Wrap up Xband accelerating structures review 24-25.11 · • Describe/put together existing...

Wrap up Xband accelerating structures review 24-25.11.2014

N. Catalan Lasheras,

https://indico.cern.ch/event/346988/



Background

• A number of the collaborators have participated in the assembly of X-band structures

– KEK/SLAC< CEA, Tsinghua University have successfully manufactured/assembled structures

– PSI, CIEMAT, SINAP, Lancaster university are joining the effort

• Ultimately, the whole manufacturing and assembly process should be accomplished by a commercial company

– To have a real estimate of the CLIC structure costs

– Needs an effort towards cost-driven design

• Document all manufacturing procedures currently used for putting together CLIC AS

– With references, scientific or historical background

– Defining a quality assurance program in parallel

• Extract procedures for off-site manufacturing

– Which steps can be let to the different establishments?

– What measurement will ensure a uniform quality?

• Write specifications for an industry built structure

N. C

atal

an L

ash

eras

A

S re

view

24

.11

.20

14

Goals of the review

• Describe/put together existing manufacturing steps

– Conditions, procedures, tests, etc.

• Verify and agree on the procedures

• Bring short term modifications

– To be implemented already in 2015

• Propose longer term modifications, studies or R&D efforts

– There will not be time for discussing all in detail but it will be most useful to have a list of potential directions to explore

– In coordination with other CLIC-RF work packages

N. C

atal

an L

ash

eras

A

S re

view

24

.11

.20

14

Participants

31 participants including outside laboratories

D. Schulte, CERN/ABP

PH. Lebrun, S. Stapnes, CERN/DG

S. Atieh, A. Cherif, G. Favre, M. Garlache, A. Perez Fontenla, CERN/MME

M. Aicheler, O. Brunner, N. Catalan Lasheras, M. Filippova, A. Grudjev, D. Gudkov, S. Lebet, A. Olyudnin, C. Rossi, A. Solodko, I. Syratchev, J. Vainola, A. Xydou, B. Woolley,

W. Wuensch, CERN/RF

M. Taborelli, M. Thiebert, CERN/VSC

F. Toral, L. Sanchez. Ciemat, Spain

T. Higo, T. Abe, KEK, Japan

M. Franzi, J. Weng, SLAC, USA

23 talks plus discussions

2 long days

N. C

atal

an L

ash

eras

Program of the review Introduction to the review. N. Catalan Lasheras

Manufacturing workflow and status of the procedures. A. Solodko …..

Tolerances coming from alignment. D. Schulte

Tolerances coming from RF. A. Grudjev

Manufacturing for High-Gradient. W. Wuensch

Ultra precision machining and built to cost disk optimization. S. Atieh

How do we measure/accept the disks, shape. Roughness. A. Cherif …..

Review of SLAC and KEK etching procedures. J. Wang

Current cleaning and etching procedures followed at CERN. M. Taborelli

Heat treatment study results, burrs and roughness. A. Perez Fontenla

Role of oxidation in bonding . M. Taborelli …..

Assembly and alignment procedure. M. Aicheler

Cell to cell alignment on GLC structures. T. Higo

Brazing/bonding sequence. S. Lebet, A. Solodko

Bonding dependence from weight and roughness. A. Xydou

H2 diffusion bonding against vacuum brazing. T. Higo …..

TD26CC plans from CIEMAT. L. Sanchez

MTF. M. Filippova

RF measurements and tuning. R. Wolf, B. Wooley

Baking requirements. M. Taborelli

Systematic analysis done on existing samples. A. Perez Fontenla …..

Manifolds assembly. D. Gudkov

SiC to copper brazing. A. Solodko

N. C

atal

an L

ash

eras


















MTF. M. Filippova






N. C

atal

an L

ash

eras

7 31-January-2013 X-band Accelerating structure Review 24-25 NOVEMBER 2014

RF DESIGN ENGINEERING

DESIGN (3D models, 2D drawings)

QUALITY CONTROL AT FACTORY

CONFORM NOT CONFORM

QUALITY CONTROL AT CERN

PRELIMINARY RF CHECK

LEAK TIGHTNESS TEST RF CHECK AND

TUNING

INSTALLATION

PACKAGING AND SHIPPING

BRAZING OF COUPLERS, TUNING

STUDS, COOLING CIRCUITS

7

Baseline manufacturing flow

ULTRA PRECISION MACHINING

ASSEMBLY OF COUPLERS (brazing,

machining)

