Printed in KoreaP/NO : MFL67982505 (1401-REV00)
CHASSIS : LB43B
MODEL : 32LB56** 32LB56**-T*
CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LED TVSERVICE MANUAL
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Internal Use Only
- 2 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All rights reserved.Only for training and service purposes
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS ................................................................... 4
SPECIFICATION ...................................................................................... 6
ADJUSTMENT INSTRUCTION ............................................................... 8
EXPLODED VIEW .................................................................................. 14
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
- 3 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All rights reserved.Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 M and 5.2 M. When the exposed metal has no return path to the chassis the reading must be infinite.An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5 mA.In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS
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SERVICING PRECAUTIONSCAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precau-tions. Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explo-sion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this service manual.CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged eas-ily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component dam-age caused by static by static electricity.1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter-natively, obtain and wear a commercially available discharg-ing wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or expo-sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some sol-der removal devices not classified as anti-static can generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads elec-trically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective mate-rial to the chassis or circuit assembly into which the device will be installed.CAUTION: Be sure no power is applied to the chassis or cir-cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-ment ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity suf-ficient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropri-
ate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.
(500 F to 600 F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuit board printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500 F to 600 F)b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the compo-nent lead and the foil.CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.
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IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the cir-cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close
as possible to the component body.2. Bend into a "U" shape the end of each of three leads remain-
ing on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed when-ever this condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec-tions).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con-nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
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SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.
1. Application rangeThis specification is applied to the LED TV used LB43B chassis.
2. Requirement for TestEach part is tested as below without special appointment.
1) Temperature: 25 C 5 C(77 F 9 F), CST: 40 C 5 C2) Relative Humidity: 65 % 10 %3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM.
5) The receiver must be operated for about5 minutes prior to the adjustment.
3. Test method1) Performance: LGE TV test method followed 2) Demanded other specification
- Safety : CE, IEC specification- EMC : CE, IEC
4. Model General SpecificationNo. Item Specification Remarks
1. Market Asia, Oceania, Africa, Middle East (PAL/DVB Market)
2. Broadcasting system1) PAL/SECAM-B/G/D/K/I2) NTSC-M3) DVB-T/T2
DTVLB43B/LB43M support DVB-TLB43T support DVB-T//T2
3. Channel Storage ATV - 135EA, DTV - 1000EA
4. Receiving system Analog : Upper HeterodyneDigital : COFDM(DVB-T)
DVB-T- Guard Interval (Bitrate_Mbit/s)1/4, 1/8, 1/16, 1/32- Modulation : Code Rate
QPSK : 1/2, 2/3, 3/4, 5/6, 7/816-QAM : 1/2, 2/3, 3/4, 5/6, 7/864-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
DVB-T2- Guard Interval (Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,- Modulation : Code Rate
QPSK : 1/2, 2/5, 2/3, 3/4, 5/616-QAM : 1/2, 2/5, 2/3, 3/4, 5/664-QAM : 1/2, 2/5, 2/3, 3/4, 5/6256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
5. Video(Composite Input) PAL, SECAM, NTSC 4 System : PAL, SECAM, NTSC, PAL606. Component Input Y/Cb/Cr, Y/Pb/Pr
7. HDMI Input HDMI1-DTV/DVIHDMI2-DTV/MHL Support HDCP
8. SPDIF out SPDIF out Except 32HD model9. USB Input For My Media(Movie/Photo/Music List) and SVC
10. Headphone
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5. Component Video Input (Y, Cb/Pb, Cr/Pr)No. Resolution H-freq(kHz) V-freq(Hz) Porposed
1 720480 15.73 60.00 SDTV, DVD 480i
2 720480 15.63 59.94 SDTV, DVD 480i
3 720480 31.47 59.94 480p
4 720480 31.50 60.00 480p
5 720576 15.625 50.00 SDTV, DVD 625 Line
6 720576 31.25 50.00 HDTV 576p
7 1280720 45.00 50.00 HDTV 720p
8 1280720 44.96 59.94 HDTV 720p
9 1280720 45.00 60.00 HDTV 720p
10 19201080 31.25 50.00 HDTV 1080i
11 19201080 33.75 60.00 HDTV 1080i
12 19201080 33.72 59.94 HDTV 1080i
13 19201080 56.250 50 HDTV 1080p
14 19201080 67.5 60 HDTV 1080p
6. HDMI Input : Refer to adjust specification about EDID data.6.1. DTV mode
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
1. 720*480 31.469 / 31.5 59.94 / 60 27.00/27.03 SDTV 480P
2. 720*576 31.25 50 54 SDTV 576P
3. 1280*720 37.500 50 74.25 HDTV 720P
4. 1280*720 44.96 / 45 59.94 / 60 74.17/74.25 HDTV 720P
5. 1920*1080 33.72 / 33.75 59.94 / 60 74.17/74.25 HDTV 1080I
6. 1920*1080 28.125 50.00 74.25 HDTV 1080I
7. 1920*1080 26.97 / 27 23.97 / 24 74.17/74.25 HDTV 1080P
8. 1920*1080 33.716/33.75 29.976/30.00 74.25 HDTV 1080P
9. 1920*1080 56.250 50 148.5 HDTV 1080P
10. 1920*1080 67.43 / 67.5 59.94 / 60 148.35/148.50 HDTV 1080P
6.2. PC modeNo. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1. 640*350 @70Hz 31.468 70.09 25.17 EGA
2. 720*400 @70Hz 31.469 70.08 28.321 DOS
3. 640*480 @60Hz 31.469 59.940 25.175 VESA(VGA)
4. 800*600 @60Hz 37.879 60.31 40.000 VESA(SVGA)
5. 1024*768 @60Hz 48.363 60.00 65.000 VESA(XGA)
6 1152*864 @60Hz 54.348 60.053 80.002 VESA
7. 1280*1024 @60Hz 63.981 60.020 108 VESA(SXGA) FHD only(Support to HDMI-PC)
8. 1360*768 @60Hz 47.712 60.015 85.5 VESA(WXGA)
9. 1920*1080 @60Hz 67.5 60.0 148.5 WUXGA(Reduced blanking) FHD only(Support to HDMI-PC)
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ADJUSTMENT INSTRUCTION1. Application Range
This specification sheet is applied to all of the LED TV with LB43B chassis.
2. Designation(1) The adjustment is according to the order which is
designated and which must be followed, according to the plan which can be changed only on agreeing.
(2) Power adjustment : Free Voltage.(3) Magnetic Field Condition: Nil.(4) Input signal Unit: Product Specification Standard.(5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 C 5 CRelative humidity : 65 10 %Input voltage : 100-220 V~, 50/60 Hz
(6) Adjustment equipments: Color Analyzer(CA-210 or CA-110), Service remote control.
(7) Push the IN STOP" key - For memory initialization.
3. Main PCB check process APC - After Manual-Insert, executing APC
* Boot file Download(1) Execute ISP program "Mstar ISP Utility" and then click
"Config" tab.(2) Set as below, and then click "Auto Detect" and check "OK"
message.If "Error" is displayed, check connection between computer, jig, and set.
(3) Click "Read" tab, and then load download file(XXXX.bin) by clicking "Read"
(4) Click "Connect" tab. If "Can't" is displayed, check connection between computer, jig and set.
(5) Click "Auto" tab and set as below.(6) Click "Run".(7) After downloading, check "OK" message.
* USB DOWNLOAD(*.epk file download)(1) Put the USB Stick to the USB socket.(2) Automatically detecting update file in USB Stick.
- If version of update file in USB Stick is lower, it will not work. But version of update file is higher, USB data will be detected automatically.
Case1 : Software version up1. After downloading S/W by USB , TV set will reboot
automatically.2. Push In-stop key.3. Push Power on key.4. Function inspection5. After function inspection, Push In-stop key.
Case2 : Function check at the assembly line1. When TV set is entering on the assembly line, Push
In-stop key at first.2. Push Power on key for turning it on.
If you push Power on key, TV set will recover channel information by itself.
3. After function inspection, Push In-stop key.
(1)
filexxx.bin
(4)
(5)
(6)
(7)...........OK
filexxx.bin
(2)
(3)
Please Check the Speed :To use speed betweenfrom 200KHz to 400KHz
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(3) Show the message "Copying files from memory".
(4) Updating is starting.
(5) Updating Completed, The TV will restart automatically.(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)* If updated version is higher than what TV has, the TV can
lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didnt have a DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.(1) Push "IN-START" key in service remote control.(2) Select "Tool Option 1" and push "OK" key.(3) Punch in the number. (Each model has their number)(4) Completed selecting Tool option.
* RS-232C Connection Method.Connection : PCBA (USB Port) USB to Serial Adapter (UC-232A) RS-232C cable PC(RS-232C port) Product name of USB to Serial Adapter is UC-232A.
4. ADC Process4.1. ADC
- Enter Service Mode by pushing "ADJ" key,- Enter Internal ADC mode by pushing "" key at "8. ADC
Calibration".
Using "P-ONLY" key of the Adjustment remote control, power on TV.
* ADC Calibration Protocol (RS232)
Adjust Sequence aa 00 00 [Enter Adjust Mode] xb 00 40 [Component1 Input (480i)] ad 00 10 [Adjust 480i Comp1] aa 00 90 End Adjust mode* Required equipment : Adjustment remote control.
4.2. Function Check4.2.1. Check display and sound
Check Input and Signal items.(1) TV(2) AV (CVBS)(3) COMPONENT (480i)(4) HDMI* Display and Sound check is executed by Remote control.
Not to push the "INSTOP" key after completion if the function inspection.
NO Item CMD 1 CMD 2 Data 0
EnterAdjust MODE
Adjust Mode In A A 0 0
When transfer the Mode In, Carry the command.
