ZXG10 BSC(V2)Installation Manual

Z X G 1 0 Z T E G S M W L L S Y S T E M

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ZZXXGG1100--BBSSCC ((VV22))

SSHHEENNZZHHEENN,, CCHHIINNAA

Installation Manual of ZXG10-BSC (V2)

Preface

The ZXG10 is a GSM mobile communication system independently developed by ZTE Corporation. It is composed of the ZXG10-MSS (Mobile Switching System) and ZXG10-BSS (Base Station System). The ZXG10-BSS provides and manages radio transmission in GSM, and consists of such equipment as ZXG10-BSC (Base Station Controller) and ZXG10-BTS (Base Transceiver Station).

This Installation Manual of ZXG10-BSC (V2) mainly introduces the project installation process of the ZXG10-BSC (V2), including the installation preparation, installation methods and procedure, and debugging. Chapter 1, System Overview, briefly introduces the system functions of BSC, composition of each function module and equipment commissioning process; Chapter 2, Equipment Structure, covers the overall structure of the BSC and the equipment parameters; Chapter 3, Preparation for Project Installation, describes requirements to the installation environments, needed instruments and meters, and methods of unpacking and inspection; Chapter 4, Hardware Installation, describes the installation flow and methods; Chapter 5, Inspection and Power-on, explains methods of power-on, power-off and transmission connection, and installation of the maintenance terminals; Chapter 6, Software Installation, briefly describes how the BSC-related software is installed and debugged; and Chapter 7 mainly shows how to operate the installation, storage and transportation. Appendix A lists the alarms, Appendix B collects the UNIX commands and Appendix C offers the abbreviations.

Generally the ZXG10-BSC (V2) in this manual is shortened as BSC.

This set of documents also contains the following manuals:

ZXG10-BSC (V2) Technical Manual

ZXG10-BSC (V2) Operation Manual

ZXG10-BSC (V2) Maintenance Manual


Statement: The actual product may differ from what is described in this manual due to frequent update of ZTE products and fast development of technologies. Please contact the local ZTE office for the latest updating information of the product.


Page I of III

Contents

1 SYSTEM OVERVIEW......................................................................................................1

1.1 SYSTEM STRUCTURE..........................................................................................................1 1.1.1 GSM network structure ....................................................................................................1 1.1.2 Composition of BSS.........................................................................................................2 1.2 HARDWARE SYSTEM STRUCTURE.........................................................................................4 1.2.1 Module introduction .........................................................................................................4 1.2.2 Function structure............................................................................................................7 1.2.3 Rack structure .................................................................................................................8 1.3 EQUIPMENT INSTALLATION AND COMMISSIONING PROCESS.....................................................9

2 EQUIPMENT STRUCTURE ..........................................................................................11

2.1 EQUIPMENT STRUCTURE...................................................................................................11 2.1.1 Features of single-cabinet structure...............................................................................11 2.1.2 Features of multi-cabinet structure ................................................................................12 2.1.3 Structure features of the plug-in box ..............................................................................13 2.1.4 Structure features of the card ........................................................................................14 2.2 BSC RACK CONFIGURATION ..............................................................................................15 2.2.1 No submultiplexing ........................................................................................................15 2.2.2 Rack configuration with submultiplexing ........................................................................18 2.2.3 GPRS rack configuration ...............................................................................................22 2.3 BOARD CONFIGURATION OF EACH LAYER OF UNITS ..............................................................22 2.4 EQUIPMENT PARAMETERS.................................................................................................25

3 PREPARATION OF INSTALLATION.............................................................................29

3.1 CHECK OF INSTALLATION ENVIRONMENT.............................................................................29 3.1.1 Requirements on equipment room.................................................................................29 3.1.2 Requirements on power supply and grounding..............................................................37 3.2 INSTRUMENT AND METER PREPARATION..............................................................................39 3.3 TECHNICAL RESOURCES PREPARATION ..............................................................................40 3.4 UNPACKING AND INSPECTION ............................................................................................40

4 HARDWARE INSTALLATION.......................................................................................43

4.1 HARDWARE INSTALLATION FLOW........................................................................................43


Page II of III

4.2 INSTALLATION OF THE RACK...............................................................................................43 4.2.1 Rack installation.............................................................................................................43 4.2.2 Connection between racks ............................................................................................46 4.2.3 Connection between the side plate and rack .................................................................47 4.2.4 Installation of the front door and rear door .....................................................................48 4.3 INSTALLATION OF THE POWER P (POWP) OF THE RACK.......................................................48 4.3.1 Introduction to functions.................................................................................................48 4.3.2 Functionality ..................................................................................................................49 4.3.3 Input, output and indicators............................................................................................51 4.4 INSTALLATION OF INTERNAL WIRES.....................................................................................52 4.4.1 Clock interface board (CKI)............................................................................................52 4.4.2 Digital switching network interface (DSNI) board ...........................................................53 4.4.3 Trunk interface (TIC) board............................................................................................53 4.4.4 Module processor (MP) .................................................................................................54 4.4.5 Configuration of backplane jumpers...............................................................................54 4.5 INSTALLATION OF EXTERNAL CABLES ..................................................................................56 4.5.1 Cable connection of the BSC system without sub-multiplexing......................................56 4.5.2 Configurations of cables of the BSC system with sub-multiplexing ................................73 4.5.3 Cable connections of BSC (GPRS) ...............................................................................80 4.6 CHECK OF THE HARDWARE INSTALLATION ..........................................................................81 4.6.1 Check of the rack installation .........................................................................................81 4.6.2 Check of base and peripherally installed terminal equipment ........................................82 4.6.3 Check of the array of racks............................................................................................82 4.6.4 Check of cables .............................................................................................................82

5 INSPECTION AND POWER-ON ...................................................................................86

5.1 DESCRIPTION OF BOARDS.................................................................................................86 5.1.1 Indicators on the panel of the control layer ....................................................................86 5.1.2 Indicators on the panel of the network switching layer ...................................................88 5.1.3 Indicators on the panel of the TC unit ............................................................................94 5.1.4 Indicators on the panels of the POWB and POWP units ................................................96 5.1.5 Indicators on the panel of the GPRS unit .......................................................................97 5.2 INSPECTION BEFORE POWER-ON .....................................................................................101 5.3 STEPS OF POWER-ON.....................................................................................................102 5.4 CHECK OF BOARD STATUS...............................................................................................104

6 SOFTWARE INSTALLATION......................................................................................105


Page III of III

6.1 INITIAL INSTALLATION FLOW OF THE SYSTEM SOFTWARE.....................................................105 6.2 INSTALLATION OF MP .....................................................................................................106 6.3 INSTALLATION OF THE BACKGROUND OPERATION AND MAINTENANCE SYSTEM ......................109 6.4 SYSTEM DEBUGGING ......................................................................................................119 6.4.1 Contents of BS system debugging...............................................................................119 6.4.2 Debugging of the system setup function ......................................................................120 6.4.3 Troubleshooting test ....................................................................................................120 6.4.4 Service test..................................................................................................................123 6.4.5 Operation and maintenance subsystem test ................................................................125 6.4.6 GPRS test contents .....................................................................................................127 6.4.7 Installation and test records .........................................................................................128

7 PACKAGING, STORAGE AND TRANSPORTATION..................................................129

7.1 PACKING .......................................................................................................................129 7.2 STORAGE ......................................................................................................................131 7.2.1 Storage conditions .......................................................................................................131 7.2.2 Placement....................................................................................................................131 7.3 EQUIPMENT TRANSPORTATION AND PORTAGE....................................................................132

APPENDIX A BS SYSTEM ALARMS........................................................................................133

A.1 BSC ALARM LIST............................................................................................................133 A.2 BTS ALARM LIST ............................................................................................................135 A.3 GPRS ALARM LIST .........................................................................................................140 A.4 NOTIFICATION TYPE LIST .................................................................................................141

APPENDIX B UNIX COMMON COMMANDS............................................................................142

APPENDIX C ABBREVIATIONS ...............................................................................................151


Page 1 of 153

1 System Overview

1.1 System structure

The BSC, an important part of the GSM digital mobile communication system, is a component of the BSS (Base Station System). It aims to manage the radio resources on a radio network and is capable of supporting various services of GSM.

As an upgraded version of the ZXG10-BSC (V1.x), the ZXG10-BSC (V2) is a multi-module product designed on the basis of ETSI Specification Phase2+, with the capacity and processing capability reaching 2048 TRXs. It inherits all advantages of the ZXG10-BSC (V1.x), featuring high-reliability, high cost performance and excellent functions. The completely opened network platform helps to support various services of GSM, and it has an obvious edge over the similar equipment currently running on various networks.

1.1.1 GSM network structure

The composition of a GSM digital mobile communication network is as shown in Fig. 1-1.


Page 2 of 153

BSC

BTS

MSC/VLR

SGSN

SMC

HLR

EIR

MS

Other PLMN

GGSNGGSN

PDN TE

PSTNMSC/VLR

MAP-E

MAP-DUm

Abis

Gf

Gr

Gn Gp

Gd

Gs

Gb

Gi

A MAP-H

MAP-F

MAP-C

Fig. 1-1 Architecture of GSM mobile communication network

The ZXG10-BSC (V2) provides three interfaces in the GSM900/1800 and EGSM900 systems: its Abis interface connects the BTS, its A interface connects the MSC and its Gb interface connects the SGSN. In the system, it is mainly in charge of radio resources management, BS management and monitoring, power control, handover and BS traffic statistics.

1.1.2 Composition of BSS

Fig. 1-2 illustrates the structure and equipment of a typical ZXG10-BSS.


Page 3 of 153

MS

Ater Interface

Um Interface

BSC

BTS

TIC

Abis Interface

TC

A Interface

MSC

OMC

Q3 Interface

TIC

Abis Interface

SM SM

BIE

BTS

BIE

SGSN

Gb Interface

PLMN

PDN

Acon Interface

SM SMBIE

Abis Interface

BTS

Fig. 1-2 Architecture of ZXG10-BSS

Generally the BSS is composed of the BTS, BSC and TC:

1. BTS

The BTS (Base Transceiver Station) is the radio part in the BSS, and it includes the baseband unit, the carrier unit and the control unit. This station, controlled by BSC, serves as the radio transceiving equipment in a certain cell by implementing the conversion between the BSC and wireless channels, the radio transmission between the BTS and MS via the air interface, and other related control functions.

The BTS is interconnected with the BSC using the Abis interface, with E1 interface equipment configured at both sides.

2. BSC

Serving as the control part in the BSS, the ZXG10-BSC fulfills the switching function in the BSS. One end of the BSC can be connected with multiple BTSs, while the other with the MSC and OMC. The BSC is oriented to the radio network. Its main functions include radio network management; radio resources management; monitoring and managing wireless BS sites; controlling the establishment, connection and release of


Page 4 of 153

radio connections between BTSs and MSs; controlling the locating, handover and paging of MSs; providing voice coding, transcoding and rate adaptation; as well as the operation and maintenance of BSS. The quantity of BTSs controlled by the BSC in the BSS varies with the traffic volume.

3. TC (Trans-Coder)

The TC mainly implements the voice conversion between the various voice codes adopted in the radio interface of the GSM system and the 64kb/s A-law PCM codes. In addition, TC is also responsible for the data rate adaptation processing in circuit-type data services. In a typical application pattern, the ZXG10-TC is located between MSC and BSC.

With TC located at the side of the MSC, the low voice encoding transmission rate used on the air interface may reduce the cost of transmission lines through the transmission SubMultiplexer SM and BIE between the MSC and BSC and those between the BSC and BTS. If the SM is used between the BSC and TC, the interface between the near end and remote end (BSC and TC) is called Ater interface, while that between the TC and MSC is named A interface.

1.2 Hardware system structure

1.2.1 Module introduction

The ZXG10-BSC (V2) is of a multi-module structure and mainly contains the following seven functions:

1. Abis interface function

2. Circuit switching function

3. Packet switching function

4. Land equipment operation management and SS7 transfer function


Page 5 of 153

5. Radio resources management function

6. Transcoding and rate adaptation function

7. Sub-multiplexing function (designed for economizing the transmission equipment)

Different function unit names are categorized in the BSC (V2) based on the functions:

1. The function unit of the module that carries the BS interface function is named BIU (Abis Interface Unit). It is configured in the same shelf to complete the interface processing of the carrier frequency, and distribute traffic timeslots and signaling timeslots.

2. The function unit of the circuit switching module is named NSU (Network Switching Unit). It supports the network switching of 32K × 32K bits in frame consistency.

3. The function unit of the packet switching module is named as PCU (Packet Control Unit). It fulfills the GPRS function.

4. The function unit of the land equipment operation management and SS7 equipment is named SCU (System Control Unit). It implements direct management on the BSC land circuit equipment and transfer of SS7, ensuring consistent working of the BSC system.

5. The function unit of the radio resources management equipment is named RMU (Radio Management Unit) or RRU (Radio Resources Unit). It fulfills the service processing of 256/240 carrier frequencies.

6. The function unit of the transcoding and rate adaptation equipment is named TCU (Transcoding Unit) and AIU (A Interface Unit). It fulfills transcoding and rate adaptation.

Meanwhile, the modular structure enables the system to be configured with corresponding hardware/software according to the user capacity, and number of sites, etc. The module structure of the system is shown in Fig. 1-3.


Page 6 of 153

RMM1

RMM2

RMM7

SCM OMM

RMM8

...

Fig. 1-3 BSC module structure

1. OMM

It mainly fulfills configuration, management and maintenance of the foreground

equipment through the SERVER.

2. SCM

As the core of the BSC, this module is mainly for management maintenance of

the BSC equipment and allocation of SS7, and it consists of the following parts:

1) SCU (System Control Unit)

2) NSU (Net Switching Unit)

3) TCU (TransCoder Unit)

4) AIU (A Interface Unit)

5) BIU (Abis Interface Unit)

6) FSMU (Far SubMultiplexing Unit) and NSMU (Near SubMultiplexing Unit);

7) PCU (Packet Control Unit)

3. RMM (Radio Management Module)


Page 7 of 153

It is mainly for radio resources management and consists of RMUs. 1~8 RMMs

can be provided by the system.

1.2.2 Function structure

The general block diagram of the ZXG10-BSC is shown as Fig. 1-4:

NSU

BIU#11

RMU

BIU#12

BIU#81

RMU

BIU#82

NSMU

FSMU

…

8M× 2

2M× 8

Abis interface

RMM#1…

8M× 28M× 2

RMM#8

E1

…NSMU

FSMU

E1…

8M× 2

…

SCUBIE OMM

TCU AIU

TCU AIU

TCU

…

8M× 2

SCM

TCU AIU

TCU AIU8M× 2

…

A Interface

PCUGb Interface8M× 2

2M×16

Fig. 1-4 BSC system structure

Itemization of each function unit to boards helps to understand the basic structure of the BSC hardware system. Fig. 1-5 provides the basic structure of the BSC hardware system (the submultiplexing unit is omitted).


Page 8 of 153

MEM

MP MP

1RMU

MPMP

MPMPMP

SMEM

MP

SCU

BOSN

BIPP TCPP

TIC

TIC

SMB

#1

#6

…

E1× 4

#1（ 2× 8M）Abis Interface

BIU

BIPP

#2

MPMP LAPD

S

……

kRMU

SYCK

TCPP

DRT

DRT

AIPPTIC

TIC

#1

#n …

#1 #1

#8 #8… …

E1× 4

AIU

TCU

NSU

DRT DTI

MPMP MPMP MPMP

PCU

A Interface

…

…

MEM

MP MP

1RMU

MPMP

MPMPMP

SMEM

MP

SCU

BOSN

BIPP TCPP

TIC

TIC

SMB

#1

#6

…

E1× 4


BIU

BIPP

#2

MPMP LAPD

S

……

kRMU

SYCK

TCPP

DRT

DRT

AIPPTIC

TIC

#1

#n …

#1 #1

#8 #8… …

E1× 4

AIU

TCU

NSU

DRT DTI

MPMP MPMP MPMP

PCU

A Interface

…

…

BOSN

BIPP TCPP

TIC

TIC

SMB

#1

#6

…

E1× 4


BIU

BIPP

#2

MPMP LAPD

S

……

kRMU

SYCK

TCPP

DRT

DRT

AIPPTIC

TIC

#1

#n …

#1 #1

#8 #8… …

E1× 4

AIU

TCU

NSU

DRT DTI

MPMP MPMP MPMP

PCU

A Interface

…

…

Note 1: The shaded blocks represent the boards of the BSC (V2) that are compatible in BSC (V1)

Note 2: k≤8, n≤15

Fig. 1-5 Basic structure of the BSC hardware system

1.2.3 Rack structure

Based on different functions, the BSC system is designed with six types of shelves. The BSC system function can be achieved via the combination of these six shelves.

The six types of shelves are as follows:

1. BCTL (Backplane of ConTroL)

2. BNET (Backplane of NET)

3. BATC (Backplane of A interface and TransCoder)

4. BBIU (Backplane of Abis Interface Unit)

5. BSMU (Backplane of SubMultiplexing Unit)

6. GPRS shelf PCU (Packet Control Unit)


Page 9 of 153

For example, a small-capacity configuration is as shown in Fig. 1-6 (single

rack):

6 BBIU

5 BCTL (RMU)

4 BCTL (SCU)

3 BNET

2 BATC

1 BATC

Fig. 1-6 Single-rack configuration

The system capacity can be enlarged through adding the BCTL (RMU) shelves, thus one SCM module can carry a maximum of eight RMM modules, and the BBIU shelves and the BATC shelves should be added correspondingly.

There are various modes for TC configuration, e.g., it can be located at the BSC side, or at the MSC side. Such configuration correspondingly determines the plug-in location of the BATC shelf.

1.3 Equipment installation and commissioning process

Normal and reliable operation of the ZXG10-BSC (V2) on the network is closely related to the quality of the project installation. Therefore, it is particularly important to create a set of systematic and proper installation process. The equipment installation process is shown in Fig. 1-7.


Page 10 of 153

St art

Pr oject p rep aratio n

Sta rt inspec tion

Rack insta lla tion

Electr ic installatio n

Transmiss ionconnect ion

Po wer-onaccepted T roubles hooting

S oftw areinsta lla tion

S ystem t est

End

N

Y

Fig. 1-7 Installation process of the ZXG10-BSC (V2)


Page 11 of 153

2 Equipment Structure

2.1 Equipment structure

The ZXG10-BSC (V2) is of a multi-module structure, and in accordance with the capacity, it can be physically configured as a single-cabinet structure or a multi-cabinet structure.

2.1.1 Features of single-cabinet structure

The dimensions of the single-cabinet are as shown in Fig. 2-1.

2200

mm

810mm

870mm

600mm

Side board

Support arms

Front door ( two leaves)

Fig. 2-1 Diagram of single-cabinet structure

Rack dimensions: 2200mm × 810mm × 600mm (height × width × depth);


Page 12 of 153

the width varying to 870mm when a side board is added.

This single cabinet features the following:

1. Solid structure, cabinet skeleton welded into a whole with section steel, with enough rigidity and strength.

2. Simple and clear-colored in international pop color series, natural combination of navy blue and off-white making the cabinet tidy, lively and vivid.

3. Easily installed/removed, conducive to debugging and maintenance. Both the front and back doors can be opened at either side. And the mounting boards at the two sides can be removed/installed conveniently.

4. Installed on top of the cabinet is the ventilation meshwork. Cabinets adopt forced heat dissipation mode, so that the cool wind enters the cabinet from its bottom, through the crevices between the circuit boards on each layer, while the hot wind goes out from the top meshwork.

5. At most seven plug-in boxes can be installed in the cabinet (including a power plug-in box on top of the cabinet).

2.1.2 Features of multi-cabinet structure

The multi-cabinet features the following:

1. The multi-cabinet structure means that many single cabinets with the same basic structure and dimensions are arrayed in an orderly row.

2. The four support arms under each single cabinet can be adjusted to keep them horizontal and at the same height. The cabinets can be located on the ground of the equipment room directly, or fixed on the section steel base in the equipment room without the four support arms.

3. When the cabinets are arranged in a row, the side boards are mounted at both sides of the array of cabinets while between the cabinets, there is none, as shown in Fig. 2-2. For multi-cabinet in more than one row,


Page 13 of 153

the side boards should be mounted at both sides of each row.

SideboardSide

board

Fig. 2-2 Multi-cabinet in one row

4. When the cabinets are arranged in one row, the upper and lower beams are tightly

fixed with bolts between the adjacent cabinets.

