Organizational Chart● China
● Europe
● Japan
● Korea
● North America
● Taiwan
Last updated: May 29, 2013
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Gas & Liquid Chemicals
CommitteeC: J-M Collard - Solvay Chemicals
C: G. Ferrier - Air Products
VC: G. De Vos - FFEM
Photovoltaic Automation
CommitteeC: E. Teichmann - Peer Group
Equipment Automation
CommitteeC: A. Honold - InReCon (I&C, PIC,
Metrics)
C: L. Pfitzner - FhG IISB (Metrics)
C: F. Petzold - Trustsec (I&C)
Silicon Wafer Committee
C: W. Bergholz - Jacobs University of
Bremen
C: P. Wagner - Consultant
C: F. Passek - Siltronic
Compound Semiconductor
Materials CommitteeC: A. Weber - SiCrystal
EHS Committee
C: B. Planting - ASML
C: T. Pilz - Pilz Automation
Photovoltaic Materials
CommitteeC: P. Wagner - Consultant
C: H. Aulich - PV Crystalox Solar
SEMI Europe Regional Standards OrganizationCo-chairs: Bert Planting - ASML, Werner Bergholz - Jacobs University of Bremen
Vice-chair: Frank Petzold - Trustsec
2 / 32
Precursor Specifications
TFL: P. Williams - SAFC Hitech
Gas & Liquid Chemicals
CommitteeC: J-M Collard - Solvay Chemicals
C: G. Ferrier - Air Products
VC: G. De Vos - FFEM
Equipment Automation
CommitteeC: A. Honold - InReCon (I&C, PIC,
Metrics)
C: L. Pfitzner - FhG IISB (Metrics)
C: F. Petzold - Trustsec (I&C)
Process Control Systems
TFL: M. Schellenberger - FhG
IISB
SEMI Europe EHS, Equipment Automation,
and Gas & Liquid Chemicals Committees
Solvents in Advanced
Processes TFL: G. De Vos - FFEM
EHS Committee
C: B. Planting - ASML
C: T. Pilz - Pilz Automation
SEMI S10 Revision (Risk
Assessment) TFL: B. Planting - ASML
International Reticle SMIF Pod
& Loadport Interoperability TFL: Astrid Gettel-GLOBALFOUNDRIES
L: Koji Ohyama - Dainichi ShojiSEMI S25 Revision TF
L: J-M Collard - Solvay
Chemicals
L: B. Planting - ASML
3 / 32
SEMI Europe PV, PV Automation, Compound
Semiconductor and Silicon Wafer Committees
Photovoltaic Materials
CommitteeC: P. Wagner - Consultant
C: H. Aulich - PV Crystalox Solar
Silicon Wafer Committee
C: W. Bergholz - Jacobs University of
Bremen
C: P. Wagner - Consultant
C: F. Passek - Siltronic
International Terminology
TFL: P. Wagner - Consultant
L: M. Bullis - Materials &
Metrology
L: T. Nakai - SUMCO
International Advanced
Wafer Geometry TFL: N. Poduje - SMS
L: S. Akiyama - Raytex
L: F. Passek - Siltronic
L: F. Riedel - Siltronic
PV Silicon Materials TF
L: Peter Wagner - Consultant
PV Ribbon TF
L: Christian Prischmann -
Ulbrich
Int’l PV Analytical Test
Methods TFL: Hugh Gotts - Balazs
Analytical Services
PV Wafer Traceability TF
L: TBD
Compound Semiconductor
Materials CommitteeC: A. Weber - SiCrystal
Contactless Resistivity
and Mobility Mapping TFL: W. Jantz - Semimap
SiC TF
L: A. Weber - SiCrystal
Photovoltaic Automation
CommitteeC: E. Teichmann - Peer Group
PV Equipment Interface
Specification (EIS) TFL: C. Born - Viltronic
International Test
Methods TFL: P. Wagner - Consultant
L: M. Bullis - Materials &
Metrology
L: R. Takeda - Covalent Silicon
International Advanced
Surface Inspection TFL: G. Kren - KLA-Tencor
L: Y. Tamaki - ATMI
L: H. Ohta - Hitachi High
Technologies
International Polished
Wafers TFL: F. Riedel - Siltronic
L: M. Bullis - Materials &
Metrology
L: T. Nakai - SUMCO4 / 32
Information & Control Committee
C: Takayuki Nishimura -
SCREEN
C: Mitsuhiro Matsuda - Hitachi
Kokusai Electric
Physical Interfaces &
Carriers CommitteeC: Tsuyoshi Nagashima -
Miraial
C: Tsutomu Okabe - TDK
C: Keni Yamagata - DAIFUKU
Traceability Committee
C: Yoichi Iga - Renesas
Electronics
C: Hirokazu Tsunobuchi -
Keyence
Compound Semiconductor
Materials CommitteeC: Masayoshi Obara - Shin-Etsu
Handotai
Silicon Wafer Committee
C: Naoyuki Kawai - The
University of Tokyo
C: Tetsuya Nakai - SUMCO
Packaging Committee
C: Kazunori Kato - AiT
C: Masahiro Tsuriya - iNEMI
C: Yutaka Koma - Koma
Consulting
Micropatterning
CommitteeC: TBD
