



Drill SummaryERF Parameters for Drill Summary

October 2016

ERF Parameters for Drill SummaryERF parameters, set in the ERF model or when the analysis is run, control the analysis.

Table 8-4. Drill Summary ERF Parameters


Drill Layer(s) pp_drill_layers The drill layers on which to run the test.

All categories

Test Layer(s) pp_test_layers The circuit layers against which to measure.

All categories

Max Annular pp_max_annular_ring

Maximum annular ring value. The higher the value, the slower the test runs. Use the minimum required.

AR

Max Clearance pp_max_clearance Maximum search value for space measurements. The higher the value, the slower the test runs. Use the minimum required.

SPACE

Drill SummaryERF Variables for Drill Summary


ERF Variables for Drill SummaryERF variables set in the ERF model control the analysis. ERF variable values are limited to 255 characters.

Table 8-5. Drill Summary ERF Variables






AR

SPACE




AR

SPACE

v_fab_drc_map_layer

Specifies the default DRC map layer name. AR

SPACE


Drill SummaryERF Variables for Drill Summary

October 2016


Chapter 9Board-Drill-Checks

Board-Drill is a read-only action intended to find potential manufacturability defects in drill and compensated rout layers. It generates measurements between drills and compensated rout paths piercing the same circuit layer. Measurements are taken between drills, from drills to rout features, but not between rout features. The Board-Drill action extends the functions available in the Drill Checks action.

The system uses a dynamic algorithm that adapts to user-selection and provides maximum performance. It assumes that all features on a rout layer are rout features, even though some features may have non-rout attributes. However, with drill layers, measurements are performed in accordance with assigned feature attributes.

The rout paths used in this section are compensated. Measurements are made from edge of hole to edge of compensated rout feature. Measurement are made between drills and routs that pierce the same circuit layer.

When measurements are made between drill features, they can be made between features on the same layer (Operation Mode = Single) or on different layers (Operation Mode = Cross).

When measurements are made between drill features and rout features they are made on different layers (drill and rout).

In all categories, the maximum distance reported is the highest value in the green range of the relevant category. For an explanation of ranges, see Understanding Severity in Checklist Operations.


Access: Analysis > Fabrication > Board-Drill-Checks


Board-Drill-Checks

October 2016

Board-Drill-Checks Action Screen:

Measurements are made from the edge of the hole to the edge of the compensated rout feature. A measurement is made between drills and routs that pierce the same circuit layer.

Attributes Used in Board-Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 437

Categories in Board-Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 438Via to Via . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 439Via to PTH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 440Via to NPTH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 441Via to Rout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 442PTH to PTH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 443PTH to NPTH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 444PTH to Rout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 445NPTH to NPTH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 446NPTH to Rout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 447NPTH to Rout_% . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 448

Results Attributes for Board Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 449

ERF Parameters for Board Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450

ERF Variables for Board Drill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 452

Board-Drill-ChecksAttributes Used in Board-Drill Checks


Attributes Used in Board-Drill ChecksAttributes assigned to the features of the product model control how the analysis tests these entities.

Feature Attributes

Table 9-1. Board-Drill Checks Feature Attributes

Name Description



Board-Drill-ChecksCategories in Board-Drill Checks

October 2016

Categories in Board-Drill ChecksThe full name of the category serves as the title of the category. Each category is accompanied by an example of a typical measurement.

Table 9-2. Board-Drill Checks Categories


Via to Via Reports distances between the edges of two vias, if less than the upper limit of the VIA2VIA green severity range.

Via to PTH Reports distances between the edges of vias and PTHs, if less than the upper limit of the VIA2PTH green severity range.

Via to NPTH Reports distances between the edges of vias and NPTHs, if less than the upper limit of the VIA2NPTH green severity range.

Via to Rout Reports distances between the edges of vias and compensated rout features, if less than the upper limit of the VIA2ROUT green severity range.

PTH to PTH Reports distances between the edges of PTHs, if less than the upper limit of the PTH2PTH green severity range.

PTH to NPTH Reports distances between the edges of PTHs and NPTHs, if less than the upper limit of the PTH2NPTH green severity range.

PTH to Rout Reports distances between the edges of PTHs and compensated rout features, if less than the upper limit of the PTH2ROUT green severity range.

NPTH to NPTH Reports distances between the edges of NPTHs, if less than the upper limit of the NPTH2NPTH green severity range.

NPTH to Rout Reports distances between the edges of NPTHs and compensated rout features, if less than the upper limit of the NPTH2ROUT green severity range.

NPTH to Rout_% Reports distances as a percentage (distance/radius*100) between the edges of an NPTH and a compensated rout belonging to drill and rout layers, if less than the upper limit of the NPTH2ROUT_P green severity range.

Board-Drill-ChecksVia to Via


Via to ViaReports distances between the edges of two vias, if less than the upper limit of the VIA2VIA green severity range.

Analysis Category <area>:VIA2VIA

Measurement Shape

Measurement ID

Distance between vias

Pads (representing a via)

Layers Displayed The drill layer/s on which the elements are located

Graphic

Function Reports distances between the edges of two vias, if less than the upper limit of the VIA2VIA green severity range.

ERF Parameters pp_1_element = Via

pp_2_element = Via


v_fab_drc_by_area

Limitations


Board-Drill-ChecksVia to PTH

October 2016

Via to PTHReports distances between the edges of vias and PTHs, if less than the upper limit of the VIA2PTH green severity range.

Analysis Category <area>:VIA2PTH

Measurement Shape

Measurement ID

Distance between via and PTH

Pads (representing a via and PTH)


Graphic

Function Reports distances between the edges of vias and PTHs, if less than the upper limit of the VIA2PTH green severity range.


pp_2_element = PTH


v_fab_drc_by_area

Limitations

Board-Drill-ChecksVia to NPTH


Via to NPTHReports distances between the edges of vias and NPTHs, if less than the upper limit of the VIA2NPTH green severity range.

Analysis Category <area>:VIA2NPTH

Measurement Shape

Measurement ID

Distance between via and NPTH

Pads (representing a via and NPTH)


Graphic

Function Reports distances between the edges of vias and NPTHs, if less than the upper limit of the VIA2NPTH green severity range.


pp_2_element = NPTH


v_fab_drc_by_area

Limitations


Board-Drill-ChecksVia to Rout

October 2016

Via to RoutReports distances between the edges of vias and compensated rout features, if less than the upper limit of the VIA2ROUT green severity range.

Analysis Category <area>:VIA2ROUT

Measurement Shape

Measurement ID

Distance between via and rout

Pads (representing a via and compensated rout feature)

Layers Displayed The drill and rout layers on which the elements are located

Graphic

Function Reports distances between the edges of vias and compensated rout features, if less than the upper limit of the VIA2ROUT green severity range.


pp_2_element = Rout


v_fab_drc_by_area

Limitations

Board-Drill-ChecksPTH to PTH


PTH to PTHReports distances between the edges of PTHs, if less than the upper limit of the PTH2PTH green severity range.

Analysis Category <area>:PTH2PTH

Measurement Shape

Measurement ID

Distance from PTH to PTH

Pad (representing a PTH)


Graphic

Function Reports distances between the edges of PTHs, if less than the upper limit of the PTH2PTH green severity range.

ERF Parameters pp_3_element = PTH

pp_4_element = PTH


v_fab_drc_by_area

Limitations


Board-Drill-ChecksPTH to NPTH

October 2016

PTH to NPTHReports distances between the edges of PTHs and NPTHs, if less than the upper limit of the PTH2NPTH green severity range.

Analysis Category <area>:PTH2NPTH

Measurement Shape

Measurement ID

Distance from PTH to NPTH

Pads (representing a PTH and an NPTH)


Graphic

Function Reports distances between the edges of PTHs and NPTHs, if less than the upper limit of the PTH2NPTH green severity range.


pp_4_element = NPTH


v_fab_drc_by_area

Limitations

Board-Drill-ChecksPTH to Rout


PTH to RoutReports distances between the edges of PTHs and compensated rout features, if less than the upper limit of the PTH2ROUT green severity range.

Analysis Category <area>:PTH2ROUT

Measurement Shape

Measurement ID

Distance from PTH to rout

Pads (representing an NPTH and a compensated rout feature)

Layers Displayed The drill and rout layers on which the elements are located

Graphic

Function Reports distances between the edges of PTHs and compensated rout features, if less than the upper limit of the PTH2ROUT green severity range.


pp_4_element = Rout


v_fab_drc_by_area

Limitations


Board-Drill-ChecksNPTH to NPTH

October 2016

NPTH to NPTHReports distances between the edges of NPTHs, if less than the upper limit of the NPTH2NPTH green severity range.

Analysis Category <area>:NPTH2NPTH

Measurement Shape

Measurement ID

Distance between NPTHs



Graphic

Function Reports distances between the edges of NPTHs, if less than the upper limit of the NPTH2NPTH green severity range.

ERF Parameters pp_5_element = NPTH

pp_6_element = NPTH


v_fab_drc_by_area

Limitations

Board-Drill-ChecksNPTH to Rout


NPTH to RoutReports distances between the edges of NPTHs and compensated rout features, if less than the upper limit of the NPTH2ROUT green severity range.

Analysis Category <area>:NPTH2ROUT

Measurement Shape

Measurement ID

Distance between NPTH and rout

Pads (representing an NPTH and a rout feature)

Layers Displayed The drill and rout layer/s on which the elements are located.

Graphic

Function Reports distances between the edges of NPTHs and compensated rout features, if less than the upper limit of the NPTH2ROUT green severity range.


pp_6_element = Rout


v_fab_drc_by_area

Limitations


Board-Drill-ChecksNPTH to Rout_%

October 2016

NPTH to Rout_%Reports distances as a percentage (distance/radius*100) between the edges of an NPTH and a compensated rout belonging to drill and rout layers, if less than the upper limit of the NPTH2ROUT_P green severity range.

Analysis Category <area>:NPTH2ROUT_P

Measurement Shape

Measurement ID

Distances from NPTHs to compensated rout features in percentage (distance/radius*100)

Pads (representing an NPTH and compensated rout feature)

Layers Displayed The drill and rout layer/s on which the elements are located

Graphic

Function Reports distances as a percentage (distance/radius*100) between the edges of an NPTH and a compensated rout belonging to drill and rout layers, if less than the upper limit of the NPTH2ROUT_P green severity range.


pp_6_element = Rout_%


v_fab_drc_by_area

Limitations

Board-Drill-ChecksResults Attributes for Board Drill Checks


Results Attributes for Board Drill ChecksResult attributes are assigned when the analysis is run. The values of the attributes can be retrieved afterwards.

Table 9-3. Board-Drill Checks Results Attributes


..._min_Via to Via Minimum distance between two via drills

..._min_Via to PTH Minimum distance between a via and PTH drill

..._min_Via to NPTH Minimum distance between a via and NPTH drill

..._min_Via to Rout Minimum distance between a via and rout

..._min_PTH to PTH Minimum distance between two PTH drills

..._min_PTH to NPTH Minimum distance between PTH and NPTH drill

..._min_PTH to Rout Minimum distance between PTH and rout

..._min_NPTH to NPTH Minimum distance between two NPTH drills

..._min_NPTH to Rout Minimum distance between NPTH and rout

..._min_NPTH to Rout_% Minimum distance as a percentage of distance to radius between NPTH and rout

min_Drill to Drill Minimum drill to drill distance

min_drill to Rout Minimum drill to rout distance

min_Drill to Rout% Minimum drill to rout percentage distance


Board-Drill-ChecksERF Parameters for Board Drill Checks

October 2016

ERF Parameters for Board Drill ChecksERF parameters, set in the ERF model or when the analysis is run, control the analysis.

Table 9-4. Board-Drill Checks ERF Parameters


Operation Modes pp_operation_modes Single — filters report by drills of same layer only.

Cross — filters report by drills of different layers only.

(Both can be set.)

All categories

Check pp_layers_all Board — the options selected in Operation Modes (Single or Cross or both) are applied to the entire board.

Affected — the options selected in Operation Modes (Single or Cross or both) are applied to the layers of pp_input_layers only.

All categories

Layer pp_input_layer The layer on which to run the check. Ignored when pp_layer_all = Board.

All categories

First El Type: Via pp_1_element Controls whether a measurement is made from a via. (yes or no)

Via to Via

Via to PTH

Via to NPTH

Via to Rout

First El Type: PTH pp_3_element Controls whether a measurement is made from a plated thru-hole. (yes or no)

PTH to PTH

PTH to NPTH

PTH to Rout

First El Type: NPTH pp_5_element Controls whether a measurement is made from a non-plated thru-hole. (yes or no)

NPTH to NPTH

NPTH to Rout

NPTH to Rout_%

Board-Drill-ChecksERF Parameters for Board Drill Checks


Second Element Type

(for First-El.-Type = Via)

pp_2_element If pp_1_element is selected, one or more entities to which to measure from a via:

• Via• PTH• NPTH• Rout

Via to Via

Via to PTH

Via to NPTH

Via to Rout

Second Element Type

(for First-El.-Type = PTH)

pp_4_element If pp_3_element is selected, one or more entities to which to measure from a plated thru-hole:

• PTH• NPTH• Rout

PTH to PTH

PTH to NPTH

PTH to Rout

Second Element Type

(for First-El.-Type = NPTH)

pp_6_element If pp_5_element is selected, one or more entities to which to measure from a non-plated thru-hole:

• NPTH• Rout• Rout_%

NPTH to NPTH

NPTH to Rout

NPTH to Rout_%

Table 9-4. Board-Drill Checks ERF Parameters (cont.)



Board-Drill-ChecksERF Variables for Board Drill Checks

October 2016

ERF Variables for Board Drill ChecksERF variables set in the ERF model control the analysis. ERF variable values are limited to 255 characters.

Table 9-5. Board-Drill Checks ERF Variables






All




All

v_fab_drc_map_layer

Specifies the default DRC map layer name. All


Chapter 10SMD Summary

The SMD Summary is a read-only action intended to operate on external copper layers and produce statistical reports on SMD lands and packages in the inspected layers. The SMD pitch and pad size parameters, as well as the types and number of packages, are important factors in the manufacturability and testability of PCBs.

The SMD summary action uses the inspected outer layers as well as associated solder mask layers to determine the SMD lands and packages statistics, along with solderability parameters such as stripe and annular ring. It also checks annular rings and stripe measurements, size of SMD row, if SMD rows fit SMD area, if pads are too small and need staggering, or if pitch is non-uniform and other criteria.

Access: Analysis > Fabrication > SMD Summary.

SMD Summary Action Screen:

Attributes Used in SMD Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 454

Categories in SMD Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 455SMD_ROW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 457SMD_PACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 458Pad Too Small. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 459Needs Staggering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 460Pitch Is Non-Uniform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 461Picture Frames . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 462PITCHxSIZE_STRIPEx<pitch>x<size> . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 463PITCHxSIZE_ARx<pitch>x<size> . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 464SIZExPITCH_STRIPEx<pitch>x<size> . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 465


SMD SummaryAttributes Used in SMD Summary

October 2016

SIZExPITCH_ARx<size>x<pitch> . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 466

Special Reports for SMD Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 467

Results Attributes for SMD Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 469

ERF Parameters for SMD Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470

ERF Variables for SMD Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 471

Attributes Used in SMD SummaryAttributes assigned to the features of the product model control how the analysis tests these entities.

Feature Attributes

Table 10-1. SMD Summary Feature Attributes

Name Description

SMD Pad This attribute should be attached to outer layer pads that are lands for SMD components. It is set by the ‘Set SMD Attribute’ Cleanup Action.

SMD SummaryCategories in SMD Summary


Categories in SMD SummaryThe SMD Summary action uses dynamic category names to report annular ring and stripe measurements for specific size and pitch combinations. The name has the prefix PITCHxSIZE or SIZExPITCH depending on the value of v_sort_by_pitch.

An example of a category name is: PITCHxSIZE_STRIPEx19.0x11.0.

This reports stripe measurements for 19 mil pitch, 11 mil pad width SMD rows, if v_sort_by_pitch = yes.

The ERF parameter pp_layer applies to all categories. It is not repeated in the category fact sheets.


Each category is described in detail, accompanied by a graphic of a typical measurement in that category.

v_sort_by_pitch Category Name Explanation

yes PITCHxSIZE_STRIPEx<pitch>x<size> Reports stripe measurements for this pitch and size

yes PITCHxSIZE_ARx<pitch>x<size> Reports AR measurements for this pitch and size

no SIZExPITCH_STRIPEx<size>x<pitch> Reports stripe measurements for this pitch and size

no SIZExPITCH_ARx<size>x<pitch> Reports AR measurements for this pitch and size

Table 10-2. SMD Summary Categories


SMD_ROW Reports all rows of equal pitch, co-linear SMD pads.

SMD_PACK Reports grouped SMD_ROW rows as bounding boxes representing packages.

Pad Too Small Reports measurements of pads s smaller than pp_test_pin_min. when the appropriate conditions apply.


SMD SummaryCategories in SMD Summary

October 2016

Needs Staggering Reports on rows whose pitch is less than pp_test_pin_stg and have not been reported in ‘Pad Too Small’.

Pitch Is Non-Uniform Reports rows where at least one of the center-to-center distances between adjacent pads differs from the average pitch of the row by more than v_max_smd_pad_ununiformity.

Picture Frames Reports rows of SMD pads that have a single solder mask clearance (drawn, surface or pad) for the whole row.

PITCHxSIZE_STRIPEx<pitch>x<size>

Reports (per pitch/size combination) the width of the solder mask stripe left between adjacent pads.

PITCHxSIZE_ARx<pitch>x<size>

Reports (per pitch/size combination) the annular ring of the solder mask around SMD pads.

SIZExPITCH_STRIPEx<pitch>x<size>

Reports (per pitch/size combination) the width of the solder mask stripe left between adjacent pads.

SIZExPITCH_ARx<size>x<pitch>

Reports (per pitch/size combination) the annular ring of the solder mask around SMD pads.

Table 10-2. SMD Summary Categories (cont.)


SMD SummarySMD_ROW


SMD_ROWReports all rows of equal pitch, co-linear SMD pads.

Analysis Category <area>:smd_row

Measurement Shape

Measurement ID

Segment

None

Layers Displayed Inspected external copper layer

Graphic

Function Reports all rows of equal pitch, co-linear SMD pads. Measurements are segments from center of first pad to center of last pad in row. Rows with pitch greater than v_max_smd are ignored.

ERF Parameters

ERF Variables v_max_smd

v_max_smd_pad_ununiformity

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations Where discreet devices (resistors or capacitors) are placed at equal distances from one another, pads of another device might be considered part of the current device. In this case, instead of grouping pairs of pads belonging to the same device, this action incorrectly groups all the upper/right or lower/left pads of different devices into rows.


SMD SummarySMD_PACK

October 2016

SMD_PACKReports grouped SMD_ROW rows as bounding boxes representing packages.

Analysis Category <area>:smd_pack

Measurement Shape

Measurement ID

Bounding box

None


Graphic

Function Groups SMD_ROW measurements and inserts the grouped rows as bounding boxes representing packages. Packages may be composed of 1, 2 or 4 rows each. Connectors are represented as single row packages.

ERF Parameters


v_fab_drc_by_area

Limitations If the ‘SMD_ROW’ measurements do not reflect the actual rows of packages, then ‘SMD_PACK’ generated measurements do not accurately reflect board components.

SMD SummaryPad Too Small


Pad Too SmallReports measurements of pads s smaller than pp_test_pin_min. when the appropriate conditions apply.

Analysis Category <area>:test_pin_min

Measurement Shape

Measurement ID

Segment

None


Graphic

Function Reports measurements of pads s smaller than pp_test_pin_min. and when both the following conditions apply:

• minimal length of a pad in a row is less than twice pp_test_pin_min.• row pitch is less than pp_test_pin_stg.

In the case of the second, the pad cannot be tested because there is a need for staggering. However, staggering cannot be performed because the pads are too small.

ERF Parameters pp_test_pin_min

pp_test_pin_stg


v_fab_drc_by_area

Limitations


SMD SummaryNeeds Staggering

October 2016

Needs StaggeringReports on rows whose pitch is less than pp_test_pin_stg and have not been reported in ‘Pad Too Small’.

Analysis Category <area>:test_pin_stagger

Measurement Shape

Measurement ID

Segment

None


Graphic

Function Reports on rows whose pitch is less than pp_test_pin_stg and have not been reported in ‘Pad Too Small’. Measurements are segments describing pitch.

ERF Parameters pp_test_pin_min

pp_test_pin_stg


v_fab_drc_by_area

Limitations

SMD SummaryPitch Is Non-Uniform


Pitch Is Non-UniformReports rows where at least one of the center-to-center distances between adjacent pads differs from the average pitch of the row by more than v_max_smd_pad_ununiformity.

Analysis Category <area>:non_uniform_pitch

Measurement Shape

Measurement ID

Segment

None


Graphic

Function Reports rows where at least one of the center-to-center distances between adjacent pads differs from the average pitch of the row by more than v_max_smd_pad_ununiformity. Average pitch is the total distance between the two end pads divided by the number of pads.

ERF Parameters

ERF Variables v_max_smd_pad_ununiformity

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


SMD SummaryPicture Frames

October 2016

Picture FramesReports rows of SMD pads that have a single solder mask clearance (drawn, surface or pad) for the whole row.

Analysis Category <area>:picture_frame

Measurement Shape

Measurement ID

Bounding box

None

Layers Displayed • Inspected external copper layer• Matching solder mask layer

Graphic

Function Reports rows of SMD pads that have a single solder mask clearance (drawn, surface or pad) for the whole row.

ERF Parameters


v_fab_drc_by_area

Limitations

SMD SummaryPITCHxSIZE_STRIPEx<pitch>x<size>


PITCHxSIZE_STRIPEx<pitch>x<size>Reports (per pitch/size combination) the width of the solder mask stripe left between adjacent pads.

Full Name PITCHxSIZE_STRIPEx25.0x12.0*

(25 mil pitch, 12 mil pad width)

Analysis Category <area>:PITCHxSIZE_STRIPEx*

Measurement Shape

Measurement ID

Segment

None


Matching solder mask layer

Graphic

Function Reports (per pitch/size combination) the width of the solder mask stripe left between adjacent pads. If the stripe is zero, the adjacent clearances touch and it is a picture frame clearance. Results are sorted by pitch.

ERF Parameters

ERF Variables v_sort_by_pitch=yes

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


SMD SummaryPITCHxSIZE_ARx<pitch>x<size>

October 2016

PITCHxSIZE_ARx<pitch>x<size>Reports (per pitch/size combination) the annular ring of the solder mask around SMD pads.

Full Name PITCHxSIZE_ARx25.0x12.0

Analysis Category <area>:PITCHxSIZE_ARx*

Measurement Shape

Measurement ID

Segment

None



Graphic

Function Reports (per pitch/size combination) the annular ring of the solder mask around SMD pads.

Measurements are segments describing the minimal distance between the outlines of the pad and the outline of the solder mask clearance. Results are sorted by pitch.

ERF Parameters

ERF Variables v_sort_by_pitch=yes

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations Gasketing (solder mask clearance smaller than SMD pad) is reported as zero annular ring.

SMD SummarySIZExPITCH_STRIPEx<pitch>x<size>


SIZExPITCH_STRIPEx<pitch>x<size>Reports (per pitch/size combination) the width of the solder mask stripe left between adjacent pads.