2.1.3 Structure features of the plug-in box

1. Dimensions of all the plug-in boxes: 279.5mm × 790mm × 319mm (height × width × depth).

2. Simply structured: it is composed of aluminum front beam, aluminum back beam, right/left side board and guide rail bar. The plug-in boxes with different functions just vary in the back plane and circuit cards.

3. The guide rail of the plug-in box is made of aluminum profile, and each plug-in box has 27 slots with the interval of 25mm between adjacent slots. The plug-in box structure is shown in Fig. 2-3.


Page 14 of 153

279.

5mm

319 m

m

790mm

25mmSide board

Aluminum back beam

Guide rail bar Backplane

Aluminumfront be am

Fig. 2-3 Plug-in box structure

2.1.4 Structure features of the card

The dimensions of all the plug-in PCBs are: 300mm × 234mm × 1.5mm (height × width × depth)

A card is composed of the panel, ejector lever and PCB. The name on the panel is corresponding to the slot on the plug-in box. On a PCB there are two plugs corresponding to the sockets on the back plane. The plugs are either 64-core or 96-core depending on the number of inlet wires. The structure of a card is shown in Fig. 2-4.


Page 15 of 153

234mm

300m

m

1.04

1.5mm

Plugs

Panel

Ejector lever

Fig. 2-4 Card structure

2.2 BSC rack configuration

2.2.1 No submultiplexing

1. N_trx≤240

For a small capacity, e.g., 240 TRXs, only one rack is needed, called dual-module BSC (one SCM and one RMM), and Fig. 2-5 illustrates the rack configuration.

Note: The number of the modules here corresponds to that of the BCTLs


Page 16 of 153

on the rack.

BBIU

BCTL (RMU)

BCTL (SCU)

BNET

BATC

BATCLayer 1

Layer 2

Layer 3

Layer 4

Layer 5

Layer 6

Fig. 2-5 N_trx≤240 rack configuration

If there are not many TRXs, just one layer of BATC might suffice.

2. 240<N_trx≤480

Here two racks should be configured to meet the capacity requirement, called three-module BSC, and Fig. 2-6 illustrates the rack configuration.

＃1

BBIU

BCTL (RMU)

BCTL (SCU)

BNET

BATC

BATCLayer 1

Layer 2

Layer 3

Layer 4

Layer 5

Layer 6

＃2

BBIU

BCTL (RMU)

BATC

BATC

Fig. 2-6 240<N_trx≤480 rack configuration


Page 17 of 153

3. 480<N_trx≤720

Here three racks should be configured to meet the capacity requirement, called four-module BSC, and Fig. 2-7 illustrates the rack configuration.

＃1

BBIU

BCTL(RMU)

BCTL (SCU)

BNET

BATC

BATCLayer 1

Layer 2

Layer 3

Layer 4

Layer 5

Layer 6

＃2

BBIU

BCTL (RMU)

BATC

BATC

BATC

BATC

＃3

BBIU

BCTL (RMU)


4. 720<N_trx≤960

Here three racks should be configured to meet the capacity requirement, called five-module BSC, and Fig. 2-8 illustrates the rack configuration.

＃1

BBIU

BCTL (RMU)

BCTL (SCU)

BNET

BATC

BATCLayer 1

Layer 2

Layer 3

Layer 4

Layer 5

Layer 6

＃2

BBIU

BCTL (RMU)

BATC

BATC

BATC

BATC

＃3

BBIU

BCTL (RMU)

BBIU

BCTL (RMU)

BATC

BATC



Page 18 of 153

2.2.2 Rack configuration with submultiplexing

There are two submultiplexing access points in the ZXG10-BSC (V2): Acon interface and Ater interface, respectively as submultiplexing interfaces at the RMM and TC sides selected by users.

The number of sub-multiplexing units is calculated according to the number of modules located at the far end. When the Ater interface is a submultiplexing one, all TC units are located at the far end. Then every four layers of TC shelves need one pair of submultiplexing units (one NSMU and one FSMU) and one far-end TC rack. When the Acon interface is a submultiplexing one, every two far-end RMMs need one NSMU and several FSMUs (the number of FSMUs equals to that of the far-end RMM racks). The quantity calculation, according to the specific conditions during implementation, employs the following principles: every two RMMs in the same RMM room can share one far-end RMM rack, while the far-end RMMs in different RMM rooms cannot share the far-end RMM rack and FSMU (although they can share the NSMU).

1. Far-end racks in the case of sub-multiplexing

1) Far-end RMM rack

One far-end RMM rack is composed of one far-end sub-multiplexing shelf and

one or two groups of RMMs. The rack diagram is shown in Fig. 2-9.

BBIU-1Layer 6

BCTL (RM U-1)Layer 5

BBIU-2Layer 4

BCTL (RM U-2)Layer 3

FSM ULayer 2

Layer 1

Fig. 2-9 Far-end RMM rack diagram


Page 19 of 153

As required, one or two RMM modules can be selected.

2) Far-end TC racks

One far-end TC rack is composed of one far-end sub-multiplexing shelf and up

to four TC shelves. The rack diagram is shown in Fig. 2-10.

Layer 6

FSMULayer 5

BATC-1Layer 4

BATC-2Layer 3

BATC-3Layer 2

BATC-4Layer 1

Fig. 2-10 Far-end TC rack diagram

2. Near-end BSC racks in the case of sub-multiplexing

The rack diagram of the BSC central rack in the case of sub-multiplexing is illustrated in the following description, where we will use these abbreviations:

N13 – indicates that the TC is located at the near-end, one RMM is located at the near end, and three RMMs are located at the far end.

F21 – indicates that the TC is located at the far-end, two RMMs are located at the near end, and one RMM is located at the far end.

In addition, for “BSMU ()”, characters in brackets express the connected far-end unit.


Page 20 of 153

The locating principle of the near-end rack is to place sub-multiplexing shelves on Rack 1 and 2, and the rest by sequence.

1) Near-end BSC rack configuration in the case of N31

In this case, the near-end BSC includes all TCs and three RMMs; and the

far-end BSC has two RMMs. The near-end BSC rack configuration diagram is

shown in Fig. 2-11.

Layer 6

Layer 5

Layer 4

Layer 3

Layer 2

Layer 1

BSM U（ BBIU-1）

BCTL（ SCU）

BNET

BATC-1

BATC-2

#1

BBIU-2

BCTL（ RM U-2）

BATC-3

BATC-4

BATC-5

BATC-6

#2

BBIU-3

BCTL（ RM U-3）

BBIU-4

BCTL（ RM U-4）

BATC-7

BATC-8

#3

Fig. 2-11 Near-end BSC rack configuration diagram in the case of N31

2) Near-end BSC rack configuration in the case of N22

In this case, the near-end BSC includes all TCs and two RMMs; and the

far-end BSC has two RMMs. The near-end BSC rack configuration diagram is

shown in Fig. 2-12.

Layer 6

BSMU(BBIU-1~2)Layer 5

BCTL( SCU)Layer 4

BNETLayer 3

BATC-1Layer 2

BATC-2Layer 1

#1

BBIU-3

BCTL(RMU-3)

BATC-3

BATC-4

BATC-5

BATC-6

#2

BBIU-4

BCTL(RMU-4)

BATC-7

BATC-8

#3


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Fig. 2-12 Near-end BSC rack configuration diagram in the case of N22

3) Near-end BSC rack configuration in the case of F31

In this case, the near-end BSC includes three RMMs; and the far-end BSC

includes all TCs and one RMM. The near-end BSC rack configuration diagram

is shown in Fig. 2-13.

Layer 6

B SM U (BB IU -1)Layer 5

BCTL(SCU)Layer 4

B N ETLayer 3

BSM U (BATC-1~4)Layer 2

BSM U (BATC-5~8)Layer 1

#1

BBIU -2

BCTL(RM U-2)

BBIU -3

BCTL(RM U-3)

#2

B BIU-4

BCTL(RM U -4)

#3

Fig. 2-13 Near-end BSC rack configuration diagram in the case of F31

4) Near-end BSC rack configuration in the case of F22

In this case, the near-end BSC includes two RMMs; and the far-end BSC has

all TCs and two RMMs. The near-end BSC rack configuration diagram is

shown in Fig. 2-14.

Layer 6

B S M U (B B IU -1~2)Layer 5

B C TL(SC U )Layer 4

B N E TLayer 3

B SM U (B A TC -1~4)Layer 2

B SM U (B A TC -5~8)Layer 1

#1

B B IU -3

B C TL(R M U -3)

B B IU -4

B C TL(R M U -4)

#2

Fig. 2-14 Near-end BSC rack configuration diagram in the case of F22


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2.2.3 GPRS rack configuration

The ZXG10-BSC (V2) GPRS is of standard configuration with only one rack including a set of GIU and eight sets of SPCUs. The rack number is arranged as GPRS rack following BSC rack when the racks are arranged side by side, and the GPRS rack structure diagram is as shown in Fig. 2-15.

B G IU

B P C U 1

B P C U 2

B P C U 3

B P C U 4

L a y e r 1

L a y e r 2

L a y e r 3

L a y e r 4

L a y e r 5

L a y e r 6

Fig. 2-15 ZXG10-BSC (V2) GPRS shelf diagram

In the ZXG10-BSC (V2) design, one SPCU unit contains up to seven BRP boards, three FPR boards, all of them are N+1 backed up. Of them, one BRP board can support up to 80 cells and 80 PS channels. Thus, one fully configured SPCU unit, containing up to six active BRP boards, can support a maximum of 480 cells or 480 PS channels. One FRP board at the Gb interface can process up to 10 NSVC. Therefore, one fully configured SPCU unit, containing up to two active FRP boards, can be configured with a maximum of 20 NSVCs.

2.3 Board configuration of each layer of units

1. The board configuration of the BBIU is shown in Fig. 2-16.

2

POWB

1 3

TIC

4

TIC

5 6

TIC

7

TIC

8 9

TIC

10

TIC

11

BIPP

12

BIPP

13

COMI

14

COMI

15

BIPP

16

BIPP

17

TIC

18

TIC

19 20

TIC

21

TIC

22 23

TIC

24

TIC

25 26

POWB

27


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Fig. 2-16 BBIU board configuration

2. The board configuration of the BCTL (RMU) is shown in Fig. 2-17.

2

POWB

1

SMEM

3 4 5

MP

6 7 8 9

MP

10 11 12

COMM

13

COMM

14

COMM

15

COMM

16

COMM

17

COMM

18

COMM

19

COMM

20

COMM

21

COMM

22

COMM

23

COMM

24

COMM

25

COMM

26

POWB

27

Fig. 2-17 BCTL (RMU) board configuration

3. The board configuration of the BCTL (SCU) is shown in Fig. 2-18.

2

POWB

1

SMEM

3 4 5

MP

6 7 8 9

MP

10 11 12

COMM

13

COMM

14

COMM

15

COMM

16

COMM

17

COMM

18

COMM

19

COMM

20

COMM

21

COMM

22

COMM

23

COMM

24

PEPD

25

MON

26

POWB

27

Fig. 2-18 BCTL (SCU) board configuration

4. The board configuration of the BNET is shown in Fig. 2-19.

2

POWB

1

CKI

3

SYCK

4 5 6

SYCK

7 8 9

BOSN

10 11

BOSN

12

DSNI

13

DSNI

14

DSNI

15

DSNI

16

DSNI

17

DSNI

18

DSNI

19

DSNI

20

DSNI

21

DSNI

22 23 24 25 26

POWB

27

Fig. 2-19 BNET board configuration

5. The board configuration of the BATC is shown in Fig. 2-20.

2

POWB

1

TCPP

3

TCPP

4

E/DRT

5

E/DRT

6

E/DRT

7

E/DRT

8

E/DRT

9

E/DRT

10

E/DRT

11

E/DRT

12

AIPP

13

AIPP

14

TIC

15

TIC

16 17

TIC

18

TIC

19 20

TIC

21

TIC

22 23

TIC

24

TIC

25 26

POWB

27

Fig. 2-20 BATC board configuration


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6. The board configuration of the NSMU is shown in Fig. 2-21.

The BSMU shelf can provide the near-end sub-multiplexing function, called the NSMU.

2

POWB

1 3 4 5 6 7 8 9

NSPP

10

NSPP

11

TIC

12

TIC

13 14

TIC

15

TIC

16 17

TIC

18

TIC

19 20

TIC

21

TIC

22 23 24 25 26

POWB

27

Fig. 2-21 NSMU board configuration

7. The board configuration of the FSMU is shown in Fig. 2-22.

The BSMU shelf can provide the far-end sub-multiplexing function, called the FSMU.

2

POWB

1

CKI

3

SYCK

4 5 6

SYCK

7 8 9

FSPP

10

FSPP

11

TIC

12

TIC

13 14

TIC

15

TIC

16 17

TIC

18

TIC

19 20

TIC

21

TIC

22 23 24 25 26

POWB

27

Fig. 2-22 FSMU board configuration

8. The board configuration of the PCU is shown in Fig. 2-23.

BRP

2

POWB

1

BRP

3

BRP

4

BRP

5

BRP

6

BRP

7

FRP

8

FRP

9

FRP

10

FRP

11

PUC

12

PUC

13 14

PUC

15

PUC

16

FRP

17

FRP

18

FRP

19

BRP

20

BRP

21

BRP

22

BRP

23

BRP

24

BRP

25

BRP

26

POWB

27

Fig. 2-23 PCU board configuration

9. The board configuration of the GIU is shown in Fig. 2-24.


Page 25 of 153

2

POWB

1 3 4

HMS

5

HMS

6 7 8 9

GIPP

10

GIPP

11

TIC

12

TIC

13 14

TIC

15

TIC

16 17

TIC

18

TIC

19 20

TIC

21

TIC

22 23 24 25 26

POWB

27

Fig. 2-24 GIU board configuration

2.4 Equipment parameters

The subsystem of the ZXG10-BSC is designed for the GSM900/1800 and EGSM900 systems, thus to control and monitor the BSs of 900MHz, 1800MHz and extended 900MHz specified in the GSM900/1800 and EGSM900 Specifications. It also fulfills the handover process between two cells in different frequencies of GSM900 and 1800, and implements proper configuration and adjustment to the planning of the two different cells.

While as a packet-style data service of the GSM, the GPRS is introduced at the GSM Phase2+, and provides end-to-end mobile data service based on the packet switching and transmission technology. It can utilize the radio resources and network land resources efficiently, and is especially applicable to long-term, small-traffic burst data services.

The main technical performance and parameters of the ZXG10-BSC (V2) is as follows:

1. Standard BSC in the switching matrix of 32K × 32K capacity.

2. Radio resources management and BS monitoring functions, implementing BSS operation and maintenance management and BS testing.

3. Supporting connection, paging, location and switching of the MS, providing the TRAU and GPRS functions, and supporting the uplink and downlink data service transmission functions of the MS.

4. The TRAU adopts the VAD technology, supporting discontinuously


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sending and receiving the DTX.

5. The TRAU can be set with an independent rack as independent equipment. The TRAU is shared by multiple BSCs or built in the BSC or MSC.

6. The PCU can provide cross connection function of the circuit service, enabling the A interface and Gb interface services to multiplex one PCM line, the timeslot of which can be flexibly configured.

7. Supporting transmission in both acknowledgement and non-acknowledgement mode of the uplink and downlink packet data.

8. Supporting channel coding modes of the CS1 ~ CS4, and dynamically adjusting the channel coding mode in accordance with the monitoring and testing results.

9. The MAC is in the dynamic allocation mode.

10. The PDCH coexists with the circuit service channel in the cell, and the dynamic conversion between the PDTCH and TCH channels according to the service status is supported.

11. Supporting the GSM900/1800 MHz and EGSM900M BS, and the automatic switchover of the MS between different modes.

12. Supporting the star, chain, ring and tree networking of the BTS.

13. Support multiple handover modes: Synchronized, asynchronized, pseudo-synchronized and pre-synchronized handover.

14. Supporting CBCH.

15. Supporting the SMS in both Chinese and English (point-to-point SM and cell broadcast SM).

16. Supporting the frequency hopping scheme in the unit of timeslot, and the TDMA frame frequency hopping is an instance of the timeslot frequency hopping.

17. Completely meeting all the data requirements of the power control


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and switching control indicated in the GSM05.08 Specification.

18. Supporting macro cellular, micro cellular and pico cellular systems.

19. Supporting concentric and multi-layer networking technologies.

20. Supporting a maximum of 512 cells, 1024 TRXs, featuring powerful processing capability, and capable of reducing the networking complexity of the system, improving the network quality and economizing the equipment room investment.

21. The largest traffic volume: 2000 Erlang (Erlang is the traffic load unit).

22. BHCA: More than 250K.

23. The interface link capability is as shown in Table 2-1.

Table 2-1 Interface link capability

Interface link type Maximum capacity

Abis interface 320 * E1 trunks

SS7 link 16 * 64K bit/s links or two 2M SS7 links

A interface 256 * E1 trunks

Gb interface 64M bit/s

24. The number of the A interface and Abis interface links can be flexibly configured as required.

25. The reliability index is the same as that of the switching system, and is compliant with specifications of the Red Papers of the Ministry of Post and Telecommunication and the YDN065-1997: the MTBF ≥ 0.1 million hours.


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26. Parameters of the system’s working environment and the BSC racks are shown in Table 2-2.

Table 2-2 Parameters of the system’s working environment and the BSC racks

Parameter name Parameter index

Power -48VDC

Rack dimensions

2200mm (H) × 810mm (W) × 600mm (D) (excluding the left/right side boards)

2200mm (H) × 870mm (W) × 600mm (D) (including the left/right side boards)

Power consumption ≤600W

Weight ≤200kg (excluding the left/right side boards)

≤270kg (including the left/right side boards)

Ambient temperature: 15°C~30°C (long-term)

Relative humidity 40%~65% (long-term)

DC voltage fluctuation range -57V~-40V

AC voltage fluctuation range 198V~242V

Frequency deviation 50Hz±5Hz

The software structure of the ZXG10-BSC (V2) features the following:

1. Perfect fault tolerance of the BSS state machine can allow the sequence of various messages of A interface and Gb interface, thus improving the butting capability between the BSC and various types of MSCs/SGSNs.

2. The BSS state machine can enhance the traffic processing capacity of BSC.

3. It has a perfect design in transaction handling, and features high reliability and security.

4. It has an automatic emergency self-protection system, so as to guarantee the user application in case of BCCH carrier frequency failure.

5. The diagnosis and testing system and monitor-alarming system ensure a secure and reliable operation of the system.

6. It can automatically adjust the configuration of the circuit service and packet service in accordance with the practical services, thus ensuring full use of the radio resources.


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3 Preparation of Installation

3.1 Check of installation environment

3.1.1 Requirements on equipment room

1. Layout of equipment room

Generally, the equipment room is classified into main equipment room and

auxiliary equipment room. The main equipment room is used to install the

principal equipment of the BSC system, while the auxiliary equipment room is

used to install such accessories as the operation and maintenance equipment,

manual position, UPS, battery set, etc. To make the principal equipment run in

an independent environment and at the same time facilitate maintenance and

management, the main and auxiliary equipment rooms must be separate but

not far from each other to make the connecting line between them as short as

possible. The operation and maintenance station is arranged in the way that

the operation and maintenance personnel face the front side of the principal

equipment. Generally the main equipment room and the operation and

maintenance room are separated with a glass wall. And, once conditions permit,

the principal equipment and the primary power supply should better not be

installed in the same room.

2. Area of equipment room

The area of the equipment room should be sufficient to hold the principal

equipment and auxiliary equipment of the BSC system for the final capacity

and to pile materials and equipment. In front of the BSC system cabinet, there

should be at least 1.5m clear space for the convenience of opening the door

and maintenance. When cabinets are arranged into multiple rows, the front

side of the first row of cabinets faces the operation and maintenance console,

and two rows of cabinets are arranged back to back. The distance between the

back sides of two rows of cabinets is not less than 1.2m, and the distances

between the front/back/left/right side of a cabinet row and the wall is not less

than 0.8m (the distance between the side with adjusting and testing devices


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and the wall is 1m).

3. Height of the equipment room

The height of the equipment room refers to the clear height from the beam

bottom or wind duct to the upper surface of the floor. It shouldn’t be lower than

3m for upper routing and 2.7m for lower routing.

4. Walls and doors/windows of the equipment room

The walls of the equipment room should be treated with anti-absorbing, fireproof and dampproof coatings or wall paper, or coated with lusterless paint. The layout of the doors and windows of the equipment room should be reasonable with the effective height no less than 2m and width of 1m after opening the door. Doors and windows should better be double-layer glass, sealed with the dust-proof rubber strip, and should be kept clean.