ADC adjust ADC Adjust A D 1 0 Automatically adjustment(The use of a internal pattern)
EZ ADJUST0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option Commercial
6. Country Group
7. Area Option
8. ADC Calibration
9. White Balance
10. 10 Point WB
11. Test Pattern
12. EDID D/L
13. Sub B/C
14. Ext. Input Adjust
ADC Calibration
ADC Comp 480i
ADC Comp 1080p
ADC Type
Start
NG
NG
OPT
Reset
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5. Total Assembly line process5.1. Adjustment Preparation
W/B Equipment conditionCA210: CH14, Test signal: Inner pattern(80IRE)-LED Module
Above 5 minutes H/run in the inner pattern. ("power on" key of Adjustment remote control)
* The spec of color temperature and coordinate.
* W/B Table in process of aging time- LGD Module
- AUO/COST/SHARP/BOE Module which cool spec is 13000 K
* Connecting picture of the measuring instrument(On Automatic control)Inside Pattern is used when W/B is controlled. Connect to auto controller or push Adjustment Remote control POWER ON Enter the mode of White-Balance, the pattern will come out.
* Auto-control interface and directions(1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10 lux).(2) Adhere closely the Color analyzer(CA210) to the module
less than 10 cm distance, keep it with the surface of the Module and Color analyzer's prove vertically.(80 ~ 100).
(3) Aging time- After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.
- Using no signal or full white pattern or the others, check the back light on.
Auto adjustment Map(RS-232C)RS-232C COMMAND[CMD ID DATA] Wb 00 00 White Balance Start Wb 00 ff White Balance End
Color Temperature : COOL, Medium, Warm. One of R Gain/G Gain/ B Gain should be kept on 0xC0, and adjust other two lower than C0.(When R/G/B Gain are all C0, it is the FULL Dynamic Range of Module)
Full White Pattern CA-210
COLORANALYZERTYPE : CA-210
RS-232C Communication
Mode Color Temp Color coordinate Remark
Cool (C50) 13,000 K X=0.271 (0.002)Y=0.270 (0.002)
- Inner pattern
for W/B adjust- External white
pattern(80IRE, 204gray)
Medium(0) 9,300 K X=0.286 (0.002)Y=0.289 (0.002)
Warm(W50) 6,500 K X=0.313 (0.002)Y=0.329 (0.002)
(normal line) March ~ DecemberAging time(Min) Cool Medium Warmcolor coordinate X y x y x y
Target 271 270 286 289 313 3291 0-2 282 289 297 308 324 3482 3-5 281 287 296 306 323 3463 6-9 279 284 294 303 321 3434 10-19 277 280 292 299 319 3395 20-35 275 277 290 296 317 3366 36-49 274 274 289 293 316 3337 50-79 273 272 288 291 315 3318 80-119 272 271 287 290 314 3309 Over 120 271 270 286 289 313 329
(normal line) January ~ FeburaryAging time Cool Medium Warm
color coordinate x y x y x yTarget 271 270 286 289 313 329
1 0-2 286 295 301 314 328 3542 3-5 284 290 299 309 326 3493 6-9 282 287 297 306 324 3464 10-19 279 283 294 302 321 3425 20-35 276 278 291 297 318 3376 36-49 274 275 289 294 316 3347 50-79 273 272 288 291 315 3318 80-119 272 271 287 290 314 3309 Over 120 271 270 286 289 313 329
Cool Medium Warmx y x y x y
spec 271 270 285 293 313 329target 276 277 290 300 318 336
RS-232C COMMAND[CMD ID DATA] MIN
CENTER(DEFAULT) MAX
Cool Mid Warm Cool Mid Warm
R Gain jg Ja jd 00 172 192 192 192
G Gain jh Jb je 00 172 192 192 192
B Gain ji Jc jf 00 192 192 172 192
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128
- 11 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All rights reserved.Only for training and service purposes
* Manual W/B process using adjust Remote control. Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000. Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting. After enter Service Mode by pushing ADJ key, Enter White Balance by pushing key at 9. White
Balance.
For manual adjustment, it is also possible by the following sequence.(1) Set TV in Adj. mode using P-ONLY key on remote
controller and then operate heat run longer than 15 minutes.(If not executed this step, the condition for W/B may be different.)
(2) Push Exit key.(3) Enter White Balance mode by pushing the ADJ key and
select 9. White Balance. When KEY () is pressed, 206 Gray internal pattern will be displayed.
(4) Zero Calibrate the probe of Color Analyzer, then place it on the center of LCD module within 10cm of the surface
(5) Select each items (Red/Green/Blue Gain) using /(CH +/-) key on Remote control.
(6) Adjust R/ G/ B Gain using /(VOL +/-) key on R/C.(7) Adjust three modes all (Cool / Medium / Warm)
- For All model w/o LS345Fix the one of R/G/B gain and change the others
- For G-FIX modelCool Mode1) Fix the one of R/G/B gain to 192 (default data) and
decrease the others. (If G gain is adjusted over 172 and R and B gain less than 192 , Adjust is O.K.)
2) If G gain is less than 172, Increase G gain by up to 172, and then increase R gain and G gain same amount of increasing G gain.
3) If R gain or B gain is over 255, readjust G gain less than 172, Conform to R gain is 255 or B gain is 255Medium / Warm Mode - Fix the one of R/G/B gain to 192 (default data) and decrease the others.
(8) When adjustment is completed, exit adjustment mode using EXIT key on Remote control.
* CASE Cool First adjust the coordinate far away from the target value(x, y).1) x, y > target
i) Decrease the R, G. 2) x, y < target
i) First decrease the B gain, ii) Decrease the one of the others.
3) x > target, y < targeti) First decrease B, so make y a little more than the
target.ii) Adjust x value by decreasing the R.
4) x < target, y > targeti) First decrease B, so make x a little more than the
target.ii) Adjust x value by decreasing the G.
* After You finish all adjustments, Press In-start button and compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable.If it is not same, then correct it same with BOM and unplug AC cable.For correct it to the models module from factory JIG model.
* Push the IN STOP" key after completing the function inspection.
5.2. DDC EDID Write (HDMI 256Byte) Connect HDMI Signal Cable to HDMI Jack. Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol. Check whether written EDID data is correct or not.* For SVC main Assembly, EDID have to be downloaded to
Insert Process in advance.
5.3. EDID DATA1) All Data : HEXA Value2) Changeable Data : *: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 ***: Year : Controlled ****: Check sum
- Auto Download After enter Service Mode by pushing ADJ key, Enter EDID D/L mode. Enter START by pushing OK key.
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option Commercial
6. Country Group
7. Area Option
8. ADC Calibration
9. White Balance
10. 10 Point WB
11. Test Pattern
12 EDID D/L
13. Sub B/C
14. Ext. Input Adjust
Whit Balance
Color Temp.
R-Gain
G-Gain
B-Gain
R-Cut
G-Cut
B-Cut
Test-Pattern
Backlight
Reset To Set
Cool
172
192
192
64
64
64
ON
100
EZ ADJUST0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option Commercial
6. Country Group
7. Area Option
8. ADC Calibration
9. White Balance
10. 10 Point WB
11. Test Pattern
12. EDID D/L
13. Sub B/C
14. Ext. Input Adjust
EDID D/L HDMI1 NG
HDMI2 NG
Start Reset
EDID D/L HDMI1 OK
HDMI2 OK
Start Reset
- 12 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All rights reserved.Only for training and service purposes
[Caution]* Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists- Digital EDID : Pin3 exists
* Edid data and Model option download (RS232)
(1) FHD 8BIT 2D HDMI EDID DATA
(2) HD 8BIT 2D HDMI EDID DATA
(3) Detail EDID Options are belowa. Product IDb. Serial No: Controlled on production line.
c. Month, Year: Controlled on production line:ex) Week : '01' -> '01'
Year : '2013' -> '18' fixd. Model Name(Hex):
cf) TV sets model name in EDID data is below.
e. Checksum: Changeable by total EDID data.
f. Vendor Specific- FHD 8bit Model
5.4. Outgoing condition Configuration When pressing IN-STOP key by Service remote control,
Red LED are blinked alternatively. And then automatically turn off. (Must not AC power OFF during blinking)
5.5. GND and HI-POT Test5.5.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion condition.
(2) You cant use Tuner Ground & Tuner signal line at all models (applied Isolator inner tuner)
5.5.2. GND & HI-POT auto-check(1) Pallet moves in the station.(POWER CORD / AV CORD is
tightly inserted)(2) Connect the AV JACK Tester.(3) Controller (GWS103-4) on.(4) GND Test (Auto)
- If Test is failed, Buzzer operates.- If Test is passed, execute next process(Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.- If Test is passed, GOOD Lamp on and move to next
process automatically.
5.5.3. Checkpoint(1) Test voltage
1) 3 Poles - GND: 1.5 KV/min at 100 mA- SIGNAL: 3 KV/min at 100 mA
2) 2 Poles- SIGNAL: 3 KV/min at 100 mA
(2) TEST time: 1 second(3) TEST POINT
1) 3 Poles- GND Test = POWER CORD GND and SIGNAL
CABLE GND.- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
2) 2 Poles- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5 mArms
NO Item CMD 1 CMD 2 Data 0
Enter downloadMode
Download Mode In A A 0 0
When transfer the Mode In, Carry the command.
