Www.isola-group.com Isola Technology and Product Update June 2005.

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Isola

Technology and Product Update

June 2005

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Isola Product Technology Roadmap

Isola Lead Free, FR4 Replacement Product Solutions

Isola High Speed, Signal Integrity Product Solutions

Reliability

Overview of Isola Test Capabilities

Isola Technology Agenda

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Isola Technology Overview

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High Speed Digital- High Gbps Data rates.- High Clock speeds

Optical Solutions- 5-10 Gbps data rates and beyond

Lead free and Thermal Reliability Higher Thermals Higher Thermal Cycling resistance

Miniaturization- Thinner Dielectrics- Embedded passives- Packaging

Thermal Management- Thermal conductive Substrates

Environmental- Halogen Free

Manufacturing and Process Technology

Emerging Trends

Signal Integrity

Lead Free

www.isola-group.com* Speeds a function of design such as line length etc.

**Laminate Data- IST performance is a function of Hole dia/board thickness,plating parameters and laminate attributes.

Isola’s Product offering- High Tg High performance

IS420IS420

Th

erm

al Perf

orm

an

ce T

26

0/

Deco

mp

./IS

T

Electrical Performance Loss /DK

FR406 High Tg 170° Epoxy


IS410 180° TgIS410

180° TgFR408 180Tg Low

Dk & DfFR408 180Tg Low

Dk & DfIS640 Next Generation

Low Loss-.005IS640 Next Generation

Low Loss-.005

P96 260 Tg Polyimide V0/V1


G200 BT EpoxyLaminate


P95 260 Tg Polyimide HBP95 260 Tg

Polyimide HB

Telecom

Higher Reliability

High Speed Digital / Base stations/Routers/Servers/Burn

in

Military/Computers/drilling

1 -1.5Gbps *

1.5-2.0 Gbps *

Low Freq and speed

T260 -10 Mins/Td.300*

*

T260 -60 Mins/Td.350*

*

High Speed /High Frequency

2.5-10 Gbps*

T288 -60 Mins/Td.400*

*

IS415IS415

L e a d Free

IS620 Tg 215 Low Loss.008 @10 Ghz LaminateIS620 Tg 215 Low Loss.008 @10 Ghz Laminate

IS625IS625

IS500IS500

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Pe

rfo

rman

ce Isola Product Offering

ApplicationFR-4FR-4ED130

Tg 130 FR-4 Multifunctional

Tg 130 FR-4 MultifunctionalED130UV

Tg 140Multifunctional

Tg 140Multifunctional

FR402/DE114

Tg 150 HalogenFree Laminate

Tg 150 HalogenFree LaminateDE156

High Tg 170° Epoxy

High Tg 170° Epoxy

FR406/DE117

High Tg Lead free Signal Integrity

High Tg Lead free Signal Integrity

FR408

IS640

Tg 180 LowDk & Df

Tg 180 LowDk & Df

Tg 215 Low Loss.008 @10 Ghz Laminate

Tg 215 Low Loss.008 @10 Ghz Laminate

Next Gen Low Loss -.0035 @10GHz-

Next Gen Low Loss -.0035 @10GHz-

P95Tg 260 Polyimide

Laminate HBTg 260 Polyimide

Laminate HB

BT / EpoxyLaminate

BT / EpoxyLaminate

IS415

G200

FR406BCIS410 BCFR408 BC

Buried CapacitanceApplications

Buried CapacitanceApplications

IS620

Low Flow No FlowLow Flow No FlowFR406 NF/A11

Tg 260 PolyimideLaminate V0/V1

Tg 260 PolyimideLaminate V0/V1P96

Chip Packaging Chip Packaging

IS420/IS410

Thermal ConductiveThermal ConductiveIS450

High Tg 180° Halogen free

High Tg 180° Halogen free

IS500

High Tg Lead freeHigh Reliability

High Tg Lead freeHigh Reliability

IS420

IS640-300 Low LossIS640-300 Low Loss





RF

&M

IC

RO

WA

VE

Tg 150 Lead Free High Reliability

Tg 150 Lead Free High Reliability

IS400

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Signal Integrity- Overview

• Drivers• Overview of Technical issues

– High Speed Basics– Key definitions– Measurements– Time domain measurements

• Losses– Dielectric losses– Conductor losses– Conductor roughness losses

• Frequency domain measurements• Isola offering• Product selection criteria

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Enterprise applications- OC-48 (~2.5Gbps),OC-96(~5 Gbps)

High End MultiGigabit and Terabit RoutersFast Edge rates

Moore’s Law -HighEnd Servers, HighEnd Computers

Low Dk, Low DfProducts

Wireless and RF applications- 3 G base stations,Bluetooth, 802.11, Automotive electronics,

Collision avoidance systems

Drivers - High Speed and High Frequency

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High Speed digital communication involves sending bits of information coded on Trapezoidal waveforms.

The Information - Zeros and ones are coded on the rise time or on both the rise time and fall time. High Voltage is 1 and Low voltage is zero The conductive paths between a chip that sends a signal to the chip that receives a signal are called

interconnects, A group of interconnects represents a bus

The sharper the Rise time the faster the signal

To achieve faster rise times Sinusoidal wave forms are superimposed on one another.

The range of frequencies used is called bandwidth

The bandwidth is given as =0.35/Rise time

Example a 2.5 Gbps signal with a rise time of 70 Ps will have a fundamental frequency = 1.25 Ghz and a second cut off frequency of 4.5 Ghz and a 2.5 Gbps signal with a rise time of 125 Ps will have a fundamental frequency equal to 1.25 Ghz and a bandwidth or second cut off frequency = 2.5 Ghz.

Frequency is a function of Data rate and bandwidth is a function of Rise Time

High Speed Digital basics

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Time-domain definition of a periodic digital clock signal with analog definitions of rise time, fall time, and duty cycle.

From Practical RF circuit Design for Modern Wireless systems Vol1 – Les Besser and Rowan Gilmore

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Digital detector output signal - eye diagram - shows the effect of random jitter. A large eye amplitude and small difference between bit window and eye duration are necessary

for low bit error rate.

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• Height of the central eye opening measures noise margin in the received signal

• Width of the signal band at the corner of the eye measures the jitter

• Thickness of the signal line at the top and bottom of the eye is proportional to noise and distortion in the receiver output

• Transitions between the top and bottom of the eye show the rise and fall times of the signal

The “Eye”

One Bit Length

Signal withNoise

Good Sampling Period

NoiseMargin

Jitter

Noise

Eye Pattern Analysis

Reference: Handbook of Fiber Optics

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0 2000 4000 60006400Time (ps)

Unbalanced stripline Vtime source

0

100

200

300

400

500Vtime[PORT_2,1,1] (mV)Unbalanced Stripline

After 40 inches through 406

A 10 Gbps signal at source

0 2000 4000 60006400Time (ps)


-200

0

200

400


0 2000 4000 60006400Time (ps)


0

100

200

300

400


After 40 inches through IS640

The effect of Laminate substrate on Signal integrity

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Isola Products and Signal integrity in time domainSimulated Eye Diagrams @ 5 Gbps -1 M -50 Ohms impedance 5 Mil Track width PRBS 35 PS Rise

time At Source Zero Dielectric Loss IS640 Df =.004

IS620 DF=.008 FR408 DF=.012 FR4 Df =.020

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- 2.00 4.00 6.00 8.00 10.00

Data Rates on PCB's Gbps

OC-3 Fast Ethernet

Fibre Channel

Gigabit Ethernet

OC-48

OC-96

OC-192

App

licat

ions

High Speed Digital Drivers

•Trends Trends •Rising Bandwidths- Bandwidth Approx.=0.35/Rise timeRising Bandwidths- Bandwidth Approx.=0.35/Rise time

•Faster edge rates ----> 35 PS and lowerFaster edge rates ----> 35 PS and lower

•High Data rates 10 Gbps/ 4 Channels at 3.125 GbpsHigh Data rates 10 Gbps/ 4 Channels at 3.125 Gbps

•Longer Lines up to 1 M longLonger Lines up to 1 M long

•Narrower lines with higher conductor lossNarrower lines with higher conductor loss

Rise Time Vs Bandwidth and Data rates

0.200.62

1.20

2.50

5.00

-

1.00

2.00

3.00

4.00

5.00

6.00

7.00

600 350 200 100 50

Rise Time PS

Date

Rat

e G

bps

and

Band

wid

th G

hz

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Lossy transmission line Model

Characterisitic impedance Zo = √(R+JwL)/(G+JwC)

R and G are not negligible

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What is attenuation (loss)?

20 Log Vout / Vin = Loss in dB

γ=α+ iβWhere α is the attenuation co-efficient and β is the phase related co-

efficient

• The Voltage of a signal drops exponentially as the energy is absorbed in the dielectric medium, dissipated

as conductor loss and radiated

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The effect of Df on Loss db/m simulated on a 5 mil line

-35

-30

-25

-20

-15

-10

-5

0

0.0250 0.0200 0.0140 0.0100 0.0080 0.0050 0.0020

Dissipation factor

Lo

ss d

B/m

Dielectric loss

αDieletric

(in dB) approx =2.3 *f(In Ghz) *df* √Dk

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Conductor loss

The Effect of Line width on overall loss for Dash-13 and IS620

(20.4)

(16.7)

(14.4)(13.3)

(11.54)(12.45)

(18.61)

(14.92)

(25.000)

(20.000)

(15.000)

(10.000)

(5.000)

-

3 Mils 5 Mils 8 Mils 10 Mils

Line Width Mils

Lo

ss

s d

B/m

Dash-13

IS620

•Wider lines are less lossier due to reduced skin effectWider lines are less lossier due to reduced skin effect•A lower loss product like IS620 allows the designer to use thinner lines. A lower loss product like IS620 allows the designer to use thinner lines.

αConductor

(in dB/inch) approx =36/(w(line width in mils)*Z0(impedance) )* √ f(In Ghz)

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Effect of Conductor RoughnessSkin Depth Microns vs Frequency GHz Copper

-

0.500

1.000

1.500

2.000

2.500

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Frequency GHz

Ski

n D

epth

Mic

ron

s

Surace roughness vs Conductor loss at 10 GHz -5 Mil Stripline

-

0.100

0.200

0.300

0.400

0.500

0 1 2 3 4 5 6

Roughness Microns

dB

/In

ch

Conductivity S/ M Copper vs surface roughness

0.00E+001.00E+072.00E+073.00E+074.00E+075.00E+076.00E+077.00E+07

0 1 2 3 4 5 6

Roughness Rms Microns

Co

nd

uct

ivit

y S

/M

Surface roughness difference between 1 and 5 Microns = Dielectric loss tangent of 0.0028 –approx - 28-30 % of the dielectric loss

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High Speed Products- Microstrip 8 mil dB/Inch Loss

0.000

0.100

0.200

0.300

0.400

0.500

Frequency GHz

Lo

ss

dB

/Inc

h

IS620 GETEK I N4000-13 N4000-13SI PCL-LD-621

IS620 0.075 0.100 0.122 0.144 0.161 0.181 0.198 0.217 0.234

GETEK I 0.096 0.132 0.170 0.204 0.238 0.272 0.300 0.328 0.360

N4000-13 0.085 0.121 0.156 0.190 0.225 0.258 0.290 0.319 0.349

N4000-13SI 0.084 0.128 0.164 0.200 0.236 0.269 0.303 0.338 0.372

P CL-LD-621 0.092 0.131 0.170 0.209 0.248 0.288 0.325 0.363 0.404

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

• IS620 is the best in class product for dissipation factor

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High Tg Standard Products- Microstrip 8 mil dB/Inch Loss