5. Floor of the equipment room

The weight-bearing capacity of the floor in the main equipment room is more than 450kg/m2, and that of the auxiliary equipment room is more than 300kg/m2. The floor must be laid and supported in a flat and firm way. The level error per square meter is no more than 2mm.

The floor must be anti-static. The system resistance value of the floor should comply with YD/T 754-95 General Rules for Anti-Static Protection of Communications Equipment Room (issued in June 1995). The floor must be statically grounded by connected to the grounding facilities with highly conductive line via the 1MΩ current-limiting resistor.

In addition, the optimum height of the floorboard is 300mm to 330mm, without garish patterns. The paints on the surface of the floor shall be lusterless without the volatilization of harmful substances. Dampproof, rodent-resistant and mothproof precautions shall be taken under the floor.

If the lower wiring mode is employed, hidden pipes, ground slots and openings shall be reserved under the floor, and their quantities, locations and sizes shall meet the requirements for laying various wires and cables,


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with the convenience for maintenance and laying of cables during future capacity expansion.

The equipment environment needs to meet the following requirements as well:

1. Requirements for temperature and relative humidity

The temperature and humidity of the working environment inside the

equipment room are measured at the spot of 1.5m above the floor and 0.4m

away from the equipment when there is no protective plate in front of or at the

back of the equipment rack. The measured value of working environment of the

ZXG10-BSC shall meet the following requirements as shown in Table 3-1.

Table 3-1 Requirements of the ambient temperature and relative humidity

Name Long-term working conditions Short-term allowed conditions

Temperature 15°C~30°C 0°C ~45°C

Relative humidity 40%~65% 20%~90%

Here short-term working duration means no more than 48 consecutive hours, and no more than 15 accumulated days in one year.

2. Electromagnetic interference resistance design

The equipment room shall be far away from high-power radio transmitting station, radar transmitting station, and high-frequency large-current equipment. The actual electric field intensity radiated to the equipment room shall be controlled below 300mV/m, and the intensity of magnetic field shall be less than 11Gs.

Generally, the following anti-radiation measures are recommended:

1) Shield the equipment room or shield against the definite electromagnetic radiation interference source.

2) Install a shielding wall between the principal equipment of the system


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and the equipment containing a transmitter with high-frequency radiation, and using separate power supply lines.

3) The power line and the conductive line in the pipe shall be grounded reasonably and the shield layer of all the cables shall be grounded.

4) Twist the signal lines and return lines so that the conductive voltage caused by the line radiation interference offsets itself.

5) Separate the power supply lines and signal lines as much as possible and avoid laying them down in parallel.

6) Strictly separate the grounding wires of the AC and DC power supplies in the equipment room.

3. Air-conditioning and ventilation design

Too high or too low temperature and humidity in the equipment room will bring about unfavorable effects to the equipment’s life span. For example, when the temperature is 10°C over the normal temperature, the equipment life span will be half reduced. Too low temperature will weaken the performance of the optical components, transistors and other devices. Under long-term high relative humidity, the insulation of some insulating material may degrade or leakage may even happen, and the metal parts of the equipment may corrode. While the low relative humidity in long term will make the insulating gaskets dry and shrink thus the fixed screws may become loose and strong static discharge may be generated, damaging the CMOS circuit on the machine.

In order to guarantee the environment conditions for equipment operation, air-conditioning and ventilation devices must be installed. Generally, the main equipment room shall be equipped with the air-conditioning equipment that runs perennially, and other auxiliary equipment rooms shall also be equipped with the air-conditioning equipment that runs seasonally according to various conditions (including the climate condition and the economic condition of the user).

The basic requirements of the air-conditioning equipment are:

1) Air-conditioning humidity: 30% ~ 75%


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2) Air-conditioning temperature: 18°C ~ 28°C

The capacity of the air-conditioning and ventilating system shall be determined on the basis of calculating the quantity of heat produced by the principal equipment of the system plus the quantity of heat produced by external heat sources (such as the heat radiated by the sun to the equipment room through the window or wall, the heat produced by the maintenance personnel inside the equipment room as well as the heat brought by the maintenance personnel when coming in or going out).

In order to guarantee the safe and reliable operation of the air-conditioning and ventilation system, the air-conditioning equipment is generally required to be dual systems, with the capacity of each system more than half of the total air-conditioning capacity.

The airtight conditions of the equipment room must not be damaged due to the installation of air-conditioning equipment, meanwhile, the content ratio of fresh air delivered to the equipment room shall not be less than 5%, so as to guarantee the appropriate air freshness inside the room.

To ensure the cleanness of the air, the dirt density and particle size, the densities of salts, acids and sulfides should strictly comply with CF 014-95 Communications Equipment Environment Conditions (Provisional Regulations), because these harmful gases may speed up metal corrosion and aging of some parts. Measures shall also be taken to prevent the incursion of such harmful gases as SO2 and H2S into the equipment room, so as to protect the health of the working personnel.

Since hot air generally flows upward, the cooling and heat radiation of the principal equipment also employs the upward exhausting mode. So, when centralized air-conditioning system is installed, the air should be taken in from the bottom and returned to the top. The air inlet is located under the movable floor, which is helpful for the heat radiation of the equipment. The blast pipe is not installed on the top, guaranteeing that no dew will be produced under any circumstance.

Generally speaking, large equipment rooms should be equipped with the air-conditioners with humidity regulation, while small equipment rooms


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may just be equipped with the common-type cabinet or window air-conditioners.

4. Fire protection design

The main building of the equipment room must meet corresponding requirements in the national GBJ 16-17 Fire Protection Specifications in Building Engineering. Based on the local fire protection regulations, the corresponding fire equipment shall be equipped and sufficient fire passages shall be reserved. Notice boards bearing “Key Fire Protection Site” shall be hung at proper locations. It is strictly forbidden to store flammable or explosive articles in the principal or auxiliary equipment room, and notice boards with “No Smoking” or “Smoking and lighting fires strictly forbidden” shall be posted up at eye-catching places. Effective fire-fighting equipment shall be equipped and placed within easy access, and effective water supply facilities for fire fighting shall be installed at proper positions. The stored amount of water for fire protection is expected to guarantee the fighting of fire for 2 hours. However, it is inadvisable for the water supply pipes, water drainage ducts and rainwater ducts to pass through the equipment room, and fire hydrants should not be installed in the equipment room. Alarming devices for smog and high temperature shall be installed and inspected frequently to guarantee their good performances.

5. Illumination design

An incandescent light bulb (or emergency lighting device) should be installed at a proper place between the racks to provide light for equipment installation and maintenance. At the same time, the equipment should be kept from long-time exposure to the light or sunshine lest that the circuit boards or components will easily distort or age due to the long-time high temperature. It is recommended that colored glass and non-tint transparent curtain be used for windows. The principal illumination of the equipment room employs fluorescent lamps that are embedded into the ceiling, with an average illumination of 300~450Lx.

6. Lightning protection design

The lightning protection design is the most important content in security design. When the height of the building’s main-body or its auxiliary facilities (such as chimney, antenna, and water tower) is over 15m, effective lightning protection measures shall be taken according to the lightning protection requirements for Class II civil buildings and


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constructions. In the lightning protection design, measures shall be taken to guard against direct-strike lightning and the incursion of lightning current. Protective measures should also be taken to defend flank attack lightning when a high-rise building serves as the equipment room. Flank attack lightning is often encountered in areas rich in lightning (e.g., Guangxi, Jiangxi, Guangdong, Fujian, Hunan, and Yunnan with more than 80 daily lightnings). Therefore, protective measures against flank attack lightning shall be taken in design in line with the specific conditions, e.g., connect the metal window frame of the building with the lightning protection lead wire, or install horizontal lightning-protection metal straps on the external surface of the wall by separating them with certain spaces along the height of the building.

The following lightning protection measures shall be taken for the main building body of the equipment room.

1) Install lightning protection nets or lightning protection straps on the parts of the building that are liable to lightning.

2) Protruding objects such as chimney, antenna and water tower, shall be equipped with overhead conductor or arrestor.

3) The sectional area of the lead wire of the lightning protection device is no less than 200mm2, with a distance not greater than 30m, and the impulse grounding resistance of the lightning protection grounding device for the building is not greater than 10Ω.

4) Outdoor cables and metal pipes are grounded before coming into the building;

5) The grounding entities shall be the metal parts (e.g., walls, reinforcing steel bars inside pillars) of the building itself, which shall be used as the lead wire of the lightning ground, and such lead wires shall be electrically connected with each other to balance the electric potential inside the building.

In the past, the lightning protection ground of the building was separated from the ground of telecom and power supply systems, and large distances were required between various grounding devices. However, due to such reasons as small building


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sites, most of these requirements of distance were not satisfied. In fact, they can not be separated in many circumstances, so it is advisable to employ joint grounding systems for the lightning protection of the buildings. The joint grounding system connects the operating ground and protection ground for telecom use and the lightning protection ground of the building as well as the ground of the industrial frequency AC power supply system together. The requirement for the grounding resistance of joint grounding is quite strict. Since the grounding resistance required for BSS equipment room is less than 10Ω, while the grounding requirements for different telecom equipment vary, the joint grounding resistance shall be determined according to the minimum resistance value of the various grounding devices.

In addition, proper lightning protection devices for the power supply must be installed to the lines of the mains input to the equipment room.

7. Quakeproof ability

The BSC room shall be equipped/installed with quakeproof facilities, so that the

switching system room has the ability to withstand the earthquake with a

seismic magnitude of 7 on the Richter scale.

8. Anti-static design

The influence of static electricity on the equipment may often be neglected, but it is a very serious problem, to which great attention must be paid. From the data available from related materials and the failure analysis made to the on-site repaired parts of ZTE Corporation, 50% of the component damage among damaged parts is caused by static electricity. In addition, the destruction of static electricity to the device is often not the once-for-all kind, it will accumulate these damages, and in this course, intermittent failure or performance deterioration will occur in the operation of the equipment. The static electricity may cause software fault, as a result, the electric switches and control circuits may not function properly or even act wrongly.

Static induction mainly originates from the following aspects:

1) External electrical fields, such as outdoor high-voltage power transmission lines and lightning.


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2) Internal systems of indoor environment, floor material and overall structure, etc.

3) Discharge of the static electricity on the body of the O&M personnel to the equipment through body contact.

In order to effectively eliminate the harm due to electric static discharge (ESD),

the following measures may be taken:

1) Ground the equipment well;

2) Lay anti-static floor and make grounding connection for the floor.

3) The O&M personnel should wear ESD wrist ring in operation, and connect the ESD ring with the electric static discharge hole on the equipment rack.

3.1.2 Requirements on power supply and grounding

1. DC power supply requirements:

1) Voltage range: the nominal voltage of the primary power supply to the equipment room shall be -48V, which has an allowance of -57V~40V.

2) The noise level indices of DC power supply voltages shall meet the general specifications of the former MPT.

3) The DC power supply shall have over-voltage/current protection and indication system.

2. AC power supply requirements:

1) Three-phase power supply: 380V±38V, 50Hz±2.5V, waveform distortion <5%

2) Single-phase power supply: 220V±22V, 50Hz±2.5V, waveform distortion <5%

3) The standby generator voltage waveform distortion shall be


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5%~10%.

3. Grounding requirements

Grounding plays an important role in guaranteeing a good electromagnetic condition and anti-interference ability for the operating environments of the principal equipment and auxiliary equipment of the system, so great attention must be paid.

Firstly, it should meet YD/T 1051-2000 General Technology Requirements on Power Support System of Communication Bureau (Station), details of which are mentioned in 6. Lighting protection design of 3.1.1. Next, certain factors that affect the grounding resistance should be taken into consideration such as state of soil, grounding body resistance and grounding cables.

1) The type of the soil has the greatest influence on the grounding resistance. For a place with poor soil state, resistance reducing agent (e.g., propenamide) can be added around the ground pole to reduce the resistance rate of the soil and the contact resistance between the soil and the grounding devices. Temperature and humidity may also affect the grounding resistance. When the temperature is lower than 0oC and the humidity is too low, the grounding resistance varies greatly. So in northern districts, the grounding stake may be buried deeply and the chemical auxiliaries may be added to meet the requirements for grounding resistance.

2) The connecting cables between the grounding stake and the grounding bolt on the principal equipment of the system shall be of copper core, with a sufficiently large sectional area that is generally no less than 50mm2. The length shall be as short as possible and the sectional area of the copper wire shall be increased further when the length exceeds 50m. Both ends of the connection wire shall be processed with tinning or thermal tin dipping, and the coating, varnish, paint and oxidized layer, etc., shall be removed from the fastening points, so as to guarantee good contact between the two metal surfaces. All the grounding connection parts should be protected against rusting, and the grounding bolts must be secured by using the mechanical method to guarantee the connection with low resistance.


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The grounding stake should be of angle iron with a length not less than 2m, and it would be best to use a grounding net if conditions permit.

3) It must be pointed out that, before the commissioning of the equipment, the user should take an accurate measurement of the grounding resistance, and provide data to the engineering personnel of our party. If the grounding resistance does not meet the requirement, principally, the commissioning should be postponed till some measures are taken by the user (our party may dispatch engineering personnel for assistance if necessary) and the grounding resistance meets the requirement. After the equipment is put into operation, the maintenance personnel must measure the grounding resistance regularly and record the results. If the grounding resistance increases, proper measures should be taken to reduce it, so as to meet the requirements for grounding resistance during equipment operation.

3.2 Instrument and meter preparation

1. Mechanical installation toolkit.

Professionals will complete mechanical installation and provide guide for

on-site installation.

2. Electrical installation toolkit. ZTE professionals must participate in electrical installation.

3. Other related instrument and meters contain the following types:

1) Straight screwdriver and cross screwdriver

2) Tweezers

3) Piers (nipper pliers, slope pliers, and pincer pliers)

4) Iron

5) Extractor


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6) Multimeter

7) Programming card

8) Eraser

9) Anti-static wrist strap

4. Installation notice

Before unpacking and installing the equipment on site, the user should notify ZTE engineers to go to the site.

3.3 Technical resources preparation

The commissioning personnel shall prepare the corresponding technical documents for reference:

1. ZXG10-BSC (V2) Technical Manual

2. ZXG10-BSC (V2) Installation Manual

3. ZXG10-BSC (V2) Operating Manual

4. ZXG10-BSC (V2) Maintenance Manual

3.4 Unpacking and inspection

As the ZXG10-BSC equipment is rather expensive, it should be well packed and attached with clear waterproof and shockproof marks during its transportation. After the equipment arrives at the operator’s installation site, it should be handled with care and kept away from sunlight and rain.

Before unpacking and inspecting, count the overall number of the components

against the attached shipping list, check whether the appearance of the case is

intact. If yes, unpack it. If there are cargo mistakes, shortage or the package is

severely damaged, stop unpacking immediately and report it to related


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departments to find out the cause.

1. Notes for the unpacking inspection

1) When the equipment arrives on site, both the engineers of ZTE Corporation and representatives of the user must be present for the unpacking inspection. If the customer unpacks the equipment on his own, ZTE Corporation will not be responsible for any harmful consequences.

2) During the unpacking, the equipment should be handled gently so as to protect the surface paint of the equipment. And please pay attention to the anti-static requirements of circuit boards.

2. Unpacking

Parts list and technical documentation are put in No. 1 packing box.

Connecting bolts between racks are put in the control cabinets.

1) First, open No.1 packing box. The installation personnel should first read the technical documents and check the list. If there is any damages inside the packages, careful inspection should be done and detailed records should be taken.

2) Wooden case for side boards: open the side cover, take out a pair of well-bound side plates, cut the band open and take the plates out.

3) Wooden case for doors: Open the side cover and take out the bound front and back doors, then cut off the binding strap and take out the two pairs of doors.

4) Wooden case for racks: first, open the top cover (cover with the arrow of storage and transportation), make the case upright, note that the support arm is adown, and pull out the racks from the case.

3. Counting the pieces

After unpacking, check the devices with the configuration table and packing list, check whether the accessories are complete, and whether the parts are deformed or damaged.


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Finally, the field engineers of ZTE and the user shall jointly sign the Unpacking and Inspection Report and return it to the Marketing Department and the local office in the specified time.


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4 Hardware Installation

4.1 Hardware installation flow

The installation steps of the ZXG10-BSC (V2) are briefly shown in Fig. 4-1.

Start

Constructenvironment of

equipment room

Install racks

Install POWP

Preliminaryinspection

End

Acceptanceinspection

Install otherequipment

Y

N

Y

N

Fig. 4-1 Installation flow of the ZXG10-BSC (V2)

4.2 Installation of the rack

4.2.1 Rack installation

1. Before rack installation, find out the wire-routing direction. For the top cabling mode, first remove the top cover of the rack.

2. For shockproof considerations, the rack still has to be reinforced. The


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base, as shown in Fig. 4-2, can be produced by the user or customized by ZTE, while the height of the bracket depends on the floor height.

1. Bracket 2. Channel section steel

Fig. 4-2 Schematic diagram of the base

3. Horizontal adjustment of the section steel base: Loosen the fixing bolts between the section steel guide rail and the bracket, and adjust the adjustable bolts between the rail and the bracket until the rail is horizontal; then add proper steel blocks between the rail and the bracket near the fixing bolts and loosen the adjustable bolts; finally, tighten the fixing bolts, as shown in Fig. 4-3.


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1. Standard floor 2. Channel section steel 3. Hexagonal bolt 4. Adjustable bolt

5. Bracket 6. Stand bar bolt 7. Spring washer, plain washer, nut 8. Steel block

Fig. 4-3 Schematic diagram of the base’s horizontal adjustment

4. Fixing of a rack: First remove the four stand bars under a rack, and fix the rack to the section steel base with bolts, plain washers, spring washers, and nuts, as shown in Fig. 4-4.

1. Standing column 2. Spring washer, plain washer, nut 3. Nut pad 4. Hexagonal bolt

Fig. 4-4 Schematic diagram of rack fixing


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4.2.2 Connection between racks

Racks can be connected in two modes:

Fig. 4-5 shows the first mode of rack connection. The short beams of the top and bottom shelves of the rack are equipped with connecting plates, between which four M8 × 25 hexagonal bolts, four plain washers, four spring washers and four nuts are used respectively to secure the two racks.

1. Spring washer, plain washer, nut 2. Connecting block 3. Hexagonal bolt 4. Shelf

Fig. 4-5 Schematic diagram of rack connection mode I

Fig. 4-6 shows the second connection mode. On the sides of the short beams of the top and bottom shelves of the rack there are mounting holes, where four M10 × 100 hexagonal bolts, four plain washers, four spring washers and four nuts are used to secure the two racks.

1. Spring washer, plain washer, nut 2. Short beam 3. Hexagonal bolt 4. Long beam

Fig. 4-6 Schematic diagram of connection mode II


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4.2.3 Connection between the side plate and rack

Side plates are attached to the left and right sides of the rack. The connection between the upper end of the side plate and the rack is shown in Fig. 4-7. The upper end of the side plate is connected to the short beam on the top via bolts with spring slip rings.

1. Pins, spring 2. Slip ring 3. Hanging board 4. Spring washer, plain washer, nut 5. Shelf 6. Upper end of the side plate

Fig. 4-7 Schematic diagram of connecting the upper end of the side plate to the rack

The lower end of the side plate can be connected to the rack in two modes.

1. As shown in Fig. 4-8, use M8 × 25 hexagonal bolts, plain washers, spring washers and nuts to connect the lower hanging board of the side plate to the connecting plate on the short beam of the bottom frame of the rack.

1.Spring washer, plain washer, nut 2. Beam 3. Connecting block 4. hexagonal bolt 5. Shelf 6. Lower end of the side plate


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Fig. 4-8 Schematic diagram of side plate-rack connection mode I

2. As shown in Fig. 4-9, on the lower hanging board of the side door and on the short beam of the bottom frame, there are mounting holes, where the M8 × 25 hexagonal bolts, plain washers, spring washers and nuts can be used in the fastening.

1. Washer 2. Hanging board 3. Hexagonal bolt 4. Shelf 5. Lower end of the side plate

Fig. 4-9 Schematic diagram of connection mode II

4.2.4 Installation of the front door and rear door

There are eight pivots installed on the rack framework. During installation of the front/rear door, place the bottom hole of the door to the sleeve on the pivot. And on the back of the upper part of the door there is a hook with a spring. Now pull it down till the pivot pin aims at the upper pivot. After the door is installed, it should be easily closed and opened. When the screws of the pivot are loosened, the location of the supporting board of the pivot can be adjusted to the left or right till equal door clearance is reached.