Full Name SIZExPITCH_STRIPEx12.0x25.0*

(12 mil pad width, 25 mil pitch)

Analysis Category <area>:SIZExPITCH_STRIPEx*

Measurement Shape

Measurement ID

Segment

None



Graphic

Function Reports (per pitch/size combination) the width of the solder mask stripe left between adjacent pads. If the stripe is zero, the adjacent clearances touch and it is a picture frame clearance. Results are sorted by size.

ERF Parameters

ERF Variables v_sort_by_pitch=no

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations


SMD SummarySIZExPITCH_ARx<size>x<pitch>

October 2016

SIZExPITCH_ARx<size>x<pitch>Reports (per pitch/size combination) the annular ring of the solder mask around SMD pads.

Full Name SIZExPITCH_ARx12.0x25.0

Analysis Category <area>:SIZExPITCH_ARx*

Measurement Shape

Measurement ID

Segment

None



Graphic

Function Reports (per pitch/size combination) the annular ring of the solder mask around SMD pads.

Measurements are segments describing the minimal distance between the outlines of the pad and the outline of the solder mask clearance. Results are sorted by size.

ERF Parameters

ERF Variables v_sort_by_pitch=no

v_fab_drc_map_layer

v_fab_drc_by_area

Limitations Gasketing (solder mask clearance smaller than SMD pad is reported as zero annular ring.

SMD SummarySpecial Reports for SMD Summary


Special Reports for SMD SummaryThe SMD Summary action generates an SMD Summary Report and a Packages Summary Table.

SMD Summary Report — Lists the manufacturability parameters for every pair of pitch and pad width values, including the following:

• Stripes (spacing between adjacent solder mask openings for pads), minimum and maximum values

• Annular rings of SMD pads versus their SM clearances

• Spacing between adjacent SMD pads

Packages Summary Table — Lists data regarding SMD packages (components) detected in inspected layers. For each package type detected, the following information is listed:

• Number of SMD packages

• Number of rows in each package

• Minimum and maximum values of the pad widths and lengths

• Pitch of package rows

• Number of pads in each package


SMD SummarySpecial Reports for SMD Summary

October 2016

SMD SummaryResults Attributes for SMD Summary


Results Attributes for SMD SummaryResult attributes are assigned when the analysis is run. The values of the attributes can be retrieved afterwards. Only layer name attributes are created, not total run attributes. Total numbers are meaningless in this context.

Table 10-3. SMD Summary Results Attributes


_num_smd_row Number of smd row violations

_num_smd_pack Number of smd pack violations

_num_test_pin_min Number of pad too small violations

_num_test_pin_stagger Number of needs staggering violations

_num_non_uniform_pitch Number of pitch is non-uniform violations

_num_picture_frame Number of picture frame violations


SMD SummaryERF Parameters for SMD Summary

October 2016

ERF Parameters for SMD SummaryERF parameters, set in the ERF model or when the analysis is run, control the analysis.

Table 10-4. SMD Summary ERF Parameters


Layer pp_layer Defines the layer to be affected by the action, according to the rules defined as described in “Valor NPI Checklist Operations User Guide”.

All categories

Pad Size Min pp_test_pin_min If a pad is too small it is reported in ‘Pad Too Small’.

All categories

Stagger pp_test_pin_stg If the pitch between two pads is smaller than this value and it is not reported in ‘Pad Too Small’, it is reported in ‘Needs Staggering’.

All categories

SMD SummaryERF Variables for SMD Summary


ERF Variables for SMD SummaryERF variables set in the ERF model control the analysis.ERF variable values are limited to 255 characters.

Table 10-5. SMD Summary ERF Variables






All


0 — <area> classification is not applied. (default)

1 — <area> classification is applied.

All

v_fab_drc_map_layer

Specifies the default DRC map layer name. All

v_max_smd Maximal pitch to be reported in ‘SMD_ROW’. SMD_ROW

v_max_smd_pad_ununiformity

Defines a ‘non-uniform’ row. If the difference between the center-to-center distance of two adjacent pads and the pitch of the row is larger than this value, the row is considered non-uniform.

Default = 1 mil.

SMD_ROW

Pitch is Non-Uniform

v_reg_tol For internal testing only

v_resolution The resolution of differentiation between close pitch or size values. With a default of 1, both 19 mil and 19.5 mil pitch are considered the same. The minimal resolution is 0.1 (if working in inch/mil it is 0.1 mil; if working in mm/microns it is 0.1mm). If less than 0.1, it is taken to be 0.1.

All PITCHxSIZE_* and SIZExPITCH_* categories

v_sort_by_pitch Determines how tables and categories are sorted.

yes — Sorted by pitch. (default) Category names are constructed as PITCHxSIZE_*.

no — Sorted by size. Category names are constructed as SIZExPITCH_*.

All PITCHxSIZE_* and SIZExPITCH_* categories


SMD SummaryERF Variables for SMD Summary

October 2016


Chapter 11Pads for Drills

Pads for Drills is a read-only action that produces a textual report listing the pad sizes for each type of drill, and the number of such pads. Results can be displayed in mm or mils (defaults to current display setting).

Access: Analysis > Fabrication > Pads for Drills.

Pads for Drills Action Screen:

Attributes Used in Pads for Drills . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 473

Sample Report for Pads for Drills . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 474

ERF Parameters for Pads for Drills. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 475

Attributes Used in Pads for DrillsAttributes assigned to the features of the product model control how the analysis tests these entities.

Feature Attributes

Table 11-1. Pads for Drills Feature Attributes

Name Description



Pads for DrillsSample Report for Pads for Drills

October 2016

Sample Report for Pads for DrillsThe report contains a table of pad sizes per hole, for each layer.

Pads for Drills Report

JOB : demo_designSTEP : rev_aDATE : 03 Jan 2016TIME : 13:07:53

Pad size per hole report layer - sigt

-------------------------------------------------------------------------| Hole size | Pad size | Pol | Count| AR | Type |Finish drill|| (mil) | (mil) | | | (mil) | | size (mil) ||-----------|---------------|-----|------|----------|------|------------|| 18.00 p | r23.00 | pos | 3176 | 2.50 | VIA | 13.50 || 18.00 p | r33.00 | pos | 583 | 7.50 | VIA | 13.50 || 24.00 p | s38.00 | pos | 2 | 7.00 | PTH | 19.00 |

...

| 96.00 p | rect197x276 | pos | 2 | 50.50 | PTH | 91.00 || 116.00 p | r150.00 | pos | 9 | 17.00 | PTH | 110.00 || 145.70 p | r165.00 | pos | 4 | 9.65 | PTH | 140.00 |-------------------------------------------------------------------------

Pad size per hole report layer - sig2

-------------------------------------------------------------------------| Hole size | Pad size | Pol | Count| AR | Type |Finish drill|| (mil) | (mil) | | | (mil) | | size (mil) ||-----------|---------------|-----|------|----------|------|------------|| 18.00 p | r23.00 | pos | 3759 | 2.50 | VIA | 13.50 |

...

| 116.00 p | r150.00 | pos | 9 | 17.00 | PTH | 110.00 || 145.70 p | r165.00 | pos | 4 | 9.65 | PTH | 140.00 |-------------------------------------------------------------------------

...

Pad size per hole report layer - sigb

-------------------------------------------------------------------------| Hole size | Pad size | Pol | Count| AR | Type |Finish drill|| (mil) | (mil) | | | (mil) | | size (mil) ||-----------|---------------|-----|------|----------|------|------------|| 18.00 p | r33.00 | pos | 438 | 7.50 | VIA | 13.50 |

...

| 116.00 p | r150.00 | pos | 9 | 17.00 | PTH | 110.00 || 145.70 p | r165.00 | pos | 4 | 9.65 | PTH | 140.00 |-------------------------------------------------------------------------

Pads for DrillsERF Parameters for Pads for Drills


ERF Parameters for Pads for DrillsERF parameters, set in the ERF model or when the analysis is run, control the analysis.

Table 11-2. Pads for Drills ERF Parameters

Screen Name Parameter Description

Circuit Layer pp_test_layer The layer to be affected by the action, according to the rules defined as described in Valor NPI Checklist Operations User Guide.

Sort Order pp_sort Controls how the results are sorted.

Pad Size — sorted by pad size. (default)

AR Size — sorted by annular ring size.


Pads for DrillsERF Parameters for Pads for Drills

October 2016


Chapter 12Etching Analysis

The Etching Analysis action is a read-only action intended to find potential manufacturing defects in signal, power and ground and mixed layers. Acid used in the etching process can remove more copper than intended. The analysis reports locations where the etching process might cause a break in net connectivity. These locations are called bottlenecks—narrow copper areas which can disappear and divide nets into separate segments. These locations should be reinforced to avoid net breaks and increase production yield.

The analysis simulates the etching process by taking a copper net, converting it to a single contour, and then shrinking it by a specified value. If, after shrinking, the net becomes broken into a number of pieces, the points of a potential break become obvious.

The Etching Analysis action is performed on both positive and negative copper layers—negative layers are inverted before analysis, and the resulting etched layer is positive. Results in the form of ‘etched’ net shapes can be saved to an ‘etched layer’. The layer is saved with the job under the name <original_layer_name_>+++.

Access: Analysis > Fabrication > Etching Analysis

Etching analysis Action Screen:

Categories in Etching Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 479Broken Contact . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 480Broken Copper . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 481Disconnection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 482Detached Drill. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 483


Etching Analysis

October 2016

Unprocessed Net . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 484Drill Mark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 485

Results Attributes for Etching Analysis. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 486

ERF Parameters for Etching Analysis. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 487

ERF Variables for Etching Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 488

Etching AnalysisCategories in Etching Analysis


Categories in Etching AnalysisThe full name of the category serves as the title of the category. Each category description is accompanied by an example of a typical measurement.

Table 12-1. Etching Analysis Categories


Broken Contact Reports a copper area connected to at least one drill or SMT pad that could become disconnected from the net as a result of shrinking the net by the value of pp_shrink.

Broken Copper Reports a copper area containing no electrical connectivity that could become disconnected from the net as a result of shrinking the net by the value of pp_shrink.

Disconnection Reports two sections of a net that could become disconnected as a result of shrinking the net by the value of pp_shrink.

Detached Drill Reports a drill that could become disconnected as a result of shrinking the net by the value of pp_shrink.

Unprocessed Net Reports nets that could not be processed.

Drill Mark Reports clearance features contained inside a drill.


Etching AnalysisBroken Contact

October 2016

Broken ContactReports a copper area connected to at least one drill or SMT pad that could become disconnected from the net as a result of shrinking the net by the value of pp_shrink.

Analysis Category broken_contact

Measurement Shape

Measurement ID

Bounding box of the disconnected area

None

Layers Displayed Checked layer

Drill layer, if the connection is a drill

Created etched layer—dependent on the value of ERF parameter pp_create_layers

Graphic

Purpose Copper areas with electrical connectivity can become disconnected from the net during etching, resulting in a short.

Function Reports a copper area connected to at least one drill or SMT pad that could become disconnected from the net as a result of shrinking the net by the value of pp_shrink.

ERF Parameters pp_layer

pp_shrink

pp_create_layers

ERF Variables v_factor

Limitations

Etching AnalysisBroken Copper


Broken CopperReports a copper area containing no electrical connectivity that could become disconnected from the net as a result of shrinking the net by the value of pp_shrink.

Analysis Category broken_copper

Measurement Shape

Measurement ID

Bounding box of the disconnected area

None



Graphic

Purpose Disconnected copper areas with no electrical connectivity are serve no purpose and if small enough could flake, resulting in a short. Such surfaces should be checked.

Function Reports a copper area containing no electrical connectivity that could become disconnected from the net as a result of shrinking the net by the value of pp_shrink.


pp_shrink

pp_create_layers

ERF Variables

Limitations


Etching AnalysisDisconnection

October 2016

DisconnectionReports two sections of a net that could become disconnected as a result of shrinking the net by the value of pp_shrink.

Analysis Category disconnection

Measurement Shape

Measurement ID

Segment connecting disconnected parts of the net

None



Graphic

Purpose Breaks in the net result in a short.

Function Reports two sections of a net that could become disconnected as a result of shrinking the net by the value of pp_shrink. Although the parts are reported to categories ‘Broken Contact’ and ‘Broken Copper’, it is sometimes easier to locate the problem using this category.


pp_shrink

pp_create_layers

ERF Variables v_factor

Limitations

Etching AnalysisDetached Drill


Detached DrillReports a drill that could become disconnected as a result of shrinking the net by the value of pp_shrink.

Analysis Category detached_drill

Measurement Shape

Measurement ID

Shape of the drill

None


Drill layer


Graphic

Purpose Detect drill which may become disconnected from the net.

Function Reports a drill that could become disconnected as a result of shrinking the net by the value of pp_shrink.


pp_shrink

pp_create_layers

ERF Variables

Limitations


Etching AnalysisUnprocessed Net

October 2016

Unprocessed NetReports nets that could not be processed.

Analysis Category unprocessed_net

Measurement Shape

Measurement ID

A shape of the net

None



Graphic

Purpose Some nets cannot be checked because they are too small to be shrunk, or limitations of the algorithm caused the process to terminate.

Function Reports nets that could not be processed, and should be checked manually or with the bottleneck test.


pp_shrink

pp_create_layers

ERF Variables

Limitations

Etching AnalysisDrill Mark


Drill MarkReports clearance features contained inside a drill.

Analysis Category drill_mark

Measurement Shape

Measurement ID

Drill limits


Graphic

Purpose To avoid etching features that are only used to mark the drill (small thermals or clearances that are to be drilled out).

Function Reports clearance features contained inside a drill. These features will not be resized for etching.

ERF Parameters

ERF Variables

Limitations


Etching AnalysisResults Attributes for Etching Analysis

October 2016

Results Attributes for Etching AnalysisResult attributes are assigned when the analysis is run. The values of the attributes can be retrieved afterwards.

Table 12-2. Etching Analysis Results Attributes


...num_broken_contact Number of reports in the Broken Contact category.

...num_broken_copper Number of reports in the Broken Copper category.

...num_disconnection Number of reports in the Disconnection category.

...num_detached_drill Number of reports in the Detached Drill category.

...num_unprocessed_net Number of reports in the Unprocessed Net category.

Etching AnalysisERF Parameters for Etching Analysis


ERF Parameters for Etching AnalysisERF parameters, set in the ERF model or when the analysis is run, control the analysis.

Table 12-3. Etching Analysis ERF Parameters


Layer pp_layer The layer to be affected by the action, according to the rules described in “Valor NPI Checklist Operations User Guide”.

All categories except:

Drill Mark

Etch Shrink pp_shrink Defines the shrinkage depth for the contour formed from the net. This is the over-etching distance—the depth to which the etching removes copper. All nets are shrunk to the same degree.


Drill Mark

Create Etched Layers

pp_create_layers Controls whether to create etched layers (with suffix +++) containing the etched net shapes from the original layer, and in what cases:

No — Do not add etched layers (default).

Reported — Add an etched layer only for layers where problems are reported.

All — Add an etched layer for each layer checked. This can be useful when trying to understand why an expected report is missing, or for finding ‘Unprocessed’ nets because all shrunken features display the shrink outline. Features which could not be processes have no outline.


Drill Mark


Etching AnalysisERF Variables for Etching Analysis

October 2016

ERF Variables for Etching AnalysisERF variables set in the ERF model control the analysis.

Table 12-4. Etching Analysis ERF Variables


v_factor For sharp corners, acid will etch deeper into copper than the distance defined by the ERF parameter Etch Shrink. ERF variable v_factor controls how far from the corner etching can propagate into copper. A value of 0.5 roughly corresponds to the etching distance defined by the ERF parameter Etch Shrink.

Broken Contact

Disconnection


Chapter 13Surface Analyzer

Surface Analyzer is a read-only action that reports problems in surface features. It finds points of self-intersection, folds, small islands or holes, and incorrectly nested polygons in layer surfaces and symbols in a layer.

A surface is defined in an ODB++ product model as a set of polygons. Some polygons are islands, and other are holes, depending on their relationship to one another. For any two polygons, either one fully contains the other or they are separate entities. Polygons may intersect only at a single point. Each polygon is a closed chain of edges. The edges can be composed of arcs or linear segments. In a legal polygon each edge (defined by a segment) may touch only its contiguous neighbors in the chain of segments comprising the polygon. Valor NPI produces only legal polygons.

Some CAD/CAM programs produce output files with self-intersecting polygons or incorrectly nested polygons or both. The automatic conversion of such polygons into Valor NPI can create ambiguous results. The Surface Analyzer provides a way to detect such situations.

Small polygons and folds, and surfaces with independent islands not inside a hole, are legal in an ODB++ product model, but can cause processing problems in some surface editing operations or third-party systems that receive input from Valor NPI. By default, the analysis does not check for these situations.

The Surface Analyzer reports problematic surfaces and problematic points in those surfaces. It can be run immediately after inputting a board, before editing surface or output operations.

Results are displayed in mm or mils (defaults to current display setting).

Access: Analysis > Fabrication > Surface Analyzer


Surface Analyzer

October 2016

Surface Analyzer Action Screen:

Categories in Surface Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 491Self-Intersection in Surface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 492Self-Intersection in Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 493Wrong Nesting for Islands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 494Wrong Nesting for Hole . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 495Small Polygon. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 496Small Polygon in Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 497Fold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 498Fold in Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 499Short Edge. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500Short Edge in Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 501Problematic Surface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 502

Results Attributes for Surface Analysis. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 503

ERF Parameters for Surface Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504

Surface AnalyzerCategories in Surface Analysis


Categories in Surface AnalysisThe full name of the category and its test group serves as the title of the category. Each category is described in detail, accompanied by an example of a typical measurement.

Table 13-1. Surface Analysis Categories


Self-Intersection in Surface Reports self-intersection points of surfaces in the layer.

Self-Intersection in Symbol Reports self-intersection points of symbols in the layer.

Wrong Nesting for Islands Reports surfaces and symbols with nesting problems.

Wrong Nesting for Hole Reports surfaces and symbols with a hole not contained within an island.

Small Polygon Reports surfaces in the layer containing small polygons.

Small Polygon in Symbol Reports symbols in the layer containing small polygons.

Fold Reports surfaces with folds.

Fold in Symbol Reports symbols with folds.

Short Edge Reports short edges less than pp_short_edge of a surface shape.

Short Edge in Symbol Reports symbols with short edges less than pp_short_edge.

Problematic Surface Reports surfaces, not symbols, with at least one problematic point, island or hole already reported in another category.


Surface AnalyzerSelf-Intersection in Surface

October 2016

Self-Intersection in SurfaceReports self-intersection points of surfaces in the layer.

Analysis Category selfintersection_in_surface

Measurement Shape

Measurement Value

Measurement ID

Point of intersection

None

None


Graphic

Purpose Self-intersection is when a surface edge segment touches another segment that is not one of its contiguous neighbors in the chain of segments comprising the polygon.

For example, if segment 5 touches 1 and 9 in addition to 4 and 6, the polygon 1-9 is self-intersecting. Self-intersecting surfaces can cause

false results in other analyses, or even failure.

Function Reports self-intersection points of surfaces in the layer.

A surface with a self-intersection point reported here is also reported in category Problematic Surface.

ERF Parameters

ERF Variables

Limitations

Surface AnalyzerSelf-Intersection in Symbol


Self-Intersection in SymbolReports self-intersection points of symbols in the layer.

Analysis Category selfintersection_in_symbol

Measurement Shape

Measurement Value

Measurement ID

Bounding box of the self-intersecting symbol

Bounding box dimensions

None


Graphic

Purpose Self-intersecting surfaces can cause false results in other analysis operations.

Function Reports self-intersection points of symbols in the layer.

ERF Parameters

ERF Variables

Limitations


Surface AnalyzerWrong Nesting for Islands

October 2016

Wrong Nesting for IslandsReports surfaces and symbols with nesting problems.

Analysis Category wrong_nesting_island

Measurement Shape

Measurement Value

Measurement ID

Bounding box of the nested island polygon


None


Graphic

Purpose Incorrect nesting indicates a problem in design or in the analysis of the surface shape.

Function Reports surfaces and symbols with nesting problems.

Surfaces with a nesting problem reported here are also reported in category Problematic Surface. If the nesting problem involves a symbol, the symbol limits are the measurement shape and value (instead of nested island limits), but the symbol is not reported to category Problematic Surface.

Wrong Nesting is reported when small islands are completely included in larger islands and are not touch any edges or each other. If any of edges touch, it is reported to the appropriate self-intersection category.

ERF Parameters

ERF Variables

Limitations

Surface AnalyzerWrong Nesting for Hole


Wrong Nesting for HoleReports surfaces and symbols with a hole not contained within an island.

Analysis Category wrong_nesting_hole

Measurement Shape

Measurement Value

Measurement ID

Bounding box of the nested hole polygon


None


Graphic

Purpose Incorrect nesting indicates a problem in design or in the analysis of the surface shape.

Function Reports surfaces and symbols with a hole not contained within an island. That is, a hole within another hole, or a surface that is a hole without an island.

Surfaces with a nesting problem reported here are also in category “Problematic Surface” on page 502. If the nesting problem involves a symbol, the symbol limits are the measurement shape and value (instead of nested hole limits), but the symbol is not reported to category Problematic Surface.

Wrong Nesting is reported when small holes are completely included in larger holes and are not touch any edges or each other. If any of edges touch, it is reported to the appropriate self-intersection category.

ERF Parameters

ERF Variables

Limitations


Surface AnalyzerSmall Polygon

October 2016

Small PolygonReports surfaces in the layer containing small polygons.

Analysis Category small_poly

Measurement Shape

Measurement Value

Measurement ID

Bounding box of the small polygon


None


Graphic

Purpose Small polygons (islands or holes) in a surface can cause problems.

Function Reports surfaces in the layer containing small polygons.

A surface with a small polygon reported here is also reported in “Problematic Surface” on page 502.

ERF Parameters pp_small

pp_small_mode

ERF Variables

Limitations

Surface AnalyzerSmall Polygon in Symbol


Small Polygon in SymbolReports symbols in the layer containing small polygons.

Analysis Category small_poly_sym

Measurement Shape

Measurement Value

Measurement ID

Bounding box of the small polygon symbol


None


Graphic

Purpose Small polygons (islands or holes) in a symbol can cause problems.

Function Reports symbols in the layer containing small polygons.


pp_small_mode

ERF Variables

Limitations


Surface AnalyzerFold

October 2016

FoldReports surfaces with folds.

Analysis Category fold

Measurement Shape

Measurement Value

Measurement ID

The fold location (a point)

None

None


Graphic

Purpose Small folds in a surface can cause problems.

Function Reports surfaces with folds. A fold is a situation where the end of a surface edge is very close to the previous edge, causing a very thin corner between edges.

A surface with a fold reported here is also reported in “Problematic Surface” on page 502.

ERF Parameters pp_max_fold_length

ERF Variables

Limitations

Surface AnalyzerFold in Symbol


Fold in SymbolReports symbols with folds.

Analysis Category fold_sym

Measurement Shape

Measurement Value

Measurement ID

The bounding box of the symbol with a fold


None


Graphic

Purpose Small folds in a symbol can cause problems.

Function Reports symbols with folds. A fold is a situation where the end of a surface edge is very close to the previous edge, causing a very thin corner between edges.

ERF Parameters pp_max_fold_length

ERF Variables

Limitations


Surface AnalyzerShort Edge

October 2016

Short EdgeReports short edges less than pp_short_edge of a surface shape.

Analysis Category short_edge

Measurement Shape

Measurement Value

Measurement ID

The short edge location

None

None


Graphic

Purpose Very short edges of a surface shape may cause problems when taking measurements or running analysis/DFM actions.

