Embedded Solutions
Embedded. Works Anywhere.
2015 Embedded Product Guide V1.0
Embedded Solutions
Solutions
MedicalImagingMedical InstrumentationBiological Inspection Systems
There are many reasons to choose high reliability, long-life embedded SBCs and systems for medical industry applications. The use of COTS Embedded SBCs reduces time to market by enabling Medical OEM manufacturers to focus their expertise on their platform designs, rather than on CPU engine technology. ADL Embedded Solutions offers the best in embedded solutions that provide the performance to drive systems like Medical Imaging where advanced graphics capabilities are a necessity for clear 2D and 3D rendering.
Industrial Automation & ControlProcess ControlRoboticsBuilding AutomationAutonomous Factory-Networked Device SystemsMachine Vision
Embedded PC systems offer an encompassing mix of legacy hardware and software support with planned migrations to future hardware. This results in significant economic advantages by leveraging existing hardware and software as well as shortening the development cycle for new Industrial Automation Systems. Wireless communications, control and monitoring among industrial devices enhance capabilities and efficiencies that provide a competitive advantage. Modular/Flexible system platforms and components provide added functionality and upgradability.
Security & SurveillanceThreat DetectionBiometric ID and Access ControlCommunications and NetworkingBiological and Explosives Trace DetectionImage Capture/RecognitionLicense Plate Identification
Beyond CCTV networks, biological and explosives trace detection, and communications monitoring, Security and Surveillance techniques have evolved into applications developed to enhance personal safety, product production and even marketing tailored to individuals.
Government & DefenseAvionics ISRSecure Communications and NetworkingCommand and ControlImaging and DSPUAV & UASGround Penetrating Radar Detection
Technology spending in Government and Defense over the next ten years will place heavy emphasis on Unmanned Aerial Vehicles (UAVs), as well as supporting infrastructure, such as ground control stations, shipboard control stations and Command and Control Systems. Supporting UAS and battlefield infrastructure like Command and Control and Secure Communications/Networking Systems will also evolve to scale with the ever-increasing demand for secure, distributed communication bandwidth. Extended Temperature/Ruggedized Systems with long-term Product Support make embedded systems the appropriate choice in these harsh and demanding environments.
RailwayAeronautical SystemsAutomotive Fleet ManagementTraffic Control ManagementVehicle Advanced System Development
Embedded PC Solutions can be leveraged in many Transportation applications.Owing to their ruggedness and flexible I/O, what is deployed in one environment is often easily adaptable to another. Transportation applications can range from solar powered ticket and information kiosk to tracking and remote power train control in all manners of Transportation environments from Automotive and Avionics to passenger and Freight Railway.
Transportation
Motor Control SystemsOil and Gas Drilling and ExplorationMiningRenewable EnergyEnergy DistributionInfrastructure InspectionLeak Detection
The Energy Sector has come to rely on embedded SBC systems to serve their small to medium volume computation and control node needs. Energy Infrastructure represents a long-run cyclical upgrade market that benefits greatly from carrying their application investments across multiple generations of hardware. Wireless communications control and monitoring among industrial devices.
Energy
1Embedded Solutions
Case Studies 2
Custom Systems & Boards 3
Modular Enclosure Systems 4–5
PC/104 • PC/104-Plus • PCI/104-Express • PCIe/104 6-7 Embedded Single Board Computers • COTS • MCOTS
3.5” Embedded Single Board Computers 8
Power Supplies 9
Peripherals & Accessories 10-11
Thermal Solutions 12
Thermal Management 13
Services 14
Tech Brief: What is PC/104? 15
Optimizing Your System Build 16
PC/104 Is the Choice When Durability Counts…
Table of Contents
PC/104 form factor boards offer the highest level of ruggedization and customization of any of the COTS embedded form factors. There are no baseboards to design and no onboard consumer grade connectors that limit the product implementation. All I/O can be custom cabled to meet very specific needs, allowing the board to be deeply embedded within a system. The fact is that
most embedded products will provide adequate processing power when appropriately sized for the job at hand. I/O bandwidth and product expandability become critical data points when defining an embedded application platform. PC/104 is the choice when durability counts for everything in environments where other embedded boards can’t survive.
2Embedded Solutions
Case Studies
Product: IPC67 Networking SystemMarket: UAS, AvionicsSegment: Network CommunicationADL Embedded Solutions was approached by a prime military contractor in the Aerospace market to create an airborne, MIL-SPEC rated embedded networking system. The requirements were for a Gen2 Intel Multicore SBC, 6 isolated/unswitched LAN ports (2 on the SBC, 4 on peripheral card), able to meet MIL-STD-704/1275/461, MIL-STD-810, and support of Red Hat Linux Distro. There was a critical specification for the unit to be conduction cooled and it had to meet a strict dimensional specification of 1.7” height x 4”width x 7” depth.
ADL Embedded Solutions design engineers worked closely with the customer providing evaluation products, Solid Works renderings, SCD (creation), and custom milled enclosures with compact faceplate connectors. Our extended Temperature Screening and Ruggedization enhancement processes provided robust reliable PCIe/104 i7 SBCs that exceeded the customer’s requirements. The custom designed systems use our ADLQM67PC-i7-2655LE SBC, ADLLAN 4 port LAN card, and ALDPS-150-12 power supply.
Product: Cameralink Hyperspectral Imaging SystemMarket: IndustrialSegment: Avionics, Computer Vision - Hyperspectral Imaging A leading supplier of hyperspectral imaging systems was looking for an MCOTS system solution that provides high-speed data processing and storage in one compact enclosure, designed for airborne environments. In critical hyperspectral imaging applications, continuous streams of incoming data represent the chemical or spectral ‘fingerprint’ within the field of view. Because hyperspectral imaging involves high-speed scanning across a wide or continuous field of view, large data files (often several gigabytes in size) need to be collected and managed. ADL Embedded Solutions’ engineers worked closely with the client to develop a system specification, Solidworks 3D CAD designs, quick-turn system prototypes, and follow-on production deliveries. The custom chassis incorporates a 2nd Gen Intel Core ADLQM87PC, with a custom-designed 4-port Cameralink card, ADLPS104 ATX power supply and high-capacity SSDs. For airborne applications, the system has no moving parts and is ruggedized for high shock and vibration environments.
Product: 3U Rackmount Data ConcentratorMarket: Oil & GasSegment: Process Monitoring and ControlADL Embedded Solutions was contacted to replace another vendor’s system that had been experiencing on-going problems both functionally and in supporting the product’s longevity.
The requirement was for a 3U aluminum enclosure that would function as a data concentrator in hazardous oil and gas environments. The data concentrator is a light-weight profibus device that uses a low-power Intel Atom Z530 SBC for its processor. This unit could not have any moving parts so that active fans could not be used. A conduction cooled approach was used so that no potential electric sparks would be created. This system is used to monitor measuring equipment via a process control system. This variant is used in explosive/hazardous areas where power can be delivered over the bus to field instruments, while limiting current flows so that explosive conditions are not created, even if a malfunction occurs.
Hundreds of systems are currently in the field both in the US and around the world and have a track record of 100% reliability. In addition, ADL Embedded Solutions EOL support program has provided this product’s availability. This program began in 2012 and will go well into 2018 and potentially further.