4.3 Installation of the power P (POWP) of the rack

4.3.1 Introduction to functions

At the top of the rack is the POWP distribution box, which has two primary inputs, and, after insulation, the two inputs are provided to the whole rack in two channels via the busbar of the rack. The fan inside the POWP


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distribution box cools the whole rack. The fan is also powered by the insulated primary power supply. Inside the power distribution box are three PCBs, two of which, on the left and right respectively, are boards with the same functions for insulating POWP.

The POWP distribution box has such functions as detecting the -48V voltage of the input primary power, monitoring the over-/under-voltage as well as monitoring, indicating and giving alarm for the system status and lightning protection.

4.3.2 Functionality

1. Two channels of primary power supply

The main feature of the POWP distribution box of the ZXG10–BSC (V2) is the 1+1 protection of the primary power supply. That is, if only one of the two primary power supplies is normal, then the busbars on both sides of the rack will keep a normal power supply, thus the power supply is kept stable. The primary power supply reaches the POWP insulating board via the 30A air switch.

2. POWP insulating board (POWI9806)

The function of the POWP insulating board is to insulate the input –48V from the output -48V to prevent the two primary power supplies from interfering with each other. At the input end of the primary power supply, over-voltage protection is available; while at the output end of the primary power supply, lightning protection is available. This board is especially designed for the safety and reliability of the main lines of the –48V, the –48V ground, and the protection ground (P.GND). The connecting wires between the terminals on the back of the POWP distribution box and the POWP insulating board and the connecting wires between the switch and the POWP insulating board are both soldered.

3. POWP detecting board (POWT9806)

The POWP detecting board functions to detect and display the status of


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the left and right primary power supply inputs and the status of the fans. This board adopts a chip-microprocessor system (89C51), and uses the A/D converter (MAX187) to detect the –48V output voltages of POWP on a real-time basis, monitor the supply of the POWP system and its operation, and report the results to the control layer via the RS485 bus as well.

4. Clear and reliable wire connections

The connecting wire of –48V, –48V ground and protection ground inside the POWP distribution box are reliable, and will not become loose even when the panel of the box is removed. For both the POWP distribution box and the POWP circuit board, wiring descriptions are provided to avoid any wrong installation. The –48V grounding wire and the protection grounding (P.GND) wire on the rear of the box are soldered and then fastened to the terminal. Wires inside the POWP distribution box are fixed with metallic clips so that the wires do not fall off. All slots of the POWP boards have lockers to avoid inverse insertion.

The terminals must be safe and reliable. The main connecting wires of the –48V, –48V ground, and protection ground employ the multi-strand soft wires with a diameter of 2.8mm, i.e., 19 strands altogether, each strand having a diameter of 0.06mm.

The colors of the –48V, –48V ground and the protection ground connecting wires must keep identical to those of the connecting wires on the busbar.

5. The system will be able to timely detect the output voltages and working statuses and give alarm timely

The POWP detection system can timely and accurately detect the –48V output voltage of the POWP through A/D conversion; and can timely report to the control layer via the RS485 bus the working conditions of the POWP and the fan system. Meanwhile, in hardware, it can display the working status on LEDs on a real-time basis and give timely alarms.

6. Reasonable thermal design with a little redundancy


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Against the maximum system load requirements and the worst working environments, the system thermal design is performed. On the basis of reasonable thermal design, and considering the long-time faultless operation of the POWP, the thermal design of the POWP has made adequate redundancy so that the life span of the power devices is prolonged, and system reliability is greatly enhanced.

7. Replacement of devices when power is on

Inside the POWP distribution box, the working status of the fan can be detected timely, and once the fan breaks down, it can be replaced when power is on.

8. Protection functions

When the input power supply is inverted, or the load is shorted, the air switch (30A) can effectively cut off the primary power supply. A fan short-circuit can burn the fan’s fuse, but the detecting circuit of the POWP board does not affect the -48V power supply. When any of the left and right power supplies fails or shuts down, the detecting board can still work normally.

4.3.3 Input, output and indicators

The POWP distribution box has two (left and right) primary power supply inputs on the rear, each consisting of–48V, –48V ground and protection ground (P.GND).

It has two (left and right) outputs on the rear, each consisting of –48V, –48V ground and the protection ground (P.GND). The output is fulfilled in the parallel dual mode. On the rear of the POWP distribution box there is an RS485 output port. The POWP detecting board has five red fan alarm indicators. In case a fan breaks down, the corresponding indicator will turn on. On the panel of the POWP distribution box there are four LEDs, whose meanings are given in the Table of POWB and POWP Panel Indicators in Section 5.1.4.


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4.4 Installation of internal wires

In the rack of the ZXG10-BSC (V2), there are various boards and backplane jumper cables with different configurations. Functions of boards vary with jumpers, including the clock interface board (CKI), digital switching network interface board (DSNI), trunk interface circuit board (DTI), module processor (MP), etc. In addition, jumper cables on the backplane will cooperate with the system RS485 bus to monitor functions of backplanes of each layer. Listed below are jumper descriptions in the alphabetical order.

4.4.1 Clock interface board (CKI)

The CKI board has a total of 20 jumpers ranging from X5 to X24, used to select the matching impedance under different clock references. The jumpers are described in Table 4-1:

Table 4-1 Jumper description for the CKI board

Jumper name Jumper description

X5~X8

Used respectively to select the line matching impedance for the 2MHz references of 2MHz0, 2MHz1, 2MHz2, and 2MHz3. When pin 1 and pin 2 are connected, it matches with the 120Ω characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75Ω characteristic impedance.

X9~X12

Used respectively to select the line matching impedance for the 5MHz references of 5MHz0, 5MHz1, 5MHz2 and 5MHz3.When pin 1 and pin 2 are connected, it matches with the 120Ω characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75Ω characteristic impedance.

X13~X15 Select the characteristic impedance of line 0 of the 2Mb/s reference. When pin 1 and pin 2 are connected, it matches with 120Ω characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75Ω characteristic impedance.

X16~X18 Select the characteristic impedance of line 1 of the 2Mb/s reference. When pin 1 and pin 2 are connected, it matches with 120Ω characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75Ω characteristic impedance.

X19~X21

Select the characteristic impedance of line 2 of the 2Mb/s reference. When pin 1 and pin 2 are connected, it matches with the 120Ω characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75Ω characteristic impedance.

X22~X24

Select the characteristic impedance of line 3 of the 2Mb/s reference. When pin 1 and pin 2 are connected, it matches with the 120Ω characteristic impedance. When pin 2 and pin 3 are connected, it matches with the 75Ω characteristic impedance.


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4.4.2 Digital switching network interface (DSNI) board

The DSNI board has a total of 3 jumpers, X3, X4A, and X4B, which can be configured to connect the COMM board (of MP level) and the PP board (of PP level). The jumper descriptions are listed in Table 4-2:

Table 4-2 Jumper description for the DSNI board

Jumper name Jumper description

X3, X4A and X4B

Used for DSNI configuration; when pin 1 and pin 2 are connected, configure it as DSNI of MP level, connecting with the COMM board; when pin 2 and pin 3 are connected, configure it as DSNI of PP level, connecting with the PP board.

4.4.3 Trunk interface (TIC) board

The TIC board has a total of six DIP switches ranging from S2 to S7, which are used to configure the matching impedance and line frame format. Descriptions of DIP switches are listed in Table 4-3.

Table 4-3 Descriptions of DIP switches for the TIC board

Line frame format configuration

Software-related configuration Description TIC position

S2

At the Gb interface 120 B X X

75 A X X

off

on

, X0XX

There is no E1 frame format on the line. It works in transparent mode.

At the non-Gb interface 120 B X X

75 A X X

off

on

, X1XX Transmit in the E1 frame format

Impedance matching configuration

Line impedance

75Ω 120Ω

Software-related configuration

S2 120 B X X

75 A X X

off

on

, 1XXX 120 B X X

75 A X X

off

on

, 0XXX

4-line E1 impedance matching

S3 120 120 120 120

75 75 75 75

off

on

, 1111 120 120 120 120

75 75 75 75

off

on

, 0000


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Bt8370 of line 1 S4 120 120 120 120

75 75 75 75

off

on

, 1111 120 120 120 120

75 75 75 75

off

on

, 0000

Bt8370 of line 2 S5 120 120 120 120

75 75 75 75

off

on

, 1111 120 120 120 120

75 75 75 75

off

on

, 0000

Bt8370 of line 3 S6 120 120 120 120

75 75 75 75

off

on

, 1111 120 120 120 120

75 75 75 75

off

on

, 0000

Bt8370 of line 4 S7 120 120 120 120

75 75 75 75

off

on

, 1111 120 120 120 120

75 75 75 75

off

on

, 0000

Note: 1=on; 0=off

4.4.4 Module processor (MP)

The MP board has one 8-bit DIP switch, which is used to set the MP node number. In BSC, this value indicates the BSC module number in the same NE, within the range of 1 to 32 (on the PCB, 1 indicates the lowest bit, while 8 the highest bit). It will do so far the foreground and background configurations are the same. The DIP switch of MP is shown in Fig. 4-10.

Value: 1 Value: 32

Fig. 4-10 DIP switch of MP

4.4.5 Configuration of backplane jumpers

4.4.5.1 Near-end units

The backplane jumper configurations are shown in Fig. 4-11. The backplane jumpers (6 × 2) are used to configure the slot numbers on each layer. To cooperate with the RS485 bus monitoring system, there is also a


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1 × 2 jumper located under the 6 × 2 jumpers, used to set the terminal matching resistance. The following description is given when facing the rear of the rack.

SIG6-1=011111Layer 6






Top of the back of the rack

Bottom of the back of the rack

Fig. 4-11 Backplane jumper configuration

The 6 × 2 jumpers on the left side and right side represent signals SIG1~6:

They are used to set the slot No. The interior pin is the ground, and the exterior pin is the signal. Short-circuit signal is 0, and open-circuit signal is 1. Configurations of SIG1 ~ SIG6 must be the same. The left and right sides are distinguished by SIG7. This signal is fixed to a high level on the left side, while on the right side, it is fixed to the ground.

The 1 × 2 jumpers on the left and right sides:

They are used to set the matching resistance. Short-circuit: using the 120Ωterminal matching resistance; open-circuit: not using the terminal matching resistance. If this layer is at the last node of the RS485 bus link,


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then the matching resistance should be connected. Otherwise, the jumper should be open. On the same RS485 bus link, only one jumper should be configured to be short-circuited.

4.4.5.2 Far-end units

On the SMU backplane of the far-end unit, besides the jumper units the same as mentioned above, there are also jumpers for RS485 configuration, as follows:

X140 and X141 are used to configure the slot No. of the GPP board, which can be configured as FSPP, NSPP or GIPP by connecting X140 and X141. For the connection, please refer to the description printed on the backplane.

X123, X133, X137 and X138 are used to connect the RS485 bus of POWB to that of GPP; while X149 and X150 are the impedance matching jumpers of the RS485 bus monitored by FSPP. Since FSPP monitors the RS485 buses of its rack, all the RS485 buses of POWB of this rack should be connected to FSPP in the cascading mode; that is, X132, X133, X137 and X138 should be connected while X149 and X150 disconnected. Otherwise, keep X132, X133, X137 and X138 disconnected and short X149 and X150.

4.5 Installation of external cables

4.5.1 Cable connection of the BSC system without sub-multiplexing

Connections of cables are almost the same despite the different rack capacities, although the number of cables will increase with the increase of capacity. To avoid repeated discussion, we will only describe the cable connections in detail in the case of N_trx≤240, and only connection changes will be introduced for other cases.


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4.5.1.1 NN_trx≤240

1. The clock and HW cables from BIPP to the T network

Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from BIPP to the T network; Type: 3×8 cables.

The connections from BIPP to the T network are as shown in Table 4-4.

BIPP end – “CNTn” (n=0~1) socket on the BIPP board in the BBIU shelf.

DSNI end – “SPCn” (n=54~57) socket on the DSNI board in the BNET shelf.

Table 4-4 Connections from BIPP to the T network

DSNI end BIPP end

1# L3_DSNI3-S_SPC56~57 DN1~8 1# L6_BIPP_L_CNT0 UP25~32

1# L3_DSNI3-S_SPC54~55 UP25~32 1# L6_BIPP_R_CNT1 UP25~32

Signal line 1# L3_DSNI3-S_SPC56~57 DN1~8 is described in Table 4-5.

Table 4-5 Description of the signal line 1# L3_DSNI3-S_SPC56~57 DN1~8

Name Description

1# Rack No. when racks are assembled (seen from the front, the leftmost rack is No.1 rack)

L3 Indicating the layer-3 backplane from the bottom of the rack

DSNI3-S Indicating the symbol name of the 96-pin socket

SPC56~57 Indicating the symbol name of the specific identifiers on the socket.

DN1~8 Indicating the specific positions on the socket: the positions 1~8 of the DOWN 96-pin socket

Signal line 1# L6_BIPP_L_CNT0 UP25~32 is described in Table 4-6.


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Table 4-6 Description of the signal line 1# L6_BIPP_L_CNT0 UP25~32

Name Description

1# Rack No. when racks are assembled (seen from the front, the leftmost rack is No.1 rack)

L6 Indicating the layer-6 backplane from the bottom of the rack

BIPP Indicating the symbol name of the 96-pin socket

L Indicating the left side of the backplane (seen from the back of the rack)

CNT0 Indicating the symbol name of the specific identifiers on the socket

UP25~32 Indicating the specific positions on the socket: the positions 25~32 of the UP 96-pin socket

2. The clock and HW cables from ATC to the T network

Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from TCPP to the T network; Type: 3×8 cables.

The connections from TCPP to the T network are as shown in Table 4-7.

TCPP end – “CNT” socket on the TCPP board in the BATC shelf.


Table 4-7 Connections from TCPP to the T network

DSNI end TCPP end

1# L3_DSNI0-S_SPC0~1 UP1~8 1# L2_TCPP_CNT UP25~32


3. The HW cables for 2M messages from the BCTL (SCU) layer to the BNET layer

Type E cables (2MHWI, 2MHWO); Name: cables from DSNI to COMM; Type: 3×8 cables.

The connections from the COMM end to the DSNI end are as shown in Table 4-8.


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DSNI end - “MPCn” (n=0~31) socket position on the DSNI0-C (or DSNI1-C) board in the BNET shelf.

COMM end - “COMMnD1” (or “COMMnD2”) (n=1~12) socket position on the COMM board in the BCTL (SCU) shelf.

Table 4-8 Connections from the COMM end to the DSNI end

COMM end DSNI end

L4_COMM1_COMM1D1 DN25~32 L3_DSNI0_C_MPC0.2 UP1~8






(to be continued)

COMM end DSNI end

L4_COMM7_COMM7D2 DN25~32 L3_DSNI0_C_MPC16.18 DN1~8






4. Connection control cables from the BCTL (SCU) layer to the BNET layer

Type F cables; Name: cables from COMM to BOSN; Type: “1-to-2” 3×8 cables.

The connections from the COMM end to the DSN end are as shown in Table 4-9.

COMM end – “COMMnD2” (n=3~4) socket position on the COMM board in the BCTL (SCU) shelf.


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DSN (CLK) end - “COMM0” (or “COMM0’”) socket position on the DSN board in the BNET shelf.

DSN end - “COMM1”(or “COMM1’”) socket position on the DSN board in the BNET shelf.

Table 4-9 Connections from the COMM end to the DSN end

COMM end DSN end (CLK) DSN end

L4_COMM3_COMM3D2 DN25~32

L3_DSN_COMM0 DN25~32

L3_DSN'_COMM1' DN17~24

L4_COMM4_COMM4D2 DN25~32

L3_DSN'_COMM0' DN25~32

L3_DSN_COMM1 DN17~24

5. 2MHW cables from BBIU to BCTL (RMU)

Type E+ cables (2MHWI, 2MHWO); Name: cables from COMI to COMM; Type: “1-to-2” 3×8 cables.

The connections from the COMM end to the COMI end are as shown in Table 4-10.

COMI end – “CNCn” (n=0~13) socket on the COMI board in the BBIU shelf.

COMM end – “COMMnD2” (n=1~12) socket on the COMM board in the BCTL (RMU) shelf.

Table 4-10 Connections from the COMM end to the COMI end

COMM end COMI end

RMU_COMM1_COMM1D2 DN25~32

RMU_COMM2_COMM2D2 DN25~32 BBIU_COMI_CNC0.1 UP1~8*


RMU_COMM4_COMM4D2 DN25~32 BBIU_COMI_CNC2.3 UP9~16



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RMU_COMM10_COMM10D2 DN25~32 BBIU_COMI_CNC8.9 DN1~8


RMU_COMM12_COMM12D2 DN25~32 BBIU_COMI_CNC10.11 DN9~16

RMU_PEPD_PEPDD2 DN25~32

RMU_MON_MOND2 DN25~32 BBIU_COMI_CNC12.13 DN17~24

6. The clock cables from AIPP of BATC to SYCK of BNET

Type H+ cables (8K); Name: cables from AIPP to SYCK; Type: “1-to-2” 3×8 cables.

The connections from the AIPP end to the SYCK end are as shown in Table 4-11.

AIPP end – “8KREF” socket position on the AIPP board in the BATC shelf.

SYCK end - “E8K” socket position on the SYCK board in the BNET shelf.

Table 4-11 Connections from the AIPP end to the SYCK end

DTI end SYCK end

L1_BATC_AIPP_8KREF UP1~8

L2_BATC_AIPP_8KREF UP1~8 B L3_BNET_SYCK_E8K UP4~11

7. The 8K clock cables from the BBIU layer to the BCTL (RMU) layer

Type K+ cables (8K); Name: cables from COMI to MP; Type: “1-to-2” 3×8 cables.

The connections from the COMI end to the MP end are as shown in Table 4-12.


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COMI end – “CNC14” or “CNC15” socket on the COMI board in the BBIU shelf.

MP end - “MP-1D1” or “MP-2D1” socket on the MP board in the BCTL (SCU) shelf.

Table 4-12 Connections from the COMI end to the MP end

COMI end MP end

BCTL_MP-1_MP-1D1 DN14~21 BBIU_COMI_CNC14, 15 DN25~32

BCTL_MP-2_MP-2D1 DN14~21

8. The 8K clock cables the from BNET layer to the BCTL (SCU) layer

Type K cables (8K); Name: cables from DSNI to MP; Type: 3×8 cables.

The connections from the DSNI end to the MP end are as shown in Table 4-13.

DSNI end - “MPCn” (n=28~31) socket position on the DSNI1-C board in the BNET shelf.

MP end - “MP-1D1” (or “MP-2D1”) socket position on the MP board in the BCTL (SCU) shelf.

Table 4-13 Connections from the DSNI end to the MP end

DSNI end MP end

L3_DSNI0-C_MPC28, 30 DN25~32 L4_MP-1_MP-1D1 DN14~21

L3_DSNI1-C_MPC29, 31 DN25~32 L4_MP-2_MP-2D1 DN14~21

9. Cables in the BCTL (SCU) layer from the MON board to DSNI and POWB

Type A cables (RS485); Name: cables from MON to DSNI and POWB; Type: “1-to-6” 3×8 cables.


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The connections from the MON end to the POWBn end are as shown in Table 4-14.

MON end - “MOND2” socket position on the MON board in the BCTL (SCU) shelf.

FBI end - “RS485” socket position on the FBI1 board in the BNET shelf.

POWB end – “485-IN” socket on the POWB board on the right at layer-6 of rack n (n is the rack No., and ranges 1~6).

Table 4-14 Connections from the MON end to the POWB end

MON end POWB end DSNI end

1# L4_MON_MOND2 DN25~32

n# L6_POWB_R_485-IN UP1~8

1# L3_FBI2'__RS485-IN UP1~8

10. RS485 cables of power supplies on the two adjacent layers

Type B cables (RS485); Name: cables from the upper-layer power supply to the lower-layer power supply; Type: 3×8 cables.

The connections from the upper-layer RS485 end to the lower-layer RS485 end are as shown in Table 4-15.

Upper-layer RS485 end - “485-OUT” socket position on the POWB board on layer Ln+1 (n is the layer No., and ranges 1~6 from bottom up).

Lower-layer RS485 end - “485-IN” socket position on the POWB board on layer Ln (n is the layer No., and ranges 1~6 from bottom up).