0.0000.100

0.2000.300

0.4000.500

0.6000.700

0.800

Frequency GHz

Lo

ss

dB

/Inc

h

FR406 IS410 IS415 IS500 PCL-370HR

FR406 0.113 0.147 0.185 0.218 0.249 0.281 0.313 0.344 0.379

IS410 0.145 0.201 0.260 0.318 0.372 0.429 0.484 0.538 0.592

IS415 0.107 0.147 0.182 0.218 0.250 0.281 0.310 0.340 0.369

IS500 0.111 0.155 0.197 0.238 0.278 0.316 0.355 0.395 0.433

P CL-370HR 0.154 0.222 0.293 0.365 0.436 0.506 0.577 0.645 0.708

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

• FR406 and IS415 are best in class - Loss close to Getek type products• PCL 370 HR is the highest loss product in this category

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Loss dB/m 50 Ohm Striplines at Various Line widths 70 Ps rise time-5 Ghz. - Calculated data

(35.000)

(30.000)

(25.000)

(20.000)

(15.000)

(10.000)

(5.000)

-

IS 410 FR406 Getek Dash-13 IS 620 IS 640 PTFE

3 Mils Db/m 5 Mils Db/m 8 Mils Db/m 10 Mils Db/m

•Line Lengths and widths dictate the use of materialsLine Lengths and widths dictate the use of materials•More & More Standard materials will be used More & More Standard materials will be used •Focus on equalization technologiesFocus on equalization technologies•Key factors will be the ability to predict accurately P.U.L characterisitcs Key factors will be the ability to predict accurately P.U.L characterisitcs •While Dielectric losses dominate at higher speedsWhile Dielectric losses dominate at higher speeds•Copper losses are not insignificant- Focus on Lower tooth profileCopper losses are not insignificant- Focus on Lower tooth profile

Material Challenges

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Isola Roadmap High Speed/High Frequency

• Enabling High Speed Digital Speeds beyond 10 GbpsEnabling High Speed Digital Speeds beyond 10 Gbps• Low Dk / Df Solutions with Conventional Process Friendly TechnologiesLow Dk / Df Solutions with Conventional Process Friendly Technologies• Flat Df Response vs. Frequency for Higher Signal IntegrityFlat Df Response vs. Frequency for Higher Signal Integrity

ID High Speed and High Frequency Development and Launch2002 2003 2004 2005

Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3

1 FR408 Low DK Mid Loss

2 IS620 Low DK Low Loss -.008 @ 10 Ghz.

3IS640 Low DK Very Low Loss Df-.0045@ 10 GHz for RF andvery High speed Digital applications

4IS625 Very Low Loss Very High Tg Product for very highspeed

5 Very Low Loss Low DK product -0.0025 @ 10 GHz

Isola Product Applications *IS410 Short and wide lines suitable for low Gb/s FR406 Longer lines suitable for low Gb/s- Have seen designs upto 3 Gb/s -20 Inch linesIS500 Halogen Free Product suitable for Mid Gb/s FR408 Low DK DF suitable for Medium to High Gb/s upto 40 InchesIS620 Low Dk Lower DF product suitable for High Gb/s upto and beyond 40 inchesIS625 Very High Tg product suitable for high to very High Gb/s long linesIS640 Very Low Loss Porduct suitable for very high Hig Gb/s and RF Microwave apps.IS6-- RF applications, long Antenna

* Highly Design dependent

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Selection –High speed products

• Key design factors in selecting products for very high speed applications

– Data rates• Higher data rates require the use of Lower DF products

– Faster Rise times• Lower DF

– Higher Frequency range or bandwidth• Stable Dissipation factor over frequency and lower DF

– Thinner packages• Narrower Lines- Lower DK and Lower Dissipation factor

– Large Backplanes • Longer lines- Lower dissipation factors

– Error correction- Predictable PUL properties• Equalization-• Pre emphasis

– Reliability• Higher CAF, Thermal Cycling and Lead free assembly compatibility

– Cost – Extendibility and scalability

• Lower dissipation factor

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• Overview Lead free assembly

• Overview Thermal Analysis

• Thermal Resistance

• Thermal Cycling Resistance

• Isola Lead free product offering

• Product selection for Lead free assembly

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Overview

• Restriction of Hazardous Substances• Legislation bans the following Six substances for

shipment to EU countries – effective July 1 -2006– Lead– Mercury– Hexavalent Chromium( Cr6+)– Polybrominated biphenyl– Polybrominated diphenyl ether

– Cadmium

• High End Networking companies exempt

Max Conc. By Wt. < 0.1 %

Max Conc. By Wt.< 0.01 %

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Liquidus and Reflow Temperatures of Candidate Lead-Free Solder alloys for Replacing Eutectic Tin-Lead Solder

Alloy CompositionLiquidus Temp. (ºC) Reflow Temp (ºC) Melting Range (ºC)

Sn-2Ag 221-226Sn-3.5Ag 221 240 – 250Sn-0.7Cu 227 245 – 255Sn-3.0Ag-0.5Cu* 220** 238 – 248Sn-3.2Ag-0.5Cu 218 238 – 248 217-218Sn-3.5Ag-0.75Cu* 218 238 – 248Sn-3.8Ag-0.7Cu 220** 238 – 248 217-210Sn-4.0Ag-0.5Cu 217-219Sn-4.0Ag-1.0Cu* 220** 238 – 248 217-220Sn-4.7Ag-1.7Cu* 244** 237 – 247

Sn-5Sb 232-240Sn-0.2Ag-2Cu-0.8Sb* 285** 246 - 256 226-228%

Sn-2.5Ag-0.8Cu-0.5Sb* 225 233 – 243

Sn-2Ag-7.5Bi* 216** 220 – 230Sn-3Ag-3Bi* 218** 233 – 243Sn-3Ag-5Bi* 216** 230 – 240Sn-3.4Ag-4.8Bi* 215** 225 – 235 200-216Sn-3.5Ag-3Bi* 217** 230 – 240

Sn-58Bi 138Sn-3.2Ag-1.1Cu-3Bi* 240** 230 – 240Sn-3.5Ag-3In-0.5Bi* 215** 230 – 240Sn-3Bi-8Zn 189-199

Patented compositions; may require licensing or royalty agreements before use. **For more information see: Phase Diagrams & Computational Thermodynamics, Metallurgy Division of Materials Science and Engineering Laboratory, NIST.

Source : NIST Website

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Property DefinitionMinimum Acceptance

Level

Liquidus temperatureTemperature at which solder alloy is completely molten

Pasty RangeRange of temperature between solidus and liquidus, where alloy is part solid and part liquid. < 30 (ºC)

Wettability

Assessed by force required to wet a copper wire with molten solder. A large force indicates good wetting, as does short duration t0 at zero wetting force and time t2/3 to reach two thirds of maximum wetting force.

Fmax > 300 uN t0 < 0.6 s t2/3 < 1 s

Area of Coverage Measures coverage of copper test piece by solder > 85 %

Drossing

Measured by amount of oxide formed in air on surface of molten solder after a fix duration at soldering temperature Qualitative

TMF

Lifetime at a given failure rate compared to that of (eutectic) Sn/37Pb, for a specific configuration of board and solder joint

> 75 %

Thermal Mismatch

Difference in coefficients of thermal expansion that causes unacceptable thermal stress < 29 ppm/ºC

CreepStress load to failure at room temperature, in 10,000 minutes (~167 hours) > 500 psi

Yield Strength >2000 psi

ElongationRelative elongation of material under uniaxial tension at room temperature > 10 %

Criteria for Down-Selection of Alloys

Source : NIST Website

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Thermal Resistance Drivers - Lead Free

Legislation driven < 1000 PPM of lead. Lead Free Solders

- Ternary alloys of Tin/Silver /Copper- Average reflow temperature 20-40 Deg C higher

Melting Points and reflow temperature Lead free Vs Tin-lead

183

218

227

218

227

215

243

250

243

250

150 170 190 210 230 250 270

Sn/37Pb

Sn/3.5Ag/0.75 Cu

Sn/0.75Cu

Sn/3.2Ag/0.5 Cu

Sn/0.7Cu

Mp Deg C Reflow Temp Deg C

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Lead Free Laminate Attributes

Sn/Pb37 Reflow

Lead Free ~Reflow

Time to delam based on Arhennius plot

1

10

100

1,000

10,000

225 235 245 255 265 275

Temp Deg C

Tim

e M

ins

IS620 IS410/IS415 FR406

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Thermal Analysis Overview

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Overview DSC / TMA / DMA /TGA

• Isola ASL equipment • Dual cell DSC with autosampler• Dual Cell DSC• Pressurized DSC/Dual cell DSC with autosampler• TMA• TGA• DMA• Test Method• DSC

– IPC-TM-650 2.4.25 Glass Transition and Cure Factor by DSC

• TMA– IPC-TN-650 2.4.24 Glass Transition and Z-axis Thermal Expansion by TMA

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DSC: Differential Scanning Calorimetry Definitions

• DSC measures the temperatures and heat flows associated with transitions in materials as a function of time and temperature in a controlled atmosphere.

• These measurements provide quantitative and qualitative information about physical and chemical changes that involve endothermic and exothermic processes, or changes in heat capacity.

• A DSC measures the heat into or out of a sample relative to a reference while heating the sample and reference with a linear temperature ramp.

• Endothermic: Heat flows into the sample.• Exothermic: Heat flows out of the sample.• What is happening to the sample?• As the sample is heated, it absorbs energy

in order to change the temperature of the sample

• Energy units (W/g) Watts per gram of sample.

Principle of Operation

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Glass Transition

• A sample goes through the Glass Transition when the amorphous or not crosslinked areas change to (or from) a viscous or rubbery condition to (or from) a hard and relatively brittle condition

• This is a fully reversible change• The glass transition takes place over a

temperature range.• The glass transition temperature (Tg)

is a temperature chosen to represent the temperature range over which the glass transition takes place.

• NOTE: FIRST AND SECOND RUNS ARE DONE ON THE SAME PIECE OF SAMPLE

• Delta Tg = Tg(run 2) - Tg(run 1)• What does a Delta Tg tell us?• Degree of Cure of the Laminate or

Printed Wiring Board• Printed Wiring Board

– All parts are cured equally

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DSC:Interpretation

181.18°C

-0.4

-0.2

0.0

0.2

0.4

De

riv.