Case Studies
3Embedded Solutions
Custom Systems and Boards
Custom Systems and BoardsCustom Small Form Factor (SFF) systems and boards can be designed to meet space, power, and environmental requirements. Aided
by Solidworks® 3D CAD design software, our engineers can help conceptualize, design, build, and fully integrate and test both low and
high IP (Ingress Protection Rating) systems. Fully integrated systems for applications as varied as data concentrators on oil rigs to military
communications with extreme MIL-STD810 vibrations requirements have been successfully designed and deployed by ADL Embedded
Solutions in close cooperation with our numerous industrial and defense-related clients.
As it sometimes happens, the optimal system solution requires an optimal custom board to support it. Our board design team’s world-
class capabilities have resulted in the industry’s highest performance PCIe/104 Intel Core i7/i5 SBCs. This foundation of world-class skills,
tools, and libraries are readily available and can be leveraged for custom SBC variants and peripherals to meet and exceed our client’s
system expectations.
Custom Board Design ServicesADL Embedded Solutions can create custom SBCs and peripheral boards that help optimize SWaP (Size,
Weight and Power) which is key to helping our clients achieve competitive advantage with their products.
Our board design tools and services fully encompass the entire value chain from component vendors, to
design support, as well as manufacturing and customer support services for BIOS and BOM control.
System Concept DevelopmentWorking from customer requirements and concepts, ADL Embedded Solutions can help refine agreed
upon critical design requirements. From these requirements, ADL Embedded Solutions can develop
implementation strategies, while our Sales engineers generate development quotes to help guide the NRE
process. This collaborative process is the key to developing workable solutions that meet both cost and
technical constraints. Often, an intervening “proof of concept” stage will precede commitment of NRE
design resources.
System DesignTools like Solidworks® 3D CAD design software not only aid in rapid development of enclosure and system
concepts, but also make for efficient communication of design concepts with customers to minimize
development time and time to market. Once approved, Solidworks® 3D CAD designs also become the
primary communication vehicle for documenting the system for customer SCDs (Source Control Drawings)
as well as for follow-on manufacturing steps. Solidworks CFD thermal simulation capabilities help ensure
systems stay within their specified thermal envelope.
System BuildUsing our strong relationships with metalwork, milling, coating, and component vendors, ADL Embedded
Solutions can make even the most complex system a reality. Typically, small quantity prototypes are built
to validate manufacturing quality and mechanical specifications. Fully integrated systems are then built
to validate ease of integration by production personnel, confirm electrical specifications, and shipped to
the end-customer for system verification testing as well as any special tests such as vibration or EMI
compliance testing.
4Embedded Solutions
The ADLMES-8200 is a Highly Configurable, Modular Enclosure System Aimed at Quick-Turn Delivery of Rugged and Extended Temperature Enclosures for a Variety of Applications.
• Modular Sidewall Design Supports Variable PC/104 Stack Heights or Expanded 3.5” SBC Intelligent Systems.
• High and Low IP (ingress protection) Systems Possible via High IP, Modular Chassis Design Coupled with Full Custom, Quick-Turn I/O Plate Support and High-IP Connector Availability.
• Flexible Ribbed Chassis Design Allows for Conduction Cooling Through Base or Passive Cooling via Chassis Which can be Augmented with Active Cooling Fan.
• Fully Supported by ADL Embedded Solutions’ Team of Solidworks Engineers for Model and or Design Support.
• Quick-Turn IP60 Availability. Additional Lead Time Required for IP65 Systems.
System Building Blocks…• Broad Portfolio of PC/104 SBC Options Ranging from
low-power Intel® Atom™ to high performance 4th Generation Intel Core i7 Processors.
• Peripheral Possibilities Include: 4-Port GLAN, GSM, WLAN, WWAN, GPS, 3G Cellular, Storage SSDs and many more Func tions Including Custom Board Services for Specialty Applications.
• Power Supply Options (ADLPS35, ADLPS104 and ADLPS104ISO) Exist for low to High-Pow ered Systems with Features Including ATX, Isolation, and EMI Filtering for a Broad Range of Requirements.
• Designed for MIL-STD 704/1275/461 and MIL-STD 810.
• Ruggedization and Extended Temperature Options Available.
• Solidworks 3D CAD Model and Design Support Available.
ADLMES-8200 High-Ingress Protection (IP) Modular Enclosure System
Fig. 1: Exploded View
Modular Enclosure Systems
5Embedded Solutions
ADLMES-8200-P2 6-Card Chassis
• HWD = 5.9” x 7.0” x 6.6”, 15cm x 17.8cm x 16.8cm
• Empty Weight = 7.3 lb, 3.31kg
• Configuration Profile: Can fit SBC Plus Power Supply; OEM SATA and MIL 704/1275/461 Options.
• Additional Four I/O Card Capacity.
• Can Fit up to 16X LAN Ports for Mobile Servers or Network Appliances with Terabyte Capacity.
• Other Applications: Mobile Computing for Transportation and Remote Monitoring, Cameralink/Framegrabbing Apps, etc..
ADLMES-8200-P1 4-Card Chassis
• HWD = 4.6” x 7.0” x 6.6”, 11.7cm x 17.8cm x 16.8cm
• Empty Weight = 6.4 lb, 2.90kg
• Configuration Profile: Can Fit SBC and Power Supply, Plus OEM SATA and MIL 704/1275/461 Options.
• Additional Two I/O Card Capacity.
• Applications: Mobile Computing for Transportation, Cameralink/Framegrabbing Apps, Remote Monitoring in Exposed Environments Such as Oil fields, Offshore Oil Platforms, etc..
ADLMES-8200-LP Low Profile 2-Card Chassis
• HWD = 3.2” x 7.0” x 6.6”, 8.1cm x 17.8cm x 16.8cm
• Empty Weight = 5.4 lb, 2.45kg
• Configuration Profile: Can Fit SBC and Power Supply, Plus OEM SATA and MIL 704/1275/461 Options.
• Applications: Low-Profile, Rugged, General Computing.
