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Guide to Temperature Profiling forWave, Reflow & Selective Soldering
29th October 2013
Bob Willis – Defect Database Coordinator
NPL Management Ltd - Commercial
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How to Test and Qualify Packages with Scanning Acoustic Microscopy (SAM)
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Temperature Profiling Measurement
Reflow Soldering (Convection & VPS)
Wave Soldering
Selective Wave/Selective Soldering
Rework & Manual Soldering
Adhesive Curing
Conformal Coat Cure
Baking Printed Boards
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Temperature Profilers
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Tin/Lead Reflow Solder Profile
Zone Number: 1 2 3 4 5 6 7 8
Top Set points: 110 120 120 120 145 190 245 260
Bottom Set points: 110 120 120 120 145 190 245 260
Conveyor Speed 75
Statistics Values: TC-1 TC-2 TC-3 TC-4 TC-5 TC-6 TC-7
Max Rising Slope 1.7 1.5 1.9 1.7 1.5 1.5 1.6
Soak Time 100-120C 68.7 68.3 65.5 71 69.8 68.8 66.1
Reflow Time /179C 57.9 60.6 61.2 57.6 53.8 60.3 56.3
Peak Temp 209.7 210.6 218.7 212.9 208.6 215.2 213.2
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BGA Temperature Profiles in 90’s
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Process of Reflow Soldering
Product Size
Product Mass
Component Type
Printed Board Construction
Solder Paste Alloy
Flux Types
Solderability
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Temperature Profiling Examples
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Temperature Profiling Examples
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What is a Thermocouple?
Two different materials are welded together to form a junction/bead. The two wire are insulated fromeach other to stop intermittent contact and false readings. The two wires are then covered with anouter cover. 1-60 micro volts can be produced between the wires which is converted to atemperature reading.
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Example Thermocouple
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Solid Sheath Thermocouple
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Thermocouple Guide
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Temperature Profiling Probes
Soldered Probes
Aluminium Foil
Kapton Tape
Epoxy Adhesive
Contact Probes
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Temperature Profiling Probes
Survey conducted on the SMART Group web site. Results from 63participantswho voted during the survey
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Multilayer Design
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Multilayer Design
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BGA361
Temperature Profiling Probe Position
BGA361
Temperature Profiling Probe Position
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Temperature Profiling Probe Position
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Temperature Profiling Probes
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Temperature Profiling Probes
Mounting thermocouple bead to component termination with high temperature solder is by far thebest technique. First mount the lead and secure with Kapton tape. Then solder the bead to thetermination. Its good practice to also secure other leads with high temp solder if the board will beused for double sided reflow profiling.
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Temperature Profiling Probes
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Temperature Profiling Probes
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Temperature Profiling Probes
Care need to be taken that the thermocouple bead is in the solder jointand not on the surface. If the wires are twisted and touching this willalso give false random readings duringmeasurement
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Temperature Profiling ProbesSelect a printed circuit board for profiling and an area array component for testing.
Select a thermocouple lead and place on the surface of the board. Hold the lead in position with Kapton tape. The bead is positioned on the centre pads. Solder the bead to a group of four pads with high temperature solder.
Hold the component firmly and locate the row of balls leading to the centre position of the component.
Remove the solder balls making sure that the area to be occupied by the thermocouple bead position is free
Place the BGA on to the surface of the board making sure that it sits flat on the pads. If the component sits flat then remove it and flux the pads and replace the BGA
Reflow the profile board, the flux will allow the solder balls to wet the pads and hold it in position.
After initial reflow place adhesive around the four sides of the component and cure the adhesive. This will reduce the possibility of the component coming off the board even when reflowed up side down.