DIFFUSION BONDING OF DISC STACK

BAKING (vacuum 650 °C,

10 days)

RF DESIGN ENGINEERING

DESIGN (3D models, 2D drawings)

QUALITY CONTROL AT FACTORY

CONFORM NOT CONFORM

QUALITY CONTROL AT CERN

PRELIMINARY RF CHECK

LEAK TIGHTNESS TEST RF CHECK AND

TUNING

INSTALLATION

PACKAGING AND SHIPPING

CLEANING (LIGHT ETCHING)

Add a final dimensional control



Tolerances coming from alignment. D. Schulte Tolerances coming from RF. A. Grudjev














MTF. M. Filippova






N. C

atal

an L

ash

eras

Emittance preservation N

. Cat

alan

Las

her

as

• Emittance budget Dey=5nm

Pre-alignment

Beam based alignment

Remittance growth after structure alignment

Requirements from luminosity N

. Cat

alan

Las

her

as

Not measured. Need more points

Subject 4.2 of the PACMAN network

To be shared between pre-alignment and fiducialization. PACMAN 4.2

To be systematically measured and model fed-back

Applies to PETS to AS. TBM-WG

Dynamic imperfections to be studied in the TBM-WG




Tolerances coming from RF. A. Grudjev Manufacturing for High-Gradient. W. Wuensch













MTF. M. Filippova






N. C

atal

an L

ash

eras

Tolerances coming from RF. A. Grudjev N

. Cat

alan

Las

her

as

a

b

r

d s b

e

ae

l e=ae/be

• Sensitivity study for undamped cell. • Riccardo Zennaro, “Study of the machining

and assembly tolerances for the CLIC accelerating structures”, EUROTeV-Report-2008-081, (2008)

• Jiaru Shi, Alexej Grudiev, Walter Wuensch, “Tuning of X-band traveling-wave accelerating structures”, NIMA 704 (2013)

Sub micron precision is required if no tuning is applied and no temperature correction is allowed Only systematic errors considered. Random errors to be studied

Conclusions from RF tolerances

• Sensitivity studies hints to sub-micron accuracy

– Only systematic errors

– Damping waveguides to be considered

• 2B is the parameter most critical for input couplers

• Tuning could correct 10 MHz but is not the baseline of CLIC.

– Prototypes need to be produced according to the baseline aiming at no tuning.

– Tuning will be used as a measure of accumulated errors and assembly quality

– eventual feedback to RF design and beam dynamics if not achievable.

• We should try to correlate tuning to disk geometry. Action?

– Not all data available for all disks

– One attempt was done in the past without success. (EDMS1291907)

N. C

atal

an L

ash

eras

Stay at submicron tolerance in the shape

Study random manufacturing errors. Systematic deformations?





Manufacturing for High-Gradient. W. Wuensch Ultra precision machining and built to cost disk optimization. S. Atieh












MTF. M. Filippova






N. C

atal

an L

ash

eras

Manufacturing for high Gradient. W. Wuensch

“Many of the procedures we have in structure production have an effect on high-gradient performance - target 100 MV/m loaded accelerating gradient.

• Copper purity, diamond machining, handling, chemistry, 1040 °C, hydrogen, vacuum bake, storage, rf conditioning, etc.

But the relationship between a specific procedure and its effect on high-gradient performance is very difficult to establish experimentally - expensive and time consuming.”

Thanks Walter!!

Increase the gradient is as important as decreasing the conditioning time.

N. C

atal

an L

ash

eras

Taking shortcuts N

. Cat

alan

Las

her

as

• High power breakdown behaviour of a pair of electrodes seems to be similar to that of a n accelerating structure once the “appropriate” scaling laws are applied… work in progress

We could “judge” changes or improvements in the current procedure using sample electrodes. • surface treatment, cleaning, etching,

degassing, etc






Ultra precision machining and built to cost disk optimization. S. Atieh How do we measure/accept the disks, shape. Roughness. A. Cherif

…..











MTF. M. Filippova






N. C

atal

an L

ash

eras

UP machining. S. Atieh

• Material. CU OFE C-1010. CERN standard. Centrally procured

• Rough machining + stress relief @<245 plus UP machining (turning and milling)

• Metrology done only on spare disks not included in the structures

• Probing marks disappear after etching

• Damage under the surface will be seen by FIB-SEM and electrodes

• SEM analysis done on 4 SOI for burrs, iris transition, turning/milling transition/CMM indents

N. C

atal

an L

ash

eras

What if we abandon etching?