Modular Enclosure
Systems
6Embedded Solutions
ADLE3800PCIntel Bay Trail
SoC Atom E3800
NEW - PCIe/104
• Intel® Atom™ E3800 Series SoC, DUAL/QUAD, 1.33 GHz - 1.91 GHz
• DC 6W-8W, DUAL/QUAD 10W
• Up to 8GB DDR3L-1333 DRAM
• Reduced Type 2 Bottom-Stacking PCIe/104; Two x1 Lanes*
• 2x 10/100/1000 Mbit LAN
• Video - VGA/DVI/DisplayPort
• 2x SATA 3Gb/s
• 8x USB 2.0; 1x USB 3.0
• 2x RS232 COM
• 1x 16 bit GPIO
• 7.1 HD Audio with SPDIF In/Out
• Power: +5V, +12V, +5V Suspend
• Standard -25C to +70C, -40C to +85C Option
• 1x Mini Card Socket for MiniPCIe and mSATA
• *Shared with Mini Card Socket
PCI/104-Express
ADLD25PCIntel Atom D525
• Intel® Atom™ Dual Core™ D525, 1.80 GHz
• Intel® ICH9M-E Chipset (SFF)
• Up to 4GB DDR3-800 DRAM
• Type 2 Bottom-Stacking PCI/104-Express
• 1x 10/100/1000 Mbit LAN
• Video - VGA/LVDS
• 2x SATA 3Gb/s
• 8x USB 2.0
• 4x RS232 (2x RS232/422/485) COM
• 1x 16 bit GPIO
• 7.1 HD Audio
• Power: +5V, +12V, +5V Suspend
• Standard -25C to +70C, -40C to +85C Option
• 1x Mini Card Socket for MiniPCIe Modules
PC/104-Plus
ADLS15PCIntel Atom Z510/Z530
• Intel® Atom™ Z510/Z530 1.1 GHz - 1.60 GHz
• Intel® SCH US15W Chipset
• Up to 2GB DDR2-533 DRAM
• Bottom-Stacking PC/104-Plus
• 1x 10/100/1000 Mbit LAN
• Video - VGA / LVDS
• 1x PATA
• 8x USB 2.0
• 2x RS232; Optional 422/485 Mod.
• 1x LPT1
• 6 Channel HD Audio
• Power: 5VDC
• Standard -25C to +70C, -40C to +85C Option
• Up To 8GB Onboard SSD Option
PC/104-Plus
ADLLX8PCAMD Geode LX800
• AMD® Geode™ LX800, 500 MHz
• AMD® Geode™ CS5536 Chipset
• Up to 1GB DDR-400 DRAM
• Bottom-Stacking PC/104-Plus
• 1x 10/100 Mbit LAN
• Video - VGA / LVDS
• 1x PATA
• 4x USB 2.0
• 1x LPT1
• 2x RS232; Optional 422/485 Mod.
• 6 Channel Audio
• Power: 5VDC
• Standard -25C to +70C, -40C to +85C Option
• Up To 8GB Onboard SSD Option
L O W P O W E R
PC/104 • PC/104-Plus • PCI/104-Express • PCIe/104 Embedded Single Board ComputersThe ADL Embedded Solutions PC/104 SBCs are available as COT, MCOTS or custom designs. All boards are offered with Industrial Temperature ratings or optional Extended Temperature and ruggedization features.
7Embedded Solutions
COTS · MCOTS
ADLQM87PC4th Generation Intel Core i7/i5
NEW - PCIe/104
• Intel® Core™ i7 Dual/Quad, 1.6 GHz to 2.4 GHz
• Intel® 8-Series PCH Lynx Point QM87 Chipset
• Up to 8GB DDR3L-1600 DRAM
• Type 1 Bottom-Stacking PCIe/104
• 2x 10/100/1000 Mbit LAN
• Video - VGA/DVI/HDMI/DisplayPort/eDP
• 4x SATA 6Gb/s with RAID
• 8x USB 2.0; 2x USB 3.0
• 2x RS232 COM
• 1x 16 bit GPIO
• 8 Channel HD Audio with SPDIF In/Out
• Power: +5V, +12V, +5V Suspend
• Standard -25C to +70C, -40C to +85C Option
• Trusted Platform Module (TPM) 1.2
• Mini-Card Socket for MiniPCIe or mSATA
PCIe/104
ADLQM67PC2nd/3rd Generation
Intel Core i7
• Intel® Core™ i7 Dual/Quad, Celeron®, 1.4 GHz to 2.2 GHz
• Intel® QM67 PCH
• Up to 8GB DDR3-1333 DRAM
• Type 1 Bottom-Stacking PCIe/104
• 2x 10/100/1000 Mbit LAN
• Video - VGA/DVI/HDMI/DisplayPort/LVDS
• 2x SATA 6Gb/s with RAID
• 8x USB 2.0
• 2x RS232 COM
• 1x 16 bit GPIO
• 8 Channel HD Audio with SPDIF In/Out
• Power: +5V, +12V, +5V Suspend
• Standard -25C to +70C, -40C to +85C Option
ADL945PCIntel Core2 Duo /
Core-Duo/CoreSolo
ADL855PCIntel Pentium M /
Celeron M
• Intel® Core™2 Duo / Core™Duo / Core™Solo, 1.0 GHz - 2.16 GHz
• Intel® 945GME / ICH7 Chipset
• Up to 2GB DDR2-667 DRAM
• Bottom-Stacking PCI/104
• 1x 10/100 Mbit LAN
• 1x 10/100/1000 Mbit LAN
• Video - VGA/LVDS
• 2x SATA 3Gb/s, 1x PATA
• 6x USB 2.0
• 2x RS232 COM
• 1x LPT1
• 6 Channel HD Audio
• Power: 5VDC
• Standard -25C to +70C, -40C to +85C Option
• Intel® Pentium® M / Cel-eron® M, 0.6 GHz - 1.8 GHz
• Intel® 855GME / ICH4 Chipset
• Up to 1GB DDR-333 DRAM
• Bottom-Stacking PC/104-Plus
• 1x 10/100 Mbit LAN
• Video - VGA/LVDS
• 1x PATA
• 4x USB 2.0
• 2x RS232 COM
• 1x LPT1
• 6 Channel Audio
• Power: 5VDC
• Standard -25C to +70C, -40C to +85C Option
PCI/104 PC/104-Plus
ADLGS45PCIntel Celeron M / Core 2 Duo (SFF)
• Intel® Celeron® M / Core™ 2 Duo (SFF), 1.2 GHz to 2.26 GHz
• Intel® GS45 / ICH9M-E Chipset
• Up to 4GB DDR3-1066 DRAM
• Type 1 Bottom-Stacking PCI/104-Express
• 2x 10/100/1000 Mbit LAN
• Video - VGA/LVDS
• 4x SATA 3Gb/s with RAID
• 8x USB 2.0
• 2x RS232; Optional 422/485 Mod.
• 1x LPT1
• 8 Channel HD Audio
• Power: +5V, +12V, +5V Suspend
• Standard -25C to +70C, -40C to +85C Option
PCI/104-Express
H I G H P E R F O R M A N C E
8Embedded Solutions
NEW - 3.5” SBC
ADLE3800HDBay Trail Atom SoC
• Supports Intel Atom 3800 Series Processors, DC/Quad
• 10W E3845,810 E3827 Processors
• Up to 8GB DDR3L-1333 DRAM
• 3x 10/100/1000 Mbit LAN
• 1x DVI-I (can be adapted to VGA/HDMI)
• 1x I-PEX MiniCoax for DVI/HDMI/DP
• 8x USB 2.0, 1x USB 3.0 over I-PEX
• 2x SATA 3Gb/s
• 1x RS232 COM
• Input Power: 24V nominal (21V - 30V) (Internally Isolated)
• Standard -25C to +70C, -40C to +85C Option
• One PCIe 2.0 x1 Lane on 2x40pin Header
3.5 Inch Embedded Single Board ComputersThe ADL Embedded Solutions 3.5-inch SBC’s combine user functionality with rugged performance; just the type of durability needed on the automation line, in the hospital, or automotive garage.