He

at

Flo

w (

W/g

/°C

)

-13

-12

-11

-10

-9

-8

He

at

Flo

w (

W/g

)

100 120 140 160 180 200 220

Temperature (°C)

Sample: 00-03-1699-15 FR-406Size: 1.0000 mgMethod: METHOD7-3Comment: T-102 20c/MIN

DSCFile: C:\TA\Data\DSC\.3-1699.015Operator: CASSIERun Date: 27-Aug-00 10:22

Exo Up Universal V2.5H TA Instruments

Selection of TG – First derivative

179.45°C(H)

-13

-12

-11

-10

-9

-8

Heat F

low

(W

/g)

120 140 160 180 200 220

Temperature (°C)


DSCFile: A:\DerivOperator: CASSIERun Date: 27-Aug-00 10:22


Selection of TG – Half height -Isola

155.87°C(I)

-13.0

-12.5

-12.0

-11.5

-11.0

-10.5

-10.0

He

at

Flo

w (

W/g

)

100 120 140 160 180 200

Temperature (°C)


DSCFile: C:\TA\Data\DSC\.3-1698.013Operator: CASSIERun Date: 26-Aug-00 10:07


Selection of Tg - Inflection

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TMA – Thermo Mechanical Analysis • TMA measures linear or volumetric changes in the dimensions of a sample as a

function of time, temperature, and force in a controlled environment.• As the sample is heated, the material expands according to it’s Coefficient of

Thermal Expansion (CTE)• Upon reaching its decomposition temperature (Td) delamination occurs• TMA: Measurements

– Glass Transition Temperature (Tg)– Temperature of Decomposition (Td)– Time to Decomposition at 260C (T-260)– Time to Decomposition at 288C (T-288)– Coefficient of Thermal Expansion (CTE)

• X, Y & Z Axis• Below Tg, Above Tg & Overall (20 - 288C)

• Tg measurement• Materials exhibit a dramatic increase in CTE as it goes through the Tg region.• Measurement of the onset of the change determines the Tg• Temperature at which delamination of the sample occurs• Analysis can be obtained from 2nd scan Tg• Decomposition temperature• Measurement of onset of the dramatic change in probe position determines the Td

• Similar onset analysis to T-260 T-288

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TMATMA : Typical 1 St Run Chart

TMA : Typical 2nd Run chart

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Sample time at temperature before delamination occurs

Typical temperatures are 260C and 288C

Sample is heated at 100C/min to the desired temperature and quickly equilibrated

Sample is then held isothermally at the desired temperature until delamination occurs

T-260(288) = Time(delam) - Time(temp equilib)

TMA T-260 T-288 Method variations Other laboratories heat sample

at 10C/min Side by side testing of

100C/min v 10C/min shows no measurable difference between the two methods

TMA: T-260 & T-288Typical TMA Decomp Curves

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TGA Thermogravimetrical Analysis

• TGA measures the amount and rate of change in the weight of a material as a function of temperature or time in a controlled atmosphere.

• Instrument made up of extremely sensitive balance within a controlled atmosphere

• TGA: What is happening to the sample?

• As the sample is heated, volatiles escape causing a loss of weight in the sample.

• Upon decomposition, a dramatic weight change occurs.

• TGA Measurements• Temperature at which x percent of

weight is lost• Decomposition Temperature (Td)

TGA Typical Curve

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DMA-Dynamic Mechanical Analysis

• The periodic application of stress and strain to the material as the temperature is varied.• Measurement of the modulii of the material provides important physical information for the

material as well as the Tg• Storage modulus: Measurement of the materials ability to store energy• Loss modulus: Measurement of the materials ability to dissipate energy• Tan Delta: Ratio of the storage modulus to the loss modulus• What is happening when the sample is being heated?• While the sample is being heated, it is physically displaced from parallel by a set force, to a set

amplitude at a set frequency• The instrument measures the samples resistance to displacement and its ability to return to its

original position.• These properties change as the temperature of the sample is changed

– Sample becomes more elastic as it goes through the glass transition range– If cross-linking is occurring during the temperature increase, the sample becomes more rigid.

• Measurements• Glass Transition Temperature (Tg)• Delta Tg• Modulus information• Two most common methods for selecting the glass transition temperature

– Onset of the Storage Modulus– Peak of the Tan Delta

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DMA: Transitions

12000

14000

16000

18000

20000

22000

24000

Sto

rag

e M

od

ulu

s (

MP

a)

0.00

0.01

0.02

0.03

0.04

0.05

0.06

Ta

n D

elta

60 80 100 120 140 160 180 200 220

Temperature (°C)

Sample: 00-01-0373-01 FR-408Size: 14.5500 x 8.7700 x 0.3100 mmMethod: 70 TO 220 @3Comment: T-098

DMAFile: C:\TA\Data\DMA\1-373.001Operator: CASSIERun Date: 1-Sep-00 14:19

Universal V2.5H TA Instruments

Broad Transition

186.63°C

170.92°C

20000

40000

60000

80000

100000

120000

140000

160000

Sto

rag

e M

od

ulu

s (

MP

a)

0.0

0.1

0.2

0.3

Ta

n D

elta

60 80 100 120 140 160 180 200 220

Temperature (°C)

Sample: 00-01-0370-02 fr-408aSize: 14.5500 x 10.6750 x 0.2720 mmMethod: 70 TO 220 @3Comment: T-098

DMAFile: C:\TA\Data\DMA\1-370.002Operator: CASSIERun Date: 31-Aug-00 08:22


Typical DMA curve

7000

8000

9000

10000

11000

12000S

tora

ge

Mo

du

lus (

MP

a)

0.00

0.02

0.04

0.06

0.08

Ta

n D

elta

60 80 100 120 140 160 180 200 220

Temperature (°C)

Sample: 00-01-0373-01FR-408Size: 14.5500 x 8.5200 x 0.4600 mmMethod: 70 TO 220 @3Comment: T-098

DMAFile: C:\TA\Data\DMA\1-373.101Operator: CASSIERun Date: 5-Sep-00 07:57


Increasing Cure

93.35°C

135.03°C

145.08°C

0

5000

10000

15000

20000

25000

Sto

rag

e M

od

ulu

s (

MP

a)

0.02

0.04

0.06

0.08

0.10

0.12

0.14

0.16

Ta

n D

elta

40 60 80 100 120 140 160 180

Temperature (°C)

Sample: 00-08-1244-01.0058 65MG2T C1/00Size: 26.6000 x 10.1900 x 1.4800 mmMethod: 50 TO 180 @3Comment: T-098

DMAFile: C:\TA\Data\DMA\8-1244.001Operator: CASSIERun Date: 22-Aug-00 09:06


Multiple Transitions

www.isola-group.com

Thermal Resistance and Lead-Free

www.isola-group.com

Thermal Resistance- Drivers

Drivers

Process conditions

Lead Free

OEM reliability requirements.

Failure mechanism - Matrix Decomposition and De-lamination

www.isola-group.com

Laminate factors

Td- Decomposition temperature of laminate measured by weight loss by TGA. Function of Resin Chemistry

T-260,T-288 - Resistance to De-lamination at elevated temperatures. This follows a Power law. Function of Resin Chemistry and board design.

Tg - Marginal effect

Thermal Resistance - Laminate factors

www.isola-group.com

Thermal Cycling Resistance

www.isola-group.com

• Drivers

• OEM reliability requirements due to harsh service conditions

• Failure mechanism - Mainly metal Fatigue

Thermal Cycling Resistance-Drivers

www.isola-group.com

• Tests - Simulated tests such as

• IST – Electrically heating interconnects in cycles of 3 minutes and cooling

• HATS-Air to Air

• Liquid to liquid and other cycling tests

Thermal Cycling Resistance -Tests

www.isola-group.com

• Laminate factors– CTE Z axis - Lower CTE reduces Stresses

on the interconnect – Modulus in the Z-direction, Poisson ratio,

Lower Modulus helps reduce the Stress. – Tg (TMA) - Higher Tg – Thermal resistance - Higher Thermal

resistance avoids degradation during pre conditioning or actual process. May over ride other factors

Thermal Cycling Resistance-Laminate Factors

www.isola-group.com

• Board design factors– Ductility of the copper - Higher is better – Thickness of the board – Hole diameter- Smaller holes and higher

aspect ratio reduce cycles to failure.– Plating Thickness and quality

Thermal Cycling Resistance-Fabrication Factors

www.isola-group.com

A Typical S-N diagram

0

100

200

300

400

500

600

700

800

900

1.0E+00 1.0E+01 1.0E+02 1.0E+03 1.0E+04 1.0E+05 1.0E+06 1.0E+07

Cycles to failure

Fa

tig

ue

Str

en

gth

Low Cycle fatigue

Finite life

Infinite life

Reliability Roadmap - Thermal Cycling - Drivers

Average thermal cycling conditions may not push copper into plastic range

Higher strains during preconditioning IST change the failure mechanism

www.isola-group.com

100 1000

1

2

3

5

10

20

30

40 50 60 70 80

90 95

99

Time to Failure

Per

cent

Probability Plot for 9.8 milWeibull Distribution - ML Estimates - 95.0% CI

Complete Data

ShapeScale

MTTFStDev

MedianIQR

FailureCensor

AD*

5.2506 353.32

325.33 71.258

329.50 97.313

17 0

0.8697

efficient -co strength fatigue the is F

efficient -coductility fatigue the is F

σ'

ε'

Where

strain Plastic strain elastic

cNbN

equationMansonCoffin

FF )^2(')^2('2/

Thermal Cycling Resistance-Data presentation

www.isola-group.com

Typical Stress Strain Curve

Copper has a modulus = 17.6 E6 Psi and a Yield strength of 30Ksi which means it reaches its Yield point at < 0.2 % elongation or 35 Deg C excursion on a board

www.isola-group.com

• Cu Layer – Elastic/Plastic

ECu = 15.6x106 psi, y,Cu = 20,000 psi, CTECu=17x10-6/oC

• Composite Substrate – Linear Elastic

Esubstrate=15 GPa, CTEsubstrate=80x10-6/oC (RT-180oC), CTEsubstrate=320x10-6/oC (180-288oC)

Material Properties of Cu Layer and Composite Substrate

21oC

260oC

Time

Temperature

150oC

Simulated Thermal Cycles

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What attributes do we need for Thermal cycling resistance?

• Laminate factors

– CTE Z axis - Lower CTE reduces Stresses on the interconnect

– Modulus in the Z-direction, Poisson ratio, Lower Modulus helps reduce the Stress.

– Tg (TMA) - Higher Tg

– Thermal resistance - Higher Thermal resistance avoids degradation during pre conditioning or actual process. May over ride other factors

Relative IST performance Isola Products

IS620 IS420 IS400 IS410 FR402 FR406 FR408Cy

cles

to fa

ilure

Modeling results show that the Overall Expansion, CTE and Preconditioning are biggest factors governing the IST performance

Isola’s Low expansion and High TMA Tg products such as IS620,IS420,IS400 perform better on Thermal cycling

IS400IS410 DE117FR408

www.isola-group.com

Higher Decomposition temperature

Higher than 340 Deg C

Higher T-260 performance

Higher than 60 minutes

Higher T-288 performance

Lower overall Z axis expansion

Less than 3.5 %

Low Wt loss at elevated temperature (Lower vols.)

What attributes do we need in a lead free product?

Isola Products and Reflow temps

FR406 FR402 G200 IS620 IS640 IS400 IS410 IS420 IS415 P95

Re

flo

w T

em

pe

ratu

re

Lead free reflow >=260 Deg C


FR408 IS625

Isola Products and Reflow temps

FR406 FR402 G200 IS620 IS640 IS400 IS410 IS420 IS415 P95

Re

flo

w T

em

pe

ratu

re



FR408 IS625

www.isola-group.com

Precondition: 6x - 260C; 0.010” PTH; 0.100” MLB Thickness

0

200

400

600

800

1000

Ave

rage

Cyc

les-

To-

Fai

lure

IS400 IS410 IS415 IS420 FR408 IS620

IST Performance by Isola Product

Acceptable service life

*Based on Published papers and discussions with fabs and OEM’s

High Performance

Very High performance

Very High Thermal strains

www.isola-group.com

Isola Lead Free Compatible Laminate Product Offering

I S400 DE156 I S410 I S420 I S415 I S500 FR408 I S620 I S640-D P95 P96/ P97*

Description150 Tg Filled

non dicyHalogen Free

150 TgPhenolic

Cured 170 Tg

Phenolic Cured Filled

170 Tg

Non Phenolic, Non Dicy-190

Tg170 Tg

Halogen Free180 Tg, Low DK Low Loss

215 Tg Low DK, Very Low

Loss

Very Low DK very Low

Loss>250 Tg

Polyimide HB

>250 Tg Polyimide V-

0/ V-1

ApplicationsAuto &

consumer Halogen Free High Rel.lead

freeVery High

Thermal rel.