Function Reports short edges less than pp_short_edge of a surface shape.

A surface with a short edge reported here is also reported in “Problematic Surface” on page 502.

ERF Parameters pp_short_edge

ERF Variables

Limitations

Surface AnalyzerShort Edge in Symbol


Short Edge in SymbolReports symbols with short edges less than pp_short_edge.

Analysis Category short_edge_sym

Measurement Shape

Measurement Value

Measurement ID

The bounding box of the symbol

Dimensions of bounding box

None


Graphic

Purpose Very short edges in a symbol may cause problems.

Function Reports symbols with short edges less than pp_short_edge.

ERF Parameters pp_short_edge

ERF Variables

Limitations


Surface AnalyzerProblematic Surface

October 2016

Problematic SurfaceReports surfaces, not symbols, with at least one problematic point, island or hole already reported in another category.

Analysis Category problematic_surface

Measurement Shape

Measurement Value

Measurement ID

The bounding box of the problematic surface


None


Graphic

Purpose Surfaces with at least one problematic point, island or hole are reported in this category to obtain an overall view. Surfaces can be very large and have a number of problems. The reports of problems to other categories are related to the specific problems of points, islands or holes.

Function Reports surfaces, not symbols, with at least one problematic point, island or hole already reported in one of the categories Self-Intersection in Surface, Wrong Nesting for Islands, Wrong Nesting for Hole, Small Polygon, Fold, or Short Edge.


pp_small_mode

pp_max_fold_length

ERF Variables

Limitations

Surface AnalyzerResults Attributes for Surface Analysis


Results Attributes for Surface AnalysisResult attributes are assigned when the analysis is run. The values of the attributes can be retrieved afterwards.


...num_problematic_surface Number of problematic surfaces in layer.

...num_selfintersection_in_surface

Number of self-intersecting surfaces in layer.

...num_selfintersection_in_symbol

Number of self-intersecting symbols in layer.

...num_wrong_nesting_island

Number of islands within other islands in layer.

...num_wrong_nesting_hole Number of holes not within an island in layer.

...num_small_poly Number of surfaces containing small polygons (either islands or holes) in layer.

...num_small_poly_sym Number of symbols containing small polygons (either islands or holes) in layer.

...num_fold Number of surfaces containing folds in layer.

...num_fold_sym Number of symbols containing folds in layer.


Surface AnalyzerERF Parameters for Surface Analysis

October 2016

ERF Parameters for Surface AnalysisERF variables set in the ERF model control the analysis.


Layer pp_layer The layer to be affected by the action according to the rules as described in “Valor NPI Checklist Operations User Guide”.

All categories

Max Size pp_small Maximum size of polygons to be reported as ‘small polygons’.

Small Polygon

Small Polygon in Symbol

Mode pp_small_mode Dimensions to be used in measuring a ‘small polygon’.

X or Y — One is smaller than pp_small.

X and Y — Both are smaller than pp_small.

Area — The area is smaller than area of (pp_small x pp_small).

Small Polygon

Small Polygon in Symbol

Max Fold Length pp_max_fold_length

Maximum length of a surface edge to be checked for causing a fold. A fold is reported if the distance between the end of the edge to the previous edge is not more than 1% of this value.

Fold

Fold in Symbol

Short Edge Length pp_short_edge Defines edges short enough to be reported as problematic.

Short Edge

Short Edge in Symbol


Chapter 14Backdrill Checks

The Backdrill Checks section is a read-write action intended to find potential manufacturability defects in backdrill layers and generate statistics on these layers in accordance with the type of drill being used. Categories, reports and attributes are generated for the action.

A backdrill is the purposeful removal of plating from within a plated through hole (PTH) by re-drilling a portion of it with a larger drill bit.

Plated through holes passing through PCBs containing a large number of layers can cause significant distortion of the high speed digital signals that pass through them. The source of the distortion is the unused section of the through hole, known as the stub. Backdrilling the unused section of the through hole removes the conductive plating of the stub, and reduces the problem of signal reflection referred to as deterministic jitter.

The PTH on the left is plated from top to bottom. The trace enters the PTH and continues to the top of the hole. The section of the PTH below the entrance of the trace is useless and can cause signal distortion. The PTH on the right has had the section below the trace removed by a drill slightly larger that the hole.

Access: Analysis > Fabrication > Backdrill Checks


Backdrill ChecksTests Performed in Backdrill Checks

October 2016

Backdrill Checks Action Screen.

Tests Performed in Backdrill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 506

Attributes Used in Backdrill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 507

Calculations Performed for Backdrill Penetration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 507

Categories in Backdrill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 510No Drill for Backdrill (Backdrill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 511Plated Backdrill (Backdrill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 512Backdrill Annular Ring (Backdrill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 513Backdrill to Copper (Backdrill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 514Backdrill to Copper Pad (Backdrill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 515Backdrill Smaller Than Plated Drill (Backdrill). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 516Backdrill to Drill Annular Ring (Backdrill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 517Backdrill Larger Than Pad (Backdrill) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 518Backdrill Ratio (Layer Check) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 519Backdrill Penetrates Stop Layer (Layer Check) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 520

Results Attributes for Backdrill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 521

ERF Parameters for Backdrill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 522

ERF Variables for Backdrill Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 523

Tests Performed in Backdrill ChecksThe tests that are listed in the ERF parameter pp_tests in the ERF model, or are indicated in the Test List when the analysis is run, control to which categories results are reported.

Table 14-1. Backdrill Checks Tests

Test Explanation

Backdrill Performs backdrill checks.

Layer Check Performs layer checks.

Backdrill ChecksAttributes Used in Backdrill Checks


Attributes Used in Backdrill ChecksAttributes assigned to the layers of the product model control how the analysis tests these entities.

Layer Attributes

Calculations Performed for Backdrill Penetration

Backdrills are used to reduce signal reflection, which creates signal distortion especially in high frequency designs. The backdrill must remove the copper plating down to the final routed signal layer—referred to as the ‘stop layer’—without penetrating the layer itself. If the ‘stop layer’ is pierced, the signal cannot propagate on the layer and the board becomes scrap.

It is important to evaluate the possibility of a backdrill piercing the ‘stop layer’ before the actual manufacture of the board. A number of factors play a role in determining the likelihood of the backdrill overshooting the intended depth and damaging the ‘stop layer’—the location of the signal layer in the buildup, the thickness of the dielectric materials, the copper weight of copper layers, and the length of the backdrill.

To capture the possibility where the ‘stop layer’ may be unintentionally drilled, the backdrill test ‘Backdrill Penetrates Stop Layer’ begins by calculating the backdrill depth required to reach the intended final copper layer as defined within the matrix using dielectric and copper thicknesses. Drill equipment has a depth tolerance based on the target depth plus another positive tolerance known as the ‘overshoot’. The sum of these two values, based on dielectric and copper materials, determines whether the ‘stop layer’ could possibly be penetrated if drill depth reached the full extent of the overshoot tolerance.

The application uses overshoot variables when running the test. The format of the variable is: v_overshoot_xx = <maximum drill depth> <overshoot>.

Table 14-2. Backdrill Checks Layer Attributes

Name Description

Backdrill not Penetrate Layer <name>

Name of the ‘stop layer’ that the drill should not penetrate

Thickness of Material

Thickness of the insulating layer of laminate between copper layers

Copper Weight Weight or thickness of the copper layer in oz./sq.foot or µm, as described in the ODB++ Format Specification, Table 2-1, How Measurements Are Stored.


Backdrill ChecksCalculations Performed for Backdrill Penetration

October 2016

These are the default values:

If backdrill depth is not larger than a specified maximum, the application assigns an overshoot value to be considered in drill depth calculations. That means that if the depth of the backdrill is not greater 0.025, an overshoot 0.014 is added in measuring depth and the backdrill is considered as having a possible depth of 0.039. This is important when trying to determine whether a backdrill will penetrate the ‘stop layer’.

You can edit this table to reflect the specific drills you are using, and add as many variables as necessary to reflect all available drills. Be careful to arrange the drills in ascending order from shortest to longest, and to run consecutively. The system interprets an empty cell as the end of the list.

Once there is a list of variables, each representing a specific drill depth and overshoot, the application calculates in the following manner:

1. The depth of the backdrill is based on the sum of all thicknesses of the material leading to the last drilled layer in the matrix; that is, the sum of all Copper Thickness and Material Thickness attributes of the penetrated layers.

NoteA layer is defined as the ‘stop layer’ by layer attribute Backdrill not Penetrate Layer. If no such layer exists, the application considers the next copper layer after the last

layer in the drill span as the Backdrill not Penetrate Layer.

2. Depth of backdrill, using the layer attributes Copper Thickness and Thickness of Material.

3. Looks up the relevant drill depth in the overshoot table.

Overshoot Variable Maximum Drill Depth Overshoot

v_overshoot_1 0.025 0.014







v_overshoot_8

v_overshoot_9

v_overshoot_10

Backdrill ChecksCalculations Performed for Backdrill Penetration


4. Compares the drill depth + overshoot distance to the distance calculated to the ‘stop layer’. If depth + overshoot exceeds the distance to ‘stop layer’, reports a violation.

Example of Backdrill Calculation

In this example, the blue layers are copper layers. The white layers are dielectric layers.

The backdrill penetrates layers d, d3, and c. The ‘stop layer’ to avoid drilling is copper layer b. The application knows the thickness of each of these layers from their relevant layer attributes—Copper Thickness and Thickness of Material—and calculates the backdrill depth. If the distance specified in the Overshoot table for a drill of this depth is less than the distance from the top of layer c to the bottom of layer b, then the backdrill will not penetrate the ‘stop layer’, layer b. If the distance is greater, there is a chance the drill might remove the plating from the barrel leading into layer b and scrap the board.


Backdrill ChecksCategories in Backdrill Checks

October 2016

Categories in Backdrill ChecksThe full name of the category and its test group serves as the title of the category. Each category is described in detail, accompanied by an example of a typical measurement.

Table 14-3. Backdrill Checks Categories


No Drill for Backdrill (Backdrill)

Reports backdrills on backdrill layers that do not have a corresponding plated drill on drill layers.

Plated Backdrill (Backdrill) Reports pads in the backdrill layer whose drill type is plated.

Backdrill Annular Ring (Backdrill)

Reports the annular ring in the signal or power and ground layer surrounding the backdrill.

Backdrill to Copper (Backdrill)

Reports backdrills too close to copper features.

Backdrill to Copper Pad (Backdrill)

Reports backdrills too close to other copper pads.

Backdrill Smaller Than Plated Drill (Backdrill)

Reports backdrills smaller than their corresponding plated hole drills.

Backdrill to Drill Annular Ring (Backdrill)

Reports the annular ring between the backdrill and the drill.

Backdrill Larger Than Pad (Backdrill)

Reports the annular ring between the backdrill and the pad.

Backdrill Ratio (Layer Check)

Reports the ration of backdrill diameter to stub length where plating has been removed.

Backdrill Penetrates Stop Layer (Layer Check)

Reports backdrills that would pierce the ‘stop layer’.

Backdrill ChecksNo Drill for Backdrill (Backdrill)


No Drill for Backdrill (Backdrill)Reports backdrills on backdrill layers that do not have a corresponding plated drill on drill layers.

Analysis Category bd2drl

Measurement Shape

Measurement Entity

Shape of the backdrill

Backdrill pad

Layers Displayed Backdrill layer

Graphic

Purpose The presence of backdrills without corresponding plated drills is a mistake in design.

Function Reports backdrills on backdrill layers that do not have a corresponding plated drill on drill layers.

ERF Parameters pp_test

ERF Variables

Limitations


Backdrill ChecksPlated Backdrill (Backdrill)

October 2016

Plated Backdrill (Backdrill)Reports pads in the backdrill layer whose drill type is plated.

Analysis Category npattr

Measurement Shape

Measurement Entity


Backdrill feature


Graphic

Purpose Backdrills must be non-plated, and the presence of a plated backdrill is a mistake.

Function Reports pads in the backdrill layer whose drill type is plated.


ERF Variables

Limitations

Backdrill ChecksBackdrill Annular Ring (Backdrill)


Backdrill Annular Ring (Backdrill)Reports the annular ring in the signal or power and ground layer surrounding the backdrill.

Analysis Category bdar

Measurement Shape

Measurement Entity

Measurement Value

Distance

Backdrill and layer feature

Spacing

Layers Displayed Signal layer or power and ground layer

Backdrill layer

Graphic

Purpose

Function Reports the annular ring in the signal or power and ground layer surrounding the backdrill.


ERF Variables

Limitations


Backdrill ChecksBackdrill to Copper (Backdrill)

October 2016

Backdrill to Copper (Backdrill)Reports backdrills too close to copper features.

Analysis Category bdspace

Measurement Shape

Measurement Entity

Measurement Value

Distance

Backdrill and drill features

Spacing


Backdrill layer

Graphic

Purpose Backdrills too close to copper features could cause damage.

Function Reports backdrills too close to copper features.


ERF Variables

Limitations

Backdrill ChecksBackdrill to Copper Pad (Backdrill)


Backdrill to Copper Pad (Backdrill)Reports backdrills too close to other copper pads.

Analysis Category bdspacepad

Measurement Shape

Measurement Entity

Measurement Value

Distance


Spacing


Backdrill layer

Graphic

Purpose Backdrills too close to other copper pads could cause damage.

Function Reports backdrills too close to other copper pads.


ERF Variables

Limitations


Backdrill ChecksBackdrill Smaller Than Plated Drill (Backdrill)

October 2016

Backdrill Smaller Than Plated Drill (Backdrill)Reports backdrills smaller than their corresponding plated hole drills.

Analysis Category bdcoverdrl

Measurement Shape

Measurement Entity

Measurement Value

Distance


Gap


Graphic

The backdrill diameter is smaller than the drill diameter.

Purpose If backdrill diameter is smaller than the diameter of the plated hole, the drill will not efficiently remove the plating.

Function Reports backdrills smaller than their corresponding plated hole drills.


ERF Variables v_plated_enlarge

v_non_plated_enlarge

v_via_enlarge

v_vialaser_enlarge

v_viaphoto_enlarge

Limitations

Backdrill ChecksBackdrill to Drill Annular Ring (Backdrill)


Backdrill to Drill Annular Ring (Backdrill)Reports the annular ring between the backdrill and the drill.

Analysis Category bddrlar

Measurement Shape

Measurement Entity

Measurement Value

Distance

Backdrill and drill feature

Spacing


Backdrill layer

Graphic

Purpose

Function Reports the annular ring between the backdrill and the drill.




v_via_enlarge

v_vialaser_enlarge

v_viaphoto_enlarge

Limitations


Backdrill ChecksBackdrill Larger Than Pad (Backdrill)

October 2016

Backdrill Larger Than Pad (Backdrill)Reports the annular ring between the backdrill and the pad.

Analysis Category far

Measurement Shape

Measurement Entity

Measurement Value

Distance

Backdrill and pad features

Spacing

Layers Displayed Feature layer

Backdrill layer

Graphic

Purpose If a backdrill is larger than the pad it has to drill, it will successfully remove all plating in the stub.

Function Reports the annular ring between the backdrill and the pad.




v_via_enlarge

v_vialaser_enlarge

v_viaphoto_enlarge

Limitations

Backdrill ChecksBackdrill Ratio (Layer Check)


Backdrill Ratio (Layer Check)Reports the ration of backdrill diameter to stub length where plating has been removed.

Analysis Category bdratio

Measurement Shape

Measurement Entity


Backdrill pad


Graphic

Purpose The greater the proportion of plating removed from the stub, the less chance of signal distortion. This ratio provides an indication of how much plating was removed by the backdrill.

Function Reports the ration of backdrill diameter to stub length where plating has been removed.


ERF Variables

Limitations


Backdrill ChecksBackdrill Penetrates Stop Layer (Layer Check)

October 2016

Backdrill Penetrates Stop Layer (Layer Check)Reports backdrills that would pierce the ‘stop layer’.

Analysis Category penetrate

Measurement Shape

Measurement Entity


Backdrill pad


Backdrill layer

Graphic

Purpose If a backdrill accidentally pierces the ‘stop layer’, the board can no longer be used.

Function Reports backdrills that would pierce the ‘stop layer’. This is determined by calculating the distance to the ‘stop layer’ according to the Thickness of Material and Copper Weight layer attributes. The ‘stop layer’ is defined by the Backdrill not Penetrate Layer Name layer attribute. The layer must be of type ‘drill’ or of sub-type ‘backdrill’. See Attributes Used in Backdrill Checks and Calculations Performed for Backdrill Penetration for details.


ERF Variables v_overshoot_<n>

Limitations

Backdrill ChecksResults Attributes for Backdrill Checks


Results Attributes for Backdrill ChecksResult attributes are assigned when the analysis is run. The values of the attributes can be retrieved afterwards.

Table 14-4. Backdrill Checks Results Attributes


...num_npattr Number of plated backdrill violations reported

...num_bd2drl Number of no drill for backdrill violations reported

...dra_bdar DRA for the backdrill annular ring violations reported

...min_bdar Minimum measurement reported for backdrill annular ring

...num_bdar Number of backdrill annular ring violations reported

...min_bdspace Minimum measurement reported for backdrill to copper

...num_bdspace Number of backdrill to copper violations reported

...typ_bdspace Typical backdrill to copper violation reported

...min_bdspacepad Minimum measurement reported for backdrill to copper pad

...num_bdspacepad Number of backdrill to copper pad violations reported

...typ_bdspacepad Typical backdrill to copper pad violation reported

...dra_bdratio DRA for the backdrill ratio violations reported

...min_bdratio Minimum backdrill ratio violation reported

...num_bdratio Number of backdrill ratio violations reported

...typ_bdratio Typical backdrill ration violation reported

...num_penetrate Number of backdrill penetrates stop layer violations reported

...num_bdcoverdrl Number of backdrill smaller than plated drill violations

...dra_bdDRLar DRA for the backdrill to drill annular ring violations reported

...min_bdDRLar Minimum measurement of backdrill to drill annular ring violations

...num_bdDRLar Number of backdrill to drill annular ring violations reported

...dra_far DRA of backdrill larger than pad violations

...min_far Minimum measurement of backdrill larger than pad violations

...num_far Number of backdrill larger than pad violations reported.


Backdrill ChecksERF Parameters for Backdrill Checks

October 2016

ERF Parameters for Backdrill ChecksERF parameters, set in the ERF model or when the analysis is run, control the analysis.

Table 14-5. Backdrill Checks ERF Parameters


Test List pp_tests The test to be run. See “Tests Performed in Backdrill Checks” on page 506.

All categories

Backdrill ChecksERF Variables for Backdrill Checks


ERF Variables for Backdrill ChecksERF variables set in the ERF model control the analysis. ERF variable values are limited to 255 characters.

Table 14-6. Backdrill Checks ERF Variables


v_plated_enlarge Enlarges a backdrill if smaller than its corresponding plated drill.

Backdrill Smaller than Plated Drill


Enlarges a backdrill if smaller than its corresponding non-plated drill.


v_via_enlarge Enlarges a backdrill if smaller than its corresponding via drill.


v_vialaser_enlarge Enlarges a backdrill if smaller than its corresponding laser drill.


v_viaphoto_enlarge Enlarges a backdrill if smaller than its corresponding photo drill.


v_overshoot_<n> Defines the maximum drill depth and possible overshoot for a specific drill.

Backdrill Penetrates Stop Layer


Backdrill ChecksERF Variables for Backdrill Checks

October 2016


Chapter 15Signal Layer Net Type Checks

The Signal Layer Net Type Checks action is a read-only action intended to check the signal quality of high speed nets.

NoteThis action is not part of the Valor NPI standard offering. It is available only at sites that have the appropriate license.

Signal quality calculations are made by PCB designers to ensure that essential restrictions and requirements have been met. Physical features might upset signal quality and invalidate original calculations. Clearances in ground planes might have been placed in the layer below critical routs. Pairs of critical nets might be running too close to one another over too great a distance. Spacing considerations between features of two different nets might not have remained consistent over a multiple of layers.

Analysis can be performed using the Design Process Wizard (DPW). See “Design Process Wizard (DPW)” in Valor NPI Engineering Toolkit User Guide.

This analysis is performed on features belonging to nets with especially sensitive constraints, and where a signal is more sensitive to noise, reflection, or changes in electrical logic. The analysis checks the physical design of a board against the electrical requirements of nets assigned certain net attributes running on and between the layers of the board.

Identifying areas that could adversely affect signal quality helps in providing this information:

• Estimation of cost derived from the results of the analysis

• Elimination of manufacturing defects prior to tool creation

• Design parameters enabling planning the manufacturing process, down to which machines to use for production

Each analysis category is governed by a set of ERF values, usually unique to each design center.

Additional information on analysis procedures can be found in: “Valor NPI Checklist Operations User Guide” and “Valor NPI ERF Manager User Guide”.

Access: Analysis > Fabrication > Signal Layer Net Type Checks


Signal Layer Net Type Checks

October 2016

Signal Layer Net Type Checks Action Screen:

Tests Performed in Signal Layer Net Type Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 530

Net to Net Spacing Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 530

Parallel Nets Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 531

Net Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 534

Clearance According to Net Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 535

Net to Net Spacing Categories for Cadence Allegro . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 536

Attributes Used in Signal Layer Net Type Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 538

Line Mode Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 540

Relative ERF Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 540

Dynamic Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 541

Conventions and Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 541

Categories in Signal Layer Net Type Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 544Line Angle (Angles) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 550Via to Via (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 551



Via to Trace (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 552Via to Pin (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 553Via to Pad* (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 554Via to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 555Trace to Trace (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 556Trace to Pin (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 557Trace to Pad* (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 558Trace to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 559Pin to Pin (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 560Pin to Pad* (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 561Pin to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 562Pad to Pad* (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563Pad* to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 564Plane to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 565Via to Via 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 566Via to Trace 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 567Via to Pin 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 568Via to Pad* 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 569Via to Plane 3D (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 570Trace to Trace 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 571Trace to Pin 3D (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 572Trace to Pad* 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 573Trace to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 574Pin to Pin 3D (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 575Pin to Pad* 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 576Pin to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 577Pad to Pad* 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 578Pad* to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 579Plane to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 580Diff. Pair With Testpoints (Diff. Pair Properties). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 581Diff. Pair End Points (Diff. Pair Properties) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 582Diff. Pair Gap (%) (Diff. Pair Properties). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 583Diff. Pair Gap (Abs) (Diff. Pair Properties) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 584Diff. Pair Via to Via (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 585Diff. Pair Via to Trace (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 586Diff. Pair Via to Pin (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 587Diff. Pair Via to Pad* (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 588Diff. Pair Via to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 589Diff. Pair Trace to Trace (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 590Diff. Pair Trace to Pin (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 591Diff. Pair Trace to Pad* (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 592Diff. Pair Trace to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 593Diff. Pair Pin to Pin (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 594Diff. Pair Pin to Pad* (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 595Diff. Pair Pin to Plane (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 596



October 2016

Diff. Pair Pad to Pad* (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 597Diff. Pair Pad* to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 598Diff. Pair Plane to Plane (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 599Diff. Pair Via to Via 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600Diff. Pair Via to Trace 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601Diff. Pair Via to Pin 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 602Diff. Pair Via to Pad* 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 603Diff. Pair Via to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 604Diff. Pair Trace to Trace 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 605Diff. Pair Trace to Pin 3D (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606Diff. Pair Trace to Pad* 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 607Diff. Pair Trace to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 608Diff. Pair Pin to Pin 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 609Diff. Pair Pin to Pad* 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 610Diff. Pair Pin to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 611Diff. Pair Pad to Pad* 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 612Diff. Pair Pad* to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 613Diff. Pair Plane to Plane 3D (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 614Via to Via Cadence (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 615Via to Pin Cadence (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 616Via to Line Cadence (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 617Via to Shape Cadence (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 618Pin to Pin Cadence Prototype (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 619Line to Pin Cadence (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 620Pin to Shape Cadence (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 621Line to Line Cadence (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 622Line to Shape Cadence (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 623Shape to Shape Cadence (Net to Net Spacing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 624PTH to Copper (Net to Net Spacing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625Diff. Pair Length (Summary) (Net Length*) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 626Diff. Pair Length Too Short (Net Length*) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 627Diff. Pair Length Too Long (Net Length*) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 628Diff. Pair Length Difference (Net Length*) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 629Diff. Pair Missing Peer (Extraneous Data) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 630Diff. Pair Extra Nets (Extraneous Data) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 631Diff. Pair With T-junction (Extraneous Data) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 632Parallel Nets (Individual) Start (Parallel Nets) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633Parallel Nets (Individual) End (Parallel Nets) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 634Parallel Nets (Adj.) (Individual) Start (Parallel Nets) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 635Parallel Nets (Adj.) (Individual) End (Parallel Nets) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 636Parallel Nets (Accumulative) Start (Parallel Nets) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 637Parallel Nets (Accumulative) End (Parallel Nets) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 639Narrow Trace (Net Path). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 640Narrow Split Trace (Net Path) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 641Too Many Vias (Net Properties). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 642



Min Line Width (Net Properties) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 643Above Min Line Width (Net Properties) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 644Net Length by Width (Net Properties) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 645

Results Attributes for Signal Layer Net Type Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . 645

ERF Parameters for Signal Layer Net Type Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 657

ERF Variables for Signal Layer Net Type Checks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 658


Signal Layer Net Type ChecksTests Performed in Signal Layer Net Type Checks

October 2016

Tests Performed in Signal Layer Net Type Checks

The tests that are listed in the ERF parameter pp_tests in the ERF model, or are indicated in the Test List when the analysis is run, control to which categories results are reported.

