ENG WBM-2100-032-N1-(Sylarus #966)-2011.05.17.doc
Wafer Beveling Machine
特許申) 4-cassette Specification
Delivery Specification
Ver.1 May 17, 2011
Sylarus Technologies
Approved Checked Created
Distributed by Daito Electron Co., Ltd.
6, Kojimachi 3-chome, Chiyoda-Ku, Tokyo 102-8730 JAPAN
TEL +81(3)3264-0211 FAX +81(3)3221-7509
Manufacturer Daito Electron Co., Ltd. EM Business Department
Machida Techno-Park Oyamagaoka, 2-2-5-6 Machida-shi, Tokyo 194-0215
TEL +81 (42)798-5161 FAX +81(42)798-5160
MODEL WBM-2100
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【1】 Product Name
WAFER BEVELING MACHINE
MODEL: WBM-2100
【2】 Purpose
This numerically controlled machine chamfers circumference and edge of a wafer with high precision.
【3】 Grinding Unit Configuration and Working Principle
A. Circumference Grinding The machine chamfers as-sliced wafers with a metal bonded form wheel (200 mm). The section marked (1) in the figure below will be removed from the wafer.
B. Notch grinding The machine chamfers a wafer notch with a small-diameter metal bonded grinding wheel (groove diameter of 1.8mm).
ウェーハ ①
横型砥石Horizontal Wheel
Wafer
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【4】 Modifications beyond Existing Daitron Beveling Machines
(1) Footprint Comparing the machine with the existing single-axis DEP-200 (2C-S-2C) which measures 2,100 (W) x 1,045 (D) x 1,900 (H), the size of the model WBM-2100 has been reduced as shown in the table below. WBM-2100 (4C-R-4C, main unit only (excluding the operation box) measures 1,200 (W) x 1,300 (D) x 2,150 (H).) Refer to drawing 3B60191 at the end of this document. Comparison with single-axis machine
W [mm] D [mm] H [mm] Area ratio [%] DEP-200 2,100 1,045 1,900 100 WBM-210 800 1,200 2,162 43.7 WBM-2100 1,200 1,300 2,150 71.1
(2) Sturdy Grinding Unit
The entire frame of the machine is made of a single iron-cast structure to minimize wheel vibration during the grinding operation, thereby reducing wafer damage and chipping.
(3) Improved OF linearity
By immobilizing the spindle-side and structuring the Y, θ and Z axes for the wafer-side, rigidity of the spindle side and OF linear precision have both been improved. The drive section has been designed to facilitate maintenance.
(4) Shorter wafer replacement time
Wafer replacement can be done at a rate of 20 sec/2 wafers. The major modification has been to change the stepping motor that had been used for the grinding Y and Z axes to an AC servo motor, which improves replacement speed. Besides, air cylinders which have been used in the transfer system were replaced by electric cylinders.
(5) Wafer Edge Non-contact Alignment Unit
The use of a non-contact method for aligning the wafer edge accommodates wafers that are easily breakable. This as well as improvements made in alignment precision serve to increase yields.
(6) Wafer Size Changes
The alignment method referred to above allows the machine to accept wafers of different sizes by replacing the grinding table, and changing the coolant nozzle position, the alignment sensor position and the recipe. This reduces the amount of down time when changing the wafer size.
(7) Applicable Wafer Sizes
The machine accommodates a wide range of sizes: 4” and 6”
(8) Thickness Measuring Unit Contact type. Capable of single-point measurement at wafer center. Since the grinding table and wafer thickness differential corresponds to the amount of wheel chamfering, it has been possible to improve surface width.
(9) Transfer System
The circular belt transport has been overhauled so that all transport is now performed by vacuum suction, minimizing wafer contamination.
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(10) Linear Guide
The linear guide used in the grinding unit is now an oil-free design that enables long-term, maintenance-free operation.