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Temperature Profiling POP Package
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Temperature Profiling POP Package
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Reflow Soldering & Profiling
Produce a slot in the surface of the board so that a bottommounted PoPwill remain flat to the surface of the board. Add a slot to the topmounted package to allow the thermocouple to be mounted betweenthe bottomand top packages
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Reflow Soldering & Profiling
Aluminium tape can be used to hold the thermocouple in position onthe bottomand top package for accurateprofile measurement
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Temperature Profiling Probes
Thermocouple leads from the printed boardassembly to the profiler should not be loose or flyingas could catch and tangle on the conveyor, linkedpin or centre board support mechanism
Thermocouple leads should be bundled togetherusing a high temperature sleeving or, alternatively,Kapton tape may be used to secure the leads
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Wave Soldering Pre‐Heat
Single Sided Board 1.6mm Paper
Double Sided Board 1.6mm FR4
6 Layer Board 1.6mm FR4
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Wave Soldering Temperature Profiles
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Wave Soldering Pre‐Heat
Profile showing excessive drop intemperature prior to wave contact
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Reflow Soldering Lead‐Free
The three row connector can be demanding thermally during intrusive reflow. The connector body and pinshave different thermal demands, these are indicated by the range of temperatures from red to blue. Makingsuccessful reflow joints to meet the IPC 610 specification is fairly easy but engineers need to consider allcomponent temperature limits and circuit board design. Pins close to the body of a connector and pin at thecentre of the body will be the last to reflow in a tin/lead or lead-free process
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Reflow Soldering Lead‐Free
Reflow results prior to optimising the profile for the connector and increasing the conveyor speed to improve product through put. Incomplete reflow of the solder paste is evident in the centre of the connector and on the inner row of pins
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Reflow Soldering Lead‐Free
Optical image after reflow before optimisation of the profile and reduction of the delta T across the connector. The joint images from the edge to the centre show complete reflow and progressive limited reflow of the through hole pins due to the delta T and peak reflow temperature
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Reflow Soldering Lead‐Free Profiles
Profile taken using a KIC profiler on SN100C intrusive reflow trial boards. Reflow conducted in air on a BTU reflow oven
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Vapour Phase Reflow at ACW
Reflow of SN100C solder paste requires either a 235 or 240oC boiling fluid for vapour phasereflow. A fluid boiling at 240oC was used by Peter Barton to solder PIHR boards at ACW,Wales.ACW are a contract services provided, successfully using vapour phase for tin/lead and lead‐free reflow. Peterwas using a Galden HS240 fluid in a ASCON VP6000 system
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Temperature Profiling
It is more complicated to profile a vapour phase system and not allprofiler suppliers have a cases suitable to protect the unit
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Vapour Phase Soldering Lead‐Free Profile
Profile taken using a ECD profiler on SN100C intrusive reflow trial boards. Reflow conducted in avapour phase system at ACW in Wales with thermocouple mounted in three positions
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Selective Soldering Trials
Pre-heating PCB assembly after fluxing (constant parameter)
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Selective Soldering Trials
Soldering through hole terminations at 280oC & 320oC per alloy
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4
1
23
5 6
Soldering Direction
PCB Direction
Selective Soldering Profiles
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Selective Soldering Profiles
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Profiling Lead-Free Hand Soldering
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Profiling Lead-Free Hand Soldering
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Profiling Lead-Free De-Soldering
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Temperature Profiling for Curing
Examples of coated boards after coating cure, also examples with too faster cure cycle well outside of the supplier recommendations for the ideal profile
Drying Oven/Cabinet/Enclosure
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Conformal Coating UV Inline Cure
In line curing systems can use mesh belt or pin transfer systems depending on the type of coating method and materials used in the production process
Conformal Coating Temperature Profile
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Acknowledgements
Alstom Power Conversion
BTU
Datapaq
ECD
Fujitsu
KIC (Link Hamson)
Loctite Multicore
Roke Manor Research
Obtain this and many more NPL reports from the Defect Database http://defectsdatabase.npl.co.uk
NPL Management Ltd - Commercial
NPL EI Free Technology Webinars/WorkshopsCleanliness Assessment Using Solvent Extract & Ionic Extraction to Improve Reliability
3rd December 2013
How to Test and Qualify Packages with Scanning Acoustic Microscopy (SAM)
4th February 2014
Effectiveness of Baking to Remove Moisture from Between PCB Ground Planes
18th March 2014
Practical Failure Analysis in Electronics – How to Do It
14th May 2014
Solderability Assessment ‐ Testing, Ageing and Practical Impact on Assembly Yield
10th June 2014
www.npl.co.uk/ei
Visit our web site www.npl.co.uk/ei
Guide to Temperature Profiling forWave, Reflow & Selective Soldering
29th October 2013
Bob Willis – Defect Database Coordinator