Net to Net Spacing TestsThis test reports on minimum distances between features of two nets when at least one of them is a critical or differential pair net. This test contains a group of categories that check violations within layers and between layers (3D).

The Net to Net Spacing categories include measurements between any combination of features (via, trace, pin, pad, plane) found either on a net or on a differential pair of nets. Results are reported according to the two features involved and the value of ERF variable v_report_diffpair_net2net_categories.

Table 15-1. Signal Layer Net Type Checks Tests

Test Explanation

Angles Reports all angles between adjacent traces of critical nets.

Diff. Pair Properties Reports on differential pair net violations.

Net to Net Spacing Reports on minimum distances between features of two nets when at least one of them is a critical or differential pair net. See “Net to Net Spacing Tests” on page 530

Net Length Reports on maximum/minimum violations of differential pair net length. Length is defined as the entire length of the net over all layers. If restrictions have been applied for the running of tests (i.e. only in Graphic Area; only in designated area), the entire length of only nets crossing the specified area will be reported.

Extraneous Data The only check that reports all irregular differential pair nets. Irregular differential pair nets discovered during other checks are ignored.

Parallel Nets Reports individual and accumulative violations on nets that run parallel for more than a specified distance. Individual violations are for parallel nets running for more than a specified distance without breaks longer than a given length. See “Parallel Nets Tests” on page 531

Net Path Reports nets with traces that do not meet or exceed a minimum width. In the case of split traces, reports nets where the total widths involved in the sections of a split do not meet or exceed a minimum width.

Net Properties Reports nets where the number of via drills exceeds a maximum number.

Signal Layer Net Type ChecksParallel Nets Tests


If neither feature is located on a differential pair net, results are reported to the net to net categories (such as via2via or via2trace).

If at least one of the features is located on a differential pair net, results can be reported to either the net to net categories or the respective differential pair categories (such as via2via_3d; via2tract_3d), depending upon the v_report_diffpair_net2net_categories value.

v_report_diffpair_net2net_categories = yes (default) — Results are reported to the ‘diff_pair’ categories.

v_report_diffpair_net2net_categories = no — Results are reported to the ‘net to net’ categories.

Minimum net clearance can be defined according to net type. (See “Clearance According to Net Type” on page 535.) If not defined, the ERF parameter pp_net2net_spacing is used as a default clearance.

When the spacing limit between nets did not come from the CAD system, but from the default value assigned ERF parameter pp_net2net_spacing, the suffix (D) is appended to the category name—for example, *:trace2trace;net1_net2(D).

In ERF models, ranges for pairs of nets using default clearance values can be different from those of CAD net clearance values. For example, you might not want to review results from these nets at all, and assign a range like -3, -2, -1 (all blue); but for those using CAD, define net clearances 4, 5, 6.

Where having results differentiated by net type is not necessary, set v_report_diffpair_net2net_categories to no.

Because this ERF variable affects all ‘Net to Net Spacing’ categories, it is explained here and only listed in the relevant categories.

For product models prepared in Cadence Allegro V.15 or later, Net Checks support extended feature-to-feature spacing rules based on the constraint areas available in Cadence Allegro V.15. A product model that uses these net type clearances has results reported to specific categories according to feature_type1, feature_type2 and area. See “Net to Net Spacing Categories for Cadence Allegro” on page 536.

Parallel Nets TestsThis test reports individual and accumulative violations on nets that run parallel for more than a specified distance. Individual violations are for parallel nets running for more than a specified distance without breaks longer than a given length. Each parallel section is reported. Accumulative violations are reported as the sum of the lengths of the parallel sections of nets running parallel, even though there are sections where they are not parallel.



October 2016

Parallel nets are susceptible to interference (cross talk) if they run parallel for too long a distance or if the accumulative parallel distance is too great, in the same layer or in adjacent layers. The categories report either individual or accumulative measurements according to the rules established by net attributes or default ERF variables.

The measurement value for all Start categories is the length of the parallel section (in Individual categories) or the accumulative length of all parallel sections (in Accumulative categories). Parallelism is checked according to a set of rules.

The measurement value for all End categories is the maximum allowed length. This value indicates which rule has been violated.

These net attributes set the rules for these categories:

• Individ. Parallel Max. Len. List

• Individ. Parallel Dist. List

• Individ. Parallel Min. Jog List (optional)

• Accum. Parallel Max. Len. List

• Accum. Parallel Dist. List

The value of each attribute is a list of strings, separated by spaces.



When parallel nets run non-parallel for a short distance and then return to being parallel to each other, it is called a jog. Parallelism is maintained if these deviations are less than a specified jog distance.

Jog distance has no meaning in Accumulative categories because parallel length is the sum of all parallel parts of the nets.

Jog distance has no meaning in Accumulative categories because parallel length is the sum of all parallel parts of the nets.

If rules are not defined in the attributes, measurements are controlled by these ERF variables:

• v_individual_length — Maximum length that two nets are allowed to run parallel.

• v_individual_dist — Maximum distance between nets considered parallel.

• v_individual_jog — Maximum non-parallel distance to still be considered parallel.

• v_accumulative_length — Maximum accumulative length that two nets are allowed to run parallel.

• v_accumulative_dist — Maximum distance between nets considered parallel.

The Accumulative categories report the total length of parallel sections along the entire length of the two nets, even parallel sections on layers not checked directly by the analysis (in the Start category) and the total allowed parallel length over all nets (in the End category).

Example 1 - Parallel Nets (Individual) Attributes

Individ. Parallel Max. Len. List=50 75 100Individ. Parallel Dist. List=5 10 15

• Two nets, 4mil apart, run parallel for a distance of 60mil.

They violate minimum parallel distance (5mil) and maximum parallel length (50mil) specified in the first rule. The system reports Start measurement = 60mil, End measurement = 50mil.

• Two nets, 9mil apart, run parallel for a distance of 70mil.

They are not reported. They do not violate minimum distance of rule one (5). They violate the distance of rule two, but not the length. They do not violate rule three.

Example 2 - Parallel Nets (Accumulative) Attributes

Accum. Parallel Max. Len. List=100 200 300Accum. Parallel Dist. List=5 10 15


Signal Layer Net Type ChecksNet Attributes

October 2016

Two nets, 4mil apart, run parallel (on any layer) for an accumulative distance of 250. They violate both rule one and rule two and are reported as such. The system reports:

‘Start’ category measurement = 250.

‘End’ category measurement =100.

‘Start’ category measurement = 250.

‘End’ category measurement =200.

Example 3 - Parallel Nets (Adj.) (Accumulative) Attributes

Accum. Parallel Max. Len. List=300Accum. Parallel Dist. List=5 10 15

Run the Parallel Nets check on layer sig1. Two nets, 4mil apart, run parallel on sig1 for 100mil. One of them then switches to sig2 (an adjacent layer) for 150mil. Further on both of them are found on sig5 at a distance closer than 5mil for 100mil.

‘Start’ category measurement = 350 (= 100 + 150 + 100).

‘End’ category measurement = 300.

Net AttributesNet attributes are assigned by CAD systems to nets. Net attributes are conceptually similar to feature and component attributes.

Net attributes, such as Net Type and Differential Pair are introduced in measurement reports to enable distinguishing between different pairs of nets (not performed in the CAD), and lead to accurate results. Results are based on the values of net attributes (if provided). For example, a Differential Pair Spacing value, defined for a pair of nets with the same Differential Pair net attribute, specifies the gap between this pair of nets. Gaps above or below this value are reported.

Net attributes, as defined in CAD systems, are imported into Valor NPI during the EDA input process.

You can view net attributes of a feature or net in the Features Information dialog box as described in Valor NPI Graphic Station User Guide. Select a feature on a net and Shift-click the Info bar at the bottom of the graphic area.

You can view net attributes in the Info Command Interface as described in Scripts for Automation in Valor NPI System Management User Guide. Choose Entity type = EDA and Data type = NETS.

Signal Layer Net Type ChecksClearance According to Net Type


Net attributes can be modified using line mode commands.

Net attributes such as Differential Pair, Net Type, and Electrical Class are tied to subsets of other net attributes. Any change in them will be reflected in all attributes in the subset. The same is true for changes to net attributes in the subset. See Line Mode Command Reference in Valor NPI System Management User Guide

Clearance According to Net TypeEach net consists of net objects of different types: vias, traces, pins, and planes. Net type clearance defines the clearance to be maintained between two net object types on two different nets, in accordance with their Net Type attributes. A set of net type clearances is identified by two net types and a list (possibly empty) of layer names. <net_type1, net_type2, layers> describes a set of clearances between each pair of net object types, belonging to these different nets.

Pairs of net object types are formed from any object type of <net_type1> to any object type of <net_type2>.

The Cadence Allegro interface enables the setting of different clearances and other limitations according to specific areas known as constraint areas. These constraint areas each have a different set of rules for net to net spacing, differential pair net gap and minimum line width.

If a job is translated from Cadence Allegro, a documentation layer is added with shapes representing the constraint areas. These shapes contain attributes relating to area name and rules (spacing and physical) for nets found within the area. The name of the layer is controlled by configuration parameter eda_cadence_sqa_area_layer_name.

The net check actions take into account these areas when checking for spacing violations between nets or differential pairs and an allowed line width. For example:

• Two close features are first checked for the area within which they are found. The spacing rules for that area are applied according to their net and feature type.

• Differential pair gap values for within and outside constraint areas in Cadence Allegro designs take precedence over the attribute Differential Pair Spacing.

• The ‘Min Line Width’ category reports lines narrower than a minimum value determined by the area where the line is found and the type of net it is.

via trace pin plane

via via2via via2trace via2pin via2plane

trace trace2trace trace2pin trace2plane

pin pin2pin pin2plane

plane plane2plane


Signal Layer Net Type ChecksNet to Net Spacing Categories for Cadence Allegro

October 2016

Valor NPI supports Cadence Allegro extended spacing rules through net to net Cadence spacing categories. These are the possible object pairs:

Net type clearances can be viewed in the Info window. See “Scripts for Automation” in Valor NPI System Management User Guide

Net type clearances are modified using line mode commands. See “Line Mode Command Reference” in Valor NPI System Management User Guide.

Net to Net Spacing Categories for Cadence Allegro

There is a set of categories specific to Cadence Allegro product models. These categories report on product models prepared in Cadence Allegro Version 15 or later. Because Cadence Allegro has three types of via (test, bb, and thru) and three types of pin (test, thru, and smd), the categories listed in this document can represent multiple categories - each reporting on a different pair of feature types.

Signal Layer Net Type ChecksNet to Net Spacing Categories for Cadence Allegro


Cadence Allegro Feature Types

test_via — A test via. A pad with attribute Pad Usage = via and attribute ICT Test Point.

bb_via — A blind or buried via. A pad with attribute Pad Usage = via containing a drill that does not pierce both sides of the board and is not a test_via.

thru_via — A thru via. A pad with attribute Pad Usage = via and is not a bb_via or test_via.

test_pin — A test pin. A pad with attribute ICT Test Point.

thru_pin — A thru pin. A pad with attribute ICT Test Point containing a drill that pierces both sides of the board and is not a test_pin.

smd_pin — An SMD pin. A pad with attribute ICT Test Point that is not a test_pin or a thru_pin.

line — A line or arc feature.

shape — A surface feature.

Category Explanation

“Via to Via Cadence (Net to Net Spacing)” on page 615

via2via (3 types of vias; 6 categories).

“Via to Pin Cadence (Net to Net Spacing)” on page 616

via2pin (3 types of vias, 3 types of pins; 9 categories)

“Via to Line Cadence (Net to Net Spacing)” on page 617

via2line (3 types of vias, a line; 3 categories)

“Via to Shape Cadence (Net to Net Spacing)” on page 618

via2shape (3 types of vias, a shape; 3 categories)

“Pin to Pin Cadence Prototype (Net to Net Spacing)” on page 619

pin2pin (3 types of pins; 6 categories)

“Line to Pin Cadence (Net to Net Spacing)” on page 620

pin2shape (3 types of pins; a shape; 3 categories)

“Pin to Shape Cadence (Net to Net Spacing)” on page 621

line2pin (a line, 3 types of pins; 3 categories)

“Line to Line Cadence (Net to Net Spacing)” on page 622

line2line (a line)

“Line to Shape Cadence (Net to Net Spacing)” on page 623

line2shape (a line, a shape)

“Shape to Shape Cadence (Net to Net Spacing)” on page 624

shape2shape (a shape)


Signal Layer Net Type ChecksAttributes Used in Signal Layer Net Type Checks

October 2016

The ‘3-D’ and ‘Diff. Pair’ Net to Net Spacing categories are not relevant to Cadence Allegro spacing rules. If one of the features belongs to a differential pair net, the violation is reported to one of the ‘feature to feature’ categories. If both belong to the same differential pair net, then measurements are reported to one of the ‘Diff. Pair’ categories of the ‘Net Length’ or ‘Extraneous Data’ Actions.

Attributes Used in Signal Layer Net Type Checks

Attributes assigned to the nets of the product model control how the analysis tests these entities.

Net Attributes

Table 15-2. Signal Layer Net Type Checks Attributes


SQA Critical Net Specifies a critical net.

Not to be confused with the Critical Net FEATURE attribute, which does not affect Signal Layer Net Type checks.

Net Type Specifies a name for the type of the net. The Net Type net attribute sets the routing rules for a net. These rules are translated into the following net attributes:

Net Min. Length (a low limit of the net length)

Net Max. Length (a high limit of the net length)

Differential Pair Specifies a differential pair name associating two nets to be routed together.

Differential Pair Spacing

Specifies a value for the gap between differential pair nets.

Values read in mm are changed to inch.

Electrical Class An electrical class name associating a net with a set of electrical call rules. Electrical class rules include physical and electrical limitations required to assure and analyze the signal quality of a high speed net.

Min. Line Width Defines the minimum width of a trace for a net.


Net Min. Length Defines the minimum length of a line for a net.


Net Max. Length Defines the maximum length of a line for a net.


Signal Layer Net Type ChecksAttributes Used in Signal Layer Net Type Checks


Physical Type A physical type name is assigned to a net associated with relevant net properties as read from Cadence Allegro. Among these properties is minimum line width.

Thickness of Dielectric Below Layer

Describes the dielectric thickness below a layer.

Drill Type Attached to hole features in drill layers to define the type of the drill. Values are: plated, non-plated, via.

Max. Via Count Maximum number of vias on the nets.

Table 15-2. Signal Layer Net Type Checks Attributes (cont.)



Signal Layer Net Type ChecksLine Mode Commands

October 2016

Line Mode CommandsThese line mode commands relate to Signal Quality Analysis functions:

For information on Valor NPI line mode commands, see “Line Mode Command Reference” in Valor NPI System Management User Guide.

Relative ERF RangesERF ranges for net clearance checks are sometimes so diverse they must be changed for each job. It is possible to enable net spacing categories to employ relative ERF ranges by setting ERF variable v_net2net_relative_ranges = yes. You view results in red, yellow and green severity levels, but the system is instructed to take the minimum value from information contained in the job and dynamically build an ERF range similar to that found in the ERF model.

For example, the ERF range for trace2trace is 0, 1, 2. Minimum spacing between traces is 10mil. If ERF variable v_net2net_relative_ranges = yes, the values used for this job will be 10, 11, 12. These relative values are displayed in the Results Viewer as well.

It is recommended for net spacing categories that all ERF model ranges be set to have their first value as 0. In this way, the first range value will be the allowed value taken from the job. All violations fall below this value and ‘near’ violations fall into the yellow severity level above it.

Table 15-3. Signal Layer Net Type Checks Line Mode Commands

Command Response

delete_cad_net_type_clearance Searches for two specified nets in a specified layer and deletes the set of clearances previously set.

sel_cad_net Selects or deselects a specified net.

sel_cad_net_by_net_num Selects or deselects a net specified by its sequential number.

sel_cad_net_type_clearance Searches two specified nets in a specified layer for sets of objects and sets their clearance to a specified value.

sel_change_cad_net_atr Assigns net attributes to a selected net.

sel_delete_cad_net_atr Deletes net attributes from a selected net.

Signal Layer Net Type ChecksDynamic Categories


Dynamic CategoriesIn the ERF file for Signal Layer Net Type checks, you can provide ranges that specify the net types to which the range applies. Net types are extracted from a Net Type net attribute assigned to the net.

For example, ranges for the Via to Trace category (via2trace) can indicate the net types:

• via2trace;critical_critical = 6, 7, 8

• via2trace;local_pwg = 4, 5, 6

In the documentation, this sort of classification is indicated: via2trace;<net_type>_<net_type>.

These principles must be followed in setting up dynamic ranges:

• Ranges in the ERF file can use the wildcard character (*) to indicate all net types.

Exact name: via2trace;critical_critical=6, 7, 8

Wildcard: via2trace;*_*=6, 7, 8

• The Net Type net attribute string must not include an underscore (_), semicolon (;), or asterisk (*).

• Attributes are always listed alphabetically in the category name:

Correct: via2trace;critical_local

Incorrect: via2trace;local_critical

• Order of ranges in the ERF file affects the matching:

Conventions and TerminologyThese conventions, abbreviations and acronyms are used in discussions of Signal Layer Net Type Analysis.

Measurements involving the nets critical and local will be reported to the first category.

Measurements involving the critical net and any other net will be reported to the second category.

via2trace;critical_local=6, 7, 8via2trace;critical_*=6, 7, 8

Measurements involving the critical net and any other net will be reported to the first category.

No measurements will be reported to the second category.

via2trace;critical_*=6, 7, 8via2trace;critical_local=6, 7, 8


Signal Layer Net Type ChecksConventions and Terminology

October 2016

3D Measurements

Adds the third dimension, depth, to a measurement so that measurements from features in different layers can be reported.

In measurements involving adjacent or next layers, the thickness of the layer as defined in layer attribute Thickness of Dielectric Below Layer is taken into consideration. The measurement segment appears in the Results Viewer in 2D, as if from a projected feature to a projected feature.

Adjacent/Next Layer

Measurements can be performed from a signal layer to an adjacent copper layer, or to the next copper layer even if there are other intervening layers.

Signal Quality Analysis, by nature of the nets being checked, includes measurements that span multiple layers. The concept of Adjacent layer and Next layer differentiates between measurements that are between features on adjacent layers and measurements that are between layers where there are intervening layers in between.

With layer siga selected, and a filter set to copper layers:

• pg1 will be returned as a adjacent layer above.

• pg2 will be returned as a next layer below.

CAD Net

This information is available only in data read in directly from an EDA system (input from other than Gerber-like data). Every feature is identified by the electrical net to which it originally belonged in the CAD system. A CAD net includes all features in all layers with the same net name.

Signal Layer Net Type ChecksConventions and Terminology


Net Attributes

Attributes assigned to CAD nets.

Critical Net

A net attribute assigned to critical nets. Some tests will check only nets with this attribute.

Differential Pair

A set of two nets to be routed together and given the same differential pair name.

Differential pair net spacing checks apply when at least one of the features is on a net with net attribute Differential Pair. If both are on differential pair nets, the Differential Pair net attribute values must be different.

Electrical Class

An electrical class name assigned to a net, which reflects its electrical characteristics such as rise time and impedance.

Net Type

The net type of a net reflects its physical requirements.

Net Type Clearance

Clearance rules assigned to two net types and a layer (optional). Each clearance defines the distance to be maintained between two objects from the nets.

Object Type

Features on a net (via, pad, pin, trace, plane).


Signal Layer Net Type ChecksCategories in Signal Layer Net Type Checks

October 2016

Categories in Signal Layer Net Type ChecksThe full name of the category and its test group serves as the title. Each category is described in detail, accompanied by an example of a typical measurement.

Table 15-4. Signal Layer Net Type Check Categories


Line Angle (Angles) Reports all angles between adjacent traces in nets with net attribute SQA Critical Net.

Via to Via (Net to Net Spacing)

Reports the distance between a via pad of Net 1 and a via pad of Net 2 on the same signal/mixed layer.

Via to Trace (Net to Net Spacing)

Reports the distance between a via pad of Net 1 and a trace of Net 2 on the same signal or mixed layer.

Via to Pin (Net to Net Spacing)

Reports the distance between a via pad of Net 1 and a pin of Net 2 on the same signal/mixed layer.

Via to Pad* (Net to Net Spacing)

Reports the distance between a via pad of Net 1 and a pad of Net 2 on the same signal or mixed layer.

Via to Plane (Net to Net Spacing)

Reports the distance between a via pad of Net 1 and a plane of Net 2 on the same signal/mixed layer.

Trace to Trace (Net to Net Spacing)

Reports the distance between a trace of Net 1 and a trace of Net 2 on the same signal or mixed layer.

Trace to Pin (Net to Net Spacing)

Reports the distance between a trace of Net 1 and a pin of Net 2 on the same signal/mixed layer.

Trace to Pad* (Net to Net Spacing)

Reports the distance between a trace of Net 1 and a pad of Net 2 on the same signal/mixed layer.

Trace to Plane (Net to Net Spacing)

Reports the distance between a trace of Net 1 and a plane of Net 2 on the same signal/mixed layer.

Pin to Pin (Net to Net Spacing)

Reports the distance between a pin of Net 1 and a pin of Net 2 on the same signal/mixed layer.

