Aurore Savoy-Navarro
LPNHE-Universités de Paris 6&7
SilC Collaboration
R&D Advances since St Malo
Si-Envelope design
Mechanics
Electronics
Future Prospects
SiLC COLLABORATIONSiLC COLLABORATION Status: International Collaboration started early 2002 [ChicagoWorkshop]
Aim: To pursue R&D on Si detectors for tracking at future LC
Who: Santa Cruz (Dorfan et al), SLAC (Jaros et al), Colorado, Tokyo, Wayne(Bellwied et al), MIT (Fisher), LPNHE, BNL; Several European & Asian (Japan, Korea and Taiwan) Institutes are also joining
Most of these groups have already a large or even sometime
proeminent expertise in this R&D domain.
Two detectors are considered:
The all-Si-tracker (SD)
The Si-envelope (LD or TESLA)
See: http://lpnhe-lc.in2p3.fr
http://blueox.uoregon.edu/~lc/randd.html
Si-Tracking concepts:
All-Si-tracker (SD)
Si-envelope
The SiLC Collaboration is pursuing independently of the detector concept, a generic R&D that focuses on:
Various sensor technologies
Short µstrips, long µstrips, SDD(contacts with Canberra, Hamamatsu, ST
Microelectronics)
R&D on Electronics FEE for each sensor case
Digitization, trigger logic,
Timing info(SDD)
Cabling & packaging
Power cycling issues
R&D on MechanicsTransparency, hermeticity, architecture,
support modularity, rigidity, deformation studies, cabling, cooling, alignement
Simulation studiesDeveloping the necessary tools:
Full simulation (GEANT4-based)
Fast simulation, Pattern recognition,
Tracking reconstruction algorithm(s)
Studies on Physics issues and needs (precision, dE/dX…), Detector
performance studies, including
comparisons between different
detector techniques and concepts.
A lot is underway in the Collaboration,
with many different tools available
(legacy from previous experiments)
WE BENEFIT FROM:WE BENEFIT FROM:
the already existing expertise gained by:the already existing expertise gained by:
Precursors: Precursors: The LEP Microvertex detectors (6 µstrip sensors/ladder)
STAR (SDD µvertex) ALICE
Larger area Si-tracking:
CDF at Run II: 3.5 m2 µstrip detectors
AMS with about 6 m2 µstrip ladders [up to 15x4.2cm length]
ATLAS and CMS very large area Si-trackers
[the next generation: ~ 200 m2]
Working in collaboration with these experiments . OUR PURPOSE is to start from the present state-of-the-art to push further this R&D for outcomes not only for the LC, but also for:
upgrades of the LHC experiments
developments of trackers for astro particle experiments
!!!!!!!!!!!!!THINNESS!!!!!!!!!!!Long µstrips/ladders
Long shaping time FEEPower cycling
Passive cooling (ultimate?!)Fine granularity (pitch size)
high precision (centroid) Thin detectors (<or = 300µm)
ratio width/pitch!Reduced cost
Sadrozinsky ‘s lawThin mechanical structure
If B-field = 5 T (compact detector), demanding magnet design
R&D ADVANCES since St MALO
J.E Augustin,M. Baubillier, M. Berggren, B. Canton, C. Carimalo, C. Chapron, W. DaSilva, D. Imbault, F. Kapusta, H. Lebbolo, F. Rossel, A. Savoy-
Navarro, D. Vincent [LPNHE-Paris]
1) Setting up the Lab Test bench:
Contacts with AMS and CMS Collaboration and Hamamatsu
2) Pursuing R&D on mechanics:
EUCLID CATIA (Detailed design)
Progress on the Si-FCH design
Studies of cooling issues:
on a mechanical prototype of the drawer
with appropriate software packages
First realizations of C-fiber prototypes, to test feasibility of drawers &
honeycomb structure
1)1) TEST BENCH for Si-SENSORS & FEETEST BENCH for Si-SENSORS & FEE
SCIPP+SLAC:SCIPP+SLAC:
Currently developing the simu of the Si-detector pulse development to begin to understand questions associated with high B-field, diffusion, pulse sharing etc… that will affect the design of the FEE chip.
Present scope: to demonstrate low-noise and power switching for the FEE amplifier of a long shaping time readout system.
Testing a 2m long ladder made with 10cm long sensors, 250µm pitch (GLAST)
LPNHE Paris:LPNHE Paris:
Currently installing the test bench:
1st ladder prototype = 5 AMS sensors (4.2 cm long, 56 µm pitch, 200 µm width, bonding allowing to test: 20, 40, 60, 80 cm… long µstrips and various RO pitch sizes)
2nd ladder prototype = 6 CMS-TOB sensors, > or = 9.45 x 6 cm long µstrips (183 µm pitch, 500 µm width)
Objectives:Objectives: 6 ‘’ 12 ‘’ wafers
500 µm 300 µm width
183 µm 50 to 100 µm pitch
Double-sided (double metalisation)
Better yield (> 50%) & cheaper
Preliminary FEE studies: Preliminary FEE studies: characterizing output signals on test bench, looking for low noise preamp on the market & developing one.