EDID data andModel option download
ADC Adjust A E 00 10 Automatically adjustment(The use of a internal pattern)
No. Item Condition Hex Data
1 Manufacturer ID GSM 1E6D
2 Version Digital : 1 01
3 Revision Digital : 3 03
0 1 2 3 4 5 6 7 8 9 A B C D E F0 00 FF FF FF FF FF FF 00 1E 6D A B10 C 01 03 80 A0 5a 78 0A EE 91 A3 54 4C 99 2620 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 81 8030 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C40 45 00 A0 5A 00 00 00 1E 66 21 50 B0 51 00 1B 3050 40 70 36 00 A0 5A 00 00 00 1E 00 00 00 FD 00 3A60 3E 1E 53 10 00 0A 20 20 20 20 20 20 D70 D 01 E80 02 03 22 F1 4E 10 9F 04 13 05 14 03 02 12 20 2190 22 15 01 26 15 07 50 09 57 07 fA0 80 1E 01 1d 80 18 71 1c 16 20 58 2c 25 00 20 C2B0 31 00 0 9e 01 1d 00 72 51 d0 1e 20 6e 28 55 00C0 20 C2 31 00 00 1e 02 3a 80 18 71 38 2d 40 58 2cD0 45 00 A0 5a 00 00 00 1e 01 1d 00 Bc 52 d0 1e 20E0 B8 28 55 40 C4 8e 21 00 00 1e 00 00 00 00 00 00F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 E
0 1 2 3 4 5 6 7 8 9 A B C D E F0 0 ff ff ff ff ff ff 00 1E 6D a b10 c 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 2620 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 01 0130 01 01 01 01 01 01 66 21 50 B0 51 00 1B 30 40 7040 36 00 40 84 63 00 00 1E 64 19 00 40 40 00 26 3050 18 88 03 06 40 84 63 00 00 18 00 00 00 FD 00 3A60 3E 1E 53 10 00 0A 20 20 20 20 20 20 d70 d 01 e80 02 03 22 F1 4E 10 1F 04 93 05 14 03 02 12 20 2190 22 15 01 26 15 07 50 09 57 07 fA0 80 1E 01 1D 80 18 71 1C 16 20 58 2C 25 00 A0 5AB0 00 00 00 9E 01 1d 00 72 51 D0 1E 20 6E 28 55 00C0 20 C2 31 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3ED0 96 00 A0 5A 00 00 00 18 02 3A 80 18 71 38 2D 40E0 58 2C 45 00 A0 5A 00 00 00 1E 00 00 00 00 00 00F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 e
Model Name HEX EDID Table DDC Function
HD/FHD Model 0001 01 00 Analog/Digital
MODEL NAME MODEL NAME(HEX)
LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 (LG TV)
EDID C/S dataFHD-8BIT HD(Non DTS) HD(DTS)
HDMI HDMI HDMI
Check Sum(Hex)
Block 0 41 75 75
Block 125 (HDMI1) 5B (HDMI1) 52 (HDMI1)
15 (HDMI2) 4B (HDMI2) 42 (HDMI2)
Input Model name(HEX)HDMI1 67030C001000HDMI2 67030C002000
- 13 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All rights reserved.Only for training and service purposes
6. 3D function test(Pattern Generator MSHG-600, MSPG-6100[Support HDMI1.4])* HDMI mode No. 872 , pattern No.83(1) Please input 3D test pattern like below.
(2) When 3D OSD appear automatically, then select OK button.
(3) Don't wear a 3D Glasses, check the picture like below.
- 14 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All rights reserved.Only for training and service purposes
400
120
501
500
310
900
A2
A10
Set + Stand
121
200
530
540
521
410
LV1
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CI_TS_DATA[0]
PCM_D[6]
PCM_5V_CTL
/PCM_CE
SC1_FB
CI_TS_CLK
PCM_A[10]
PCM_A[9]
HP_LOUT
CI_TS_DATA[2]
CI_TS_SYNC
PCM_A[13]
SC1_IDPCM_D[1]
HP_DET
SCART1_MUTE
PCM_D[5]
/PCM_WE
/PCM_IRQA
PCM_D[3]
PCM_D[0]
/PCM_CD
CI_TS_DATA[5]
PCM_D[2]
PCM_A[14]
CI_TS_DATA[4]
SCART1_Lout
/PCM_REG
HP_ROUT
/PCM_IOWR CI_TS_DATA[1]
PCM_RST
PCM_A[12]
CI_TS_VAL
CI_TS_DATA[3]
/PCM_WAIT
SCART1_Rout
CI_TS_DATA[6]
PCM_D[4]
PCM_A[8]
DTV/MNT_VOUT
PCM_D[7]
/PCM_OE
SIDE_HP_MUTE
CI_TS_DATA[7]
/PCM_IORD PCM_A[11]
SC1_B+/COMP1_Pb+
SC1_G+/COMP1_Y+
SC1_R+/COMP1_Pr+
SC1/COMP1_L_IN
SC1/COMP1_DET
SC1/COMP1_R_IN
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
/CI_DET
2013.05.09
TP_NON_EN 3
NC5_L14
TP for Headphone
TP for S2
TP for CI slot
TP for NON-EU models(except EU and China)
TP for SCART
TP for FE_TS_DATA
Copyright 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
TH
E
R
M
A
L
THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. Power_PD2
2013.10.28
4
L14_M1A
Q403MMBT3904(NXP)
E
B
C
+12V
R42610K
+3.5V_ST
Q406AO3435
FET_2.5V_AOS
G
DS
PANEL_VCC
PWM_DIM
Q400MMBT3904(NXP)
E
B
C
R4201K
R4243.9K
PWM_DIM_PULL_DOWN
R40110K R442
10K
+24V
Q404MMBT3904(NXP)
E
B
C
R44110K
+3.5V_ST
R44533K
R4482.2K
C4130.1uF16V
OPT
C4160.33uF
16V
R44410K
+12V
INV_CTL
R4302.7K
1%
+3.5V_ST
R40010K
OPT
+3.5V_ST
R42510K
R435100K
Q402MMBT3904(NXP)
E
B
C
R42910K
C4150.1uF16V
C4170.1uF16V
L410BLM18PG121SN1D
C4240.1uF16V
OPT
+3.3V_Normal
Q406-*1DMP2130L
FET_2.5V_DIODE
G
DS
R43205%
OPT
R4311.2K
1%
L403MLB-201209-0120P-N2
POWER_ON/OFF_1
C4010.1uF
50V
+1.10V_VDDC
POWER_DET
RL_ON
+3.3V_Normal
+12V
+24V
+3.5V_ST
L402MLB-201209-0120P-N2
C4290.1uF16V
R423100
PWM2_2CH_POWER
PANEL_CTL
R44310K
R40610K
R419100
+3.5V_ST POWER_DET_RESET
+3.3V_Normal
C4020.1uF
16V
C4250.1uF25V
OPTC4220.1uF
R436100K
OPT
R4515.6KR4044.7K
R40210K
R4525.6K
R41233K
OPT
Q401
MMBT3906(NXP)
1
2
3
PWM1
L4073.6uH
R454100 5%
PD_+12V
C43022uF10V
C41410uF10V
C4282.2uF10V
C42022uF10V
C42122uF10V
C42710uF16V
ZD4005V
ZD4025V
L401CB2012PK501T
L400CB2012PK501T
L408UBW2012-121F
120OHM
+3.3V_Normal
C40610uF16V
R41810
R410100K
L4054.7uH
R4054.7K
OPT
R40910K
C40810uF10V
+3.3V_Normal
R416100K
OPT
AVDD5V_MHL
+5V_Normal
U
S
B
1
_
O
C
D
C41222uF16V
+5V_USB
10uFC405
R40710K
R4034.7K
OPT
5V_HDMI_4
USB1_CTL
+12V
/
M
H
L
_
O
C
P
_
D
E
T
C4090.047uF25V
L409BLM18PG121SN1D
+3.3V_Normal
L411CB2012PK501T
10uFC426
10V
+1.5V_DDR
10uFC431
10V
R4550
C41010uF10V
ZD4032.5V
ZD4012.5V
R4560
OPT
C4324.7uF
50V3216
+24V_CAP
C4001uF10V1005OPT
+24V
R4578.2K
1%
OPT
R45805%
OPT
R4384.7K
OPT
C40710uF10V2012
IC401APX803D29
1GND
3VCC 2 RESET
IC402APX803D29
OPT
1GND
3VCC 2 RESET
C434390pF50V
C4190.039uF
50V
C423
270pF50V
C4350.1uF16V
C4180.01uF
ZD4045V
+3.5V_POWER_DET
+3.5V_POWER_DET
+3.5V_POWER_DET
+3.3V_Normal
/VBUS_EN
MHL_OCP_EN
R4632.7K
MHL_SW_TRR46410K
MHL_SW_TR
Q408MHL_SW_TR
E
B
C
R46210K
MHL_SW_TR
Q407MHL_SW_TR E
B
C
Q409MHL_SW_TR
E
B
C
R46510K
MHL_SW_TR
R46620K
R46110K
MHL_SW_TR
R43920K1%
R44047K1%
R4332.7K1%
R44722K
C403100pF50V
OPT
R41515K5%
R4590
OPT
R4084.7K
R4491K1/16W1%
R4502001/16W1%
C41182pF50V
C4044700pF50V
D40130V
MBR230LSFT1G
L406CB2012PK501T
+3.5V_ST
C43610uF10V
OPTC437
0.1uF16V
Q405DMP2130L
G
DS
R42727K1%
OPT
R4285.1K
1%
OPT
IC404AZ1117EH-ADJTRG1
ADJ/GNDOUTIN
R437100 5%
OPT
R454-*1300
5%
PD_+3.5V
IC403TPS5432DDAR
3PH
2VIN
4GND
1BOOT
5VSENSE
6COMP
7EN
8SS
9
[EP]GND
TPS65282REGR
IC400
1EN
3SS
7
F
A
U
L
T
2
9
S
W
_
O
U
T
2
1
0
R
L
I
M
1
1
A
G
N
D
1
2
S
W
_
O
U
T
1
13SW_IN_1
14SW_IN_2
15FB
16LX_1
17LX_2
18BST
1
9
P
G
N
D
_
1
2
0
P
G
N
D
_
2
2
1
V
I
N
_
1
2
2
V
I
N
_
2
2
3
P
G
O
O
D
2
4
V
7
V
5EN_SW2
8
F
A
U
L
T
1
6EN_SW1
4ROSC
2COMP 25
[
E
P
]
G
N
D
C4334.7uF16V
+12V_CAP
3216
MHL_5V_EN
MHL_5V_EN
R42118K1%
R4223.3K1%
P401SMAW200-H18S5
14 12V
924V
4 PDIM#1
18 GND
1312V
8 PDMI#2
33.5V
17GND
12 GND
7GND
2 DRV ON
16 NC
11GND
6 3.5V
1PWR ON
1512V
10 24V
53.5V
19
.
