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>>> ASML Twinscan XT1250B Configuration <<<
Vintage: 2004/2005
Status: De-installed by ASML in September 2013 with proper locking devices installed and has
been in constant climate controlled storage with purge gas to lens. Now is mostly crated and
wrapped
Available Date: Immediately
NOTE: This tool was installed in a 200/300mm R&D facility and lightly used. It has one
200mm chuck and one 300mm chuck and ran in “single chuck mode”.
Rev. 2 Configuration File, added information
Revised tool configuration> currently has one 200mm chuck and one 300mm chuck so can
run either size wafer concurrently
Revised tool performance data, see pages 3 to 5 and data in bold font, underlined
ASML application engineer review on tool performance at shut-down, see page 5
De-installation report added, see pages 7 to 12
Current layout of key items storage and N2 purge, see pages 12 to 14
Added packing list, starting on page 14
Photo when in fab
Configuration and Photos
ASML Twinscan XT1250B ARF Scanner, 193nm Exposure Wavelength
With GIGAPHOTON GT42A4 Laser System (20W)
< 70nm Resolution
Reduction Ratio: 1:4
Exposure Field (Max x, y): 26mm x 33mm
Numeric Aperture: 0.60 to 0.85
2 point Global Alignment: < 0.008um
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Config Report
Config Item Value
Software release Twinscan Sw rel. 4.0.0
Power 400 Volt
Wafer size 200 and 300 mm
Wafer type Notch
Laser MODEL GIGAPHOTON GT42A4 (20W)
Laser type Gigaphoton laser
FAT Attendance Yes
OIU/Reticle-/Waf.aux.port Left Configuration
CSR's for XT1250B various CSR 7603
WH Carrier Interface 25 Wafer Open Cassette kit
Wafer Track Interface SOKUDO RF3/200
Mark sensor (WH opt.pre-align) Yes
DOE ID12 Low Sigma Yes
DOE ID6 High Sigma Yes
Image Streaming Standard
CD-FEC Standard
Lithoguide ILIAS Standard
MDL View Site View
Athena Narrow Marks Standard
24 char Reticle Barcode Reader Yes
Focus Spot Monitor Standard
Recipe Creator Yes
LOT OVERHEAD REDUCTION LOR-2
Lot Overhead Reduction Standard
Machine Specification for SW key B
Quasar XL Standard
Dose mapper STD (Lithoserver needed @Fab)
Lot Overhead Reduction 2 Standard
Reticle Shape Correction Yes
Twinscan Wafer Switch Yes
Gridmapper Yes (Lithoserver needed @Fab)
System Lens and Performance Data
Illumination and DOSE Control
Specification Current Results
Date Measured (shut down in
9/2013) Comments
Slit uniformity Setting 1 NA=0.85 Annular, Si=0.69,So=0.93
Intensity >1000mW 1023.22 9/9/2012 LUSU.99
Slit Uniformity <0.35% 0.25 9/9/2012
Scan Uniformity <0.2%
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Setting 2 NA=0.70 Annular, Si=0.45, So=0.75
Intensity >1130mW N/A
setting 3 NA=0.85 Annular, Si=0.58,So=0.88
Intensity >1130mW N/A
Dose System Performance Setting1 <1.4% 1.343 9/9/2012 ODDP.99
Dose Repeatability and Accuracy Setting 1
Repeatability <0.4% 0.127 12/27/2011 ODAR.67
Accuracy <1.5% 0.377 12/27/2011 ODAR.67
Pupil Verification Setting 1
Ellipticity <3.0% 2.25 7/7/2012 LUPI.99
Sigma Variation <0.012% 0.003 7/7/2012 LUPI.99
Projection
Specification Current Results
Date Measured
(shut down in 9/2013)
Comments
Aberrations RMS z5-Z37 <1.8nm 1.61 9/9/2012 EMZC.50
RMS spherical <1.0nm 0.79 9/9/2012 EMZC.50
RMS coma <1.0nm 0.86 9/9/2012 EMZC.50
RMS astigmatism <1.0nm 0.65 9/9/2012 EMZC.50
Non-correctable distortion setting1 NCE <8.0nm N/A
Image plane deviation @ 70nm setting1 IPD <55nm 61 9/8/2012
FPSQ.1 through FPSQ.11 are data exposed either at
/100 or /500; FPCM.41
(8/11/13) IPD=52
Astigmatism @ 70nm setting 1 Ast <35 16 9/8/2012
FPSQ.1 through FPSQ.11 are data exposed either at
/100 or /500; FPCM.41
(8/11/13) Ast =14
Long Range Stray light setting 1 Max <1.0 0.74 9/9/2012
EMCA.95
Short Range Stray Max <1.5 N/A
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light setting 1
Focus and Leveling
Specification Current Results
Date Measured (shut down in
9/2013) Comments
Wafer Map reproducibility 99.70% <15nm 5.8 8/20/2006 EMWA.01
Full wafer focus uniformity <15nm N/A
Chuck to Chuck Focus difference <60nm N/A
No data -- system ran in single chuck mode
Focus stability <40nm N/A
Not measured prior to shut
down. If need, we can try if able to extract SYCO
data.