ADLQM67HDS2nd Generation Intel Core i7/i5
3.5” SBC
• Supports 2nd Generation Intel® Core™ i7/i5 Quad/Dual
• rPGA988B Socket; Intel QM67 PCH
• Up to 2x 8GB DDR3-1333 DRAM
• 2x 10/100/1000 Mbit LAN
• 1x DVI-I (can be adapted to VGA/HDMI)
• 1x I-PEX MiniCoax for DVI/HDMI/DP
• 10x USB2.0, 4x are Std USB Connectors
• 4x SATA (2x 6Gb/s, 2x3Gb/s)
• 4x RS232 COM, DSUB COM1
• Power: +5V, +12V, +5V Suspend
• Standard -25C to +70C, -40C to +85C Option
• Expansion: Four PCIe x1 Lanes on 2x40pin Header
• Expansion: 1x Mini-PCI Socket
3.5” SBC
ADLGS45HDSIntel Core 2 Duo / Celeron M
• Supports Intel® Core™ 2 Duo/Intel®Core™ 2 Quad/Celeron
• PGA478; Intel GS45 ICH9M-E Chipset
• Up to 2x 4GB DDR3-1066 DRAM
• 2x 10/100/1000 Mbit LAN
• Video: External DVI-I (can be adapted to VGA/HDMI)
• Video: Internal DVI/HDMI 2x9pin Header
• 10x USB2.0, 4x are Std USB Connectors
• 4x SATA 3Gb/s
• 4x RS232 COM, DSUB COM1
• Power: +5V, +12V, +5V Suspend
• Standard -25C to +70C, -40C to +85C Option
• Expansion: Four PCIe x1 Lanes on 2x40pin Header
• Expansion: 1x Mini-PCI Socket
ADL3GQM67HDS3rd Generation Intel Core i7/i5
3.5” SBC
• Supports 3rd Generation Intel® Core™ i7/i5 Quad/Dual
• rPGA988B Socket; Intel QM67 PCH
• Up to 2x 8GB DDR3-1333 DRAM
• 2x 10/100/1000 Mbit LAN
• 1x DVI-I (can be adapted to VGA/HDMI)
• 1x I-PEX MiniCoax for DVI/HDMI/DP
• 10x USB2.0, 4x are Std USB Connectors
• 4x SATA (2x 6Gb/s, 2x3Gb/s)
• 4x RS232 COM, DSUB COM1
• Power: +5V, +12V, +5V Suspend
• Standard -25C to +70C, -40C to +85C Option
• Expansion: Four PCIe x1 Lanes on 2x40pin Header
• Expansion: 1x Mini-PCI Socket
ADLQM87HD4th Generation Intel Core i7/i5
NEW - 3.5” SBC
• Supports 4th Generation Intel® Core™ i7/i5 Quad/Dual
• Intel PCH Lynx Point QM87
• Up to 2x 8GB DDR3L-1600 DRAM
• 2x 10/100/1000 Mbit LAN
• 1x DVI-I (can be adapted to VGA/HDMI)
• 1x I-PEX MiniCoax for DVI/HDMI/DP
• 8x USB 2.0, 3x USB 3.0 (1x over I-PEX)
• 4x SATA (2x 6Gb/s, 2x3Gb/s)
• 3x RS232 COM, DSUB COM1
• Power: +5V, +12V, +5V Suspend
• Standard -25C to +70C, -40C to +85C Option
• Expansion: Four PCIe x1 Lanes on 2x40pin Header
• Expansion: 1x Mini-PCI Socket
9Embedded Solutions
ADLPS104-150
Specification ADLPS104CF ADLPS35-150-5 ADLPS35-150-12 ADLPS104-150-5 ADLPS104-150-12 ADLPS104ISO-150-5 ADLPS104ISO-150-12
Input Voltages 8V to 28V 7V to 36V 14V to 36V 7V to 30V 14V to 36V 7V to 30V 14V to 36V
Output Voltages 5V at 10A with cooling 5V at 20A 5V at 20A 5V at 20A 5V at 20A 5V at 20A 5V at 30A
5V at 20A with cooling 5VS at 5A 5VS at 5A 5VS at 5A 5VS at 5A 5VS at 5A 5VS at 5A
3.3V at 5A 3.3V at 5A 3.3V at 5A 3.3V at 5A 3.3V at 30A 3.3V at 30A
12V at 10A 12V at 10A 12V at 10A
Total Power 50W no cooling; 100W with cooling
150W max; 15A max input current
150W max; 15A max input current
150W max; 15A max input current
150W max; 15A max input current
150W max; 15A max input current
150W max; 15A max input current
Input Protection Short circuit; voltage filtering
Overcurrent; Overvolt-age/ Undervoltage;
Surge; Reverse voltage
Overcurrent; Overvolt-age/ Undervoltage;
Surge; Reverse voltage
Overcurrent; Overvolt-age/ Undervoltage;
Surge; Reverse voltage
Overcurrent; Overvolt-age/ Undervoltage;
Surge; Reverse voltage
Overcurrent; Overvolt-age/ Undervoltage; Surge; Reverse voltage
Overcurrent; Overvolt-age/ Undervoltage; Surge; Reverse voltage
Isolation Galvanic Isolation to 500V
Galvanic Isolation to 500V
Temperature -40C to +85C-40C to +85C with conduction cooling
-40C to +85C with conduction cooling
-40C to +85C with conduction cooling
-40C to +85C with conduction cooling
-40C to +85C with conduction cooling
-40C to +85C with conduction cooling
MTBF (MIL-HDBK-217F)
> 600,000 at 25°C > 600,000 at 25°C > 600,000 at 25°C > 600,000 at 25°C > 600,000 at 25°C > 600,000 at 25°C
Recommended Usage
ADLxxPC -- LX8, 855, 945, Atom S15W
ADLxxHD(S) 855, 945, GS45, QM67, QM87
ADLxxHD(S) 855, 945, GS45, QM67, QM87
ADLxxPC -- GS45, Atom D25, Atom N200,
QM67, QM87, E3800
ADLxxPC -- GS45, Atom D25, Atom N200,
QM67, QM87, E3800
ADLxxPC -- GS45, QM67, QM87
ADLxxPC -- GS45, QM67, QM87
NotesPC/104plus with CF
socket and RTC battery option
ATX compatible; 2" x 4" small form factor
ATX compatible; 2" x 4" small form factor
ATX compliant; PCI/104-Express Std; supports PCI/104 and
PCIe/104*
ATX compliant; PCI/104-Express Std; supports PCI/104 and
PCIe/104*
Optional Mil-Std 704, Mil-Std 1275
and Mil-Std 461 filter available*
Optional Mil-Std 704, Mil-Std 1275
and Mil-Std 461 filter available*
Designed for Long-Lived Embedded ApplicationsADL Embedded Solutions Power Supplies are designed with long-lived, rugged and industrial embedded applications in mind.
MTBF is optimized through a
careful choice of components,
connectors and design techniques.