SEMI Japan Regional Standards OrganizationCo-Chair: Mitsuhiro Matsuda - Hitachi Kokusai Electric Co-Chair: Naoyuki Kawai – The University of Tokyo
Vice Chair: Supika Mashiro - TEL
Photovoltaic Materials
CommitteeC: Takashi Ishihara -
Mitsubishi Electric
C: Kazuhiko Kashima -
GlobalWafers Japan
C: Tetsuo Fukuda - AIST
Special Groups
Reporting to the JRSC
Gases & Facilities
Committee
C: Hiromichi Enami - Hitachi
High-Technologies
C: Isao Suzuki - MKS Japan
Environmental Health &
Safety CommitteeC: Hidetoshi Sakura - Intel
C: Supika Mashiro - TEL
C: Moray Crawford - Hatsuta
Seisakusho
Liquid Chemicals
CommitteeC: Hiroshi Tomita - Toshiba
C: Hiroyuki Araki - SCREEN
FPD Factory Automation
CommitteeC: Yasunobu Otogawa - Daihen
C: Harumichi Hirose - Shibaura
Mechatronics
FPD Materials & Components
CommitteeC: Hisashi Aruga - Seiko Epson
C: Tadahiro Furukawa - Yamagata
University
C: Yoshihiko Shibahara - FUJIFILM
FPD Mask Committee
C: Kazuya Shiojiri - SK-Electronics
C: Kaname Nitobe - HOYA
FPD Metrology Committee
C: Ryoichi Watanabe - Japan
Display Central
C: Akira Kawaguchi - Otsuka
Electronics
FPD Coordination Group
L: Yoshitada Nogami - SK
Electronics
L: Makoto Yamamoto - Muratec
Standardization Process
Integration (SPI)L: Supika Mahiro -TEL
Photovoltaic Automation
CommitteeC: Terry Asakawa -TEL
C: Emi Ishikawa - Atelier
Ishikawa
C: Makoto Ishikawa - Nisshinbo
Mechatronics
Test Committee
C: Hirofumi Kaga - Renesas
Electronics
C: Takashi Umenaga -
Teradyne
Photovoltaic
CommitteeC: Hiromu Takatsuka -
Mitsubishi Heavy Industries
C: Kazuhiko Kashima -
GlobalWafers Japan
C: Masaaki Yamamichi - AIST
C: Terry Asakawa - TEL
Metrics Committee
C: Toshio Murakami -Murakami
Corporation
5 / 32
SEMI Japan PV, PV Materials,
and PV Automation Committees
Photovoltaic Materials
CommitteeC: Takashi Ishihara - Mitsubishi
Electric
C: Kazuhiko Kashima -
GlobalWafers Japan
C: Tetsuo Fukuda - AIST
Japan PV Materials TF
L: Tetsuo Fukuda - AIST
L: Takashi Ishihara - Mitsubishi
Electronic
Photovoltaic Automation
CommitteeC: Emi Ishikawa - Atelier Ishikawa
C: Terry Asakawa - TEL
C: Makoto Ishikawa - Nisshinbo
Mechatronics
Photovoltaic Committee
C: Hiromu Takatsuka - Mitsubishi
Heavy Industries
C: Kazuhiko Kashima -
GlobalWafers Japan
C: Masaaki Yamamichi - AIST
C: Terry Asakawa - TEL
Global PV Equipment Interface
Specification (PV-EIS) TFL: Takashi Murakami - TEL
L: Makoto Ishikawa - Nisshinbo
Mechatronics
6 / 32
Metrics Committee
C: Toshio Murakami -Murakami
Corporation
Physical Interfaces & Carriers
CommitteeC: Tsuyoshi Nagashima - Miraial
C: Tsutomu Okabe – TDK
C: Keni Yamagata - DAIFUKU
TA: Takao Nojima - Intel
SEMI Japan PI&C and Metrics Committees
Int'l Environmental
Contamination Control TFL: Mikio Furukawa - Shin-Etsu
Polymer
ESD/ESC TF
L: Toshio Murakami -
Murakumi Corporation
Global PI&C Standards
Maintenance TFL: Shoji Komatsu - ActeonEMC Study Group
L: Koji Ochi - Noise Laboratory
450 mm International
PI&C TFL: Shoji Komatsu - Acteon
(PIC-Si) Int’l 450 mm
Shipping Box TFL: Yasuhiro Shimizu -
Consultant
Cycle Time Metrics TF
L: Kenichiro Mukai - Applied
Materials Japan
L: Supika Mashiro - TEL
International Reticle SMIF Pod
& Loadport Interoperability TFL: Koji Oyama - Dainichi Shoji
450 mm AMHS
TFL: Yoichi Motoori - Muratec
L: Kenji Yamagata - DAIFUKU
International Process Module
Physical Interface TFL: Supika Mashiro - TEL
7 / 32
Traceability Committee
C: Yoichi Iga - Renesas Electronics
C: Hirokazu Tsunobuchi - Keyence
SEMI Japan Information & Control,
and Traceability Committees
5 Year Review
TFL: Hirokazu Tsunobuchi -
Keyence
Information and Control
CommitteeC: Takayuki Nishimura - SCREEN
C: Mitsuhiro Matsuda - Hitachi
Kokusai Electric
Adviser: Mitch Sakamoto - Tokyo
Electron
AMHS TF
L: Hiroshi Kondo - Murata
Machinery
L: Mitsumasa Ago - DAIFUKU
TA
Hiroshi Kondo - Murata
Machinery
Tadashi Mochizuki - Tokyo
Electron
GEM 300 TF
L: Yoshihisa Takasaki -
SCREEN
L: Tadashi Mochizuki - Tokyo
Electron
Japan PV Traceability TF