Dynamic Performance
Specification Current Results
Date Measured (shut down in
9/2013) Comments
Moving standard deviation mean +3sig <7.0nm 5 9/8/2012 TSDA.16
Moving average mean +3sig <3.0nm 0.8 9/8/2012 TSDA.16
Reticle Masking Accuracy <300um N/A
Overlay
Specification Current Results
Date Measured (shut down in
9/2013) Comments
Stage Repeatability <4.0nm N/A 9/3/2011
XYWO.06- All the reports available in the directory are from either /100(m7965) or
/500(m8101)
Stage grid verification <7.0nm N/A 2/26/2007
FGGO.02 This report the wafer
is exposed at /500
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(m8101); use offline tool to model final xy
raw data
Single Machine Overlay
overlay max 99.7% <8.0nm 4.5,3.3nm 1/16/2005 XYNO.23
Matched Machine Overlay
overlay max 99.7% <14.0 3.5,2.9nm 9/14/2012 XYMO.68
ASML Applications Engineer Review of tool performance
Hello,
I would like to summarize the phone conference with ASML applications engineering
pertaining to the performance data that was extracted from the XT-1250 Scanner.
1) Projection Lens:
The applications engineers said that the projection lens data looks very good. The only data in
question previously was IPD. However there are two data points. One in 8/11/12 that is in spec
at 52nm and one that was slightly out of spec on 9//9/12 at 62nm. The engineers’ comments
were that it is very probable that the lens meets spec.
2) Focus and leveling:
There is no data for chuck to chuck matching because the tool has one 200mm and one 300mm
chuck, so it was run in single chuck mode. If this was out of spec, a likely repair would be a
chuck replacement. The cost would be around $50k. Not too significant.
General comments from the applications engineers:
1) CD uniformity is normally only performed on a new install and not normally taken on a
used tool. If the lens aberrations are in spec (as they are) there should not be a concern about
CD uniformity.
2) This tool was not highly utilized and was under contract with ASML. Consequently, the
tool should be in very good condition. Lens degradation is a function of the quantity of light
that is transmitted through the lens.
3) This tool is fully capable of volume manufacturing.
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System Layout and In Fab Photos
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De-installation report by ASML engineers
XT1250 M41XX Day 1 of 5
De-installation Daily Report Form 1– GENERAL INFORMATION PASSDOWN DATE: 9-16-2013
Customer Name:
Project Manager:
System SN:
System Model #:
Mechanical De-
Installers :
M41XX XT:1250
2- MILESTONES
De-install Start
Date:
De-install
Complete:
09-16-2013
3- TODAY’S ACTIVITIES
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- Prep Ship machine(see issues)
- Drained LC circuit of machine
- Drained LC, MC, ACC, Laser
- Connected GSU
- Received all lockings (see issues)
4- NEXT ACTIVITIES
- Remove water Cabinet filters
- Drain electronic cabinets
- Decable and disconnect all subfab cabinets
- Remove Misc parts
- Remove frame parts
- Remove WH
5- ISSUES
- Could not Initialize WS, RS, RH, (remedy not researched at the de install)
- Missing two out of six panel carts, on order, ETA unknown (for move out only)
XT1250 M41XX Day 2 of 5
De-installation Daily Report Form 1– GENERAL INFORMATION PASSDOWN DATE: 9-17-2013
Customer Name:
Project Manager:
System SN:
System Model #:
Mechanical De-
Installers :
M41XX XT:1250
2- MILESTONES
De-install Start
Date:
De-install
Complete:
09-16-2013
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- Remove water Cabinet filters
- Drain electronic cabinets
- De-cable and disconnect all subfab cabinets
- Removed Rear seismics
- Remove Misc parts
- Remove frame parts
- Detached Bottom module
- Removed energy sensors