(11) Improved Wheel Specifications and Maintenance
The 200 mm circumference grinding wheel with standard thickness of 20 mm allows multiple grooves to be added. The spindle position has been moved to the left front of the machine, making replacement work easier and improving maintenance performance. By attaching an air spindle for notch grinding, a wafer notch can be chamfered.
(12) Water Splash Prevention
Bellows-type shutters are located in the grinding unit to prevent water from splashing while wafer grinding is in progress.
(13) Wafer Clean & Dry unit
Simple cleaning and drying of a single side of a wafer
(14) Operation Box The commercial 15-inch LCD touch panel makes processes easier to operate and adjust. Refer to the exterior view diagram at the end of this document.
(15) Setting Up Grinding Conditions
Specific grinding conditions can be entered as digital settings. The range of programmable conditions includes wafer diameter, OF conditions (number of OFs, length, corner R, and θ orientation), number of grinding cycles, grinding speed, grinding width, and grinding wheel position.
(16) Display Unit
Flow rate and pressure (normal/back pressure) metrics are all displayed on the LCD panel for better visibility when checking gauge readings.
(17) Automatic Measurement Function
The machine provides a function for automatically taking thickness measurement, centering and grinding the wafer placed in the wafer tray (1 slot at the machine’s left side). This eliminates the need to insert the wafer into a cassette for performing the measurements and adjustments described above.
(18) Wafer diameter measurement feature The machine measures diameter of a chamfered wafer. (OK/NG quality judgment, measured data
save) (19) Reduced Wiring I/O System
All on/off signals are communicated through a 2-cable wiring system. This results in fewer wires and connectors than in existing I/O wiring, and also simplifies the system since DC power lines and signal lines are connected to a common terminal location. As on the PLC, LEDs are provided for verifying the on/off status of the machine.
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【5】 Specifications № Item Specification Std. OP Remarks
1 Wafer size φ4″,φ6″ OF φ4″,φ6″
2 Wafer crystal axis shape V-notch φ4″,φ6″ Ge
3 Material Glass 300μm-1,000μm
4 Wafer thickness At least 250μm
No. of cassettes 4 cassettes Upper/lower 2 slots x 2
Cassette guide Designed based on customer’s specifications
Setup per cassette Setup of cassette to be used
Can specify 2C-2C or 4C supply/storage cassette
Slot pitch 4.76 mm, 6.35 mm, etc. Parameter setup availableCassette specification No. of slots Max 25 slots Parameter setup available
Drive method Electric cylinder θ axis
Effective angle 250° Drive method Stepping motor R axis
Retracting axis Effective stroke 330mm
Drive method Electric cylinder Z axis
Effective stroke 590mm
5 Center Arm Unit
Wafer retention method Bottom surface suction instrument Linear gauge Pressure 40g or less Resolution 1μm Repeatability ±1μm
Thickness measurement device
No. of meas. points
Single point at center
6 Thickness Measuring Unit
Contact type 1 center-point
Drive method Air cylinder
Alignment method Wafer edge, non contact method
Utilizes the Fine Alignment Unit Capable of OF & IF detection Bottom surface suction
Alignment device Line CCD sensor
Resolution 1 µm
Alignment precision± 30 µm or less (for edge non-contact)
Wafer eccentricity May not conform to spec, depending on actual wafer edge. Some transparent wafers may not be detectable.
Alignment Method
Wafer size change By changing the sensor position
Manual
Drive Electric cylinder Stroke 660mm X axis Resolution 1μm Drive Electric cylinder
Stroke 210mm
7 Alignment Unit
Supply Transfer Unit
Z axis Resolution 5μm
When using WBM-2100
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Wafer transfer method
Directly transferred to the grinding table after fine alignment
Wafer upper surface suction
Drive method AC servo motor Drive range 360°
Alignment θ axis
Resolution 0.001° (360° / 360,000 )
No. of grinding axes 1 axis When using WBM-2100 Drive method AC servo motor Control resolution 0.036° (360° / 100,000 ) Repeat precision ± 1 min.