L: Yoichi Iga - Renesas
Electronics
L: Hirokazu Tsunobuchi -
KeyenceEquipment Information
System Security TFL: Mitch Sakamoto - Tokyo
Electron
Sensor Bus TF
L: Hideaki Ogihara - ALGO
Sysstem
Predictive Carrier
Logistics (PCL) TFL: Yuko Toyoshima - Hitachi
High-Technologies
L: Terry Asakawa - Tokyo
Electron
8 / 32
SEMI Japan Gases & Facilities, and
Liquid Chemicals Committees
Gases and Facilities
CommitteeC: Hiromichi Enami - Hitachi High
Technologies
C: Isao Suzuki - MKS Japan
F1 Revision TF
L: Shuji Moriya - Tokyo Electron
Yamanashi
L: Yoshifumi Machii - Fujikin
Gas Panel Test Method TF
L: Yoshifumi Machii - Fujikin
L: Shuji Moriya - Tokyo Electron
Yamanashi
Liquid Chemicals Committee
C: Hiroshi Tomita - Toshiba
C: Hiroyuki Araki - SCREEN
Diaphragm Valve TF
L: Shigeru Ohsugi - CKD
L: Kimihito Sasao - Advance
Electric
Welding Fitting TF
L: Kimihito Sasao - Advance
Electric
L: Takashi Hasegawa - KITZ
SCT
5-year Review TF
L: Koichi Ishikawa - ACE
Liquid Filter TF
L: Takuya Nagafuchi - Nihon
Entegris
L: Takehito Mizuno - Nihon Pall
5-year Review TF
L: Yoshifumi Machii - Fujikin
Liquid-Borne Particle
Counter TFL: Kaoru Kondo - RION
L: Kazutoshi Kato - PMS
9 / 32
Environmental, Health &
Safety CommitteeC: Hidetoshi Sakura - Intel
C: Supika Mashiro - TEL
C: Moray Crawford - Hatsuta
Seisakusho
S23 Revision TF
L: George Hoshi - TEL
L: Lauren Crane – KLA-Tencor
SEMI Japan EHS Committee
STEP Planning WG
L: Kenji Sugihara - Panasonic
S18 Revision TF
L: Supika Mashiro - TEL
L: Moray Crawford - Hatsua
Seisakusho
GHG Emission
Characterization TFL: George Hoshi - TELL: Minoru Kagino - Toshiba
Seismic Protection
TFL: Eiji Nakatani - Sokudo
FPD System Safety TF
L: Ikuo Goto - Muratec
Automation
L: Naokatsu Nishiguchi -
SCREEN
10 / 32
SEMI Japan FPD Factory Automation,
Materials & Components, Mask, and Metrology Committees
FPD Factory Automation
CommitteeC: Yasunobu Otogawa - Daihen
C: Harumichi Hirose - Shibaura
Mechatronics
Future Generation Factory
Automation TFL: Yasunobu Otogawa - Daihen
L: Harumichi Hirose - Shibaura
Mechatronics
L: Hiroyuki Matsumoto - Hitachi
Plant Technologies
FPD Factory Automation
5 Year Review TFL: open
FPD Mask Committee
C: Kazuya Shiojiri - SK Electronics
C: Kaname Nitobe - HOYA
FPD Materials & Components
CommitteeC: Hisashi Aruga - Seiko Epson
C: Tadahiro Furukawa - Yamagata
University
C: Yoshihiko Shibahara - Fujifilm
Backlight TF
L: Satoshi Kanazawa - Stanley
L: Masami Takagi - Harison
Toshiba Lighting
L: Kazuyoshi Yamaguchi -
Panasonic Photo & Lighting
Polarizing Film TF
L: Yuzo Akada - Nitto Denko
L: Toshihito Otsuka - Sanritz
L: Yoshihiko Shibahara -
Fujifilm
Large Size Mask TF
L: Atsushi Okazaki - SK-
Electronics
Single Substrate Handling
Interface (SSHI) TFL: Yasunobu Otogawa -
Daihen
L: Hiroshi Fukazawa - Muratec
Automation
FPD Productivity
Improvement WGL: open
Flexible Display TF
L: Takashi Shiro - Teijin
L: Tadahiro Furukawa -
Yamagata University
FPD Metrology Committee
C: Ryoichi Watanabe - Japan
Display Central
C: Akira Kawaguchi - Otsuka
Electronics
D31 Revision TF
L: Kose Tanahashi - Samsung
Electronics
L: Masao Kochi - Highland
L: Keizo Ochi - Konica Minolta
Optics
FPD Color Filter TF
L: Hisashi Aruga - Seiko Epson
11 / 32
Silicon Wafer Committee
C: Naoyuki Kawai - The University of
Tokyo
C: Tetsuya Nakai - SUMCO
International Annealed
Wafers TFL: Koji Araki - GlobalWafers
Japan
SEMI Japan Silicon Wafer Committee
International Terminology
TFL: Tetsuya Nakai - SUMCO
International Advanced
Wafer Geometry TFL: Satoshi Akiyama - Raytex
Japan JWG TF
L: Masanori Yoshise -
Freelance
L: Satoshi Akiyama - Raytex
International Test Method
TFL: Ryuji Takeda -
GlobalWafers Japan
International SOI Wafers
TFL: Atsushi Ogura - Meiji
University
L: Tetsuya Nakai - SUMCO
Reclaim Wafer TF
L: Hisashi Taniguchi - Hamada
Heavy Industries
L: Keiji Konno - Mimasu
Semiconductor Industry International Advanced