High Speed, High

reliability

High Speed, High rel,

halogen freeHigh Speed Digital apps

Very High Speed Digital

Apps.

Very High Speed Digital

Apps.

Military/ Computers, Down Hole Drilling

Military/ Computers,

Lead Free Compatible Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes

Halogen Free No Yes No No No Yes No No No No NoCAF resistant Chemistry Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes

ROHS and WEEE Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes YesThermal Cycling rating-I ST/ TCT/ HATS Very High Very High High Very High Very High Very High High Very High High Very High Very High

Tg-DSC Deg C 150 150 175 170 190 170 180 215 225 >250 >250

X CTE PPm/ C below Tg 13 13 13 13 13 13 13 13 11 14 14

Y CTE PPm/ c below Tg 14 14 14 14 14 14 14 14 10 17 17

Z Alpha 1 CTE PPm/ C 45 45 60 40 55 50 65 55 NA 55 60

Overall expansion 20-288 Deg C Percent 3.00% 3.00% 3.50% 2.80% 2.90% 2.80% 3.50% 2.80% 3.60% 1.50% 1.50%

Decomposition temp Deg C Onset 330 380 350 340 370 400 360 353 350 416 382

T-260 Minutes 60 60 60 60 60 60 60 60 60 60 60

T-288 Minutes >5 >5 >15 >15 >20 >15 >15 >15 >10 60 60

Peel Strength lb/ inch >7.4 >6.3 >6.3 >6.3 >6.3 >6.3 >5.5 >6.3 >5.5 >6.3 >6.3

Peel Strength N/ mm >1.3 >1.1 >1.1 >1.1 >1.1 >1.1 >1.1 >1.1 >1 >1.1 >1.1

Dk -2 Ghz 4.00 4.00 4.00 4.00 3.90 3.90 3.60 3.60 3.0-3.6 3.90 3.90

Df-2 Ghz 0.0200 0.0200 0.0210 0.0200 0.0160 0.0160 0.0110 0.0080 <.0045 0.0170 0.0170

Dk-10 Ghz 3.90 3.90 3.90 3.90 3.80 3.80 3.55 3.55 3.0-3.6 3.80 3.80

Df-10 Ghz 0.0220 0.0220 0.0230 0.0210 0.0170 0.0170 0.0125 0.0080 <.0045 0.0200 0.0200

* Only For Europe

www.isola-group.com




Reliability



www.isola-group.com

Lead-free solderable

IS410

+ Low CTE

IS400

Phenolic epoxy

Tg 180C

CAF resistant

CTE – 3.5 % amb – 288 C

Td – 350C

T288 > 15 min

UL Approved

Phenolic cured, filled

Tg 150C

CAF resistant

CTE – 3.00 % amb – 288 C

Td – 330C

T288 > 5 min

UL Approved

IS420

Phenolic cured, filled

Tg 170C

CAF resistant

CTE– 2.80 % amb -288 C

Td – 340C

T288 > 15 min

UL approved

+ Low Df

IS415

Non-dicy, Non phenolic

Tg 190C

CAF resistant

CTE – 2.90 % amb - 288 C

Td – 370C

T288 > 20 min

UL approved

Applications : 6 x solder float, lead-free soldering

Applications : Severe thermal cycling, lead-free soldering

Applications : High data rate; Severe TCT, lead-free solder,

Isola Thermal Reliability Products

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Isola Product Ad

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Isola Lead Free Compatible Products

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IS400

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Features- Better Thermal Reliability With Non-dicy Cured Chemistry

- Excellent Z-axis Thermal Expansion - Excellent Solder Heat Resistance & Low Moisture

Absorption

- Higher Tg 150oC (DSC) Than Standard Epoxies

- Standard FR-4 Epoxy Processing

- UV Blocking & AOI Compatible

Applications- Computers, Servers, Workstations, Telecommunications,

Consumer Electronics & Automotives

IS400 Product Strengths

www.isola-group.com* For 0.71mm (0.028 Laminate, 38% Weight Resin Content

Item FR402 IS400

Tg (oC)

DSC

TMA

DMA

140 ± 5

135 ± 5

150 ± 5

150 ± 5

145 ± 5

155 ± 5

Z-axis CTE (ppm/oC)

Room Temp to Tg

Tg to 288 oC

Room Temp to 288 oC

70-80

270-330

150-170

40-50

180-240

120-140

Solder Dip @288oC (sec) > 60 > 180

Decomposition Temp (oC, TGA) 300-310 325-335

Time to Delamination (min, TMA)

T288

T260

1-5

10-15

10-15

> 60

IS400 Laminate Thermal Properties

www.isola-group.com

Thickness :0.028

Property Unit Condition IS400 FR402

Peel Strength (1oz)

Flexural Strength Length Cross

Volume Resistivity

Surface Resistivity

Dielectric Constant (500MHz)

Dissipation Factor (500MHz)

Water Absorption

Solder Dip @288oC

Glass Transition Temp. (DSC)

Flammability

lb/in

psi

.cm

-

-

%

sec

oC

-

A

A

C-96/35/90

C-96/35/90

C-24/23/50

C-24/23/50

D-24/23

A

A

UL94

6~8

70000 ~ 8000060000 ~ 70000

5x1014~ 5x1015

1x1013~ 1x1014

4.3

0.015~0.018

0.12~0.18

> 180

150

V-0

9~11

70000 ~ 8000060000 ~ 70000

5x1014~ 5x1015

1x1013~ 1x1014

4.3

0.015~0.018

0.15~0.20

> 60

135~145

V-0

IS400 Laminate Physical Properties

www.isola-group.com

Result

Pass

Result

Pass

Test conditionTCT (-40oC to +125oC) 15 min/10 sec/15 min’ for 200 cycles, then microsection and E-testing.

Sample

8L MLB

Test conditionTCT (-40oC to +125oC) 15 min/10 sec/15 min’ for 200 cycles, then microsection and E-testing.

Sample

8L MLB

Current State

No delam, copper crack, resin recession been found.

IS400 Thermal Reliability Testing

www.isola-group.com

IS410

www.isola-group.com

IS420IS420

Th

erm

al P

erf

orm

an

ce T

26

0/

Decom

p./

IST




IS410 180° TgIS410



Dk & DfIS620 Tg 215 Low Loss.009 @10 Ghz LaminateIS620 Tg 215 Low Loss.009 @10 Ghz Laminate

IS640 Next Generation Low Loss-.005







Polyimide HB

Telecom

High Reliability - Lead Free

High Speed Digital / Base stations/Routers/Servers/Bur

n in


1 -1.5Gbps *

1.5-2.0 Gbps *

Low Freq and speed

* Speeds a function of design such as line length etc.

T260 -10 Mins/Td.300*

*

T260 -60 Mins/Td.350*

*


2.5-10 Gbps*

T288 -60 Mins/Td.400*

*


IS415190TgIS415190Tg

IS500Halogen Free

180 Tg

IS500Halogen Free

180 Tg

www.isola-group.com

High Tg FR4 (180°C TMA)

Enhanced thermal stability High Decomposition Temperature

(350°C)

Superior PTH reliability due to very low z-axis CTE

Unique resin chemistry contributes to CAF Resistance

Lead-Free Compatible PCB substrate (6x peak 260°C reflow)

Un-filled resin matrix enhances Hi-pot resistance on thin cores

Enhanced drilling performance on high aspect ratio holes

Low Cost of ownership

Wide market acceptance and North American and Asia Pacific

manufacturing


www.isola-group.com

As a substitute for Std. FR4 requiring lead-free performance

As an improvement over FR4 materials by achieving CAF resistance

An alternative to filled phenolic resin systems that are more

susceptible to insulation resistance failures

IS410 Product Positioning

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Property Units FR406 IS410 G200 FR408 IS620

Tg, (DSC) ºC 170 180 185 180 215

Td, (TGA) ºC 290 350 320 360 352

CTE

x-axis (amb - Tg) ppm/ºC 14 11 15 13 14

y-axis (amb - Tg) ppm/ºC 13 13 15 14 12

z-axis (amb - 288C) % 4.4 % 3.5 % 3.5 % 3.5% 2.8 %

Solder Float, 288C sec >220 >500 >1200 >500 > 800

T-260, (TMA) min 10 >60 20 >60 >60

T-288, (TMA) min <1 >15 8 20 >15

Material Tested: 0.008”, 44% Resin %


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> 6.37778lb/inPeels, 1 oz.

14001400117511001100volt/milElectrical Strength

94 V-094 V-094 V-094 V-094 V-0-Flammability

.15*.15*0.14*0.20*0.20*%Moisture Absorption

-

-

-

-

Units

GPYFR-4FR-4FR-4FR-4UL Recognition

.008.011.012.021.018DF, 2 GHz

N/AN/A.013.023.023DF, 1 MHz

3.63.73.73.93.9DK, 2 GHz

N/AN/A4.04.64.6DK, 1MHz

IS620FR408G200IS410FR406Property

Material Tested: 50% Resin Content*Material Tested: 0.008”, 44% Resin %


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IS410 vs. High Tg FR4Immersion Silver Finish; 100 V Bias; 25 Coupons

0102030405060708090

100

B1 B2 B3 B4

High Tg FR4

IS410

Spacing - PTH to PTH

Fai

lure

%

B1 = 11 mil diagonal spacingB2 = 15 mil diagonal spacingB3 = 20 mil diagonal spacingB4 = 25 mil diagonal spacing

IS410 CAF Test Results

www.isola-group.com

Mean Time to Failure (MTTF) = 325 cycles

100 1000

1

2

3

5

10

20

30

40 50 60 70 80

90 95

99

Time to Failure

Per

cent


Complete Data

ShapeScale

MTTF

StDev

Median

IQR

Failure

Censor

AD*

5.2506 353.32

325.33

71.258

329.50

97.313

17

0

0.8697

IS410 IST (9.8 mil PTH)

www.isola-group.com

IS410 Dk Matrix

IS410 High Performance Tg 180 CDk Phenolic Epoxy Td 350 C

CORE Standard Resin Content Dk @ 2.0 GHz Dk @ 5.0 Ghz Dk @ 10.0 GhzTHICKNESS

0.0025 1-1080 58 3.72 3.65 3.650.0030 1-2113 44 4.04 3.98 3.980.0035 2 - 106 65 3.58 3.50 3.500.0040 1-2116 45 4.02 3.96 3.960.0043 106/1080 60 3.68 3.60 3.600.0050 1-1652 42 4.10 4.04 4.040.0053 106/2113 56 3.76 3.69 3.690.0060 1080/2113 53 3.83 3.76 3.760.0070 1-7628 41 4.12 4.07 4.070.0080 2-2116 45 4.02 3.96 3.960.0095 2-2116 52 3.85 3.78 3.780.0100 2-1652 42 4.10 4.04 4.040.0120 2-1080/7628 47 3.97 3.91 3.910.0140 2-7628 41 4.12 4.07 4.070.0180 2-7628/2116 42 4.10 4.04 4.040.0210 3-7628 39 4.18 4.12 4.120.0240 3-7628/2113 41 4.12 4.07 4.070.0280 4-7628 40 4.15 4.09 4.090.0310 4-7628/2116 40 4.15 4.09 4.090.0340 5-7628 40 4.15 4.09 4.090.0350 5-7628 41 4.12 4.07 4.070.0390 6-7628 37 4.23 4.18 4.18

