WBS 5 - Forward Pixels

US CMS DOE/NSF Review: May 8-10, 2001 1

WBS 5 - Forward Pixels

Bruno Gobbi

DOE/NSF Review

May 8, 2001

WBS 5 - Forward PixelsWBS 5 - Forward PixelsWBS 5 - Forward PixelsWBS 5 - Forward Pixels


OutlineOutlineOutlineOutline

• Status of the US CMS Pixel project

• System overview

• Accomplishments of last year’s goals

• Status and technical progress

• Scope change and contingency use since

last review

• Committee concerns and issues

• Plans for the next six months

• Summary and conclusions


The FPix project is nearing the completion of a 3 year R&D phase. All the major components have now been defined, allowing for a more realistic estimate of cost and schedule.

The project is now shifting into prototyping of components, carrying out system tests, and studying how to assemble the detector. The installation date has been delayed by one year (to April 06), permitting us to start the final assembly in ‘04 rather than ‘03.

Status of the Forward PixelStatus of the Forward PixelStatus of the Forward PixelStatus of the Forward Pixel


FPix System OverviewFPix System Overview

Barrel

CMS Pixel Detector

FPix Disks

EuropeanGroup

Responsibility of US CMS

Service Cylinder

Space Cylinder

FPix Full Size Model of 1/2-Disk 2.4m

Power, Cooling, Optical Fibers

FPix:• US delivers 4 ‘disks’ (“stand alone” system)

• No changes in scope since last year

Disks’ Mechanics

IR

FPIX System OverviewFPIX System OverviewFPIX System OverviewFPIX System Overview


Blade Butterfly

HDI

Plaquette

SensorsROC

VHDI

Si Plate

FPix Scope and DeliverablesFPix Scope and Deliverables

FECVMEBoard

Token Bit Manager

Comm. Network Hub

NEW

FPIX Scope and DeliverablesFPIX Scope and DeliverablesFPIX Scope and DeliverablesFPIX Scope and Deliverables


Last YearGoals and Accomplishments

Last YearLast YearPlans and AccomplishmentsPlans and Accomplishments

Last YearLast YearPlans and AccomplishmentsPlans and Accomplishments

• Beam test: Carried out.

• Prototype TBM/CNH, HDI, and FEC: TBM/CNH, and FEC being tested (FPGA), HDI is now two components a Very-HDI (first prototype) and the HDI

• Submission of second prototype sensors: In progress

• Submission of Multiple Chips Placement: Parts just returned. Good results.

• Procure first 1/2-Disk made of Be: Delayed by lack of engineers. Effort is resuming now.


FPix Technical Progress in FPix Technical Progress in FY01FY01

FPix Technical Progress in FPix Technical Progress in FY01FY01

• Preparing for a new Sensor Submission

• Bump Bonding submission for multiple chips being evaluated

• First Prototypes of the TBM and FEC

• First prototype of VHDI

• Started tooling for assembly of detectors

• Results from Test Beam at CERN


1.E-07

1.E-06

1.E-05

1.E-04

1.E-03

0 100 200 300 400 500Reverse Bias (V)

Lea

kag

e C

urr

en t

(A) Pixel Current

Guard Ring Current

After = 1x1014 p/cm2

increase in current after 300V(2-8)% noisy channels (PSI)With = 6x1014 p/cm2

same I with pixels at -100C

FPix. Sensors, 1st Subm.