Surface Inspection TFL: Yusuke Tamaki - ATMI
Japan
L: Hideo Ohta - Hitachi High
Technologies
JA Shipping Box TF
L: Shoji Komatsu - Acteon
L: Yasuhiro Shimizu - Shimizu
Consultant
International 450 mm
Wafer TFL: Masaharu Watanabe -
Semilab
International 450 mm
Shipping Box TFL: Yasuhiro Shimizu - Shimizu
Consultant
GOI WG
L: Tsuyoshi Otsuki - Shin-Etsu
Handotai
Surface Organic
Contaminant Analysis WGL: Yoshimi Shiramizu -
Renesas Electronics
Surface Metal Chemical
Analysis WGL: Ryuji Takeda - GlobalWafers
Japan
L: Hitoshi Torayama -
KOBELCO
BMD DZ WG
L: Satoshi Akiyama - Raytex
L: Kazuo Moriya - Raytex
Bulk Heavy Metal Analysis
by Electrical Measurement
WGL: Shingo Sumie - KOBELCO
L: Kei Matsumoto - SUMCO
International Epitaxial
Wafers TFL: Takao Takenaka - Takenaka
Consultant
International Polished
Wafers TFL: Koji Izunome - GlobalWafers
Japan
Japan Test Method TF
L: Ryuji Takeda - GlobalWafers
Japan
L: Tsuyoshi Otsuki Shin-Etsu
Handotai
L: Yoshimi Shiramizu -
Renesas Electronics
12 / 32
Micropatterning Committee
C: open
C: open
SEMI Japan Compound and Micropatterning Committees
5 Year Review TF
L: open
Compound Semiconductor
Materials CommitteeC: Masayoshi Obara - GlobalWafers
Japan
C: open
5 Year Review TF
L: TBD
Global 200 mm GaAs
Wafer Specification TFL: TBD
Sapphire Substrate TF
L: Toshiro Kotaki - Namiki
Precision Jewel
Mask Data Format for
Mask Tools TFL: Toshio Suzuki - Dai Nippon
Printing
International SiC TF
L: Taizo Hoshino - NIPPON
STEEL & SUMIKIN
MATERIALS
13 / 32
Test Committee
C: Hirofumi Kaga - Renesas
Electronics
C: Takashi Umenaga -Teradyne
Packaging Committee
C: Kazunori Kato - AiT
C: Masahiro Tsuriya - iNEMI
C: Yutaka Koma - Koma Consulting
Electromagnetic
Characterization SGL: Mikio Kiyono - AET
SEMI Japan Test and Packaging Committees
Wafer Shipping Container for
Assembly &Packaging TF L:Yasuhiro Shimizu - Shimizu
Consultant
L: Kazuhiko Nakamura - Consultant
L: Tatsuya Yanagawa - Achilles
Packages & Packaging Materials
Eco-efficiency TFL: Shoichi Suzuki - Sumitomo Metal Mining
L: Kazuhiko Nakamura - Consultant
450 mm ATDP TF
L: Akihito Kawai - DISCO
L: Sumio Masuchi - DISCO
L: Kiyofumi Tanaka - SEP
L: Kenichi Watanabe - Lintec
DFM SG
L: Ichiro Anjo - Jisso Partners
3D-IC SG
L: Kazunori Kato - AiT
L: Masahiro Tsuriya - iNEMI
L: Yutaka Koma - Koma
Consulting
Thin Chip (Die) Bending
Strength Measurement TF L: Haruo Shimamoto
L: Morihiro Kada - ASET
L: Shoji Yasunaga - Rohm
L: Yuzo Shimobeppu - Fujitsu
Semiconductor
14 / 32
SEMI Korea Regional Standards Organization
Information & Control
CommitteeC: Hyungsu Kim - SDS
C: Chul Hong Ahn - SK Hynix
C: Gun Woo Lee - Miracom Inc.
Facilities Committee
C: Kwang Sun Kim - KUT
C: Insoo Cho - Shinsung ENG
FPD Metrology
CommitteeC: JongSeo Lee - Samsung
Display
C: II-Ho (William) Kim - Light
Measurement Solution
FPD Committee
C: JongSeo Lee - Samsung
Display
C: II-Ho (William) Kim - Light
Measurement Solution
EHS WG
L: Seung Jong Ko - SK Hynix
L: Hyunsuk Kim - Samsung
Electronics
15 / 32
SEMI Korea FPD and FPD Metrology Committees
FPD Committee
C: JongSeo Lee - Samsung
Display
C: II-Ho (William) Kim - Light
Measurement Solution
PDP Subcommittee
L: SeKwang Park - Kyungpook
Univ.
LCD Subcommittee
L: JongSeo Lee - Samsung
Display
OLED Subcommittee
L: Choonghoon Yi -
MODISTECH
FPD Metrology
CommitteeC: JongSeo Lee - Samsung
Display
C: II-Ho (William) Kim - Light
Measurement Solution
Tone and Color TF
L: Kyung Jin Kang - LG
Electronics
Color Assessment
TFL: Jongho Chong - Samsung
Display
L: Myongyoung Lee - LG
Electronics
L: Don-Gyou Lee - LG Display
LCD SC
L: Don-Gyou Lee - LG Display
OLED SC
L: Don-Gyou Lee - LG Display
3D Display SC
L: Sungho Choi - Masterimag
3D
Optical Characteristic
Measurement TFL:JongSeo Lee - Samsung
Display
16 / 32
SEMI Korea Information & Control,
Facilities Committees, and EHS WG
Information & Control
CommitteeC: Hyungsu Kim - SDS
C: Chul Hong Ahn - SK Hynix
C: Gun Woo Lee - Miracom Inc.