Pin to Pad* (Net to Net Spacing)

Reports the distance between a pin of Net 1 and a pad of Net 2 on the same signal/mixed layer.

Pin to Plane (Net to Net Spacing)

Reports the distance between a pin of Net 1 and a plane of Net 2 on the same signal/mixed layer.

Pad to Pad* (Net to Net Spacing)

Reports the distance between a pad of Net 1 and a pad of Net 2 on the same signal or mixed layer, when the second pad is not a toeprint.

Pad* to Plane (Net to Net Spacing)

Reports the distance between a pad of Net 1 and a plane of Net 2 on the same signal/mixed layer, when the pad is not a toeprint.



Plane to Plane (Net to Net Spacing)

Reports the distance between a plane of Net 1 and a plane of Net 2 on the same signal/mixed layer.

Via to Via 3D (Net to Net Spacing)

Reports the 3D distance between a via of Net 1 and a via of Net 2 on an adjacent signal/mixed layer.

Via to Trace 3D (Net to Net Spacing)

Reports the 3D distance between a trace of Net 1 and a via pad of Net 2 on an adjacent signal/mixed layer.

Via to Pin 3D (Net to Net Spacing)

Reports the 3D distance between a via pad of Net 1 and a pin of Net 2 on an adjacent signal/mixed layer.

Via to Pad* 3D (Net to Net Spacing)

Reports the 3D distance between a via pad of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint.

Via to Plane 3D (Net to Net Spacing)

Reports the 3D distance between a via pad of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer.

Trace to Trace 3D (Net to Net Spacing)

Reports the 3D distance between a trace of Net 1 and a trace of Net 2 on an adjacent signal/mixed layer.

Trace to Pin 3D (Net to Net Spacing)

Reports the 3D distance between a trace of Net 1 and a pin of Net 2 on an adjacent signal/mixed layer.

Trace to Pad* 3D (Net to Net Spacing)

Reports the 3D distance between a trace of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint.

Trace to Plane 3D (Net to Net Spacing)

Reports the 3D distance between a trace of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer.

Pin to Pin 3D (Net to Net Spacing)

Reports the 3D distance between a pin of Net 1 and a pin of Net 2 on an adjacent signal/mixed layer.

Pin to Pad* 3D (Net to Net Spacing)

Reports the 3D distance between a pin of Net 1 and a pad of Net 2 on an adjacent signal or mixed layer, when the pad is not a toeprint.

Pin to Plane 3D (Net to Net Spacing)

Reports the 3D distance between a pin of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer.

Pad to Pad* 3D (Net to Net Spacing)

Reports the 3D distance between a pad of Net 1 and a pad of Net 2 on an adjacent signal or mixed layer, when the second pad is not a toeprint.

Pad* to Plane 3D (Net to Net Spacing)

Reports the 3D distance between a pad of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint.

Plane to Plane 3D (Net to Net Spacing)

Reports the 3D distance between a plane of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer.

Table 15-4. Signal Layer Net Type Check Categories (cont.)




October 2016

Diff. Pair With Testpoints (Diff. Pair Properties)

Reports all testpoints on a net with net attribute Differential Pair.

Diff. Pair End Points (Diff. Pair Properties)

Reports differential pair nets whose endpoints extend too far from their mutual path.

Diff. Pair Gap (%) (Diff. Pair Properties)

Reports differential pair nets that do not maintain the same distance between them throughout the entire net route.

Diff. Pair Gap (Abs) (Diff. Pair Properties)

Reports differential pair nets that do not maintain the same distance between them throughout the entire net route.

Diff. Pair Via to Via (Net to Net Spacing)

Reports the distance between a via pad of Net 1 and a via pad of Net 2 on the same signal/mixed layer.

Diff. Pair Via to Trace (Net to Net Spacing)

Reports the distance between a trace of Net 1 and a via pad of Net 2 on the same signal/mixed layer.

Diff. Pair Via to Pin (Net to Net Spacing)

Reports the distance between a via pad of Net 1 and a pin of Net 2 on the same signal or mixed layer.

Diff. Pair Via to Pad* (Net to Net Spacing)

Reports the distance between a via pad of Net 1 and a pad of Net 2 on the same signal or mixed layer, when the pad is not a toeprint.

Diff. Pair Via to Plane (Net to Net Spacing)

Reports the distance between a plane of Net 1 and a via pad of Net 2 on the same signal or mixed layer.

Diff. Pair Trace to Trace (Net to Net Spacing)

Reports the distance between a trace of Net 1 and a trace of Net 2 on the same signal/mixed layer.

Diff. Pair Trace to Pin (Net to Net Spacing)

Reports the distance between a trace of Net 1 and a pin of Net 2 on the same signal/mixed layer.

Diff. Pair Trace to Pad* (Net to Net Spacing)

Reports distances between traces of Net 1 and pads of Net 2 on the same signal/mixed layer, when the pad is not a toeprint.

Diff. Pair Trace to Plane (Net to Net Spacing)

Reports the distance between a trace of Net 1 and a plane of Net 2 on the same signal/mixed layer.

Diff. Pair Pin to Pin (Net to Net Spacing)

Reports the distance between a pin of Net 1 and a pin of Net 2 on the same signal/mixed layer.:

Diff. Pair Pin to Pad* (Net to Net Spacing)

Reports the distance between a pin of Net 1 and a pad of Net 2 on the same signal/mixed layer, when the pad is not a toeprint.

Diff. Pair Pin to Plane (Net to Net Spacing)

Reports the distance between a pin of Net 1 and a plane of Net 2 on the same signal/mixed layer.

Diff. Pair Pad to Pad* (Net to Net Spacing)

Reports the distance between a pad of Net 1 and a pad of Net 2 on the same signal/mixed layer, when the second pad is not a toeprint.





Diff. Pair Pad* to Plane (Net to Net Spacing)

Reports the distance between a pad of Net 1 and a plane of Net 2 on the same signal/mixed layer, when the pad is not a toeprint.

Diff. Pair Plane to Plane (Net to Net Spacing)

Reports the distance between a plane of Net 1 and a plane of Net 2 on the same signal/mixed layer.

Diff. Pair Via to Via 3D (Net to Net Spacing)

Reports the 3D distance between a via pad of Net 1 and a via pad of Net 2 on an adjacent signal/mixed layer.

Diff. Pair Via to Trace 3D (Net to Net Spacing)

Reports the 3D distance between a trace of Net 1 and a via pad of Net 2 on an adjacent signal/mixed layer.

Diff. Pair Via to Pin 3D (Net to Net Spacing)

Reports the 3D distance between a via pad of Net 1 and a pin of Net 2 on an adjacent signal or mixed layer.

Diff. Pair Via to Pad* 3D (Net to Net Spacing)

Reports the 3D distance between a via pad of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint.

Diff. Pair Via to Plane 3D (Net to Net Spacing)

Reports the 3D distance between a plane of Net 1 and a via pad of Net 2 on an adjacent signal/mixed layer.

Diff. Pair Trace to Trace 3D (Net to Net Spacing)

Reports the 3D distance between a trace of Net 1 and a trace of Net 2 on an adjacent signal/mixed layer.

Diff. Pair Trace to Pin 3D (Net to Net Spacing)

Reports the 3D distance between a trace of Net 1 and a pin of Net 2 on an adjacent signal/mixed layer.

Diff. Pair Trace to Pad* 3D (Net to Net Spacing)

Reports the 3D distance between a trace of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint.

Diff. Pair Trace to Plane 3D (Net to Net Spacing)

Reports the 3D distance between a trace of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer.

Diff. Pair Pin to Pin 3D (Net to Net Spacing)

Reports the 3D distance between a pin of Net 1 and a pin of Net 2 on an adjacent signal or mixed layer.

Diff. Pair Pin to Pad* 3D (Net to Net Spacing)

Reports the 3D distance between a pin of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint.

Diff. Pair Pin to Plane 3D (Net to Net Spacing)

Reports the 3D distance between a pin of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer.

Diff. Pair Pad to Pad* 3D (Net to Net Spacing)

Reports the 3D distance between a pad of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the second pad is not a toeprint.

Diff. Pair Pad* to Plane 3D (Net to Net Spacing)

Reports the 3D distance between a pad of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint.





October 2016

Diff. Pair Plane to Plane 3D (Net to Net Spacing)

Reports the 3D distance between a plane of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer

Via to Via Cadence (Net to Net Spacing)

Reports the distance between a via pad of Net 1 (bb, test or thru) and a via pad of Net 2 (bb, test or thru) on the same signal/mixed layer.

Via to Pin Cadence (Net to Net Spacing)

Reports the distance between a via pad (bb, test or thru) of Net 1 and a pin (test, thru or smd) of Net 2 on the same signal/mixed layer.

Via to Line Cadence (Net to Net Spacing)

Reports the distance between a via pad of Net 1 and a line of Net 2 on the same signal/mixed layer

Via to Shape Cadence (Net to Net Spacing)

Reports the distance between a via pad of Net 1 and a shape of Net 2 on the same signal/mixed layer.

Pin to Pin Cadence Prototype (Net to Net Spacing)

Reports the distance between a pin of Net 1 and a pin of Net 2 on the same signal/mixed layer.

Line to Pin Cadence (Net to Net Spacing)

Reports the distance between a line of Net 1 and a pin of Net 2 on the same signal/mixed layer

Pin to Shape Cadence (Net to Net Spacing)

Reports the distance between a pin of Net 1 and a shape of Net 2 on the same signal/mixed layer.

Line to Line Cadence (Net to Net Spacing)

Reports the distance between a line of Net 1 and a line of Net 2 on the same signal/mixed layer.

Line to Shape Cadence (Net to Net Spacing)

Reports the distance between a line of Net 1 and a shape of Net 2 on the same signal/mixed layer.

Shape to Shape Cadence (Net to Net Spacing)

Reports the distance between a shape of Net 1 and a shape of Net 2 on the same signal/mixed layer.

PTH to Copper (Net to Net Spacing)

Reports the distance between the copper of Net 1 and a PTH drill of Net 2 that pass through the signal or mixed or copper layers.

Diff. Pair Length (Summary) (Net Length*)

Reports the length of a net belonging to a differential pair.

Diff. Pair Length Too Short (Net Length*)

Reports the too-short length of a net belonging to a differential pair.

Diff. Pair Length Too Long (Net Length*)

Reports the too long length of a net belonging to a differential pair.

Diff. Pair Length Difference (Net Length*)

Reports the difference in length of a differential pair of nets.





Diff. Pair Missing Peer (Extraneous Data)

Reports all nets with net attribute Differential Pair for which there is no corresponding net with the same Differential Pair net attribute.

Diff. Pair Extra Nets (Extraneous Data)

Reports all nets with a Differential Pair net attribute for which there are more than two nets assigned the same Differential Pair net attribute.

Diff. Pair With T-junction (Extraneous Data)

Reports nets with net attribute Differential Pair13 for which there are more than two endpoints.

Parallel Nets (Individual) Start (Parallel Nets)

Reports two nets, one of which is has attribute SQA Critical Net, running parallel for too long a distance.

Parallel Nets (Individual) End (Parallel Nets)

Reports two nets (one of which has net attribute SQA Critical Net) running parallel for too long a distance

Parallel Nets (Adj.) (Individual) Start (Parallel Nets)

Reports two nets (one of which has net attribute SQA Critical Net) running parallel on adjacent layers for too long a distance.

Parallel Nets (Adj.) (Individual) End (Parallel Nets)

Reports two nets (one of which has net attribute SQA Critical Net) running parallel on adjacent layers for too long a distance.

Parallel Nets (Accumulative) Start (Parallel Nets)

Reports two nets (one of which has net attribute SQA Critical Net) running parallel for too long a distance.

Parallel Nets (Accumulative) End (Parallel Nets)

Reports two nets (one of which has net attribute SQA Critical Net) running parallel for a too long a distance.

Narrow Trace (Net Path) Checks the width of traces between each two end points on a net with net attributes Min. Line Width and SQA Critical Net.

Narrow Split Trace (Net Path)

Checks the width of traces between each two end points on a net with net attributes Min. Line Width and SQA Critical Net.

Too Many Vias (Net Properties)

Checks that the number of via drills on a net with attribute Max. Via Count does not exceed the value of this attribute.

Min Line Width (Net Properties)

Reports lines with a width under the allowed value as taken from the CAD system.

Above Min Line Width (Net Properties)

Reports lines with a width above that of the minimum line width as taken from the CAD system.

Net Length by Width (Net Properties)

Reports the total length of all traces belonging to the same net, of the same width and on the same layer.




Signal Layer Net Type ChecksLine Angle (Angles)

October 2016

Line Angle (Angles)Reports all angles between adjacent traces in nets with net attribute SQA Critical Net.

Analysis Category line_ang;<net_type>

Measurement Shape

Value

IDs

Arc angle

Angle

Line 1; Line 2

Layers Displayed Signal/mixed layer containing the lines

Graphic

Purpose Angles which are too sharp cause reflection.

Function Reports all angles between adjacent traces in nets with net attribute SQA Critical Net.

ERF Parameters

ERF Variables v_short_line_len

v_angles_tol

Limitations

Signal Layer Net Type ChecksVia to Via (Net to Net Spacing)


Via to Via (Net to Net Spacing)Reports the distance between a via pad of Net 1 and a via pad of Net 2 on the same signal/mixed layer.

Analysis Category via2via;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic

Purpose Spacing between the features of two different nets must be sufficient to prevent EMI effects.

Function Reports the distance between a via pad of Net 1 and a via pad of Net 2 on the same signal/mixed layer if:

• at least one of the nets is a critical net (with net attribute SQA Critical Net).

• neither net is a differential pair net (with net attribute Differential Pair) and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Via to Via’.)

• the distance is less than the net clearance defined for the relevant net types and may also include layer restrictions and a relevant constraint area. If not defined, pp_net2net_spacing determines net clearance.

ERF Parameters pp_net2net_spacing

ERF Variables v_net2net_relative_ranges

v_report_diffpair_net2net_categories

Limitations


Signal Layer Net Type ChecksVia to Trace (Net to Net Spacing)

October 2016

Via to Trace (Net to Net Spacing)Reports the distance between a via pad of Net 1 and a trace of Net 2 on the same signal or mixed layer.

Analysis Category via2trace;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a via pad of Net 1 and a trace of Net 2 on the same signal/mixed layer if:

• At least one of the nets is a critical net (with net attribute SQA Critical Net).

• Neither net is a differential pair net (with net attribute Differential Pair) and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Via to Trace’.)

• The distance is less than the net clearance defined for the relevant net types and may also include layer restrictions and a relevant constraint area. If not defined, pp_net2net_spacing determines net clearance.




Limitations

Signal Layer Net Type ChecksVia to Pin (Net to Net Spacing)


Via to Pin (Net to Net Spacing)Reports the distance between a via pad of Net 1 and a pin of Net 2 on the same signal/mixed layer.

Analysis Category via2pin;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a via pad of Net 1 and a pin of Net 2 on the same signal/mixed layer if:

• at least one of the nets is a critical net (with a SQA Critical Net net attribute).

• neither net is a differential pair net (with net attribute Differential Pair) and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Via to Pin’.)

• the distance is less than the net clearance defined for the relevant net types and may also and a relevant constraint area. If not defined, pp_net2net_spacing determines net clearance.




Limitations


Signal Layer Net Type ChecksVia to Pad* (Net to Net Spacing)

October 2016

Via to Pad* (Net to Net Spacing)Reports the distance between a via pad of Net 1 and a pad of Net 2 on the same signal or mixed layer.

Analysis Category via2pad;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a via pad of Net 1 and a pad of Net 2 on the same signal/mixed layer if:

• At least one of the nets is a critical net (with net attribute SQA Critical Net).

• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases are reported in ‘Diff. Pair Via to Pad’.)

• The distance is less than the net clearance defined for the relevant net types and may also and a relevant constraint area. If not defined, pp_net2net_spacing determines net clearance.

* When pad is not a toeprint.




Limitations

Signal Layer Net Type ChecksVia to Plane (Net to Net Spacing)


Via to Plane (Net to Net Spacing)Reports the distance between a via pad of Net 1 and a plane of Net 2 on the same signal/mixed layer.

Analysis Category via2plane;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a via pad of Net 1 and a plane of Net 2 on the same signal/mixed layer if:

• At least one of the nets is a critical net (with attribute SQA Critical Net).

• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases are reported in ‘Diff. Pair Via to Plane’.)





Limitations


Signal Layer Net Type ChecksTrace to Trace (Net to Net Spacing)

October 2016

Trace to Trace (Net to Net Spacing)Reports the distance between a trace of Net 1 and a trace of Net 2 on the same signal or mixed layer.

Analysis Category trace2trace;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a trace of Net 1 and a trace of Net 2 on the same signal/mixed layer if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Trace to Trace’.)





Limitations

Signal Layer Net Type ChecksTrace to Pin (Net to Net Spacing)


Trace to Pin (Net to Net Spacing)Reports the distance between a trace of Net 1 and a pin of Net 2 on the same signal/mixed layer.

Analysis Category trace2pin;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2

Layers Displayed Signal or mixed layer

Graphic


Function Reports the distance between a trace of Net 1 and a pin of Net 2 on the same signal/mixed layer if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Trace to Pin’.)





Limitations


Signal Layer Net Type ChecksTrace to Pad* (Net to Net Spacing)

October 2016

Trace to Pad* (Net to Net Spacing)Reports the distance between a trace of Net 1 and a pad of Net 2 on the same signal/mixed layer.

Analysis Category trace2pad;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a trace of Net 1 and a pad of Net 2 on the same signal/mixed layer if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Trace to Pad’.)






Limitations

Signal Layer Net Type ChecksTrace to Plane (Net to Net Spacing)


Trace to Plane (Net to Net Spacing)Reports the distance between a trace of Net 1 and a plane of Net 2 on the same signal/mixed layer.

Analysis Category trace2plane;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a trace of Net 1 and a plane of Net 2 on the same signal/mixed layer if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Trace to Plane’.)





Limitations


Signal Layer Net Type ChecksPin to Pin (Net to Net Spacing)

October 2016

Pin to Pin (Net to Net Spacing)Reports the distance between a pin of Net 1 and a pin of Net 2 on the same signal/mixed layer.

Analysis Category pin2pin;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a pin of Net 1 and a pin of Net 2 on the same signal/mixed layer if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Pin to Pin’.)





Limitations

Signal Layer Net Type ChecksPin to Pad* (Net to Net Spacing)


Pin to Pad* (Net to Net Spacing)Reports the distance between a pin of Net 1 and a pad of Net 2 on the same signal/mixed layer.

Analysis Category pin2pad;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a pin of Net 1 and a pad of Net 2 on the same signal/mixed layer if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Pin to Pad’.)






Limitations


Signal Layer Net Type ChecksPin to Plane (Net to Net Spacing)

October 2016

Pin to Plane (Net to Net Spacing)Reports the distance between a pin of Net 1 and a plane of Net 2 on the same signal/mixed layer.

Analysis Category pin2plane;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a pin of Net 1 and a plane of Net 2 on the same signal/mixed layer if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Pin to Plane’.)

• The distance is less than the net clearance* defined for the relevant net types. If not defined, pp_net2net_spacing determines net clearance.





Limitations

Signal Layer Net Type ChecksPad to Pad* (Net to Net Spacing)


Pad to Pad* (Net to Net Spacing)Reports the distance between a pad of Net 1 and a pad of Net 2 on the same signal or mixed layer, when the second pad is not a toeprint.

Analysis Category pad2pad;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a pad of Net 1 and a pad of Net 2 on the same signal or mixed layer, when the second pad is not a toeprint, if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Pad to Pad’.)





Limitations


Signal Layer Net Type ChecksPad* to Plane (Net to Net Spacing)

October 2016

Pad* to Plane (Net to Net Spacing)Reports the distance between a pad of Net 1 and a plane of Net 2 on the same signal/mixed layer, when the pad is not a toeprint.

Analysis Category pad2plane;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a pad of Net 1 and a plane of Net 2 on the same signal/mixed layer. when the pad is not a toeprint, if:

• at least one of the nets is a critical net (with attribute SQA Critical Net).

• neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Pad to Plane’.)





Limitations

Signal Layer Net Type ChecksPlane to Plane (Net to Net Spacing)


Plane to Plane (Net to Net Spacing)Reports the distance between a plane of Net 1 and a plane of Net 2 on the same signal/mixed layer.

Analysis Category plane2plane;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a plane of Net 1 and a plane of Net 2 on the same signal/mixed layer if:


• neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Plane to Plane’.)





Limitations


Signal Layer Net Type ChecksVia to Via 3D (Net to Net Spacing)

October 2016

Via to Via 3D (Net to Net Spacing)Reports the 3D distance between a via of Net 1 and a via of Net 2 on an adjacent signal/mixed layer.

Analysis Category via2via_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment (3D distance represented in 2D)

3D distance

Net 1; Net 2

Layers Displayed Signal/mixed layer of Net 1

Signal/mixed layer of Net 2

Graphic

Purpose Spacing between the features of two different nets on adjacent layers must be sufficient to prevent EMI effects.

Function Reports the 3D distance between a via of Net 1 and a via of Net 2 on an adjacent signal/mixed layer if:


• neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Via to Via 3D’.)

• the distance is less than the net clearance defined for the relevant net types. (If not defined, pp_net2net_spacing determines net clearance.)

Distance between layers is determined by the layer attribute Thickness of Dielectric Below Layer.




Limitations

Signal Layer Net Type ChecksVia to Trace 3D (Net to Net Spacing)


Via to Trace 3D (Net to Net Spacing)Reports the 3D distance between a trace of Net 1 and a via pad of Net 2 on an adjacent signal/mixed layer.

Analysis Category via2trace_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a trace of Net 1 and a via pad of Net 2 on an adjacent signal/mixed layer if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Via to Trace 3D’.)

• The distance is less than the net clearance defined for the relevant net types. If not defined, pp_net2net_spacing determines net clearance.





Limitations


Signal Layer Net Type ChecksVia to Pin 3D (Net to Net Spacing)

October 2016

Via to Pin 3D (Net to Net Spacing)Reports the 3D distance between a via pad of Net 1 and a pin of Net 2 on an adjacent signal/mixed layer.

Analysis Category via2pin_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a via pad of Net 1 and a pin of Net 2 on an adjacent signal/mixed layer if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Via to Pin 3D’.)

• The distance is less than the net clearance defined for the relevant net types. (If not defined, pp_net2net_spacing determines net clearance.)





Limitations

Signal Layer Net Type ChecksVia to Pad* 3D (Net to Net Spacing)


Via to Pad* 3D (Net to Net Spacing)Reports the 3D distance between a via pad of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint.

Analysis Category via2pad_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a via pad of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint, if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Via to Pad 3D’.)






Limitations


Signal Layer Net Type ChecksVia to Plane 3D (Net to Net Spacing)

October 2016

Via to Plane 3D (Net to Net Spacing)Reports the 3D distance between a via pad of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer.

Analysis Category via2plane_3d;<net_type>_<net_type>

Measurement Shape

Value

ID(s)


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a via pad of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes.(Such cases reported in ‘Diff. Pair Via to Plane 3D’.)






Limitations

Signal Layer Net Type ChecksTrace to Trace 3D (Net to Net Spacing)


Trace to Trace 3D (Net to Net Spacing)Reports the 3D distance between a trace of Net 1 and a trace of Net 2 on an adjacent signal/mixed layer.

Analysis Category trace2trace_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a trace of Net 1 and a trace of Net 2 on an adjacent signal/mixed layer if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Trace to Trace 3D’.)