Note: All test performed at ambient conditions Tg - measured by DSCBased on the Bereskin Stripline Test Method Td - measured by TGA @ onset

CONSTRUCTION

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IS410 Df Matrix

IS410 High Performance Tg 180 C

Df Phenolic Epoxy Td 350 C

CORE Standard Resin Content Df @ 2.0 GHz Df @ 5.0 Ghz Df @ 10.0 Ghz

THICKNESS0.0025 1-1080 58 0.026 0.027 0.0270.0030 1-2113 44 0.021 0.022 0.0220.0035 2 - 106 65 0.028 0.029 0.0290.0040 1-2116 45 0.021 0.027 0.0270.0043 106/1080 60 0.026 0.028 0.0280.0050 1-1652 42 0.020 0.021 0.0210.0053 106/2113 56 0.025 0.026 0.0260.0060 1080/2113 53 0.024 0.025 0.0250.0070 1-7628 41 0.020 0.021 0.0210.0080 2-2116 45 0.021 0.027 0.0270.0095 2-2116 52 0.024 0.025 0.0250.0100 2-1652 42 0.020 0.021 0.0210.0120 2-1080/7628 47 0.022 0.023 0.0230.0140 2-7628 41 0.020 0.021 0.0210.0180 2-7628/2116 42 0.020 0.021 0.0210.0210 3-7628 39 0.019 0.020 0.0200.0240 3-7628/2113 41 0.020 0.021 0.0210.0280 4-7628 40 0.020 0.021 0.0210.0310 4-7628/2116 40 0.020 0.021 0.0210.0340 5-7628 40 0.020 0.021 0.0210.0350 5-7628 41 0.020 0.021 0.0210.0390 6-7628 37 0.019 0.020 0.020


CONSTRUCTION

www.isola-group.com

FR406 IS410 IS415

Scaling See Scaling Table in Process Guide

Same as FR406 Similar to FR408

Oxide Multiple options available Same as FR406 Same as FR406/8

Lamination ROR = 8 - 12F/min

Cure = 360F (60 min)

Pressure = 250 - 300 psi

ROR = 8 - 12 F/min



ROR = 8 - 12 F/min



Drilling See Drilling Table in Process Guide

Same as FR406, longer drill life

Same as FR406 longer drill life

Desmear Chemical Desmear (single pass)

Same as FR406 Similar to FR408 (double pass cyclic amine)

IS410 Processing Cross Reference

www.isola-group.com

IS415Next Generation in Thermally Reliable

Laminate and Prepreg

www.isola-group.com

IS420IS420

Th

erm

al P

erf

orm

an

ce T

26

0/

Decom

p./

IST




IS410 180° TgIS410











Polyimide HB

Telecom



n in


1 -1.5Gbps *

1.5-2.0 Gbps *

Low Freq and speed


T260 -10 Mins/Td.300*

*

T260 -60 Mins/Td.350*

*


2.5-10 Gbps*

T288 -60 Mins/Td.400*

*



IS500Halogen Free

180 Tg

IS500Halogen Free

180 Tg

www.isola-group.com

Superior PTH reliability due to very low z-axis CTE Very high Tg (200°C by TMA) compared to FR4 (160ºC by TMA) Non-phenolic based resin system Very high decomposition temperature (375°C) suitable for Pb-free

assembly Dielectric constant comparable to Std High Tg FR4 Dissipation factor comparable to Std High Tg FR4 (20% lower than

phenolic resin systems) Low cost of ownership relative to modified epoxy systems with Mid-

Dk, mid-Df performance


www.isola-group.com

The only low cost, non-phenolic, lead free substrate in the market

As a substitute for Std. FR4 requiring lead-free performance

without sacrificing electrical performance

An improvement over phenolic-based FR4 materials by providing

lower loss comparable to Std FR4 materials

An alternative to filled phenolic resin systems that are more

susceptible to insulation resistance failures


www.isola-group.com

Property Units FR406 IS410 IS415 P95

Tg, (DSC) ºC 170 180 190 260*

Td, (TGA) ºC 290 350 375 416

CTE

α 1, z-axis (amb - Tg)

ppm/ºC 65 50 50 55

Solder Float, 288C sec >220 >500 >1000 >1200

T-260, (TMA) min 10 >60 >60 >60

T-288, (TMA) min <1 >10 >20 >60

Dk (2 GHz) 3.9 3.9 3.8 4.2

Df (2 GHz) .018 .023 .017 .014Isola Material Tested: 0.008”, 44% Resin Content


www.isola-group.com

IS415 Tg by TMA

196C (Better Thermal Performance)


www.isola-group.com


Dk Non-Dicy, Non=Phenolic Td 370 C

CORE Standard Resin Content Dk @ 2.0 GHz Dk @ 5.0 Ghz Dk @ 10.0 Ghz

THICKNESS0.0025 1-1080 58 3.68 3.67 3.650.0030 1-2113 44 4.01 4.00 3.990.0035 2 - 106 65 3.54 3.52 3.510.0040 1-2116 45 3.99 3.98 3.960.0043 106/1080 60 3.64 3.62 3.610.0050 1-1652 42 4.07 4.06 4.040.0053 106/2113 56 3.73 3.71 3.700.0060 1080/2113 53 3.79 3.78 3.770.0070 1-7628 41 4.09 4.08 4.070.0080 2-2116 45 3.99 3.98 3.960.0095 2-2116 52 3.82 3.80 3.790.0100 2-1652 42 4.07 4.06 4.040.0120 2-1080/7628 47 3.94 3.93 3.910.0140 2-7628 41 4.09 4.08 4.070.0180 2-7628/2116 42 4.07 4.06 4.040.0210 3-7628 39 4.15 4.14 4.130.0240 3-7628/2113 41 4.09 4.08 4.070.0280 4-7628 40 4.12 4.11 4.100.0310 4-7628/2116 40 4.12 4.11 4.100.0340 5-7628 40 4.12 4.11 4.100.0350 5-7628 41 4.09 4.08 4.070.0390 6-7628 37 4.20 4.19 4.18

Note: All test performed at ambient conditions Tg - tested by DSCBased on the Bereskin Stripline Test Method Td - tested by TGA @ onset

CONSTRUCTION

IS415 Dk Matrix

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Df Non-Dicy, Non-Phenolic Td 370 C


THICKNESS0.0025 1-1080 58 0.0155 0.0161 0.01670.0030 1-2113 44 0.0133 0.0138 0.01420.0035 2 - 106 65 0.0166 0.0173 0.01790.0040 1-2116 45 0.0135 0.0140 0.01440.0043 106/1080 60 0.0158 0.0164 0.01700.0050 1-1652 42 0.0130 0.0135 0.01390.0053 106/2113 56 0.0152 0.0158 0.01630.0060 1080/2113 53 0.0147 0.0153 0.01580.0070 1-7628 41 0.0129 0.0133 0.01370.0080 2-2116 45 0.0135 0.0140 0.01440.0095 2-2116 52 0.0146 0.0151 0.01560.0100 2-1652 42 0.0130 0.0135 0.01390.0120 2-1080/7628 47 0.0138 0.0143 0.01470.0140 2-7628 41 0.0129 0.0133 0.01370.0180 2-7628/2116 42 0.0130 0.0135 0.01390.0210 3-7628 39 0.0126 0.0130 0.01330.0240 3-7628/2113 41 0.0129 0.0133 0.01370.0280 4-7628 40 0.0127 0.0131 0.01350.0310 4-7628/2116 40 0.0127 0.0131 0.01350.0340 5-7628 40 0.0127 0.0131 0.01350.0350 5-7628 41 0.0129 0.0133 0.01370.0390 6-7628 37 0.0123 0.0126 0.0130


CONSTRUCTION

IS415 Df Matrix

www.isola-group.com


0.0000.100

0.2000.300

0.4000.500

0.6000.700

0.800

Frequency GHz

Lo

ss

dB

/Inc

h

FR406 IS410 IS415 IS500 PCL-370HR

FR406 0.113 0.147 0.185 0.218 0.249 0.281 0.313 0.344 0.379

IS410 0.145 0.201 0.260 0.318 0.372 0.429 0.484 0.538 0.592

IS415 0.107 0.147 0.182 0.218 0.250 0.281 0.310 0.340 0.369

IS500 0.111 0.155 0.197 0.238 0.278 0.316 0.355 0.395 0.433

P CL-370HR 0.154 0.222 0.293 0.365 0.436 0.506 0.577 0.645 0.708

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

• FR406 and IS415 are best in class - Loss close to Getek type products

• PCL 370 HR is the highest loss product in this category

IS415 Attenuation Comparison

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FR406 IS410 IS415


Same as FR406 Similar to FR408





ROR = 8 - 12 F/min



ROR = 8 - 12 F/min





Same as FR406 longer drill life




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IS500

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IS420IS420

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IS410 180° TgIS410











Polyimide HB

Telecom



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1 -1.5Gbps *

1.5-2.0 Gbps *

Low Freq and speed


T260 -10 Mins/Td.300*

*

T260 -60 Mins/Td.350*

*


2.5-10 Gbps*

T288 -60 Mins/Td.400*

*



IS500Halogen Free

180 Tg

IS500Halogen Free

180 Tg

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High Tg (180°C) Halogen-Free PCB substrate

Superior Dk across frequency (3.8 - 4.3) closely matching High Tg FR4

Loss Tangent comparable to High Tg FR4 (.016 - .018)

Very Low z-axis CTE (2.3%), as compared to Std FR4 (4%)

Superior Thermal Reliability, capable of meeting lead-free requirements

(T260 and T288 >60 minutes)

Low moisture absorption (0.2%)

Very high copper peel strength 8 lb/in. (1.4KN/m) after thermal stress

Global product availability (N. America, Europe, Asia) by early 2005


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Competitive Products: Hitachi E-67G(H), Hitachi E-679FG, Polyclad PCL-HF-571F, Nelco D1049 (beta)

Superior Dk relative to all currently available Halogen-Free substrates (3.8 vs. 4.5 - 5.0)

Globally manufactured High Tg, Halogen Free PCB Substrate

Low z-axis CTE, ideal for IST critical applications

40% higher peel strengths than competitive materials

Significant Cost Advantage


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TG DSC - 180°CTMA - 170°CDMA - 210°C

CTE (z-axis, RT - 120 °C): < TG : 35 - 40 ppm/°C> TG : 180 ppm/°C

T260 (TMA): > 60 min

T288 (TMA): > 60 min

TD (TGA): 400°C

Thermal stress tests: Solder dip @ 288°C > 5 minutes: passed 10x 10 sec @ 288°C: passed

High Pressure Cooker Test: passed(30 min + solder dip 20 sec @ 260 °C)

IS500 Thermal Characteristics

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Flammability: V-0

Moisture uptake:(D24/23) 0.12 %

Dk @ 10 GHz: 4.0

Df @ 10 GHz: 0.0147 - 0.0154

Alkali Resistance: passed(D24/125, 20 min. @ 70°C 20 min. @ in 10 % NaOH)

CTI (Comparative Tracking Index) 300

Color Dark Yellow

Peel Strength > 7.0 lb/in. (1.4KN/m)

IS500 Physical Characteristics

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IS500 Halogen Free CAF Reistance Tg 180 C