EHS WG
L: Seung Jong Ko - SK Hynix
L: Hyunsuk Kim - Samsung
Electronics
S2 Sub-WG
L: Deok Seop Shim - TUV
Rheinland
S23 Sub-WG
L: Sangyun Jung - Samsung
Electronics
GEM 300 TF
L: Jong Sub Shim - ASM
L: Chang Yul Cho - SEMES
L: Byoung Min Im - TEL Korea
DDA TF
L: Hyungsu Kim - SDS
Facilities Committee
C: Kwang Sun Kim - KUT
C: Insoo Cho - Shinsung ENG
Equipment Cleanness TF
L: Insoo Cho - Shinsung ENG
17 / 32
Information & Control
CommitteeC: Jack Ghiselli - Ghiselli Consulting
C: Brian Rubow - Cimetrix
C: Lance Rist - Industry Consultant
Physical Interfaces & Carriers
CommitteeC: Matt Fuller - Entegris
C: Mutaz Haddadin - Intel
Metrics Committee
C: David Bouldin - Fab Consulting
C: Mark Frankfurth - Cymer
Microlithography Committee
C: Wes Erck - Wes Erck &
Associates
C: Rick Silver - NIST
Compound Semiconductor
Materials CommitteeC: Russ Kremer - Freiberger
Compound Materials
C: James Oliver - Northrop Grumman
Silicon Wafer Committee
C: Dinesh Gupta - STA
C: Noel Poduje - SMS
VC: Mike Goldstein - Intel
Traceability Committee
C: Win Baylies - BayTech Group
C: Yaw Obeng - NIST
Facilities Committee
C: Steve Lewis - CH2M Hill
Gases Committee
C: Tim Volin - Parker Hannifin
C: Mohamed Saleem - Fujikin
Liquid Chemicals Committee
C: Frank Flowers - FMC
C: Frank Parker - ICL
MEMS/NEMS Committee
C: Win Baylies - BayTech Group
C: Mark Crockett - MEMSMART
C: Janet Cassard - NIST
Environmental Health & Safety
CommitteeC: Chris Evanston - Salus
Engineering
C: Sean Larsen - Lam Research AG
Flat Panel Display Committee
C: Bill Colbran - Engenuity Systems
SEMI N.A. Regional Standards OrganizationCo-Chairs: Jackie Ferrell - ISMI & Sean Larsen - Lam Research AG
Vice-Chair: Mark Crockett - MEMSMART
NA RSC Technical Architect
BoardC: James Moyne - University of
Michigan
C: Yaw Obeng - NIST
Photovoltaic
CommitteeC: Win Baylies - BayTech Group
C: James Moyne - University of
Michigan
3DS-IC
CommitteeC: Richard Allen - NIST
C: Urmi Ray - Qualcomm
C: Chris Moore - Semilab
C: Sesh Ramaswami - Applied
Materials
HB-LED Committee
C: Iain Black - Philips
C: Chris Moore - Semilab
C: Bill Quinn - WEQ Consulting
C: David Reid - Silian
Automated Test Equipment
CommitteeC: Ajay Khoche - Khoche Consulting
Photovoltaic Materials
CommitteeC: Lori Nye - Brewer Science
C: John Valley - MEMC
18 / 32
Gases Committee
C: Tim Volin - Parker Hannifin
C: Mohamed Saleem - Fujikin
Mass Flow TF
L: Mohamed Saleem - Fujikin
Pressure Measurement TF
L: Justin Hough - Applied
Materials
L: David Colquhoun - BriskHeat
Contamination Subcommittee
C: Tim Volin - Parker Hannifin
Filters & Purifiers TF
L: Mohamed Saleem - Fujikin
Materials and Processes
SubcommitteeC: Tim Volin - Parker Hannifin
Materials of Construction
Gas Delivery Systems TFL: Tim Volin - Parker
Hannifin
Components Subcommittee
C: Mohamed Saleem - Fujikin
SEMI N.A. Gases Committee
Heater Jacket TF
L: David Colquhoun - BriskHeat
L: Mark Crockett - MEMSmart
Gas Specifications TF
L: Mark Ripkowski - CONSCI
Surface Mount Sandwich
Component Dimensions TFL: Matt Milburn - UCT
19 / 32
Facilities Committee
C: Steve Lewis - CH2M Hill
Analytical Methods TF
L: Frank Flowers - FMC
SEMI F57 Rewrite TF
L: James Henry - Arkema
Group
L: Ian Francisco - Lam
Research
Liquid Chemicals Committee
C: Frank Flowers - FMC
C: Frank Parker - ICL
SEMI N.A. Facilities & Liquid Chemicals Committees
F51 Revision TF
L: Dalia Vernikovsky - Applied
Seals North America
Building Information Modeling (BIM) for
Semiconductor Capital Equipment TFL: Ben Bruce - Applied Materials
Determining Roughness
of Polymer Surfaces TFL: Marty Burkhart -Hi Pure Tech
L: Gunter Moeller - Arkema
Group
SEMI F104 Rewrite TF
L: TBD
UPW Filter Performance
TFL: Slava Libman - Air Liquide
SEMI F63 Rewrite TF
L: Slava Libman - Air Liquide
SEMI F31, F39 & F41
Rewrite TFL: David Kandiyeli - Ichor
Systems
L: Koh Murai - Ichor Systems
SEMI F40 Rewrite TF
L: Marty Burkhart -Hi Pure Tech
Liquid Chemicals
SubcommitteeC: Frank Flowers - FMC
C: Frank Parker - ICL
Liquid Chemical Distribution
SubcommitteeC: open
20 / 32
Information & Control Committee