Others work above 450 degrees

Shape accuracy N

. Cat

alan

Las

her

as

Not a problem. Well within reach in critical areas!

Achieved Flatness

• Seems to be ok for closed waveguide but not for open waveguide.

• Disks are saddle-shaped for open waveguides

N. C

atal

an L

ash

eras

2008

2009

2010

2011-2012

Achieved Flatness II

• Outliers are measured in free state for damping waveguides • Could come from the free-state requirement

N. C

atal

an L

ash

eras

0

0.005

0.01

0.015

0.02

0 20 40 60 80 100 120 140

Clo

sed

WG

1

.4u

m

No

WG

0

.7u

m

Op

en W

G

1.4

um

*

Co

up

lers

Need to compare between free state and vacuum chuck and change specifications if necessary

Feedback from firms

Firm 1 – Increase and uniform Ra in the wall.

– Sharp edge.

– Increase of RR

Firm 2 – Flatness 1->3 um,

– waveguide shape 5->10um (RR),

– Roughness 25->15nm

Firm 3 – Sharp edge.

– Increase of RR,

– Ra of the walls

N. C

atal

an L

ash

eras

We should address RR and either increase it or justify it Consensus on sharp edge Roughness does not find a consensus


















MTF. M. Filippova






N. C

atal

an L

ash

eras

How do we measure/accept the disks? A. Cherif

Metrology and SEM analysis done only on spare disks

N. C

atal

an L

ash

eras

• Parts arrival • Cleaning by TE/VSC • Temperature stabilization inside

the laboratory • Program construction • Measuring setup • Tool calibration • Measurements

• Characteristics on the drawing

• Iris • Cavity • Flatness • Concentricity

• Roughness • Mitutoyo • Veeco

• Results on EDMS Cleaning is not necessary. Dry, clean air blowing should be sufficient

How do we measure/accept the disks? A. Cherif

• Lost of effort on reducing dimples by CMM

– Probe marks

N. C

atal

an L

ash

eras

From 4.7 to 0.08 um!

Discussion on machining and acceptance

• Some metrology needs to be done for all pieces including reference outside surface and shape. – Included in the acceptance tests besides visual inspection and made if

necessary in b.169 lab. Action: Nuria, Anastasiya, Andrej, Ahmed

• Sharp edge. Machining sequence to be stated in the technical specs to chose the orientation of burrs. Action: Said.

• Can we accept a larger roughness in the cell wall? Action: Alexej • Burrs, scratches, contamination and indents to be accepted if not

visually detected 10-100um? Action: Andrej. • Need to define acceptable burrs, scratches, contamination and

indents – accepted if not visually detected 10-100um? Action: Andrej – Bonding tests on scratched disks. Action Serge

• Flatness should be not relaxed but measurements checked. – Measurements with the vacuum chuck to be compared with the “free

state” Action Ahmed

• Changing R05 to 1.0 or 2.5 to be studied Action: Alexej • Shall we tight the tolerance for OD to +/1um? And the shape?

N. C

atal

an L

ash

eras








Review of SLAC and KEK etching procedures. J. Wang Current cleaning and etching procedures followed at CERN. M. Taborelli









MTF. M. Filippova






N. C

atal

an L

ash

eras

Surface issues for RF structures in SLAC. J. Wang

• Surface roughness after etching

N. C

atal

an L

ash

eras

Etch

ing

for

rem

ovin

g sl

ight

con

tam

inat

ion

and

flui

ds

Not

just

ified

for

dia

mon

d-tu

rned

pie

ces

Etching for 5 seconds N

. Cat

alan

Las

her

as Etching for removing slight contamination and fluids

Not justified for diamond-turned pieces









Current cleaning and etching procedures followed at CERN. M. Taborelli Heat treatment study results, burrs and roughness. A. Perez Fontenla








MTF. M. Filippova






N. C

atal

an L

ash

eras

Current cleaning and etching at CERN. M. Taborelli

• Degreasing: • immersion in Topklean MC20 (cosolvent: hydrocarbons), which is a pre-degreasing agent with

antioxidant effect • Immersion with ultrasound and in vapour phase of HFE 71IPA (hydrofloroether C4F9OCH3 and

isopropyl alcohol) which is a volatile degreasing agent.

