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Fortune 500 Company
25+ years of driving the evolution of wireless
Making wireless more personal, affordable and accessible to people everywhere
World’s largest fabless semiconductor company, #1 in wireless
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Innovation Across Entire Wireless Value Chain
Qualcomm: A Communications Systems Company
InnovativeTechnologies
Standardization Productization Commercialization
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Displacing Feature Phones
Continued Smartphone Momentum
Source: Average of Gartner, Oct. ’12; Strategy Analytics, Aug. ’12
2011 2012 2013 2014 2015 2016
Annual Forecasted Smartphone Unit Shipments24% CAGR
2011–2016
Cumulative Smartphone Unit Sales Forecast Between 2012–2016 ~5B
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Immediacy, Portability, Connectedness
Our Most Important Device
Source: Google/Sterling Brands/Ipsos Multi-Screen Research, Aug. ’12
4/5of all searches on a smartphone are spontaneous, compared to
52% on PC
1/3+of daily media interactions
occur on a smartphone
~1/2of smartphone owners use
them while watching TV
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Mobile is Redefining Computing
High Resolution Screens
Responsive Devices
Fast, Always-On Connectivity
Rich Multimedia Experience
High Performance Computing
Sleek, Ultra-light
Longer Battery Life
Thermal Efficiency
Without Compromising Mobility
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Unmatched Portfolio
Qualcomm Approach: Own the Key Technology Blocks
DSP
GPU
CPU RF
Connectivity
Location
3G/4G/LTE
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Successful Investments Have Resulted in Leadership
ApplicationProcessor
GraphicsProcessor
Digital SignalProcessor
3G/4G/LTE RF
Sources: Mobile AP Unit Shipment - Strategy Analytics; GPU Shipment - Jon Peddi Research; DSP shipment - Forward Concepts; 3G/4G/LTE - Strategy Analytics; RF iSuppli, Q1’12
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/ /
A History Of Time-To-Market and Product Superiority
Qualcomm Modem Technology Leadership
2008 2010 20122009 20112007200620052004 2013
90
70
50
30
40
60
80
100
20
10
DL 1.8 MbpsUL 384 kbps
DL 7.2 MbpsUL 5.76 Mbps
DL 28 MbpsUL 5.76 Mbps
First Integrated LTE Multimode
DL 100 Mbps
First DC-HSPA+
DL 42 Mbps
Pea
k D
L D
ata
Rat
e (M
bps)
First LTE World ModeDL 100 Mbps
MSM 6275
MSM 7200
MDM 8200
MDM 8220
MDM 9x00
MDM 9x15
MDM 9x25
First LTE Advanced Carrier Aggregation with Cat4DL 150 Mbps
First HSDPA
First HSUPA
First Integrated LTE Smartphone
DL 100 Mbps
MSM 8960
150
FirstHSPA+
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First and Second Generation Gobi LTE Launch Velocity
Qualcomm LTE Leadership and Scale
Nov. ’12 CAs shown are projected, based on documented OEM products in development; all other figures are actual/historical CAs
MDM9x15
MSM8960
MDM9x00
Cum
ulat
ive
Num
ber
of C
arrie
r Acc
epta
nces
(U
niqu
e O
EM
Dev
ices
)
LTE OEM Device Acceptances on
Qualcomm LTE chips
12/2010 11/2012
Time
16
16Performance (DMIPS)
Pow
er (
mW
)
0
500
1000
1500
2000
0 1000 2000 3000 4000 5000 6000 7000
Half the Power
Laptop Only
Highest Performance at the Lowest Power
CPU Leadership Now and into Next Generation
Source: Qualcomm lab testing
x86 SOC (32nm HKMG)
Current Gen Competitor (40nm LP)
Newly Released Competitor (32nm HKMG)
Snapdragon “Krait” 200 (28nm LP)
Snapdragon “Krait” 300 (28nm LP)
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Latest GPU Architecture — Higher Performance, Lower Power
Adreno 320 GPU Leads in Power-Efficient Performance
Sources: AnandTech ’12, Qualcomm data
Rel
ativ
e P
erfo
rman
ce p
er m
W
Performance Power Efficiency (Higher Is Better)
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
4.00
Competitor A quad-core Snapdragon dual-core(8960) Adreno 225
Competitor B quad-core Snapdragon quad-core(8064) Adreno 320
5.1
5.9
8.7
8.8
9
12
13
13
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Samsung Galaxy Nexus(OMAP4460/SGX540)
Huawei Ascend P1 (OMAP4460/SGX540)
LG Optimus 4X HD (Tegra 3)
Samsung Galaxy S 2 (Exy/Mali400)
HTC One X (Tegra 3)
HTC One S (S4/Adreno 225)
HTC One X (S4/Adreno 225)
Samsung Galaxy S 3 (Exy4/Mali400)
Samsung Galaxy S 3 (S4/Adreno 225)
LG Optimus G (S4 Pro/Adreno 320)
GLBenchmark 2.5—Egypt HD (Offscreen 1080p)Frames per Second—Higher Is Better
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Investing for Growth
Qualcomm Maturing Turnkey Model
Ecosystem, Channel Support
Complete Reference
Design
Competitive Price
Superior Technology
Brand
OEMs Launches
DaysLaunch Time-to-Market in Design
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© 2012 QUALCOMM TECHNOLOGIES, INC. All rights reserved. 25
© 2012 Qualcomm Technologies, Inc. All rights reserved. Qualcomm, Snapdragon, Trepn, and Gobi are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Trademarks of Qualcomm Incorporated are used with permission. AllJoyn is a trademark of Qualcomm Innovation Center, Inc., registered in the United States and other countries. Other products and brand names may be trademarks or registered trademarks of their respective owners.
Qualcomm Technologies, Inc5775 Morehouse Drive
San Diego, CA 92121-1714