C: Brian Rubow - Cimetrix
C: Jack Ghiselli - Ghiselli Consulting
C: Lance Rist - Industry Consultant
TA: Gino Crispieri - ISMI
AMHS IBSEM TF
L: Kevin Dandoy - Applied
Materials
L: Ron Denison - Consultant
GEM300 TF
L: Brian Rubow- Cimetrix
L: Gino Crispieri - ISMI
Diagnostic Data
Acquisition (DDA) TFL: Brian Rubow - Cimetrix
L: Gino Crispieri - ISMI
Sensor Bus TF
C: James Moyne - University of
Michigan
Process Control System
Architecture (PCS) TFL: James Moyne - University of
Michigan
L: Chris Maloney - Intel
Sort Map TF
L: Dave Huntley - Kinesys
Software
L: Thierry de Villeneuve -
STMicoelectronics
Automated Test Equipment
CommitteeC: Ajay Khoche - Khoche Consulting
Standard Test Data
Format (STDF) TFL: Ajay Khoche - Khoche
Consulting
SEMI N.A. Information & Control
and Automated Test Equipment Committees
Test Cell Communcations
TFL: Len Van Eck - LTX-
Credence
L: Mark Roos - Roos
Instruments
Energy Saving Equipment
Communication TFL: Gino Crispieri - ISMI
L: Mike Czerniak - Edwards
Vacuum
21 / 32
Metrics Committee
C: David Bouldin - Fab Consulting
C: Mark Frankfurth - Cymer
TE: Carolyn Busing - Self
TE: Chona Shumate - Cymer
TA: Greg Francis - Cymer
SEMI N.A. Physical Interfaces & Carriers
and Metrics Committees
Physical Interfaces & Carriers
CommitteeC: Matt Fuller - Entegris
C: Mutaz Haddadin - Intel
Global PIC Maintenance
TFL: Larry Hartsough - UA
Associates
Metrics Education & Adoption
(MEA) Subc (inactive)C: TBD
EMC TF
L: Vladimir Kraz - BestESD
Technical Services
L: Mark Frankfurth - Cymer
ESD/ESC TF
L: Arnold Steinman - Electronics
Workshop
L: open
Factory Level Productivity
Metrics TF (inactive)L: Ron Billings - Georgia Tech/
FABQ
L: Jim Irwin - I/C Irwin Consulting
EUV Reticle Handling TF
L: Long He - SEMATECH
L: David Chan - SEMATECH
L: John Zimmerman - ASML
L: David Halbmaier - Entegris
L: Kazuya Ota - Nikon
International 450 mm PIC
TFL: Mutaz Haddadin - Intel
L: Shoji Komatsu - Acteon
NA 450mm Shipping Box
TFL: Tom Quinn - Intel
Equipment Training &
Documentation TFL: Mark Cohran - Intel
L: Malthi Venkat - Nikon Precision
International 450 mm
Shipping Box TFL: Tom Quinn - Intel
L: Yasuhiro Shimizu -
Consultant
450mm ATDP TF
L: Stefan Radloff - Intel
Wait Time Waste Metrics
and Methods TFL: Jackie Ferrell - ISMI
L: Lance Rist - Industry
Consultant
Equipment RAMP Metrics
TFL: David Busing - KLA-Tencor
L: Steven Meyer - Intel
International Reticle SMIF Pod
& Loadport Interoperability TFL: Astrid Gettel-GLOBALFOUNDRIES
L: Koji Oyama - Dainichi Shoji
International Process Module
Physical Interface TFL: Supika Mashiro -Tokyo Electron
L: Richard Oechsner - Fraunhofer
Equipment Cost of
Ownership TF (inactive)L: Daren Dance - WWK
L: David Bouldin - Fab Consulting
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Microlithography Committee
C: Wes Erck - Wes Erck &
Associates
C: Rick Silver - NIST
Terminology of Metrology
TFL: Jim Potzick - NIST
Extreme Ultraviolet (EUV)
Mask TFL: David Chan - SEMATECH
Mask Orders (P10) TF
L: Wes Erck - Wes Erck &
Associates
Data Path TF
L: Thomas Grebinski - OASIS
Tooling
L: Kurt Wampler - ASML
Traceability Committee
C: Win Baylies - BayTech Group
C: Yaw Obeng - NIST
SEMI N.A. FPD, Microlithography
& Traceability Committees
Standards for
Scatterometry TFL: Thomas Germer - NIST
Extreme Ultraviolet (EUV)
Fiducial Mark TFL: Long He - SEMATECH
Flat Panel Display Committee
C:Bill Colbran - Engenuity Systems
5 Year Review TF
L: Win Baylies - BayTech
Group
23 / 32
SEMI N.A. Compound Semiconductor
& Silicon Wafer Committees
International Annealed
Wafers TFL: Dinesh Gupta - STA
International Epitaxial
Wafers TFL: Dinesh Gupta - STA
L: Paul Langer - Langer Silicon
Solutions
International Polished
Wafers (Substrate) TFL: Murray Bullis - Materials &
Metrology
International SOI Wafers
TFL: Mariam Sadaka - SOITEC
International Advanced
Wafer Geometry TFL: Noel Poduje - SMS
L: Jaydeep Sinha - KLA-Tencor
L: John Valley - MEMC
International Advanced
Surface Inspection TFL: George Kren - KLA Tencor
L: John Valley - MEMC
International Test