θ axis
Horizontal runout 10 µm or less Drive method AC servo motor Stroke 185 mm Control resolution 1 µm (2 mm/2,000)
Y axis
Repeat precision ± 2.5 µm Drive method AC servo motor Stroke 50mm Control resolution 0.1 µm (5 mm/50,000)
Z axis
Repeat precision ± 3 µm
For vertical movement
Method Bellows type full cover Drive method Air cylinder
Grinding fluid splash protection Function
With grinding table wash function
Using air & water Can set number of spins
Circum. Output near wheel Change coolant nozzle position when switching wafer size. Coolant nozzle
Notch Output from back of wheel
8 Grinding Unit (Wafer side)
Drain pot Auto drain feature For the grinding table vacuum line
9 Number of grinding axes 1 axis When using WBM-2100
Drive method Motor built-in spindle Inverter motor
Spindle taper runout 2 µm or less
Spindle bearings Angular ball bearings
Spindle lubrication Grease injection
Spindle max. rpm 5,000 rpm When using 200 mm wheel
Max. wheel periphery speed
2,500 m/min or greater
When using 200 mm wheel Max 7-speed Fixed setting
Mountable wheel specifications
φ200mm t=20mm IDφ30mm SUS
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Edge spindle specification High-speed φ200mm
Wheel mounting nut t=20mm Domed cap nut (1) included
Drive Air turbine
Spindle circum. runout 10μm
Wheel mount method Collet chuck method
Max. spindle rpm 80,000rpm
Max. wheel periphery speed
450m/min When using 1.8mm wheel
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Grinding Unit (Wheel side)
Notch spindle specifications
Mountable wheel specifications
O.D.φ4.2mm±0.1mm I.D.φ1.8mm t=13mm
Mounting axis diameter 3mm
For 1 axis (1 each) When using WBM-2100 12 Grinding table
φ4″ Black ceramic coating
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φ6″ Black ceramic coating Drive method Electric cylinder
X axis Effective stroke
340mm
Drive method Electric cylinder Z axis Effective
stroke 100mm
When using WBM-2100 13 Waste Transfer Unit
Wafer retention method Upper surface suction
Wash nozzle Top surface Washer dryer unit (Single side, simple washing & drying)
Dry nozzle Top and bottom surfaces
θ axis AC servo motor 1,500rpm 14 Washer dryer unit
Wafer retention method Suction to lower surface of wafer
Vacuum suction table for 4” and 6” wafers
Black ceramic coating
Control PC control Grinding unit positioning control method
Screen display 15-inch LCD panel
Input Touch panel Windows screen
Unit Digital setting
Grinding conditions User defined settings
Ground wafer count Counter
15 Electrical box (Control box located in upper part of machine)
Function Saving recipe, machine data USB
Grinding conditions setup
50 programs
No. of grinding cycles
1 - 8 (passes)
No. of OFs 0 - 8 (8 places)
OF length 0 – 60 mm
OF angle -359.999 – +359.999
Corner R 0.01 - 50.00 mm
Grinding speed 1 - 100mm/sec
Wafer diameter According to spindle specification
No. of wheel slots TBD
Wheel periphery speed
According to spindle specification
Notch depth 0.5 - 1.3mm
Notch angle 55° - 125°
Notch bottom R 0.9 - 2.5 mm
16 Setup for wafer grinding conditions
Notch shoulder R 0.01 - 9.99 mm
17 Signal lamp (with buzzer, adjustable (manual) sound volume)
3-color Note 1
18 Safety cover Full cover With interlock φ4″ - - Supplied by the customer
19 Master wafer φ6″ - - Supplied by the customer
20 Vacuum suction specification CONVUM specification
Drop in source pressure
Spindle air turbine for notch rough grinding
21 Pressure display (normal/back pressure)
Spindle air bearing for notch rough grinding
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For center arm vacuum
For alignment table vacuum
For supply transfer vacuum
For grinding table suction vacuum
For waste transfer vacuum
For wash/dry table vacuum
For edge grinding coolant
For built-in spindle cooling water
For notch grinding coolant
22 Flow display
Wash water for washer/dryer
Auto thickness measurement
Auto centering measurement 23 Single wafer grinding and automatic measurement functions
Single wafer grinding
1 wafer stage
Normal grinding mode 24 Grinding method Normal grinding
Spiral grinding Diameter meas. before grinding Utilizes the alignment sensor
25 Measurement function Diameter meas. after grinding Utilizes the alignment sensor
26 International standards compliance None 27 Display language English 28 Air gun, water gun, standard tools 1 each (supplied)
29 Cassette For each wafer size - -
Supplied by the customerIf cassettes are not supplied, the machine will perform single-wafer grinding.