R44612K
R4530
R4671K
OPT
PANEL_VCC
+1.10V_VDDC
R1
+3.3V_Normal
+1.5V_DDR
Vout=0.808*(1+R1/R2)
Power_DET
R2
FROM LIPS or POWER B/D
L14 POWER BLOCK (POWER DETECT 2)
R1
R2
+5V_Normal & +5V_USB with OCP
R2
R1
1.3A
4A
Vout=1.25*(1+R2/R1)+Iadj*R2
Vout=0.8*(1+R1/R2)
3A
(Active High)
(Active Low)
Ready - Dual Power Det
R432, R454-*1, R438
Now is
R457, R454
Detect Valtage
O R430, R431, R454
Use Circuit Designator
Power Detect +3.5V
Power Detect +12V
Power Detect +24V
Power Detect activity
* Notice - Applying all inch models for LCD L14 - Dual Power Det is used for detecting two kinds of voltage
Copyright 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
USB DOWN STREAM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
13/04/30
USB_S1 7
L14_M1A
JK700
3
A
U
0
4
S
-
3
0
5
-
Z
C
-
(
L
G
)
1
2
3
4
5
D700RCLAMP0502BA
OPT
SIDE_USB1_DM
SIDE_USB1_DP
C70022uF10V
ZD700
5VOPT
SD05
C7015pF50V
OPTC7025pF50V
OPT
C70322uF10VUSB_HDD_CAP
+5V_USB
USB (SIDE)
Copyright 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
2013/08/15
HDMI_R1_S1 8
L14_M1A
VA804ESD_HDMI1
R803
1K
D802MMBD6100
A
2
C
A
1
HDMI_ARC
VA805ESD_HDMI2
D1+_HDMI2
CEC_REMOTE_S7
+3.5V_ST
VA800
ESD_HDMI1_VARISTOR
VA808ESD_HDMI2
R80910K
D2-_HDMI2
VA802ESD_HDMI1
R807
2.7K
D801MMBD6100
A
2
C
A
1
CK-_HDMI4CK-_HDMI2
R804100
VA801ESD_HDMI1_VARISTOR
R816 100
HDMI-2R810 100
DDC_SCL_2
R812
1.8KHDMI-2DDC_SCL_2
JK800
E
A
G
5
9
0
2
3
3
0
2
14
13
5D1_GND
20
SHIELD
12
11
2D2_GND
19
18
10CK+
4D1+
1D2+
17
9D0-
8D0_GND
3D2-
16
7D0+
6D1-
15
D0+_HDMI2
R811 100
VA803ESD_HDMI1
DDC_SDA_2
5V_HDMI_2
R800
2.7K
HPD4
5V_HDMI_4
CK+_HDMI4
D800MMBD6100
A
2
C
A
1
VA809ESD_HDMI2
VA800-*11uF10VESD_HDMI1_CAP
+5V_Normal
R
8
0
5
3
.
3
K
DDC_SCL_4
VA801-*11uF10VESD_HDMI1_CAP
R814
33
HDMI-2
D1-_HDMI4
DDC_SDA_4
5V_DET_HDMI_4
5V_HDMI_4
D1-_HDMI2
HDMI_CEC
CK+_HDMI2
R806
2.7K
R817300K
HDMI-2
5V_DET_HDMI_2
DDC_SDA_4
+5V_Normal
DDC_SCL_4HPD2
HDMI_CEC
Q800MMBT3904(NXP)
E
B
C
R801
2.7K
D0-_HDMI2
VA811ESD_HDMI2
D0-_HDMI4
MHL_CD_SENSE
5V_HDMI_2
R8133.3KHDMI-2
VA810ESD_HDMI2
D2+_HDMI4
VA807
OPT5.6V
DDC_SDA_2
D1+_HDMI4
R815 100HDMI-2
C8000.047uF25V
HDMI-2
D2-_HDMI4
R802
1.8K
D2+_HDMI2
R808
10K
HDMI_CEC
D0+_HDMI4
VA806ESD_HDMI2JK801
E
A
G
6
2
6
1
1
2
0
4
HDMI-2
14 NC
13 CE_REMOTE
5D1_GND
20
GND
12 CK-
11 CK_GND
2D2_GND
19 HP_DET
18 5V
10CK+
4D1+
1D2+
17 GND
9D0-
8D0_GND
3D2-
16 DDC_DATA
7D0+
6D1-
15 DDC_CLK
D803-*2
RCLAMP0524PAESD_HDMI1_SEMTECH
1
82
7
3
645
910
D804-*2
RCLAMP0524PAESD_HDMI1_SEMTECH
1
82
7
3
645
910
D806-*2
RCLAMP0524PAESD_HDMI2_SEMTECH
1
82
7
3
645
910
D805-*2
RCLAMP0524PAESD_HDMI2_SEMTECH
1
82
7
3
645
910
JK801-*1DAADR019A
HDMI-2_EMI_FOOSUNG
14RESERVED
13CEC
5TMDS_DATA1_SHIELD
20
BODY_SHIELD
12TMDS_CLK-
11TMDS_CLK_SHIELD
2TMDS_DATA2_SHIELD
19HOT_PLUG_DETECT
18VDD[+5V]
10TMDS_CLK+
4TMDS_DATA1+
1TMDS_DATA2+
17DDC/CEC_GND
9TMDS_DATA0-
8TMDS_DATA0_SHIELD
3TMDS_DATA2-
16SDA
7TMDS_DATA0+
6TMDS_DATA1-
15SCL
D803
IP4294CZ10-TBRESD_HDMI1_IP4294
1
82
7
3
645
910
D803-*1
IP4283CZ10-TBAESD_HDMI1_IP4283
3GND_1
2TMDS_CH1+
4TMDS_CH2-
1TMDS_CH1-
5TMDS_CH2+
6NC_1
7NC_2
8GND_2
9NC_3
10NC_4
D804-*1
IP4283CZ10-TBAESD_HDMI1_IP4283
3GND_1
2TMDS_CH1+
4TMDS_CH2-
1TMDS_CH1-
5TMDS_CH2+
6NC_1
7NC_2
8GND_2
9NC_3
10NC_4
D805-*1
IP4283CZ10-TBAESD_HDMI2_IP4283
3GND_1
2TMDS_CH1+
4TMDS_CH2-
1TMDS_CH1-
5TMDS_CH2+
6NC_1
7NC_2
8GND_2
9NC_3
10NC_4
D806-*1
IP4283CZ10-TBAESD_HDMI2_IP4283
3GND_1
2TMDS_CH1+
4TMDS_CH2-
1TMDS_CH1-
5TMDS_CH2+
6NC_1
7NC_2
8GND_2
9NC_3
10NC_4
D804
IP4294CZ10-TBRESD_HDMI1_IP4294
1
82
7
3
645
910
D805
IP4294CZ10-TBRESD_HDMI2_IP4294
1
82
7
3
645
910
D806
IP4294CZ10-TBRESD_HDMI2_IP4294
1
82
7
3
645
910
HDMI (REAR 1 / SIDE 1 MHL)HDMI_2 MHLHDMI_1
CEC
MHL Spec
Copyright 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
Fiber Optic
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. SPDIF
2013/10/29
10
NC5_L14
+3.3V_Normal
SPDIF_OUT
JK1001JST1223-001
SPDIF_OPTIC
1
GND
2
VCC
3
VINPUT
4
F
I
X
_
P
O
L
E
C10011uF10V
OPTC100247pF50V
SPDIF_CAP_47pF
C1002-*118pF50V
SPDIF_CAP_18pF
SPDIF OPTIC JACK
5.15 Mstar Circuit Application
SPDIF
ESD Ready
Copyright 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. LVDS_NON_EU
2013/05/22
11
L14_S7LR(M1A)
RXB0-
RXA0+
C11010.1uF16V
MO_HD
C11000.1uF16V
MO_FHD
RXBCK-
RXA1-
RXB4-
+3.3V_Normal
RXB1+
RXBCK+
PANEL_VCC
RXB3+
RXA3-
RXB4+
RXA4-
RXA4+
RXA2+
RXB2-
RXA1+
RXA2-
RXB1-
R11093.3K
OPT
RXA3+
RXA0-
PANEL_VCC
RXACK-
RXB2+
R111010K
OPT
RXB3-
RXB0+
P1100FI-RE51S-HF-J-R1500
MO_FHD
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12RXA0-
13RXA0+
14RXA1-
15RXA1+
16RXA2-
17RXA2+
18.
19RXACK-
20RXACK+
21.
22RXA3-
23RXA3+
24RXA4-
25RXA4+
26.
27.
28RXB0-
29RXB0+
30RXB1-
31RXB1+
32RXB2-
33RXB2+
34.
35RXBCK-
36RXBCK-
37.
38RXB3-
39RXB3+
40RXB4-
41RXB4+
42.
43.
44.
45.
46.
47.
48.
49.
50.
51.
52
.