Limitations


Signal Layer Net Type ChecksTrace to Pin 3D (Net to Net Spacing)

October 2016

Trace to Pin 3D (Net to Net Spacing)Reports the 3D distance between a trace of Net 1 and a pin of Net 2 on an adjacent signal/mixed layer.

Analysis Category trace2pin_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a trace of Net 1 and a pin of Net 2 on an adjacent signal/mixed layer if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Trace to Pin 3D’.)

• The distance is less than the net clearance defined for the relevant net types. If not defined, pp_net2net_spacing determines net clearance.)





Limitations

Signal Layer Net Type ChecksTrace to Pad* 3D (Net to Net Spacing)


Trace to Pad* 3D (Net to Net Spacing)Reports the 3D distance between a trace of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint.

Analysis Category trace2pad_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a trace of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint, if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Trace to Pad 3D’.)






Limitations


Signal Layer Net Type ChecksTrace to Plane 3D (Net to Net Spacing)

October 2016

Trace to Plane 3D (Net to Net Spacing)Reports the 3D distance between a trace of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer.

Analysis Category trace2plane_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a trace of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories = yes. (Such cases reported to Diff. Pair Trace to Plane 3D.)






Limitations

Signal Layer Net Type ChecksPin to Pin 3D (Net to Net Spacing)


Pin to Pin 3D (Net to Net Spacing)Reports the 3D distance between a pin of Net 1 and a pin of Net 2 on an adjacent signal/mixed layer.

Analysis Category pin2pin_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a pin of Net 1 and a pin of Net 2 on an adjacent signal/mixed layer if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories = yes. (Such cases reported to ‘ Diff. Pair Pin to Pin 3D’ .)






Limitations


Signal Layer Net Type ChecksPin to Pad* 3D (Net to Net Spacing)

October 2016

Pin to Pad* 3D (Net to Net Spacing)Reports the 3D distance between a pin of Net 1 and a pad of Net 2 on an adjacent signal or mixed layer, when the pad is not a toeprint.

Analysis Category pin2pad_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a pin of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint, if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Pin to Pad 3D’.)

• The distance is less than the net clearance defined for the relevant net types If not defined, pp_net2net_spacing determines net clearance.





Limitations

Signal Layer Net Type ChecksPin to Plane 3D (Net to Net Spacing)


Pin to Plane 3D (Net to Net Spacing)Reports the 3D distance between a pin of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer.

Analysis Category pin2plane_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a pin of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Pin to Plane 3D’.)






Limitations


Signal Layer Net Type ChecksPad to Pad* 3D (Net to Net Spacing)

October 2016

Pad to Pad* 3D (Net to Net Spacing)Reports the 3D distance between a pad of Net 1 and a pad of Net 2 on an adjacent signal or mixed layer, when the second pad is not a toeprint.

Analysis Category pad2pad_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a pad of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint, if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Pad to Pad 3D’.)

• The distance is less than the net clearance defined for the relevant net types. (See “Clearance According to Net Type” on page 535.) If not defined, pp_net2net_spacing determines net clearance.





Limitations

Signal Layer Net Type ChecksPad* to Plane 3D (Net to Net Spacing)


Pad* to Plane 3D (Net to Net Spacing)Reports the 3D distance between a pad of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint.

Analysis Category pad2plane_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a pad of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint, if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Pad to Plane 3D’.)






Limitations


Signal Layer Net Type ChecksPlane to Plane 3D (Net to Net Spacing)

October 2016

Plane to Plane 3D (Net to Net Spacing)Reports the 3D distance between a plane of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer.

Analysis Category plane2plane_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a plane of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer if:


• Neither net is a differential pair net and v_report_diffpair_net2net_categories=yes. (Such cases reported in ‘Diff. Pair Plane to Plane 3D’.)






Limitations

Signal Layer Net Type ChecksDiff. Pair With Testpoints (Diff. Pair Properties)


Diff. Pair With Testpoints (Diff. Pair Properties)Reports all testpoints on a net with net attribute Differential Pair.

Analysis Category dp_testpoints;<net_type>

Measurement Shape

Value

IDs

Testpoint shape

Symbol number assigned to an arbitrary shape on the net

DP name


Graphic

Purpose To avoid placing testpoints on differential pair nets. When a probe connects to a testpoint the differential impedance between a pair of nets is changed and may cause the logic to fail.

Function Reports all testpoints on a net with net attribute Differential Pair.

ERF Parameters

ERF Variables

Limitations


Signal Layer Net Type ChecksDiff. Pair End Points (Diff. Pair Properties)

October 2016

Diff. Pair End Points (Diff. Pair Properties) Reports differential pair nets whose endpoints extend too far from their mutual path.

Analysis Category dp_end_points;<net_type>

Measurement Shape

Value

IDs

Point

Length

DP name


Graphic

Purpose Significant divergence from the mutual path of Differential Pair nets causes electrical interference

Function Reports all nets with net attribute Differential Pair whose endpoints extend a distance of ERF variable v_dpair_end_point_len from their mutual path.

ERF Parameters

ERF Variables v_dpair_end_point_len

Limitations

Signal Layer Net Type ChecksDiff. Pair Gap (%) (Diff. Pair Properties)


Diff. Pair Gap (%) (Diff. Pair Properties)Reports differential pair nets that do not maintain the same distance between them throughout the entire net route.

Analysis Category dp_gap_p;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Percentage

DP name

Layers Displayed Signal layer (one representative layer of the net)

Graphic

Purpose Differential pair electrical logic depends upon maintaining an equal distance between the nets.

Function Reports differential pair nets with net attribute Differential Pair that do not maintain the same distance between them throughout the entire net route. The check compares the distance to the value of Differential Pair Spacing (imported from the CAD), if present. If not, it compares it to pp_dpair_gap, the default gap value. If the difference between the distance measurement and the default gap value exceeds the tolerance +v_dpair_gap_tol_p (percent), it is reported as a violation expressed as a percentage of the specified gap.

For Cadence Allegro designs, the check first determines the differential pair gap value to be used. Before V15.0 this information was taken from within/without constraint areas. From V15.0 it is taken from the electrical constraint set table. If not present, the check then searches for attribute Differential Pair Spacing attached to the net (earlier versions). If no attribute found it then proceeds as described.

ERF Parameters pp_dpair_gap

ERF Variables v_dpair_gap_tol_p

Limitations Ignores Differential Pair nets with stubs or T-junctions.


Signal Layer Net Type ChecksDiff. Pair Gap (Abs) (Diff. Pair Properties)

October 2016

Diff. Pair Gap (Abs) (Diff. Pair Properties)Reports differential pair nets that do not maintain the same distance between them throughout the entire net route.

Analysis Category dp_gap_abs;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

DP name


Graphic

Purpose Differential pair electrical logic depends upon maintaining an equal distance between the nets.

Function Reports differential pair nets with net attribute Differential Pair which do not maintain the same distance between them throughout the entire net route. The check compares the distance to the value of Differential Pair Spacing (imported from the CAD), if present. If not, it compares it to pp_dpair_gap, the default gap value. If the difference between the distance measurement and the default gap value exceeds the tolerance +v_dpair_gap_tol_p (percent), it is reported as a violation expressed as the actual size of the specified gap.

Before V15.0 this information was taken from within/without constraint areas. From V15.0 it is taken from the electrical constraint set table. If not present, the check then searches for attribute Differential Pair Spacing attached to the net (as in earlier versions). If no attribute found it then proceeds as described.

ERF Parameters pp_dpair_gap

ERF Variables v_dpair_gap_tol_p


Signal Layer Net Type ChecksDiff. Pair Via to Via (Net to Net Spacing)


Diff. Pair Via to Via (Net to Net Spacing)Reports the distance between a via pad of Net 1 and a via pad of Net 2 on the same signal/mixed layer.

Analysis Category dp_via2via;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

3D distance

Net 1; Net 2


Graphic

Purpose Spacing between the features of two different nets, one on a Diff. Pair net or both on different Diff. Pair nets) on the same layer must be sufficient to prevent EMI effects.

Function Reports the distance between a via pad of Net 1 and a via pad of Net 2 on the same signal/mixed layer where:

• At least one of the features is on a differential pair net (with net attribute Differential Pair). If both are on differential pair nets, their Differential Pair net attributes must be different.


• ERF variable v_report_diffpair_net2net_categories = yes.



v_report_diffpair_net2net_categories = yes

Limitations


Signal Layer Net Type ChecksDiff. Pair Via to Trace (Net to Net Spacing)

October 2016

Diff. Pair Via to Trace (Net to Net Spacing)Reports the distance between a trace of Net 1 and a via pad of Net 2 on the same signal/mixed layer.

Analysis Category dp_via2trace;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a trace of Net 1 and a via pad of Net 2 on the same signal/mixed layer where:



• ERF variable v_report_diffpair_net2net_categories=yes.




Limitations

Signal Layer Net Type ChecksDiff. Pair Via to Pin (Net to Net Spacing)


Diff. Pair Via to Pin (Net to Net Spacing)Reports the distance between a via pad of Net 1 and a pin of Net 2 on the same signal or mixed layer.

Analysis Category dp_via2pin;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a via pad of Net 1 and a pin of Net 2 on the same signal/mixed layer where:







Limitations


Signal Layer Net Type ChecksDiff. Pair Via to Pad* (Net to Net Spacing)

October 2016

Diff. Pair Via to Pad* (Net to Net Spacing)Reports the distance between a via pad of Net 1 and a pad of Net 2 on the same signal or mixed layer, when the pad is not a toeprint.

Analysis Category dp_via2pad;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a via pad of Net 1 and a pad of Net 2 on the same signal or mixed layer, when the pad is not a toeprint, where:







Limitations

Signal Layer Net Type ChecksDiff. Pair Via to Plane (Net to Net Spacing)


Diff. Pair Via to Plane (Net to Net Spacing)Reports the distance between a plane of Net 1 and a via pad of Net 2 on the same signal or mixed layer.

Analysis Category dp_via2plane;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a plane of Net 1 and a via pad of Net 2 on the same signal or mixed layer where:







Limitations


Signal Layer Net Type ChecksDiff. Pair Trace to Trace (Net to Net Spacing)

October 2016

Diff. Pair Trace to Trace (Net to Net Spacing)Reports the distance between a trace of Net 1 and a trace of Net 2 on the same signal/mixed layer.

Analysis Category dp_trace2trace;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a trace of Net 1 and a trace of Net 2 on the same signal/mixed layer where:







Limitations

Signal Layer Net Type ChecksDiff. Pair Trace to Pin (Net to Net Spacing)


Diff. Pair Trace to Pin (Net to Net Spacing)Reports the distance between a trace of Net 1 and a pin of Net 2 on the same signal/mixed layer.

Analysis Category dp_trace2pin;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a trace of Net 1 and a pin of Net 2 on the same signal/mixed layer where:


• The distance is less than the net clearance defined for the relevant net types. See “Clearance According to Net Type” on page 535. If not defined, pp_net2net_spacing determines net clearance.





Limitations


Signal Layer Net Type ChecksDiff. Pair Trace to Pad* (Net to Net Spacing)

October 2016

Diff. Pair Trace to Pad* (Net to Net Spacing)Reports distances between traces of Net 1 and pads of Net 2 on the same signal/mixed layer, when the pad is not a toeprint.

Analysis Category dp_trace2pad;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports distances between traces of Net 1 and pads of Net 2 on the same signal/mixed layer, when the pad is not a toeprint, where:







Limitations

Signal Layer Net Type ChecksDiff. Pair Trace to Plane (Net to Net Spacing)


Diff. Pair Trace to Plane (Net to Net Spacing)Reports the distance between a trace of Net 1 and a plane of Net 2 on the same signal/mixed layer.

Analysis Category dp_trace2plane;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a trace of Net 1 and a plane of Net 2 on the same signal/mixed layer where:







Limitations


Signal Layer Net Type ChecksDiff. Pair Pin to Pin (Net to Net Spacing)

October 2016

Diff. Pair Pin to Pin (Net to Net Spacing)Reports the distance between a pin of Net 1 and a pin of Net 2 on the same signal/mixed layer.:

Analysis Category dp_pin2pin;<net_type>_<net_type>

Measurement Shape

Value

ID(s)

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a pin of Net 1 and a pin of Net 2 on the same signal/mixed layer where:







Limitations

Signal Layer Net Type ChecksDiff. Pair Pin to Pad* (Net to Net Spacing)


Diff. Pair Pin to Pad* (Net to Net Spacing)Reports the distance between a pin of Net 1 and a pad of Net 2 on the same signal/mixed layer, when the pad is not a toeprint.

Analysis Category dp_pin2pad;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a pin of Net 1 and a pad of Net 2 on the same signal/mixed layer, when the pad is not a toeprint:







Limitations


Signal Layer Net Type ChecksDiff. Pair Pin to Plane (Net to Net Spacing)

October 2016

Diff. Pair Pin to Plane (Net to Net Spacing)Reports the distance between a pin of Net 1 and a plane of Net 2 on the same signal/mixed layer.

Analysis Category dp_pin2plane;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a pin of Net 1 and a plane of Net 2 on the same signal/mixed layer where:







Limitations

Signal Layer Net Type ChecksDiff. Pair Pad to Pad* (Net to Net Spacing)


Diff. Pair Pad to Pad* (Net to Net Spacing)Reports the distance between a pad of Net 1 and a pad of Net 2 on the same signal/mixed layer, when the second pad is not a toeprint.

Analysis Category dp_pad2pad;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a pad of Net 1 and a pad of Net 2 on the same signal/mixed layer, when the second pad is not a toeprint, where:


• The distance is less than the net clearance defined for the relevant net types. See Reports nets where the number of via drills exceeds a maximum number. See “Clearance According to Net Type” on page 535. If not defined, pp_net2net_spacing determines net clearance.





Limitations


Signal Layer Net Type ChecksDiff. Pair Pad* to Plane (Net to Net Spacing)

October 2016

Diff. Pair Pad* to Plane (Net to Net Spacing)Reports the distance between a pad of Net 1 and a plane of Net 2 on the same signal/mixed layer, when the pad is not a toeprint.

Analysis Category dp_pad2plane;<net_type>_<net_type>

Measurement Shape

Value

ID(s)

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a pad of Net 1 and a plane of Net 2 on the same signal/mixed layer, when the pad is not a toeprint, where:







Limitations

Signal Layer Net Type ChecksDiff. Pair Plane to Plane (Net to Net Spacing)


Diff. Pair Plane to Plane (Net to Net Spacing)Reports the distance between a plane of Net 1 and a plane of Net 2 on the same signal/mixed layer.

Analysis Category dp_plane2plane;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a plane of Net 1 and a plane of Net 2 on the same signal/mixed layer where:







Limitations


Signal Layer Net Type ChecksDiff. Pair Via to Via 3D (Net to Net Spacing)

October 2016

Diff. Pair Via to Via 3D (Net to Net Spacing)Reports the 3D distance between a via pad of Net 1 and a via pad of Net 2 on an adjacent signal/mixed layer.

Analysis Category dp_via2via_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic

Purpose Spacing between the features of two nets (one or both ‘Diff. Pair’ nets) on adjacent layers must be sufficient to prevent EMI effects.

Function Reports the 3D distance between a via pad of Net 1 and a via pad of Net 2 on an adjacent signal/mixed layer where:



• ERF variable v_report_diffpair_net2net_categories = yes.Distance between layers is determined by the layer attribute Thickness of Dielectric Below Layer.




Limitations

Signal Layer Net Type ChecksDiff. Pair Via to Trace 3D (Net to Net Spacing)


Diff. Pair Via to Trace 3D (Net to Net Spacing)Reports the 3D distance between a trace of Net 1 and a via pad of Net 2 on an adjacent signal/mixed layer.

Analysis Category dp_via2trace_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graph


Function Reports the 3D distance between a trace of Net 1 and a via pad of Net 2 on an adjacent signal/mixed layer where:







Limitations


Signal Layer Net Type ChecksDiff. Pair Via to Pin 3D (Net to Net Spacing)

October 2016

Diff. Pair Via to Pin 3D (Net to Net Spacing)Reports the 3D distance between a via pad of Net 1 and a pin of Net 2 on an adjacent signal or mixed layer.

Analysis Category dp_via2pin_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a via pad of Net 1 and a pin of Net 2 on an adjacent signal or mixed layer where:



• ERF variable v_report_diffpair_net2net_categories=yes.Distance between layers is determined by the layer attribute Thickness of Dielectric Below Layer.




Limitations

Signal Layer Net Type ChecksDiff. Pair Via to Pad* 3D (Net to Net Spacing)


Diff. Pair Via to Pad* 3D (Net to Net Spacing)Reports the 3D distance between a via pad of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint.

Analysis Category dp_via2pad_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a via pad of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint, where:



• v_report_diffpair_net2net_categories = yes.Distance between layers is determined by the layer attribute Thickness of Dielectric Below Layer.




Limitations


Signal Layer Net Type ChecksDiff. Pair Via to Plane 3D (Net to Net Spacing)

October 2016

Diff. Pair Via to Plane 3D (Net to Net Spacing)Reports the 3D distance between a plane of Net 1 and a via pad of Net 2 on an adjacent signal/mixed layer.

Analysis Category dp_via2plane_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a plane of Net 1 and a via pad of Net 2 on an adjacent signal/mixed layer where:







Limitations

Signal Layer Net Type ChecksDiff. Pair Trace to Trace 3D (Net to Net Spacing)


Diff. Pair Trace to Trace 3D (Net to Net Spacing)Reports the 3D distance between a trace of Net 1 and a trace of Net 2 on an adjacent signal/mixed layer.

Analysis Category dp_trace2trace_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a trace of Net 1 and a trace of Net 2 on an adjacent signal/mixed layer where:

• at least one of the features is on a differential pair net (with net attribute Differential Pair). If both are on differential pair nets, their Differential Pair net attributes must be different.

• the distance is less than the net clearance defined for the relevant net types. (See “Clearance According to Net Type” on page 535.) If not defined, pp_net2net_spacing determines net clearance.





Limitations


Signal Layer Net Type ChecksDiff. Pair Trace to Pin 3D (Net to Net Spacing)

October 2016

Diff. Pair Trace to Pin 3D (Net to Net Spacing)Reports the 3D distance between a trace of Net 1 and a pin of Net 2 on an adjacent signal/mixed layer.

Analysis Category dp_trace2pin_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a trace of Net 1 and a pin of Net 2 on an adjacent signal/mixed layer where:







Limitations

Signal Layer Net Type ChecksDiff. Pair Trace to Pad* 3D (Net to Net Spacing)


Diff. Pair Trace to Pad* 3D (Net to Net Spacing)Reports the 3D distance between a trace of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint.

Analysis Category dp_trace2pad_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a trace of Net 1 and a pad of Net 2 on an adjacent signal or mixed layer, when the pad is not a toeprint, where:







Limitations


Signal Layer Net Type ChecksDiff. Pair Trace to Plane 3D (Net to Net Spacing)

October 2016

Diff. Pair Trace to Plane 3D (Net to Net Spacing)Reports the 3D distance between a trace of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer.

Analysis Category dp_trace2plane_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a trace of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer where:







Limitations

Signal Layer Net Type ChecksDiff. Pair Pin to Pin 3D (Net to Net Spacing)


Diff. Pair Pin to Pin 3D (Net to Net Spacing)Reports the 3D distance between a pin of Net 1 and a pin of Net 2 on an adjacent signal or mixed layer.

Analysis Category dp_pim2pin_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a pin of Net 1 and a pin of Net 2 on an adjacent signal or mixed layer where:







Limitations


Signal Layer Net Type ChecksDiff. Pair Pin to Pad* 3D (Net to Net Spacing)

October 2016

Diff. Pair Pin to Pad* 3D (Net to Net Spacing)Reports the 3D distance between a pin of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint.

Analysis Category dp_pin2pad_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a pin of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint, where:


• the distance is less than the net clearance defined for the relevant net types. See “Clearance According to Net Type” on page 535. If not defined, pp_net2net_spacing determines net clearance.





Limitations

Signal Layer Net Type ChecksDiff. Pair Pin to Plane 3D (Net to Net Spacing)


Diff. Pair Pin to Plane 3D (Net to Net Spacing)Reports the 3D distance between a pin of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer.

Analysis Category dp_pin2plane_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a pin of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer where:







Limitations


Signal Layer Net Type ChecksDiff. Pair Pad to Pad* 3D (Net to Net Spacing)

October 2016

Diff. Pair Pad to Pad* 3D (Net to Net Spacing)Reports the 3D distance between a pad of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the second pad is not a toeprint.

Analysis Category dp_pad2pad_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a pad of Net 1 and a pad of Net 2 on an adjacent signal/mixed layer, when the second pad is not a toeprint, where:







Limitations

Signal Layer Net Type ChecksDiff. Pair Pad* to Plane 3D (Net to Net Spacing)


Diff. Pair Pad* to Plane 3D (Net to Net Spacing)Reports the 3D distance between a pad of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint.

Analysis Category dp_pad2plane_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a pad of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer, when the pad is not a toeprint, where:







Limitations


Signal Layer Net Type ChecksDiff. Pair Plane to Plane 3D (Net to Net Spacing)

October 2016

Diff. Pair Plane to Plane 3D (Net to Net Spacing)Reports the 3D distance between a plane of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer

Analysis Category dp_plane2plane_3d;<net_type>_<net_type>

Measurement Shape

Value

IDs


3D distance

Net 1; Net 2



Graphic


Function Reports the 3D distance between a plane of Net 1 and a plane of Net 2 on an adjacent signal/mixed layer where:







Limitations

Signal Layer Net Type ChecksVia to Via Cadence (Net to Net Spacing)


Via to Via Cadence (Net to Net Spacing)Reports the distance between a via pad of Net 1 (bb, test or thru) and a via pad of Net 2 (bb, test or thru) on the same signal/mixed layer.

Analysis Category bb_via2bb_via;<net_type>_<net_type>

bb_via2test_via;<net_type>_<net_type>

bb_via2thru_via;<net_type>_<net_type>

test_via2test_via;<net_type>_<net_type>

test_via2thru_via;<net_type>_<net_type>

thru_via2thru_via;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a via pad of Net 1 (bb, test or thru) and a via pad of Net 2 (bb, test or thru) on the same signal/mixed layer if:





Limitations


Signal Layer Net Type ChecksVia to Pin Cadence (Net to Net Spacing)

October 2016

Via to Pin Cadence (Net to Net Spacing)Reports the distance between a via pad (bb, test or thru) of Net 1 and a pin (test, thru or smd) of Net 2 on the same signal/mixed layer.

Analysis Category bb_via2smd_pin;<net_type>_<net_type>

test_via2smd_pin;<net_type>_<net_type>

thru_via2smd_pin;<net_type>_<net_type>

bb_via2test_pin;<net_type>_<net_type>

test_via2test_pin;<net_type>_<net_type>

thru_via2test_pin;<net_type>_<net_type>

bb_via2thru_pin;<net_type>_<net_type>

test_via2thru_pin;<net_type>_<net_type>

thru_via2thru_pin;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a via pad (bb, test or thru) of Net 1 and a pin (test, thru or smd) of Net 2 on the same signal/mixed layer if:





Limitations

Signal Layer Net Type ChecksVia to Line Cadence (Net to Net Spacing)


Via to Line Cadence (Net to Net Spacing)Reports the distance between a via pad of Net 1 and a line of Net 2 on the same signal/mixed layer

Analysis Category bb_via2line;<net_type>_<net_type>

test_via2line;<net_type>_<net_type>

thru_via2line;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a via pad of Net 1 and a line of Net 2 on the same signal/mixed layer if:





Limitations


Signal Layer Net Type ChecksVia to Shape Cadence (Net to Net Spacing)

October 2016

Via to Shape Cadence (Net to Net Spacing)Reports the distance between a via pad of Net 1 and a shape of Net 2 on the same signal/mixed layer.