• Drying: nitrogen • Packaging: in plastic boxes

N. C

atal

an L

ash

eras

M.Malabaila, EDMS 1108069 measured by weight

Y.Higashi :30+-3 nm/s = 1.8 um/60s J.Wang : 0.75 um/60s

Removal rate of etching :

Present proc. Results not compatible with SLAC and KEK experience. But stress relief temperature 450-500 degrees










Heat treatment study results, burrs and roughness. A. Perez Fontenla Role of oxidation in bonding . M. Taborelli

…..







MTF. M. Filippova






N. C

atal

an L

ash

eras

• Study of the different heat treatments on the copper parts and the effect o etching

• Decided on 245 based on micro-hardness

Study of heat and chemical treatments effects on the surface of ultra-precision machined discs for CLIC. A. Perez Fontenla

N. C

atal

an L

ash

eras

Disc nr 1 2 3 4 5

T (°C) - 185 245 250 500

t (h) - 2 2 4 2

Sector –I Radius 0,02

Sector –II Chamfer 0,02x0,02

Sector –III Sharp edge

Turned area

Milled area

5 discs with ≠ annealing cycle

Are we sure about this? Not much statistics…

– The presence of steps (µm) was confirmed in all discs, before and after etching;The discontinuity before etching is smaller on discs annealed for a longer time or higher T (nr 4 & 5);

• Etching increases drastically roughness and is worse in low temperature samples

• Burrs are removed by etching.

N. C

atal

an L

ash

eras

Study of heat and chemical treatments effects on the surface of ultra-precision machined discs for CLIC. A. Perez Fontenla

Higher temperature annealing seems to do copper harder. Is this bad? Machining is not less precise


















MTF. M. Filippova






N. C

atal

an L

ash

eras

Role of oxidation on bonding. M. Taborelli

• Surface diffusion more important than bulk diffusion. H2 may speed up the process.

• Oxidation reduces adhesion force.

• Oxidation appears in less than an hour.

• Unlike vacuum, heating in H2 will reduce oxidation

• Beware of carbon contamination which will not be removed

N. C

atal

an L

ash

eras

1040 degrees will eliminate oxide in open surfaces. What about bonding surfaces?

Discussion on surface treatment

• No etching should be done on disks anymore.

– Only solvent cleaning.

– Thus no dimples should be allowed in the RF part larger than? Ra?

– Burrs and machining steps need to be under control

• Test on oxide to be prepared. XPS measurements of oxide layer growth.

– Bonding cycle on oxidised samples to assess the bonding quality and the “deoxidising” capacity of the heating cycle. Action: Mauro, Serge.

• Handling from the reception of the disks needs to be reviewed. Action Nuria

– Beware of Carbon contamination

• Stress relieve temperature much lower than in SLAC, KEK and CIEMAT. Is this a concern? Action Said

N. C

atal

an L

ash

eras

Can we spot them?












Assembly and alignment procedure. M. Aicheler Cell to cell alignment on GLC structures. T. Higo





MTF. M. Filippova






N. C

atal

an L

ash

eras


• Manual stacking made against a UP machined V-block using tuning holes or machined line

• Manual stacking against automatic stacking

• Measured before and after bonding

N. C

atal

an L

ash

eras

Data measured for all structures N

. Cat

alan

Las

her

as

After bonding the

misalignment increases by an

average of 2.5μm

2 exceptions in which the after bonding is better than the pre-

bonding. This may be due to fact that might not be measured the same generatrix before and after

bonding

In general extended, more systematic measurements to be done Data exists to be re-analysed for bow













Cell to cell alignment on GLC structures. T. Higo Brazing/bonding sequence. S. Lebet, A. Solodko




MTF. M. Filippova






N. C

atal

an L

ash

eras


• OD is the key for measurements need to be fully measured.

• Stacked manually against a V-block.

• Hold during transport to the oven.

• Later used pre-bonding at low temperature ~150 degrees before releasing fixture

N. C

atal

an L

ash

eras

Some (really) typical results

Cell to cell alignment < 1um

Smooth shape. Large bow

Bonding slippage < 1um

N. C

atal

an L

ash

eras

Very

goo

d ce

ll to

cel

l alig

nmen

t.