30 Grinding wheel (for edge) φ200mm t=20mm SUS - - Supplied by the user
31 Grinding wheel (for notch) ODφ4.2mm±0.1mm φ1.8mm t=13mm Shaft to be attached: φ3mm
Supplied by the user
Wafer vacuum arm x 1 For center arm 32 Included consumables
Vacuum pad x 3 For waste transfer arm
Options listed above may not be available depending on the combination. Detailed specifications will be determined through
consultation.
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Note 1) Signal lamp status specification (Daitron standard specification) Status definitions
Machine status is divided into the following eight categories: Standby; Maintenance; Auto run; Some cassette end; All
cassette end; Ending; and Error (Warning, Alarm, Emergency), and Warm up.
● Standby
Machine is ready for operation, but there is no activity and no other status is active.
● Maintenance
Maintenance operation from the maintenance screen is in progress.
● Auto run
At least one unit in the machine is running in auto mode and is not in one of the following states.
● Some cassette end
At least one part of the machine is running in auto operation, and at least one cassette is empty or full. In this state,
the operator can switch out a cassette.
● All cassette end
At least one part of the machine is running in auto operation, and all cassettes are full or empty. In this state, auto
operation cannot continue unless the operator either supplies wafers or transfers them.
● Ending
The Stop PBS is pressed during process, and the process is stopped. (All wafers are unloaded before the process is
stopped.)
● Error
An error was detected in an operating part of the machine, and operator involvement is required in order for operation
to continue. When an error occurs, this overrides all of the other states described above.
● Warm up
The grinding unit only or a whole machine is warming up.
Status Indicators
The status display can be changed using the screen below.
* Modification of any of the foregoing shall be worked out through consultation.
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【6】 Grinding Conditions
Confirmation Items: The customer is requested to fill in the blank spaces below with the figures that are being specified.
Incoming Wafers Wafer size [inch] φ4 φ6 Diameter [mm] 100.06±0.05 100.06±0.05 OF length [mm] 31.5±2.0 44.0±2.0 IF length [mm] - -
IF angle relative to OF (clockwise) [ ] - -
Wafer thickness [μm] 260±10 320±10
Processed Wafers Wafer size [inch] φ4 φ6 Diameter [mm] 100.0±0.05 100.0±0.05 OF length [mm] 32.0±1.0 45.0±1.0 IF length [mm] - -
IF angle relative to OF(clockwise) [ ]
- -
【7】 Grinding Precision
Inspection Item Inspection Standard Measurement Instrument Grinding chamfer width precision (Circum., notch)
±40 µm (lapped wafer with 22 chamfering angle)
Edge profiler or microscope
Crystal axis precision
10 min. or less X-ray measuring device or chamfer width measurement after processing
OF linearity 10 µm/57.5 mm Normal grinding
Diameter precision
± 20 µm or less Grinding precision of at least the alignment precision is required to ensure this amount of precision at the wafer diameter. For elliptical incoming wafers, grinding amount must be increased further, in excess of the elliptical dimensions.
