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Vertical conveyor parts washer

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an article comprising a tank for Filtration, Znc., Newbury Park, Calif supporting a plating fluid reser- A membrane electrode device for voir; a plating apparatus; and a electrodeposition coating com- plating chemical replenishment prising an electrode and a tubular system. membrane assembly MEMBRANE ELECTRODE DEVICE FOR ELECTROCOATING US. Patent 6,264,809. July 24,200l C.H. Lee, assignor to PTI Advanced CATIONIC ELECTRODEPOSITION COATING US. Patent 6,265,079. July 24,200l Circle 053 on reader card or go to www.thru.to/webconnect Grinding Wheels That Polish Cork filled, hard rubber bond, abrasive wheels. Pmr abrasim a herd Circle 033 on reader card or go to www.thru.to/webconnect S. Nishiguchi et al., assignors to Kansai Paint Co., Ltd., Hyogo, Japan A cationic electrodeposition coat- ing composition comprising a base resin containing a cationiz- able functional group, character- ized by containing bismuth lac- tate derived from a lactic acid, whose L-isomer content is at least 80% by weight, or bismuth methoxyacetate in a form of being dissolved in an aqueous medium. ELECTROLBSS METAL DEPOSITION US. Patent 6,265,086. July 24,200l B. Harkness, assignor to Dow Corning Ltd., Barry Wales, United Kingdom A method for forming a patterned metal film on a substrate by elec- troless metal deposition compris- ing applying a patterned coating of a silyl hydride functional resin onto a substrate; and applying an electroless plating solution com- prising a metal ion onto the silyl hydride functional resin coating to deposit a patterned metal film on the substrate. POWDER COATING US. Patent 6,265,487. July 24,200l P-G. Gottis, assignor to Vantico, Inc., Brewster, N.Y A powder coating composition based on one or more than one poly (meth) acrylic resins having free carboxyl groups, which com- position comprises a hardener based on epoxide compounds. VERTICAL CONVEYOR PARTS WASHER US. Patent 6,267,124. July 31, 2001 D.R. Bowden, assignor to Bowden Industries, Inc., Huntsville, Ala. A parts washing system compris- ing at least one wash tank adapt- ed to retain a cleaning solution therein, means mounted general- ly centrally of the wash tank for creating turbulence of a cleaning solution within the tank directed toward opposite side walls; an 62 Metal Finishing
Transcript
Page 1: Vertical conveyor parts washer

an article comprising a tank for Filtration, Znc., Newbury Park, Calif

supporting a plating fluid reser- A membrane electrode device for voir; a plating apparatus; and a electrodeposition coating com- plating chemical replenishment prising an electrode and a tubular system. membrane assembly

MEMBRANE ELECTRODE DEVICE FOR ELECTROCOATING US. Patent 6,264,809. July 24,200l

C.H. Lee, assignor to PTI Advanced

CATIONIC ELECTRODEPOSITION COATING US. Patent 6,265,079. July 24,200l

Circle 053 on reader card or go to www.thru.to/webconnect

Grinding Wheels That Polish Cork filled, hard rubber bond, abrasive wheels. Pmr abrasim a herd

Circle 033 on reader card or go to www.thru.to/webconnect

S. Nishiguchi et al., assignors to

Kansai Paint Co., Ltd., Hyogo, Japan

A cationic electrodeposition coat- ing composition comprising a base resin containing a cationiz- able functional group, character- ized by containing bismuth lac- tate derived from a lactic acid, whose L-isomer content is at least 80% by weight, or bismuth methoxyacetate in a form of being dissolved in an aqueous medium.

ELECTROLBSS METAL DEPOSITION US. Patent 6,265,086. July 24,200l

B. Harkness, assignor to Dow

Corning Ltd., Barry Wales, United

Kingdom

A method for forming a patterned metal film on a substrate by elec- troless metal deposition compris- ing applying a patterned coating of a silyl hydride functional resin onto a substrate; and applying an electroless plating solution com- prising a metal ion onto the silyl hydride functional resin coating to deposit a patterned metal film on the substrate.

POWDER COATING US. Patent 6,265,487. July 24,200l

P-G. Gottis, assignor to Vantico, Inc.,

Brewster, N.Y

A powder coating composition based on one or more than one poly (meth) acrylic resins having free carboxyl groups, which com- position comprises a hardener based on epoxide compounds.

VERTICAL CONVEYOR PARTS WASHER US. Patent 6,267,124. July 31, 2001

D.R. Bowden, assignor to Bowden

Industries, Inc., Huntsville, Ala.

A parts washing system compris- ing at least one wash tank adapt- ed to retain a cleaning solution therein, means mounted general- ly centrally of the wash tank for creating turbulence of a cleaning solution within the tank directed toward opposite side walls; an

62 Metal Finishing

Page 2: Vertical conveyor parts washer

endless conveyor extending from a parts loading station to a parts discharging station and a plurali- ty of means for carrying parts mounted in spaced relationship to the endless conveyor, each means being pivotally mounted.

AIR ATOMIZING NOZZLE US. Patent 6267,301. July 31,ZOOl

J Haruch, assignor to Spraying

Systems Co., Wheaton, Ill.

An air atomizing nozzle assembly with improved air cap.

PARALLEL ACTION HOLDING CLAMP US. Patent 6,267,856. July 31, 200

H. Brown, assignor to M & B Plating

Racks Inc., Quebec, Canada

A holding clamp for releasably holding a thickened planar article to be submerged in a liquid solu-

tion bath ahead of a submerged anode bar and to be electroplated therein.

APPARATUS FOR ELECTROPLATING US. Patent 6,267,860. July 31,200l

WL. Brodsky, assignor to

International Business Machines

Corp., Armonk, NJ

A method for enhancing the elec- troplating of at least one article supported by an electrically con- ductive support structure adapt- ed to conduct electrical current and having a plurality of electri- cal connections adapted to con- nect to at least one article to be electroplated.

APPARATUS FOR PLATING WAFERS CM. Patent 6,267,862. July 31,200l

R. Kaufman and G.C. Downes, assig-

nors to Technic Inc., Cranston, R. I.

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A method of plating a desired sur- face of a wafer comprising form- ing an uneven plating deposition across the desired surface of the wafer; providing an electrical con- ductor in proximity to the wafer; and creating a voltage difference between the electrical conductor and wafer to remove a plating material off the desired surface to improve the uniformity of plating deposition across the desired sur- ace of the wafer

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July 2002 63


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