Lots

of

mea

sure

men

t po

ints

B

ow c

an b

e ea

sily

cor

rect

ed














Brazing/bonding sequence. S. Lebet, A. Solodko Bonding dependence from weight and roughness. A. Xydou



MTF. M. Filippova






N. C

atal

an L

ash

eras

Brazing and bonding. S. Lebet, A. Solodko

• Detailed description of procedures, tooling and issues

N. C

atal

an L

ash

eras

Avoid using graphite pads in contact with diamond-machined parts















Bonding dependence from weight and roughness. A. Xydou H2 diffusion bonding against vacuum brazing. T. Higo

…..


MTF. M. Filippova






N. C

atal

an L

ash

eras

• Trends on deformation are good but real data give negative deformations

• All sample disks bonded correctly independently of weight

• RF disks results are not all ok but do not correlate with pressure. – Looking into flatness

Bonding dependence from weight and Ra. A. Xydou N

. Cat

alan

Las

her

as

No pressure

0.1 MPa 0.28 MPa

0.28 MPa

0.06 MPa

0.04 MPa

0.1 MPa

0.06 MPa

0.04 MPa

Measurements to be better understood

Last bonding tests last week


















MTF. M. Filippova

RF measurements and tuning





N. C

atal

an L

ash

eras

Discussion on bonding/brazing

• Avoid using graphite pads in contact with diamond-machined parts

• Bonding dependence on weight studies

– Better understanding of the measurements is required

– not conclusive for real disks. Investigating flatness. Action Anastassia

• Vacuum brazing used at lower frequency. Single cell study In KEK. Waiting for the results

• No big changes in the procedure in the short term

– Could be worth to study different atmosphere in electrodes?

• New smaller tooling to avoid leaving the cleanroom. Action Serge

N. C

atal

an L

ash

eras

















TD26CC plans from CIEMAT. L. Sanchez MTF. M. Filippova






N. C

atal

an L

ash

eras

RF X-band previous projects @ CIEMAT N

. Cat

alan

Las

her

as

TBL PETS

Buncher

Microtron

Precision machining Precision joining Vacuum brazing

Precision assembly Low power RF tests

Bead pull and tuning

Plans for CLIC structures: TD26CC

Tuning at CERN

Disc machining

Parts machining

Bonding

Brazing

Leak testing

Assembly

CIEMAT will manufacture a TD26CC structure according CERN procedures

Scope of the collaboration

CIEMAT facilities

Equipment for assembly Clean room

Granites

Measuring machines

Equipment for testing Network analyzers

Leak detectors

Materials division at CIEMAT Optical microscopy

Electronic microscopy

Atomic force microscopy


















MTF. M. Filippova RF measurements and tuning. R. Wolf, B. Wooley





N. C

atal

an L

ash

eras

CDD repositoy M

TF. M

aria

Fili

pp

ova

Project (product) structure M

TF. M

aria

Fili

pp

ova

Item structure in EDMS

57

• Item structure is created in EDMS by using Agile E6 application based on BOM.

• In items can be attached technical characteristics and documents related to the assemblies and corresponding components.

• For each AS top item assembly we usually ask EDMS/MTF support to create five (5) equipment sets where the links on MTF page with corresponding equipment structure could be found.

EDMS - Engineering and Equipment Data Management

assembly item sub-assembly item

sub-assembly item sub-assembly item

component item

MTF

. Mar

ia F

ilip

po

va

Equipment management folder M

TF. M

aria

Fili

pp

ova

New workflow steps № AS Workflow Steps Applicable Standard Result file Manufacturing step catalogue data

1 Discs and coupler manufacturing at factory Technical Specification for UP parts yes

2 Discs and coupler inspection at factory EDMS #1207881 yes

3 Discs and couplers acceptance EDMS #1207881 yes

4 Sample discs dimensional control EDMS #823316 yes CMM used

5 Sample discs SEM EDMS #887717 yes

6 Assembly of couplers EDMS #1421001 yes

7 RF check before diffusion bonding EDMS # 1257643 yes

8 Discs and couplers surface treatment

EDMS# 1440603 (disc-etching --

>EDMS #1242352

couplers, manifolds, waveguides -

degreasing-->EDMS #1072247) yes

9 Alignment control before diffusion bonding EDMS #1237642 yes

10 Diffusion bonding of disc stacks EDMS #1237642 yes oven, atmosphere, pressure

11 Alignment control after diffusion bonding EDMS #1237642 yes

12 Brazing of disc stack with couplers and tuning studs EDMS #1421002 yes oven, atmosphere

13 Brazing of manifolds EDMS #1421004 yes oven, atmosphere

14 Brazing of cooling circuits EDMS #1421006 yes oven, atmosphere

15 Leak tightness test EDMS #1278313 yes

16 RF check and tuning EDMS #1257643 yes

17 Vacuum Baking EDMS #1421007 yes oven

18 Installation EDMS #1421009 no facility name

19 Power test EDMS #1421012 yes test bench, max. archived gradient, breakdown

Manufacturing Step Main Catalogue Data: • Applicable Standard EDMS document № where the

corresponding step procedure is attached • Results EDMS document № of the corresponding result

report Some step data fields to be implemented individually for some steps according to table 3, column “Manufacturing step catalogue data”.