RXACK+
R1100 0
MO_FHD
R1101 0MO_FHD
R1102 0
MO_FHD
R110410K
OPT
R11033.3K
OPT
+3.3V_Normal
L1101
UBW2012-121F120OHM
MO_HD
L1100
UBW2012-121F120OHM
MO_FHD
RXA3+
RXA3-
RXACK+
RXACK-
RXA2-
RXA2+
RXA1-
RXA1+
RXA0-
RXA0+
VCOM_SCL
VCOM_SDA
VCOM_SCL
VCOM_SDA
R11152K
VCOM_I2C_PULL_UP
VCOM_SCL
VCOM_SDA
R11142K
VCOM_I2C_PULL_UP
R11050
VCOM_I2C
URSA/VCOM_SDA
URSA/VCOM_SCLR1106
0
VCOM_I2C
+3.3V_Normal
URSA/VCOM_SDA
URSA/VCOM_SCL
P110110031HR-30
MO_HD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
RXB1-
RXB0-
RXA4+
RXA1-
Pol-change
RXB4+
RXACK+
RXBCK-
RXA0+
RXA2+
LVDS (NON EU)
RXA2+
RXBCK-
RXB4-
RXA3+
RXA1+
RXB2+
RXB3-
RXA3-
RXBCK-
RXACK-
RXA2+
RXA1-
RXB1-
RXB3-
RXA3+
RXA2-
RXA0+
RXA4+
Shift
RXBCK+
RXB2-
RXA4+
[51Pin LVDS Connector] (For FHD 60Hz)
RXACK+
RXA3-
RXACK-
RXB3+
RXA3+
RXA1-
RXB0-
RXA0-
RXACK+
RXB3+
RXA4-
RXB3+
RXA4+
RXA2-
RXA2+
RXA1+
RXB2-
Pol-change
RXB4+
RXB1-
RXA4-
RXACK+
RXB3-
RXB0+
RXB3+
RXBCK+
RXB4-
RXA0+
RXA2+
RXB0+
RXB1+
RXA3-
RXA2-
RXBCK+
RXB4-
RXA0+
RXA4+
RXA2+
RXB3-
RXA0-
RXB0-
RXA4-
RXACK-
RXB0-
RXA4+
RXB2+
RXA1-
RXB2+
RXACK-
RXA3-
RXA1+
RXA3-
RXA1+
RXB3+
RXB3-
RXA3-
RXB1-
RXB4+
FOR FHD REVERSE(10bit)
RXB0+
RXB3-
RXA3+
RXA0+
RXA2- RXACK-
RXB1-
RXA3+
RXB2- RXBCK-
RXBCK+
RXA1+
RXA0-
RXA3+
RXA0-
RXB2+
RXB0-
RXA0-
RXB2-
RXACK-
MIRROR
RXB4-
RXA0-
RXB2+
RXA4+
RXB4-
RXA1+
RXB3+
RXB0+
RXB1+
RXA1-
RXA0-
RXA4-
RXB2-
Change in S7LR
RXA4-
RXB2+
MIRROR
RXB1-
RXA3+
RXA1-
RXACK+
RXB3+
RXB0+
RXB4-
RXACK+
RXB1+
RXACK-
RXA4-
RXA1-
RXA2-
RXA0+
RXB0-
RXB1+
RXB4+
RXB2+
RXBCK-
RXB0-
FOR FHD REVERSE(8bit)
RXBCK-
RXBCK+
RXB4+
RXB0+
RXB2-
RXA1+
RXBCK-
RXA2-
RXB1+
RXB1+
RXB1-
RXA4-
RXB4+
[30Pin LVDS Connector] (For HD 60Hz_Normal)
Change in S7LR
RXB1+
RXB3-
RXA2+
RXA3-
RXA2-
RXB2-
LVDS_SEL
RXBCK+
RXB4-
RXB0+
RXA0+
RXB4+
RXBCK+
RXACK+
EU pin assign is different from NON EU.Because of position of HD wafer.
LVDS_SEL
V-COM I2C
Copyright 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. 1_DDR
2013/05/20
12
NC5_S7LR(M1A)
A-MWEB
A-MA7
A-MDQL5
A-MBA2
A-MCASB
A-MA8
A-MA12
R
1
2
0
8
5
6
1
%
D
D
R
_
E
X
T
A-MODT
A-MA2
A-MDQU7
A-MDQL0
A-MDQL2
C
1
2
0
1
0
.
1
u
F
D
D
R
_
E
X
T
A-MA14
C
1
2
0
2
1
0
0
0
p
F
D
D
R
_
E
X
T
A-MDQSLB
A-MA4
R
1
2
0
1
1
K
1
%
D
D
R
_
E
X
T
A-MVREFDQ
A-MRESETB
A-MCKB
A-MDQL3
A-MDMU
A-MVREFCA
R
1
2
0
2
1
K
1
%
D
D
R
_
E
X
T
A-MDQL4
A-MBA1
R
1
2
0
5
1
K
1
%
D
D
R
_
E
X
T
A-MDQU2
R1203
2401%
DDR_EXT
A-MDQSU
R1206
10K
DDR_EXT
A-MBA0
A-MA5
A-MDQU1
A-MDQSL
A-MA9
R
1
2
0
7
5
6
1
%
D
D
R
_
E
X
T
C
1
2
1
4
1
0
0
0
p
F
D
D
R
_
E
X
T
A-MCKE
A-MVREFDQ
A-MDML
A-MA10
A-MDQU0
A-MA13
A-MDQU3
A-MA11
A-MDQU6
A-MDQSUB
C
1
2
1
3
0
.
1
u
F
D
D
R
_
E
X
T
A-MRASB
A-MVREFCA
A-MDQU4A-MDQU5
A-MDQL7
A-MA0
A-MDQL6
A-MA3
A-MDQL1
A-MA1
A-MA6
A-MCK
R
1
2
0
4
1
K
1
%
D
D
R
_
E
X
T
+1.5V_DDR
C
1
2
1
7
0
.
1
u
F
OPT
C1210 0.1uFDDR_EXT
C1206 0.1uFDDR_EXT
C1211 0.1uFDDR_EXT
C1207 0.1uFDDR_EXTC1208 0.1uFDDR_EXT
C1204 0.1uFDDR_EXT
C1212 0.1uFDDR_EXT
C1209 0.1uFDDR_EXT
C1205 0.1uFDDR_EXT
C1215
0.01uF50V
DDR_EXT
C
1
2
1
8
0
.
1
u
F
OPT
C
1
2
2
4
0
.
1
u
F
OPT
H5TQ2G63DFR-PBCIC1201-*2
DDR_1600_2G_HYNIX_OLD
EAN61829203
A0N3
A1P7
A2P3
A3N2
A4P8
A5P2
A6R8
A7R2
A8T8
A9R3
A10/APL7
A11R7
A12/BCN7
A13T3
NC_5M7
BA0M2
BA1N8
BA2M3
CKJ7
CKK7
CKEK9
CSL2
ODTK1
RASJ3
CASK3
WEL3
RESETT2
DQSLF3
DQSLG3
DQSUC7
DQSUB7
DMLE7
DMUD3
DQL0E3
DQL1F7
DQL2F2
DQL3F8
DQL4H3
DQL5H8
DQL6G2
DQL7H7
DQU0D7
DQU1C3
DQU2C8
DQU3C2
DQU4A7
DQU5A2
DQU6B8
DQU7A3
VREFCAM8
VREFDQH1
ZQL8
VDD_1B2
VDD_2D9
VDD_3G7
VDD_4K2
VDD_5K8
VDD_6N1
VDD_7N9
VDD_8R1
VDD_9R9
VDDQ_1A1
VDDQ_2A8
VDDQ_3C1
VDDQ_4C9
VDDQ_5D2
VDDQ_6E9
VDDQ_7F1
VDDQ_8H2
VDDQ_9H9
NC_1J1
NC_2J9
NC_3L1
NC_4L9
NC_6T7
VSS_1A9
VSS_2B3
VSS_3E1
VSS_4G8
VSS_5J2
VSS_6J8
VSS_7M1
VSS_8M9
VSS_9P1
VSS_10P9
VSS_11T1
VSS_12T9
VSSQ_1B1
VSSQ_2B9
VSSQ_3D1
VSSQ_4D8
VSSQ_5E2
VSSQ_6E8
VSSQ_7F9
VSSQ_8G1
VSSQ_9G9
C
1
2
1
6
1
0
u
F
1
0
V
OPT
C1203 10uF10VDDR_EXT
C
1
2
1
9
1
u
F
OPT
C
1
2
2
0
1
u
F
OPT
C
1
2
2
1
1
u
F
OPT
C
1
2
2
2
1
u
F
OPT
C
1
2
2
3
1
u
F
OPT
+1.5V_DDR
+1.5V_DDR
+1.5V_DDR
+1.5V_DDR+1.5V_DDR
A-MA13A-MA14
A-MA7
A-MA10
A-MA1
A-MA8
A-MA3
A-MA0
A-MA4
A-MA6
A-MA11
A-MA9
A-MA5
A-MA2
A-MA12
A-MBA0A-MBA1A-MBA2
A-MCKE
A-MCK
A-MCKB
A-MCASB
A-MWEB
A-MRASB
A-MODT
A-MRESETB
A-MDMU
A-MDML
A
-
M
D
Q
S
U
A
-
M
D
Q
S
U
B
A
-
M
D
Q
S
L
A
-
M
D
Q
S
L
B
A-MDQL4
A-MDQL0
A-MDQL3
A-MDQL7
A-MDQL5
A-MDQL2
A-MDQL6
A-MDQL1
A-MDQU1
A-MDQU3
A-MDQU0
A-MDQU4A-MDQU5
A-MDQU2
A-MDQU6A-MDQU7
R1209
2401%
A/B_DDR3_CS
A/B_DDR3_CS
H5TQ1G63EFR-PBC IC1201
DDR_1600_1G_HYNIX
EAN61829003A0
N3
A1P7
A2P3
A3N2
A4P8
A5P2
A6R8
A7R2
A8T8
A9R3
A10/APL7
A11R7
A12/BCN7
NC_7T3
NC_5M7
BA0M2
BA1N8
BA2M3
CKJ7
CKK7
CKEK9
