Automated S l i LSelective Laser
Assembly System
Ray PrasadRay Prasad Consultancy Group
President, BeamWorks Inc,
(2000 - 2006) Spark 400
May 26, 2012 1
Note: BeamWorks Ltd, an Israeli Based Company filed for Liquidation in April 2012
All I O Same HereAll In One Same Here
S T l BeamWorksSuper Tool BeamWorksSuper ToolSpark 400Spark 400
DispensePaste
PlaceComponents
Laser Solder
Rework
2006 VISION AWARD WINNERMay 26, 2012 2
2006 VISION AWARD WINNER
Spark 400 for All your SMT NeedsFor One or All of Your SMT Process Steps
Flexibility
VersatilityVersatility
Reflow OvenPick & Place Rework
Spark 400: 2006 Vision Award Winner
Reflow OvenPick & Place Rework
May 26, 2012 3
State of Our Industry: SMT* SMT is the predominant technology forSMT is the predominant technology for
assembly of today’s electronics products* Even though SMT has been in high volume g g
production since the mid 80’s, fewer than 10% of companies have first pass yield of over 90%.
* A th I i O I d t H l i l* Another Issue in Our Industry: How to selectivelyadd components to an already assembled board without impacting previously assembled p g p ycomponents. And do it in an automated manner and not manually
May 26, 2012 4
Competitive AdvantagesOf k S k 400Of BeamWorks Spark 400
* Spark 400 addresses the automated selective assembly i f h i d O d l A dissues of the industry. One good example: Automated selective assembly of missing, planned or unplanned, components
S k 400 id bilit f t t d l ti di i– Spark 400 provides capability for automated selective dispensing, placement, and reflow without impacting the neighboring components
* Electronics products are getting smaller and lighter every p g g g yday by packing components on a board closer and closer together, so much so that it is almost impossible to rework these boards. – Cell phones, PDAs, laptops and even desktops are good examples
of tightly packed assemblies. – Rework in tight spacing is one of the key competitive advantages
of Spark 400 (Removal and replacement even in tight spaces, as
May 26, 2012 5
of Spark 400 (Removal and replacement even in tight spaces, as low as 20 mils)
C titi Ad t OfCompetitive Advantages Of BeamWorks Spark 400
* The traditional SMT assembly, if done correctly, produces high quality assemblies at a very high speed.
* But when something goes wrong and something does go* But when something goes wrong - and something does go wrong and will go wrong as long as humans are involved -the same line will produce scrap at the same high speed.– In such cases you need a high volume automated rework– In such cases you need a high volume automated rework
system– Such a system has not been available, until now– Spark 400 is an ideal system for automated mass reworkSpark 400 is an ideal system for automated mass rework– There is simply no comparable system for automated mass
rework. Bar none.
May 26, 2012 6
Competitive Advantages Of BeamWorks Spark 400
* Spark 400 is able to solder moisture sensitive components without baking resulting in faster cycle time a key concernwithout baking resulting in faster cycle time, a key concern in a production environment. This is an important advantage of the Spark 400.
* Spark 400 addresses not only today’s technologies but isSpark 400 addresses not only today s technologies but is poised to deal with emerging technologies:– Assembly of optoelectronic components where the component
cannot be subjected to reflow temperatures – Lead free soldering is another emerging technology. All lead free
solders have about 40 deg C higher melting point than that of tin lead (179 or 183 deg C)
– To implement lead free we need to use higher temperature boardTo implement lead free we need to use higher temperature board and component package materials that will be more expensive than the current materials being used. We may also need new equipment to accommodate these higher temperatures.Spark 400 will address these issues without the need for high
May 26, 2012 7
– Spark 400 will address these issues without the need for high temperature circuit board material or need for any modification.
Competitive Advantages OfCompetitive Advantages Of BeamWorks Spark 400
* A current trend in the electronics industry is for most high volume manufacturing to move to low cost countries such as China
* Spark 400 is a beneficiary of this emerging trend since it is a perfect system for quick-turn prototype and engineering buildsy q p yp g g
* Spark 400 can be placed in any engineering lab where engineers can refine and debug their products before shipping them offshore for high volume manufacturing.