2) R&D on Mechanics: Basic elements of the detector design2) R&D on Mechanics: Basic elements of the detector designLadder
drawer
Honeycomb structure
Moving from EUCLID to CATIA
The long drawer is made of 5 ladders; each ladder is made of 6 CMS-TOB sensors. The drawer is about 2.5 m long.
Ladder: 6 sensors
R&D on Mechanics con’td: Si-FCH DESIGN
Modularity: ladders with 4,5or 6 sensors
4 Quadrants
4 XUV made of 6 2-sided sensors: 4 XU & 2 VV
XUVVUXXUVVUX
The Si-Envelope, CATIA-CAD design
CATIA design of the outside central part of the Si-Envelope: SET
CATIA design of the Si-FCH honeycomb structure
The Si-envelope components in a few numbers:
Si-envelope Component Items Total Number
Si-FCH (XUV) Nb of layers
Nb of ladders , 4 sensors
Nb of ladders, 5 sensors
Nb of ladders, 6 sensors
Nb of RO channels/endcap
Power dissipation
4 XU + 2 VV
192
480
288
983,000
393 Watts
SET Nb of layers
Nb of ladders
Nb of RO channels
Power dissipation
2 1-sided + 1 2-sided
4480
2,293,760
920 Watts
SIT Nb of layers
Nb of ladders
Nb of RO channels
Power dissipation
2 2-sided
38 + 94 =132
270,336
110 Watts
R&D on Mechanics cont’d: C-FIBER PROTOTYPES
Honeycomb structure: Several French firms contacted No pb foreseen to realize the proposed honeycomb structure within the required dimensions
C-fiber structure for drawers: Mechanical studies, design and fabrication of tools + cast of C-fiber structure drawer section done at LPNHE-PCC
1st prototype drawer structure: 2 mm thick & 20 cm long. Need to go to 1 mm thick & 2.5m long Doable but easier by cutting structure into 2 pieces.
R&D on Mechanics cont’d: COOLING STUDIES & TESTS on PROTOS
Entre les résistances
27
27,2
27,4
27,6
27,8
28
28,2
28,4
28,6
28,8
0 50 100 150 200
abscisse ( cm )
tem
pér
atu
re (
° C
)
60 V
82,5 V
Résistances 1 2 3 4 5Température
( ° C )38,2 40,0 39,9 38,8 37,0
Température en fonction de la résistance
36,5
37
37,5
38
38,5
39
39,5
40
40,5
0 1 2 3 4 5 6
résistance
tem
péra
ture
( °
C )
60 V
Aim: Test if water cooling at end of the 2.5 m long drawer OK vs FEE power dissipation (0.2watt/ladder)
Modelling of 2.5 m drawer with C-fiber board, made of 5 parts, each one =60cm ladder. FEE = resistor (0.8 or 1.4 Watt). Higher power dissipation & very localized so much worse than anticipated.
Natural air convection: T°C varies at most 8°C
Nord 40,7 33,6 29,7 28,8Est 44,1 32,7 29,6 28,7Sud 37,2 31,4 29,9Ouest 45,5 33,8 30,1 29,1
Température ( °C )
Peripherie d'une résistance
25
30
35
40
45
50
0 1 2 3 4 5 6
Eloignement par rapport à la résistance ( cm )
Tem
per
atu
re (
° C
)
NORD
EST
SUD
OUEST
A simple water cooling at the edge of the drawer looks sufficient
Measuring temperature decrease in the resistor neighbourhood rapid decrease
Measuring Temperature without naturalconvection (~80% suppressed), T(coolingwater=19degC) results similar to natural convection, so Grad T<<10 degC
Simulation studies: developing full GEANT4-based simu. The detailed CAD mechanical design = instrumental to define the geometry DB = 1st step
Tokyo is developing a full GEANT4 simu for the SD tracker
So full simulation work is really starting now.
All these issues are underway. A lot has been achieved since the first ECFA-DESY Extended Studies Workshop at Cracow in September ‘01
First results on long ladder characterization & FEE developments (next ECFA-DESY Workshop)
R&D on Mechanics aiming on:
Detailed CAD Design, CATIA-based of the Si-Envelope.
Building realistic prototypes of: a long ladder (Lab), a long
drawer(Lab) a piece of honeycomb support structure(Industry)
Cooling tests on realistic mechanical proto & comparison with software computations (ACORD, SAMCEF)
Simulation studies: Main aim = developing a GEANT4-based detailed simulation (including pattern recognition)
Further developments of the SiLC Collaboration