What if…. There was a KGD

Standards Committee?

KGD Workshop 2011 November 10, 2011

Steve Steps, Aehr Test Systems

•  What might be in a KGD standard •  Who might benefit •  Pros and Cons of KGD standards •  Conclusions

Agenda

KGD Standard 2

•  Standardize the “look and feel” of Specifying KGD – Die functionality – Size, Shape – Bonding method (bond wire,

TSV, etc.) – Bonding pads (location,

function) – How “KG” (reliability “9”s)

KGD Standard

KGD Standard 3

•  Handling standards have existed •  Standards exist for 3D components

– MS1-0307: Wafer-Wafer bonding – JC-11/JC-42: Wide-IO memory – JC-14: 3D-IC Reliability Test Methods – JC-63: 3D Stacked Mixed Technologies – ….

•  KGD standards for COB or stacked die?

Some Standards Exist

KGD Standard 4

KGD Standard 5

KGD Standard 6

KGD Standard 7

11-11

QFP-Package COB

Combination of Chips and PCBs – State of Technology

Die/Wire bonding on leadframe

Soldering on PCB

Die bonding onto PCB

Wire bonding Chip to PCB

•  Opens up “stacking” to everyone –  Examples

•  GPS “augmented reality”, head-ups display for glasses. •  “Dick Tracy” watch

–  Could be executed by a small team/start-up •  Major companies could focus on value added

–  Even large companies struggle with integrating memory into chips

–  Stack a “standard” DRAM instead

•  Many KGD business opportunities

Benefits of KGD Standards

KGD Standard 9

•  Because of size and weight restrictions, would require very high integration

•  KGD needed: – Processor – Memory (DRAM and flash) – GPS chip – Display driver

•  Could a small start-up execute this?

Example, GPS Glasses

KGD Standard 10

•  Because of size and weight restrictions, would require very high integration

•  KGD needed: – Processor – Memory (DRAM and flash) – Cell-phone chip – Simple display driver/display

•  Could a small start-up execute this?

Dick Tracy Watch

KGD Standard 11

•  Major components: – Processor – BUY? – Memory (DRAM and flash) – BUY? – Cell-phone chip – BUY? – Simple display driver/display – BUY? – Stacking – Contract? –  Industrial Design – YES – Application programming – YES

•  Could be executed by a small team, if KGD standards existed

Start-up Contribution

KGD Standard 12

•  Could even benefit well established semiconductor companies – Significant resources expended on “trivial”

aspects – such as memory. – Could instead source the memory from

well-established memory vendors – Focus resources on “core competencies”

Major Companies Benefit

KGD Standard 13

•  KGD suppliers for basic components: •  DRAM •  Flash •  Processors •  GPS/Wi-Fi/Cell phone chips

•  KGD distributors (“DigiKey of KGD”) •  KGD integrators (stacking/packaging)

New/Expanded KGD Business

KGD Standard 14

•  One of the key components has issues –  Each DRAM manufacturer has their own size/

shape/pad locations –  “Fixed” today in the packaging –  Would need to be standardized to provide

consumer flexibility –  Each manufacturer motivated to force their

solution as the “standard.” •  Can standards be implemented quickly

enough to be useful? •  Who drives the Standard Committee?

Issues With KGD Standards

KGD Standard 15

KGD Standard 16

KGD Standard 17

KGD Standard 18

•  Look at existing standards •  What’s missing? •  Contact Rich Allen •  Participate

Conclusions

KGD Standard 19