Features Include
• MTBF > 500,000 hours; MIL-HDBK-217F on ADLPS35 and ADLPS104
• Rugged Latching and Locking Connectors for High Shock and Vibration Tolerance
• Small 2”x 4” Form Factor for Space Constrained Applications and PC/104 Variants for Stacked Configurations
• Options for MIL-STD 704/1275/461 Available
• Robust ATX Compatibility for High-Performance Intel Core i7 and ADLGS45 Applications
• Thermal Cooling Options for Extended Temperature Applications
• Voltage and Fault Monitoring Options
• Solidworks 3D CAD Models and Design Support Available
ADLPS35-150ADLPS104CF ADLPC104ISO
Power Supplies
*Voltage/Temp Monitoring
10Embedded Solutions
Peripherals and Accessories
For additional peripherals, please visit our website.
MIL-STD 704/1275/461MIL-COTS Power Supply Filter
• Small Size = 1.9 x 1.1 x 0.37 in
• -40C to +85C Operation
• EMI filtering: MIL-STD-461E/F
• Transient Protection MIL-STD-1275 and MIL-STD-704
• Vin = 16.5 – 50 Vdc
• 120W Max. Output
• Compatible with ADLPS35, ADLPS104, and ADLPS104ISOL
• Optional 293030 PC/104 Mounting Plate Can Fit ADLPS35 Side-By-Side
• Available for all ADL PC/104, PCI/104, PCIe/104-Express and PCIe/104 SBCs
• Production Quality Cable designs with Panel-Mount Connectors
• Custom Cable Design and Manufacturing Services Avail-able for Industrial and Military Grade Applications
Development Cable Kits
ADLLAN-41000eQuad-Port Gigabit Ethernet
LANPCI/104-Express
• Intel® I350-AM4 Quad Port Gigabit LAN Controller
• PCI/104-Express Form Factor with PCI Pass-thru
• Compatible with Type 1 and Type 2 PCIe/104 or PCIe/104-Express SBCs
• PCIe V2.0 (2.5GT/s, 5.0GT/s) using x1 PCIe Lane
• ACPI/APM Wakeup
• PXI Pre-boot Support
• Jumbo Framing up to 9.5KB
• 2xUSB 2.0 ports from Host SBC
• Integrated I/O Virtualization
• Up to 4 Boards Possible in Stack, 16 Ports Total at Gigabit Speed
POC-7200 Rapid Prototype Development Kit
• Compatible with all ADL Embedded Solutions’ PC/104 and 3.5” SBCs
• Low Cost Development Kit
• Ideal for Initial Evaluation of SBCs and Peripherals Prior to Production Design
• Compatible with Development Cable Kits
• Rapid Custom I/O Panel Options
• Not for Production Use
ADLPCIe-PCI Bridge Card
• PCI/104-Express to PCI/104 Bridge
• Compatible with Type 1 and Type 2 PCI/104-Express form factors
• Down-Stacking Variant Standard, Up-Stacking Variant Available
• 2xUSB 2.0 Ports from Host SBC
• Ruggedization Options for Harsh Environments
• Operating Range -40° to +85º C
ADL-CS100 Conduction Cooling Development Plate
• 10” x 10” x 0.5” (25cm x 25cm x 1.3cm)
• Equivalent to 6” x 6” x 6” inch SFF chassis with ¼” thick walls
• Excellent Room Temperature Stack Evaluation Prior to Integration
• Simulates “real world” Conduction Cooling and Provides Good Baseline for Final Chassis Design
• K-100 Powder Cast, 6061 Precision Milled Aluminum
• Compatible with ADL PC/104, PCI/104, PCIe/104-Express and PCIe/104 SBCs
USB Digital and Analog I/O Peripherals
PC/104 Stack Mountable
• Analog I/O up to 16 In, 2 Out, 16 bit, 500 KHz
• High-Speed, 16 CH, 8 MHz Digital I/O
• Standard Digital I/O; 16/32/54/96 CH
• USB 2.0, USB 3.0, USB 1.1 Compatible
• -25C to +70C Standard
• -40C to +85C Available
ADLCOM-ISOLIsolated RS232 to RS485/RS232
Transceiver
• In-line RS232 to Isolated RS485 or RS232 to Isolated RS232 Transceiver
• 1kV DC Isolation for 1 Second; 500V AC/60Hz Isolation for 1 Minute
• Supports Data Rates up to 250Kbps in Isolated RS232 and Isolated RS485
• Dimensions: 40mm x 26mm (1.6”x1”)
• Cabling for ALL ADL Embedded Solutions SBC COM Ports Types
• DB9 Output Cable Standard
• Custom Cabling Options Available
• Ruggedization Options for Harsh Environments
• Operating Range -40° to +85º C
11Embedded SolutionsFor additional peripherals, please visit our website.
PCIe/104 2-CH MiniPCIe Socket Card
• 2x MiniPCIe Sockets
• SIM Card Support
• MiniPCIe Status LEDs
• MiniPCIe USB Routed to Separate Connectors
• -40C to +85C Operation
SLC mSATA Flash SSD Options
• Compatible with ADLQM87PC, and ADLE3800PC
• 16GB, 32GB, 64GB, 128GB
• Industrial Grade SLC
• Industrial Grade MLC
• Standard -25C to +70C
• -40C to +85C Available
ADL35PCIPCIe Backplane board
for 3.5” SBCs
• 2x PCIe x1 Slots Standard
• Compatible with 2 x 40 pin PCIe Expansion Connector ADLGS45HD, ADLQM67HDS, ADLQM87HD and ADLE3800HD 3.5” SBCs
• -40C to +85C Rated
• 4x PCIe x1, 1x PCIe x4, and 2x PCIe x1 with MiniPCIe Available with MOQ
• ADL PCle Flex Cable Required
• Call for Details
MiniPCIe I/O Modules
Compatible: ADLQM87PC, ADLE3800PC, ADLD25PC
Options Available:
• 4x Switchable RS232/422/485
• 1x Gbit LAN w RJ45
• Peak 1CH/2CH CAN BUS
• 36bit DIO GPIO
• MIL-STD 1553
• GPS Receiver
• 16bit Analog I/O
• WIFI 802.11 a/b/g/n
NEW - Integrated PC/104 MIL-STD 704/1275/461
PSU Assembly
• MILCOTS 704/1275/461 Filter Module
• ADLPS35-150-12
• Vin = 18 – 36V
• 120W Max Power
• Designed For Compact, Stack-Reduced MILCOTS Solution
MiniPCIe Framegrabber Modules
Compatible: ADLQM87PC, ADLE3800PC, ADLD25PC
Model 1012 Mini PCIe 8-CH Framegrabber Module
• NTSC and PAL Compatible
• 8 Composite Video Inputs
• 8 Mono Audio Inputs
AVC8000nano Mini PCIe 8-CH Framegrabber
• 8 Live NTSC/PAL Video Inputs
• 8 x D1 Size Capture at Full Frame Rate
Eb1 Mini Mini PCIe Cameralink Module
• 1x Base Mode
NEW - 4x LAN module with Flex Cable for 3.5” SBCs
• 4x Gigabit LAN RJ/45 Ports
• Compatible with 2 x 40 pin PCIe Expansion Connector ADLGS45HD, ADLQM67HDS and ADLQM87HD 3.5” SBCs
• Intel 82574L LAN Controller
• 9 KB Jumbo Frame Support
• -40C to +85C Rated
Peripherals and Accessories
Computer Vision Peripheral Options
PCI and PCIe/104-Express Options Available For:
• Cameralink, 2-CH and 4-CH
• 4 CH H.264
• 4CH NTSC/PAL
• 0 to +70C Standard
• -40C to +85C Available
• Call for Details
12Embedded Solutions
Part No. Item Code
AD
L855
PC
AD
L945
PC
AD
LLX8
PC
AD
LS15
PC
AD
LGS4
5PC
AD
LD25
PC
AD
LE38
00PC
AD
LQM
67PC
AD
LQM
67PC
i7
-351
7UE
AD
LQM
87PC