CSL2
ODTK1
RASJ3
CASK3
WEL3
RESETT2
DQSLF3
DQSLG3
DQSUC7
DQSUB7
DMLE7
DMUD3
DQL0E3
DQL1F7
DQL2F2
DQL3F8
DQL4H3
DQL5H8
DQL6G2
DQL7H7
DQU0D7
DQU1C3
DQU2C8
DQU3C2
DQU4A7
DQU5A2
DQU6B8
DQU7A3
VREFCAM8
VREFDQH1
ZQL8
VDD_1B2
VDD_2D9
VDD_3G7
VDD_4K2
VDD_5K8
VDD_6N1
VDD_7N9
VDD_8R1
VDD_9R9
VDDQ_1A1
VDDQ_2A8
VDDQ_3C1
VDDQ_4C9
VDDQ_5D2
VDDQ_6E9
VDDQ_7F1
VDDQ_8H2
VDDQ_9H9
NC_1J1
NC_2J9
NC_3L1
NC_4L9
NC_6T7
VSS_1A9
VSS_2B3
VSS_3E1
VSS_4G8
VSS_5J2
VSS_6J8
VSS_7M1
VSS_8M9
VSS_9P1
VSS_10P9
VSS_11T1
VSS_12T9
VSSQ_1B1
VSSQ_2B9
VSSQ_3D1
VSSQ_4D8
VSSQ_5E2
VSSQ_6E8
VSSQ_7F9
VSSQ_8G1
VSSQ_9G9
IC101LGE2132(M1A_256M)
M1A_256M
B_DDR3_A[0]E11
B_DDR3_A[1]F12
B_DDR3_A[2]D10
B_DDR3_A[3]B10
B_DDR3_A[4]E15
B_DDR3_A[5]B11
B_DDR3_A[6]F14
B_DDR3_A[7]C11
B_DDR3_A[8]D14
B_DDR3_A[9]A12
B_DDR3_A[10]F16
B_DDR3_A[11]D13
B_DDR3_A[12]D15
B_DDR3_A[13]C12
B_DDR3_A[14]E13
B_DDR3_BA[0]A9
B_DDR3_BA[1]D16
B_DDR3_BA[2]A10
B_DDR3_MCLKC13
B_DDR3_MCLKZB13
B_DDR3_MCLKEE17
B_DDR3_ODTB8
B_DDR3_RASZC8
B_DDR3_CASZB9
B_DDR3_WEZD11
B_RESETF10
B_DDR3_CS0D12
B_DDR3_DQSLA19
B_DDR3_DQSUB18
B_DDR3_DQMLC16
B_DDR3_DQMUD21
B_DDR3_DQSBLC18
B_DDR3_DQSBUC17
B_DDR3_DQL[0]A20
B_DDR3_DQL[1]A16
B_DDR3_DQL[2]C19
B_DDR3_DQL[3]C15
B_DDR3_DQL[4]C20
B_DDR3_DQL[5]C14
B_DDR3_DQL[6]B21
B_DDR3_DQL[7]B15
B_DDR3_DQU[0]F18
B_DDR3_DQU[1]D19
B_DDR3_DQU[2]D17
B_DDR3_DQU[3]E21
B_DDR3_DQU[4]E19
B_DDR3_DQU[5]D20
B_DDR3_DQU[6]D18
B_DDR3_DQU[7]F20
ZQE9
IC101-*1LGE2131(M1A_128M)
M1A_128M
B_DDR3_A[0]E11
B_DDR3_A[1]F12
B_DDR3_A[2]D10
B_DDR3_A[3]B10
B_DDR3_A[4]E15
B_DDR3_A[5]B11
B_DDR3_A[6]F14
B_DDR3_A[7]C11
B_DDR3_A[8]D14
B_DDR3_A[9]A12
B_DDR3_A[10]F16
B_DDR3_A[11]D13
B_DDR3_A[12]D15
B_DDR3_A[13]C12
B_DDR3_A[14]E13
B_DDR3_BA[0]A9
B_DDR3_BA[1]D16
B_DDR3_BA[2]A10
B_DDR3_MCLKC13
B_DDR3_MCLKZB13
B_DDR3_MCLKEE17
B_DDR3_ODTB8
B_DDR3_RASZC8
B_DDR3_CASZB9
B_DDR3_WEZD11
B_RESETF10
B_DDR3_CS0D12
B_DDR3_DQSLA19
B_DDR3_DQSUB18
B_DDR3_DQMLC16
B_DDR3_DQMUD21
B_DDR3_DQSBLC18
B_DDR3_DQSBUC17
B_DDR3_DQL[0]A20
B_DDR3_DQL[1]A16
B_DDR3_DQL[2]C19
B_DDR3_DQL[3]C15
B_DDR3_DQL[4]C20
B_DDR3_DQL[5]C14
B_DDR3_DQL[6]B21
B_DDR3_DQL[7]B15
B_DDR3_DQU[0]F18
B_DDR3_DQU[1]D19
B_DDR3_DQU[2]D17
B_DDR3_DQU[3]E21
B_DDR3_DQU[4]E19
B_DDR3_DQU[5]D20
B_DDR3_DQU[6]D18
B_DDR3_DQU[7]F20
ZQE9
H5TQ2G63FFR-PBC IC1201-*3
DDR_1600_2G_HYNIX_NEW
EAN61829204
A0N3
A1P7
A2P3
A3N2
A4P8
A5P2
A6R8
A7R2
A8T8
A9R3
A10/APL7
A11R7
A12/BCN7
A13T3
NC_5M7
BA0M2
BA1N8
BA2M3
CKJ7
CKK7
CKEK9
CSL2
ODTK1
RASJ3
CASK3
WEL3
RESETT2
DQSLF3
DQSLG3
DQSUC7
DQSUB7
DMLE7
DMUD3
DQL0E3
DQL1F7
DQL2F2
DQL3F8
DQL4H3
DQL5H8
DQL6G2
DQL7H7
DQU0D7
DQU1C3
DQU2C8
DQU3C2
DQU4A7
DQU5A2
DQU6B8
DQU7A3
VREFCAM8
VREFDQH1
ZQL8
VDD_1B2
VDD_2D9
VDD_3G7
VDD_4K2
VDD_5K8
VDD_6N1
VDD_7N9
VDD_8R1
VDD_9R9
VDDQ_1A1
VDDQ_2A8
VDDQ_3C1
VDDQ_4C9
VDDQ_5D2
VDDQ_6E9
VDDQ_7F1
VDDQ_8H2
VDDQ_9H9
NC_1J1
NC_2J9
NC_3L1
NC_4L9
NC_6T7
VSS_1A9
VSS_2B3
VSS_3E1
VSS_4G8
VSS_5J2
VSS_6J8
VSS_7M1
VSS_8M9
VSS_9P1
VSS_10P9
VSS_11T1
VSS_12T9
VSSQ_1B1
VSSQ_2B9
VSSQ_3D1
VSSQ_4D8
VSSQ_5E2
VSSQ_6E8
VSSQ_7F9
VSSQ_8G1
VSSQ_9G9
K4B1G1646G-BCK0IC1201-*1
DDR_1600_1G_SS
EAN61836301
A0N3
A1P7
A2P3
A3N2
A4P8
A5P2
A6R8
A7R2
A8T8
A9R3
A10/APL7
A11R7
A12/BCN7
A13T3
NC_5M7
BA0M2
BA1N8
BA2M3
CKJ7
CKK7
CKEK9
CSL2
ODTK1
RASJ3
CASK3
WEL3
RESETT2
DQSLF3
DQSLG3
DQSUC7
DQSUB7
DMLE7
DMUD3
DQL0E3
DQL1F7
DQL2F2
DQL3F8
DQL4H3
DQL5H8
DQL6G2
DQL7H7
DQU0D7
DQU1C3
DQU2C8
DQU3C2
DQU4A7
DQU5A2
DQU6B8
DQU7A3
VREFCAM8
VREFDQH1
ZQL8
VDD_1B2
VDD_2D9
VDD_3G7
VDD_4K2
VDD_5K8
VDD_6N1
VDD_7N9
VDD_8R1
VDD_9R9
VDDQ_1A1
VDDQ_2A8
VDDQ_3C1
VDDQ_4C9
VDDQ_5D2
VDDQ_6E9
VDDQ_7F1
VDDQ_8H2
VDDQ_9H9
NC_1J1
NC_2J9
NC_3L1
NC_4L9
NC_6T7
VSS_1A9
VSS_2B3
VSS_3E1
VSS_4G8
VSS_5J2
VSS_6J8
VSS_7M1
VSS_8M9
VSS_9P1
VSS_10P9
VSS_11T1
VSS_12T9
VSSQ_1B1
VSSQ_2B9
VSSQ_3D1
VSSQ_4D8
VSSQ_5E2
VSSQ_6E8
VSSQ_7F9
VSSQ_8G1
VSSQ_9G9
K4B2G1646Q-BCK0 IC1201-*4
DDR_1600_2G_SS
EAN61848803
A0N3
A1P7
A2P3
A3N2
A4P8
A5P2
A6R8
A7R2
A8T8
A9R3
A10/APL7
A11R7
A12/BCN7
A13T3
NC_5M7
BA0M2
BA1N8
BA2M3
CKJ7
CKK7
CKEK9
CSL2
ODTK1
RASJ3
CASK3
WEL3
RESETT2
DQSLF3
DQSLG3
DQSUC7
DQSUB7
DMLE7
DMUD3
DQL0E3
DQL1F7
DQL2F2
DQL3F8
DQL4H3
DQL5H8
DQL6G2
DQL7H7
DQU0D7
DQU1C3
DQU2C8
DQU3C2
DQU4A7
DQU5A2
DQU6B8
DQU7A3
VREFCAM8
VREFDQH1
ZQL8
VDD_1B2
VDD_2D9
VDD_3G7
VDD_4K2
VDD_5K8
VDD_6N1
VDD_7N9
VDD_8R1
VDD_9R9
VDDQ_1A1
VDDQ_2A8
VDDQ_3C1
VDDQ_4C9
VDDQ_5D2
VDDQ_6E9
VDDQ_7F1
VDDQ_8H2
VDDQ_9H9
NC_1J1
NC_2J9
NC_3L1
NC_4L9
NC_6T7
VSS_1A9
VSS_2B3
VSS_3E1
VSS_4G8
VSS_5J2
VSS_6J8
VSS_7M1
VSS_8M9
VSS_9P1
VSS_10P9
VSS_11T1
VSS_12T9
VSSQ_1B1
VSSQ_2B9
VSSQ_3D1
VSSQ_4D8
VSSQ_5E2
VSSQ_6E8
VSSQ_7F9
VSSQ_8G1
VSSQ_9G9
CLose to Saturn7M ICCLose to DDR3
Option : Ripple Check !!!