Table 4-15 Connections from the upper-layer RS485 end to the lower-layer RS485 end

Upper-layer RS485 end Lower-layer RS485 end

Ln+1_POWB_L (R) _485-OUT UP9~16 Ln_POWB_L (R) _485-IN UP1~8


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11. RS485 cables of power supplies on the same layer

Type C cables (RS485); Name: cables of power supplies on the same layers; Type: 3×8 cables.

Connections from the left RS485 end to the right RS485 end are as shown in Table 4-16. The connections are in the left-right symmetry.

The left RS485 end – “485_OUT” socket position on the left POWB board in the bottom layer.

The right RS485 end – “485_OUT” socket position on the right POWB board in the bottom layer.

Table 4-16 Connections from the left RS485 end to the right RS485 end

The left RS485OUT The right RS485OUT

N# POWB_L_485-OUT UP9~16 N# POWB_R_485-OUT UP9~16

12. RS485 cables connecting POWPs

Type Z cables (RS485); Name: POWP cables; Type: 3×8 cables are used for one end, and round-head cables are used for the other end.

The connections of POWB with POWP are as shown in Table 4-17.

The last POWB end on the left - “485_OUT” socket position on the left POWB board in the top shelf.

POWP end - the position of the round-head socket on POWP.

Table 4-17 Connections of POWB with POWP

RS485OUT RS485IN

L6_POWB_L_485-IN UP1~8 POWP_485IN


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13. Network cables (Type O cables) used to connect the background

Connection cables from MP to the Ethernet; Type: 3×8 cables are used on one end, and RJ45 cables are used on the other end.

Connection relations:

MP end - “MP-1D2” or “MP-2D2” socket on the MP board in the BCTL (SCU) shelf.

RJ45 end – “RJ45” socket on HUB.

14. Cables (P-type cables) of sensors

Cables from PEPD to sensors. 3×8 cables are used on one end, and smog, temperature/humidity and infrared sensors are connected to the other end.

Connection relations:

PEPD end – “PEPDD2 (SENSOR)” socket on the PEPD board in the BCTL (SCU) shelf.

15. 6-pin power supply plug Type Q cable, which powers each board through the backplane, and the power supply plug is as shown in Fig. 4-12.

3

2

1

6

5

4

GND

GNDP

－48VIN

GND48

GNDP

GND

Fig. 4-12 The power supply plug as seen from the soldering surface of the backplane


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4.5.1.2 240<N_trx≤480



The connections BIPP to the T network are as shown in Table 4-18.




DSNI end BIPP end



1# L3_DSNI3-S_SPC52~53 UP17~24 2# L6_BIPPL-CNT0 UP25~32

1# L3_DSNI3-S_SPC50~51 UP9~16 2# L6_BIPPR-CNT1 UP25~32

2. The clock and HW cables from BATC to the T network


The connections from the DSNI end to the TCPP end are as shown in Table 4-19.





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DSNI end BATC end



1# L3_DSNI0-S_SPC4~5 UP17~24 2# L4_TCPP-CNT UP25~32


3. For connections of other cables, please refer to Section 4.5.1.1.

4.5.1.3 480<N_trx≤720







DSNI end BIPP end






1# L3_DSNI2-S_SPC46~47 DN25~32 3# L6_BIPPR-CNT1 UP25~32




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DSNI end BATC end





1# L3_DSNI0-S_SPC8~9 DN1~8 2# L2_TCPP-CNT UP25~32



4.5.1.4 720<N_trx≤960







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DSNI end BIPP end







1# L3_DSNI2-S_SPC44~45 DN17~24 3# L4_BIPPL-CNT0 UP25~32






DSNI end – “SPCn” (n=0~15) socket on the DSNI_S board in the BNET shelf.


DSNI end BATC end











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4.5.1.5 960<N_trx≤1200







DSNI end BIPP end















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DSNI end – “SPCn” (n=0~19) socket on the DSNI-S board in the BNET shelf.


DSNI end BATC end












4.5.1.6 1200<N_trx≤1800







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DSNI end BIPP end




















DSNI end – “SPCn” (n=0~31) socket on the DSNI_S board in the BNET shelf.


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DSNI end BATC end















3. Type A+ cables in the BCTL (SCU) layer from the MON board to POWB

Type A+ cables (RS485); Name: cables from MON to POWB; Type: “1-to-2” 3×8 cables. Refer to Table 4-28 for the connection relations.

Table 4-28 Connections from MON to POWB

MON end POWB end

1# L4_MON_MOND1 DN17~24 6# L6_POWB_R_485-IN UP1~8


4.5.2 Configurations of cables of the BSC system with sub-multiplexing

4.5.2.1 The case that the Acon interface holds the sub-multiplexing

We will take the rack in the case 240<N_trx≤480 as an example, its configuration is described in Section 2.2.


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Cables in this configuration include:

1. Type D cables from TCPP to DSNI

2. Type D cables from NSPP to DSNI

3. Type X cables from FSPP to BIPP

4. Type E cables from DSNI to SCU/COMM

5. Type F cables from SCU/COMM to DSN

6. Type E+ cables from COMI to RMU/COMM

7. Type H+ cables from NSPP to SYCK of the BNET layer

8. Type H+ cables from FSPP to SYCK of this layer

9. Type K cables from DSNI to the 8K clock of MP

10. Type A cables – RS485 cables from MON to POWB and FBI. Note that no type A cables are used for the far-end racks.

11. Type B cables – RS485 bus cables connecting POWBs on different layers in a near- or far-end rack

12. Type C cables - RS485 bus cables connecting POWBs on the same layer

On a near-end rack, type C cables are used in the bottom shelf with configured parts, that is, they are connected to J1_L1 and J2_L3 with the same connection method as described above for the type C cables; however, on a far-end rack, type C cables won’t be used. This is because the RS485 bus of the left and right POWBs can be connected via the jumpers on the FSMU backplane so that the 3×8 cables won’t be necessary. To be more specific, the jumpers X132, X133, X137 and X138 are shorted, thus sparing the type C cables. The following should be paid attention:

1) On a far-end rack, these four jumpers must be shorted.


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2) On a far-end rack, the terminal resistors of the RS485 bus must be connected. For this example, the RS485 bus is terminated at the left and right POWBs of J3_L6 (the top BBIU), so the RS485 matching resistors of the two POWBs will be connected to the bus by merely shorting the two jumpers X42 and X46 of J3_L6.

13. Type O cables connecting background network cables on a near-end rack

14. Type P cables connecting PEPD and sensors on a near-end rack

15. Type Q cables connecting power supplies on a near- or far-end rack

16. Type Z cables connecting POWB and POWP on a near- or far-end rack

Now, we will only discuss Items 2, 3, 7 and 8 in detail, for description of other items, please refer to relevant contents in previous sections.

1. The clock and HW cables from NSPP to the T network

Type D cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from NSPP to the T network; Type: 3×8 cables.

The connections from NSPP to the T network are as shown in Table 4-29.

NSPP end – “NSPP0” socket on the NSPP board in the NSMU shelf.


Table 4-29 Connections from NSPP to the T network

DSNI end NSPP end

1# L3_DSNI0-S_SPC0~1 UP1~8 1# L2_NSMU_NSPP0 UP25~32

1# L3_DSNI0-S_SPC2~3 UP9~16 1# L2_NSMU_NSPP0 DN1~8




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2. The clock and HW cables from FSMU to BBIU

Type X cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from FSPP to BIPP; Type: 3×8 cables.

The connections from FSPP to BIPP are as shown in Table 4-30.

FSPP end – “HW2~9” sockets on the FSPP0 board in the BSMU shelf.

BIPP end – “CNT” socket on the BIPP board in the BBIU shelf.

Table 4-30 Connections from FSPP to BIPP

BIPP end FSPP end

L4_TCPP_CNT UP25~32 L5_FSPP0_HW2-3 DN1-8




3. Cables for the 8K clock reference from NSMU to BNET

Type H+ cables (8KREF+, 8KREF-; Name: cables from NSPP to SYCK; Type: “1-to-2” 3×8 cables. Refer to Table 4-31 for the connection relations.

NSPP end – “8KREF” socket on the NSPP board in the BSMU shelf.

SYCK end - “E8K” socket on the SYCK board in the BNET shelf.

Table 4-31 Connections from NSMU to the T network

SYCK end NSPP end

L2_NSPP0_8KREF UP1~8 L3_BNET_SYCK_E8K UP4~11

L1_NSPP0_8KREF UP1~8

4. Cables for the clock reference from FSPP to SYCK in a far-end BSMU


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Type H+ cables (8KREF+, 8KREF-; Name: cables from FSPP to SYCK; Type: “1-2” 3×8 cables. Refer to Table 4-32 for the connection relations.

FSPP end – “8KREF” socket on the FSPP board in the BSMU shelf.

SYCK end - “E8K” socket on the SYCK board in the BSMU shelf.

Table 4-32 Connections from NSMU to the T network

SYCK end FSPP end

L4_BATC_AIPP_8KREF UP1~8 L5_FSMU_SYCK_E8K UP4~11


4.5.2.2 The case that the Ater interface involves the sub-multiplexing

We will take the rack in the case 240<N_trx≤480 as an example, its configuration is described in Section 2.2.

Cables in this configuration include:

1. Type D cables from BIPP to DSNI

2. Type D cables from NSPP to DSNI

3. Type X cables from FSPP to TCPP

4. Type E cables from DSNI to SCU/COMM

5. Type E cables from SCU/COMM to DSN

6. Type E+ cables from COMI to RMU/COMM

7. Type H+ cables from the near-end NSPP to SYCK of the BNET layer

8. Type H+ cables from the far-end AIPP to SYCK of the FSMU layer

9. 8K clock cables from DSNI to MP

10. Type A cables -RS485 bus cables from MON to POWB and FBI. Note


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that no type A cables are used for the far-end racks.

11. Type B cables - RS485 bus cables connecting POWBs on different layers in a near- or far-end rack.

12. Type C cables - RS485 bus cables connecting POWBs on the same layer

On a near-end rack, type C cables are used in the bottom shelf with configured parts, that is, they are connected to J1_L2 and J3_L5 with the same connection method as described above for the type C cables; however, on a far-end rack, type C cables won’t be used. This is because the RS485 bus of the left and right POWBs can be connected via the jumpers on the FSMU backplane so that the 3×8 cables won’t be necessary. To be more specific, the jumpers X132, X133, X137 and X138 are shorted, thus sparing the type C cables. The following should be paid attention:

1) On a far-end rack, these four jumpers must be shorted.

2) The terminal resistors of the RS485 bus must be connected to the RS485 bus. For this example, the RS485 bus is terminated at the left and right POWBs of J2_L1, so the RS485 matching resistors of the two POWBs will be connected to the bus by merely shorting the two jumpers X154 and X157 of J2_L1.

13. Type O cables connecting background network cables on a near-end rack

14. Type P cables connecting PEPD and sensors on a near-end rack

15. Type Q cables connecting power supplies on a near- or far-end rack

16. Type Z cables connecting POWB and POWP on a near-end rack

17. Type Z+ cables connecting POWB and POWP on a far-end rack

For the connection methods of Items 1, 4~6, and 9 ~ 15 among the 17 items

above, please refer to detailed description in Section 4.5.1, and for those of

Items 2 and 7, please refer to Section 4.5.2.1. Now, we will only discuss Items

3, 8 and 17.

1. The clock and HW cables from BATC to FSMU in the far-end rack


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Type X cables (8M, 8K, 8MHWI, 8MHWO); Name: cables from FSPP to TCPP; Type: 3×8 cables.

The connections from FSPP to TCPP are as shown in Table 4-33.

FSPP end – “HW2~9” sockets on the FSPP0 board in the BSMU shelf.


Table 4-33 Connections from FSPP to TCPP

TCPP end FSPP end





2. Cables for the 8K clock reference from AIPP to FSMU in the far-end rack

Type H+ cables (8KREF+, 8KREF-); Name: cables from AIPP to SYCK of FSMU; Type: “1-to-2” 3×8 cables.

The connections from AIPP to SYCK are as shown in Table 4-34.

AIPP end – “8KREF” socket on the AIPP board in the BATC shelf.

SYCK end - “E8K” socket on the SYCK board in the BSMU shelf.

Table 4-34 Connections from AIPP to SYCK

AIPP (end-1 and end-2) SYCK end


L3_BATC_AIPP_8KREF UP1~8 L5_FSMU_SYCK_E8K UP4~11


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3. RS485 cables connecting POWPs in the far-end rack

Type Z cables (RS485): POWP cables of the last POWB end on the left. Type: 3×8 cables are used for one end, and round-head cables are used for the other end. Refer to the relevant part in Section 4.5.1 for the connection method.

4.5.3 Cable connections of BSC (GPRS)

The No. of the GPRS rack depends on the number of BSC racks; if there are four BSC racks, then the GPRS rack is the fifth one.

1. Cables from BNET to BPUC

Type D cables; Name: cables from BNET to BPUC; Type: 3×8 cables.

The connections from BNET to BPUC are as shown in Table 4-35.

BNET end – “SPC” socket on the DSNI board in the BNET shelf.

BPUC end – “TNET(V2.0)” socket on the BPUC board in the BPUC shelf.

Table 4-35 Connections from BNET to BPUC

BNET BPUC

1# L3_DSNI2-S_SPC32~33 UP1~8 n# L2_BPCU-96PIN_TNET (V2.0) UP1~8

1# L3_DSNI1-S_SPC30~31 DN25~32 n# L3_BPCU-96PIN_TNET (V2.0) UP1~8

1# L3_DSNI1-S_SPC28~29 DN17~24 n# L4_BPCU-96PIN_TNET (V2.0) UP1~8

1# L3_DSNI1-S_SPC26~27 DN9~16 n# L5_BPCU_96PIN_TNET (V2.0) UP1~8

2. Cables from BNET to BGIU

Type D cables; Name: cables from BNET to BGIU; Type: 3×8 cables.

The connections from BNET to BGIU are as shown in Table 4-36.


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BNET end – “SPC” socket on the DSNI board in the BNET shelf.

BGIU end – “TNET” socket on the GIPP board in the BGIU shelf.

Table 4-36 Connections from BNET to BGIU

BENT end BGIU

1# L3_DSNI1-S_SPC24~25 DN1~8 n# L1_BGIU_GIPP_TNET UP1~8

4.6 Check of the hardware installation

4.6.1 Check of the rack installation

1. Racks must be installed vertically. After installation, both the horizontal and vertical deviation should not exceed 3mm.

2. The layout of racks must meet the design requirements. The main aisle between rows of racks must be aligned in a straight line with an error lower than 5mm. The adjacent racks should be close to each other and the racks in one row should be on the same plane.

3. Fixing screws must be fastened, and the exposed part (height) of the same kind of screws should be identical.

4. No component on the rack is allowed to go off or be damaged, and the paint coating should not peel off or be damaged. If the paint coating peels off or is damaged, the relevant part should be re-coated. All the labels should be present and clear.

5. The rack installation shall be reinforced for shock resistance, if necessary, anchor bolts can be used to secure the rack to the ground.

6. Connectors must have good contact with flexible plugging/unplugging. The surface of the plugged slots should be even and flat.


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4.6.2 Check of base and peripherally installed terminal equipment

1. The installation location of the base should meet the engineering design requirements.

2. Racks shall be aligned in a straight line, adjacent racks shall be put closely together, and the racks shall be in the same plane without obvious unevenness.

3. The peripheral terminal equipment should be all ready and complete, installed at the proper positions, and in normal operation.

4. Alarming devices in the equipment room must be fixed at eye-catching locations and tightly fixed.

4.6.3 Check of the array of racks

The configuration of racks depends on the capacity, so no specific restriction is placed on the length of rack rows. However, the connection cables between devices are generally restricted to less than 15m. In addition, the area of the equipment room should also be taken into account. After the total capacity and configuration are determined, the total number of racks and the quantity of various shelves are determined. Furthermore, the adjacent relationship between different racks also counts. With each single module being a group, the central rack is usually placed in the middle of the single module. The number of rack rows, racks in each row, primary passages, and secondary passages, are determined by the total number of racks.

4.6.4 Check of cables

The cables of the system are classified into external cables and internal cables.

The external cables mainly include various trunk cables and power supply (-48V) cables. The external cables of the ZXG10-BSC (V2) include E1 cables connecting with BTS and MSC, and cables connecting with the primary power supply. The connector of the E1 cable connected to BSC is standard RF coaxial connector


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CC4Y-J32//CC4-J32B//CC4Y-J32B//1.0/2.3-J3T, and the connector connected to BTS can be selected as required. The cable is the 75Ω coaxial cable. Each rack has one set of primary power supply cables connected to the cables of POWP with two signal cables: -48V and –48V ground, the connector connected to POWP employs the lug and the other end can be selected as required.

The internal cables mainly include RS485 monitoring cables, 8MHW cables, clock cables, connection control cables, Ethernet cables and sensor cables, etc. Cables inside a rack are already installed before the delivery of the equipment, while those among racks should be installed on site.

1. Laying of the power supply cables

1) Requirements for connection of the power cables and grounding cables

Good grounding of BSC is an important guarantee for lightning protection and anti-interference, as well as the basis for stable and reliable operation of the equipment. The grounding resistance should comply with the relevant standards. If necessary, the grounding connectors should be processed against corrosion to ensure low-resistance grounding.

To make the power supply cables easier to lead in, each rack has a -48V leading-in box, i.e., the POWP. This part is the inlet for the power supply of the whole rack, and it chiefly implements such functions as the filtering, under-/over-voltage detection, giving alarms and over-voltage protection for the -48V power supply. For easier cabling, the whole POWP is designed into a drawer structure, which is installed on the top of the rack.

2) Requirements for the bundling of power cables and grounding cables

The power cables and grounding cables should be laid following the principle that they are separated from other cables. For in-rack cabling, the cables should be bundled separately without being bundled with other cables, and separate bundling is also required for out-rack cabling such as


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in the cable trough or ditch. The power cables and grounding wires should pass through the fixing shelves on both sides of the rack, and be bound at the inner edge on the external side of the fixing shelf. Each fixing shelf should be bound. The cable clips should be located on the external side of the fixing shelf.

3) When the power cables and grounding cables are connected to the terminals of the POWP, a pair of pliers shall be used to twist the cables into the routing shape, with even routing and neat bundling. During cabling, the cables far away from the terminals should be put outside, while those close to the terminals should be put inside.

4) Before laying power cables and grounding cables, length of the needed cables should be measured and some extra length should be taken, for just in case. If the cable is found not long enough during cable layout, stop laying and replace the cable with a new one. It is not allowed to make joints or soldering points in the middle of the cable.

2. Laying of trunk cables

1) When the equipment is installed with a base and the conductive floor is installed inside the equipment room, it is recommended for the user to employ the bottom cabling mode. If no base is installed, then the top cabling mode should be adopted, but a cable tray should be mounted on the top of the rack.

A. Bottom cabling mode

In the case of ground installation, as there are four support arms below the

rack, there is some space between the bottom shelf of the rack and the ground,

which can be used for cabling; in the case of reinforcement installation, the

rack is installed on a section steel base instead of support arms, then cables

should be laid through the ground ditch under the rack.

B. Top cabling mode

To implement the top cabling mode, the top mesh of the rack is divided into two

parts of different sizes. Loosen the screws that fasten the top mesh and


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remove the small top mesh board from the back of the top cover, so that cables

can be led out from the top.

2) The trunk cables should be laid separately from the power cables.

3) The turning radius of coaxial cables should not be less than 40mm, so that the core can be protected from being damaged.

4) The insulating layer of cables cannot be damaged. And the cables should be laid for the convenience of future maintenance and expansion.

5) Cables laid on the cable tray must be bundled. The bundled cables should be close to each other and look straight and neat. The spaces between cable clips should be even and cables should be bundled with appropriate tightness.

6) Cables laid inside the cable trough may be not bundled, but should be arranged in order. No cable is allowed to run over from the trough. Cables should be bundled where they come into or go out from a trough and where they make a turn.

7) The cables should be laid from the rack to the distribution frame. During the laying, the cables should keep somewhat loose and after the laying, some excessive length of the cables should be saved. Please refer to the connector installation position for the cable layout, the cables on the left side of the rack should be placed at the left cabling position, and those on the right side should be placed at the right cabling position. During cabling in a cable trough or under the movable floor, the cables should be bundled as per racks. The cables should be straight and in order, and the laid cables should be arranged neatly without damage on the external sheath, and a margin should be left if necessary.

8) The No. of both ends of a trunk cable should correspond to each other.


