Wirelaid - a life-prolonging measure · partially thick copper – enabling high current at the...

Wirelaid® - a life-prolonging measure

Webinar April 7th, 2015 Speaker: Andreas Schilpp

07.04.2015www.we-online.com

Agenda

Why this headline?

van-’t-Hoff’s rule – describing the relationbetween speed and temperature in a chemical reaction:

� thumb rule in chemical kinetic allowsan estimation of many phenomena in chemistry

� the rule says that chemical reactionsare accelerated through a temperaturerising of 10K by a factor of 2 up to 4

source:Wikipedia

07.04.2015www.we-online.com page 2

Agenda

Why this headline?

van-’t-Hoff’s rule – describing the relationbetween speed and temperature in a chemical reaction:

� applied to

Aging processes of electronic components:

10K lower temperature extends their life

span by a factor of 2 up to 4


Agenda

07.04.2015

Preisvergleich, thermische Betrachtung

repetitionbasics

WIRELAIDvs

Standard

newDesign Guide

Power Elements SMD

passive heatdissipation

combinationswith HDI / Semiflex

www.we-online.com page 4

introduction

The basics have already beencovered in detail by several

webinars.

Please find them in our

Webinar Archive or at


introduction

current (up to 300A and more) Logic (SMD, fine line)

on a single pcb / on a single layer

07.04.2015

requirements of the market:


introduction

07.04.2015

Your benefits

� reduced system volume

� thick copper technology replaced by single wires

� improved heat dissipation through higher cross seqtional area of copper

� elimination of connectors

� reduction of layers

� combination of power and logic on one layer

� reduction of system costs

� standard soldering due to reduced thermal mass compared to thick copper

technology

� thinner copper layers possible

� smaller area needed due to partial thick copper


Frequently asked questions from our customers


� FAQ of WIRELAID-Technique – from experience

1. Where are the wires located?

2. Could there be wires as well on cores?

introduction

Wire Wrap versus Wirelaid

07.04.2015

Photo taken by Haragayato


Agenda

07.04.2015


repetitionbasics

WIRELAIDvs

Standard

newDesign Guide


Power Elements SMD



WIRELAID versus Standard

WIRELAID cross sectionalarea - wire

track over wire(35µm base copper)

width Standard track(35µm base copper)

ReductionRouting area

F14 0,5mm² 1,9mm 8,9mm 78,7%

07.04.2015

0,63mm²customer´s requirement : 20A @ 20K (35µm base copper)

with WIRELAIDreduction of

78,7% width

8,9mm 1,9mm4,5mm


Thermal imaging: Demonstrator

left:Multilayer 6 layerseach 105µm copper

right:2 layers ML2 Wire@1@2each 35µm copper, Wires F14

result @ 50A:nearly same temperature rising, recorded with Optris IR-camera

Mit freundlicher Unterstützung der Firma Optris, Berlin


Thermal imaging: Demonstrator

07.04.2015

� small temperature rising: – 50A permanent current

– Wirelaid only with 2 layers

≈≈≈≈ 9 K


Agenda

07.04.2015


repetitionbasics

WIRELAIDvs

Standard

newDesign Guide


Power Elements SMD



Design Guide NEW

Since today there is the newest revision of theWIRELAID Design Guide 1.4

– new: simplified rules for wire design

– new: design rule for Pad connections

– new: current waveforms

– new: passive heat dissipation (in detail later )

– explanation for cost comparison on pcb level

� english / french versions following soon

07.04.2015

more informations about high power applications

combined with logics you will find here:

www.we-online.com/power!www.we-online.com page 15

Now we will have a …

What is correct for you (multiple choice possible) ?

1. We are already using Wirelaid

2. We plan to use Wirelaid in one of the next projects

3. We have products where we think that Wirelaid is

possible and reasonable

4. We see restrictions which prohibit the usage of

Wirelaid

07.04.2015www.we-online.compage 16

Agenda

07.04.2015


repetitionbasics

WIRELAIDvs

Standard

newDesign Guide

Power Elements SMD




Power feeding through power elements

� up to 50 A: SMD Powerelements

– small footprint

– No pad drilling with THV necessary

– perfect for WIRELAID with wire underouter layers

– perfect for combination with Microviasin solder pads when wires are underlayer 2 respectively (n-1)

– standard assembly and solder process

– available in reel with pick caps

– internal and external threads M3 or M4

� more Informations:we-online.com/powerelements


Power feeding through power elements

� Press-Fit Powerelements:

wires must not be drilled!

07.04.2015

��

��


Agenda

07.04.2015


repetitionbasics

WIRELAIDvs

Standard

newDesign Guide

PowerElemente SMD




Passive heat dissipation – approach

07.04.2015

� wires welded directly under the solderpads of the power components allow

much better heat spreading

� packaging i.e. TO2xy or D²PAK

� fits perfectly to SMT components


Passive heat dissipation – experiment

07.04.2015

� Tu = 20°C, power loss 16,5 W / cm²

� after 5 s you can see the wires which aretransferring the heat of the componentthus cooling it

� heating the chip up to Tmax at nominal power loss

� Left Tmax = 55°C without wires, right Tmax = 38°C with wires. clearly improved hot spot situation: temperature 17 K lower meansextension of life span with a factor of 4!


Passive heat dissipation – component array

07.04.2015

� heat dissipation of a component arrayusing a common wire with weldingpoints under the solder pads of eachcomponent

� maximum possible density of thepower components and excellent heatdissipation at the same time

� improved heat dissipation usingparallel wires


Agenda

07.04.2015


repetitionbasics

WIRELAIDvs

Standard

newDesign Guide

PowerElements SMD




Combination with HDI / Microvias

07.04.2015

� requirements– high current

– low temperature rising allowed

– high voltage up to 900V

– Logic with sensitive signals

– SMD assembly both sides

� solution– Wirelaid partially „thick copper“

– + HDI-Technique

� only few THTs

� additional area for isolation gaps

� excellent signal routing with Microvias


Combination with Semiflex

07.04.2015

� requirements– high current

– Power + Logic

– SMD assembly both sides

– rightangled connector

– not enough area for components

� solution– partially „thick copper“ using Wirelaid

– + Semiflex - Technique

� saving footprint area

� 3D volume usage


� partially thick copper

– enabling high current at the same time with

logic circuitry

– enabling thin copper layers and thuscombination with HDI Technique

– could be combined with Semiflex

– enables excellent heat dissipation

– extending life span of thermally critical

components

� a life-prolonging measure

summary


Thank you very much for your attention!

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Wirelaid - a life-prolonging measure · partially thick copper – enabling high current at the...

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