292054 ADLTS2HSS X X292055 ADLTS1LX X292056 ADLTS2LX X292057 ADLTS3LX X X292059 ADLTS4LX X293052 ADL855PC-SPREADER X293054 ADLTS2PIPE X X293057 ADLTSHSS-FAN X X X293162 ADL945-SPREADER (0.600") X293163 ADL945-SPREADER2 (1.000") X293166 ADL945-LTSPREADER (low mass) X292061 ADLS15PC-SP0600 SPREADER X292064 ADLS15PC-SP1000 SPREADER X292063 ADLS15PC-FANSINK (1"X2") X292062 ADLS15PC-LP PASSIVE X297413 ADLGS45PC-FANSINK X293050 SPREADER-FANSINK X X X292406 ADLGS45PC-SP0600 SPREADER X292410 ADLGS45PC-SP1000 SPREADER X292513 ADLD25PC-SP0600 X292514 ADLD25PC-SP1000 X292517 ADLD25PC-FANSINK (2"x2") X292512 ADLD25PC-LP PASSIVE X292806 ADLE3800PC-SP0600 X292808 ADLE3800PC-SP1000 X292810 ADLE3800PC-LP Passive X292812 ADLE3800PC-FANSINK (2"x2") X292610 ADLQM67PC-Fansink X292612 ADLQM67PC-SP0600 X292614 ADLQM67PC-SP1000 X292619 ADLQM67PC-3517UE-SP0600 X292760 ADLQM87PC-SP0600 X292761 ADLQM87PC-SP1000 X929762 ADLQM87PC-FANSINK X290010 CS-100 (10"x10"x.5") X X X X X X X X X X
ADLQM87PCShown with Copper Enhanced 0.6”Spreader for Wall Mounting
ADLE3800PCShown with 2” x 2” Fansink
3.5” SBC SpreaderShown with 0.6” Spreader for Wall Mounting
Thermal Solutions for PC104 & 3.5” Single Board Computers
Part No. Item Code
AD
LGS4
5HD
S
AD
LQM
67H
DS
AD
L3G
67H
DS
AD
LQM
87H
D
AD
LE38
00H
D
29485X* ADLGS45HDS-SPREADER X29486X* ADLQM67HDS-SPREADER X X294863 ADLQM87HD-SPREADER X294864 ADLE3800HD-SPREADER X294152 ADL35-BBHS (spreader req'd) X X X X X
“X” processor height designator
ADL Embedded Solutions offers highly effective heat conductive and heat convective thermal solutions tailored to maximize the longevity of your ADL Embedded Solutions’ SBC.
Design and Engineering Features Include:
• Designed to exacting specifications by our Solidworks Design Team.
• Milled locally in US to tolerances of less than 1mil for critical dimensions.
• Anodized color coatings as well as clear Alzak and trivalent chromate (TCP) coatings used for humidity protection and optimal thermal emissivity.
• Each thermal solution is custom design and characterized to each ADL Embedded Solutions SBC and verified through thermal chamber characterization.
• Each SBC includes at least one fansink convective cooling option and one or more heatspreader conduction cooling solutions.
• All SBC and thermal solutions are available in Solidworks 3D CAD for spacing planning purposes.
ADL Embedded Solutions also offers custom enclosure and thermal cooling design services. Contact your Sales engineer for further information.
PC/104 Thermal Solutions Matrix
3.5-Inch Thermal Solutions Matrix
13Embedded Solutions
Designing successful embedded systems demands efficient PCB design,
choosing low power and long-life components, and the creation of an effective
cooling solution within the parameters specified. Since heat reduces the life
of embedded systems, efficient cooling solutions directly result in long-term
reliability for the overall system.
Design Considerations:
• The difference between Tjmax (maximum CPU junction temperature allowable) of the CPU and the maximum Tambient (ambient temperature taken external to the thermal solution such as the heatsink for an open stack or external to the chassis for an embedded stack) defines the temperature delta which the thermal solution must achieve. For example, commonly CPU Tjmax = 100C, so if maximum Tambient = 85C, the thermal solution temperature rise cannot exceed 15C. In summary: Max Tdelta = Tjmax - Max Tambient
• Lower-powered SBCs such as Intel Atom architectures can often be sufficiently cooled through passive or forced convection (fan assisted) heatsink solutions and still meet extended temperature requirements.
• Higher-powered architectures such as the Intel Core i7-series or GS45GME usually cannot meet extended -40C to +85C operation without a conduction cooling path to a larger metal structure (vehicle bulkhead, airframe, system cabinet, etc.) as described below.
• Make note of maximum CPU load required and test final chassis enclosure under these conditions. Reduced CPU load translates directly into lower heat generation and reduced thermal cooling requirements.
• ADL Embedded Solutions also offers custom enclosure and thermal cooling design services. Contact your Sales Engineer for further information.
Thermal Management
Heat Spreader and Chassis Cooling Key Points:
1. Using precision-milled heat spreaders specifically designed for each ADL Embedded Solutions platform, heat from the CPU/Chipset is conduction transferred to the chassis wall/base.
2. Heat spreaders are often copper-enhanced for high-performance/high temperature SBCs, include specialty coatings to optimize emissivity and are coupled with precision standoffs to maintain planarity and optimal mechanical coupling to the chassis wall.
3. The Chassis is designed by the customer or ADL Embedded Solutions to dissipate the heat conducted from the heat spreader as follows:
• Passive Convection Cooling through use of a finned chassis design that takes advantage of available airflow is just one example.
• Forced Convection Cooling of a finned chassis design by adding an appropriate externally-mounted fan.
• Conduction Cooling by mounting the chassis base in such a way as to make metal-to-metal contact with the vehicle bulkhead, airframe, system cabinet, etc., such that the chassis heat is conduction transferred to the larger metal structure. This is the more common cooling strategy for high-powered Intel Core i7 designs, especially quad-core CPUs.
ADLPS104
ADL-4-Port LAN
SBC
ADL Heatspreader
Chipset
CPU
Customer Chassis Wall/Base
Cross-Section of PC/104 Stack With Heat Spreader
14Embedded Solutions
Services
Custom System enclosures can be designed to meet space, power, and environmental requirements. Aided by Solidworks® 3D CAD design software, our engineers can help conceptualize, design, build, and fully integrate and test both low and high IP (Ingress Protection Rating) systems. Working from customer requirements and concepts, ADL Embedded Solutions can help refine concepts and develop implementation strategies and quotes to help guide the NRE process.