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5 Inspection and Power-on

5.1 Description of boards

Listed below are the meanings of status of indicators on the panels of various boards of the ZXG10-BSC (V2) rack, and the functions of various switch buttons.

5.1.1 Indicators on the panel of the control layer

Descriptions of indicators on the panel of the control layer are listed in Table 5-1.

Table 5-1 Indicators on the panel of the control layer

Board name

Legend Indicator or switch

Description

Indicating the running status of the board.

Flashing slowly: Normal

Constantly on: Abnormal RUN: HL1

Off: Abnormal

Indicating the failure status of the board.

On: Board fault FAU: HL2

Off: Normal

Indicating the active/standby status of the board.

Constantly on: In the active status MST: HL3

Off: In the non-active status


MP

HL1HL2HL3HL4

SW1SW2SW3

RES: HL4

Constantly on: In the standby status


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(to be continued)

Board name Legend Indicator or

switch Description

Off: In the non-standby status

Lockless button – Changeover switch SW: SW1 Press this switch to change over the

active/standby status of the board.

Lockless button – Reset switch RST: SW2

Press this switch to reset the board.

Power switch with lock button

ON/OFF: SW3 Push this switch down to power on and spring up to power off.


SMEM

HL1HL2

RUN: HL1

Constantly on: Normal


Flashing slowly: Normal RUN: HL1 On together with the FAU indicator: The board has faults


On together with the RUN indicator: The board has faults

FAU: HL2

Off: Normal

Lockless button – Reset switch

COMM

(MPPP)

(MPMP)

HL1HL2

SW1

RST: SW1 Press this switch to reset the board.


COMM

(MTP)

HL1HL2

SW1

RUN: HL1 Flashing slowly: SS7 link obstructed


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(to be continued)


switch Description

Flashing fast: SS7 link normal


Flashing slowly: Board fault FAU: HL2

Off: Normal




Flashing slowly: Normal RUN: HL1

Flashing slowly together with the FAU indicator: The board has faults.


Flashing slowly together with the RUN indicator: The board has faults.

FAU: HL2

Off: Normal


COMM

(LAPD)

HL1HL2

SW1

RST: SW1




Flashing fast: The sensor is being preheated.

RUN: HL1

Constantly on/off: Abnormal


On: The board has faults FAU: HL2

Off: Normal


PEPD (MON)

HL1HL2

SW1

RST:SW1 Press this switch to reset the board.

Note: There is a keyboard interface and a monitor interface on the MP panel, which are used for the software debugging.

5.1.2 Indicators on the panel of the network switching layer

Descriptions of indicators on the panel of the network switching layer are listed in Table 5-2.


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Table 5-2 Indicators on the panel of the network switching layer

Board name


Description



Flashing fast: The data is being loaded in synchronization mode.

RUN: HL1



On: The board has faults.

Flashing slowly: communication between this board and the upper-level board has faults.

FAU: HL2

Off: Normal





Constantly on: In the standby status RES: HL4


Lockless button – Changeover switch

BOSN

HL1HL2HL3HL4

SW1SW2

EXCH: SW1 Press this switch to change over the active/standby status of the board.

(to be continued)


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switch Description

Lockless button – Reset switch RST: SW2

Press this switch to reset the board. Indicating the running status of the board. Flashing slowly: Normal RUN: HL1 Flashing fast: Communication between this board and MP failed Indicating the failure status of the board. On: The board has faults Flashing slowly: Communication between this board and the upper-level board failed

FAU: HL2

Off: Normal Indicating the active/standby status of the board. Constantly on: In the active status MST: HL3

Off: In the non-active status Indicating the active/standby status of the board. Constantly on: In the standby status RES: HL4

Off: In the non-standby status Lockless button – Changeover switch

SW: SW1 Press this switch to change over the active/standby status of the board. Lockless button - Reset switch

DSNI/ COMI

HL1HL2HL3HL4

SW1SW2

RST: SW2 Press this switch to reset the board. Indicating the running status of the board. On: Normal RUN: HL1 Flashing fast: Communication with SYCK failed Indicating the failure status of the board. On: The board has faults CKI

H L 1H L 2H L 3H L 4

S W 1S W 2S W 3

H L 5H L 6H L 7H L 8H L 9H L 1 0H L 1 1

FAU: HL2

Off: Normal

(to be continued)


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Board name

Legend Indicator or

switch Description

Indicator for 8kHz reference existence

Constantly on: 8kHz reference exists. 8kHz: HL3

Off: 8kHz reference does not exist.

Indicator for 2MHz reference existence

Constantly on: 2MHz reference exists. 2MHz: HL4

Off: 2MHz reference does not exist.

Indicator for 5MHz reference existence

Constantly on: 5MHz reference exists. 5MHz: HL5

Off: 5MHz reference does not exist.

Indicator for 2Mb/s reference existence

Constantly on: 2Mb/s reference exists. 2Mb/s: HL6

Off: 2Mb/s reference does not exist.

REFI: HL7~HL10

Four indicators indicate the selected ones of the 16 references in the binary system, top one to bottom one respectively indicate the high bit to low bit, 1 for On, 0 for Off.

0~3: 8K0~3; 4~7: 2MHz0~3

8~11: 5MHz0~3; 12~15: 2Mb/s 0~3

Indicating the “enabled” status of manual selection of the clock reference.

Constantly on: Manual selection of the clock reference is enabled.

MANEN: HL11

Off: Manual selection of the clock reference is disabled.

MANSL: SW1 Lockless button – Selection switch

(to be continued)


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Board name

Legend Indicator or

switch Description

Clock reference selection switch: Up to 16 references can be selected in turn by pressing this switch.

Lockless button – Selection switch

MANEN: SW2 Press this switch to set CKI to the “manual enabled” or “manual disabled” status alternately.



Indicating the running status of the board. RUN: HL1 Constantly on: Normal


On: The board has faults FAU: HL2

Off: Normal





Constantly on: In the standby status MST: HL4


Fast capture mode indicator of the board

Constantly on: The board is working in the fast capture mode.

CATCH: HL5

Off: The board is working in the non-fast capture mode.

Tracing mode indicator of the board

Constantly on: The board is working in the tracing mode. TRACK: HL6

Off: The board is working in the non-tracing mode.

SYCK

HL2HL3HL4

SW1SW2SW3

HL5HL6HL7HL8HL9HL10HL11

HL1

SW4

HL12

HOLD: HL7 Hold mode indicator of the board

(to be continued)


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Board name

Legend Indicator or

switch Description

Constantly on: The board is working in the hold mode.

Off: The board is working in the non-hold mode.

Free mode indicator of the board

Constantly on: The board is working in the free mode. FREE: HL8

Off: The board is working in the non-free mode.

Clock reference source indicator of the board

Constantly on: The SYCK board uses the clock reference from the CKI board.

REFI: HL9

Off: The SYCK board does not use the clock reference from the CKI board.


Constantly on: The SYCK board uses the clock reference from itself. REFI: HL10

Off: The SYCK board does not use the clock reference from the board itself.


REFI: HL11 Constantly on: The SYCK board uses the clock reference from itself.

REFI: HL11 Off: The SYCK board does not use the clock reference from itself.

Indicating the “enabled” status of manual selection of the clock reference.

Constantly on: Manual selection of the clock reference is enabled.

MANI: HL12

Off: Manual selection of the clock reference is disabled.

SYCK

MANSL: SW1 Lockless button – Selection switch

(to be continued)


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Board name

Legend Indicator or

switch Description

The clock reference can be manually selected in turn with this switch.

Lockless nutton – Enable switch

MANSL: SW2

Press this button to turn on/off the indicator that indicates the manual selection of clock reference enabled or disabled. Only when this indicator is on, the manual selection is enabled.

Lockless button – Changeover switch SW: SW3 Press this button to change over the

active/standby status of the board.



5.1.3 Indicators on the panel of the TC unit

Descriptions of indicators on the panel of the TC unit are listed in Table 5-3.

Table 5-3 Indicators on the panel of the TC unit

Board name

Legend Indicator or

switch Description



Flashing fast: Communication between this board and MP failed

RUN: HL1



On: The board has faults

DRT/

EDRT

HL1HL2HL3

SW1

FAU: HL2

Flashing slowly: Communication between this board and the upper-level board failed

(to be continued)


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switch Description

Off: Normal

Indicating whether there is traffic to handle on this board.

Constantly on: None of DSPs have traffic to handle.

IDLE: HL3

Off: There is traffic being handled.





Constantly on/off: Abnormal RUN: HL1

Flashing fast: Communication between this board and MP failed



Flashing slowly: Communication between this board and the upper-level board failed

FAU: HL2

Off: Normal

Indicating the status of the first E1 port on the board.

Flashing fast: Normal

Constantly on: Alarming DT1: HL3

Off: E1 port is not initialized.

DT2: HL4 Indicating the status of the second E1 port on the board; refer to DT1 for the indications of “On”.

DT3: HL5 Indicating the status of the third E1 port on the board, refer to DT1 for the indications of “On”.

DT4: HL6 Indicating the status of the fourth E1 port on the board; refer to DT1 for the indications of “On”.


TIC

HL2HL3

SW1

HL1

HL5HL6

HL4


5.1.4


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5.1.5 Indicators on the panels of the POWB and POWP units

Descriptions of indicators on the panels of the POWB and POWP units are

listed in Table 5-4.

Table 5-4 Indicators on the panel of the power supply unit

Board name


Description


Constantly on: Normal RUN: HL1

Off: The board has faults



POWB

HL1

HL2

FAU: HL2

Off: Normal

Power distributor (POWP) of the rack

1 2 3 4 5 6

Fun power indicator 1


-48V indicator 2


Under-voltage indicator

Constantly on: Under-voltage input 3

Off: Normal input voltage

Over-voltage indicator

Constantly on: Over-voltage input 4

Off: Normal input voltage

5 Socket of anti-static wrist strap

Power distributor (POWP) of the rack

6 Power switch: Up - on; Down - off


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5.1.6 Indicators on the panel of the GPRS unit

Descriptions of indicators on the panel of the GPRS unit are listed in Table 5-5.

Table 5-5 Indicators on the panel of the GPRS unit

Board name Legend Indicator or switch Description

RUN: HL1

FAU: HL2

Combination of these two indicators expresses different

status:

1. Both flashing fast: The board is started and waiting for

establishment of the HDLC link.

2. HL1 – Flashing fast, HL2 – Off: Waiting for DBS to synchronize

data or to notify synchronization of data.

3. Both constantly on: After correction of inconsistent IP

address and unit No., waiting for the manual reset.

4. HL1 – Flashing slowly, HL2 - Off: Normal


On: ActiveMST: HL3

OFF: Non-active


On: StandbyMST: HL4

Off: Non-standby


EXCH: SW1 Press this switch to change over the active/standby status of the

board.

PUC

HL1HL2HL3HL4

SW1SW2

RST: SW2 Lockless button – Reset switch


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(to be continued)



RUN: HL1

FAU: HL2

Combination of these two indicators expresses different status:

1. Both flashing fast: The board is started and waiting for establishment of the HDLC link.

2. HL1 – Flashing fast, HL2 – Off: Waiting for DBS to synchronize data or to notify synchronization of data.

3. Both constantly on: After correction of inconsistent IP address and the unit No., waiting for the manual reset.


Indicating the status of DSP1


GDPP (FRP/BRP)

HL1HL2DSP1DSP2

SW1

DSP1 (this indicator is unavailable on the FRP board) Off: DSP1 does not run.

Indicating the status of DSP1

Flashing slowly: Normal DSP2 (this indicator is unavailable on the FRP board) Off: DSP2 does not run.

GIPP

RST: SW1 Lockless button - Reset switch

(to be continued)


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RUN: HL1

FAU: HL2






On: Active MST: HL3

OFF: Non-active


On: Standby MST: HL4

Off: Non-standby


EXCH: SW1 Press this switch to change over the active/standby status of the board.

GIPP

GIPP

HL1HL2HL3HL4

SW1SW2

RST: SW2 Lockless button – Reset switch

(to be continued)


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RUN: HL1

FAU: HL2




3. HL1 – Flashing slowly, HL2 – Off: Normal

Indicating the status of the first E1 port on the board.

Flashing fast: Normal

Constantly on: Alarming

DT1: HL3

Off: E1 port is not initialized.

Indicating the status of the second E1 port on the board.

TIC

HL2HL3

SW1

HL1

HL5HL6

HL4

DT2: HL4

Ditto

Indicating the status of the third E1 port on the board. DT3: HL5

Ditto

Indicating the status of the fourth E1 port on the board. DT4: HL6

Ditto

Lockless button - Reset switch

TIC



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5.2 Inspection before power-on

A thorough inspection should be performed before the system is powered on.

1. Requirements for temperature, humidity and power voltage in the equipment room

1) Temperature: 15°C ~30°C

2) Relative humidity: 40%~65%

3) DC voltage: nominal value -48V (permitted range: -57V~-40V)

2. Check of cables

1) Check whether the power cables and grounding cables of each layer and each rack are connected properly.

2) Whether the connectors are inserted into their position and whether the contact is reliable.

3) Whether jumpers are properly set on each board.

4) Whether the foreground and background are connected properly.

5) Whether the version of the booting program loaded on each board is correct.

3. Check of other hardware

1) Whether equipment labels are complete, clear and correct.

2) Whether PCBs are inserted at the their positions and nothing is absent.

3) Whether various selection and control switches of the equipment are set at their specified start positions.

4) Whether the fuse of the equipment is of the required specifications.


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5) Whether the racks are properly grounded, with the grounding resistance meeting relevant technical requirements.

6) No short-circuit exists between the positive polar and negative polar of the power supply.

7) Whether the racks are aligned tidily and neatly, and whether the rack flags are correct and clear.

8) Whether the pins on backplanes are distorted or short-circuited.

5.3 Steps of power-on

After the above checks, power on the equipment in the following order,

otherwise the equipment may fail to begin working normally.

If the hardware passes the check, then power on the equipment in the following steps:

1. Before the power-on, make sure that the power cables are connected properly without damage and short-circuit; and ensure all the boards and power supplies are at their positions (the power switches should be at “OFF”); and ensure the software hardened on each board is of correct version, and no board is inserted into the slot.

2. Measure whether the primary input of POWP is normal; if not, get it back to normal based on necessary consultation.

3. Switch on the POWP and see whether it is normal and whether the -48V output is in the normal range (if not, find out the cause and ensure normal output).

4. After inserting the power supply (such as POWB) of a certain layer, turn it on, and observe its operation; if no abnormality occurs, turn it off.

5. Repeat step 4 to see if the power supply on each layer of the equipment is normal.

6. Turn on again a power supply of a certain layer (such as POWB),


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then insert a board of this layer. (Insert the board along the guide rail and make sure that the two connectors on the board align with the sockets on the backplane. After the board is inserted, press the locking lever vertically to the panel of the board, a “crack” sound will indicate that the board is locked.) Observe the operation of the board, and insert other boards only after making sure that the board is running normally. (The hot-swapping is allowed for all boards other than the power board.) If nothing abnormal happens, turn off the power supply on this layer.

7. Instructions on hot-swapping of boards:

While plugging and unplugging boards, always remember to wear the anti-static wrist strap. Do not forcedly plug/unplug hot-swappable boards by abnormal means or tools. Note especially that to unplug a board, first open the locking levers and then pull out the board once in the direction reverse to the insertion direction.

Boards that hot-swapping is not allowed must be plugged or unplugged after the power is cut off.

8. Repeat step 6 till all boards are inserted into their slots.

Then power on the whole system in the following steps:

1. Turn on the primary power distributor on the rack to lead the primary power supply into the rack.

2. Turn on the secondary power supplies in the following steps:

1) First turn on the secondary power supply of the peripheral interface units at a lower level.

2) Then turn on the secondary power supply on the control layer.

3) Finally turn on the working power supplies on the MP board and the background server.

Note: There is no constraint on the starting-up procedure of the power


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supplies among modules.

If any equipment is faulty or needs maintenance, or in any other case when the power supply of the cabinet should be turned off, then turn off the power in an order reverse to that mentioned above.

Note: Make sure that all secondary power supplies are turned off before turning off the primary power supply.

During the operation of the equipment, if the power-off recovery test of the primary power supply is required, all secondary power supplies and the power supply of the MP background should be turned on.

5.4 Check of board status

1. After power-on, the potential difference between racks shall be less than 0.1V.

2. After the power-on, the outputs of POWBs on various layers shall be within a nominal range. When conditions allow or when it is necessary, the ripple noise of the output voltages should be tested to see if they meet requirements.

3. Simulation test of the load capability of backup power supplies, i.e., when a single power supply is working, measure the power index from the remote end.

4. Check whether the status of each indicator on boards is normal after power-on (for definitions of the indicators on boards, please refer to Section 5.1).

5. Check whether the ventilation fans of the racks are working normally, whether the alarm devices with visual and audible alarms operate normally, and whether the clock device is working normally with nominal precision.


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6 Software Installation

6.1 Initial installation flow of the system software

1. Preparations

1) Engineering information: hardware environment, radio resources, etc.

2) Setup CD of the ZXG10-BSC

The setup CD mainly includes the BSC and BTS version software, OMCR (V2) software and GPRS software.

3) OS software, including Windows NT, Solaris 2.5.1 or Solaris2.6

4) ORACLE8.0.5 database software

5) TCPIP.CFG and ZXG10.CFG configuration files

6) Properly configured foreground and background data files

2. Installation flow

Initial installation of the system software includes installation of the MP

software and background operation & maintenance system software. The

installation of the background operation & maintenance system software is

divided into the server installation and client installation. The installation flow is

shown in Fig. 6-1.


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Install the clientsoftware

Dubug

Install the serversoftware

Install the MPsoftware

St ar t

End

Fig. 6-1 Initial installation flow of the system software

6.2 Installation of MP

1. Installation flow

1) Copy BSC and BTS version software to the C:\VERSION directory, and change the main version number of BSC into: “ZXGBSC”.

2) Copy the data files to the \data\work directories of various MPs.

3) Change file C:\USER\SUPER\PROG\LOGON into “:sb:version/zxgbsc”, and change the attribute of the LOGON file into read-only and hidden.

4) Copy the TCPIP.CFG and ZXG10.CFG file templates to the C:\CONFIG directory.

5) Change the configuration file TCPIP.CFG under the C:\CONFIG\ directory.

6) Reset and restart MP.


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2. The configuration variables of the communications configuration file TCPIP.CFG are described in the Table 6-1.

Table 6-1 Configuration variables of TCPIP.CFG

Configuration variable name

Sub-item Description

BscID [MAIN] BSC ID, non-zero value of BYTE type. The foreground is insensitive to this setting, but OMCR uses it to manage multiple BSCs.

IsRemote [MAIN] Whether this module is put at the far-end. Value: 0 or 1.

TcpPort [MAIN] The port by which MP accepts the link establishment request from TCP, usually set to 5000.

Server Mno [SERVER] Machine No. of server. Multiple servers may be configured, but two at most for the time being. The quantity is defined in SYSCFG.INI.

Server IP [SERVER] IP address of the server.

Test IP [SERVER] IP address of the test server. This address should not be the same as the IP address of any server and LMT.

LMT Mno [LMT] Machine No. of the local maintenance terminal.

LMT IP [LMT] IP address of the local maintenance terminal.

Module [MODULE] MP module No. If this MP is the same as the module No., then read the IP behind it. No.1 is the central module, and No. 2~9 are peripheral modules.

Left IP [MODULE] IP address of the MP which is inserted into the left slot.

Right IP [MODULE] IP address of the MP which is inserted into the right slot.

3. Configuration examples

[MAIN]

BscID = 18

IsRemote = 0

TcpPort = 5000

[SERVER]


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Server Mno = 127

Server IP = 192 168 018 065

Server Mno = 138

Server IP = 192 168 018 066

Test IP = 192 168 018 179

[LMT]

LMT Mno = 200

LMT IP = 192 168 018 070

[MODULE]

Module = 1

Left IP = 192 168 018 001

Right IP = 192 168 018 033

Module = 2

Left IP = 192 168 018 002

Right IP = 192 168 018 034

Module = 3


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Left IP = 192 168 018 003

Right IP = 192 168 018 035

Module = 4

Left IP = 192 168 018 004

Right IP = 192 168 018 036

Module = 5

Left IP = 192 168 018 005

Right IP = 192 168 018 037

6.3 Installation of the background operation and maintenance system

Solaris OS is a relatively stable UNIX OS provided by Sun Microsystems. The OMCR (V2) system is the NMS software with Solaris OS as the server and NT as the workstation, and the application core of the whole system service is based on UNIX OS.