Digital calipers
Notch depth precision ± 20 µm or less Edge profiler Notch angle precision ± 0.5° or less Edge profiler Notch bottom R precision ± 0.1 mm Edge profiler Roughness To be determined through discussion To be determined.
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【8】 Production Time
● Wafer change time: At least 20sec- (may be longer depending on the setting for wash/dry time)
● Wafer grinding time is determined by the wafer periphery speed.
Wafer diameter x Wafer grinding time =
Wafer periphery speed+ Wheel movement time
● Cycle time Since loading and unloading are performed during grinding, cycle time is expressed as follows: Cycle time = Grinding time + wafer exchange time
【9】 Wafer Grinding Flow Chart
Cassette loading ・・・ Supply wafers from four cassettes
Wafer loading ・・・ Transport via center arm
Wafer Thickness Measurement
・・・ Wafer thickness measurement
(Contact, Center-point)
Fine alignment ・・・ Fine alignment (edge non-contact)
Wafer diameter measurement (edge non-contact)
Grinding ・・・ Edge grinding (form wheel)
Notch grinding
Wafer Clean & Dry ・・・ Simple washing & drying
Wafer Diameter Measurement
・・・ Diameter measurement
(edge non-contact)
Wafer Transfer ・・・ Transport via center arm
Unloading to cassette ・・・ Storage into four cassettes
(returned to the same slot of the same cassette)
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【10】 General Specifications
1. Size 1,200 (W) x 1,300 (D) x 2,150 (H) mm
(excluding signal tower and operation box)
Exterior View Diagram (DWG. No. 3B60191) is attached. 2. Weight 1,700 kg
Power voltage 3-phase 4-wire, AC460V (power source terminal with cover) Breaker 50A frame for machine’s main power supply;
20A earth leakage circuit breaker 3. Power consumption Rated power consumption: approx. 5 kVA The following specifications are for one axis. 4. Grinding water(pure water) supply
・ Supply pressure 0.2MPa (2.0kgf/cm2) ・ Volume consumed 3L/min ・ Temperature 20C°±2C° (No temperature fluctuations. Processing precision may be
impacted if fluctuation occurs.) ・ Coupling O.D.φ12mm, I.D.φ9mm Nylon tube ・ Connection Rear View Drawing-a
5. Build-in spindle cooling water (Supply) ・ Supply pressure 0.2MPa (2.0 kgf/cm2) ・ Volume consumed 2L/min ・ Temperature Within -5 °C of ambient temperature (no temperature fluctuations) ・ Coupling O.D.φ10mm, I.D.φ6.5mm Urethane tube ・ Connection Rear View Drawing-b
6. Build-in spindle cooling water (Drain to the factory) ・ Connection O.D.φ10mm, I.D.φ6.5mm Urethane tube ・ Connection Rear View Drawing-c
7. Washing water (Supply) ・ Supply pressure 0.2MPa (2.0 kgf/cm2) ・ Volume consumed 1.5L/min ・ Temperature Within -5 °C of ambient temperature (no temperature fluctuations) ・ Coupling O.D.φ12mm, I.D.φ9mm Nylon tube ・ Connection location Rear View Drawing-d
8. Main Air (Supply) ・ Supply pressure 0.55MPa (5.6 kgf/cm2) ・ Volume consumed 595NL/min ・ Coupling O.D.φ16mm, I.D.φ10mm Urethane tube ・ Connection location Rear View Drawing-e
9. Notch spindle air supply ・ Supply pressure 0.55MPa (5.6 kgf/cm2) ・ Volume consumed 160NL/min ・ Coupling O.D.φ12mm, I.D.φ8mm Urethane tube ・ Connection location Rear View Drawing-f
10. Grinding table vacuum generator (Exhaust) ・ Connection O.D.φ12mm, I.D.φ8mm Urethane tube ・ Connection location Rear View Drawing-g
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11. Washing table vacuum generator (Exhaust) ・ Connection O.D.φ12mm, I.D.φ8mm Urethane tube ・ Connection location Rear View Drawing-h
12. Waste transfer arm vacuum generator (Exhaust) ・ Connection O.D.φ12mm, I.D.φ8mm Urethane tube ・ Connection location Rear View Drawing-i
13. Grinding unit & Washing unit (Exhaust) ・ Exhaust volume 1m3/min or more ・ Port diameter VP75 PVC pipe (O.D. 89mm, I.D.77mm) ・ Connection location Rear View Drawing-j
14. Water discharge ・ Connection Hose (O.D.φ62mm, I.D.φ50mm) ・ Connection location Rear View Drawing-k