Dk High Tg Td 400 C


THICKNESS0.0020 1-106 70 3.60 3.57 3.570.0025 1-1080 57 3.78 3.76 3.760.0030 1-1080 63 3.66 3.63 3.630.0035 1-2113 51 3.92 3.89 3.890.0041 106/ 1080 60 3.72 3.69 3.690.0045 106/ 1080 63 3.66 3.63 3.630.0050 1-1652 42 4.14 4.11 4.110.0055 1080 / 2113 56 3.81 3.78 3.780.0060 2-1080 63 3.66 3.63 3.630.0070 7628 40 4.19 4.17 4.170.0080 2-2116 45 4.06 4.04 4.040.0090 2-2116 50 3.94 3.92 3.920.0100 2-1652 42 4.14 4.11 4.110.0120 2-1080 / 7628 47 4.01 3.99 3.990.0140 2-7628 40 4.19 4.17 4.170.0180 2-7628 / 2116 47 4.01 3.99 3.990.0200 2-2113 / 2-7628 42 4.14 4.11 4.110.0240 2-1652 / 2-7628 41 4.16 4.14 4.140.0280 4-7628 40 4.19 4.17 4.170.0310 2-1652 / 3-7628 40 4.19 4.17 4.170.0350 5-7628 40 4.19 4.17 4.170.0390 2116 / 5-7628 41 4.16 4.14 4.14


CONSTRUCTION

IS500 – Dk matrix

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IS500 Halogen Free CAF resistant Tg 180 C

Df High Tg Td 400 C


THICKNESS0.0020 1-106 70 0.0180 0.0190 0.01910.0025 1-1080 57 0.0165 0.0170 0.01760.0030 1-1080 63 0.0175 0.0180 0.01870.0035 1-2113 51 0.0154 0.0159 0.01640.0041 106/ 1080 60 0.0170 0.0176 0.01820.0045 106/ 1080 63 0.0175 0.0179 0.01870.0050 1-1652 42 0.0139 0.0142 0.01460.0055 1080 / 2113 56 0.0163 0.0168 0.01740.0060 2-1080 63 0.0180 0.0181 0.01870.0070 7628 40 0.0135 0.0139 0.01430.0080 2-2116 45 0.0144 0.0148 0.01520.0090 2-2116 50 0.0153 0.0157 0.01620.0100 2-1652 42 0.0139 0.0142 0.01460.0120 2-1080 / 7628 47 0.0147 0.0152 0.01560.0140 2-7628 40 0.0135 0.0139 0.01430.0180 2-7628 / 2116 47 0.0147 0.0152 0.01560.0200 2-2113 / 2-7628 42 0.0139 0.0142 0.01460.0240 2-1652 / 2-7628 41 0.0137 0.0140 0.01450.0280 4-7628 40 0.0135 0.0139 0.01430.0310 2-1652 / 3-7628 40 0.0135 0.0139 0.01430.0350 5-7628 40 0.0135 0.0139 0.01430.0390 2116 / 5-7628 41 0.0137 0.0140 0.0145


CONSTRUCTION

IS500 - Df matrix

www.isola-group.com


0.0000.100

0.2000.300

0.4000.500

0.6000.700

0.800

Frequency GHz

Lo

ss

dB

/Inc

h

FR406 IS410 IS415 IS500 PCL-370HR

FR406 0.113 0.147 0.185 0.218 0.249 0.281 0.313 0.344 0.379

IS410 0.145 0.201 0.260 0.318 0.372 0.429 0.484 0.538 0.592

IS415 0.107 0.147 0.182 0.218 0.250 0.281 0.310 0.340 0.369

IS500 0.111 0.155 0.197 0.238 0.278 0.316 0.355 0.395 0.433

P CL-370HR 0.154 0.222 0.293 0.365 0.436 0.506 0.577 0.645 0.708

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

• FR406 and IS415 are best in class - Loss close to Getek type products

• PCL 370 HR is the highest loss product in this category


www.isola-group.com

FR406 IS410 IS500


Same as FR406 Currently using FR406 scaling factors (additional characterization req’d)





ROR = 8 - 12 F/min



ROR = 8 - 12 F/min


Pressure = 300 psi



See Drilling table in following slides




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Reliability



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FR408

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IS420IS420

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IS410 180° TgIS410











Polyimide HB

Telecom



n in


1 -1.5Gbps *

1.5-2.0 Gbps *

Low Freq and speed


T260 -10 Mins/Td.300*

*

T260 -60 Mins/Td.350*

*


2.5-10 Gbps*

T288 -60 Mins/Td.400*

*



IS500Halogen Free

180 Tg

IS500Halogen Free

180 Tg

www.isola-group.com

Positioning

FR408 is a high performance FR-4 epoxy laminate and prepreg system designed for advanced circuitry applications.

As an improvement over Std. FR4, FR408 offers improved electrical properties as well as Pb-Free compatibility.

As an alternative to PPO resin systems, FR408 offers lower signal loss improving electrical performance.

As an alternative to PPO resin systems, FR408 offers a 33% lower CTE improving PTH reliability As an alternative to modified epoxy systems with Cyanate Ester, FR408 offers better fracture

toughness making it the product of choice for high density designs and CAF resistance

Value Proposition

High thermal performance Tg of 180°C by DSC Very high decomposition temperature, Td of 360°C by TGA suitable for Pb-Free assembly Improved Dielectric Properties (Dk 3.3 – 3.8; Df 0.010 - 0.012) Superior Processing, closest to conventional FR-4 as compared to all high speed materials

FR408 Positioning and Value Proposition

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Property Units FR406 IS410 G200 FR408 IS620

Tg, (DSC) ºC 170 180 185 180 215

Td, (TGA) ºC 290 350 320 360 353

CTE

x-axis (amb - Tg) ppm/ºC 14 11 15 13 13

y-axis (amb - Tg) ppm/ºC 13 13 15 13 14

z-axis (amb - 288C) ppm/ºC 140 140 140 120 110-120

Solder Float, 288C sec >220 >500 >1200 >500 > 800

T-260, (TMA) min 10 >60 20 >60 >60

T-288, (TMA) min <1 >10 8 20 >15


FR408 Laminate Thermal Properties

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> 6.3778lb/inPeels, 1 oz.

1400140011751100volt/milElectrical Strength

94 V-094 V-094 V-094 V-0-Flammability

.15*.15*0.14*0.20*%Moisture Absorption

-

-

-

-

-

-

-

-

Units

GPYFR-4FR-4FR-4UL Recognition

.008.012.017.019DF, 10 GHz

.008.012-.019DF, 5 GHz

.008.011.012.018DF, 2 GHz

N/AN/A.013.023DF, 1 MHz

3.553.73.73.8DK, 10 GHz

3.553.7-3.9DK, 5 GHz

3.63.73.73.9DK, 2 GHz

N/AN/A4.04.6DK, 1MHz

IS620FR408G200FR406Property

Material Tested: 50% Resin Content*Material Tested: 0.008”, 44% Resin Content

FR408 Laminate Physical Properties

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FR408 High Performance Tg 180 C

Dk Mid Dk, Df High Tg Td 360 C


THICKNESS0.0020 1-106 63 3.49 3.48 3.470.0025 1-1080 55 3.67 3.66 3.650.0030 1-2113 44 3.95 3.94 3.930.0035 1-2113 52 3.74 3.73 3.720.0035 2 - 106 65 3.45 3.43 3.430.0040 1-3070 48 3.84 3.83 3.820.0043 106/1080 58 3.60 3.59 3.580.0050 1-1652 42 4.00 3.99 3.990.0053 106/2113 56 3.65 3.63 3.630.0060 1080/2113 53 3.72 3.71 3.700.0070 2113/2116 45 3.92 3.91 3.900.0080 2-2116 45 3.92 3.91 3.900.0100 2-1652 42 4.00 3.99 3.990.0120 2-1080/7628 46 3.90 3.88 3.880.0140 2-7628 41 4.03 4.02 4.010.0180 2-7628/2116 42 4.00 3.99 3.990.0210 3-7628 39 4.09 4.08 4.070.0240 3-7628/2113 41 4.03 4.02 4.010.0280 4-7628 40 4.06 4.05 4.040.0310 4-7628/2113 40 4.06 4.05 4.040.0350 5-7628 41 4.03 4.02 4.010.0400 6-7628 37 4.15 4.13 4.130.0590 9-7628 37 4.15 4.13 4.13


CONSTRUCTION

FR408 Dk matrix

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FR408 High Performance Tg 180 C

Df Mid Dk, Df High Tg Td 360 C


THICKNESS0.0020 1-106 63 0.0128 0.0136 0.01340.0025 1-1080 55 0.0120 0.0127 0.01250.0030 1-2113 44 0.0109 0.0114 0.01130.0035 1-2113 52 0.0112 0.0123 0.01220.0035 2 - 106 65 0.0131 0.0138 0.01360.0040 1-3070 48 0.0113 0.0119 0.01170.0043 106/1080 58 0.0123 0.0130 0.01280.0050 1-1652 42 0.0107 0.0112 0.01100.0053 106/2113 56 0.0121 0.0128 0.01260.0060 1080/2113 53 0.0118 0.0124 0.01230.0070 2113/2116 45 0.0110 0.0115 0.01140.0080 2-2116 45 0.0110 0.0115 0.01140.0100 2-1652 42 0.0107 0.0112 0.01100.0120 2-1080/7628 46 0.0111 0.0116 0.01150.0140 2-7628 41 0.0106 0.0111 0.01090.0180 2-7628/2116 42 0.0107 0.0112 0.01100.0210 3-7628 39 0.0104 0.0108 0.01070.0240 3-7628/2113 41 0.0106 0.0111 0.01090.0280 4-7628 40 0.0105 0.0110 0.01080.0310 4-7628/2113 40 0.0105 0.0110 0.01080.0350 5-7628 41 0.0106 0.0111 0.01090.0400 6-7628 37 0.0102 0.0106 0.01050.0590 9-7628 37 0.0102 0.0106 0.0105

Note: All test performed at ambient conditions Tg - tested by DSCBased on the Bereskin Stripline Test Method Td - tested by TGA @ onset.