Guard Ring: Design hold 1000V. Very good!

p-Stop: double open ring. OK but no safety margin

Before irradiation90% of pixels have Vbrkdwn >300V

FPIX Sensors - First SubmissionFPIX Sensors - First SubmissionFPIX Sensors - First SubmissionFPIX Sensors - First Submission


Conclusions (first submission):

• Baseline design is adequate for CMS! - Would like to understand and correct the increase in current for irradiated sensors - the cause of 10% noisy channels (test PSI)

FPix. Sensor 2nd SubmissionFPix. Sensor 2nd Submission

Second submission

• Is in preparation. Goals:- finalize the two-double ring p-stop design - produce sensors to test the FPix readout

FPIX Sensor - Second SubmissionFPIX Sensor - Second SubmissionFPIX Sensor - Second SubmissionFPIX Sensor - Second Submission


FPix, Bump BondingFPix, Bump Bonding

D;/cms/Lehman/Lehman 2001/Presentations/Plenary Presentations\Bump-Bonding..ppt

• Bump bonding with industry

• Single Chip Placement

• status: parts returned.

• submission with MCNC for bump bonding (Blank Chips) for all the sensors required for 3 Blades [135 ROC, 21 sensors of 5 different sizes, SnPb]

• In house bump bonding

• at UCD (In) for R&D detectors and read-out electronics

• yield per bump 0.9998 0.0001

FPIX - Bump BondingFPIX - Bump BondingFPIX - Bump BondingFPIX - Bump Bonding


Z, B

X

Y

20o

Row

Beam

}

Double Column

Charge Sharing

Pixels150 x150 m2

D:\LHM\2001\Presentations\Plenary Presentations\For Dan \Geometry Pixels.ppt 8mm

ROC, PSI36:11 double columns x 30 rows

Vienna Repeater

FPix. Test Beam at CERNFPIX - Test Beam at CERNFPIX - Test Beam at CERNFPIX - Test Beam at CERNFPIX - Test Beam at CERN


150 m

= 14 mover pixel

Pixels at 20o to beam

150 m / 12 = 43 m

FPix. CERN’s Test Results

= 46 mover pixel

Charge sharing vs position

Charge sharing vs position

Pixels normal to beam

150 m

D:\LHM\2001\Presentations\Plenary Presentations\For Dan \Cern Test Result.ppt

CERN Test ResultsCERN Test ResultsCERN Test ResultsCERN Test Results


FPix, Readout ElectronicsFPix, Readout Electronics

Front End Controller, FECSingle Channel Prototype

FPGAToken Bit Manger, TBM

and Control Network Hub

FEDDetetor

FPIX Readout ElectronicsFPIX Readout ElectronicsFPIX Readout ElectronicsFPIX Readout Electronics


Very Hight Densityes. Interc.Very Hight Densityes. Interc.

VHDI for Row of 5 ROCs

Test Station

Very High Density InterconnectVery High Density InterconnectVery High Density InterconnectVery High Density Interconnect


FPix, R&D Assembly. SiDetFPix, R&D Assembly. SiDet

Assembly of Detectors;NIKON measurementstation. Need 672 units

Assembly of Butterflies;OMIS II measurementstation. Need 96 units

FPIX - R&D Assembly - SiDetFPIX - R&D Assembly - SiDetFPIX - R&D Assembly - SiDetFPIX - R&D Assembly - SiDet


FPix, R&D SurveyFPix, R&D Survey

Survey BladesZeiss 500 measurement station.Need 8 units (1/2-Disk)

Components

FPIX R&D - SurveyFPIX R&D - SurveyFPIX R&D - SurveyFPIX R&D - Survey


US CMS FPIXUS CMS FPIXBCWS, BCWP & ACWPBCWS, BCWP & ACWP

US CMS FPIXUS CMS FPIXBCWS, BCWP & ACWPBCWS, BCWP & ACWP

$0

$500

$1,000

$1,500

$2,000

$2,500

AY

K$ BCWS (K$)

BCWP (K$)

ACWP (K$)