Solid Works/ Custom Systems
Many customers are well versed in 3D CAD design for their systems work and simply need CAD modeling support to integrate our boards, enclosures, or peripherals into their system. CAD models for all of our SBCs and select peripherals are available in both Solidworks and STEP 203/214 formats. Other formats might be available on a case by case basis, such as IGES, etc. For SBCs, CAD models can be made available with most of our standard thermal solutions already integrated. Request for CAD models can be made through your Sales Engineer.
CAD Modeling Support
Conformal Coating: Primarily done with Acrylic 1B31 material, with other materials available by special request. Commonly used for high humidity environments.
Bonding: Used for high vibration industrial and military environments for adhering high-mass components to the PCB to prevent component damage or loss during high vibration events.
Underfill: Primarily used for moderate vibration environments such as railway, military ground and air transports, etc. Also highly recommended for extended temperature operation of processors and chipsets with small BGA ball features <1mm or environments with rapid temperature changes.
Ruggedization for extreme military and industrial vibration environments will sometimes require all the usual bonding, underfill, and coatings but perhaps also complete encapsulation with bonding material of selected structures and custom thermal solutions with enhanced structural reinforcement.
Coating, Underfill and Bonding for Ruggedization
Bonding Conformal Coating Over Entire Board
Underfill
Any customer system (board stack with/without custom system enclosure) can be fully integrated including custom O/S installation, peripheral card installation and configuration, board modifications, custom cabling, and customer specific testing requirements. A well-defined systems integration process guarantees that all customer requirements are well documented and captured and that quality is ensured through the use of prototype phase, production pilot run(s), QA checkpoints, technician training, and document control.
System Integration
Extended temperature screening is available for all ADL Embedded Solutions SBCs. Please consult your Sales Engineering for a quote.
Ext.Temperature Screening
Often, integration of an SBC into a specific application requires removing or modifying SBC connectors (e.g. from vertical to 90 degree) to solve space and fit constraints. Many of these modifications can be made on an order-specific basis by ADL Embedded Solutions technicians working to IPC610 Class III standards. For long-term projects, customer-specific BOMs can be created to ensure product consistency over the life of the product. Please contact your Sales Engineer for a quote.
Board Modifications
Customer specific BIOS and firmware requirements can include:
• Fixed BIOS/Firmware Revision Control
• Custom BIOS Configuration Settings and Defaults
• Custom Splash Screens and logos
• Custom BIOS Integration of Specific Flat Panels Please contact your Sales Engineer for a quote.
Custom BIOS Build
ADL Embedded Solutions can create custom SBCs and peripheral boards that help optimize SWaP (Size, Weight and Power) which is key to helping our clients achieve competitive advantage with their products. Our board design tools and services fully encompass the entire value chain from component vendors, to design support, links to manufacturing and customer support services for BIOS and BOM control.
Custom Board Design Services
ADL Embedded Solutions provides both standard and extended temperature range thermal solutions for all of our SBCs. In addition, ADL Embedded Solutions can provide custom thermal solutions (plates, heatsinks and enclosures) as required by specific customer specifications. Working closely with local milling and metal coating facilities, ADL Embedded Solutions engineers can create all manner thermal solutions including copper-enhancement for high-power SBCs and most metal coatings including TCP, clear and black anodizing, etc. Please contact your Sales Engineer for an NRE quote.
Custom Thermal Solutions
15Embedded Solutions
BackgroundPC/104 is a stackable, embedded computer standard with a compact footprint and stackable bus architecture. Unlike a regular desktop PC which uses a backplane, PC/104 modules mate together via stackable ISA, PCI, and PCIe bus connectors. PC/104’s success in embedded applications is namely due to:
• Compact Size 3.6 by 3.8 Inches (90 x 96 mm) Module Size• Self-Stacking Expands Without Backplanes or Card Cages• Rugged, Reliable Connectors Reliable in Harsh Environments; 1000+ Mating Cycles as Compared to <100 for COMs • Four-Corner Mounting Holes Assymetrical Layout with Increased Resistance to Shock and Vibration• Fully PC Compatible Reduced Development Costs and Time-To-Market
PC/104 Bus EvolutionPC/104 stackable embedded PCs have followed the desktop PC leveraging on the hardware and software support developed for this popular platform.
Down Stack Configuration ExamplesThe flexibility and expandability of the bus and mechanical layout allow many different stack configurations to support an array of diverse project requirements. See full specification for more examples.
Custom SBCs and Peripherals for Optimal Size and I/O ConfigurationsSpace constrained solutions can be optimized by way of custom I/O boards that help collapse multiple I/O boards on the stack down to one board as illustrated in the example at right with an oversized I/O peripheral card. Alternatively, custom, single board SBC solutions can also be created by ADL Embedded Solutions for optimal size and I/O configurations.
The PC/104 logo, PC/104, PC/104-Plus, PCI-104, PCI/104-Express, PCIe/104, 104, EPIC, EPIC Express, EBX, and EBX Express are trademarks of the PC/104 Consortium. PCI, PCI Express, and PCIe are trademarks of PCI-SIG.
What is PC/104?
PCIe/104-Express SBC Stack ExampleWith PCIe/104 and PCI Modules
PCIe/104 SBC Stack Examplewith Bridge Card for PCI Modules
PCIe/104 ADLQM67PC with Custom I/O Board
16Embedded Solutions
The key to successfully designing a board, stack or system involves asking the right questions in a collaborative dialogue with the customer. It starts with the basic question, “What does the system need to do?” Gathering all the data, including initial assumptions by the customer, leads to an understanding of both the prioritized needs and constraints that will result in the most robust, reliable and appropriate solution.
The purpose of this feature is not to provide a complete list of all the possible questions and considerations when discussing optimum system design, nor capturing the program requirements, but in using a methodology backed with industry experience, that will result in the best embedded system solution possible.
Key Areas of System Design, What Is Needed:
• Performance of CPU, I/O, PCB/Bus interfaces, Cable Throughput Capacity.
• Power Consumption/Thermal Management Demands.
• System Functional Upgradeability/Flexibility.
• System Certification(s) and Ingress Protection Scope.
• System Enclosure Size, Weight, Material Make-Up and Surface Coating.
• DC/DC Power Supply for Conversion of Input Power with Possible Isolation and Filtering as well as Identifying all the Voltages that are to be Encountered within the System and Attached Devices.
• Defined Form Factor and Bus Interface(s).
• Selection of Cabled, Cable-Reduced or Cable-Less System.
• Software Support for O/S and Drivers as well as CPU/SSD Software Compatibility.
System Function Component Considerations
• CPU/DRAM Memory Capacity/I/O Features.
• SBC Thermal Solutions, Fan, Convection, Conduction or a Combination of.
• SSD Type and Number. On Board or In/Out of Stack. Removable or Non-Removable. Write-Protection, Encryption and the Level of, Secure Erase, MLC, SLC, etc.
• Type and Number of Video Outputs, Number of Independent Channels Needed, Type.
• Custom BIOS for CPU Performance/Thermal Reduction, Rev Lock-In, Quick-Boot or Specific Boot-Up Sequence.
• Peripheral Board Selection Based Upon Bus Interface, Performance and Thermal Considerations. Type of Connectors, Standard or MIL STD D38999.