Copyright 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. S_FLASH
2013/04/29
13
NC5_S7LR(M1A)
SPI_SCK
+3.5V_ST+3.5V_ST
C13000.1uF
R13014.7K
OPT
/SPI_CS
SPI_SDO
IC1300MX25L8006EM2I-12G
SPI_FLASH_MACRONIX
3WP#
2SO/SIO1
4GND
1CS#
5SI/SIO0
6SCLK
7HOLD#
8VCC
R130233
R130010K
OPT
SPI_SDI
/FLASH_WP
IC1300-*1W25Q80BVSSIG
SPI_FLASH_WINBOND
3%WP[IO2]
2DO[IO1]
4GND
1CS
5DI[IO0]
6CLK
7HOLD[IO3]
8VCC
+3.5V_ST
Serial Flash for SPI boot
Copyright 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+3.3V_TU
C161320pF50V
OPT
C160222uF6.3V
C16160.1uF16V
C160522uF6.3V
IF_N_MSTAR
IF_AGC_SEL
TU_SIF
FE_TS_VAL_ERR
+3.3V_TU
C161018pF50V
C16010.1uF 16V
OPT
C1615100pF50V
R1607 33
C16030.1uF16V
TU_SDA
R16111.8KTU_IIC_ATSC_1.8K
R161282
OPT
FE_TS_DATA[0]
R1610-*11KTU_IIC_NON_ATSC_1K
IF_P_MSTAR
L1600UBW2012-121F
R1609 100
C160918pF50V
IF_AGC_MAIN
R1606 0
IF_NON_FILTER_KR
C16110.1uF16V
TU_CVBS
R1606-*110
IF_FILTER_AJ
R1605-*110
IF_FILTER_AJ
TUNER_RESET
+3.3V_TU
R1605 0
IF_NON_FILTER_KR
C161420pF50V
OPT
TU_SCL
T
U
_
G
N
D
_
A
R1608 33
RF_SWITCH_CTL
C16070.1uF16V
FE_TS_SYNC
R16130
OPT
R1611-*11KTU_IIC_NON_ATSC_1K
+3.3V_Normal
FE_TS_CLK
R16101.8K
TU_IIC_ATSC_1.8K
TDJH-G101DTU1601-*1
TU_AJ_T/C
47
SHIELD
6IF[P]
7IF[N]
8NC_2
9NC_3
1B1[+3.3V]
2NC_1
3IF_AGC
4SCL
5SDA
A1A1
B1B1
TDJH-H101F TU1601TU_ATSC
47
SHIELD
6IF[P]
7IF[N]
8NC_2
9NC_3
1B1[+3.3V]
2NC_1
3IF_AGC
4SCL
5SDA
A1A1
B1B1
Size change,0929
16
should be guarded by ground
Close to the tuner
FE_AGC_SPEED_CTL
close to the tuner pin, add,09029
CHANGE TO6.3V 2012 X5R
1. should be guarded by ground2. No via on both of them3. Signal Width >= 12mils Signal to Signal Width = 12mils Ground Width >= 24mils
L14_M1A
CHANGE TO6.3V 2012 X5R
GLOBAL tuner block KR & AJ
GND seperation for ASIS tuner
close to TUNER
TUNER_KR_AJ
2013/06/05
Copyright 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
COMP2_Pr+
AV2_CVBS_DET
R171410K
R172112K
R171510K
R171912KAV2
R17131K
R1704470K
R1700470KAV2
VA17025.6VOPT
R17121K
COMP2_Pb+
+3.3V_Normal
COMP2_DET
R1701470KAV2
R170575
R170910K
COMP2_R_IN
R1703470K
VA17035.6VOPT
AV2_R_IN
VA17055.6VOPT
VA17045.6VAV2_LR_ZENER
C17011000pF50VOPT
R171610K
AV2
R171010K
C17041000pF50VOPT
R170675
COMP2_L_IN
R1711 1KAV2
+3.3V_Normal
+3.3V_Normal
VA17005.6VCOMP_LR_ZENER
VA17065.6VAV2_LR_ZENER
R171812KAV2
R170810KAV2
SC1/AV2_CVBS_IN
C170347pF50VAV2
COMP2_Y+/AV_CVBS_IN
C17021000pF50VOPT
R172012K
AV2_L_IN
R171710K
AV2
VA17015.6VCOMP_LR_ZENER
AV_CVBS_DET
C17051000pF50VOPT
ZD1704COMP_Y_ZENER_ROHM
ZD1700COMP_Pr_ZENER_ROHM
ZD1705COMP_Y_ZENER_ROHM
ZD1707AV2_CVBS_ZENER_ROHM
ZD1706AV2_CVBS_ZENER_ROHM
ZD1703COMP_Pb_ZENER_ROHM
ZD1702COMP_Pb_ZENER_ROHM
ZD1701COMP_Pr_ZENER_ROHM
ZD1707-*1AV2_CVBS_ZENER_KEC
ZD1706-*1AV2_CVBS_ZENER_KEC
ZD1703-*1COMP_Pb_ZENER_KEC
ZD1702-*1COMP_Pb_ZENER_KEC
ZD1701-*1COMP_Pr_ZENER_KEC
ZD1700-*1COMP_Pr_ZENER_KEC
ZD1705-*1COMP_Y_ZENER_KEC
ZD1704-*1COMP_Y_ZENER_KEC
R170775
1%1608
R170275
1%
AV2
1608
DTV/MNT_VOUT
R172375
C
V
B
S
_
O
U
T
_
T
E
S
T
R17240
CVBS_OUT_TEST
JK1702PPJ245N2-01
COMP_AV1_YG
5A [GN/YL]O-SPRING
6A [GN/YL]E-LUG
4A [GN/YL]CONTACT
5B [BL]O-SPRING
7C [RD1]E-LUG-S
5C [RD1]O-SPRING
4C [RD1]CONTACT
5D [WH]O-SPRING
4E [RD2]CONTACT
5E [RD2]O-SPRING
6E [RD2]E-LUG
JK1702-*1PPJ245-01 COMP_AV1_G
6A [GN]C-SPRING
7A [GN]E-LUG
4A [GN]CONTACT
5B [BL]C-SPRING
8C [RD1]E-LUG-S
6C [RD1]C-SPRING
4C [RD1]CONTACT
5D [WH]C-SPRING
4E [RD2]CONTACT
6E [RD2]C-SPRING
7E [RD2]E-LUG
JK1701-*1PPJ248-01 COMP_AV1/2_G
6D [GN]C-SPRING
7D [GN]E-LUG
4D [GN]CONTACT
5E [BL]C-SPRING
8F [RD1]E-LUG-S
6F [RD1]C-SPRING
4F [RD1]CONTACT
5G [WH1]C-SPRING
4H [RD2]CONTACT
6H [RD2]C-SPRING
7H [RD2]E-LUG
7A [YL]E-LUG
6A [YL]C-SPRING
4A [YL]CONTACT
5B [WH2]C-SPRING
4C [RD3]CONTACT
6C [RD3]C-SPRING
7C [RD3]E-LUG
JK1701PPJ248-21
COMP_AV1/2_YG
5D [YL/GN]O-SPRING
6D [YL/GN]E-LUG
4D [YL/GN]CONTACT
5E [BL]O-SPRING
7F [RD1]E-LUG-S
5F [RD1]O-SPRING
4F [RD1]CONTACT
5G [WH1]O-SPRING
4H [RD2]CONTACT
5H [RD2]O-SPRING
6H [RD2]E-LUG
6A [YL]E-LUG
5A [YL]O-SPRING
4A [YL]CONTACT
5B [WH2]O-SPRING
4C [RD3]CONTACT
5C [RD3]O-SPRING
6C [RD3]E-LUG
2013.08.15L14_S7LR(M1A)
REAR_JACK_NON_EU
COMPONENT&AV1
17
AV2
COMPONENT & AV1(COMMON), AV2
Size Check !!!
Size Check !!!