CONSTRUCTION

FR408 Df matrix

www.isola-group.com

IS620

www.isola-group.com

IS420IS420

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IS410 180° TgIS410











Polyimide HB

Telecom



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1 -1.5Gbps *

1.5-2.0 Gbps *

Low Freq and speed


T260 -10 Mins/Td.300*

*

T260 -60 Mins/Td.350*

*


2.5-10 Gbps*

T288 -60 Mins/Td.400*

*



IS500Halogen Free

180 Tg

IS500Halogen Free

180 Tg

www.isola-group.com

IS620 Ad

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Superior Electrical Performance - The Loss With IS620 is Lower at Higher Frequencies and Stays Stable, the Response With APPE is Not Stable and it Increases With Frequency

IS620 is a Thermoset Resin, Unlike APPE Resins Which Are Thermoplastic Blends. The APPE Resin Conforms While IS620 Flows

IS620 Does Not Use Special Glass and is Therefore Available in Standard Sizes and is Not Subject to the Supply Issues

The Cost of Ownership vs. Performance is Very Favorable With IS620

Superior PTH reliability due to very low z-axis CTE

The Only Lead-Free Compatible Product in its Class


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Appropriate for High Speed Digital applications up to 5 Gbps

As a performance upgrade replacement for Nelco N4000-13 Product due to its ease of processing and superior thermal and electrical attributes at a slightly lower cost of ownership

As a substitute for Nelco N4000-13SI Products due to its ease of processing, availability and lower cost of ownership

As a replacement for APPE resin systems due to its much lower cost of ownership and availability

As a replacement for Rogers 4350 in the lower to mid end designs due to its stable electrical performance at a substantially reduced cost

As a substitute for G-200/BT applications due to its better thermal and electrical performance at similar cost

As the lead-free low loss product


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Property Units FR406 G200 IS415 IS500 IS620 IS640

Tg, (DSC) ºC 170 185 190 170 215 220

Td, (TGA) ºC 290 320 370 400 353 350

CTE

x-axis (amb - Tg) ppm/ºC 14 15 13 13 11 11

y-axis (amb - Tg) ppm/ºC 13 15 14 14 13 10

z-axis (amb - 288C)

% 4.4% 3.5% 2.9% 2.8% 2.8% 3.6%

Solder Float, 288C sec >220 >1200 >1200 TBD >800 TBD

T-260, (TMA) min 10 20 >60 >60 >60 >60

T-288, (TMA) min <1 8 >20 >15 >15 >10



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Property Units FR406 G200 IS415 IS500 IS620 IS640

Dk, 2 GHz 3.9 3.7 3.8 3.9 3.6 3.0-3.6

Dk, 10 GHz 3.8 - 3.7 3.8 3.55 3.0-3.6

Df, 2 GHz .018 .012 .016 .016 .008 <.0045

Df, 10 GHz .019 - .017 .017 .008 <.0045

Electrical Strength V/mil 1100 1175 >1000 1000 1400 TBD

Peels, 1oz lbs./in. 8 7 >6.3 >6.3 >6.3 >5.5

Flammability 94V-0 94V-0 94V-0 94V-0 94V-0 94V-0

Moisture Absorption

% 0.20 0.14 0.26 0.12 0.15 0.40*

UL Recognition FR-4 FR-4 FR-4 TBD GPY Non ANSI

*Material Tested: 0.030”(5-2116), 52% Resin %


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IS620 Low Loss Low Dk Tg 215 C

Dk Lead Free Td 353 C

Core Standard Resin Dk Dk Dk

Thickness Construction Content 2.0 Ghz 5 Ghz 10 Ghz0.0020 1-106 70 3.33 3.31 3.300.0027 1-1080 60 3.54 3.53 3.520.0030 1-1080 63 3.47 3.46 3.450.0035 2-106 66 3.41 3.39 3.380.0035 1-2113 51 3.76 3.74 3.740.0040 2 x 106 70 3.33 3.31 3.300.0040 1-3070 50 3.78 3.77 3.760.0045 106/1080 63 3.47 3.46 3.450.0050 2 x 106 76 3.21 3.19 3.180.0050 106/2113 55 3.66 3.64 3.640.0060 1080/2113 54 3.68 3.67 3.660.0060 1080/ 106 70 3.33 3.31 3.30.0070 2-2113 52 3.73 3.72 3.710.0080 2-3070 50 3.78 3.77 3.760.0100 3 x 1080 66 3.41 3.39 3.380.0100 2-2116 54 3.68 3.67 3.660.0120 2-2113/ 1652 48 3.83 3.82 3.810.0140 2-2116/1652 47 3.86 3.85 3.840.0160 3-1652 46 3.89 3.87 3.870.0180 2-3070/2-1652 46 3.89 3.87 3.870.0210 2-2116/2-1652 50 3.78 3.77 3.760.0240 2-2116/3-1652 46 3.89 3.87 3.870.0280 2-3070/4-1652 45 3.91 3.90 3.890.0310 2-2116/4-1652 48 3.83 3.82 3.810.0350 7-1652 43 3.97 3.96 3.950.0400 8-1652 43 3.97 3.96 3.95


IS620 Dk Matrix

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IS620 Low Loss, Low Dk Tg 215 CDf Lead Free Td 353 C

Core Standard Resin Df Df DfThickness Construction Content 2.0 Ghz 5 Ghz 10 Ghz

0.0020 1-106 70 0.0095 0.0098 0.00990.0027 1-1080 60 0.0090 0.0093 0.00940.0030 1-1080 63 0.0091 0.0094 0.00950.0035 2-106 66 0.0093 0.0096 0.00970.0035 1-2113 51 0.0086 0.0089 0.00890.0040 1-3070 50 0.0086 0.0088 0.00890.0040 2x106 70 0.0095 0.0098 0.00990.0045 106/1080 63 0.0092 0.0094 0.00950.0050 2 x 106 76 0.0097 0.0101 0.01020.0050 106/2113 55 0.0088 0.0091 0.00910.0060 106/1080 70 0.0095 0.0098 0.00980.0060 1080/2113 54 0.0088 0.0090 0.00910.0070 2-2113 52 0.0087 0.0089 0.00900.0080 2 x 3070 50 0.0086 0.0088 0.00890.0100 3 x 1080 66 0.0093 0.0096 0.00970.0100 2-2116 54 0.0088 0.0090 0.00910.0120 2-2113/ 1652 48 0.0085 0.0087 0.00880.0140 2-2116/1652 47 0.0087 0.0087 0.00870.0160 3-1652 46 0.0084 0.0086 0.00870.0180 2-3070/2-1652 46 0.0084 0.0086 0.00870.0210 2-2116/2-1652 50 0.0086 0.0088 0.00890.0240 2-2116/3-1652 46 0.0084 0.0086 0.00870.0280 2-3070/4-1652 45 0.0084 0.0086 0.00860.0310 2-2116/4-1652 48 0.0085 0.0087 0.00880.0350 7-1652 43 0.0083 0.0085 0.00850.0400 8-1652 43 0.0083 0.0085 0.0085


IS640 Df matrix

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Frequency (GHz)Frequency (GHz)

12 Inch Trace 8 Inch Trace

IS620 vs. Modified Epoxy Special Glass

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Attenuation by Isola Grade

-35

-30

-25

-20

-15

-10

-5

0

0 2 4 6 8 10 12 14 16 18 20

Frequency (GHz)

Att

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dB

)

FR406 FR408 IS620 IS640

Data courtesy Northrup Grumman

IS620 Attenuation 16” Transmission Line

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High Speed Products- Microstrip 8 mil dB/Inch Loss

0.000

0.100

0.200

0.300

0.400

0.500

Frequency GHz

Lo

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dB

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IS620 GETEK I N4000-13 N4000-13SI PCL-LD-621

IS620 0.075 0.100 0.122 0.144 0.161 0.181 0.198 0.217 0.234

GETEK I 0.096 0.132 0.170 0.204 0.238 0.272 0.300 0.328 0.360

N4000-13 0.085 0.121 0.156 0.190 0.225 0.258 0.290 0.319 0.349

N4000-13SI 0.084 0.128 0.164 0.200 0.236 0.269 0.303 0.338 0.372

P CL-LD-621 0.092 0.131 0.170 0.209 0.248 0.288 0.325 0.363 0.404

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

• IS620 is the best in class product for dissipation factor


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Time / ns

Z / IS620

RO4350a) Time Domain Reflectometry

Figure a shows a TDR measurement of the impedance profile of a 1m conductor in layer HF 1. For comparisonpurposes TDR results of conductors in a board made from IS 620 and R04350 are confronted. The differenceof the impedance course can be basically attributed to 2 reasons:

1. Inevitable different geometrical dimensions (line width, height of chamber etc.) of the two boards2. Different dielectric figures for both materials

Due to different dielectric figures of different types of material there are varying delays of electrical signals. Also these delays can be taken from TDR measurements. The difference in time of the scarped flanks at the endof the effective range marks the double difference in delay (feed and return run of signal) of electrical signals.

IS620 TDR Measurements - Siemens

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TDR measurements allow a very precise determination of running time differences and thereof the differences of dielectric figures. However, in order to identify damping characteristics, gauging in the frequency range are more suitable. In order to do so scattering parameters S21 (transmisson damping) of both materials are compared. Figure b shows that there are no differences in damping features of both materials in a range of up to 15GHz. As a result of this it can be said that both materials hold nearly the same dissipation factors tan

Frequency / GHz

S21 / dB

RO4350

IS620

b) Frequency Domain

IS620 S21 Measurements - Siemens

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IS620Lead Free Assembly Testing

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IS620 Pb-Free Simulation – NEMI Parameters

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IS620 Lead-Free Assembly – European Customer A

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IS620 Lead-Free Assembly – European Customer B

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Plated-Thru Holes after 8x Reflow Process

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Samples of the finished test cards were sent to Isola for thermal analysis prior to reflow simulation. The results shown support the claim that the IS620 would perform as expected in the reflow simulation. Additional, samples were submitted to the Isola R&D lab after 8 reflow passes.

Before Reflow Simulation After Reflow SimulationCTE before Tg 61.2 ppm/C - 181CCTE after Tg 259.0 ppm/C - 181-269CCTE after Tg 786.0 ppm/C - 269-288COverall CTE 155.9 ppm/C - 20-288CTGA 350C 349CDSC Tg Cleave A 199-200C Delta 1CDSC Tg Cleave B 198-199C Delta 1CPeak Tan Delta 171C and 269CT-260 by TMA 60 minutes + 60 minutes+T-288 by TMA 2.8, 2.9, 3.0, 3.7 minutesWeight Loss % 0.4% to 260C 0.4% to 260C

IS620 Thermal Analysis (before and after 8x Reflow Simulation)

www.isola-group.comIS620 Lead Free is getting great traction in the market and we are already seeing a strong Ramp up. It is now the only Lead Free product

in its Class

IS620 Lead-Free Assembly Summary Feedback from the Market

IS620 Passes Lead-Free Assembly Testing 7x at Merix

IS620 Passes Lead-Free Assembly Testing 6x at PPC

Positive Results at all customers to date

Finished Board thermal analysis demonstrates T260 greater than 60 minutes

Finished Board decomposition temperature greater than 350 C

Joint Press-Release with Merix on Lead-Free Compatibility

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Isola Processing Cross Reference

FR408 IS620 IS640

Scaling 30% greater in Grain

Similar to FR408 in Fill

Currently evaluating* (using IS620 factors)

Oxide Same as FR406/8 Same as FR406/8 Same as FR406/8

Lamination ROR = 8 - 12 F/min



40 min soak – 200F

ROR = 4 F/min

Cure = 390F (120 min)


ROR = 3 - 5 F/min

Cure = 390F (150 min)


Drilling Similar to N4000-13 or N4000-13SI

Similar to N4000-13 or N4000-13SI

Similar to R4350 F&S

Drill life substantially better than R4350

Desmear Double Pass Desmear

Plasma Desmear

Similar to FR408 (prefer Plasma Desmear)

Similar to FR406

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Next Generation Low Loss

IS640

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IS640 Ad

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IS420IS420

Th

erm

al P

erf

orm

an

ce T

26

0/

Decom

p./

IST




IS410 180° TgIS410











Polyimide HB

Telecom



n in


1 -1.5Gbps *

1.5-2.0 Gbps *

Low Freq and speed


T260 -10 Mins/Td.300*

*

T260 -60 Mins/Td.350*

*


2.5-10 Gbps*

T288 -60 Mins/Td.400*

*



IS500Halogen Free

180 Tg

IS500Halogen Free

180 Tg

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Superior Signal Integrity - flat Df from 2 to 15 GHz

Stable Dielectric Constant from 2 to 15 GHz

Customized Dk for different applications (ie.3.0, 3.20, 3.25, 3.38, 3.45)

Utilizes Standard E-Glass

Standard Thicknesses Available

Tack-free prepreg for ease in handling

Superior Drilling performance

Conventional FR-4 processing

Compatible with Isola IS410, FR406 & FR408

Lower Cost of Ownership

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Applicable for RF Microwave/High-Speed Digital Market (5+ Gbps)

Capable of meeting lead-free requirements

IS640 prepreg is non-tacky, unlike Rogers 4350

Significant Cost Advantage

Rogers 4350 has 60% ceramic filler in the resin, more difficult drilling


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Electrical Properties ValuesDk @ 2 GHz 3.43Dk @ 5 GHz 3.43Dk @ 10 GHz 3.43Df @ 2 GHz 0.0037Df @ 5 GHz 0.0038Df @ 10 GHz 0.0038

Mechanical Properties ValuesPeel Strength - after thermal stress 4 lbs/in (1/2 oz)RTFlammability 94 V-0T- 260 > 60 minutesTg - DSC 220 Degrees C

*All tests run on 0.030” 2116 with 52 % retained resin % Electrical properties tested by Bereskin Stripline Method

IS640 Material Properties

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2.5

3

3.5

4

2 GHz 5 GHz 10 GHz

IS620 APPE IS640

55 % RESIN

IS640 Stripline Dk Comparison

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0.0035

0.0055

0.0075

0.0095

0.0115

2 GHz 5 GHz 10 GHz

IS 620 APPE IS640

55 % RESIN

IS640 Stripline Df Comparison

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IS640 Very Low Loss Tg 220 C

Dk Td 350 C


THICKNESS Construction0.0030 1-1080 64 3.10 3.10 3.100.0040 1-3070 50 3.49 3.49 3.490.0050 1-2116 52 3.43 3.43 3.430.0060 1652 51 3.46 3.46 3.460.0060 2-1080 64 3.10 3.10 3.100.0080 2-3070 50 3.45 3.45 3.450.0100 2-2116 52 3.43 3.43 3.43

High Spped Digital

IS640 Dk matrix – High Speed Digtal

Electrical test data by Bereskin Stripline Method at ambient temp.