• Use of Conductive Gasketing and/or Masking of Anodizing System Contact Surfaces with Support Structure.
Optimizing Embedded System Design
4-Port Serial Board with USB Interface
PCIe/104 to Two-Port PCIe Mini Card Adapter (Peripheral Board)
Power Input Filter
PCIe 104 Quad-Port Camera Link Frame Grabber
PCIe/104 Quad-Port Camera Link Frame Grabber
ADLPS104-150 Power Supply
ADLPS35-150 with Power Input Filter
ADLLAN-41000e Quad-Port GbE Peripheral
ADLQM67PC-2715QE – PCIe Single Board Computer
Heat Spreader Available In Standard 0.600” Height or 1.000” Height Shown
Universal Adapter for In-Stack Storage Options with 2.5” SSD Installed
ADLQM87PC-4700EQ PCIe/104 Single Board Computer – Quad-Core with Hyperthreading, HD4600 Graphics, USB 3.0, Onboard mSATA/mPCIe
CS-100 Chassis Simulator – Useful for Simulating Thermal Dissipation Through 100 sq. Inches of Aluminum
4 Card System Stack
7 Card System Stack
Reduced Stack Through Use of Dual PCIe AdapterBoard, with CAN, COM mPCIe Modules
17Embedded Solutions
About ADL Embedded Solutions
Corporate HeadquartersADL Embedded Solutions Inc. 4411 Morena Blvd. Suite 101 San Diego, CA 92117-4345 T: 858-490-0597 F: 858-490-0599 [email protected] [email protected] www.adl-usa.com
European HeadquartersADL Embedded Solutions GmbH Eiserfelder Straße 316 D-57080 Siegen, Germany T: +49 (0) 271 250 810 0 F: +49 (0) 271 250 810 20 [email protected] [email protected] www.adl-europe.com
For a complete list of International Sales Partners visit: www.adl-usa.com/contact
Copyright © 2015 ADL Embedded Solutions. All rights reserved. Printed in the United States of America. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the written permission of the publisher. ADL Embedded Solutions is a trademark of ADL Embedded Solutions, Inc. Product specifications are subject to change without notice and are subject to discontinuance.
About ADL Embedded SolutionsADL Embedded Solutions is a leading provider of customizable, high-performance embedded solutions for demanding thermal and rugged environments. ADL Embedded Solutions diverse portfolio of products range from SBCs based on the AMD Geode™ and Intel® Atom® processors through high-performance 4th generation Intel® Core™ platforms built to PC/104 and 3.5” form factors, all of which can be delivered as part of a full system, or individual boards.
Founded in 1994, ADL Embedded Solutions Inc. is a privately held company with headquarters in San Diego, CA. In July of 2010, ADL Embedded Solutions opened its European headquarters in Germany, (ADL Embedded Solutions GmbH), and is now better positioned to support its customers on a global basis.
Our ProductsOur product lines include PC/104, PC/104-Plus, PCI-104, PCI/104-Express, PCIe/104, 3.5” boards, custom boards, and Modular Enclosure Systems. Our products are designed and manufactured under ISO 9001 with state-of-the-art equipment and fully factory tested prior to shipment. In addition, all computer boards and integrated systems are individually tested at ADL Embedded Solutions before shipping, including extended temperature testing when required.
Customer Support The commitment of our experienced, well-trained sales and engineering staff, provide our customers with project planning assistance, specific application requirements, and can recommend the best integrated solution for a project. Our Technical Support and Customer Service departments are here to ensure your product satisfaction after the sale. We support and service what we sell.
Services ADL Embedded Solutions can provide full CAD design, build and integration services for custom enclosures, including high IP requirements. Value-added services include ruggedization for high shock and vibration, extended temperature, and harsh environments, as well as CAD support including board models and full enclosure design, build, and integration.
Markets We Serve ADL Embedded Solutions serves customers in a variety of markets, including Transportation, Medical, Government & Defense, Energy, Security & Surveillance, and Industrial Automation & Control.
EXECUTIVE
MEMBER
Request a Quote
Contact us at [email protected] or 858.490.0597 to discuss your application requirements
See page 8 for additional information
See page 6 for additional information See page 7 for
additional information See page 8 for additional information
Embedded. Works Anywhere.
Customizable COTS Integrated Systems, Stacks & Boards• COTS Small Form Factor (SFF) Systems, Stacks and
Boards Designed to Meet Space, Performance, Power, and Environmental Requirements. Our Engineering Design Team Can Assist You in Optimizing the Configuration for Your System!
• Aided by Solidworks® 3D CAD Design Software, Our Engineers Can Help Conceptualize, Design, Build, and Fully Integrate and Test Both Low and High IP (Ingress Protection Rating) Systems.
• Fully Integrated Systems for Applications Such as Data Concentrators Used on Oil Rigs to Military Communications with Extreme MIL-STD810 Vibration Requirements, Have Been Successfully Designed and Deployed in Close Cooperation with Our Industrial and Defense-Related Clients.
• Our Board Design Team’s World-Class Capabilities Have Resulted in The Industry’s Highest Performance PCIe/104 Intel Core i7/i5 SBCs.
ADLE3800PCIntel Bay Trail
SoC Atom E3800
NEW - PCIe/104
• Intel® Atom™ E3800 Series SoC, Dual/QUAD, 1.33 GHz - 1.91 GHz
• DC 6W-8W, QUAD 10W
• Up to 8GB DDR3L-1333 DRAM
• Reduced Type 2 Bottom-Stacking PCIe/104; Two x1 Lanes*
• 1x Mini Card Socket for MiniPCIe and mSATA
• *Shared with Mini Card Socket
ADLQM87PC4th Generation Intel Core i7/i5
NEW - PCIe/104
• Intel® Core™ i7 DC/Quad, 1.6 GHz to 2.4 GHz
• Intel® 8-Series PCH Lynx Point QM87 Chipset
• Up to 8GB DDR3L-1600 DRAM
• Type 1 Bottom-Stacking PCIe/104
• Trusted Platform Module (TPM) 1.2
• Mini-Card Socket for MiniPCIe or mSATA
ADLQM87HD4th Generation Intel Core i7/i5
NEW - 3.5” SBC
• Supports 4th Generation Intel® Core™ i7/i5 Quad/DC
• Intel PCH Lynx Point QM87
• Up to 2x 8GB DDR3L-1600 DRAM
• 2x 10/100/1000 Mbit LAN
• 1x DVI-I (can be adapted to VGA/HDMI)
• 1x I-PEX MiniCoax for DVI/HDMI/DP
• Expansion: Four PCIe x1 Lanes on 2x40pin Header
• Expansion: 1x Mini-PCI Socket
NEW - 3.5” SBC
ADLE3800HDBay Trail Atom SoC
• Supports Intel Atom 3800 Series Processors, DC/Quad
• 10W E3845, 8W E3827 Processors
• Up to 8GB DDR3L-1333 DRAM
• 1x DVI-I (can be adapted to VGA/HDMI)
• 1x I-PEX MiniCoax for DVI/HDMI/DP
• One PCIe 2.0 x1 Lane on 2x40pin Header