* One Ton Color Jack - Yellow/Green
Copyright 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
2013.04.29
HEAD_PHONE_EU 30
NC5_M1A
R30013.3K
OPT
C300010uF16V
HEAD_PHONE
C300110uF16V
HEAD_PHONE
JK3000KJA-PH-0-0177
HEAD_PHONE
3DETECT
4L
5GND
1R
+3.3V_Normal
R300510K
HEAD_PHONE
C30031000pF50V
OPT
HP_LOUT
R30041K
HEAD_PHONE
HP_DET
+3.5V_ST
HP_ROUT
SIDE_HP_MUTE
R30021K
HEAD_PHONEC30021000pF50V
OPT
R30031K
HEAD_PHONE
Q3002MMBT3904(NXP)OPT
E
B
C
Q3003MMBT3904(NXP)OPT
E
B
C
Q3005MMBT3904(NXP)OPT
E
B
C
Q3004MMBT3904(NXP)OPT
E
B
C
Q3001MMBT3906(NXP)
OPTE
B
C
Q3000MMBT3904(NXP)
OPT E
B
CR30001K
OPT
C30044.7uF
10V
HEAD_PHONE
L3001HEAD_PHONE
5.6uH
L3000HEAD_PHONE
5.6uH
C30054.7uF
10V
HEAD_PHONE
Headphone *Option : HEAD_PHONE_EU
Close to the Main IC
Close to the Main IC
Copyright 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. RS232C_MSTAR_DEBUG_4P
2013/04/30
40
L14_S7LR(M1A)
PM_RXD
+3.5V_ST
R4001100
R4000100
P400012507WS-04L
RS232C_DEBUG_4P
1VCC
2PM_RXD
3GND
4RM_TXD
5
GND
PM_TXD
J
P
_
G
N
D
3
RGB_DDC_SCL
J
P
_
G
N
D
4
RGB_DDC_SDA
J
P
_
G
N
D
1
J
P
_
G
N
D
2
P400112505WS-04A00
MSTAR_DEBUG_4P
1
2
3
4
5
RS-232C 4PIN & MSTAR DEBUG 4PIN
RS-232C 4PIN
MSTAR DEBUG 4PIN
Copyright 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. IR_EYE_SENSOR
2013/09/03
46
L14_M1A
R460310K1%
R4602100
C460618pF50V
Digital Eye
C46000.1uF
16V
R4608 100
Digital Eye
R46003.3K
R46071K
Digital Eye
C46030.1uF16V
OPT
KEY1
+3.5V_ST
R4601100
C46011000pF50V
KEY2
VA4600LED_R_Zener
R460410K1%
C4604100pF50V
R46051K
Digital Eye
SENSOR_SDA
+3.3V_Normal
P460112507WR-08L
OPT
1
2
3
4
5
6
7
8
9
C46020.1uF16V
OPT
L4600BLM18PG121SN1D
C460518pF50V
Digital Eye
+3.5V_ST
IR
R4609 100
Digital Eye
+3.5V_STR46061.8K
SENSOR_SCL
P460012507WR-10L
1
2
3
4
5
6
7
8
9
10
11
LED_R/BUZZ
VA4601IR_Zener
IR/LED + Digital Eye + Control
Copyright 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
2013/09/16
MAIN1_NON_EU 51
M1A_L14
PCM_D[3]
PCM_A[1]
PCM_A[10]
PCM_A[5]
PCM_A[7]
FE_TS_DATA[3]
PCM_A[0]
PCM_D[6]
CI_TS_DATA[0]
CI_TS_DATA[2]
PCM_A[7]
PCM_A[5]
PCM_A[0]
PCM_A[2]
FE_TS_DATA[0]
PCM_A[11]
PCM_D[4]
PCM_A[14]
CI_TS_DATA[4]
PCM_A[6]
PCM_D[7]
PCM_A[4]
FE_TS_DATA[2]
CI_TS_DATA[7]
PCM_A[4]
PCM_A[13]PCM_A[12]
FE_TS_DATA[0]
CI_TS_DATA[1]
PCM_A[3]
PCM_D[1]
FE_TS_DATA[5]
PCM_A[3]
PCM_A[1]
PCM_A[2]
CI_TS_DATA[6]
PCM_D[0]
FE_TS_DATA[1]
PCM_D[2]
PCM_A[9]
CI_TS_DATA[3]
FE_TS_DATA[7]
FE_TS_DATA[4]
PCM_D[5]
PCM_A[8]
PCM_A[6]
FE_TS_DATA[6]
CI_TS_DATA[5]
R1390
HALF_NIM/EU_NON_T2
PCM_A[0-7]
5V_DET_HDMI_2
/PCM_IOWR
I2C_SCL
MODEL_OPT_2
SPI_SDI
R129 22
DEMOD_RESET
RGB_DDC_SCL
COMP2_DET
PANEL_CTL
RXB2+
PCM_D[0-7]
SCART1_MUTE
MODEL_OPT_0
RL_ON
C1231000pFOPT
/PF_CE0AUD_MASTER_CLK_0
RXB3+
RXA4-
R12010KPDP
/SPI_CS
/PF_OE
KEY2
MODEL_OPT_4
/F_RB
PF_ALE
R108 22
SPDIF_OUT
R141 47
AV_CVBS_DET
EPHY_TP
C114-*4 30pFXTAL_LOAD_30pF
PCM_A[0-14]
R13710K
HALF_NIM/EU_NON_T2
FE_TS_DATA[0]
RXA1+
L101BLM18PG121SN1D
HALF_NIM/EU_NON_T2
C1050.1uF
/MHL_OCP_DET
IC104-*1R1EX24256BSAS0A
NVRAM_RENESAS
EAN62389501
3A2
2A1
4VSS
1A0
5SDA
6SCL
7WP
8VCC
+3.5V_ST
/CI_CD1
/PCM_IORD
PF_ALE
RXB4-
/PCM_OE
R12533
FE_TS_VAL_ERR
PWM0
R135 33
/PCM_WAIT
HP_DET
C12233pFIF_FILTER_AJ/CSA
I2C_SDA
R
1
3
6
1
M
+3.3V_Normal
IF_AGC_MAIN
AMP_SDA
C12433pFIF_FILTER_AJ/CSA
CI_TS_VAL
/PCM_IRQA
C121
100pFOPT
+3.3V_Normal
+3.3V_Normal
R1103.9K
LED_R/BUZZ
SOC_RESET
R132 100SPDIF_OPTIC
RXB0+
RXB4+
I2C_SDA
CI_TS_DATA[0-7]
POWER_DET
TU_SIF
RF_SWITCH_CTL
IC102H27U1G8F2CTR-BC
EAN35669103NAND_FLASH_1G_HYNIX
26NC_17
27NC_18
28NC_19
29I/O0
30I/O1
31I/O2
32I/O3
33NC_20
34NC_21
35NC_22
36VSS_2
37VCC_2
38NC_23
39NC_24
40NC_25
41I/O4
42I/O5
43I/O6
44I/O7
45NC_26
46NC_27
47NC_28
48NC_29
17ALE
3NC_3
6NC_6
16CLE
15NC_10
14NC_9
13VSS_1
12VCC_1
11NC_8
10NC_7
9CE
8RE
7R/B
4NC_4
5NC_5
25NC_16
24NC_15
23NC_14
2NC_2
22NC_13
21NC_12
1NC_1
20NC_11
19WP
18WE
FRC_RESET
URSA/VCOM_SCL
EPHY_RP
SENSOR_SCL
RXB2-
R103 100
FE_TS_CLK
RXB3-
PCM_RST
R1132.2K
R134 33
C1200.047uF25VHALF_NIM/EU_NON_T2
C1048pFOPT
RXACK+
SPI_SDO
R
1
1
7
4
.
7
K
O
P
T
C112100pF50V
OPT
DEMOD_SDA
PM_RXD
PWM2
SPDIF_OUT
LED_R/BUZZ
PM_MODEL_OPT_0
PCM_5V_CTL
/F_RB
SENSOR_SDA
/PCM_REG
IC104M24256-BRMN6TP
EAN61548301
NVRAM_ST
3E2
2E1
4VSS
1E0
5SDA
6SCL
7WC
8VCC
EPHY_TN
USB1_OCD
IF_N_MSTAR
R128 22
EPHY_TP
PM_MODEL_OPT_0
TU_SDA
PWM2
/PCM_CE
RXA4+
URSA/VCOM_SDA
/PF_CE0
POWER_ON/OFF_1
CI_TS_SYNC
R102 10K
DEMOD_RESET
MODEL_OPT_5
+3.3V_Normal
R1051K
C116 0.1uF
RXA1-
RXB1-
R123
56
/PF_WP
FRC_RESET
KEY1
R
1
1
8
4
.
7
K
/PF_WE
PM_LED
PM_LED
IF_P_MSTAR
RXB0-
USB1_CTL
MODEL_OPT_1
PWM1
R1041K
OPT
C1068pFOPT
R1071K
OPT
/CI_CD1
PWM_DIM
R11910KLCD
RXA2+
FE_TS_SYNC
AV2_CVBS_DET
IR
SPI_SDI
C1180.1uF
HALF_NIM/EU_NON_T2
IC102-*5K9F1G08U0D-SCB0
NAND_FLASH_1G_SSEAN61857001
26NC_17
27NC_18
28NC_19
29I/O0
30I/O1
31I/O2
32I/O3
33NC_20
34NC_21
35NC_22
36VSS_2
37VCC_2
38NC_23
39NC_24
40NC_25
41I/O4
42I/O5
43I/O6
44I/O7
45NC_26
46NC_27
47NC_28
48NC_29
17ALE
3NC_3
6NC_6
16CLE
15NC_10
14NC_9
13VSS_1
12VCC_1
11NC_8
10NC_7
9CE
8RE
7R/B
4NC_4
5NC_5
25NC_16
24NC_15
23NC_14
2NC_2
22NC_13
21NC_12
1NC_1
20NC_11
19WP
18WE
SENSOR_SDA
AMP_SCL
AMP_MUTE
C1010.1uF
I2C_SCL
EPHY_RN
RXA3+
C115 0.1uF
RXBCK+
SC1/COMP1_DET
RXA3-
I2C_SCL
DEMOD_SCL
TUNER_RESET
/FLASH_WP
AR10422
/PF_OE
AUD_MASTER_CLK
R1400
HALF_NIM/EU_NON_T2
RXACK-
R1111K
R1121K
MHL_OCP_EN
/CI_CD2
MHL_CD_SENSE
+3.5V_ST
C1190.1uFHALF_NIM/EU_NON_T2
+3.3V_Normal
TU_SCL
R
1
1
6
4
.
7