Bulk Micromachining Bulk Micromachining of of
Silicon for MEMSSilicon for MEMS
Mustafa G. Guvench, Ph.D.Mustafa G. Guvench, Ph.D.
University of Southern MaineUniversity of Southern Maine
Single Crystal Silicon for MEMS
Mechanical Material
SILICON?
Stiff => Stiff => Thinning is required for appreciable strainThinning is required for appreciable strain
Single Crystal Silicon for MEMS
Single Crystal Silicon for MEMS
Structure of Single Crystal Silicon
Miller Indices for Single Crystal Silicon
Miller Indices for Single Crystal Silicon
SCS has SCS has anisotropic anisotropic properties:properties:
Electrical, Electrical, Thermal, Thermal, Mechanical, Mechanical, ChemicalChemical
ETCHING for BULK MICROMACHINING(Isotropic/Anisotropic)
ETCHING for BULK MICROMACHINING(Isotropic/Anisotropic)
ETCHING for BULK MICROMACHINING(Cavity/Cantilever Anisotropic)
DRY (Plasma) ETCHING
Deep Reactive Ion Etch (DRIE)
Single Crystal Silicon for MEMS
Single Crystal Silicon for MEMS
Single Crystal Silicon for MEMS
What is MICRO-MACHINING?
What can Micromachined Parts/Systems do for us?
Be a Conduit to Microscopic Domain:
1. Sensing (Information)2. Information Processing 3. Communication4. Manipulation (Actuation and Control)
Why / Why not
SILICON?
Semiconductor: Semiconductor: Active Devices + SensorsActive Devices + Sensors(Photo-Magneto-Strain Sensing)(Photo-Magneto-Strain Sensing)
Insulator:Insulator: SiOSiO22 , Si , Si33NN44 , Glass , Glass
Thin Film Conductor:Thin Film Conductor: Aluminum, Gold, SilicidesAluminum, Gold, Silicides
PhotoLithography:PhotoLithography: Planar control (+ & -)Planar control (+ & -)
Mechanical Material
SILICON?
Stiff => Stiff => Thinning is required for appreciable strainThinning is required for appreciable strain
Micromachining of
SILICON?
MICROMACHINING of SILICON => MICROMACHINING of SILICON => (a) (a) BULK (substrate)BULK (substrate)(b) (b) SURFACE (films)SURFACE (films)
Additive Processes: Additive Processes: Chemical and Physical DepositionChemical and Physical Deposition(Thin Layers only) (Single/Poly)(Thin Layers only) (Single/Poly)
Removal Processes:Removal Processes: Chemical and Physical EtchingChemical and Physical Etching(Wet/Dry/Plasma/Inert/Reactive)(Wet/Dry/Plasma/Inert/Reactive)
(Bulk/Film) (Anisotropic/Isotropic)(Bulk/Film) (Anisotropic/Isotropic)
BULK MICROMACHINING(Etchants: Isotropic/Anisotropic)
BULK MICROMACHINED(Silicon Capillary for Insulin Infuser)
BULK MICROMACHINED(Silicon Capillary for Insulin Infuser)
BULK MICROMACHINED(Silicon Capillary for Insulin Infuser)
BULK MICROMACHINED(Silicon Mask for Cylindrical Micromotion Sensor)
BULK MICROMACHINED(Series Connected Photovoltaic Converter Battery)
BULK MICROMACHINED(Series Connected Photovoltaic Converter Battery)
BULK MICROMACHINED(Series Connected Photovoltaic Converter Battery)
MOTION? HANDLING? ASSEMBLY?COUPLING? =>
MicroElectroMechanicalSytems
M (CMOS-IC Technology) + E (CMOS-IC Technology) +
M (Silicon and Sacrificial Layers) +
O (Aluminum) +
S (IC Packaging Technology)
Three-Layer Poly-Silicon Surface Micromachining Process
(to build Mechanical Parts on CMOS IC)
Final cross sectional view with 7 layersFinal cross sectional view with 7 layers
Three-Layer Poly-Silicon Surface Micromachining Process
Surface Micromachined
Micromachining of Projection Camera
M (CMOS-IC Technology) + E (CMOS-IC Technology) +
M (Silicon and Sacrificial Layers) +
O (Aluminum) +
S (IC Packaging Technology)
M.G.GuvenchM.G.Guvench
Surface Micromachined Silicon SensorsSurface Micromachined Silicon Sensors
M.G.GuvenchM.G.Guvench
Surface Micromachined Silicon SensorsSurface Micromachined Silicon Sensors
M.G.GuvenchM.G.Guvench
Electrostatic Field SensorsElectrostatic Field Sensors
M.G.GuvenchM.G.Guvench
Electrostatic Field SensorsElectrostatic Field Sensors
M.G.GuvenchM.G.Guvench
Electrostatic Field SensorsElectrostatic Field Sensors
M.G.GuvenchM.G.Guvench
Mass (Absorption/Deposition) SensorMass (Absorption/Deposition) Sensor
M.G.GuvenchM.G.Guvench
Mass (Absorption/Deposition) SensorMass (Absorption/Deposition) Sensor
M.G.GuvenchM.G.Guvench
Mass (Absorption/Deposition) SensorMass (Absorption/Deposition) Sensor
M.G.GuvenchM.G.Guvench
Electrostatic Field SensorsElectrostatic Field Sensors
M.G.GuvenchM.G.Guvench
Flow Skin Friction SensorsFlow Skin Friction Sensors
M.G.GuvenchM.G.Guvench
Flow Skin Friction SensorsFlow Skin Friction Sensors
M.G.GuvenchM.G.Guvench
CMOS Analog Chip Design (Operational Amplifier)CMOS Analog Chip Design (Operational Amplifier)
M.G.GuvenchM.G.Guvench
MicroFab Laboratory
Programmable Diffusion/Oxidation System’s Programmable Diffusion/Oxidation System’s Controller in The MicroFab LaboratoryController in The MicroFab Laboratory
Double-Diffused PDouble-Diffused P++NNNN++ Junction PhotoDiode Junction PhotoDiode Made Being Tested in The MicroFabrication Lab.Made Being Tested in The MicroFabrication Lab.
MicroFab Laboratory
Surface Micromachined Silicon SensorsSurface Micromachined Silicon Sensors
M.G.GuvenchM.G.Guvench
3-Poly Surface Micromachining ProcessedSensors
Cross SectionCross Section
MEMS Switch
MEMS MicromotorMEMS Micromotor
A Mass (Absorption/Deposition) SensorA Mass (Absorption/Deposition) Sensor
M.G.GuvenchM.G.Guvench