- Removed HP laser
- De-cabled system
- Remove ECAB, Bagged
- De-cabled RS
- Started reverse cable pull
4- NEXT ACTIVITIES
- Finish Removing Misc parts
- Finish Removing frame parts
- Finish Reverse cable pull
- Disconnect and Remove facility lines
- Remove EIM
- Remove WH
5- ISSUES
- Could not Initialize WS, RS, RH, (remedy not researched at de-install)
- Missing two out of six panel carts, on order, ETA unknown (for move out only)
XT1250 M41XX Day 3 of 5
De-installation Daily Report Form 1– GENERAL INFORMATION PASSDOWN DATE: 9-18-2013
Customer Name:
Project Manager:
System SN:
System Model #:
Mechanical De-
Installers :
M41XX XT:1250
2- MILESTONES
De-install Start
Date:
De-install
Complete:
09-16-2013
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3- TODAY’S ACTIVITIES
- Disconnected RS
- Disconnected WS
- Disconnected EIM
- Finish Removing frame parts
- Disconnected WH
- Locked WH
- Put WH on transport
- Finish Reverse cable pull
- Disconnect and Remove facility lines
- Remove EIM
- Finish Removing Misc parts
- Removed Bottom module and put on transport
- Laser was packed
- Panel cart Panels 02 was packed
4- NEXT ACTIVITIES
- Remove and lock RS
- Lock ILL lift
- Remove ILL
- Shift out WS start locking
- Lock Rear Metro frame
5- ISSUES
- Could not Initialize WS, RS, RH, (remedy not researched at de-install)
- Missing two out of six panel carts, on order, ETA unknown (for move out only)
XT1250 M41XX Day 4 of 5
De-installation Daily Report Form 1– GENERAL INFORMATION PASSDOWN DATE: 9-19-2013
Customer Name:
Project Manager:
System SN:
System Model #:
Mechanical De-
Installers :
M41XX XT:1250
2- MILESTONES
De-install Start
Date:
De-install
Complete:
09-16-2013
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3- TODAY’S ACTIVITIES
- Remove and lock RS
- Lock ILL lift
- Remove ILL
- Shifted out the WS
- Started prepping the MB
4- NEXT ACTIVITIES
- Shift out WS start locking
- Lock Rear Metro frame
- Start prepping MB
- Start bagging MB
5- ISSUES
- Could not Initialize WS, RS, RH, (remedy not researched at de-install)
- Missing two out of six panel carts, on order, ETA unknown (for move out only)
XT1250 M41XX Day 5 of 5
De-installation Daily Report Form 1– GENERAL INFORMATION PASSDOWN DATE: 9-20-2013
Customer Name:
Project Manager:
System SN:
System Model #:
Mechanical De-
Installers :
M41XX XT:1250
2- MILESTONES
De-install Start
Date:
De-install
Complete:
09-16-2013
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- Locked metroframe
- Removed RH
- Put RH on Transport and locked and bagged
- Bagged MB
- Shifted out WS started locking(see issues)
4- NEXT ACTIVITIES
- Finish locking and bag WS
5- ISSUES
- WS chucks will not de-couple from Long Strokes (was not researched at de-install)
- Could not Initialize WS, RS, RH, (was not researched at de-install)
- Missing two out of six panel carts, on order, ETA unknown (for move out only)
Current Notes, Layout and Photos in Climate Controlled Storage at Fab
N2 Supply capable of 3.5 cfm
Temp Range (Uncrated) – 59F to 86F
Humidity Range (Uncrated) - < 60%
Climate Control Items & Dims (WxDxH):
AOM Laser Module (crated) – 47.2” x 47.2” x 39.4”
Beam Shaping Module (crated) – 47” x 46.6” x 89.4”
Reticle Handler (crated) – 102.4” x 86.6” x 94.5”
Reticle Stage (crated) – 102.4” x 86.6” x 94.5”
Wafer Handler (crated) – 98.4” x 55.1” x 74.8”
Wafer Stage on transport – 96.9” x 78” x 43.5”
Main Body on transport (standard)- 179.5” x 82.8” x 94.5”
Bottom Module on transport – 80.3” x 39.4” x 93.1”
Illuminator (transport) – 94” x 80” x 93”
Gigaphoton Laser – 36” x 75” x 70”
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Main Lens Assembly with Purge Gas Line
Packing List Follows
Lens Purge
Gas Line
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