Webinar: HDI 2 –Perfection in HDI
Optimal use of the HDI technology
Würth Elektronik Circuit Board Technology
www.we-online.de Seite 1 04.09.2013
Agenda
Overview Webinar HDI 1
Route out a BGA
Costs
Roadmap – HDI 2.0
Lasercavity
www.we-online.de Seite 2 04.09.2013
Agenda
Overview Webinar HDI 1
Route out a BGA
Costs
Roadmap – HDI 2.0
Lasercavity
www.we-online.de Seite 3 04.09.2013
www.we-online.de Seite 4 04.09.2013
Overview
HDI
• High Density Interconnection
Microvia
• Smallest, laser drilled holes
Buried Via
• Buried drills on the inner layers
Pitch
• Middle of a pad to the middle of a pad
www.we-online.de Seite 5 04.09.2013
Overview - Why Microvia technology?
t
h
h
Basic material CTEz
Copper thickness t
Aspect Ratio AR= h /
IPC-2221/2122
TCT i.d.R -45° / + 125° C
Solder process
Expand! 0 10 20 30 40 50 60 70
25 50 75 100 125 150 175 200 225 250 T [°C]
Expand Z
-axis
[µ
m]
Standard-FR4 Z-Achse Cu
Overview - Technologys
www.we-online.de Seite 6 04.09.2013
Standard Microvia
Staggered Microvias
Stacked Microvias
Microvia on Buried
Via
Agenda
Overview Webinar HDI 1
Route out a BGA
Costs
Roadmap – HDI 2.0
Lasercavity
www.we-online.de Seite 7 04.09.2013
Intel Atom
Pitch 0.593 diagonal
Pad 325 µm / Trace 89 µm / Spacing 90 µm
www.we-online.de Seite 8 11.06.2013
Rout out BGA – 0,650 mm Pitch
www.we-online.de Seite 9 11.06.2013
Route out BGA – 0,500 mm Pitch
www.we-online.de Seite 10 11.06.2013
Route out BGA – 0,500 mm Pitch
Large solderpads
No fine line structures on the outer layers
+ No routing on the outer layers
-
www.we-online.de Seite 11 11.06.2013
Route out BGA – 0,500 mm Pitch
www.we-online.de Seite 12 11.06.2013
Route out BGA – 0,500 mm Pitch
Planar surface
+ Small solderpads
No routing on the outer layer
-
www.we-online.de Seite 13 11.06.2013
Route out BGA – 0,500 mm Pitch
www.we-online.de Seite 14 11.06.2013
Route out BGA – 0,500 mm Pitch
Routing on the outer layers
Normally one µVia layer could be saved
+ Fine line structures on the outer layer, small soldermask clearence
High production effort
-
www.we-online.de Seite 15 11.06.2013
Route out BGA – 0,400 mm Pitch
BGA Pad: 275 µm
µVia Pad inner layer: 300 µm
Trace width / spacing
Outer layer : 100 µm
Inner layer: 100 µm
Soldermask clearence: 35 µm
NSMD!!
- No trace between the pads
- Each row in the BGA needs an extra
µVia layer.
Agenda
Overview Webinar HDI 1
Route out a BGA
Costs
Roadmap – HDI 2.0
Lasercavity
www.we-online.de Seite 16 04.09.2013
www.we-online.de Seite 17 04.09.2013
Costs
Pcb dimensions
Amount of layers
> could be essential if a product is succesful!
We will have a…
04.09.2013 www.we-online.de Page 18
Why no plated through hole vias should be used,
if a complex HDI stackup is given?
www.we-online.de Seite 19 04.09.2013
Costs
PTH Microvia
How many signal layers are needed?
www.we-online.de Seite 20 11.06.2013
Complexity
Costs
1 + 6 + 1
1.
Microvias 1 to 2
8 to 7
PTH 1 to 8
1 x pressed
1 x electroplated
1 x laserdrilled
1 x mech. drilled
2 + 4 + 2
2. 1.
