1/23/2011
Team members:
Duc TranTuan NgoGiang Nguyen
Peter ElabdThien NguyenThe Duong
Advisor: Dr. Mark Weislogel
Capstone 2011
Mobile Environment Chamber -Product Design Specifications
Overview
• Introduction• Project Plan• Product Design Specification• House of Quality• Risk• Conclusion
IntroductionCurrent Chamber:
• Lack of mobility• Non-uniform temp
distribution• Expensiveness
Heating and Cooling System
Chamber
PC
Controller
Actuator
Solid State Drives
Facility
Set T
Facility
Facility
Project Plan
ID Task Name Start Finish Duration27/320/2 6/3
1 19d2/4/20111/14/2011PDS
2 7d1/21/20111/14/2011Customer identification & requirements, existing product
3 7d1/28/20111/21/2011PDS criteria, engineering metrics, HoQ
3/4
Feb 2011
6/2 8/5
Mar 2011 Apr 2011
10/4 17/4 24/413/3 22/523/1 1/513/2
Jan 2011 May 2011
16/1 20/3 15/530/1 27/2
6d2/4/20111/30/2011Review, update tasks4
12d2/13/20111/31/2011External search5
7
14d2/17/20112/2/2011Internal search
14d2/28/20112/13/2011Concept evaluation & selection
6d2/18/20112/13/2011Review ideas8
9 9d2/28/20112/18/2011Finalize concept
6
Main task Sub task
12
11
10 18d4/15/20113/27/2011Detailed design
20d5/1/20114/8/2011Manufacturing, Prototyping
18d5/22/20115/2/2011Testing, optimization, review
Legend:
Product Design SpecificationCriteria Priority
Performance 1
Environment 1
Safety 1Cost 1
Mobility 1
Timelines 1
Ergonomics 2
Testing 2
Quantity 2
Maintenance 2
Materials 2
Quality and Reliability 3
Regulatory 3
Documentation (processes) 3
Company constraints and procedures 3
Legend High priority Medium priority Low priority
Product Design Specification
Mechanical AspectMobility• 19- inch rack form factor• Density: 75 lb./sq. ft. or less• Capacity: 4-12 Devices Under Test
(DUT)
Performance• Temperature range: -5 oC to 105 oC with ± 2 oC accuracy• Temperature uniformity: ±4oC throughout the chamber• Temperature transient:10 oC /minute • Airflow: 0.5 to 5 m/s across DUTs
Product Design Specifications
Input Power• Voltage : 120 - 240 VAC• Frequency: 50 Hz / 60 Hz• Real time communication with PC: read/write
current set-point temp and actual temp• Over-limit protection: An alarm activates when
thermal over-limit condition detected or EMO is pushed
FeaturesElectrical Aspect
Product Design SpecificationsOthers
Cost• 150 – 450 USD/DUT slot
Safety
• Comply with Semiconductor Equipment and Materials International (SEMI)
House of Quality
Risk Management
• Team Communication and Alignment
• Supplier Issues and Availability of Parts
• Project Exceed Budget
Conclusion
• All criteria are well defined
• The team is ready for the next phase!!!
• An agreement between design team and customers is specified
Q&A
Back up
http://flexstar.com/environmentchamber.php
Intel requirements + SEMI links