Dimensional control

MTF

. Mar

ia F

ilip

po

va

Responsibilities M

TF. M

aria

Fili

pp

ova

№ AS Workflow Step Responsible(s) for procedures and workflow step

People allowed to close the step

1 Discs and coupler manufacturing at factory Said ATIEH Said, Andrey, Anastasiya, Nuria, Maria

2 Discs and coupler inspection at factory Said ATIEH, Andrey OLYUNINAndrey, Said, Anastasiya, Nuria, Maria

3 Discs and couplers acceptance Andrey OLYUNIN Andrey, Anastasiya, Nuria, Maria

4 Sample discs dimensional control Ahmed CHERIFDidier, Ahmed, Anastasiya, Nuria, Maria

5 Sample discs SEM Ana Teresa PEREZ FONTENLAAnitè, Anastasiya, Nuria, Gonzalo, Maria

6 Assembly of couplers Anastasiya SOLODKO, Serge LEBET Anastasiya, Serge, Nuria, Maria

7 RF check before diffusion bonding Rolf WEGNERRolf, Andrey, Anastasiya, Nuria, Maria

8 Discs and couplers surface treatment Marc THIEBERT Marc, Anastasiya, Nuria, Maria9 Alignment control before diffusion bonding Anastasiya SOLODKO, Serge LEBET Anastasiya, Nuria, Serge, Maria

10 Diffusion bonding of disc stacks Anastasiya SOLODKO, Serge LEBET Anastasiya, Nuria, Serge, Maria11 Alignment control after diffusion bonding Anastasiya SOLODKO, Serge LEBET Anastasiya, Serge, Nuria, Maria

12Brazing of disc stack with couplers and tuning studs Anastasiya SOLODKO, Serge LEBET Anastasiya, Serge, Nuria, Maria

13 Brazing of manifolds Anastasiya SOLODKO, Serge LEBET Anastasiya, Serge, Nuria, Maria14 Brazing of cooling circuits Anastasiya SOLODKO, Serge LEBET Anastasiya, Serge, Nuria, Maria

15 Leak tightness test Cedric GARION, Esa Antero PAJUCedric, Esa, Andrey, Philipp G., Anastasiya, Nuria , Maria

16 RF check and tuning Rolf WEGNERRolf, Andrey, Alexej, Anastasiya, Nuria, Maria

17 Vacuum Baking Anastasiya SOLODKO, Serge LEBETSerge, Anastasiya, Nuria, Markus, Mauro, Cedric, Maria

18 Installation Nuria CATALAN LASHERASSerge, Andrey, Philipp de S., Philipp G., Anastasiya, Nuria, Maria

19 Power test Nuria CATALAN LASHERAS Anastasiya, Nuria, Maria

Write procedure After each manufacturing step:

Close the MTF step Attach result file

Open Non conformity in not ok

Define manufacturing sequence Approve procedures

Coordinate between steps Discuss and decide on NC actions


















MTF. M. Filippova

RF measurements and tuning. R. Wolf, B. Woolley Baking requirements. M. Taborelli




N. C

atal

an L

ash

eras

4 Port VNA

TWS input ports

contact thermometer

TWS output ports

V-block

discs clamped together

62

clamping device

high-quality measurement cables

1/12/2015

X-band Accelerating Structure Review

RF measurements before bonding R

F M

easu

rem

ents

an

d T

un

nin

g. A

. Oly

un

in,

R. W

egn

er, B

. Wo

olle

y

Expected vs measured reflexion R

F M

easu

rem

ents

an

d T

un

nin

g. A

. Oly

un

in,

R. W

egn

er, B

. Wo

olle

y

Ok for Bonding

2. RF measurements before tuning

64

note:

strong standing wave caused by detuned output coupler detuning

1/12/2015

RF

Mea

sure

men

ts a

nd

Tu

nn

ing.