15. Vacuum source Vacuum generator specification 16. Painting color R4-383 (Daitron standard color); Japan Paint Manufacturers Assoc. (JPMA) 17. Operating environment
・ Temperature 23 C°±2 C°(no daily fluctuations) ・ Humidity 80% or less Note: Depending on the relationship between ambient temperature and humidity, condensation
may still form even if temperature remains within the range given above. Therefore, be advised to maintain a temperature differential of 5C or less between ambient temperature and grinding water
【11】 Warranty Period
For the period of one year after the final inspection at the time of delivery, a malfunction in performance or operation clearly deriving from a defect in the Manufacture’s design or manufacturing shall be repaired at no cost. In regard to software, there may be instances in which a charge will be applied on problems identified after the free warranty period has elapsed.
【12】 Warranty Range
If, during the warranty period described above, a malfunction occurs in the course of normal usage of the product that was in accordance with this operator’s manual, the defective part of such mechanism shall be replaced or repaired at no cost. The following shall be excluded from the warranty range.
(a) Careless handling or erroneous operation by the user (1) Usage that does not conform to the operator’s manual (2) Handling under environmental conditions exceeding the specifications
(b) Cause of the malfunction is due to the fault of someone other than the vendor (c) Modifications or repairs were made by someone other than the vendor (d) Natural or other disasters over which the vendor has no control
【13】 Acceptance Conditions
This machine shall be confirmed and tested on items specified in advance by the customer by Daito Electron Co., Ltd.; EM Business Division at its Machida Factory (initial pre-delivery acceptance inspection) and at the customer’s factory (secondary on-site acceptance inspection) where the same specified items
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shall be confirmed and tested at the customer’s factory for the second and final acceptance. The inspection will be completed at the point when the customer’s representative has confirmed continuous machine operation. Basic conditions for acceptance inspections
(1) These specifications must be fulfilled. (2) There must be no errors throughout continuous loading of 100 wafers. (3) When quality checking 25 processed wafers, all must be within processing tolerances.
【14】 Other
For items not established in these specifications, details shall be worked out through consultations. Changes made by mutual consent shall be submitted as revised specifications. Where no mention is made, Daitron specifications shall apply.
【15】 Additional Notes
Specifications concerning regulations In the event that laws or requirements for specific facilities apply, the machinery and devices described in these specifications shall satisfy the standards established thereby. Examples are the Pollution Prevention Act, Factory Location Law, City Planning Law, Building Standard Law, Electricity Enterprises Law, Occupational Health and Safety Law, Factory Regulations, High Press Gas Safety Law, Poisonous and Deleterious Substance Control Law, Fire Prevention Law, and administrative notices issued by construction-related government agencies.
【16】 Documents to be Submitted (two copies each, regular paper)
1. Final Specifications 2. Inspection Results 3. Operator’s Manual 4. List of Component Parts 5. Consumable Parts List 6. Maintenance Manual 7. Electrical Diagram 8. Parts Manual (Catalogue)
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【17】 Exterior View 1 (4 cassette specification)
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【18】 Grinding table approval drawing