* There are some technical key advantages of Spark 400 that are not* There are some technical key advantages of Spark 400 that are not available in any other system on the market today– Spark 400 can monitor and control body and lead temperatures of
components– Spark 400 provides not only unique profile for each component but
even unique profile for each lead
May 26, 2012 8
Point and Click Programming
May 26, 2012 9
Spark 400 Multi Process Assembly CapabilitySpark 400 Multi Process Assembly Capability
Multi Process Head:1 Pick & Place1. Pick & Place
Vacuum Nozzle
2. Dispensing
3. Laser Soldering
C t F di
May 26, 2012 10
Components Feeding :Trays, Reels, Sticks
Head Assembly
Laser Window
X 4X 4
DiDown
Looking Camera
Dispenser(Solder Paste,
Flux)
Pick –Up
May 26, 2012 11
Tool
F ll S L (T Vi )Full System Layout (Top View)
29 Reel FeedersAdjustable Feeders
Nozzle
jConveyor
Supporting Nozzle replacement Station & Up
Looking Camera
Plate
Automated Tray Feeder
Camera
Bottom Heater Controller
May 26, 2012 12
Feeder Shuttle Option2 groups of 51 feeders
(8 mm) each.Total 102 feeders
May 26, 2012 13
Selective Paste DispensingSelective Paste Dispensing
* P iti di l t* Positive displacement for controlled paste depositdeposit
* Accurate dispensing for discrete and finefor discrete and fine pitch components
* Consistent qualityq y
May 26, 2012 14
Selective Component PlacementSelective Component Placement
* d* Up to 40 trays and 102 tape feeders
* Vision capability for accurateVision capability for accurate placement
* Good throughput* Accommodate small and large
boards (up to 16” X 20”)* CAD data input for* CAD data input for
programming * Extremely Short set up time
May 26, 2012 15
y p
Unique Tray for Tape & Reel StripsUnique Tray for Tape & Reel Strips(Good for R/Cs on Short Strips)
May 26, 2012 16
S l ti R flSelective Reflow
* 4 l ti* 4 lasers acting simultaneously for high throughputthroughput
* Not heating adjacent componentscomponents
* Getting the solder hot but keeping the board coolp g
May 26, 2012 17
A tomated Dispensing Placement andAutomated Dispensing, Placement and Soldering of Resistors and Capacitors
May 26, 2012 18
A tomated Dispensing Placement andAutomated Dispensing, Placement and Soldering of QFP
QFP Dispensing
QFP Placement
QFP Soldering
May 26, 2012 19
NOTE: CLICK ON VIDEO CLIPS TO PLAY
Automated Dispensing, Placement and p g,Soldering of BGA
BGA Dispensing
BGA PlacementBGA Placement
BGA Soldering
May 26, 2012 20
NOTE: CLICK ON VIDEO CLIPS TO PLAY
T i l T P fil f BGA225Typical Temp Profile for BGA225Soldering or Rework
4 Lasers controlled by 4 IR temp sensors acting simultaneously
4
T (Deg-C) 3
220
12120
1
20 5540 70Seconds
May 26, 2012 21
Spark 400 Current MarketSpark 400 Current Market
* Low Volume General Applications– Small Subcontractors - small lot production– OEMs for New Product Introduction work– R&D Environments Pilot runs and Prototype work– Large Subcontractors - Auxiliary SMT line
* Hi h V l S i li d A li i* High Volume Specialized Applications– Large Sub-contractors, OEMs - selective assembly
of planned and un planned missing componentsof planned and un-planned missing components, automatic rework, SMT connector assembly, BGA assembly, Optical Component Soldering
May 26, 2012 22
Approximate Assembly Cycle TimesApproximate Assembly Cycle TimesActual Time Will Depend on Boards & Components
(Time in Seconds)(Time in Seconds)Component type Removal dispense pick & place soldering
cap 0402 6 2 5 3
res 0603,0805 6 2 5 3
1206 6 3 5 3
SOT23 6 4 5 4
SO8 30 5 5 6
SO16 40 6 6 12
TSOP32 60 6 6 24
QFP100 120 10 6 40QFP100 120 10 6 40
PLCC52 80 12 6 20
Small BGA 300 mils 60 60 6 80
Medium BGA 700 mils 60-120 120 6 80-140
May 26, 2012 23
Big BGA 1500 mils 120-180 180 6 140-200
Spark 400 Current Applications