Tg tested by DSCTd tested by TGA @ onset

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Df Td 350 C


THICKNESS0.0030 1-1080 64 0.0033 0.0034 0.00340.0040 1-3070 50 0.0038 0.0039 0.00390.0050 1-2116 52 0.0037 0.0038 0.00380.0060 1652 51 0.0038 0.0038 0.00380.0060 2-1080 64 0.0033 0.0034 0.00340.0080 2-3070 50 0.0038 0.0039 0.00390.0100 2-2116 52 0.0037 0.0038 0.0038

CONSTRUCTION

IS640 Df matrix – High Speed Digital

Electrical Data tested by Bereskin Stripline Method at ambient temp.

Tg – tested by DSCTd – tested by TGA @ onset

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3.45 Td 350 C

DkThickness Dk @ 2.0 GHz Dk @ 5.0 Ghz Dk @ 10.0 Ghz

0.0200 3.45 3.45 3.450.0300 3.45 3.45 3.450.0600 3.45 3.45 3.45


3.38 Td 350 C


0.0200 3.38 3.38 3.380.0300 3.38 3.38 3.380.0600 3.38 3.38 3.38

RF/ Microwave

RF/ Microwave

IS640 RF/ Microwave – 3.45 and 3.38 Dk

Tested per IPC TM 650 2.5.5.5

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3.45 Td 350 C

DkThickness Df @ 2.0 GHz Df @ 5.0 Ghz Df @ 10.0 Ghz

0.0200 0.0045 0.0045 0.00450.0300 0.0045 0.0045 0.00450.0600 0.0045 0.0045 0.0045


3.38 Td 350 C


0.0200 0.0042 0.0042 0.00420.0300 0.0042 0.0042 0.00420.0600 0.0042 0.0042 0.0042

RF/ Microwave

RF/ Microwave

IS640 Rf/ Microwave Df matrix– 3.45 and 3.38 Dk


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3.25 Td 350 C


0.0200 3.25 3.25 3.250.0300 3.25 3.25 3.250.0600 3.25 3.25 3.25


3.20 Td 350 C


0.0200 3.20 3.20 3.200.0300 3.20 3.20 3.200.0600 3.20 3.20 3.20

RF/ Microwave

RF/ Microwave

IS640 RF/ Microwave – 3.25 & 3.20 Dk


www.isola-group.com


3.25 Td 350 C


0.0200 0.0035 0.0035 0.00350.0300 0.0035 0.0035 0.00350.0600 0.0035 0.0035 0.0035


3.20 Td 350 C


0.0200 0.0035 0.0035 0.00350.0300 0.0035 0.0035 0.00350.0600 0.0035 0.0035 0.0035

RF/ Microwave

RF/ Microwave

IS640 RF/ Microwave Df matrix – 3.25 & 3.20 Dk


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3.00 Td 350 C


0.0200 3.00 3.00 3.000.0300 3.00 3.00 3.000.0600 3.00 3.00 3.00

RF/ Microwave

IS640 RF/ Microwave - 3.00 Dk


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Isola Processing Cross Reference

FR408 IS620 IS640

Scaling 30% greater in Grain

Similar to FR408 in Fill

Currently evaluating* (using IS620 factors)

Oxide Same as FR406/8 Same as FR406/8 Same as FR406/8

Lamination ROR = 8 - 12 F/min



40 min soak – 200F

ROR = 4 F/min

Cure = 390F (120 min)


ROR = 3 - 5 F/min

Cure = 390F (150 min)


Drilling Similar to N4000-13 or N4000-13SI

Similar to N4000-13 or N4000-13SI

Similar to R4350 F&S

Drill life substantially better than R4350

Desmear Double Pass Desmear

Plasma Desmear

Similar to FR408 (prefer Plasma Desmear)

Similar to FR406

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Reliability



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PWB Reliability Test Methods

Interconnect Stress Testing (IST)

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IST is an accelerated stress test method

Creates uniform strain from within substrate

DC current is used to heat the PTH barrels and forced convection cooling to cycle PTH

Technique identifies and assesses the severity of post separation and barrel cracks

Interconnect Stress Testing (IST)

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Test Method Comparison

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Failure defined as resistance degradation

QUANTIFYING DEGREES OF POST SEPARATION (.050" GRID)

0

5

10

15

20

25

30

35

40

45

50

1 21 41 61 81 101 121 141 161 181 201 221 241 261 281 301 321 341 361 381 401 421 441 461 481

IST CYCLES

RE

SIS

TAN

CE

CH

AN

GE

IN M

ILL

IOH

MS GROSS

FINE LINE

GOOD

IST Data Analysis

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Benefits of Weibull Analysis method

Accounts for infant mortality

Requires few data points to fit data

Attributes of Weibull Distribution

- Good Fit of data: Shape parameter

(slope) > 3

- Number of cycles at 1% failure > 75

cycles

- MTTF (Mean Time to Failure) is a

meaningful summary of data100 1000

1

2

3

5

10

20

30

40 50 60 70 80

90 95

99

Time to Failure

Per

cent


Complete Data

ShapeScale

MTTF

StDev

Median

IQR

Failure

Censor

AD*

5.2506 353.32

325.33

71.258

329.50

97.313

17

0

0.8697

IST Weibull Analysis

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Hi-Pot Testing

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Hi-Pot testing is analogous to high voltage testing

Determine the state of the material’s electrical insulation

Synonymous terms: Voltage withstanding test Dielectric strength testing Insulation breakdown testing

Technique to test the insulation resistance of materials ZBC used in buried distributive

capacitance applications Reference: Buried Capacitance and thin laminates

Hi-Potential Testing (Hi-Pot)

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Conductive Anodic Filament (CAF) Failure

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CAF formation was first reported in 1976, but field failures were identified later in the 1980s

Electrochemical failure Growth of copper containing filament along epoxy-glass

interface Bell Laboratories investigated mechanism of CAF

formation Physical degradation of glass/epoxy bond Moisture absorption occurs under high humidity conditions An electrochemical pathway develops and electrochemical

corrosion occurs Water acts as electrolyte, the copper circuitry becomes the

anode and cathode, and the operating voltages acts as the driving potential

Conductive Anodic Filament (CAF)

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CAF Pathways

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Sun Microsystems Test Board 10 Layer Board, .050” Single Ply 2116 Construction All Layers, B and C-Stage

D1 D2

A1A2A3A4

B1B2B3B4

C1C2

C3C4

A1 - A4 = Hole to Hole In Line with GlassB1 - B4 = Hole to Hole Diagonal to GlassC1 - C4 = Hole to Plane Clearance (antipad)D1 & D2 = Plane to Plane

CAF Test Vehicle

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Registration

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Registration error composed of several different sources Types: Offset error, Compensation error, angle error, random noise Offset error

Related to tooling processes Punch, pinning, and drilling

Compensation error Related to scaling artwork Material movement or artwork movement

Angle error Related to a rotational misalignment Post-etch punch machines that are miscalibrated

Random noise

Registration Summary

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References

1. Ready, W. Jud, Turbini, Laura J., “Conductive Anodic Filament Failure: A Material Perspective” www.readymadeparties.com/jud/reprints/publications/PRICM_1998/materialsperspective_short.pdf

2. Biunno, Nicholas, Schroeder, Greg, “Buried Capacitance and Thin Laminates”. www.circuitree.com/CDA/ArticleInformation/coverstory/BNPCoverStoryItem/0,2135,119345,00.html

3. PCB reliability testing with Interconnect Stress Test. http://www.polarinstruments.com/support/reliability/ap301.html

4. McQuarrie, Wm. Gray, “Control of Key Registration Variables for Improved Process Yields on Dense MLBs”. www.isola-usa.com

www.isola-group.com




Reliability


Isola Technology

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IsolaLaboratory Capabilities

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• Thermal Analysis– Differential Scanning

Calorimetry (DSC) • Tg, delta Tg

– Thermomechanical Analysis (TMA)

• X, Y, Z- CTE, Tg, T-260, T-288

– Dynamic Mechanical Analysis (DMA)

• Tg, Modulus – 4 Camera CTE (X and Y)– Rheometer

• Gel Window, Minimum Viscosity

• Microscopy– Scanning Electron Microscopy

(SEM)– Energy Dispersive

Spectroscopy (EDS)– Optical Microscopy

(Microsectioning including thermal stress)

– Fourier-Transform Infrared Spectroscopy (FTIR)

– Coulometric Titration (Moisture Content)

IPC-4101A Qualification and Conformance Testing

Isola Analytical lab Capabilities

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• Electrical Testing– Dielectric Constant/ Dissipation

Factor• 1 MHz (Two Fluid)• 100 MHz to 1.5 GHz (HP

4291A)• 1 GHz to 20 GHz (Bereskin

Method)• Network Analyzer and full

signal integrity bench– Electric Strength– Hi-Pot– Arc Resistance– Insulation Resistance– Conductive Anodic Filament

(CAF)

• Physical Testing– Dimensional Stability

• 4 Camera System– Peel Strength– UL Flammability– Oxygen Index– Flexural Strength– Compressive Strength– Bond Strength– Shear Strength– Warp and Twist– Surface Profilometry

Isola Analytical Lab Capabilities

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Agilent PNA/PLTS Signal Integrity Bench

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Signal Integrity with Eye Diagrams

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Mechanical Analysis

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Scanning Electron Microscopy (SEM)

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Development Methodology Modeling

Large IP Portfolio and Large Data base of Research Strong Development and Process Technology group

Neat Resin characterization and modeling Infrastructure

Pilot manufacturing facilities Best in class Analytical Labs Global footprint with Regional Centers of excellence Investment in new Technology

Focus on cost effective technologies Isola’s new Technologies based on unique formulas using components vs.

prepackaged value priced Technologies from Vendors

Leading Technology Player

Isola Competitive Advantage – Product Technology

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Www.isola-group.com Isola Technology and Product Update June 2005.

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