The installation of the background operation & maintenance system includes the installation of the server software and client software. For the basic UNIX commands to be used in the following installation process, please refer to Appendix B.

The installation of the server software includes the following steps:

1. Install the Solaris 2.5.1 or Solaris 2.6 OS.


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2. Install ORACLE 8.0.5 database.

3. Install OMCR (V2) server program.

4. Import data file.

5. Install the peripherals like printer.

Server OS installation:

1. System hardware and software requirements

As ORACLE and OMCR will be installed in the Solaris, advanced hardware and software are required

1) Host: Sun SPARC server.

2) Memory: at least 32M, and usually above 512M to effectuate good performance.

3) Hard disk: at least 6G to ensure long-term stable running of the system.

4) OS: Solaris 2.5.1 or Solaris 2.6 (SunOS 5.5.1 or SunOS 5.6).

5) OS patches: the latest patch programs provided by Sun.

6) Other software: ORACLE 8.0.5, OMCR (V2).

2. Install Solaris on Sun

Before installation, you should know the hardware environment of your system, such as the hard disk space and the memory. The installation steps are as follows:

1) Insert Solaris OS installation CD into CD-ROM drive of the system.

2) Restart the system.

3) Switch to root user, and restart the system.


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Press Stop+A (press Stop key and A key at the same time) when the system begins to restart.

4) With the OK prompt, input the command: boot cdrom.

5) Select the language displayed in the installation process, and input the serial No. for the language (English) selected.

6) Input the number of MBs indicating the hard disk space. Select the size of the swap partition to be used during installation. For ORACLE installation in the next step, the swap partition is recommended to be three times of the physical memory, and if there is more than 1G physical memory in the system, the swap space may be two times of the physical memory, or even less.

7) When the system instruct you to select disk partition to be used in Solaris installation, just accept the default partition (/dev/dsk/c0t0d0s1).

8) The installation environment software will be copied to the hard disk, and then the system will reboot, and several minutes later, the system identification window will appear.

9) In the system identification window, input the information about the system, as shown in Table 6-2:

Table 6-2 System information

System information to be provided Example

Host name Sun10

Network connection Yes

IP address 138.1.20.3

Network mask (255.255.255.0 by default) 255.255.0.0

Name service “NIS+” , “NIS” , “DNS” or “None” None (by default)

Domain name NULL

Name server NULL

IP address of server NULL

Time zone East Asia->PRC


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Date and time 15:03 on November 22, 2000

Root password Sun10omc

Power management (to determine whether the system uses this function)

No

10) Answer questions raised during Solaris installation. See Table 6-3 for details.

Table 6-3 Some questions and suggested answers during Solaris installation

Questions to be answered during installation

Answers to be selected

Version to be installed 2.6 5/98

Default installation or self-defined installation Self-defined

Language environment of software installed English

Software set Five options in all, and select the second one

Partition condition Not changed

To select the partition, note that the partition needed for installing ORACLE database should be 3.5GB at least, and that for installing OMCR server program should be 2GB at least, and the swap partition of the system should be 512MB at least.

11) Wait for the completion of Solaris installation.

This process may last for one hour, depending on the software to be installed

and the speed of the system.

12) Check the “Installation abstract” shown at the end of Solaris installation process.

13) After the installation is over, the system will automatically eject the installation disk.

6.3.1.1 Installing ORACLE database

1. Preconditions

In Solaris installation, set up partition "/oracleapp" not smaller than 3.5G as the


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partition for Oracle installation. To install ORACLE in other partitions, just

change "/oracleapp" in this document to the corresponding partition path.

2. Preparations before installation

1) In the identity of root user, create dba user group, and create the oracle user that belongs to this group.

2) In the identity of root user, change the owner of the directory "/oracleapp" to oracle.

3) In the identity of root user, create local bin directory, e.g. /opt/bin directory, and make sure that each user has the right to visit this directory.

4) In the identity of oracle user, create 4 sub-directories as installation points (a software installation point, and three database installation points), such as

/oracleapp/u01

/oracleapp/u02

/oracleapp/u03

/oracleapp/u04

5) In the identity of oracle user, create $ORACLE_BASE path,

software_mount_point/app/oracle/, such as

/oracleapp/u01/app/oracle

6) In the identity of root user, change /etc/profile file.

#/etc/profile file

ORACLE_OWNER=oracle

export ORACLE_OWNER

ORACLE_BASE=/oracleapp/u01/app/oracle


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export ORACLE_BASE

ORACLE_HOME=$ORACLE_BASE/product/8.0.5

export ORACLE_HOME

LD_LIBRARY_PATH=$LD_LIBRARY_PATH:$ORACLE_HOME/lib:/usr/openwin/lib:$ORAC

LE_HOME/jdbc/lib:/usr/local/lib (no line feed allowed in actual operations)

export LD_LIBRARY_PATH

ORACLE_SID=omc

export ORACLE_SID

ORACLE_TERM=xSun5

export ORACLE_TERM

CLASSPATH=$CLASSPATH:$ORACLE_HOME/jdbc/lib

export CLASSPATH

PATH=$PATH:/usr/bin:/opt/bin:$ORACLE_HOME/bin:/usr/local/bin:/usr/ccs/bin

export PATH

ORA_NLS33=$ORACLE_HOME/ocommon/nls/admin/data

export ORA_NLS33

NLS_LANG=AMERICAN_AMERICA.WE8ISO8859P1

Export NLS_LANG

TMP_DIR=/var/tmp

export TMP_DIR

umask 022


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7) In the identity of root user, change /etc/system file.

#/etc/system file

set shmsys:shminfo_shmmax=4294967295

set shmsys:shminfo_shmmin=1

set shmsys:shminfo_shmmni=100

set shmsys:shminfo_shmseg=10

set semsys:seminfo_semmns=200

set semsys:seminfo_semmni=70

8) Restart the machine.

9) In the identity of root user, run cdrom_mount_point/orainst/oratab.sh script to create and set oratab file and corresponding rights under /var/opt/oracle directory. The instance information about ORACLE is saved in the oratab file.

3. Installation processes

Log in to Solaris as an oracle user, run the installer “orainst” in the CD. For

specific installation processes, please refer to the related document about

oracle installation. A simple installation process is as follows.

1) Select CUSTOM mode for installation.

2) There are several installation modes:

Install, Upgrade or De-Install Software

Create/Upgrade Database Objects

Perform Administrative Tasks

For installation for the first time, select the first installation mode above.


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3) Select: Install New Product - Create DB Objects.

4) Reserve the default path: ORACLE_BASE, ORACLE_HOME.

5) Reserve the default path: Installer Log, SQL Log, Makefile Log, OS Log.

6) Select: Install From CD-ROM.

7) Keep the value of ORACLE_SID unchanged.

8) Select: NLS: Native Language – American English.

9) Select the desired product for installation.

Client Software

Net8

Oracle UNIX Installer

Oracle8 Enterprise (RDBMS)

Oracle8 Partitioning Option

PL/SQL 8.0.5.0.0

Pro*C/C++

SQL*Plus

TCP/IP Protocol Adapter

Oracle Intelligent Agent

Solaris Documentation


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JDBC

10) Reserve the default value: Group To Act as DBA: dba.

11) Reserve the default value: OSOPER Group – dba.

12) Select: File System-based Database.

Database storage type: File System or Raw Devices.

13) Select “Y”: Distribute Control Files Over 3 Mount Points.

/oracleapp/u02

/oracleapp/u03

/oracleapp/u04

14) Database character set: select WE8ISO8859P1.

This character set is not listed in the installation interface of the installer and

therefore needs to be input manually.

15) NLS Character Set: WE8ISO8859P1.

Select WE8ISO8859P1 as the character set to realize national language

support (NLS) function. This character set is not listed in the installation

interface of the installer and therefore needs to be input manually.

16) Input password: Password For “system”.

During installation, input “oracle” as password where it is required without

exception. And the password may be changed after installation.

17) Input password: Password For “sys”.

18) Select “N”: Do not Set the Password For “internal”.

19) Input password: Password for the TNS Listener.


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20) Select “N”: Multi-Threaded Server (N).

21) Reserve the default value: Control Files.

/oracleapp/u02/oradata/omc(SID)/control01.ctl



Reserve the default value: Files:

/oracleapp/u01/app/oracle/product/8.0.5/dbs/orapwomc

/oracleapp/u02/oradata/omc/system01.dbf

/oracleapp/u02/oradata/omc/redoomc01.log



/oracleapp/u02/oradata/omc/rbs01.dbf

/oracleapp/u02/oradata/omc/temp01.dbf

/oracleapp/u02/oradata/omc/users01.dbf

/oracleapp/u02/oradata/omc/tools01.dbf

22) Select “N”: LSM (Legato Storage Manager).

23) JDBC (select all).


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24) Select “Y”: Help For SQL *PLUS (Y).

25) Select “Y”: Demo Table For SQL *PLUS (Y).

26) Reserve the default value: ORACLE_DOC directory: /oracleapp/u01/app/oracle/doc.

27) Select: Formats For UNIX Documentation (both html and pdf).

28) Start installation.

4. Work after installation

In the identity of root user, execute $ORACLE_HOME/orainst/root.sh.

6.4 System debugging

6.4.1 Contents of BS system debugging

After BSC software and hardware are installed, overall debugging is performed

so as to find possible problems and get prepared for the normal acceptance,

cutover and running of the system.

Debugging of the base station system includes the following contents:

1. Equipment installation technical test

For the details, please refer to Chapter 5.2, Inspection before power-on.

2. System setup functions

System initialization loading.

3. Troubleshooting test

4. Service test

1) Call service


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2) Various switching modes

Operation and maintenance subsystem test

1) Man-machine commands

2) Configuration management

3) Alarm management function

4) Performance measurement and performance management functions

5) Security management

6.4.2 Debugging of the system setup function

Initialization: BSC initialization is normal.

6.4.3 Troubleshooting test

1. Active/standby switchover

1) Switchover of active/standby MPs

A. Fault switchover

B. Manual switchover

C. Man-machine command switchover

Switchover works normally. Subscribers in the status of talking or ringing will not be influenced, but those in the process of connecting may be influenced. MP can realize switchover from active to standby, or standby to active.

2) BOSN board active/standby switchover

A. Fault switchover



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Switchover works normally. Subscribers in the status of talking or ringing should not be influenced, but those in the process of connecting may be influenced. BOSN can realize switchover from active to standby, or standby to active.

3) GPP board active/standby switchover

A. Fault switchover



Switchover works normally. Call connection is not influenced in the process of switchover, and there should be an alarm report in the case of fault switchover.

4) COMI board active/standby switchover.

A. Fault switchover

B. Man-machine command switchover


5) DSNI active/standby switchover:

A. Fault switchover




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6) COMI board active/standby switchover

A. Fault switchover



7) POWB hot backup function

POWB hot backup function is implemented normally. Call connection is not

affected, and there should be an alarm report when POWB gets faulty.

2. Restarting the system

1) System restart after power-off

A. Board indicators work normally.

B. PCM system returns to normal.

C. Link No. 7 can be reactivated.

D. LAPD link can return to normal.

E. All cells can return to normal.

F. OMCR can give the correct alarm content.

G. Communication between foreground and background return to normal.

H. BSS services return to normal.

2) MTP board restart: NO.7 (SCCP) is interrupted, but it may return to normal.

3) LAPD restart: LAPD link with BTS is broken, but it can return to normal.

4) PEPD board restart: it can return to normal.


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5) MONI board restart: it can return to normal.

6) MPPP board restart: communication between BSC MP and PPs is broken, but it may return to normal.

7) MPMP board restart: communication among BSC modules is broken, but it can return to normal.

8) DRT board restart: The trunk to MSC is broken, but it can return to normal.

9) TIC board restart: The trunk to MSC is broken, but it can return to normal.

6.4.4 Service test

6.4.4.1 Call service

1. Local MS→local PSTN subscriber

A local MS calls an idle local PSTN, the called PSTN subscriber will reply, and the call is completed. When a local MS calls an idle local PSTN subscriber, the called rings and the caller hears the ring-back tone, the calling MS will turn off his mobile phone, and the call shall be released properly. MS calls local PSTN subscriber, and when the called is busy, the call should be capable of being released correctly. MS calls local PSTN subscriber, and when the called is a null number, MS should hear null number announcement tone. MS calls an idle local PSTN subscriber, and when the called does not answer or the timer is timeout, the call should be capable of being released successfully.

2. Local MS→long distance PSTN

MS calls an idle distance PSTN subscriber, and the distance PSTN subscriber

answers.

3. Local PSTN subscriber→local MS

A local PSTN subscriber calls an idle local mobile subscriber, the MS


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answers, and the call should be capable of being completed. Local PSTN calls local busy MS, the caller should be able to release correctly, without affecting the call of the called. Local PSTN subscriber calls MS, and when the called does not answer and the timer is timeout, the call should be capable of being released. Local PSTN subscriber calls local idle MS, but when the radio channel is congested, the call should be capable of being released successfully. Local PSTN subscriber calls local idle MS, but when the ground trunks are all busy, the call should be capable of being released correctly.

4. Local MS→local MS

An MS calls another idle MS and the called party answers the call, the call shall be completed successfully. MS calls another idle MS, and when the called answers and the caller hooks on first, the call should be capable of being released successfully. An MS calls another idle MS, and when the called answers, the called hooks on first, the call should be capable of being released successfully. An MS calls another local busy MS, the caller should be able to release correctly, without affecting the call of the called. An MS calls another idle MS, and the called party does not answer the call until timeout, the call shall be released. An MS calls another MS, when the called MS gives no paging response, the call should be capable of being released successfully. An MS calls another MS, when the called number is a null number and the caller hears null number announcement tone, the call should be capable of being released successfully. An MS calls another MS, and when the radio channel is congested, the call should be capable of being released successfully.

5. Local PSTN subscriber→non-local MS

PSTN calls an MS roaming locally, the MS answers, the call should be capable of being completed.

6. Long-distance PSTN subscriber→local MS

A long-distance PSTN subscriber calls local MS, the MS answers, the call

should be connected.


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7. Remote MS→local MS

A remote MS calls an idle local MS, and the local MS answers, then the call

shall be connected. A local MS roaming remotely calls local MS, local MS

answers, the call should be capable of being completed. Remote MS roaming

to the third party calls local MS, local MS answers, the call should be capable

of being completed. A local MS roaming remotely calls local MS, local MS

answers, the call should be capable of being completed.

8. Local MS→remote MS

A local MS calls an idle remote MS that does not roam, and the called answers,

then the call should be connected. A local MS calls a local MS, local MS that

roams to a remote network, and the called answers, then the call should be

connected. A local MS calls a remote local MS that roams to the local network

and the called answers, the call should be connected. A local MS calls an MS

that roams to a third-party remote network and calls a local MS, the called

answers, then the call should be connected.

6.4.4.2 Handover test

1. Handover function in the same cell: Handover can be performed normally.

2. Handover function between two adjacent cells controlled by the same BSC: Handover can be performed normally.

3. Handover function between two adjacent cells controlled by different BSC: Handover can be performed normally.

4. Directed retry controlled by the same BSC: Handover can be performed normally.

5. Directed retry controlled by different BSCs: Handover can be performed normally.

6.4.5 Operation and maintenance subsystem test

1. Man-machine commands


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BSS can input all commands and configuration data via the remote OMC

interface, and transmit them to BSS along X.25 link. It supports local MMIs of

all BSCs and BTSs.

2. Configuration management

The data can be correctly configured in accordance with the radio network of

the subscribers. The operation and maintenance center should be able to

modify, add and delete data easily and correctly.

3. Alarm management

The alarm management subsystem should perform various functions: collect various BTS and BSC alarms timely and correctly, and report to OMCR; ensure that no alarm is lost or repeated; correctly send status of each board to OMCR, such as the active/standby status, etc., save the alarm in BSC for certain period of time when the foreground is disconnected from the background, and after communication restores, send the alarm to OMCR; support various man-machine commands for the board, such as reset, switchover; whether to provide hot backup of current alarm information between active/standby MP, and during active MP switchover, no alarm information will be repeated or lost.

The alarm function can be tested by simulating all possible alarms in the system environment, and through the alarm background of OMCR, checking whether the alarms can be reported and recovered correctly. We can check whether man-machine commands can be executed correctly by sending various supported commands from the alarm background of OMCR to BSC.

4. Performance management

For the performance measurement sub-system, it should create and terminate various measurement tasks issued by background, i.e. perform correct maintenance according to man-machine commands of background; send measurement data to background timely and correctly. The measurement data collected may truly reflect the running status of the system. When the foreground is disconnected from the background, the


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former saves the data in BSC, and then sends to OMCR after communication restores.

The performance is tested mainly through artificial service flows, to observe at the OMCR performance measurement background whether relevant data are correct; and via this background, add to or delete from the foreground the measurement tasks to see whether BSC can handle these operations correctly.

5. Security management

Security management includes various management for authentication, access control, user, user group, operation log, etc. In addition, BSC has the system restriction function, restricting the input of MMI commands from the local I/O terminal, remote connection terminal or via X.25 data link.

6.4.6 GPRS test contents

1. Hardware function test

2. Software version check

Check the version number of the software manufactured with that of the running software. They should be consistent.

3. Fault test

Once the system is restarted after power-off, the Gb link can be re-activated, and each BVC can become normal again.

4. Switchover and restart test

1) PUC board active/standby switchover

A. Fault switchover



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2) GIPP board active/standby switchover.

1 Fault switchover

2 Manual switchover

3 Man-machine command switchover

3) BRP restart: it can return to normal.

4) FRP restart: it can return to normal.

5. Service test

1) Gb interface test

NSVC status observation, blocking, unblocking; BVC status observation, blocking, unblocking, signaling BVC resetting.

2) Packet service test

GPRS attachment, detachment; PDP activation, deactivation; packet service test (PING, WAP, FTP, HTTP).

6.4.7 Installation and test records

When installing and testing BSC software and hardware, please keep careful records of all installation items and test results, especially for the faults and corresponding solvents in the project.


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7 Packaging, Storage and Transportation

7.1 Packing

All parts and components of ZXG10-BSC (V2) are packed by adopting reasonable quakeproof, vibration-free and other precaution measures, so as to protect the equipment during transportation.

The whole system of ZXG10-BSC (V2) is packed in separate packages. These packages include rack package, doorplate package, side plate package, MP package, power supply package, cable package, and delivery-attached documentation package.

Each package has obvious outside markers, which indicate the product name, model, handling and placing direction, as well as dampproof, fragile, waterproof and piled layer indications, so as to avoid damages, confusion, mismatching, etc., while storing and transporting the equipment.

1. Packing of plug-in units

Take down the plug-in units from the rack, pack them with anti-static bag and put in large foam-padded carton box. Operate in an order reverse to the above one for assembling racks on site.

2. Rack packing

Rack package contains plug-in boxes, backplanes, power plug-in box on top of the rack, plug-in units, backplane signal lines (excluding cabinet top cover, front and back door plates and side plates). First pack them with anti-static bag and then put in a wooden box. Operate in an order reverse to the above one for assembling racks on site.


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The size of the wooden box is 958mm (length) × 2148mm (width) × 813mm (depth), as shown in Fig. 7-1.

958m

m81

3mm

2148mm

Fig. 7-1 Exterior dimensions of the wooden box

3. Door packing

Wrap the 4 front and back doors separately in EPE packages, separate them with foam boards, and then put them into door packing boxes. Operate in an order reverse to the above one for assembling racks on site.

Size of the wooden box: 238mm (length) × 1988mm (width) × 508mm (depth)

4. Side door packing

Wrap the two left and right side doorplates separately with EPE packages, stack them up by placing foam boards in-between, and then put them into the side doorplate packing box. Operate in an order reverse to the above one for assembling racks on site.

Size of the wooden box: 178mm (length)×2,123mm (width) × 708mm (depth)


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7.2 Storage

7.2.1 Storage conditions

Ordinary goods should be placed in special-purpose rooms and taken care of by somebody designated by the user. The room should satisfy the following conditions:

1. Temperature: 0°C ~ 35°C, relative humidity: 20% ~ 75%, without dense dirt or corrosive materials around.

2. No direct sunshine or other direct thermal radiation.

3. The warehouse should be fixed with a thermometer, hygroscope, air-conditioner, ventilation fan, and facilities providing protection against dust, mold, corrosion and rodents.