W. Scheduled

W. Performed

ACW. Performed


FPIX - BCWS ProfileFPIX - BCWS ProfileFPIX - BCWS ProfileFPIX - BCWS Profile

FPIX BCWS by Fiscal Year

0

500,000

1,000,000

1,500,000

2,000,000

2,500,000

FY96 FY97 FY98 FY99 FY00 FY01 FY02 FY03 FY04 FY05 FY06

W. Scheduled vs. Year


US CMS FPIXUS CMS FPIXSch. & Cost PerformanceSch. & Cost Performance

US CMS FPIXUS CMS FPIXSch. & Cost PerformanceSch. & Cost Performance

0.50

0.60

0.70

0.80

0.90

1.00

1.10

1.20

BCWP/BCWS

ACWP/BCWP

Scheduled Performance

Cost Performance


US CMS FPIX US CMS FPIX (% Comp., Cont. Use)(% Comp., Cont. Use)US CMS FPIX US CMS FPIX (% Comp., Cont. Use)(% Comp., Cont. Use)

0.000

0.100

0.200

0.300

0.400

0.500

0.600

BCWP/EAC

(EAC-Base)/Base(Contingency Use)

% W. Completed

% Cont. Use


FPIX - ETCFPIX - ETCFPIX - ETCFPIX - ETC

FPIX - ETC 5.6 AYM$

EDIA (k$)

M&S (k$)

Mfg Labor (k$)

EDIA

Mfg

M&S


SOW 01 - FPIXSOW 01 - FPIXSOW 01 - FPIXSOW 01 - FPIX

FPIX SOWs FY01 -- $.36M

University of California-Davis

Fermilab

Johns Hopkins University

University of Mississippi

Northwestern University

Purdue University

Rutgers University

Fnal

Rutgers

Purdue


US CMS FPIXUS CMS FPIXL2 & L3 Milestone PerformanceL2 & L3 Milestone Performance

US CMS FPIXUS CMS FPIXL2 & L3 Milestone PerformanceL2 & L3 Milestone Performance


FPix Critical Path

PanelsDisks

Space Cylinders

VHDI & HDI

SensorsReadout Chip

Bump Bonding

Assembly PlaquettesAssembly Butterflies

Assembly 1/2-DisksInstall Disks in 1/2-Cyl.

Shipment to LHCCommissioning completed


Critical Path AnalysisCritical Path AnalysisCritical Path AnalysisCritical Path AnalysisCritical Path Analysis

• The read-out chip development sets the critical path. [responsibility of PSI]

• Development of the TBM, VHDI and HDI depends on the design of the ROC.

• Bump Bonding is the next most critical task.


Last Review ConcernsLast Review ConcernsLast Review ConcernsLast Review Concerns

Concerns from last time have been addressed:

• Increase engineering support for HDI, (VHDI). Done

• Update the near term plan with specific milestones. Done

• Devote manpower immediately to the evaluation /of a new preproduction of sensors. Done

• Increase manpower on bump-bonding task.

Request was made to the funding agencies but it

has not been awarded yet.


Issues

• Additional manpower for bump bonding remains a pressing issue.

• Mechanical engineering must be made available (from US CMS) now to prevent this task from becoming a critical one.

IssuesIssuesIssuesIssues


What we plan for the next 6 monthsWhat we plan for the next 6 monthsWhat we plan for the next 6 monthsWhat we plan for the next 6 months

• Submission of second prototype sensors

• Testing of the first prototype TBM/CNH and FEC (FPGA), … then with FED and new sensors with final chip in Dmill

• Layout of VHDI and HDI

• Continue tooling for the assembly

• Procure prototypes PSS for 1/2-Disk


Summary and Conclusions

• FPix effort is now moving from R&D to prototyping.

• Results from a test beam at CERN confirm the expected position resolution.

• Evaluation of first sensor’s submissions completed. Second submission is being prepared.

• A submissions for bump bonding of blank multiple chips is being evaluated and gives promising results.

• Submission TBM/CNH chip to take place this month.

• Testing of prototypes TBM and FEC (FPGA) … has started; will allow a Full System test (sensors, ROC, FED, OL, ...)

Summary and ConclusionsSummary and ConclusionsSummary and ConclusionsSummary and Conclusions

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WBS 5 - Forward Pixels

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