* Missing components (“Skips”)Components not arriving on time create a major quality and delivery problem for both OEMs andquality and delivery problem for both OEMs and subcontractors since late components have to be either assembled by hand or the production is postponed waiting for arrival of missing components– Spark 400 not only allows automated assembly of
unplanned missing components but can be used to changeunplanned missing components but can be used to change production planning to allow use of planned missing components
May 26, 2012 24
Opto Electronics ApplicationOpto-Electronics Application(Get the solder hot but keep the package Cool)
* Many components are temperature sensitive and require selective assembly without heating the package
* Mostly done manually Automation is required to reduceMostly done manually. Automation is required to reduce cost
* Spark 400 is well suited to replace manual soldering with automated reflow for both through hole and SMT opto-electronics components – Faster, cheaper process with consistent quality for Tx and RxFaster, cheaper process with consistent quality for Tx and Rx
optical modules & other optical devices (not operator dependent)– Dispense extra paste for gold plated leads to address brittle gold
intermetallic problems
May 26, 2012 25
intermetallic problems– Thinner intermetallic layer for improved reliability (< 1 micron)
May 26, 2012 26
Wi l A li iWireless Applications* For wireless applications minor customization is requiredFor wireless applications minor customization is required
to convert high volume generic assembly to custom assembly
* With the trend toward Bluetooth, most boards will require RF shields that are added after the boards are assembled
* S k 400 i i l iti d t t hi h* Spark 400 is uniquely positioned to convert a high volume generic assembly to custom assembly and to selectively assemble RF shieldsselectively assemble RF shields
May 26, 2012 27
Laser Vs Hot Air for Rework* No need for hot air nozzles* No melting of solder joints of
neighboring components* ki ( f )
CSP REWORK
* No Baking (Except for BGAs) and No Popcorning
* No need for mini-stencils* R k i Ti ht S (15* Rework in Tight Spaces (15
mils Vs 150 mils for hot air)* Automated removal and
replacement (Dipping Process)replacement (Dipping Process)* Much faster than Hot air
May 26, 2012 28
NOTE: CLICK ON VIDEO CLIPS TO PLAY
Reduce QFP Rework from 7 Steps to 4Reduce QFP Rework from 7 Steps to 4 Steps by Using ”Dipping” Process1. Apply heat to the QFP to be replaced2. When the solder joints melt, remove QFP3 Clean the site by removing solder on the QFP lands3. Clean the site by removing solder on the QFP lands4. Apply solder paste. Apply liquid flux5. Place QFP6. Apply heat to solder joints. Merge Steps 5 and 6 in one
step by picking up QFP and letting it hover over QFP pads while melting solder below and then gently pushing p g g y p gQFP in molten solder. Please see the attached video clip.
7. Clean and or brush off solder balls if present
May 26, 2012 29
Vision Award Winning Unique ReworkVision Award Winning Unique Rework Process for QFP: Reduce Time & Damage
May 26, 2012 30
Impact of Hot Air: Damage to AdjacentImpact of Hot Air: Damage to Adjacent Components
Damaged CapsBy Hot Air
May 26, 2012 31
Impact of Hot Air: Shielding to Pre entImpact of Hot Air: Shielding to Prevent Damage to Adjacent Components
May 26, 2012 32Kapton Tapes to Protect Neighboring Components from Hot Air takes time and needs Space
L V H t Ai f R kLaser Vs Hot Air for Rework
* No need for hot air nozzles* No need for hot air nozzles* No melting of solder joints of neighboring
componentscomponents* No Pop-corning & No Baking (Except for BGAs)* No need for mini-stencils* Rework in Tight Spaces (15 mils Vs 150 mils
for hot air)* Automated removal and replacement* At least ten times faster than Hot air
May 26, 2012 33
BeamWorks Spark 400All in One Assembly System
GET THE SOLDER HOTKEEP THE BOARD COOL
Spark 400
May 26, 2012 34