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Ke Wu

Canada Research Chair in Radio-Frequency and Millimetre-Wave Engineering

Poly-Grames Research Center

Center for Radio-Frequency Electronics Research (CRER) of Quebec

Department of Electrical Engineering

Ecole Polytechnique (University of Montreal), Canada

ke.wu@polymtl.ca

Substrate Integrated Circuits (SICs) and Systems for

RF and Millimeter-wave Applications

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Introduction

Drawbacks of standard planar transmission line technologies Need for compact, low-loss, low-cost integrated waveguides and circuits

Integration issues

Substrate Integrated Circuits (SICs) and Systems

Performance of substrate embedded waveguides

Recent achievements in the field of substrate integrated circuits (SICs)

System-on-Substrate (SoS) Concepts

Future challenges and possibilities

Conclusions

OUTLINE

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Drawbacks of current technologies

EM field singularities cause high current densities in the conductor edges high conductor losses

Semi-opened and/or unbounded planar circuits are subject to packaging problem andradiation losses

high cross-talk and transmission losses

Microstrip Coplanar Waveguide (CPW)

Introduction

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Performance gap at mmW frequencies

Electrically large mmW components rely on low loss technology Gap between lossy planar waveguides and bulky metal waveguides needs to be

closed.

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Design Examples of Microstrip to Rectangular Waveguide Transition

a) Probe Type b) Ridge Type

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(a) (b) (c)

(d) (e) (f)

Synthesized Waveguides and Substrate Integrated Circuits (SICs)non-planar structure in planar form

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Substrate Integrated Circuits (SICs)

Complete integration of planar circuits (surface type) and non-planarcircuits (volume type) on the same dielectric substrate and fabricationprocess

Synthesized waveguides made of metallic fences and/or dielectric

contrasts compatible with planar substrate (electrically, mechanically, andthermally)

Potential hybrid and monolithic features such as planar multilayer,miniaturization, self-packaging, tunability, electro-optical control and

conversation

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Substrate Integrated Waveguide

Early version of SIW filter

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Substrate Integrated Non-Radiative Dielectric Waveguide

SINRD LSM11 mode(only half the structure is shown)

Early SINRD filter

(7th order, without cover)

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Substrate Integrated Image Guide

Fundamental Ey11 mode

(only half the structure is shown)

Silicon SIIG prototype

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Interfacing / Transitions

wS

lS

w

b

ar

p

x

z

y

Courant electriqueChamp magnetique

Waveguide SIIG

CPW SIW

Microstrip SIW

CPW SIIG

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In-Line Four-Pole Dual-Mode Filter

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Substrate Integrated Waveguide Antennas

g/2 3g/4

lf of

ae slotted antenna

leaky-wave antenna

Ond

esdefuite

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Integrated SIW antenna/feeder module

Antipodal Linearly Tapered Slot Antenna

(ALTSA)

1 x 16 SIW-ALTSA field profile

1x 8 SIW-ALTSA photo

Measuredradiation pattern

of 1x 8 SIW-ALTSA at

10 GHz with18.76dBi gain

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Substrate Integrated Waveguide

Directional Couplers

Weff

LaLs

Ws

L1

L2

L1

L2

(a) (b)

1 4

2 3 2 3

1 4

Weff

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Substrate Integrated Waveguide Oscillator

L

b

W

90

JP1 JP2

P_INJ

P_OSC

P_AP_B

ATF36077AMPLIFIER

SIW CAVITY

W c

Gc

Wp

LpLx

PHASE STUBS

LOOP LENGTH

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Integrated FMCW Radar System on Substrate (SoS)

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Synthesized or Substrate Integrated NRD-Guide

Standard NRD Guide Generalized NRD Guide Substrate Integrated NRD Guide

R RR1

RR1

Air Holes

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94 GHz 3rd Order Alumina SINRD Guide Filter

S1 S2

L1L2

Wt

S1

L2L1

L1 = 0.180mm, L2 = 0.449mmS1 = 1.082mm, S2 = 1.118mm, Wt = 0.737mm

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Simulated and Measured Results

87 89 91 93 95 97 99 101 103-50

-45

-40

-35

-30

-25

-20

-15

-10

-5

0

5

GHz

dB

S11

(sim) S21

(sim) S11

(mea) S21

(mea)

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System-on-Substrate (SoS) Concepts

Advanced Technological Features

Nano-structuredzero loss and agile/tunable substrates

Traveling-wave electro-optical devices

Mixed integration of different waveguides on substrate

High-density multilayer integration

Monolithic integration ofpassive and active circuits on substrate includingantennas

(Sub)millimeter-wave VLSI (very-large scale integration)

Terahertz electronics and photonics

Bridging the gap between electronic and optical systems

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Complementary Modal Field Profiles

a) b)

E field E field

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Other Examples of Multi-port SICs

SIW cruciform directional coupler or cross-over

1

3 2

4

5

68

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W-band multi-port receiver circuit

Substrate integrated waveguide circulator

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24/77 GHz dual band antenna system

140-280 GHz think-film SIW band-pass filter(Prof. Ian Robertson, University of Leeds, UK)

(b)

Traveling-wave photodetector and modulator

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Substrate Integrated Folded Waveguide (SIFW)(from Dr. Paul R. Young, University of Kent, UK)

a

a/2

a/3a/4 4 layer

3 layer

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SIW and Half-Mode SIW (HMSIW) Structures

Evolution of HMSIW from SIW

HMSIW

SIW

Dominant modes in

HMSIW and SIW

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SIIG W-band Antennas

94-GHz SIIG planarDielectric rod antenna

94-GHz SIIG array antenna

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Substrate Integrate Circuits (SICs)

Combining planar and synthesized non-planar guiding structures

Example of a substrate integrated circuit

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Conclusions

Substrate integrated circuits (SICs) for low-cost/high-density RF/millimeter-

wave/terahertz and photonic wireless ICs and system applications

Hybrid design platforms such as planar-substrate integrated waveguide (SIW) &

planar-substrate integrated dielectric guides

Potential monolithic SICs with semiconductor and/or smart substrate towards

System-on-Substrate (SoS) approach for future millimeter-wave and photonic

wireless applications

Bridging the technological gap between electronics and photonics for GHz and THz

innovations and discoveries

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Acknowledgements

Many year contributions by the speakers students and research fellows as well as

technical support of technologists at the Poly-Grames Research Center have made thispresentation possible

The speaker is grateful to Canadian NSERC (Natural Sciences and Engineering

Research Council) and Quebecois funding agency (FQRNT) for their financial supportthrough multiple grants

Worldwide collaborators including Prof. Wei Hong and his team at Southeast University

(China), Prof. Maurizio Bozzi and his colleagues at University of Pavia (Italy) and others

have made contributions to this presentation