Methods TFL: Dinesh Gupta - STA
International Terminology
TFL: Murray Bullis - Materials &
Metrology
Specifications Metrology Committee
International 450 mm
Wafer TFL: Mike Goldstein - Intel
Compound Semiconductor
Materials CommitteeC: Russ Kremer - Freiberger
Compound Materials
C: James Oliver - Northrop
Grumman
Electrical Properties TF
L: Austin Blew - LEI
SEMI M55 5-Yr Review TF
L: Judy Kronwasser - NOVASiC
Silicon Carbide TF
L: Open
GaN TF
L: Judy Kronwasser - NOVASiC
Silicon Wafer Committee
C: Dinesh Gupta - STA
C: Noel Poduje - SMS
VC: Mike Goldstein - Intel
TE: Murray Bullis - Materials &
Metrology
24 / 32
SEMI N.A. Photovoltaic
& Photovoltaic Materials Committees
Photovoltaic Materials
CommitteeC: Lori Nye - Brewer Science
C: John Valley - MEMC
PV Electrical & Optical
Properties Measurements TFL: Austin Blew - LEI
L: Chris Moore - Semilab
International PV Analytical
Test Methods TFL: Hugh Gotts - Balazs
Analytical Services
Photovoltaic Committee
C: Win Baylies - BayTech Group
C: James Moyne - University of
Michigan
25 / 32
S2 Interlock Reliability TF
L: Bert Planting - ASML
L: Tom Pilz - Pilz Automation
Ergonomics TF
L: Ron Macklin - Macklin &
Associates
L: Paul Schwab Texas
Instruments
Environmental Health & Safety
CommitteeC: Chris Evanston - Salus Engineering
C: Sean Larsen - Lam Research AG
SEMI N.A. Environmental, Health & Safety Committee
S2 Ladders & Steps TF
L: Ron Macklin - Macklin &
Associates
L: Carl Wong - AKT
International Fire
Protection TFL: Matt Wyman - Koetter Fire
Protection
Lifting Equipment TF
L: Ron Macklin - Macklin &
Associates
S2 Chemical Exposure TF
L: John Visty - Salus
Engineering
S2 Machinery Directive
Mapping TFL: Lauren Crane - KLA-Tencor
S22 Revision TF
L: Chris Evanston - Salus
Engineering
L: Sean Larsen - Lam Research
AG
S6 Revision TF
L: John Visty - Salus
Engineering
L: Glenn Holbrook - TUV SUD
S2 Non-Ionizing Radiation
TFL: Sean Larsen -Lam Research
AG
L: John Visty - Salus
Engineering
Fail-Safe/Fault-Tolerant
TFL: Lauren Crane - KLA-Tencor
L: Chris Evanston - Salus
Engineering
Manufacturing Equipment Safety
SubcommitteeC: Mark Harralson - Intel
C: Cliff Greenberg - Nikon Precision
C: Andrew Giles - ESTEC
C: Lauren Crane - KLA-Tencor
26 / 32
SEMI N.A. 3DS-IC, HB-LED & MEMS/NEMS
MEMS/NEMS Committee
C: Win Baylies - BayTech Group
C: Mark Crockett - MEMSMART
C: Janet Cassard - NIST
Packaging TF
L: Steve Martell - Sonoscan
Wafer Bond TF
L: Win Baylies - BayTech
Group
L: Richard Allen - NIST
Material Characterization
TFL: Janet Cassard - NIST
L: Kevin Turner - University of
Pennsylvania
International MEMS
Terminology TFL: Steven Martell - Sonoscan
Reliability TF
L: Open
HB-LED Committee
C: Iain Black - Philips
C: Chris Moore - Semilab
C: Bill Quinn - WEQ Consulting
C: David Reid - Silian
3DS-IC
CommitteeC: Richard Allen - NIST
C: Urmi Ray - Qualcomm
C: Chris Moore - Semilab
C: Sesh Ramaswami - Applied
Materials
HB-LED Equipment
Automation Interfaces TFL: Daniel Babbs - Brooks
Automation
L: Jeff Felipe - Entegris
HB-LED Assembly TF
L: Paul Reid - Kulicke & Soffa
3DS-IC Bonded Wafer TF
L: Richard Allen - NIST
HB-LED Wafer TF
L: David Joyce - GT Advanced
Technologies
L: Julie Chao - Silian
3DS-IC Inspection and
Metrology TFL: Victor Vartanian -
SEMATECH
L: Yi-Shao Lai - ASE
L: David Read - NIST
HB-LED Impurities and Defects
in Sapphire Wafers TFL: Luke Glinski - GT Advanced
Technologies
3DS-IC Thin Wafer
Handling TFL: Urmi Ray - Qualcomm
L: Raghunandan Chaware -
Xilinx
L: Richard Allen - NIST
Microfluidics TF
L: Mark Crockett - MEMSMART
L: Mark Tondra - Diagnostic
Biosensors
27 / 32
SEMI Taiwan Regional Standards Organization
Information & Control
CommitteeC:Robert Chien - TSMC
Environmental Health & Safety
CommitteeC: S. W. Yu - SAHTECH
C: F. M. Hsu - TSMC
Flat Panel Display Committee
C: Tzeng-Yow Lin - CMS/ITRI
C: Jia-Ming Liu - TDMDA
Photovoltaic Committee
C : B. N. Chuang - CMS/ITRI
C : J.S. Chen-TeraSolar
C : Ray Sung-UL Taiwan
ISC Taiwan Advisor
Tzeng-Yow Lin - CMS/ITRI
3DS-IC
CommitteeC: Tzu-Kun Ku - ITRI
C: Wendy Chen - King Yuan
Electronics
C: Yi-Shao Lai - ASE