Analysis Category bb_via2shape;<net_type>_<net_type>

test_via2shape;<net_type>_<net_type>

thru_via2shape;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a via pad of Net 1 and a shape of Net 2 on the same signal/mixed layer if:





Limitations

Signal Layer Net Type ChecksPin to Pin Cadence Prototype (Net to Net Spacing)


Pin to Pin Cadence Prototype (Net to Net Spacing)Reports the distance between a pin of Net 1 and a pin of Net 2 on the same signal/mixed layer.

Analysis Category smd_pin2smd_pin;<net_type>_<net_type>

smd_pin2test_pin;<net_type>_<net_type>

smd_pin2thru_pin;<net_type>_<net_type>

test_pin2test_pin;<net_type>_<net_type>

test_pin2thru_pin;<net_type>_<net_type>

thru_pin2thru_pin;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a pin of Net 1 and a pin of Net 2 on the same signal/mixed layer if:





Limitations


Signal Layer Net Type ChecksLine to Pin Cadence (Net to Net Spacing)

October 2016

Line to Pin Cadence (Net to Net Spacing)Reports the distance between a line of Net 1 and a pin of Net 2 on the same signal/mixed layer

Analysis Category line2smd_pin;<net_type>_<net_type>

line2test_pin;<net_type>_<net_type>

line2thru_pin;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2

Layers Displayed Signal or mixed layer

Graphic


Function Reports the distance between a line of Net 1 and a pin of Net 2 on the same signal or mixed layer if:


• The distance is less than the net clearance defined for the relevant net types and may also include layer restrictions and a relevant constraint area. (See “Clearance According to Net Type” on page 535.) If not defined, pp_net2net_spacing determines net clearance.



Limitations

Signal Layer Net Type ChecksPin to Shape Cadence (Net to Net Spacing)


Pin to Shape Cadence (Net to Net Spacing)Reports the distance between a pin of Net 1 and a shape of Net 2 on the same signal/mixed layer.

Analysis Category smd_pin2shape;<net_type>_<net_type>

test_pin2shape;<net_type>_<net_type>

thru_pin2shape;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a pin of Net 1 and a shape of Net 2 on the same signal/mixed layer if:





Limitations


Signal Layer Net Type ChecksLine to Line Cadence (Net to Net Spacing)

October 2016

Line to Line Cadence (Net to Net Spacing)Reports the distance between a line of Net 1 and a line of Net 2 on the same signal/mixed layer.

Analysis Category line2line;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a line of Net 1 and a line of Net 2 on the same signal/mixed layer if:


• the distance is less than the net clearance defined for the relevant net types and may also include layer restrictions and a relevant constraint area. (See “Clearance According to Net Type” on page 535.) If not defined, pp_net2net_spacing determines net clearance.



Limitations

Signal Layer Net Type ChecksLine to Shape Cadence (Net to Net Spacing)


Line to Shape Cadence (Net to Net Spacing)Reports the distance between a line of Net 1 and a shape of Net 2 on the same signal/mixed layer.

Analysis Category line2shape;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a line of Net 1 and a shape of Net 2 on the same signal/mixed layer if:


• the distance is less than the net clearance defined for the relevant net types and may also include layer restrictions and a relevant constraint area. (See “Clearance According to Net Type” on page 535.) If not defined, pp_net2net_spacing determines net clearance.



Limitations


Signal Layer Net Type ChecksShape to Shape Cadence (Net to Net Spacing)

October 2016

Shape to Shape Cadence (Net to Net Spacing)Reports the distance between a shape of Net 1 and a shape of Net 2 on the same signal/mixed layer.

Analysis Category shape2shape;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2


Graphic


Function Reports the distance between a shape of Net 1 and a shape of Net 2 on the same signal/mixed layer if:


• the distance is less than the net clearance defined for the relevant net types and may also include layer restrictions and a relevant constraint area.If not defined, pp_net2net_spacing determines net clearance.



Limitations

Signal Layer Net Type ChecksPTH to Copper (Net to Net Spacing)


PTH to Copper (Net to Net Spacing)Reports the distance between the copper of Net 1 and a PTH drill of Net 2 that pass through the signal or mixed or copper layers.

Analysis Category <area>:pth2cpr;<net_type>_<net_type>

Measurement Shape

Value

IDs

Distance segment

Distance

Net 1; Net 2

Layers Displayed Signal or mixed or p and g layer of Net 1

Drill layer of Net 2

Graphic


Function Reports the distance between the copper of Net 1 and a PTH drill of Net 2 that pass through the signal or mixed or copper layers if:


• the distance is less than pp_net2net_spacing.• the drill bears attribute Drill Type = plated.

Results reported to this category are taken from signal or mixed or copper positive and negative layers.


ERF Variables

Limitations


Signal Layer Net Type ChecksDiff. Pair Length (Summary) (Net Length*)

October 2016

Diff. Pair Length (Summary) (Net Length*)Reports the length of a net belonging to a differential pair.

Analysis Category dp_length;<net_type>

Measurement Shape

Value

IDs

Feature (an arbitrary feature from the net)

Length

DP name

Layers Displayed Representative signal layer of the net

Graphic

Function Reports the length of a net belonging to a differential pair. Length is the sum of all net traces (assigned net attribute Differential Pair).

ERF Parameters

ERF Variables


Signal Layer Net Type ChecksDiff. Pair Length Too Short (Net Length*)


Diff. Pair Length Too Short (Net Length*)Reports the too-short length of a net belonging to a differential pair.

Analysis Category dp_length_short;<net_type>

Measurement Shape

Value

IDs


Length

DP name


Graphic

Function Reports the length of a net belonging to a differential pair shorter than net attribute Net Min. Length. Length is the sum of all net traces (assigned both Differential Pair and Net Min. Length net attributes).

Length is defined as the entire length of the net over all layers. If restrictions have been applied for the running of tests (i.e. only in Graphic Area; only in designated area), the entire length of only nets crossing the specified area will be reported. Because this test covers all layers, its running requires a longer time period.

ERF Parameters

ERF Variables



Signal Layer Net Type ChecksDiff. Pair Length Too Long (Net Length*)

October 2016

Diff. Pair Length Too Long (Net Length*)Reports the too long length of a net belonging to a differential pair.

Analysis Category dp_length_long;<net_type>

Measurement Shape

Value

IDs


Length

DP name


Graphic

Function Reports the length of a net belonging to a differential pair longer than net attribute Net Max. Length. Length is the sum of all net traces (assigned both Differential Pair and Net Max. Length net attributes).

Length is defined as the entire length of the net over all layers. If restrictions have been applied for the running of tests (i.e. only in Graphic Area; only in designated area), the entire length of only nets crossing the specified area will be reported. Because this test covers all layers, its running requires a longer time period.

ERF Parameters

ERF Variables


Signal Layer Net Type ChecksDiff. Pair Length Difference (Net Length*)


Diff. Pair Length Difference (Net Length*)Reports the difference in length of a differential pair of nets.

Analysis Category dp_length_diff;<net_type>

Measurement Shape

Value

IDs


Length

DP name


Graphic

Function Reports the difference in length of a differential pair of nets (assigned the same Differential Pair net attribute).

Length is defined as the entire length of the net over all layers. If restrictions have been applied for the running of tests (such as only in Graphic Area, or only in designated area), the entire length of only nets crossing the specified area will be reported. Because this test covers all layers, its running involves a greater time period.

ERF Parameters

ERF Variables



Signal Layer Net Type ChecksDiff. Pair Missing Peer (Extraneous Data)

October 2016

Diff. Pair Missing Peer (Extraneous Data)Reports all nets with net attribute Differential Pair for which there is no corresponding net with the same Differential Pair net attribute.

Analysis Category dp_miss_peer

Measurement Shape

Value

IDs


Length

DP name


Graphic

Purpose A Differential Pair net without a peer indicates a mistake in design setup.

Function Reports all nets with net attribute Differential Pair for which there is no corresponding net with the same Differential Pair net attribute.

ERF Parameters

ERF Variables

Limitations

Signal Layer Net Type ChecksDiff. Pair Extra Nets (Extraneous Data)


Diff. Pair Extra Nets (Extraneous Data)Reports all nets with a Differential Pair net attribute for which there are more than two nets assigned the same Differential Pair net attribute.

Analysis Category dp_extra_nets

Measurement Shape

Value

IDs


Symbol number assigned to an arbitrary shape on the net

DP name


Graphic

Purpose More than two nets assigned the same Differential Pair name indicates a mistake in design set up.

Function Reports all nets with a Differential Pair net attribute for which there are more than two nets assigned the same Differential Pair net attribute.

ERF Parameters

ERF Variables

Limitations


Signal Layer Net Type ChecksDiff. Pair With T-junction (Extraneous Data)

October 2016

Diff. Pair With T-junction (Extraneous Data)Reports nets with net attribute Differential Pair13 for which there are more than two endpoints.

Analysis Category dp_with_t_junction

Measurement Shape

Value

IDs


Shape; DP name


Graphic

Purpose The system does not report length (all Net Length categories) for Differential Pair nets with a T-junctions other than in this category.

Function Reports nets with net attribute Differential Pair13 for which there are more than two endpoints. In addition to a beginning and endpoint, there is also a T-junction.

ERF Parameters

ERF Variables

Limitations

Signal Layer Net Type ChecksParallel Nets (Individual) Start (Parallel Nets)


Parallel Nets (Individual) Start (Parallel Nets)Reports two nets, one of which is has attribute SQA Critical Net, running parallel for too long a distance.

Analysis Category parallel_nets_ind_start

Measurement Shape

Value

IDs

Segment between parallel nets

Length of parallel nets

Two nets


Graphic

Purpose Nets running parallel for a long distance can cause electrical interference.

Function Reports two nets (one of which has net attribute SQA Critical Net) running parallel for a distance defined by the following net attributes assigned to at least one of the nets:

• Individ. Parallel Max. Len. List• Individ. Parallel Dist. List• Individ. Parallel Min. Jog List (optional)

If not defined by attributes, defined by default ERF variable values.

ERF Parameters

ERF Variables v_individual_length

v_individual_dist

v_individual_jog

Limitations


Signal Layer Net Type ChecksParallel Nets (Individual) End (Parallel Nets)

October 2016

Parallel Nets (Individual) End (Parallel Nets)Reports two nets (one of which has net attribute SQA Critical Net) running parallel for too long a distance

Analysis Category parallel_nets_ind_end

Measurement Shape

Value

IDs


Maximum allowed length for parallel nets

Two nets


Graphic





ERF Parameters


v_individual_dist

v_individual_jog

Limitations

Signal Layer Net Type ChecksParallel Nets (Adj.) (Individual) Start (Parallel Nets)


Parallel Nets (Adj.) (Individual) Start (Parallel Nets)Reports two nets (one of which has net attribute SQA Critical Net) running parallel on adjacent layers for too long a distance.

Analysis Category parallel_nets_adj_ind_start

Measurement Shape

Value

IDs


Length of parallel nets

Two nets

Layers Displayed Signal layers of both nets

Graphic


Function Reports two nets (one of which has net attribute SQA Critical Net) running parallel on adjacent layers for a distance defined by the following net attributes assigned to at least one of the nets:



ERF Parameters


v_individual_dist

v_individual_jog

Limitations


Signal Layer Net Type ChecksParallel Nets (Adj.) (Individual) End (Parallel Nets)

October 2016

Parallel Nets (Adj.) (Individual) End (Parallel Nets)Reports two nets (one of which has net attribute SQA Critical Net) running parallel on adjacent layers for too long a distance.

Analysis Category parallel_nets_adj_ind_end

Measurement Shape

Value

IDs


Maximum allowed length of parallel nets

Two nets

Layers Displayed Signal layers of both nets

Graphic


Function Reports two nets (one of which has net attribute SQA Critical Net) running parallel on adjacent layers for a distance defined by the following net attributes assigned to at least one of the nets:



ERF Parameters


v_individual_dist

v_individual_jog

Limitations

Signal Layer Net Type ChecksParallel Nets (Accumulative) Start (Parallel Nets)


Parallel Nets (Accumulative) Start (Parallel Nets)Reports two nets (one of which has net attribute SQA Critical Net) running parallel for too long a distance.

Analysis Category parallel_nets_acc_start

Measurement Shape

Value

IDs


Accumulative length of parallel nets

Two nets


Graphic



• Accum. Parallel Max. Len. List• Accum. Parallel Dist. List


ERF Parameters

ERF Variables v_accumulative_length

v_accumulative_dist


Signal Layer Net Type ChecksParallel Nets (Accumulative) Start (Parallel Nets)

October 2016

Limitations

Signal Layer Net Type ChecksParallel Nets (Accumulative) End (Parallel Nets)


Parallel Nets (Accumulative) End (Parallel Nets)Reports two nets (one of which has net attribute SQA Critical Net) running parallel for a too long a distance.

Analysis Category parallel_nets_acc_end

Measurement Shape

Value

IDs


Allowed accumulative length of parallel nets

Two nets


Graphic



• Accum. Parallel Max. Len. List• Accum. Parallel Dist. List


ERF Parameters

ERF Variables v_accumulative_length

v_accumulative_dist

Limitations


Signal Layer Net Type ChecksNarrow Trace (Net Path)

October 2016

Narrow Trace (Net Path)Checks the width of traces between each two end points on a net with net attributes Min. Line Width and SQA Critical Net.

Analysis Category narrow_trace

Measurement Shape

Value

IDs

Segment showing line width

Width of trace

Net name


Graphic

Purpose Nets below a minimum width are subject to breaks and shorts. This check reports net traces narrower than a minimum width.

Function Checks the width of traces between each two end points on a net with net attributes Min. Line Width and SQA Critical Net. If Min. Line Width is not defined, the system uses the default value as defined in ERF variable v_min_line_width. The narrowest trace below this value and the net name are reported.

The entire net is checked if any portion of it runs on a ‘checked’ layer. End points are either pads, or lines touching only one other shape on the layer. Where there are a number of end points, the path between each two is checked.

If a net splits, (on the same or different layers) the split section is similarly checked. If the total width of the split sections is less than Min. Line Width results are reported to category “Narrow Split Trace (Net Path)” on page 641.

ERF Parameters

ERF Variables v_min_line_width

Limitations • This check works only on lines. If pads are used as traces, their width is ignored. The size of a drill connecting two traces on different layers is also ignored.

• Bottlenecks are not reported in this category.

Signal Layer Net Type ChecksNarrow Split Trace (Net Path)


Narrow Split Trace (Net Path)Checks the width of traces between each two end points on a net with net attributes Min. Line Width and SQA Critical Net.

Analysis Category narrow_split

Measurement Shape

Value

IDs

Segment showing line width

Total width of traces involved in the split

Net name

Layers Displayed Signal layers involved in the split (two or more)

Graphic

Purpose Nets below a minimum width are subject to breaks and shorts. This check reports net traces which have been split and the total of all widths is narrower than a minimum width.

Function Checks the width of traces between each two end points on a net with net attributes Min. Line Width and SQA Critical Net. If Min. Line Width is not defined, the system uses the default value as defined in ERF variable v_min_line_width. The narrowest trace below this value and the net name are reported. Violations on single traces are reported in “Narrow Trace (Net Path)” on page 640.

The entire net is checked if any portion of it runs on a ‘checked’ layer. End points are either pads, or lines touching only one other shape on the layer. Where there are a number of end points, the path between each two is checked.

ERF Parameters

ERF Variables v_min_line_width

Limitations • This check works only on lines. If pads are used as traces, their width is ignored. The size of a drill connecting two traces on different layers is also ignored.

• Bottlenecks are not reported in this category.


Signal Layer Net Type ChecksToo Many Vias (Net Properties)

October 2016

Too Many Vias (Net Properties)Checks that the number of via drills on a net with attribute Max. Via Count does not exceed the value of this attribute.

Analysis Category max_vias

Measurement Shape

Value

IDs

One feature from the problematic net

Number of via drills on the net

Net name; maximum number of via drills allowed


Drill layer

Graphic

Purpose Too many via drills can reduce the quality of a net.

Function Checks that the number of via drills on a net with attribute Max. Via Count does not exceed the value of this attribute. Nets without this attribute, but with attribute SQA Critical Net are checked that their number of via drills do not exceed ERF variable v_max_via_count.

ERF Parameters

ERF Variables v_max_via_count

Limitations

Signal Layer Net Type ChecksMin Line Width (Net Properties)


Min Line Width (Net Properties)Reports lines with a width under the allowed value as taken from the CAD system.

Analysis Category <area>:min_line_width;<physical_type>

Measurement Shape

Value

IDs

Line

Line width

Net name; expected width (minimum allowed width)


Constraint areas (if present)

Graphic

Purpose Trace width should be larger than a minimum value dependent on net type and constraint area to maintain satisfactory electrical connectivity.

Function Reports lines with a width under the allowed value as taken from the CAD system. The minimum width is saved as a ‘net physical type’ rule (reported as the second measurement ID). Results reported to this category are classified according to the attribute Physical Type as read from the job. The category is relevant only to Cadence Allegro designs.

The check applies only to nets with attributes SQA Critical Net and Physical Type.

This test applies to all signal layers of the net, though results are displayed in one layer only. Because there is presently no way to highlight an entire net, the measurement shape is one net feature (via drill). However, you can use the Features Selection Filter to highlight all via drills of the offending net.

ERF Parameters

ERF Variables

Limitations


Signal Layer Net Type ChecksAbove Min Line Width (Net Properties)

October 2016

Above Min Line Width (Net Properties)Reports lines with a width above that of the minimum line width as taken from the CAD system.

Analysis Category <area>:above_min_line_width;<physical_type>

Measurement Shape

Value

IDs

Line

Line width

Net name; expected width (as specified in the constraint rules)


Constraint areas (if present)

Graphic

Purpose Trace width should be of a value dependent on net type and constraint area to maintain satisfactory electrical connectivity.

Function Reports lines with a width above that of the minimum line width as taken from the CAD system. Minimum width is saved as a ‘net physical type’ rule (reported as the second measurement ID). Results reported to this category are classified according to the attribute Physical Type as read from the job. The category is relevant only to Cadence Allegro designs.

The check applies only to nets with attributes SQA Critical Net and Physical Type.

ERF Parameters

ERF Variables

Limitations

Signal Layer Net Type ChecksNet Length by Width (Net Properties)


Net Length by Width (Net Properties)Reports the total length of all traces belonging to the same net, of the same width and on the same layer.

Results Attributes for Signal Layer Net Type Checks

Result attributes are assigned when the analysis is run. The values of the attributes can be retrieved afterwards.

Analysis Category net_length_by_width;<net_type>

Measurement Shape

Value

IDs

One trace of the reported net

Total length of traces making up the net, their width and layer

Net name; width of traces


Graphic

Purpose Provides a summary of nets by their width and layer.

Function Reports the total length of all traces (lines and arcs) belonging to the same net, of the same width and on the same layer. (Traces may be unconnected in the layer.) Results reported to this category are reported according to attribute Net Type. Results reported to this category are reported according to attribute Net Type. Results reported to this category are classified according to attribute Net Type.

Multiple features cannot be connected to a measurement. So the displayed measurement is a representative trace of the net. To see the other traces making up the net, use the Features Filter dialog box and select net and width.

ERF Parameters

ERF Variables v_simple_net_length

Limitations

Table 15-5. Signal Layer Net Type Checks Results Attributes


...min_line_ang Smallest line angle reported

...num_line_ang Number of line angles reported

...typ_line_ang Typical line angle reported


Signal Layer Net Type ChecksResults Attributes for Signal Layer Net Type Checks

October 2016

...num_dp_testpoint Number of differential pair testpoint violations

...min_dp_end_points Smallest distance beyond mutual path of differential pair endpoints

...num_dp_end_points Number of differential pair endpoint violations

...typ_dp_end_points Typical distance beyond mutual path of differential pair endpoints

...max_dp_end_points Largest distance beyond mutual path of differential pair endpoints

...num_dp_gap_p Number of differential pair gap violations (expressed as percentage)

...typ_dp_gap_p Typical differential pair gap in percentage

...max_dp_gap_p Largest differential pair gap in percentage

...num_dp_gap_abs Number of differential pair gap violations (absolute)

...typ_dp_gap_abs Typical differential pair gap (absolute)

...max_dp_gap_abs Largest differential pair gap (absolute)

...num_nonref_sig_adj Number of non-referenced signals in adjacent copper layer

...num_nonref_sig_area_adj Number of non-referenced signal areas in adjacent copper layer

...max_nonref_sig_area_adj Largest non-referenced signal area size in adjacent copper layer

...num_nonref_sig_len_adj Number of non-referenced signal lengths in adjacent copper layer

...max_nonref_sig_len_adj Longest non-referenced signal length in adjacent copper layer

...num_nonref_sig_width_p_adj Number of non-referenced signal widths in adjacent copper layer (percentage)

...max_nonref_sig_width_p_adj Widest non-referenced signal width in adjacent copper layer (percentage)

...num_nonref_sig_next Number of non-referenced signals in next copper layer

...num_nonref_sig_area_next Number of non-referenced signal areas in next copper layer

...max_nonref_sig_area_next Largest non-referenced signal area size in next copper layer

Table 15-5. Signal Layer Net Type Checks Results Attributes (cont.)




