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High Tech. a Catania: il caso STMicroelectronicsHigh Tech. a Catania: il caso STMicroelectronics
Dr. Manlio La Duca
FACOLTA’ DI ECONOMIAFACOLTA’ DI ECONOMIA
WELCOME!WELCOME!
2
To offer strategic independence to
our partners worldwide, as a
profitable and viable broad range
semiconductor supplier
Mission
3
We aim at becoming the undisputed leader in multimedia convergence and power applications, dedicating
significant resources to productinnovation and increasingly becoming
a solution provider
Vision
Macroeconomic trends – GDP growthMacroeconomic trends – GDP growth
World GDP growth
4.7%
2.2%2.7%
3.6%4.4%
5.0% 5.2%
1.7%
3.3% 3.6%3.3%
-2.1%
4.9%
00 01 02 03 04 05 06 07 08 09 10E 11E 12E
% Y-o-Y
Source : IMF, World bank, June 2010
Emergingcountries continue
to bring tractionBubble
Recession
Back to growthdriven by US and
emerging countriesSlowrecovery
Recession
Year
GLOBAL OUTLOOK(Real GDP; quarterly percent change from one year earlier, unless noted otherwise)
• Global growth is forecast to recover in all regions but remain below precrisis levels over the medium term. • Accordingly, relative to precrisis trends, some activity has been permanently lost. Losses are particularly large in emerging Europe and the Commonwealth of Independent States (CIS), where recovery in many countries will be slow and medium-term growth rates appreciably lower than before the crisis. • Recovery is also expected to be sluggish in a number of advanced economies, although less so in the United States than in the euro area and Japan.
Semiconductor Ranking 2009 – ST ranked #5
Source : iSuppli Corporation supplied rankings for 2009(foundries excluded)
Rank RankCompany Country of origin
Revenue2009/2008
changes Market share2009 2008 (million$ USD)
1 1 Intel Corporation USA 32 095 -5.00% 14.20%2 2 Samsung Electronics South Korea 17 123 1.30% 7.60%3 3 Toshiba Semiconductors Japan 10 640 -4.00% 4.70%4 4 Texas Instruments USA 9 612 -13.20% 4.20%5 5 STMicroelectronics FranceItaly 8 400 -18.60% 3.70%6 8 Qualcomm USA 6 475 0.00% 2.90%7 9 Hynix South Korea 5 940 -1.40% 2.60%8 6 Renesas Technology Japan 5 664 -19.30% 2.50%9 12 AMD USA 5 038 -7.60% 2.20%
10 7 Sony Japan 4 670 -32.80% 2.10%11 11 NEC Semiconductors Japan 4 403 -24.40% 1.90%12 10 Infineon Technologies Germany 4 340 -27.10% 1.90%13 14 Broadcom USA 4 198 -9.60% 1.90%14 16 Micron Technology USA 3 995 -9.90% 1.80%15 24 MediaTek Taiwan 3 524 21.70% 1.60%16 19 Elpida Memory Japan 3 498 -2.80% 1.50%17 13 Freescale Semiconductor USA 3 344 -32.70% 1.50%18 15 Panasonic Corporation Japan 3 330 -25.60% 1.50%19 17 NXP Netherlands 3 247 -19.90% 1.40%20 18 Sharp Electronics Japan 2 886 -20.00% 1.30%
Top 20 142 422 -10.70% 62.80%All Other companies 84 313 -15.20% 37.20%TOTAL 226 735 -12.40% 100.00%
8
STMicroelectronics
A Global Semiconductor Company
13 %Americas 18 %
Japan &Korea45 %
Greater China & South Asia
24 %EMEA (1)
Sales by region % of Q3’10 sales
(1) Europe, Middle East & Africa(2) Including revenues from ST-NXP Wireless for the month of January 09 and
ST-Ericsson starting February 09(3) Including ST-Ericsson
§ 2009 sales : US$ 8.51 billion (2)
§ Q1 2010 sales : US$ 2.325 billion § Approx. 51,000 employees in the group (3)
§ 15 main production sites§ Advanced R&D centers in 10 countries
9
STMicroelectronics Awards
ST has received more than 100 awards and accolades worldwide, in
the areas of both Quality and Environmental Protection,
including the European Quality Award and the Malcolm Baldrige National
Quality Award
10
Shareholding Structure*
* At December 31, 2009(1) Based on Corporate Governance rights between FT1CI/Areva/CEA and CDP pursuant to STH Shareholders’ Agreement. (2) New York Stock Exchange, Euronext, Paris and Borsa Italiana, Milano(3) In addition to the 27.5% held by ST Holding II B.V. and the 68.9% held by the Public, 3.5% are held by the Company as Treasury shares
AREVA CEA
FT1C150 % (1)
Cassa Depositi e Prestiti (CDP)50 % (1)
ST Holding N.V.100 %
ST Holding II B.V.27.5 %
Public (2) (3)
68.9%
STMicroelectronics N.V. (ST)
Human ResourcesP. Chastagner
11
Organization
Finance C. Ferro
Infrastructures & Services
O. Kosgalwies
Product QualityExcellenceG. Auguste
Greater China & South Asia
F. Guibert
Japan & Korea
M.L. Cassis
AmericasR. Krysiak
Front-End Manufacturing
O. Bellezza