28 / 32
SEMI Taiwan Information & Control and
Photovoltaic Committees
Photovoltaic Committee
C : B. N. Chuang - CMS/ITRI
C : J.S. Chen-TeraSolar
C : Ray Sung-UL Taiwan
c-Si Cell Appearance TF
L : Jeff Lee - Chroma
L: Jesse Cheng - Kinmac
PV Wafer Measurement
Method TFL : Jason Lin- Chunson
Information & Control
Committee
C: Robert Chien - TSMC
Equipment Engineering
System (EES) TFL : Ivan Chen - TSMC
L: Jack Huang - MKS
Factory Integration TF
L : MT Yeh - PSC
L: Robert Weng - TEL
L: H. S You - Energywell
Liaison - TSIA
Celia Shih - TSIA
Information & Control
Committee AdvisorThomas W.Y Chen - TSMC
PV Package Performance
TFL: I. Chou - Delsolar
L: C.C. Lin - PVGuider
L: T.C. Wu - CMS/ITRI
L: K. Ke - Gran Systems
L: K.T. Lee - King Design
Building Integrated
Photovoltaic (BIPV) TFL : T.C. Wu - CMS/ITRI
L: C.C. Lin – PVGuider
L: K.T. Lee - King Design
L: I. Chou - Delsolar
Automated Material Handling
System (AMHS) TFL :William Liu - UMC
L: Hu Szn Fan - UMC
29 / 32
SEMI Taiwan 3DS-IC & Environmental, Health & Safety
Committees
Environmental Health & Safety
CommitteeC: S. W. Yu - SAHTECH
C: F. M. Hsu - TSMC
IC Equipment Safety TF
L: Colin Shen - MXIC
L: C. C. Huang - SAHTECH
Gas and Chemical Safety
TFL: Benny Chen - AUO
L: Heng-Li Sue - SAHTECH
L: Moony Lee - UMC
Seismic TF
L: K. C. Tsai - NCREE
L: J. S. Hwang - NCREE
L: D. W. Sun - TSMC
FPD Safety Sub Committee
L: C. C. Huang - SAHTECH
Equipment Safety TF
L: Benny Chen - AUO
L: Juo Cho - AUO
L: Alice Lin - CMO
EHS Committee
AdvisorRoger Wu - UMC
Environmental
Sustainability TFL: Yu-Fong Chen - AUO
L: Tony C. H. Lu - ITRI
L: C Y Huang - TSMC
3DS-IC
CommitteeC: Tzu-Kun Ku - ITRI
C: Wendy Chen - King Yuan
Electronics
C: Yi-Shao Lai - ASE
Test TF
L: Tzong-Tsong Miau - ITRI
L: Roger Hwang - ASE
L: Sam Ko - KYEC
PV Safety
TFL: Juo Cho - AUO
L: Chwan-Der Lee - TSMC
L: Eddie Wu - Nexpower
LED Safety
TFL: Eric Lin - Epistar
Middle End Process TF
L: Arthur Chen - NTUST
L: Erh Hao Chen - ITRI
L: Jerry Yang - SEMATECH
30 / 32
SEMI Taiwan Flat Panel Display Committee
Flat Panel Display Committee
C: Tzeng-Yow Lin - CMS/ITRI
C: Jia-Ming Liu-TDMDA
Liaison TF
L: YP Lan - CMS
L: De-An Chang - DTV Taiwan
L: Nancy Chuang - TDMDA
L: Mao-Sheng Huang - CMS/ITRI
ACG TF
L: Tony Wang - CMI
L: S.P. Wang - DTC/ITRI
L: Chi-Tai Huang - Ruyico
MURA TF
L: Yueh-Yi Lai - CMS/ITRI
L: Siang Yuan Pan - AUO
L: Ji Tai Huang - Ruyico
Color Breakup TF
L: Kuei Neng Wu - CMS/ITRI
L: Ming-Lang Tai - CPT
L: Yuen-Li Lai - CMS/ITRI
LED Backlight TF
L: Carol Tien - CMS/ITRI
L: Chun-Hsiang Wen - MCL/
ITRI
L: Gaga Kuo - AUO
LCD Subcommittee
L : Yuh-Der Jiaan - CMS/ITRI
L: Kerson Wang - AUO
3D Display Metrology TF
L: Wen-Chuan Tsai - AUO
L: Jally Chen - CMO
L: Kuen Lee - EOL/ITRI
E-Paper Display TF
L: HH Cheng - AUO
L: HT Huang - DTC/ITRI
L: H. J. Tsai - CMS/ITRI
Touch Screen Panel TF
L: Yen-Wen Fang - AUO
L: S.Y. Chou - CMS/ITRI
3D Display Gray-to-Gray
Cross-Talk TFL: Tony Wang - CMI
L: YT Chen - CPT
L: Kevin Chen - AUO
31 / 32
SEMI China Regional Standards Organization
Photovoltaic Committee
C: Guangchun Zhang -
CanadiaSolar
C: Jun Liu - China Electronics
Standardization Institute
PV Crystalline Silicon
Module TF
L: Wei Zhou - Trina Solar
L: Qiang Huang - Trina Solar
L: Cheng Zhu - Suntech
L: Binglin Lu - ISTA-China
PV Silicon Wafer TF
L: Yuepeng Wan - LDK
L: Xiaoyong Wang - JAsolar
L: Jingang Lu - Suntech
Metal Paste for Crystalline
Silicon Solar Cells TFL: Rulong Chen - Suntech
L: Weiming Zhang - Heraeus
L: Mao Wang - DuPont
L: Shan Xu - Rutech
PV Diffusion Furnace Test
Methods TFL: Liangyu Liu - CETC-48th
L: Xianwu Cai - CETC-48th
L: Yu Si - Sevenstar
Polysilicon Packaging
Materials TFL: Lv Jinbiao - GCL Poly
L: Liu Xiaoxia - GCL
L: Binglin Lu - ISTA-China
Anti-Reflective Coated
Glass TF
L: Xiaogang Zhu - CPVT
L: Bing Yin - Suntech
Thin Film Silicon PV
Module TFL: Yaohua Mai - Baoding
Tianwei Solarfilms
L: Xinwei Niu - Chint Solar
L: Zhenyu Wu - Hanergy
PV Silicon Raw Materials
TF
L: Yan Dazhou - SINOSICO
L: Xiaoxia Liu - GCL
L: Dongxu Chu - SINOSICO
L: He Li - CPVT
32 / 32