Microvias 1 to 2
+ 1 to 3
8 to 6
8 to 7
PTH 1 to 8
2 x pressed
1 x electroplated
1 x laserdrilled
1 x mech. drilled
Microvia Filling?
2 + 4 + 2
2. 1.
Microvias 1 to 2
2 to 3
7 to 6
8 to 7
PTH 1 to 8
2 x pressed
2 x electroplated
2 x laserdrilled
1 x mech. drilled
1 + 6b + 1
1. 2.
Microvias 1 to 2
8 to 7
PTH 1 to 8
Buried Via 2 to 7
2 x pressed
2 x electroplated
1 x laserdrilled
2 x mech. drilled
2 + 4(6b) + 2
2. 1.
Microvias 1 to 2
2 to 3
7 to 6
8 to 7
PTH 1 to 8
Buried Via 2 to 7
2 x pressed
2 x electroplated
2 x laserdrilled
2 x mech. drilled
2 + 4b + 2
2. 1.
3.
Microvias 1 to 2
2 to 3
7 to 6
8 to 7
PTH 1 to 8
Buried Via 3 to 6
3 x pressed
3 x electroplated
2 x laserdrilled
2 x mech. drilled
Laser drilling
1 to 3
Staggered
Microvias
buried Vias
extra
buried
Microvias
1 x pressed 2 x pressed 3 x pressed
100 %
115 %
120 %
142 %
150 %
175 %
90 %
ML08
ohne
µ-Vías
Costs
www.we-online.de Seite 21 04.09.2013
Kosten
Filling ?
Microvias stacked
0,40 mm BGA Pitch Microvias
staggered
Complexity
Costs
We will have a…
04.09.2013 www.we-online.de Page 22
Why is it cheaper, to have Buried Vias from the first to the last Microvia layer?
Survey
04.09.2013 www.we-online.de Page 23
Agenda
Overview Webinar HDI 1
Route out a BGA
Costs
Roadmap – HDI 2.0
Lasercavity
www.we-online.de Seite 24 04.09.2013
www.we-online.de Seite 25 04.09.2013
Roadmap
HDI 2.0 [µm] 2013 2014 2015 Forecast
Trace width / spacing 75 50
Padsize Microvia 275 220
Dril ldiameter Microvia 100 90 75
Drill diameter Buried Via (mech.) 250 200 150
Forecast:
• BGA Pitch 0.30 mm
• ELIC
• HDI…5+x+5
• High frequency – High Speed
Agenda
Overview Webinar HDI 1
Route out a BGA
Costs
Roadmap – HDI 2.0
Lasercavity
www.we-online.de Seite 26 04.09.2013
Lasercavity?
With a laser prudced cavity
Exposing of layout on the inner layes
Embedding of components
Miniaturization
Better thermal management
www.we-online.de Seite 27 04.09.2013
Querschnitt
www.we-online.de Seite 28 04.09.2013
Lasercavity
LASERCAVITY® – with sidewall matalization
HDI08_3+2(4b)+3
Lasercavity
www.we-online.de Seite 29 04.09.2013
Micorvias for the thermal connection
to the aluminum
Two step Lasercavity with different electrical potentials
Lasercavity
www.we-online.de Seite 30 04.09.2013
LASERCAVITY® - Two levels for wire bonding
65 µm
step depth
Lasercavity
www.we-online.de Seite 31 04.09.2013
250 µm LC
1400 µm
Stackup: 1+6b+1
• Lasercavity on layer 6
• Lasercavity surface for AL wire bonding
LASERCAVITY®
1.4 mm deep
04.09.2013 www.we-online.de Page 32
Thank you for your attention!
Dominic Büch
WÜRTH ELEKTRONIK GmbH & Co. KG
Product Management
Lasercavity
Circuit Board Technology
P.: +49 7622 397 223
M.:+49 151 7270 9888
W. www.we-online.de