Computer & Comm.Infrastructure
G. Bertino
Automotive Product Group
P. Grimme
Home Entertainment & DisplaysP. Lambinet
Packaging and Test Manufacturing
J. See
Analog, Power & MEMS
C. Papa (acting)
Microcontrollers, Memories & Smartcards
C. Dardanne
Technology R&D J-M. Chery
President & CEOC. Bozotti
EMEAA. Cuomo
Industrial & Multisegment Sector
C. Papa
Product GroupsSales & Marketing
COOA. Dutheil
Manufacturing & Technology R&D
LegalP. Ollivier
CommunicationC.E. Ottaviani
AdministrationT. Hooghiemstra
ComplianceA. Grenville
CEO C. Bozotti
Corporate Staff Functions
Business Dev. & Strategic Planning
L. Lietar
ST Catania site Yesterday/Today
Satellite view
vBUILDABLE AREA 183.520m2
vAREA OCCUPIED BY BUILDINGS 59.000m2
vCLEAN ROOM 21.702m2
YearYear Surface AreaSurface Area EmployeesEmployees Wafer Wafer DimensionsDimensions LithographyLithography
1960 The first brick laid
1962 9500 m² 1” 200µ
1970 17000 m² 1528 2”/3” 100µ
1980 25000 m² 1716 4” 10µ
1990 27000 m² 1026 5” 2µ
2000 76000 m² 3848 6” / 8” 0,25µ
2001 88194 m² 4141 6” / 8” 0,18µ
2002 88194 m² 4504 6” / 8” 0,15µ
2004 164800 m² 4768 6” / 8” 0,13µ / 0,11µ
September2010
183520 m ² 4.041 6” / 8” 0,11µ
Evolution of Catania site
* since March 2008 * since March 2008 496496 employees have been employees have been
Admin & Site Services EHS,Quality&Sust. Excellence Operations Planning,Logistic&
PurchasingR&D Techno&Product
Dev Marketing Support & Staff functions
Total 184 214 2074 125 962 171 311
0
1000
2000
3000 FUNCTIONAL AREAS
Employees at ST Catania
UNIV. DEGREE 1395
H.S. DIPLOMA 2528
OTHER 118
EMPLOYEES' EDUCATION
TrainingTraining
Administration Administration
Human ResourcesHuman Resources
Purchasing & Logistics Purchasing & Logistics
General ServicesGeneral Services
Security and Safety ServicesSecurity and Safety Services
Site ActivitiesFront End: Front End: FabFab. 6“ and 8“. 6“ and 8“
Wafer Wafer EpitaxyEpitaxy: 6“ and 8“: 6“ and 8“
Research and DevelopmentResearch and Development
Quality and Reliability Quality and Reliability
Marketing and Customer ServiceMarketing and Customer Service
Information Communication TechnologyInformation Communication Technology
ST Product DivisionsST Product Divisions& Groups& Groups
ST R&DST R&D
• Definition of the specifications• Development plan • Project validation
• New Technologies• New Platforms of Design•Technology sharing
UniversityUniversityCustomerCustomer
• Customer Support• Cooperation• Joint projects• Identification of:
New ProductsNew Applications
…the “Flywheel”…the “Flywheel”of developmentof development
Strategic Cooperation
• Graduation thesis/internships• Basic research support• New materials study
ü 2009 (ytd): Graduation thesis/Internships
performed at ST Catania:
§ 56 Graduation Theses
§ 35 Internships
•All graduation thesis completed at ST Catania (more than 900) are available on the INTRANET, Thesis Archive http://elib.ctn.st.com/TSLib/
Catania site Graduation thesis and internships
University graduates hired 2000-2009
125
63
287
50
533
Physics
Chemistry
ComputerScience
Other
Elect./TelecEngineering
2001 2002 2003 2004 2005 2006 2007 2008 TOT
§STUDENT THESES§INTERNSHIPS
83 116 93 145 185 133 87 86 928928
Collaboration/Research at ST Catania
In Catania: 962 researchers, 719 of whom are university graduated
•• SeveralSeveral groupsgroups engagedengaged in in longlong--termterm researchresearch and in the and in the developmentdevelopment ofof highhigh--
levellevel architecturesarchitectures
Collaboration with public and Collaboration with public and
universityuniversity--sponsored sponsored
organizations on the ST organizations on the ST
Catania site premisesCatania site premises
•• Total Surface: more than 1000 m²Total Surface: more than 1000 m²
19
Sources: ST
ST Q3 2010 sales100%=US$ 2.657 billion
Computer12 %
Communications*35 %
Industrial & Others
8 %
Consumer12 %
Automotive14 %
Sales by Market Segment / Channel*
Distribution*19 %
* Sales recorded by ST-Ericsson and consolidated by ST are included in Communications and Distribution
20
Sales by Operating Segment
ST Q3 2010 sales 100% = US$ 2.657 billion
Wireless25 %
35 %
Industrial & Multisegment Sector
Others
1%ACCI*39 %
* ACCI : Automotive, Consumer, Computer and Telecom Infrastructure
2010 ACCI Products and Wins
Digital Consumer§New high-end STi7108 SoC, enabling 3D-ready hybrid Internet/broadcast-TV Set-
top-boxes.