4. The warehouse should be installed with fire control and alarm devices.

5. The warehouse keeper should read the thermometer and hygroscope every day and keep proper record. To make the temperature and humidity meet relevant requirements (in case they fail to), proper measures should be taken.

6. The warehouse keeper should keep the warehouse clean and tidy, and open the windows or curtains only when it is necessary.

7.2.2 Placement

Keep the following in mind when storing goods:

1. Place the packing box as directed, with the arrow outside the packing box pointing upward. Do not place it upside down and do not overlap more than two boxes.

2. Usually, place computers and boards on top and cables at the bottom. Do not overlap more than four cartons.


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3. Store boards in cartons and insert isolating plates between the boards, so as to protect the boards against damage due to static electricity. Place no more than 20 boards in a carton to prevent the boards from pressing against each other. Wear anti-static wrist strap when handling the boards.

4. Place the box storing boards on rack to protect board from moisture.

7.3 Equipment transportation and portage

Special containers should be used for product transportation.

The products on transportation vehicles shall be placed neat and tidy, compact, safe, and reliable, so as to prevent shake-caused damages during transportation. Do not overlap more than three wooden boxes, no more than two fiber boxes, and no more than four cartons. Note that the computers and boards should be placed on the top of the vehicle, and cables at the bottom.

In long-distance transportation, the equipment MUST NOT be loaded in an ship or carload without awnings. In transshipment, equipment MUST NOT be placed in an open warehouse. During the transportation, equipment MUST NOT be loaded with flammable, explosive and erosive goods, and the parts should NOT be exposed to rain, snow, liquids or mechanical damages.

During transportation, keep the cargo away from the ferromagnetic and highly radiating objects.

Do not place the products and parts packed upside down when they are lifted for transportation.

No more than two cabinet packing boxes are allowed in the forklift every time, and the maximum height for lifting must be within the range; and the equipment parts must lie at the gravity center of the forklift.

Note the storage and transportation mark on the packing box when handling.


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Appendix A BS System Alarms

After ZXG10 is plunged into operation, start the centralized monitoring over its overall operation status so as to enable real-time maintenance and repairing. This function is implemented by the background alarming system. This Appendix lists alarms of various types for reference.

A.1 BSC alarm list

Table A-1 BSC alarm list

Alarm type Alarm level Description

Net drive board alarm 2 DSNI board has been inserted unstably, the board is not in the position, or communication with MP is interrupted or hardware is faulty.

Severe alarm on the power supply board

2 Voltage output is over or under voltage.

Clock interface board alarm

3 BITS clock reference is lost, or the clock interface board powers off or hardware is faulty, etc.

Common alarm of the power supply

4 The power supply board can not be monitored, is not in position, or powers off, etc.

SS7 access point unreachable

3 The communication link quality between BSC and MSC is not good.

SS7 L3 alarm 3 SS7 link communication quality is poor, and a lot of error signaling is received, etc.

SS7 SCCP alarm 2 When SCCP configures SSN status, the office ID can not be found out by DPC.

MP active/standby communication interrupted

2 The standby MP does not work normally, the shared memory board is faulty, etc.

MPPP board fault 2 Communication between MPPP and MP interrupted, power-off, hardware fault, or clock loss, etc.

SS7 board fault 3 Communication between MTP and MP interrupted, power-off, hardware fault, or clock loss, etc.

Alarm type Alarm level

Description

MON board fault 3 Communication between MON and MP interrupted, power-off, hardware fault, or clock loss, etc.


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SMEM board fault 2 Communication between SMEM and MP interrupted, power-off, hardware fault, or clock loss, etc.

Environment monitoring board fault

2 Communication between the environment monitoring board and MP interrupted, power-off, hardware fault, or clock loss, etc.

LAPD board fault 2 Communication between LAPD and MP interrupted, power-off, hardware fault, or clock loss, etc.

Trunk congestion 3 Trunk congestion

Trunk loading error 4 Trunk loading error

BIE unit alarm 3 Communication is interrupted, reporting the fault

BIE sub-unit alarm 4 Frame asynchronization

SM board fault 2 Communication between SM and MP interrupted, power-off, hardware fault, or clock loss, etc.

PCM cable fault between SM

3 A chip fault in the SM board or external line fault

SM sub-unit fault 3 Frame asynchronization

DRT board fault 2 Communication between DRT and MP interrupted, power-off, hardware fault, or clock loss, etc.

DTI board fault 2 Communication between DTI and MP interrupted, power-off, hardware fault, or clock loss, etc.

TC sub-unit alarm 3 Frame asynchronization

DSP ring fault on DRT 4 Software or hardware fault in DSP

PECM sub-unit alarm 4 Fault of a chip in the SM board or an external line, etc.

PECM board fault 3 Communication between PECM and MP interrupted, power-off, hardware fault, or clock loss, etc.

BSC equipment room ambient temperature alarm

2 Temperature is out of the normal working range of the switching system.

BSC equipment room ambient humidity alarm

3 Humidity is out of the normal working range of the switching system

BSC equipment room smog alarm

1 There is smog in the equipment room.

BSC equipment room infrared alarm

1 Somebody illegally enters the equipment room.

MP alarm 2 The standby MP is faulty.


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Alarm type Alarm level Description

The standby MP powers off

The standby MP software is faulty.

The standby database restores.

Database loading fails

The standby MPWatchDog overflows.

Insufficient MP disk space alarm

2 Hard disk space is insufficient.

MP bus alarm 1 The shared memory bus is faulty, and communication board bus is faulty.

MP database loading fault

2 The database loading failure, the database synchronous failure

Switching network fault 2 The switching network hardware, software or clock interface faults

Switching network dual faults

1 Communication with MP interrupted, clock fault, power-off, etc.

Clock board severe alarm

1 8K frame header and 8K clock output faults; 16K frame header and 16M clock output faults.

Clock board general alarm

3 Main D/A conversion is out of range, and it is normally caused by the clock aging.

A.2 BTS alarm list



FUC-CHP0 communication interrupted 4




DSP0 initialization failure 3




There is check error on one line of the uplink data from RPP to the main/diversity CHP (DSP0)

3


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4


4


4

Number of the CKU-receiving frame is abnormal. 4

The interface clock of FUC_CKU is faulty. 3

Flash Memory error 3

Other FUC hardware errors 4

WatchDog overflow of DSP0 4





4


4


4


4

WatchDog overflow of FUC 3

Attempts of programming is beyond limits in Flash Memory of FUC

4

Ch0 parameter configuration error 4








CHP software version inconsistent 3


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FUC software version inconsistent 3

No response from L3 layer software of FUC temporarily 4

LAPD link between FU and BSC interrupted 3

DLRC_AL downlink check error 3

Receiving RF local oscillator 1 out of lock 4

Receiving RF local oscillator 2 out of lock 4

Transmitting RF local oscillator 3 out of lock 3

Transmitting RF local oscillator 4 out of lock 3

Transmitting IF local oscillator 5 out of lock 3

Receiving IF local oscillator 6 out of lock 4

CU parameter configuration error 3

CU software version error 3

CU L4 layer software without response temporarily 4

CKU main clock alarm 2

CKU frame number alarm 3

CKU phase-locked loop out of lock alarm 4

CKU software version error 3

CKU L3 layer software without response temporarily 4

BIE software version error 2

BIE switching chip 1 fault 3




E1 interface chip 1 read/write fault in BIE 4



E1 interface signal 1 loss alarm in BIE 3



E1 interface signal 1 forward slip code indication in BIE 4

E1 interface signal 2 forward slip indication in BIE 4


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E1 interface signal 3 forward slip code indication in BIE 4

E1 interface signal 1 backward slip indication in BIE 4

E1 interface signal 2 backward slip indication in BIE 4

E1 interface signal 3 backward slip code indication in BIE 4

E1 interface signal 1 frame asynchronization alarm in BIE 3



BIE link parameter configuration error 3

No response from L3 layer software in BIE temporarily. 4

Fan 1 alarm 3

Fan 2 alarm 3

Fan 3 alarm 3

Fan 4 alarm 3

Fan 5 alarm 3

Fan 6 alarm 3

Fan 7 alarm 3

Fan 8 alarm 3

Fan 9 alarm 3

Temperature sensor 1 alarm 3






Dry contact 1 alarm 3








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L3 layer software version error in EAM 3

Temporarily no response from L3 layer software in EAM 3

Attempts of programming is beyond limits in the FLASH of OMU 4

FLASH programming failure in OMU 4

FUBUS fault (communication between OMU and all FUs is interrupted) 3

OBBUS fault (communication between OMU and BIE/CKU/EAM is interrupted) 3

OMU backup board is not in position. 4

PA output power alarm 3

PA voltage standing wave ratio alarm 3

PA power amplifier tube over current alarm 4

PA power amplifier tube over voltage alarm 4

PA over temperature minor alarm (≥75°C) 4

PA over temperature major alarm (≥80°C) 3

Downlink check error from CHP to CUI 4

Low noise amplifier 1 alarm of the transmitter splitter 4

Low noise amplifier 2 alarm of the transmitter splitter 4

Standing wave minor alarm of the transmitter combiner 4

Standing wave major alarm of the transmitter combiner 3

PSB alarm 3

PSA alarm 3

CKD not in position 3

OMU communication link interrupted 2

BIE communication link interrupted 3

CKU communication link interrupted 3

EAM communication link interrupted 3

FU communication link interrupted 4


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CU communication link interrupted 4

RTE communication link interrupted 3

PSA communication link interrupted 3

PSB communication link interrupted 3

PA communication link interrupted 4

MUL communication link interrupted 4

CKD communication link interrupted 4

HYCOM communication link interrupted 4

OMU board timeout has not been reported 3

BIE board timeout has not been reported 4

CKU board timeout has not been reported 4

EAM board timeout has not been reported 4

FU board timeout has not been reported 4

CU board timeout has not been reported 4

RTE board timeout has not been reported 4

PSA board timeout has not been reported 4

PSB board timeout has not been reported 4

PA board timeout has not been reported 4

MUL board timeout has not been reported 4

CKD board timeout has not been reported 4

HYCOM board timeout has not been reported 4

A.3 GPRS alarm list



HDLC communication is interrupted in FRP board 3

8M8K clock loss in FRP board 2

8K clock loss in FRP board 2

FRP board frame relay circuit fault 3


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MSVC link reset failure 3

HDLC communication is interrupted in BRP board 3

8M8K clock loss in BRP board 2

8K clock loss in BRP board 2

DSP fault in BRP board 4

PUC board failure. 3

PUC unit failure. 3

LAN fault inside SPCU 3

GIPP board failure. 3

LAN fault between SPCUs 2

A.4 Notification type list

Table A-4 Notification type list

Notification types Cause description

Peripheral control unit reset

Disk is full.

File is damaged. File operation error announcement

File bias value error.

TUP announcement

ISUP announcement

SCCP announcement

E1 interface slip code announcement

BSSAP announcement


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Appendix B UNIX Common Commands

Under Shell prompt, input UNIX commands.

The basic format of UNIX commands is as follows:

command parameter 1 parameter 2 ... parameter n

UNIX command consists of one command and 0~several parameters. The command and parameter are separated by a space, so are parameter and parameter. The format of UNIX command is similar to that of DOS command, but UNIX command is case sensitive and the command and parameter must be separated.

1. Login and exit

Input the username when the remote system prompts as “login:”, press <Enter>, and input the password in accordance with the system prompt. Note that the terminal does not display the password, just input as usual. Upon successful login, the system will give $> prompt or other prompts, indicating you have entered into the system’s working environment. Do use logout or exit command to exit the system or leave the terminal for long.

Note:

UNIX includes three common Shells: B Shell, C Shell and K Shell, and generally, B Shell is default in the system. The default prompts of B Shell and K Shell are "$", and that of C Shell is "%". The system prompt is "#" if the user logs in as root user.

2. User management command

Users of UNIX system include common users and super users, and each user belongs to an authority group. After login as root super user, it is possible to add user with useradd and delete user with userdel.


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1) Adding a user

useradd [-c uid comment] [-d dir] [-e expire] [-f inactive] [-g gid] [-G gid [,

gid…]] [-m [-k skel_dir]] [-s shell] [-u uid [-o]] username

username: the login name of the user, which is an essential parameter

uid comment: content saved in user ID explanation domain

dir: user’s HOME directory

expire: the exact date when user name expires

inactive: the number of days when username hasn’t been used before username is locked

gid: the name or ID of the group the user belongs to

Shell: user’s initial Shell

Skel_dir: the directory of the file copied to the user’s new HOME directory

Uid: user’s unique ID

-o: indicating that the user ID is not necessary to be unique

-g: a basic group selected for the user

-G: some basic groups selected for the user

E.g.: useradd –c OMC2.0 –d /home/omc –g root omc

Create a user omc, whose HOME directory is /home/omc, belonging to


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root group.

2) Deleting a user

userdel [-r] username

-r: delete user’s HOME directory when deleting a user

E.g.: userdel –r omc

Delete omc user, and delete his HOME directory at the same time

userdel omc

Delete omc user, but not his HOME directory

3. File and directory operation commands

pwd the command to show the current working directory

cd convert the working directory (“..” upper-level directory, “.” current directory)

E.g.: cd /home/omcuser

mkdir create sub-directory

E.g.: mkdir omctmp

Under the current directory, create subdirectory omctmp

rm /mv /cp move, copy and delete file


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E.g.: rm –r tmp delete all files and directories under the sub-directory tmp

rm gpo2001/7/12.log delete the log file of gpo

mv junk precious rename the file junk as precious, keeping the content unchanged.

cp junk precious copy file, existing two files with the same content.

ls -al list all files and directories in the system. The attributes of each item indicate the read/write and execution attributes of files/directories, including the file/directory number, host user, host group, file size, creation time, file name.

vi editor or other editors can be used to create file.

cat show the content of a text file

E.g.: cat test.conf or cat test.conf | more

tail show the last 10 lines of the file, applicable to large files.

E.g.: tail -f gpoc2001/7/11.log, capable of promptly showing the content of the updated current file

find used to search for a certain file

E.g.: find ../ amp2001/7/11.log search for the file named amp2001/7/11.log in the upper-level or included subdirectory.

grep search for character string in the whole text file


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E.g.: grep ‘hello world’ example.txt

4. File compression and decompression

tar most common backup commands

E.g.: tar -cvf ./2001/7/12log.tar . back up all files under the current

directory to 2001/7/12 log.tar file

tar –xvf omc20.xxxx-sparc.tar decompress the file to the current directory

gzip/gunzip compress/uncompress compression and decompression tool

E.g.: gzip omc20.xxxx-sparc.tar compress the omc20.xxxx-sparc.tar file to omc20.xxxx-sparc.tar.gz file

gunzip omc20.xxxx-sparc.tar.gz decompress the file to tar file

compress omc20.xxxx-sparc.tar compress the .tar file to

omc20.xxxx-sparc.tar.Z file

uncompress omc20.xxxx-sparc.tar.Z decompress omc20.xxxx-sparc.tar.Z to omc20.xxxx-sparc.tar file

5. Network-related commands

netstat: view the connection status of the current network interface of the server

ping view the contection status of the network e.g., ping 138.2.1.235

telnet: log in to other hosts e.g., telnet 138.2.1.235


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ifconfig configure local network interface, ifconfig –a is used to show the local IP address

6. How to execute other commands of the program at the background

To make a program run at the background, just add “&” at the end of the

command line.

E.g.: execute find command at the background to search for the file abc under the current directory or its subdirectory.

Execute the command, and the following contents will immediately display:

$ find . -name abc -print&

10722

$

10722 stands for process ID (PID).When find command is executed at the background, the result will be displayed.

7. Process-related commands

PS shows the process information as in Table B-1.

Table B-1 Process information shown by PS

UNIX command Explanations

ps Show the process information related to the terminal used

ps -u username Show the process of a certain user (e.g. ps -u abc)

ps –e Show the information of all running processes

ps –f The long list shows the information of each process

ps –ef the long list shows the information of all running processes

E.g., kill “kill” the process


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E.g., kill process ID or kill–9 process ID force-kill process

8. Steps for stopping out-of-control process

1) Log in as root user at the unlocked terminal

2) Use "ps -ef" and "grep keyword" command to search for the pid number of the out-of-control process

3) kill pid number. If it can’t be killed, then run "kill -9 pid number"

4) If it still can not be, use shutdown

9. View disk space

df –k show how much the disk spaces of the host are used

du –sk . show the disk space occupied by the current directory

10. The shutdown command of the system

reboot restart the system

shutdown the command to shut down and restart the system.E.g., shutdown –i6 restart the system

11. Install and uninstall local file system

mount /dev/device /directory/to/mount

Here, /dev/device is the file system to be installed;

/directory/to/mount is the installation point of the local file system

Note: Before installation, the host directory of the installation point must exist


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Options of the mount commands:

rw: rewritable

ro: read only

bg: background installation (if installation fails, the installation process will retry at the background until installation succeeds)

intr: installation may be interrupted

E.g. mount –o –rw,bg,intr /dev/hda4 /usr

umount /directory/to/mount

E.g. unmount /usr unmount the /usr file system from the current directory tree, and restore the original content under the directory

12. Load network file system

The most common operation is to visit the file directories of other hosts, provided that this file directory is shared by other hosts in NFS mode. e.g., to visit /export/home/omc directory of 138.2.1.235 machine:

$cd /net/138.2.1.235/export/home/omc

13. Other commands

vmstat view the use condition of the virtual memory of the system

date show the current system time

passwd set user password.For example, passwd, change the current user password


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which <filename> view which directory of the system a certain command is in

E.g., which ls view which directory the command ls is in.

14. Switch to root user

su

Password

15. Use of man tool

The most common help is the man tool in UNIX, whose basic use is man <topic>. In addition, man –sX <topic> can be used to specify the topic of Chapter X.man –K <topic> can be used to search for the topic containing the keyword <topic>.

E.g, man ls view all help topics of the command ls.


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Appendix C Abbreviations Abbr. Full name

AIPP A Interface Peripheral Processor

AIU A Interface Unit

BATC Backplane of A interface and TransCoder

BBIU Backplane of Abis Interface Unit

BCTL Backplane of ConTroL

BIE Base station Interface Equipment

BIPP Abis Interface Peripheral Processor

BIU Abis Interface Unit

BNET Backplane of NET

BOSN Bit-Oriented Switching Network

BRP BSSGP RLC/MAC Protocol processor

BSC Base Station Controller

BSMU Backplane of SubMultiplexing Unit

BSS Base Station System

BTS Base Transceiver Station

CKI ClocK Interface board

COMI COMmunication Interface board

COMM COMMunication board

DRT Dual-Rate Transcoder

DSNI Digital Switch Network Interface

DSP Digital Signal Processor

DTI Digital Trunk Interface

EDRT Enhanced DRT

EGSM Enhanced Global System for Mobile communicaion

FRP Frame Relay Protocol Processor

FSMU Far SubMultiplexing Unit


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(to be continued)

Abbr. Full name

FSPP Far Submultiplexing Peripheral Processor

GIPP Gb Interface Peripheral Processor

GPP General Peripheral Processor

GPRS General Packet Radio Service

GSM Global System for Mobile communication

HW HighWay

LAPD Link Access Protocol on the D channel

LED Low Emitting Diode

LMT Local Maintain Terminal

MON MONitor board

MPMP MP To MP

MPPP MP To PP

MS Mobile Station

MSC Mobile Switching Center

MSS Mobile Switch System

MTP Message Transfer Protocol

NSMU Near SubMultiplexing Unit

NSPP Near Submultiplexing Peripheral Processor

NSU Net Switching Unit

PCB Printed Circuit Board

PCM Pulse Code Modulation

PCU Packet Control Unit

PDCH Packet Data CHannel

PEPD Peripheral Environment &Power Detecting board

POWB POWer B

POWP POWer P

PUC Packet Unit Controller

PSTN Public Switching Telephone Network

RMU Radio Manage Unit

RXLE Rx Level

RXQUA Rx QUAlity


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(to be continued)

Abbr. Full name

SCCP Signaling Connection Control Part

SCM System Control Module

SCU System Control Unit

SM SubMultiplexing

SMB Subrate Multiplexing to Bts

SMEM Share MEMory

SMPP Subchannel Multiplexing Peripheral Processor

SMU Subchannel Multiplexing Unit

SUBPP SUB Peripheral Processor

SYCK SYnchronous ClocK board

TC Trans Coder

TCP Transfer Control Protocol

TCPP TransCoder unit Peripheral Processor

TCU TransCoder Unit

TIC Trunk Interface Circuit

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ZXG10 BSC(V2)Installation Manual

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