A. O

lyu

nin

, R

. Weg

ner

, B. W

oo

lley

Tuned structure and tuning record R

F M

easu

rem

ents

an

d T

un

nin

g. A

. Oly

un

in,

R. W

egn

er, B

. Wo

olle

y

Discusion and Conclusions

• Use the same pins for all structures.

• Verify that tuning is preserved after baking

– Next structure TD26_CC to be re-measured after baking

• Need statistical study of tuning for all structures up to know

– To validate the CLIC baseline (no tuning)

– To evaluate the assembly quality,

• No correlation found between tuning records and disks/cells geometry errors.

– Possibly most errors are produced by assembly

– TBC. Only one structure has been done.

RF

Mea

sure

men

ts a

nd

Tu

nn

ing.

A. O

lyu

nin

, R

. Weg

ner

, B. W

oo

lley


















MTF. M. Filippova


Baking requirements. M. Taborelli Systematic analysis done on existing samples. A. Perez Fontenla

…..



N. C

atal

an L

ash

eras

Baking requirements B

akin

g re

qu

irem

ents

. M. T

abo

relli

H2 H2

-0.5 0.0 0.51.194x10

-4

1.196x10-4

1.198x10-4

1.200x10-4

C (

% w

t)

x (cm)

1309 K

1305 K

1301 K

1297 K

1293 K

1289 K

1285 K

1281 K

1277 K

1273 K

1269 K

Ramp down, 4K/min

-0.5 0.0 0.51.40x10

-9

1.45x10-9

1.50x10-9

1.55x10-9

1.60x10-9

C (

% w

t)

x (cm)

10 d

5 d

2 d

1 d

10 h

8 h

Heat treatment after bonding

Changes after 8h are only in 1e-10 of concentration!

Degassing data from PSI structure N

. Cat

alan

Las

her

as

Discussion on baking

• According to simulations work 10 hours would be sufficient to eliminate H2 in the copper bulk.

– Sample is thin (1cm) and may not be representative?

• Data from PSI structure seems to indicate that degassing is not that fast.

– Significant reduction after 12 hours

• Refurbished degassing oven in building 101 has been equipped with gas analyser. Action Ivo

– Data to be taken on the next cycles. TD26CC on January

– With and without structure

N. C

atal

an L

ash

eras


















MTF. M. Filippova




Manifolds assembly. D. Gudkov SiC to copper brazing. A. Solodko

N. C

atal

an L

ash

eras

Manifolds assembly. D. Gudkov M

anif

old

s as

sem

bly

. D. G

ud

kov

Serge Lebet, Vadim Soldatov

Brazing tests M

anif

old

s as

sem

bly

. D. G

ud

kov

Samples cut from the quarters M

anif

old

s as

sem

bly

. D. G

ud

kov

Alternatives to manifolds. Discussion

• First of this kind in CLEX now.

• TD24_SiC being manufactured slightly differently

• Putting manifolds and SiC in vacuum tank could also be a possibility

• Integrated disks

– Very accurate shape of the external reference is a bigger problem for these disks.

– First samples arrived

Study is under way

Man

ifo

lds

asse

mb

ly. D

. Gu

dko

v

Waiting for TD24_SiC experience


















MTF. M. Filippova






N. C

atal

an L

ash

eras

Needs for SiC to Cu joining Si

C t

o C

u b

razi

ng.

A. S

olo

dko

AS with damping material

RF GATE VALVE

Crack

Undergoing study by Igor and Anastasiya

Conclusions

• Procedures are now fully known and justified. Ongoing with the authors. – Need to make the point in January

• Industry-ready specs need to define a clear QA • Some slides from Anastasiya

– Immediate changes, to be implemented from next year – Follow-up items to be defined during the following months – Long term studies

• We make prototypes to prove CLIC baseline – No compromises – Conditioning is as important as hig gradient

• Faster feedbak – Changes that may impact bonding quality will be tested in simple disks

in the oven. – Changes that may impact high gradient will be first tested on

electrodes

• Larger and faster interaction with other work packages

N. C

atal

an L

ash

eras

Thanks!

N. C

atal

an L

ash

eras

A

S re

view

24

.11

.20

14

Date post:	25-Feb-2021
Category:	Documents
Upload:	others
View:	3 times
Download:	0 times

Wrap up Xband accelerating structures review 24-25.11 · • Describe/put together existing...

Documents