Automotive Electronics§Several Body Control Modules design wins for 32-bit MCUs in Europe and the US.§Significant share gained in a major worldwide engine-control management
platform, covering all car segments.
Automotive Infotainment§ Important Cartesio+ design win from a leading OEM, targeting Japan.
Computer peripherals§Two design wins with a world-leading printer manufacturer for inkjet Multi-Function
Printers
Communication Infrastructure§Four important ASIC designs with major customers – three of them in 32nm
process technology
21
2010 IMS Products and Wins
MEMS§A 3-axis gyroscope with digital output selected for a next-generation smartphone.§Continued momentum for accelerometers and gyroscopes in consumer, mobile
and gaming applications.
Healthcare§Agreement for the development and supply of a wireless MEMS sensor for a new
platform enabling better management of glaucoma patients
Power §Production ramping up for DC/DC converters ICs for the power management of
AMOLED displays in mobile-phone applications from two major global players.§Key design wins in power conversion ICs, including one for a kit to be used in a
new 2011 TV platform and one from a leading game-console maker. §Several design wins in power transistors for automotive, computer and photovoltaic
applications
Memory & Microcontrollers§Several additions to STM32 general-purpose MCUs family (offering up to 1 Mbyte
of Flash, Value Line…).§ Launch of an innovative dual-interface EEPROM chip.
.
22
2010 ST-Ericsson Products and Wins
23
§ Announced numerous enhancements to U8500, its advanced smartphone platform, also breaking through 1.2 Ghzperformance barrier
Smart mobility & multimedia § TD-SCDMA technology selected by HTC for its smartphones
in China
§ Cooperation with China Mobile on TD-LTE development
§ Launched U6715, a new low-cost, compact and very power-efficient Android-ready platform, broadening the smartphonesegment to the mass market
§ Selected by Sagem Wireless as its platform provider for future Sagem Wireless devices
23
24
50/50 JV with Ericsson
Products
Major Customers
Automotive, Consumer, Computer and
Communication Infrastructure (“ACCI”)
Industrial and Multisegment Sector
(“IMS”)Wireless
Home Entertainment
& Displays
Computer & Communication
Infrastructure
Automotive Products
Group
Analog, Power and
MEMS
Microcontrollers, Memories and
SmartcardsMajor Product Lines
Business Segments
Customer update
25
26
Diversified Customer Base
2009 Top 30* OEM and Top EMS Customers
* Alphabetically listed by main application sector
Consumer
Computer
AutomotiveCommunications
EMSIndustrial
HuaweiNokiaResearch in MotionSony EricssonSamsung
ADBCisco/Scientific AtlantaGarminLG ElectronicsNintendoPacePanasonicPhilipsSagemSharpThomson (now Technicolor)
DeltaGemaltoSiemens
AppleDellEastman KodakHPSeagateWestern Digital
BoschContiDelphiDensoMarelli
Cal-Comp.ElcoteqFlextronicsHonHai FoxconnJabilSanmina - SCI
Q108 Q208 Q308 Q408 Q109 Q209 Q309 Q409 Q110
27
GenesisMicrochip Wireless Mobile Platforms
Recent Initiatives & Heading for the Future
50%
Headcountrealignment
ST-Ericsson costrealignment
ST-NXPsynergy plan
Manufacturingrestructuring
5 yearsR&D grants
secured
Micron to acquireNumonyx
Advancing Process R&D Partnerships
ST & Philips Semi (NXP)
2008
Motorola (Freescale)
+
Leadership and reduced process development costs are enabled through the International Semiconductor Development Alliance (ISDA)
ST & Philips Semi (NXP)
1992 2001 2003
28
3SUN: Photovoltaic Joint Venture
Equity Injection(Almost All In-kind =€70M)*
Equity Injection(Cash =€70M)
Equity Injection(Cash =€70M)
* The ST contribution into the PV joint venture consists primarily of the contribution in-kind of the M6 factory. Through an option agreement with Numonyx, Numonyx will transfer M6 to ST, against the off-set of a portion of the outstanding 30-year note due to ST, immediately before the closing of the PV JV. Upon closing, ST will then contribute M6 to the PV JV.
Photovoltaic Joint Venture
State Grants + Project Financing (non-resource)
1/3 ownership of JV 1/3 ownership of JV 1/3 ownership of JV
29
30
ST Commitment to Sustainable Excellence
§ For us, understanding our stakeholders’ expectations is a precise business strategy, reflecting our many years of experience and our conviction that socially responsible companies are intrinsically more competitive and generate higher returns for shareholders.
§ We encourage ST employees to exercise a strong sense of individual responsibility to the environment and to the local communities in which we operate.
§ Our approach to Corporate Responsibility extends well beyond our Company, as we actively seek to involve our suppliers in our approach, significantly expanding our impact.
Box color RB 0 82 142