...num_nonref_sig_len_next Number of non-referenced signal lengths in next copper layer

...max_nonref_sig_len_next Longest non-referenced signal length in next copper layer

...num_nonref_sig_width_p_next Number of non-referenced signal widths in next copper layer (percentage)

...max_nonref_sig_width_p_next Widest non-referenced signal width in next copper layer (percentage)

...min_via2via Smallest distance between vias

...num_via2via Number of via to via violations

...typ_via2via Typical distance between vias

...min_via2trace Smallest distance between via and trace

...num_via2trace Number of via to trace violations

...typ_via2trace Typical distance between via and trace

...min_via2pin Smallest distance between via and pin

...num_via2pin Number of via to pin violations

...typ_via2pin Typical distance between via and pin

...min_via2pad Smallest distance between via and pad

...num_via2pad Number of via to pad violations

...typ_via2pad Typical distance between via and pad

...min_via2plane Smallest distance between via and plane

...num_via2plane Number of via to plane violations

...typ_via2plane Typical distance between via and plane

...min_trace2trace Smallest distance between traces

...num_trace2trace Number of trace to trace violations

...typ_trace2trace Typical distance between traces

...min_trace2pin Smallest distance between trace and pin

...num_trace2pin Number of trace to pin violations

...typ_trace2pin Typical distance between trace and pin

...min_trace2pad Smallest distance between trace and pad

...num_trace2pad Number of trace to pad violations





October 2016

...typ_trace2pad Typical distance between trace and pad

...min_trace2plane Smallest distance between trace and plane

...num_trace2plane Number of trace to plane violations

...typ_trace2plane Typical distance between trace and plane

...min_pin2pin Smallest distance between pins

...num_pin2pin Number of pin to pin violations

...typ_pin2pin Typical distance between pins

...min_pin2pad Smallest distance between pin and pad

...num_pin2pad Number of pin to pad violations

...typ_pin2pad Typical distance between pin and pad

...min_pin2plane Smallest distance between pin and plane

...num_pin2plane Number of pin to plane violations

...typ_pin2plane Typical distance between pin and plane

...min_pad2pad Smallest distance between pads

...num_pad2pad Number of pad to pad violations

...typ_pad2pad Typical distance between pads

...min_pad2plane Smallest distance between pad and plane

...num_pad2plane Number of pad to plane violations

...typ_pad2plane Typical distance between pad and plane

...min_plane2plane Smallest distance between planes

...num_plane2plane Number of plane to plane violations

...typ_plane2plane Typical distance between planes

...min_via2via_3d Smallest distance between vias on different layers

...num_via2via_3d Number of via tin layer 1 to via in layer 2 violations

...typ_via2via_3d Typical distance between vias on different layers

...min_via2trace_3d Smallest distance between via and trace on different layers

...num_via2trace_3d Number of via in layer 1 to trace in layer 2 violations

...typ_via2trace_3d Typical distance between via and trace on different layers





...min_via2pin_3d Smallest distance between via and pin on different layers

...num_via2pin_3d Number of via in layer 1 to pin in layer 2 violations

...typ_via2pin_3d Typical distance between via and pin on different layers

...min_via2pad_3d Smallest distance between via and pad on different layers

...num_via2pad_3d Number of via in layer 1 to pad in layer 2 violations

...typ_via2pad_3d Typical distance between via and pad on different layers

...min_via2plane_3d Smallest distance between via and plane on different layers

...num_via2plane_3d Number of via in layer 1 to plane in layer 2 violations

...typ_via2plane_3d Typical distance between via and plane on different layers

...min_trace2trace_3d Smallest distance between traces on different layers

...num_trace2trace_3d Number of trace in layer 1 to trace in layer 2 violations

...typ_trace2trace_3d Typical distance between traces on different layers

...min_trace2pin_3d Smallest distance between trace and pin on different layers

...num_trace2pin_3d Number of trace in layer 1 to pin in layer 2 violations

...typ_trace2pin_3d Typical distance between trace and pin on different layers

...min_trace2pad_3d Smallest distance between trace and pad on different layers

...num_trace2pad_3d Number of trace in layer 1 to pad in layer 2 violations

...typ_trace2pad_3d Typical distance between trace and pad on different layers

...min_trace2plane_3d Smallest distance between trace and plane on different layers

...num_trace2plane_3d Number of trace in layer 1 to plane in layer 2 violations

...typ_trace2plane_3d Typical distance between trace and plane on different layers





October 2016

...min_pin2pin_3d Smallest distance between pins on different layers

...num_pin2pin_3d Number of pin in layer 1 to pin in layer 2 violations

...typ_pin2pin_3d Typical distance between pins on different layers

...min_pin2pad_3d Smallest distance between pin and pad on different layers

...num_pin2pad_3d Number of pin in layer 1 to pad in layer 2 violations

...typ_pin2pad_3d Typical distance between pin and pad on different layers

...min_pin2plane_3d Smallest distance between pin and plane on different layers

...num_pin2plane_3d Number of pin in layer 1 to plane in layer 2 violations

...typ_pin2plane_3d Typical distance between pin and plane on different layers

...min_pad2pad_3d Smallest distance between pads on different layers

...num_pad2pad_3d Number of pad in layer 1 to pad in layer 2 violations

...typ_pad2pad_3d Typical distance between pads on different layers

...min_pad2plane_3d Smallest distance between pad and plane on different layers

...num_pad2plane_3d Number of pad in layer 1 to plane in layer 2 violations

...typ_pad2plane_3d Typical distance between pad and plane on different layers

...min_plane2plane_3d Smallest distance between planes on different layers

...num_plane2plane_3d Number of plane in layer 1 to plane in layer 2 violations

...typ_plane2plane_3d Typical distance between planes on different layers

min_dp_via2via Smallest distance between vias on differential pair nets

num_dp_via2via Number of via to via violations on differential pair nets

typ_dp_via2via Typical distance between vias on differential pair nets

min_dp_via2trace Smallest distance between via and trace on differential pair nets





num_dp_via2trace Number of via to trace violations on differential pair nets

typ_dp_via2trace Typical distance between via and trace on differential pair nets

min_dp_via2pin Smallest distance between via and pin on differential pair nets

num_dp_via2pin Number of via to pin violations on differential pair nets

typ_dp_via2pin Typical distance between via and pin on differential pair nets

min_dp_via2pad Smallest distance between via and pad on differential pair nets

num_dp_via2pad Number of via to pad violations on differential pair nets

typ_dp_via2pad Typical distance between via and pad on differential pair nets

min_dp_via2plane Smallest distance between via and plane on differential pair nets

num_dp_via2plane Number of via to plane violations on differential pair nets

typ_dp_via2plane Typical distance between via and plane on differential pair nets

min_dp_trace2trace Smallest distance between traces on differential pair nets

num_dp_trace2trace Number of trace to trace violations on differential pair nets

typ_dp_trace2trace Typical distance between traces on differential pair nets

min_dp_trace2pin Smallest distance between trace and pin on differential pair nets

num_dp_trace2pin Number of trace to pin violations on differential pair nets

typ_dp_trace2pin Typical distance between trace and pin on differential pair nets

min_dp_trace2pad Smallest distance between trace and pad on differential pair nets





October 2016

num_dp_trace2pad Number of trace to pad violations on differential pair nets

typ_dp_trace2pad Typical distance between trace and pad on differential pair nets

min_dp_trace2plane Smallest distance between trace and plane on differential pair nets

num_dp_trace2plane Number of trace to plane violations on differential pair nets

typ_dp_trace2plane Typical distance between trace and plane on differential pair nets

min_dp_pin2pin Smallest distance between pins on differential pair nets

num_dp_pin2pin Number of pin to pin violations on differential pair nets

typ_dp_pin2pin Typical distance between pins on differential pair nets

min_dp_pin2pad Smallest distance between pin and pad on differential pair nets

num_dp_pin2pad Number of pin to pad violations on differential pair nets

typ_dp_pin2pad Typical distance between pin and pad on differential pair nets

min_dp_pin2plane Smallest distance between pin and plane on differential pair nets

num_dp_pin2plane Number of pin to plane violations on differential pair nets

typ_dp_pin2plane Typical distance between pin and plane on differential pair nets

min_dp_pad2pad Smallest distance between pads on differential pair nets

num_dp_pad2pad Number of pad to pad violations on differential pair nets

typ_dp_pad2pad Typical distance between pads on differential pair nets

min_dp_pad2plane Smallest distance between pad and plane on differential pair nets

num_dp_pad2plane Number of pad to plane violations on differential pair nets





typ_dp_pad2plane Typical distance between pin and plane on differential pair nets

min_dp_plane2plane Smallest distance between planes on differential pair nets

num_dp_plane2plane Number of plane to plane violations on differential pair nets

typ_dp_plane2plane Typical distance between planes on differential pair nets

min_dp_via2via_3d Smallest distance between vias in different layers on differential pair nets

num_dp_via2via_3d Number of via on layer 1 to via on layer 2 violations on differential pair nets

typ_dp_via2via_3d Typical distance between vias only different layers on differential pair nets

min_dp_via2trace_3d Smallest distance between via of layer 1 and trace of layer 2 on differential pair nets

num_dp_via2trace_3d Number of via on layer 1 to trace on layer 2 violations on differential pair nets

typ_dp_via2trace_3d Typical distance between via of layer 1 and trace of layer 2 on differential pair nets

min_dp_via2pin_3d Smallest distance between via of layer 1 and pin of layer 2 on differential pair nets

num_dp_via2pin_3d Number of via on layer 1 to pin on layer 2 violations on differential pair nets

typ_dp_via2pin_3d Typical distance between via of layer 1 and pin of layer 2 on differential pair nets

min_dp_via2pad_3d Smallest distance between via of layer 1 and pad of layer 2 on differential pair nets

num_dp_via2pad_3d Number of via on layer 1 to pad on layer 2 violations on differential pair nets

typ_dp_via2pad_3d Typical distance between via of layer 1 and pad of layer 2 on differential pair nets

min_dp_via2plane_3d Smallest distance between via of layer 1 and plane of layer 2 on differential pair nets

num_dp_via2plane_3d Number of via on layer 1 to plane on layer 2 violations on differential pair nets





October 2016

typ_dp_via2plane_3d Typical distance between via of layer 1 and plane of layer 2 on differential pair nets

min_dp_trace2trace_3d Smallest distance between traces in different layers on differential pair nets

num_dp_trace2trace_3d Number of trace on layer 1 to trace on layer 2 violations on differential pair nets

typ_dp_trace2trace_3d Typical distance between traces in different layers on differential pair nets

min_dp_trace2pin_3d Smallest distance between trace on layer 1 and pin on layer 2 on differential pair nets

num_dp_trace2pin_3d Number of trace on layer 1 to pin on layer 2 violations on differential pair nets

typ_dp_trace2pin_3d Typical distance between trace on layer 1 and pin on layer 2 on differential pair nets

min_dp_trace2pad_3d Smallest distance between trace on layer 1 and pad on layer 2 on differential pair nets

num_dp_trace2pad_3d Number of trace on layer 1 to pad on layer 2 violations on differential pair nets

typ_dp_trace2pad_3d Typical distance between trace on layer 1 and pad on layer 2 on differential pair nets

min_dp_trace2plane_3d Smallest distance between trace on layer 1 and plane on layer 2 on differential pair nets

num_dp_trace2plane_3d Number of trace on layer 1 to plane on layer 2 violations on differential pair nets

typ_dp_trace2plane_3d Typical distance between trace on layer 1 and plane on layer 2 on differential pair nets

min_dp_pin2pin_3d Smallest distance between pins in different layers on differential pair nets

num_dp_pin2pin_3d Number of pin on layer 1 to pin on layer 2 violations on differential pair nets

typ_dp_pin2pin_3d Typical distance between pins in different layers on differential pair nets

min_dp_pin2pad_3d Smallest distance between pin on layer 1 and pad on layer 2 on differential pair nets

num_dp_pin2pad_3d Number of pin on layer 1 to pad on layer 2 violations on differential pair nets





typ_dp_pin2pad_3d Typical distance between pin on layer 1 and pad on layer 2 on differential pair nets

min_dp_pin2plane_3d Smallest distance between pin on layer 1 and plane on layer 2 on differential pair nets

num_dp_pin2plane_3d Number of pin on layer 1 to plane on layer 2 violations on differential pair nets

typ_dp_pin2plane_3d Typical distance between pin on layer 1 and plane on layer 2 on differential pair nets

min_dp_pad2pad_3d Smallest distance between pads in different layers on differential pair nets

num_dp_pad2pad_3d Number of pad on layer 1 to pad on layer 2 violations on differential pair nets

typ_dp_pad2pad_3d Typical distance between pads in different layers on differential pair nets

min_dp_pad2plane_3d Smallest distance between pad on layer 1 and plane on layer 2 on differential pair nets

num_dp_pad2plane_3d Number of pad on layer 1 to plane on layer 2 violations on differential pair nets

typ_dp_pad2plane_3d Typical distance between pad on layer 1 and plane on layer 2 on differential pair nets

min_dp_plane2plane_3d Smallest distance between planes in different layers on differential pair nets

num_dp_plane2plane_3d Number of plane on layer 1 to plane on layer 2 violations on differential pair nets

typ_dp_plane2plane_3d Typical distance between planes in different layers on differential pair nets

min_dp_length Smallest differential pair length reported

num_dp_length Number of differential pair lengths reported

typ_dp_length Typical differential pair length reported

max_dp_len_long Longest differential pair length (too long) reported

num_dp_len_long Number of differential pair lengths (too long) reported

typ_dp_len_long Typical differential pair length (too long) reported

min_dp_len_short Shortest differential pair length (too short) reported

num_dp_len_short Number of differential pair lengths (too short) reported





October 2016

typ_dp_len_short Typical differential pair length (too short) reported

max_dp_len_diff Longest differential pair length difference reported

num_dp_len_diff Number of differential pair length differences reported

typ_dp_len_diff Typical differential pair length difference reported

num_dp_miss_peer Number of differential pair nets missing a peer

num_dp_extra_nets Number of differential pair nets with extra nets

num_dp_wrong_end_points Number of differential pair nets with more than two endpoints

num_parallel_nets_ind_start Number of parallel nets running for distances over a given value.

num_parallel_nets_ind_end Number of parallel nets running for distances over a given value.

num_parallel_nets_acc_start Number of parallel nets for which an accumulative distance is reported.

num_parallel_nets_acc_end Number of parallel nets for which an accumulative distance is reported.

num_parallel_nets_adj_ind_start Number of parallel nets in adjacent layers running for distances over a given value.

num_parallel_nets_adj_ind_end Number of parallel nets in adjacent layers running for distances over a given value.

num_narrow_trace Number of narrow traces.

num_narrow_split Number of narrow split traces.



Signal Layer Net Type ChecksERF Parameters for Signal Layer Net Type Checks


ERF Parameters for Signal Layer Net Type Checks

ERF parameters, set in the ERF model or when the analysis is run, control the analysis.

Table 15-6. Signal Layer Net Type Checks ERF Parameters


Layer pp_layer Defines the layer to be affected by the action according to the rules as defined in “Valor NPI Checklist Operations User Guide”.

All

Default Diff. Pair Gap

pp_dpair_gap Default spacing between the two nets of a differential pair.

All Diff. Pair Properties categories

Net to Net Spacing

pp_net2net_spacing Defines maximum spacing between features of different nets if net clearance has not been defined for the net type.

All Net to Net Spacing categories

Tests List pp_tests The tests to be run. See “Tests Performed in Signal Layer Net Type Checks” on page 530.

All


Signal Layer Net Type ChecksERF Variables for Signal Layer Net Type Checks

October 2016

ERF Variables for Signal Layer Net Type Checks

ERF variables set in the ERF model control the analysis. ERF variable values are limited to 255 characters.

Table 15-7. Signal Layer Net Type Checks ERF Variables

Variable Description Categories Affected

v_accumulative_dist Determines the maximum distance between nets considered parallel in the ‘Parallel Lines - Accumulative’ categories.

Parallel Nets (Accumulative) Start

Parallel Nets (Accumulative) End

v_accumulative_length Determines the maximum accumulative length that two nets are allowed to run parallel in the ‘Parallel Lines - Accumulative’ categories.

Parallel Nets (Accumulative) Start

Parallel Nets (Accumulative) End

v_angles_tol A tolerance to determine what angles are considered as 0 or 180. This is needed because of unavoidable precision errors. To avoid warnings for parallel lines, any angle in the range of 180-v_angles_tol or 0+v_angles_tol is considered parallel lines. It is suggested that tolerance not be set less than 0.01 degrees.

Line Angle

v_dpair_end_point_len Determines the minimum distance of divergence from a mutual path for differential pair nets to be considered a violation. Endpoints more than this distance from the point of divergence are reported.

Diff. Pair End Points

v_dpair_gap_tol_p A tolerance to determine gap violation between differential pair nets. Gap value + v_dpair_gap_tol_p is considered a violation. Sets a percentage of the requested gap.

Diff. Pair Gap (%)

Diff. Pair Gap (Abs)



v_individual_dist Determines the maximum distance between nets considered parallel in the ‘Parallel Lines - Individual’ categories.

Parallel Nets (Individual) Start

Parallel Nets (Individual) End

Parallel Nets (Adj.) (Individual) Start

Parallel Nets (Adj.) (Individual) End

v_individual_jog Determines the maximum non-parallel distance to still be considered parallel in the ‘Parallel Lines - Individual’ categories.





v_individual_length Determines the maximum length that two nets are allowed to run parallel in the ‘Parallel Lines - Individual’ categories.





v_max_via_count Determines the maximum number of via drills allowed on a net with attribute SQA Critical Net, but lacking attribute Max. Via Count. If set to a negative value (-1), there is no limitation on the number of via drills.

Too Many Vias

v_min_line_width Determines the minimum width for a trace in the ‘Net Path’ categories.

Narrow TraceNarrow Split Trace

v_net2net_relative_ ranges Determines the ERF range to use.

no - (default) use ERF model ranges.

yes - use ranges relative to net clearance.

Affects all net spacing (net2net) categories.

See Relative ERF Ranges for details.


Table 15-7. Signal Layer Net Type Checks ERF Variables (cont.)




October 2016

v_report_diffpair_ net2net_categories

Determines whether measurements between two nets of different differential pair nets, or where only one net is a member of a differential pair net, are reported to the ‘diffpair’ categories or ‘net2net’ categories.

yes - (default) if at least one of the nets is a differential pair net, report to the ‘diffpair’ categories.

no - report all results to the ‘net2net’ categories.


v_short_line_len Determines the minimum length for a line to be considered the side on an angle. Angles between lines where one side is less than v_short_line_len are not reported.

Line Angle

v_simple_net_length Determines how total net length is calculated.

no - (default) calculate net length, ignoring short edges and taking into account trace aperture width and traces that don’t exactly meet the next trace. (As in versions prior to 7.6.5) This option produces a value representing the actual physical length of the net.

yes - calculate net length to be the total of all trace skeleton lengths. This option produces a value closest to that of CAD systems (ignoring trace aperture width and overlap).

Net Length by Width

Table 15-7. Signal Layer Net Type Checks ERF Variables (cont.)


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SETTLEMENT AND DAMAGES, WITH RESPECT TO ANY ALLEGED PATENT OR COPYRIGHT INFRINGEMENTOR TRADE SECRET MISAPPROPRIATION BY ANY PRODUCT PROVIDED UNDER THIS AGREEMENT.

11. TERMINATION AND EFFECT OF TERMINATION.

11.1. If a Software license was provided for limited term use, such license will automatically terminate at the end of the authorizedterm. Mentor Graphics may terminate this Agreement and/or any license granted under this Agreement immediately uponwritten notice if Customer: (a) exceeds the scope of the license or otherwise fails to comply with the licensing or confidentialityprovisions of this Agreement, or (b) becomes insolvent, files a bankruptcy petition, institutes proceedings for liquidation orwinding up or enters into an agreement to assign its assets for the benefit of creditors. For any other material breach of anyprovision of this Agreement, Mentor Graphics may terminate this Agreement and/or any license granted under this Agreementupon 30 days written notice if Customer fails to cure the breach within the 30 day notice period. Termination of this Agreementor any license granted hereunder will not affect Customer’s obligation to pay for Products shipped or licenses granted prior tothe termination, which amounts shall be payable immediately upon the date of termination.

11.2. Upon termination of this Agreement, the rights and obligations of the parties shall cease except as expressly set forth in thisAgreement. Upon termination of this Agreement and/or any license granted under this Agreement, Customer shall ensure thatall use of the affected Products ceases, and shall return hardware and either return to Mentor Graphics or destroy Software inCustomer’s possession, including all copies and documentation, and certify in writing to Mentor Graphics within ten businessdays of the termination date that Customer no longer possesses any of the affected Products or copies of Software in any form.

12. EXPORT. The Products provided hereunder are subject to regulation by local laws and European Union (“E.U.”) and United States(“U.S.”) government agencies, which prohibit export, re-export or diversion of certain products, information about the products, anddirect or indirect products thereof, to certain countries and certain persons. Customer agrees that it will not export or re-export Productsin any manner without first obtaining all necessary approval from appropriate local, E.U. and U.S. government agencies. If Customerwishes to disclose any information to Mentor Graphics that is subject to any E.U., U.S. or other applicable export restrictions, includingwithout limitation the U.S. International Traffic in Arms Regulations (ITAR) or special controls under the Export AdministrationRegulations (EAR), Customer will notify Mentor Graphics personnel, in advance of each instance of disclosure, that such informationis subject to such export restrictions.

13. U.S. GOVERNMENT LICENSE RIGHTS. Software was developed entirely at private expense. The parties agree that all Software iscommercial computer software within the meaning of the applicable acquisition regulations. Accordingly, pursuant to U.S. FAR 48CFR 12.212 and DFAR 48 CFR 227.7202, use, duplication and disclosure of the Software by or for the U.S. government or a U.S.government subcontractor is subject solely to the terms and conditions set forth in this Agreement, which shall supersede anyconflicting terms or conditions in any government order document, except for provisions which are contrary to applicable mandatoryfederal laws.

14. THIRD PARTY BENEFICIARY. Mentor Graphics Corporation, Mentor Graphics (Ireland) Limited, Microsoft Corporation andother licensors may be third party beneficiaries of this Agreement with the right to enforce the obligations set forth herein.

15. REVIEW OF LICENSE USAGE. Customer will monitor the access to and use of Software. With prior written notice and duringCustomer’s normal business hours, Mentor Graphics may engage an internationally recognized accounting firm to review Customer’ssoftware monitoring system and records deemed relevant by the internationally recognized accounting firm to confirm Customer’scompliance with the terms of this Agreement or U.S. or other local export laws. Such review may include FlexNet (or successorproduct) report log files that Customer shall capture and provide at Mentor Graphics’ request. Customer shall make records available inelectronic format and shall fully cooperate with data gathering to support the license review. Mentor Graphics shall bear the expense ofany such review unless a material non-compliance is revealed. Mentor Graphics shall treat as confidential information all informationgained as a result of any request or review and shall only use or disclose such information as required by law or to enforce its rightsunder this Agreement. The provisions of this Section 15 shall survive the termination of this Agreement.

16. CONTROLLING LAW, JURISDICTION AND DISPUTE RESOLUTION. The owners of certain Mentor Graphics intellectualproperty licensed under this Agreement are located in Ireland and the U.S. To promote consistency around the world, disputes shall beresolved as follows: excluding conflict of laws rules, this Agreement shall be governed by and construed under the laws of the State ofOregon, U.S., if Customer is located in North or South America, and the laws of Ireland if Customer is located outside of North orSouth America or Japan, and the laws of Japan if Customer is located in Japan. All disputes arising out of or in relation to thisAgreement shall be submitted to the exclusive jurisdiction of the courts of Portland, Oregon when the laws of Oregon apply, or Dublin,Ireland when the laws of Ireland apply, or the Tokyo District Court when the laws of Japan apply. Notwithstanding the foregoing, alldisputes in Asia (excluding Japan) arising out of or in relation to this Agreement shall be resolved by arbitration in Singapore before asingle arbitrator to be appointed by the chairman of the Singapore International Arbitration Centre (“SIAC”) to be conducted in theEnglish language, in accordance with the Arbitration Rules of the SIAC in effect at the time of the dispute, which rules are deemed to beincorporated by reference in this section. Nothing in this section shall restrict Mentor Graphics’ right to bring an action (including forexample a motion for injunctive relief) against Customer in the jurisdiction where Customer’s place of business is located. The UnitedNations Convention on Contracts for the International Sale of Goods does not apply to this Agreement.

17. SEVERABILITY. If any provision of this Agreement is held by a court of competent jurisdiction to be void, invalid, unenforceable orillegal, such provision shall be severed from this Agreement and the remaining provisions will remain in full force and effect.

18. MISCELLANEOUS. This Agreement contains the parties’ entire understanding relating to its subject matter and supersedes all prioror contemporaneous agreements. Any translation of this Agreement is provided to comply with local legal requirements only. In theevent of a dispute between the English and any non-English versions, the English version of this Agreement shall govern to the extentnot prohibited by local law in the applicable jurisdiction. This Agreement may only be modified in writing, signed by an authorizedrepresentative of each party. Waiver of terms or excuse of breach must be in writing and shall not constitute subsequent consent, waiveror excuse.

Rev. 151102, Part No. 265968

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